JP2018207090A - Multilayer electronic component, its mounting substrate, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated electronic component capable of reducing acoustic noise in an audible frequency region of 20 kHz or less and high frequency vibration of 20 kHz or more, and a mounting substrate thereof. The present invention comprises a capacitor main body, first and second external electrodes arranged so as to be separated from each other on a mounting surface of the capacitor main body, and an insulator, and the first and second external electrodes. The first connection terminal includes the first and second connection terminals to be connected, respectively, the first connection terminal includes the first to third conductive patterns, and the first cutting portion, and the second connection terminal is a fourth. To provide a laminated electronic component including a sixth conductive pattern and a second cut portion, and a mounting substrate thereof. [Selection diagram] Fig. 1

Description

  The present invention relates to a multilayer electronic component, its mounting substrate, and an electronic device.

  A multilayer capacitor, which is one of the multilayer electronic components, is made of a dielectric material. Since this dielectric material has piezoelectricity, it can be deformed in synchronization with an applied voltage.

  When the period of the applied voltage is in the audible frequency band, the displacement becomes vibration and is transmitted to the substrate through the solder, and the vibration of the substrate can be heard as sound. Such a sound is called acoustic noise.

  When the operating environment of the device is quiet, the user may recognize the acoustic noise as an abnormal sound and feel that the device is malfunctioning. In addition, in a device having an audio circuit, acoustic noise may be superimposed on the audio output, and the quality of the device may be reduced.

  In addition to acoustic noise recognized by human ears, the cause of malfunction of various sensors used in IT and industrial / electrical equipment when piezoelectric vibration of multilayer capacitors occurs in a high-frequency region of 20 kHz or higher. Can be.

  On the other hand, the external electrode of the capacitor and the substrate are connected via solder. At this time, the solder is formed so as to be inclined at a certain height along the surface of the external electrode on both side surfaces or both end surfaces of the capacitor body.

  At this time, the larger the volume and height of the solder, the more the vibration of the multilayer capacitor is further transmitted to the substrate, and the generated acoustic noise increases.

Japanese Patent No. 3847265 Korean Published Patent No. 10-2010-0087622 Korean Published Patent No. 10-2015-0127965

  An object of the present invention is to provide a multilayer electronic component that can reduce acoustic noise in an audible frequency region of 20 kHz or less and high-frequency vibration of 20 kHz or more, and a mounting substrate thereof.

  One aspect of the present invention includes a capacitor main body, first and second external electrodes disposed on the mounting surface of the capacitor main body to be spaced apart from each other, and an insulator, and the first and second external electrodes, A multilayer electronic component including first and second connection terminals connected to each other, wherein the first connection terminal includes a first conductive pattern formed on a first surface facing the first external electrode; A second conductive pattern formed on a second surface opposite to the first surface; a first cutting portion formed on one or more side surfaces connecting the first and second surfaces; and the first cutting. And a third conductive pattern that electrically connects the first and second conductive patterns to each other, and the second connection terminal is formed on a fourth surface facing the second external electrode. A fourth conductive pattern and the fourth surface A fifth conductive pattern formed on the fifth surface facing; a second cut portion formed on one or more side surfaces connecting the fourth and fifth surfaces to each other; and formed on the second cut portion. And a sixth conductive pattern electrically connecting the fourth and fifth conductive patterns to each other.

  In one embodiment of the present invention, the first connection terminal may be an entire surface where the third conductive pattern connects the first and second conductive patterns, or a surface including the first cut portion and one of the other surfaces. The second connection terminal is formed on the entire surface where the sixth conductive pattern connects the fourth and fifth conductive patterns, or on the surface including the second cut portion and a part of the other surface. Can be done.

  In one embodiment of the present invention, first and second solder accommodating portions may be provided on the first and second external electrodes on the mounting surface side of the capacitor body by the first and second cutting portions, respectively. it can.

  In one embodiment of the present invention, the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes that are alternately stacked with the dielectric layers sandwiched therebetween, and facing each other. Connected to the first and second surfaces, the first and second surfaces, the third and fourth surfaces facing each other, the first and second surfaces, and the third and fourth surfaces; The first and second internal electrodes may be exposed at the third and fourth surfaces, respectively, having fifth and sixth surfaces facing each other.

  In one embodiment of the present invention, the first and second external electrodes include first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and the first and second connection portions. The first and second band portions extending from the first to the first surface of the capacitor body and connected to the first and fourth conductive patterns, respectively.

  In an embodiment of the present invention, the first and second cutting portions may be formed to open toward the third and fourth surfaces of the capacitor body, respectively.

  Another aspect of the present invention includes a plurality of dielectric layers, and a plurality of first and second internal electrodes that are alternately stacked with the dielectric layers interposed therebetween, and first and second surfaces facing each other, Third and fourth surfaces connected to the first and second surfaces and facing each other, connected to the first and second surfaces, and connected to the third and fourth surfaces and facing each other. A capacitor main body having six surfaces, one end of the first and second internal electrodes being exposed on the third and fourth surfaces, respectively, and first and second capacitors disposed on the third and fourth surfaces of the capacitor main body, respectively. A first and second external electrodes each including a second connection portion and first and second band portions extending from the first and second connection portions to a part of the first surface of the capacitor body; First and second connection terminals respectively connected to the second band part; In the multilayer electronic component, the first connection terminal includes a first cutting portion that is opened toward the third surface of the capacitor body, and connects the first and second surfaces of the capacitor body to each other. Both sides of the direction and the portion forming the first cut portion have conductivity, the outer peripheral surface excluding the first cut portion has insulating properties, and the second connection terminal is the fourth of the capacitor body. A second cutting portion that is open toward the surface, and both surfaces in a direction connecting the first and second surfaces of the capacitor body to each other and a portion forming the second cutting portion have conductivity, and Provided is a multilayer electronic component in which the outer peripheral surface excluding the two cut portions has insulation.

  In one embodiment of the present invention, first and second solder accommodating portions may be provided on the first and second band portions on the mounting surface side of the capacitor body by the first and second cutting portions, respectively. it can.

  In one embodiment of the present invention, the first and second cutting parts may be formed to have curved surfaces.

  In an embodiment of the present invention, the first and second cutting parts may be formed in an inverted “U” shape.

  In one embodiment of the present invention, the first and second connection terminals may be bump terminals.

  In one embodiment of the present invention, the first and second connection terminals may be made of an insulating substrate.

  In one embodiment of the present invention, the first and second connection terminals may be circuit boards.

  In one embodiment of the present invention, the insulator included in the first and second connection terminals may be epoxy.

  In one embodiment of the present invention, the first to sixth conductive patterns may be metal patterns.

  Still another aspect of the present invention is mounted such that a substrate having first and second electrode pads on one surface and first and second connection terminals connected to the first and second electrode pads, respectively. Provided is a mounting board for a multilayer electronic component including the multilayer electronic component.

  According to one embodiment of the present invention, there is an effect that acoustic noise in an audible frequency region of 20 kHz or less and high-frequency vibration of 20 kHz or more in a multilayer electronic component can be reduced.

1 is a perspective view showing a multilayer electronic component according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view showing that first and second connection terminals are separated in FIG. 1. (A) And (b) is the top view which showed the 1st and 2nd internal electrode of the multilayer electronic component by 1st Embodiment of this invention, respectively. It is sectional drawing along the II 'line of FIG. FIG. 3 is a perspective view illustrating first and second connection terminals of FIG. 1. FIG. 5A is a perspective view showing another embodiment of the third and sixth conductive patterns. It is the perspective view which showed the multilayer electronic component by 2nd Embodiment of this invention. It is the front view which showed roughly the state by which the multilayer capacitor was mounted in the board | substrate without the connection terminal. It is the front view which showed roughly the state by which the multilayer electronic component by 1st Embodiment of this invention was mounted in the board | substrate.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer description.

  FIG. 1 is a perspective view showing a multilayer electronic component according to a first embodiment of the present invention, and FIG. 2 is an exploded perspective view showing that first and second connection terminals are separated in FIG. FIGS. 3A and 3B are plan views showing the first and second internal electrodes of the multilayer electronic component according to the first embodiment of the present invention, respectively. FIG. FIG. 5A is a perspective view showing the first and second connection terminals of FIG. 1.

  Referring to FIGS. 1 to 5a, the multilayer electronic component 100 according to the first embodiment of the present invention includes a capacitor body 110 and first and second external parts disposed on the mounting surface of the capacitor body 110 so as to be spaced apart from each other. The electrodes 131 and 132 include first and second connection terminals 140 and 150 made of an insulator and connected to the first and second external electrodes 131 and 132, respectively.

  Hereinafter, when the direction of the capacitor body 110 is defined to clearly describe the embodiment of the present invention, X, Y, and Z shown in the drawings are the length direction, the width direction, and the thickness direction of the capacitor body 110, respectively. Indicates. In the present embodiment, the thickness direction can be used in the same concept as the stacking direction in which the dielectric layers are stacked.

  The capacitor body 110 is obtained by laminating a plurality of dielectric layers 111 in the Z direction and then firing, and a plurality of dielectric layers 111 and a plurality of layers alternately stacked in the Z direction with the dielectric layers 111 interposed therebetween. First and second internal electrodes 121 and 122.

  In addition, covers 112 and 113 having a predetermined thickness can be formed on both sides of the capacitor body 110 in the Z direction, if necessary.

  At this time, the dielectric layers 111 adjacent to each other in the capacitor main body 110 can be integrated to such an extent that the boundary cannot be confirmed.

  The capacitor body 110 may have a substantially hexahedron shape, but the present invention is not limited thereto.

  In the present embodiment, for convenience of description, both surfaces of the capacitor body 110 facing each other in the Z direction are connected to the first and second surfaces 1 and 2 and the first and second surfaces 1 and 2 in the X direction. Both surfaces facing each other are connected to the third and fourth surfaces 3, 4, the first and second surfaces 1, 2, and both surfaces facing each other in the Y direction are connected to the third and fourth surfaces 3, 4. The fifth and sixth surfaces 5 and 6 are defined. In the present embodiment, the first surface 1 can be a mounting surface.

The dielectric layer 111 includes a ceramic material having a high dielectric constant, and may include, for example, a BaTiO ₃ based ceramic powder. However, the present invention is not limited to this.

Examples of the BaTiO ₃ ceramic powder include (Ba _1-x Ca _x ) TiO ₃ , Ba (Ti _1-y Ca _y ) O ₃ , (Ba ₁ ) in which Ca, Zr, and the like are partly dissolved in BaTiO _{3. -x Ca x) (Ti 1-} y Zr y) O 3, or _{Ba (Ti 1-y Zr y} ) but such _{O 3} and the like, and the present invention is not limited thereto.

  In addition to the ceramic powder, a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like can be further added to the dielectric layer 111. Examples of the ceramic additive include transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), and aluminum (Al).

  The first and second internal electrodes 121 and 122 are electrodes having different polarities, and are alternately stacked so as to face each other along the Z direction with the dielectric layer 111 interposed therebetween, and one end of the capacitor main body. The third and fourth surfaces 3 and 4 of 110 can be exposed.

  At this time, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the dielectric layer 111 disposed therebetween.

  Thus, the end portions of the first and second internal electrodes 121 and 122 that are alternately exposed on the third and fourth surfaces 3 and 4 of the capacitor body 110 are the third and fourth surfaces 3 and 4 of the capacitor body 110, which will be described later. 4 may be connected to and electrically connected to the first and second external electrodes 131 and 132 disposed in the first and second external electrodes 131 and 132, respectively.

  At this time, the first and second internal electrodes 121 and 122 are formed of a conductive metal, and for example, a material such as nickel (Ni) or a nickel (Ni) alloy can be used. However, the present invention is not limited thereto. Is not to be done.

  With the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132, electric charges are accumulated between the first and second internal electrodes 121 and 122 facing each other.

  At this time, the capacitance of the multilayer electronic component 100 is proportional to the areas of the first and second internal electrodes 121 and 122 that overlap each other along the Z direction.

  The first and second external electrodes 131 and 132 may be supplied with voltages having different polarities and may be connected to and electrically connected to exposed portions of the first and second internal electrodes 121 and 122, respectively.

  A plating layer may be formed on the surfaces of the first and second external electrodes 131 and 132 as necessary.

  For example, the first and second external electrodes 131 and 132 may include the first and second conductive layers, the first and second nickel (Ni) plating layers formed on the first and second conductive layers, First and second tin (Sn) plating layers formed on the first and second plating layers, respectively.

  The first external electrode 131 may include a first connection part 131a and a first band part 131b.

  The first connection part 131a is a part formed on the third surface 3 of the capacitor body 110 and connected to the first internal electrode 121. The first band part 131b is a mounting surface of the capacitor body 110 from the first connection part 131a. This is a portion that extends to a part of the first surface 1 and is connected to the first connection terminal 140.

  At this time, the first band portion 131b is extended to a part of the second surface 2 of the capacitor body 110 and a part of the fifth and sixth surfaces 5, 6 for the purpose of improving the fixing strength. It can extend further.

  The second external electrode 132 may include a second connection part 132a and a second band part 132b.

  The second connection part 132a is a part formed on the fourth surface 4 of the capacitor body 110 and connected to the second internal electrode 122. The second band part 132b is a mounting surface of the capacitor body 110 from the second connection part 132a. This is a portion that extends to a part of the first surface 1 and is connected to the second connection terminal 150.

  At this time, the second band portion 132b is extended to a part of the second surface 2 of the capacitor body 110 and a part of the fifth and sixth surfaces 5, 6 for the purpose of improving the fixing strength. It can extend further.

  The first connection terminal 140 is made of an insulator and includes first and second conductive patterns 145 and 146 made of a conductive metal. For example, the first connection terminal 140 can be made of an insulating substrate such as FR4 or a circuit board, but the present invention is not limited to this. The first connection terminal 140 may be a bump terminal.

  The first conductive pattern 145 is formed on the surface 141 of the first connection terminal 140 facing the first band part 131 b of the first external electrode 131, and the second conductive pattern 146 is the first conductive pattern 145 at the first connection terminal 140. And is formed on the surface 142 facing.

  At this time, since the first and second conductive patterns 145 and 146 of the first connection terminal 140 have the same polarity, the signal terminal and the ground terminal can function as terminals having the same polarity.

  A first cut portion 143 is formed on a part of the outer peripheral surface connecting the two surfaces 141 and 142 where the first and second conductive patterns 145 and 146 are formed in the first connection terminal 140. Thereby, on the first surface 1 side which is the mounting surface of the capacitor main body 110, the first solder accommodating portion 161 as a solder pocket is provided on the first band portion 131b.

  In the present embodiment, the first cutting part 143 may be formed to open toward the third surface 3 of the capacitor body 110. At this time, the first cutting part 143 may be formed to have a curved surface.

  A third conductive pattern 147 is formed on the first cutting part 143 and is made of a conductive metal so as to electrically connect the first and second conductive patterns 145 and 146 to each other. At this time, the third conductive pattern 147 may be formed by plating. The first to third conductive patterns 145, 146, and 147 may be metal patterns.

  With such a configuration, in the first connection terminal 140, the portion forming both surfaces 141 and 142 and the first cutting portion 143 in the direction of connecting the first and second surfaces 1 and 2 of the capacitor body 110 to each other has conductivity. The outer peripheral surface 144 excluding the first cutting part 143 has an insulating property.

  The second connection terminal 150 is made of an insulator and includes fourth and fifth conductive patterns 155 and 156 made of a conductive metal. For example, the second connection terminal 150 can be made of an insulating substrate such as FR4 or a circuit board, but the present invention is not limited to this. The second connection terminal 150 may be a bump terminal.

  The fourth conductive pattern 155 is formed on the surface 151 of the second connection terminal 150 facing the second band portion 132 b of the second external electrode 132, and the fifth conductive pattern 156 is the fourth conductive pattern 155 at the second connection terminal 150. And formed on a surface 152 facing the surface.

  At this time, since the fourth and fifth conductive patterns 155 and 156 of the second connection terminal 150 have the same polarity, the signal terminal and the ground terminal can function as terminals having the same polarity.

  In the second connection terminal 150, a second cutting part 153 is formed on the outer peripheral surface connecting the two surfaces 151 and 152 on which the fourth and fifth conductive patterns 155 and 156 are formed. As a result, on the first surface 1 side, which is the mounting surface of the capacitor body 110, the second solder accommodating portion 162 as a solder pocket is provided on the second band portion 132b.

  In the present embodiment, the second cutting part 153 may be formed to open toward the fourth surface 4 of the capacitor body 110. At this time, the second cutting part 153 may be formed to have a curved surface.

  A sixth conductive pattern 157 is formed on the second cut portion 153 and is made of a conductive metal and electrically connects the fourth and fifth conductive patterns 155 and 156 to each other. At this time, the sixth conductive pattern 157 may be formed by plating.

  With such a configuration, in the second connection terminal 150, the portion forming both surfaces 151 and 152 and the second cutting portion 153 in the direction connecting the first and second surfaces 1 and 2 of the capacitor body 110 to each other has conductivity. The outer peripheral surface 154 excluding the second cutting portion 153 has insulation properties. The fourth to sixth conductive patterns 155, 156, and 157 may be metal patterns.

  On the other hand, referring to FIG. 5b, the first connection terminal 140 includes a surface including a first conductive portion 147, 148 of the third conductive pattern connecting the first and second conductive patterns 145, 146, or a surface including the first cutting portion 143. It can be formed on a part of the other surface. In addition, the second connection terminal 150 includes the entire surface 157 and 158 where the sixth conductive pattern connects the fourth and fifth conductive patterns 155 and 156, or the surface including the second cutting portion 153 and a part of the other surface. Can be formed.

  As described above, when the third conductive pattern and the sixth conductive pattern are further formed on the whole or a part of the outer peripheral surfaces of the first and second connection terminals 140 and 150, the first and second cut portions 143, It is possible to improve the positional deviation between the chip and the substrate at the time of mounting by performing the soldering performed only on the inner side of 153 on the outer peripheral surface other than the first and second cutting portions 143 and 153. . At this time, the third and sixth conductive patterns can be formed by plating.

  In addition, the first and second connection terminals 140 and 150 can reduce the transmission of piezoelectric vibration generated in the capacitor body 110 to the substrate by separating the mounted substrate and the capacitor body 110 by a predetermined distance. Such an effect can be improved when the thickness of the first and second connection terminals 140 and 150 is equal to or greater than a predetermined thickness. For example, the thickness of the first and second connection terminals 140 and 150 is Although it can be 60 μm or more, the present invention is not limited to this.

  Further, the first and second connection terminals 140 and 150 may include a plating layer as necessary. The plating layer includes a nickel (Ni) plating layer formed on the first to sixth conductive patterns of the first and second connection terminals 140 and 150, and a tin (Sn) plating formed on the nickel plating layer. Layers.

  As shown in FIG. 6, the multilayer electronic component 100 ′ according to another embodiment of the present invention includes first and second cutting portions 143 ′ and 153 ′ of the first and second connection terminals 140 ′ and 150 ′. Can be formed in an inverted “U” shape.

  At this time, the first and second cutting portions 143 ′ and 153 ′ may be formed to open toward the third and fourth surfaces of the capacitor body 110 in the X direction.

  Accordingly, on the first surface 1 side of the capacitor body 110, the first and second solder accommodating portions 163 and 164 having a rectangular shape are formed on the first and second band portions of the first and second external electrodes 131 and 132. Can be provided.

  Therefore, it is possible to secure a relatively large volume of the solder pocket as compared with the multilayer electronic component having a curved surface, and a relatively large amount of the solder pocket when the multilayer electronic component 100 ′ is mounted on the substrate. Since the solder can be taken in, the formation of solder fillets can be effectively suppressed, and the acoustic noise reduction effect of the multilayer electronic component 100 ′ can be further improved.

  On the other hand, the 1st and 2nd cutting part in this invention consists of a several bending surface, Comprising: In addition to the inverted "U" shape shown by FIG. 6, it has 2 bending parts. It can be configured to comprise four or more surfaces, consisting of one surface or having three or more folds.

  FIG. 7 is a front view schematically showing a state in which the multilayer capacitor is mounted on the substrate without connection terminals, and FIG. 8 is a diagram illustrating the multilayer electronic component according to the first embodiment of the present invention mounted on the substrate. FIG.

  When voltages having different polarities are applied to the first and second external electrodes 131 and 132 formed on the multilayer electronic component 100 in a state where the multilayer electronic component 100 is mounted on the substrate 210, the dielectric layer 111 The capacitor body 110 expands and contracts in the thickness direction due to the inverse piezoelectric effect (inverse piezoelectric effect), and both ends of the first and second external electrodes 131 and 132 are formed at the capacitor body 110 due to the Poisson effect (poisson effect). In contrast to the expansion and contraction in the thickness direction, the film contracts and expands.

  Such contraction and expansion generate vibrations. In addition, the vibration is transmitted from the first and second external electrodes 131 and 132 to the substrate 210, whereby sound is radiated from the substrate 210 and becomes acoustic noise.

  Referring to FIG. 7, solder 231 ′ formed between the first and second external electrodes 131 and 132 of the multilayer capacitor and the first and second electrode pads 221 and 222 formed on one surface of the substrate 210. Since 232 ′ is formed at a certain height toward the second surface of the capacitor body 110, a large amount of vibration generated from the multilayer capacitor can be transmitted to the substrate.

  Referring to FIG. 8, the multilayer electronic component mounting substrate according to the present embodiment includes a substrate 210 having first and second electrode pads 221 and 222 on one surface, and first and second connection terminals 140 on the upper surface of the substrate 210. , 150 are mounted so as to be connected to the first and second electrode pads 221 and 222, respectively.

  At this time, in the present embodiment, the multilayer electronic component 100 is described as being mounted on the substrate 210 via the solders 231 and 232. However, if necessary, a conductive paste can be used instead of the solder. It may be used.

  According to the present embodiment, the piezoelectric vibration transmitted to the substrate via the first and second external electrodes 131 and 132 of the multilayer electronic component 100 is the first and second made of an insulator made of a soft material. Acoustic noise can be reduced by being absorbed by the elasticity of the connection terminals 140 and 150.

  At this time, the first and second solder accommodating portions provided by the first and second cutting portions of the first and second connection terminals 140 and 150 take the solders 231 and 232 into the first surface of the capacitor body 110, respectively. It will play a role as a solder pocket.

  In the present embodiment, portions of the outer peripheral surfaces of the first and second connection terminals 140 and 150 excluding the first and second cut portions are made of an insulating surface.

  As a result, when the multilayer electronic component 100 is mounted on the substrate 210, no solder is formed on the outer peripheral surfaces of the first and second connection terminals except for the first and second cut portions. The solders 231 and 232 are more effectively taken into the accommodating portions 161 and 162. Thereby, it can suppress that a solder fillet (Solder Fillet) is formed toward the 2nd surface of the capacitor body 110. FIG.

  Accordingly, the piezoelectric vibration transmission path of the multilayer electronic component 100 is cut off, and the maximum displacement point between the solder fillet and the capacitor body 110 is separated, so that the acoustic noise of the multilayer electronic component 100 can be reduced compared to the structure of FIG. The reduction effect can be remarkably improved.

  Further, according to the present embodiment, the acoustic noise reduction structure can also effectively suppress the vibration amount transmitted to the substrate of the piezoelectric vibration of the multilayer electronic component at an audible frequency within 20 kHz.

  Therefore, it reduces the high-frequency vibration of multilayer electronic components, prevents malfunction of sensors that can be a problem due to high-frequency vibration of 20 kHz or more of electronic components in the IT or industrial / electric equipment field, Accumulation of fatigue can be suppressed.

  As mentioned above, although embodiment of this invention was described in detail, the scope of the present invention is not limited to this, and various correction and deformation | transformation are within the range which does not deviate from the technical idea of this invention described in the claim. It will be apparent to those having ordinary knowledge in the art.

100, 100 'Electronic component 110 Capacitor body 111 Dielectric layer 121, 122 First and second internal electrodes 131, 132 First and second external electrodes 131a, 132a First and second connection portions 131b, 132b First and second 2-band part 140,140 '1st connection terminal 143,153 1st and 2nd cutting part 145-147 1st-3rd conductive pattern 150,150' 2nd connection terminal 155-157 4th-6th conductive pattern 161 163, first solder accommodating portion 162, 164 second solder accommodating portion 210 substrate 221, 222 first and second electrode pads 231, 232 solder

Claims (30)

A capacitor body;
First and second external electrodes disposed on the mounting surface of the capacitor body to be spaced apart from each other;
A multilayer electronic component including an insulator and including first and second connection terminals respectively connected to the first and second external electrodes;
The first connection terminal includes a first conductive pattern formed on a first surface facing the first external electrode, a second conductive pattern formed on a second surface facing the first surface, and the first connection terminal. And a first cutting part formed on one or more side surfaces connecting the second surfaces to each other, and a third cutting part formed on the first cutting part and electrically connecting the first and second conductive patterns to each other. A conductive pattern,
The second connection terminal includes a fourth conductive pattern formed on a fourth surface facing the second external electrode, a fifth conductive pattern formed on a fifth surface opposite to the fourth surface, and the fourth And a second cutting part formed on one or more side surfaces connecting the fifth surface and the fifth surface, and a sixth cutting part formed on the second cutting part and electrically connecting the fourth and fifth conductive patterns to each other. A multilayer electronic component comprising a conductive pattern. The third conductive pattern is formed on one or more other sides of the first connection terminal;
The multilayer electronic component according to claim 1, wherein the sixth conductive pattern is formed on one or more other sides of the second connection terminal.   3. The multilayer according to claim 1, wherein first and second solder accommodating portions are provided on the first and second external electrodes on the mounting surface side of the capacitor body by the first and second cutting portions, respectively. Type electronic components. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes that are alternately stacked with each of the plurality of dielectric layers interposed therebetween, and first and second opposing each other. Connected to the first and second surfaces and connected to the third and fourth surfaces, connected to the first and second surfaces, and connected to the third and fourth surfaces to face each other. And have fifth and sixth surfaces,
4. The multilayer electronic component according to claim 1, wherein end portions of the first and second internal electrodes are exposed on the third and fourth surfaces, respectively. 5.   The first and second external electrodes are disposed on the third and fourth surfaces of the capacitor body, respectively, and the first surface of the capacitor body from the first and second connection portions. The multilayer electronic component according to claim 4, further comprising first and second band portions that extend to a part of the first and second band portions and are respectively connected to the first and fourth conductive patterns.   6. The multilayer electronic component according to claim 5, wherein the first and second cut portions are formed to be opened toward the third and fourth surfaces of the capacitor body, respectively.   The multilayer electronic component according to claim 1, wherein the first and second connection terminals are bump terminals.   The multilayer electronic component according to claim 1, wherein the first and second connection terminals are made of an insulating substrate.   The multilayer electronic component according to any one of claims 1 to 6, wherein the first and second connection terminals are circuit boards.   The multilayer electronic component according to any one of claims 1 to 9, wherein the insulator included in the first and second connection terminals includes epoxy.   The multilayer electronic component according to any one of claims 1 to 10, wherein the first to sixth conductive patterns are metal patterns. A plurality of dielectric layers; and a plurality of first and second internal electrodes stacked alternately with each of the plurality of dielectric layers interposed therebetween, the first and second surfaces facing each other; Third and fourth surfaces connected to the second surface and facing each other; fifth and sixth surfaces connected to the first and second surfaces and connected to the third and fourth surfaces and facing each other A capacitor body with one end of the first and second internal electrodes exposed on the third and fourth surfaces, respectively,
First and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body, and first and second portions extending from the first and second connection portions to a part of the first surface of the capacitor body. First and second external electrodes each including a band part;
A multilayer electronic component including first and second connection terminals respectively connected to the first and second band portions;
The first connection terminal includes a first cutting portion that opens toward a third surface of the capacitor body, and the first cutting portion and the first and second surfaces of the capacitor body are connected to each other. The both sides of the first connection terminals facing each other in the first direction have conductivity, and the outer peripheral surface of the first connection terminal connected to both sides of the first connection terminal except for the first cutting portion is Have insulation,
The second connection terminal includes a second cutting portion that is opened toward a fourth surface of the capacitor body, and the second cutting portion and both surfaces of the second connection terminal facing each other in the first direction. A multilayer electronic component having conductivity, wherein an outer peripheral surface of the second connection terminal connected to both surfaces of the second connection terminal except for the second cutting portion is insulative. One or more outer peripheral surfaces of the first connection terminal have conductivity,
The multilayer electronic component according to claim 12, wherein one or more outer peripheral surfaces of the second connection terminals have conductivity.   14. The multilayer according to claim 12, wherein first and second solder accommodating portions are provided on the first and second band portions on the mounting surface side of the capacitor body by the first and second cutting portions, respectively. Type electronic components.   The multilayer electronic component according to any one of claims 12 to 14, wherein the first and second cutting portions are formed to have curved surfaces.   The multilayer electronic component according to any one of claims 12 to 14, wherein the first and second cutting portions are formed of a plurality of flat surfaces.   The multilayer electronic component according to claim 12, wherein the first and second connection terminals are bump terminals.   The multilayer electronic component according to claim 12, wherein the first and second connection terminals are made of an insulating substrate.   The multilayer electronic component according to claim 12, wherein the first and second connection terminals are circuit boards.   The multilayer electronic component according to any one of claims 12 to 19, wherein the insulator included in the first and second connection terminals includes epoxy.   The multilayer electronic component according to any one of claims 12 to 20, wherein the conductive surface includes a metal pattern. A substrate having first and second electrode pads on one side;
The multilayer electronic component according to any one of claims 1 to 21, wherein the multilayer electronic component is mounted so that the first and second connection terminals are respectively connected to the first and second electrode pads. Type electronic component mounting board. A substrate,
First and second electrode pads disposed on an upper surface of the substrate and spaced apart in a length direction;
It includes a plurality of first and second internal electrodes that are alternately stacked with a dielectric layer sandwiched in a thickness direction orthogonal to the top surface of the substrate, the bottom surface serving as a mounting surface in the thickness direction, and the first and second A capacitor body exposed at the first and second end faces of the internal electrode opposite to each other in the length direction;
A first external electrode including a first band part disposed on a first end surface of the capacitor body and extending to a mounting surface of the capacitor body;
A second external electrode including a second band part disposed on the second end surface of the capacitor body and extending to a mounting surface of the capacitor body;
A first connection including a first cutting portion connected to the upper surface of the first electrode pad, connected to the lower surface of the first band portion, and formed on a side surface not facing the second electrode pad in the length direction. A terminal,
A second cutting portion connected to the upper surface of the second electrode pad, connected to the lower surface of the second band portion, and formed on a side surface not facing the first electrode pad in the length direction; A second connection terminal spaced apart from the connection terminal;
A first solder for electrically connecting the first external electrode and the first cut portion with the first electrode pad;
A second solder that electrically connects the second external electrode and the second cut portion with the second electrode pad;
At least some of the first and second connection terminals each include an insulator,
Each of the first and second cutting parts has an electrically conductive surface.   24. The electronic device according to claim 23, wherein the first and second cutting parts have a spherical shape.   24. The electronic device of claim 23, wherein the first and second cutting portions have concave surfaces.   26. The electronic device according to any one of claims 23 to 25, wherein the insulator is an epoxy. A substrate including first and second electrode pads disposed on the upper surface so as to be spaced apart in the longitudinal direction;
A main body having a bottom surface in a thickness direction orthogonal to the upper surface of the substrate, and first and second external electrodes disposed on the bottom surface so as to be spaced apart from each other in the length direction;
The first and second electrodes include an insulating material, spaced apart from each other in the length direction, connecting the first and second electrode pads and the first and second external electrodes, respectively, and projecting in a direction perpendicular to the thickness direction. 2 and a first connection terminal including first and second conductive patterns disposed on the first and second cut portions, respectively.
An electronic device, wherein the first and second external electrodes are electrically connected to the first and second electrode pads by solder, respectively.   28. The electronic device according to claim 27, wherein the first and second cutting parts have a spherical shape.   28. The electronic device of claim 27, wherein the first and second cutting parts have concave surfaces.   30. The first and second connection terminals may further include conductive patterns disposed on upper and lower surfaces of the connection terminal, respectively, and electrically connected to a conductive pattern disposed on the cutting portion. The electronic device as described in any one.