JP2018206965A5

JP2018206965A5 -

Info

Publication number: JP2018206965A5
Application number: JP2017111044A
Authority: JP
Filing date: 2017-06-05
Publication date: 2020-03-05
Anticipated expiration: 2037-06-05

Description

本発明の一態様によれば、交差する複数の分割予定ラインによってチップとなる複数の領域に区画されたチップ領域と、該チップ領域を囲む外周余剰領域と、を有する板状の被加工物から複数の該チップを製造するチップの製造方法であって、被加工物を保持テーブルで直に保持する保持ステップと、該保持ステップを実施した後に、被加工物に対して透過性を有する波長のレーザビームの集光点を該保持テーブルに保持された被加工物の内部に位置づけるように該分割予定ラインに沿って被加工物の該チップ領域にのみ該レーザビームを照射し、該チップ領域の該分割予定ラインに沿って改質層を形成するとともに、該外周余剰領域を改質層が形成されていない補強部とするレーザ加工ステップと、該レーザ加工ステップを実施した後に、該保持テーブルから被加工物を搬出する搬出ステップと、該搬出ステップを実施した後に、被加工物に力を付与して被加工物を個々の該チップへと分割する分割ステップと、を備え、該分割ステップでは、加熱と冷却とにより該力を付与して被加工物を個々の該チップへと分割するチップの製造方法が提供される。 According to one embodiment of the present invention, a plate-shaped workpiece having a chip region partitioned into a plurality of regions to be chips by a plurality of intersecting dividing lines and an outer peripheral surplus region surrounding the chip region, A chip manufacturing method for manufacturing a plurality of the chips, wherein a holding step of directly holding the workpiece on a holding table, and after performing the holding step, a wavelength of a wavelength that is transparent to the workpiece. The laser beam is applied only to the chip area of the workpiece along the dividing line so as to locate the focal point of the laser beam inside the workpiece held by the holding table, Along with forming the modified layer along the planned dividing line, a laser processing step of making the outer peripheral surplus region a reinforcing portion where the modified layer is not formed, and after performing the laser processing step, And unloading step for unloading the workpiece from the holding table, after performing該搬output step includes a dividing step of dividing a by applying a force to the workpiece to the workpiece the individual the chip, and the in division step, the manufacturing method of the chip to divide heating and cooling and to impart the force by the workpiece the individual the chip is provided.

本発明の一態様において、該レーザ加工ステップを実施した後、該分割ステップを実施する前に、該補強部を除去する補強部除去ステップを更に備えても良い。また、本発明の一態様において、該保持テーブルの上面は、柔軟な材料によって構成されており、該保持ステップでは、該柔軟な材料で被加工物の表面側を保持しても良い。 In one embodiment of the present invention, the method may further include a reinforcing part removing step of removing the reinforcing part after performing the laser processing step and before performing the dividing step. In one embodiment of the present invention, the upper surface of the holding table is made of a flexible material, and in the holding step, the front side of the workpiece may be held by the flexible material.

本発明の一態様に係るチップの製造方法では、被加工物を保持テーブルで直に保持した状態で、被加工物のチップ領域にのみレーザビームを照射して分割予定ラインに沿う改質層を形成し、その後、加熱と冷却とにより力を付与して被加工物を個々のチップへと分割するので、被加工物に力を加えて個々のチップへと分割するためにエキスパンドシートを用いる必要がない。このように、本発明の一態様に係るチップの製造方法によれば、エキスパンドシートを用いることなく板状の被加工物を分割して複数のチップを製造できる。 The chip manufacturing method according to an embodiment of the present invention, while directly held by the holding table a workpiece, a modified layer along the dividing lines by irradiating a laser beam only in the chip region of the workpiece formed, then, the heating and cooling by by applying a force to split the workpiece into individual chips, necessary to use the expanded sheet to split into individual chips by applying a force to the workpiece There is no. As described above, according to the method for manufacturing a chip according to one embodiment of the present invention, a plurality of chips can be manufactured by dividing a plate-shaped workpiece without using an expanded sheet.

また、本発明の一態様に係るチップの製造方法では、被加工物のチップ領域にのみレーザビームを照射して分割予定ラインに沿う改質層を形成するとともに、外周余剰領域を改質層が形成されていない補強部とするので、この補強部によってチップ領域は補強される。よって、搬送等の際に加わる力によって被加工物が個々のチップへと分割されてしまい、被加工物を適切に搬送できなくなることもない。 In the method for manufacturing a chip according to one embodiment of the present invention, a modified layer is formed along a line to be divided by irradiating a laser beam only to a chip region of a workpiece, and a modified layer is formed in a surplus outer peripheral region. Since the reinforcing portion is not formed, the chip region is reinforced by the reinforcing portion. Therefore, the workpiece is not divided into individual chips by the force applied at the time of transportation or the like, and the workpiece cannot be properly transported.

Claims

A chip for manufacturing a plurality of chips from a plate-shaped workpiece having a chip region partitioned into a plurality of regions to be chips by a plurality of intersecting dividing lines, and an outer peripheral surplus region surrounding the chip region. A manufacturing method,
A holding step for holding the workpiece directly on the holding table;
After performing the holding step, along the dividing lines so as to position inside the workpiece converging point of the laser beam having a transmission wavelength to held on the holding table to the workpiece The laser beam is applied only to the chip region of the workpiece to form a modified layer along the planned dividing line in the chip region, and the outer peripheral surplus region is a reinforcing portion where the modified layer is not formed. A laser processing step,
After performing the laser processing step, an unloading step of unloading the workpiece from the holding table,
After performing the該搬out step, and a dividing step of dividing the a by applying a force workpiece into individual said chips to the workpiece,
In the dividing step, a chip is produced by applying the force by heating and cooling to divide a workpiece into individual chips.

2. The method according to claim 1, further comprising: a step of removing the reinforcing portion after performing the laser processing step and before performing the dividing step.

The upper surface of the holding table is made of a flexible material,
The chip manufacturing method according to claim 1, wherein, in the holding step, a surface side of the workpiece is held by the flexible material.