JP2018179748A - Inspection procedure data generation device, substrate inspection device, and substrate inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To generate inspection procedure data capable of sufficiently reducing the possibility of electrostatic breakdown of electronic components in substrate inspection.SOLUTION: A test object substrate includes a semiconductor element mounted thereon, and a plurality of probing points having a first type probing point for conducting a conductor pattern defined by any one of ground and power source and a second type probing point for conducting a signal input/output terminal of a semiconductor element. An inspection procedure data generation device generates inspection procedure data for determining the execution sequence of inspection steps for causing a substrate inspection device to contact the probing points of the test object substrate with an inspection probe and to conduct inspection. Prior to execution of inspection step on the second type probing point, a connection step for connecting the first type probing point to a reference potential via the probe is incorporated to thereby generate the inspection procedure data.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an inspection procedure data generation device that generates inspection procedure data that determines the execution order of inspection steps by a substrate inspection device, and a substrate inspection device that performs inspection according to inspection procedure data. The present invention also relates to a substrate inspection method using a substrate inspection apparatus.

  As an inspection procedure data generation device for generating this kind of inspection procedure data, the applicant discloses an inspection order setting device used in a probe moving type substrate inspection device in Patent Document 1 below. The applicant has also disclosed in Patent Document 1 below a movable probe type substrate inspection apparatus for inspecting a circuit substrate to be inspected (hereinafter also referred to as “inspection target substrate”) according to the generated inspection procedure data. There is.

  In the inspection of a substrate to be inspected by the substrate inspection apparatus disclosed by the applicant, the CPU first determines the execution order (the order of probing for each measurement point) of each inspection step to be performed. Specifically, the CPU designates the number of the inspection step to be executed first among all the inspection steps to be executed by key operation. This establishes the first (first) inspection step as a reference step. Next, the CPU calculates the distances between the measurement point of the first inspection step and the measurement points of other inspection steps whose execution order is not determined, and the CPU calculates the distance to the measurement point of the first inspection step. Identify the inspection step of the measurement point located at the shortest distance. This establishes the second inspection step. Subsequently, for each of the third and subsequent inspection steps, the CPU measures the shortest distance from the measurement point of the inspection step determined immediately before, similarly to the determination procedure of the second inspection step described above. The point inspection step is identified, and the identified inspection step is determined as the next inspection step. Thereafter, the CPU repeatedly executes the above process until there is no inspection step whose execution order has not been determined. This determines the inspection order of all the inspection steps. Then, the substrate inspection apparatus disclosed by the applicant executes the inspection of each step in the determined inspection order.

Patent No. 3034583 (Claim 1)

  However, the substrate inspection apparatus disclosed by the applicant has the following problems to be improved. Specifically, when the inspection target substrate is carried into the substrate inspection apparatus, the inspection target substrate rubs against the carrying-in device M such as a loader, and at that time, as shown in FIG. Static electricity is charged on the capacitance C between the wider conductor pattern G (in the figure, the conductor pattern connected to the ground is shown) defined in either of the power source and the power source and the loading device M connected to the reference potential B There is something to do.

  In this case, when the inspection is started in a state in which the capacitance C is electrostatically charged, it is weak to the electrostatic, for example, depending on the probing point (measuring point) for probing the probe PR in the first inspection step in the determined inspection order. There is a possibility of electrostatic breakdown of electronic components such as semiconductor devices. For example, as shown in FIG. 5, when the probe PR is first probed on the conductor pattern connected to the signal input / output terminal of the semiconductor element SE, the positive voltage side of the capacitor C is shown as shown by the broken line in the figure. Of the substrate inspection device having the same potential as the reference potential B of the terminal of the semiconductor device SE, the conductor pattern G, the internal circuit of the semiconductor element SE, the conductor pattern connected to the signal input / output terminal of the semiconductor element SE A current path including the reference potential B of the part and the terminal on the negative voltage side of the capacitance C is formed. Then, the static electricity charged in the capacitor C is discharged by flowing through this current path. At that time, there is a possibility that the semiconductor element SE may be electrostatically destroyed due to the current flowing above the allowable passing current value of the semiconductor element SE. In the substrate inspection using the substrate inspection apparatus, it is preferable to sufficiently reduce the possibility that the electronic component such as the semiconductor element SE is electrostatically destroyed.

  The present invention has been made in view of such problems to be improved, and an inspection procedure data generation device capable of sufficiently reducing the possibility of electrostatic destruction of electronic parts in substrate inspection using a substrate inspection apparatus, substrate An object of the present invention is to provide an inspection apparatus and a substrate inspection method.

  In order to achieve the above object, the inspection procedure data generation apparatus according to claim 1 is a first type of probing point in which a semiconductor element is mounted and which is conducted to a conductor pattern defined by either the ground or the power supply and the semiconductor In the inspection step, a probe for inspection is brought into contact with the probing point and the substrate inspection apparatus inspects a substrate to be inspected having a plurality of probing points including the second type of probing point conducted to the signal input / output terminal of the element. An inspection procedure data generation apparatus for generating inspection procedure data for determining an execution order, wherein the first type probing points and the reference type are detected via the probe prior to the execution of the inspection step on the second type probing points. Incorporating a connection step to connect potentials To generate the order data.

  According to a second aspect of the present invention, in the inspection procedure data generation device according to the first aspect, when the substrate inspection device includes at least a pair of movable probes, the reference potential is generated. And the connection step of probing one of the probes connected to the first type of probing point.

  According to a third aspect of the present invention, there is provided a substrate inspection apparatus comprising: at least a pair of movable probes; a movement mechanism for holding the probes movably in any of three orthogonal axial directions; a measuring unit; The semiconductor device is mounted, and the first type of probing point conducted to the conductor pattern defined by either the ground or the power source and the second type of probing point conducted to the signal input / output terminal of the semiconductor device And the control unit is configured to inspect the substrate to be inspected having a plurality of probing points including the plurality of probing points, and the control unit performs the movement prior to the execution of the inspection step on the second type probing points according to inspection procedure data. One of the probes connected to the reference potential by controlling the mechanism is pro- grammed to the probing point of the first type. To Bing.

  According to a fourth aspect of the present invention, in the substrate inspection method, the semiconductor element is mounted, and the first type of probing point electrically connected to the conductor pattern defined by either the ground or the power source and the signal input / output terminal of the semiconductor element A substrate inspection method for inspecting a substrate to be inspected having a plurality of probing points including a second type of probing point electrically connected to the inspection point by bringing a probe for inspection into contact with the probing points, A connection step of connecting the first type of probing point and the reference potential via the probe is performed prior to the execution of the inspection step on the second type of probing point.

  According to a fifth aspect of the present invention, in the substrate inspection method according to the fourth aspect, the reference potential is connected using a substrate inspection apparatus configured to include at least a pair of movable probes. Performing the connecting step of probing one of the probes at the first type of probing point.

  In the inspection procedure data generation apparatus according to claim 1, an inspection procedure incorporating a connection step of connecting the first type of probing point and the reference potential via the probe prior to the execution of the inspection step on the second type of probing point. Generate data. Further, in the substrate inspection method according to claim 4, according to the inspection procedure data, prior to the execution of the inspection step on the second type of probing point, one probe connected to the reference potential is used as the first type of probing point. Probe it.

  Therefore, according to the inspection procedure data generation apparatus and the substrate inspection method, even when the inspection is started in a state in which static electricity is charged between the conductor pattern of the inspection object substrate and the reference potential, the connection step can be performed. By performing this prior to the inspection step, the charged static electricity can be discharged to the reference potential through the probe. Therefore, according to the inspection procedure data generation device and the substrate inspection method, the passage of static electricity to the internal circuit of the semiconductor device can be avoided in the substrate inspection, and as a result, the electrostatics of the semiconductor device in the substrate inspection using the substrate inspection device Destruction can be avoided.

  In the inspection procedure data generation device according to claim 2, when the substrate inspection device is configured to include at least a pair of movable probes, one probe connected to the reference potential is used as a probing point of the first type type. To generate test procedure data. Therefore, according to this inspection procedure data generation device, the substrate inspection device according to claim 3 and the substrate inspection method according to claim 5, electrostatic breakdown of semiconductor elements in substrate inspection by this type of substrate inspection device is avoided. be able to.

FIG. 1 is a configuration diagram showing a configuration of a substrate inspection system 1; FIG. 2 is a block diagram showing the configuration of a substrate inspection apparatus 2; It is a flow chart which shows the procedure of inspection procedure data generation processing. It is explanatory drawing explaining a connection step. It is an explanatory view explaining electrostatic breakdown of semiconductor element SE in substrate inspection.

  Hereinafter, embodiments of an inspection procedure data generation device, a substrate inspection device, and a substrate inspection method according to the present invention will be described with reference to the attached drawings.

  The substrate inspection system 1 shown in FIG. 1 includes a substrate inspection apparatus 2, a rack 3, a loader 4, a conveyance path 5 (the upstream conveyance path 5A, the downstream conveyance path 5B), and an inspection procedure data generation device 6. Conduction and disconnection of the conductor pattern on the board inspection device 2 according to the inspection procedure data generated by the inspection procedure data generation device 6 by automatically transporting the circuit substrate 10 to be inspected (hereinafter also referred to as “inspection object substrate 10”) And inspection of electronic components.

  First, the inspection target substrate 10 will be described. The inspection target substrate 10 is an example of the “inspection target substrate”, and as shown in FIG. 4, is a conductor pattern on which electronic components such as the semiconductor element 13 are mounted and which is defined by either the ground or the power supply. A plurality of broad conductive patterns 11 are formed on the inner layer or the surface of the substrate (in the figure, a state in which one conductive pattern is formed on the inner layer is illustrated) and signal input / output of electronic components such as semiconductor elements 13 A narrow conductor pattern 12 connected to the terminal is configured as a multilayer printed circuit board formed on the inner layer or the substrate surface. In this case, the conductor pattern 11 formed in the inner layer is electrically connected to the land 14 formed on the substrate surface through a via or the like. Further, as shown in the figure, the inspection target substrate 10 has a probing point P1 (first type of probing point P1) conducting to the conductor pattern 11 and a probing point P2 (second type probing) conducting to the conductor pattern 12 And a plurality of probing points including point P2). The “inspection target substrate” is not limited to the multilayer printed circuit board as in the present embodiment, and may be a single layer circuit board or a flexible substrate.

  The substrate inspection apparatus 2 is an example of the “substrate inspection apparatus”, and as shown in FIG. 2, the substrate holding unit 21, the moving mechanisms 22 a and 22 b (hereinafter also referred to as “moving mechanism 22” when not distinguished), a probe 23a and 23b (hereinafter, also referred to as "probes 23" when not distinguished), a measuring unit 24, an operating unit 25, a display unit 26, a storage unit 27, and a control unit 28 are provided. The inspection probe 23 is brought into contact to execute an inspection step for inspection.

  The substrate holding unit 21 sucks or holds the inspection target substrate 10 under the control of the control unit 28 and holds the inspection target substrate 10 at the inspection position. The moving mechanism 22 is an example of a “moving mechanism”, and moves the probe 23 according to the control of the control unit 28 to make probing at each probing point in the conductor pattern of the inspection object substrate 10 held by the substrate holding unit 21. . The probes 23a and 23b are flying type probes, and are attached to the moving mechanisms 22a and 22b so as to be movable in any of three orthogonal axial directions (X-Y-Z directions), and connected to the measurement unit 24 It is done.

  The measuring unit 24 measures the electrical parameters (current values) between the probing points based on the electrical signals input to and output from the probing points of the inspection target substrate 10 through the probes 23a and 23b according to the control of the control unit 28. , Voltage value, resistance value, phase, etc.) and output measurement data. The operation unit 25 includes an operation switch, an operation touch panel, and the like (not shown) for setting operation conditions of the substrate inspection apparatus 2 and instructing start / stop of substrate inspection, and controls an operation signal corresponding to the operation. Output to 28. The display unit 26 displays the inspection result and the like of the inspection target substrate 10 according to the control of the control unit 28.

  The storage unit 27 is a memory, and stores various data according to the control of the control unit 28. Specifically, the storage unit 27 stores inspection procedure data for determining the execution order of the inspection steps, measurement data measured by the measurement unit 24, and inspection reference data for determining the quality of the measurement data. .

  The control unit 28 is constituted by, for example, a CPU, and controls the substrate inspection apparatus 2 in a comprehensive manner. Specifically, control unit 28 causes storage unit 27 to store the inspection procedure data transferred from inspection procedure data generation device 6. In addition, the control unit 28 controls the moving mechanisms 22a and 22b according to the inspection procedure data stored in the storage unit 27 to cause the probes 23a and 23b to be probed at the probing points associated with the respective inspection steps. Control 24 to execute measurement processing. Further, the control unit 28 causes the storage unit 27 to store the measurement data measured by the measurement unit 24. Furthermore, the control unit 28 is based on the measurement data and the inspection reference data stored in the storage unit 27, and the conduction state (conduction inspection) or the insulation state (insulation inspection) between the probing points at which the probes 23a and 23b are probed. And, the quality of the state (electronic component inspection) of the electronic component such as the semiconductor element 13 is judged, and the judgment result is displayed on the display unit 26 or outputted to the external device.

  As shown in FIG. 1, the rack 3 accommodates a plurality of inspection target substrates 10 in a stacked state. The loader 4 is disposed on the upstream side of the transport path 5 and feeds the inspection target substrates 10 stacked on the rack 3 one by one to the transport path 5A on the upstream side. The transport path 5A transports the inspection target board 10 before inspection to the board inspection apparatus 2, and the transport path 5B transports the inspected inspection target board 10 from the board inspection apparatus 2 to the loading place of the inspected board outside the figure. Do.

  The inspection procedure data generation device 6 is constituted of, for example, a personal computer, and is configured to be capable of data communication with the substrate inspection device 2 and a CAD (computer-aided design) system 7 by communication means such as USB cable connection. In addition, the inspection procedure data generation device 6 determines inspection procedure data for determining the execution order of the inspection steps to be executed by the substrate inspection device 2 based on CAD data or Gerber data of the inspection target substrate 10 taken from the CAD system 7. Generate Further, inspection procedure data generation device 6 generates inspection procedure data according to inspection procedure data generation processing S1 shown in FIG. 3 described later, and transfers the generated inspection procedure data to substrate inspection device 2.

  Next, a method of generating inspection procedure data used when inspecting the inspection target substrate 10 will be described with reference to the drawings. In this case, the inspection procedure data is generated by executing the inspection procedure data generation process S1 shown in FIG. 3 by the inspection procedure data generation device 6 in order to avoid electrostatic breakdown of the semiconductor element 13.

  In inspection procedure data generation processing S1, first, inspection procedure data generation device 6 communicates with CAD system 7 to capture substrate data on inspection object substrate 10 such as CAD data and Gerber data from CAD system 7 (step S2).

  Subsequently, the inspection procedure data generation device 6 performs continuity inspection, insulation inspection, and component inspection of electronic components such as the semiconductor element 13 mounted on the inspection target substrate 10 to be performed for each conductor pattern from the taken-in substrate data. Extract inspection step items. Furthermore, the inspection procedure data generation device 6 rearranges the extracted inspection step items so that the moving distance of the probe 23 becomes as short as possible in order to shorten the inspection time, and the order and inspection to be performed by the substrate inspection device 2 An inspection step that defines the content is generated (step S3).

  Subsequently, the inspection procedure data generation device 6 incorporates a connecting step for connecting the first type probing point P1 and the reference potential B via the probe 23a prior to the execution of the inspection step for the second type probing point P2. Inspection procedure data is generated (step S4).

  Specifically, when the probing points corresponding to the first inspection step (the first inspection step) are the first type probing point P1 and the second type probing point P2, as shown in FIG. The probe 23a is probed at the first type of probing point P1 as the connection step, and then the connection step is incorporated to probe the probe 23b with a time difference at the second type of probing point P2 as the inspection step and inspection procedure data (Hereinafter, this inspection procedure data is also referred to as “first inspection procedure data”). In addition, when the probing points corresponding to the first inspection step are both the second type of probing point P2, the first type prior to probing the probes 23a and 23b to the second type of probing point P2 as the inspection step. The step of connecting the probe 23a to the probing point P1 of the second step is incorporated to generate inspection procedure data (hereinafter, this inspection procedure data is also referred to as "second inspection procedure data"). In the case of a so-called multi-chamfered substrate in which a plurality of circuit boards of the same type or different types mutually independent (that is, mutually insulated) are subjected to the “inspection target substrate”, prior to the execution of the inspection step. Test procedure data incorporating connection steps to be performed is generated for each circuit board. Subsequently, the inspection procedure data generation device 6 transfers the generated inspection procedure data to the substrate inspection device 2. At this time, in the substrate inspection apparatus 2, the control unit 28 stores the transferred inspection procedure data in the storage unit 27.

  Next, the board inspection operation in the board inspection system 1 will be described. First, the loader 4 sends out the inspection target substrate 10 from the rack 3 to the transport path 5A. In this case, the inspection target substrate 10 may be electrostatically charged due to the inspection target substrate 10 rubbing against the loader 4. In particular, the portion of the conductor pattern 11 having a relatively large area defined by the ground or the power source, and the reference potential B in the substrate inspection system 1 (as an example, frame ground of the substrate inspection device 2, loader 4 and transport path 5A etc.) The capacitance C between them (FIG. 5) may be electrostatically charged.

  Subsequently, in the substrate inspection apparatus 2, the control unit 28 probes the inspection target substrate 10 sent from the transport path 5A and held by the substrate holding unit 21 according to the inspection procedure data stored in the storage unit 27. Perform board inspection by probing 23. In the substrate inspection, the control unit 28 first executes the connection step. Specifically, when using the first inspection procedure data, as shown in FIG. 4, the control unit 28 first causes the probe 23a to be probed to the first type of probing point P1 as a connection step. Also, when using the second inspection procedure data, the control unit 28 first causes the probe 23a to be probed to the first type of probing point P1 as the connection step. At this time, even if static electricity is charged in the capacitance C between the conductor pattern 11 of the inspection object substrate 10 and the reference potential B, this static electricity is measured from the probing point P1 of the first type via the probe 23a. It is discharged to the potential B and removed.

  Next, the control unit 28 executes an inspection step. Specifically, when using the first inspection procedure data, the control unit 28 sets a time difference between the probe 23b of the second type probing point P2 and the probe 23a of the first type probing point P1. To probe. On the other hand, when using the second inspection procedure data, the control unit 28 causes the probes 23a and 23b to be probed to either the first type of probing point P1 or the second type of probing point P2. At this time, even when any inspection procedure data is used, the static electricity of the capacitance C is removed in the connection step, so that the static electricity does not flow in the internal circuit of the semiconductor element 13. Electrostatic breakdown is avoided. After that, the control unit 28 controls the measuring unit 24 so that the electric parameter (current) between the probing points is detected based on the electric signal input / output from / to each probing point through the probe 23 being probed. Value, voltage value, resistance value, phase, etc. are measured to output measurement data. Next, the control unit 28 stores the output measurement data in the storage unit 27 and a probing point at which the probes 23a and 23b are probed based on the measurement data and the inspection reference data stored in the storage unit 27. Determine the quality of the conduction state (conduction test) or insulation state (insulation test) and the state of the electronic component such as the semiconductor element 13 (electronic component test), and store the determination result in the storage unit 27; It is displayed on the display unit 26 or output to an external device. Subsequently, the control unit 28 ends the substrate inspection on the inspection target substrate 10 when the probing and inspection steps for all the probing points are completed in accordance with the inspection procedure data.

  Subsequently, in the substrate inspection system 1, the transport path 5 </ b> B transports the inspected inspection target substrate 10 delivered from the substrate inspection device 2 to the loading location of the inspected substrate.

  As described above, in the inspection procedure data generation device 6, the connection step of connecting the first type probing point P1 and the reference potential B via the probe 23 prior to the execution of the inspection step on the second type probing point P2. To generate inspection procedure data. In the substrate inspection apparatus 2 and the substrate inspection method using the substrate inspection apparatus 2, the moving mechanism 22 is controlled to perform the reference potential prior to the execution of the inspection step for the second type probing point P2 according to the inspection procedure data. One probe 23a connected to B is probed to the first type of probing point P1.

  Therefore, according to the substrate inspection method using inspection procedure data generation device 6, substrate inspection device 2, and substrate inspection device 2, static electricity is charged between conductor pattern 11 of inspection object substrate 10 and reference potential B. Even when the inspection is started in the presence state, by executing the connection step prior to the inspection step, the charged static electricity can be discharged to the reference potential B through the probe 23a. Therefore, according to inspection procedure data generation device 6, substrate inspection device 2, and substrate inspection method, the passage of static electricity to the internal circuit of semiconductor element 13 can be avoided in substrate inspection, resulting in substrate inspection device 2. It is possible to avoid electrostatic breakdown of the semiconductor element 13 in substrate inspection used.

  Further, in the inspection procedure data generation device 6, when the substrate inspection device 2 is configured to include at least a pair of movable probes 23, one probe 23a connected to the reference potential B is subjected to the first type probing The connection step for probing point P1 is incorporated to generate inspection procedure data. Therefore, according to the inspection procedure data generation device 6, the substrate inspection device 2, and the substrate inspection method using the substrate inspection device 2, electrostatic destruction of the semiconductor element 13 in the substrate inspection by this type of substrate inspection device 2 is avoided. be able to.

  Further, although the example in which the “substrate inspection apparatus” and the “inspection procedure data generation apparatus” are separately configured has been described, both may be integrally configured.

DESCRIPTION OF SYMBOLS 1 board inspection system 2 board inspection apparatus 6 inspection procedure data generation apparatus 10 inspection object board 11, 12 conductor pattern 13 semiconductor element 22, 22a, 22b moving mechanism 23, 23a, 23b probe 24 measurement part 28 control part B reference electric potential P1 Type 1 Probing Point P2 Type 2 Probing Point

Claims (5)

A semiconductor device is mounted, and includes a first type of probing point conducting to a conductor pattern defined by any of ground and a power source, and a second type probing point conducting to a signal input / output terminal of the semiconductor device An inspection procedure data generation device that generates inspection procedure data for determining an execution order of inspection steps for causing an inspection probe to contact the probing point and making the substrate inspection device inspect the inspection target substrate having a plurality of probing points ,
Inspection procedure data for generating the inspection procedure data by incorporating a connecting step of connecting the first type of probing point and the reference potential via the probe prior to the execution of the inspection step for the second type of probing point Generator.   When the substrate inspection apparatus is configured to include at least a pair of movable probes, the connection step for probing one of the probes connected to the reference potential to the first type of probing point is incorporated. The inspection procedure data generation device according to Item 1. At least a pair of movable probes, a moving mechanism for holding the probes movably in any of three orthogonal axial directions, a measuring unit, and a control unit, a semiconductor element is mounted, and a ground is provided And a test target substrate having a plurality of probing points including a first type of probing point conducted to a conductor pattern defined in any one of a power source and a second type of probing point conducted to a signal input / output terminal of the semiconductor device Board inspection equipment to inspect
According to inspection procedure data, the control unit controls the moving mechanism to perform one of the probes connected to a reference potential prior to the execution of the inspection step on the second type of probing point. Board inspection device to make probing point probing. A semiconductor device is mounted, and includes a first type of probing point conducting to a conductor pattern defined by any of ground and a power source, and a second type probing point conducting to a signal input / output terminal of the semiconductor device A substrate inspection method for inspecting a substrate to be inspected having a plurality of probing points by performing an inspection step of bringing a probe for inspection into contact with the probing points,
And a connection step of connecting the first type of probing point and the reference potential via the probe prior to the execution of the inspection step on the second type of probing point.   The connection step of probing one of the probes connected to the reference potential to the first type of probing point is performed using a substrate inspection apparatus configured to include at least a pair of movable probes. The substrate inspection method according to claim 4.

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