JP2018165670A - Conductive contact, conductive contact unit, and semiconductor inspection apparatus including conductive contact unit - Google Patents

Abstract

A semiconductor integrated circuit to be inspected or an electrode or wiring of an electronic component including the semiconductor integrated circuit is reliably positioned to ensure electrical contact, and further, a conduction path is secured and electric resistance is reduced. A conductive contact is provided that is reduced.
A conductive contact, a first member including a first tip, a first flange, and a first boss, a second tip, a second flange, A second member including a second boss portion, a first proximal end portion, a third member including a cylindrical portion, a third boss portion, and a third distal end portion; and a first coil spring; And a second coil spring.
[Selection] Figure 1

Description

  The present invention relates to a conductive contact. For example, a conductive contact, a conductive contact unit, and a conductive contact for inspecting an inspection object such as an electronic component having a circuit using a semiconductor such as a semiconductor integrated circuit, or an electronic device including the electronic component The present invention relates to a semiconductor inspection apparatus including a child unit.

  Semiconductor integrated circuits are used in various electronic components. An electronic component having a semiconductor integrated circuit is also used for an electronic device such as a display device represented by a liquid crystal display device, an EL (Electroluminescence) display device, and the like. Hereinafter, these electronic components and electronic devices are collectively referred to as electronic components.

  The electronic component includes, for example, an element such as a semiconductor element, a resistor element, and a capacitor element, or a circuit including a plurality of these elements. These elements are produced, for example, by forming a pattern such as an electrode, a wiring, and a hole for electrically connecting the wiring on a substrate such as a silicon wafer or a glass substrate. Electronic components are manufactured through several hundred or more manufacturing steps for manufacturing a plurality of elements as described above. Manufacture of an electronic component includes a plurality of manufacturing steps for manufacturing a plurality of elements as described above. For this reason, although it is performed in an environment where the contamination of foreign matters is highly regulated, it is difficult to completely suppress the damage to the substrate and circuit, the occurrence of patterning defects, and the like. Therefore, it is necessary to inspect various characteristics of the electronic component in order to investigate damage to the substrate and circuit, occurrence of patterning defects, and prevent the introduction of defective products.

  The inspection of the characteristics of electronic parts is generally performed using an inspection device called a semiconductor inspection device. In these inspections, for example, the tip of a thin needle electrode called a conductive contact (also called a probe) is electrically contacted with each of a plurality of electrodes and a plurality of wirings formed on a semiconductor integrated circuit, Acquire various electrical information.

  In recent years, semiconductor integrated circuits and display devices have been highly integrated and miniaturized, and a plurality of electrodes and a plurality of wirings formed on electronic components such as semiconductor integrated circuits have also been reduced. Depending on the electronic component, there is also an electronic component in which the dimensions of electrodes and wiring are hundreds of tens of micrometers or less. Therefore, in the conductive contact included in the semiconductor inspection apparatus, for example, it is important to stabilize the electrical contact with the electrodes and wirings formed on the electronic component. Thus, attempts have been made to devise the structure of the conductive contact included in the semiconductor inspection apparatus.

JP 2013-130516 A

  One of the objects of the present invention is to perform positioning reliably with respect to a semiconductor integrated circuit to be inspected, or an electrode or wiring of an electronic component including the semiconductor integrated circuit, and to reliably achieve electrical contact. It is providing the electroconductive contactor which secures and makes electrical resistance small. Another object of the present invention is to provide a conductive contact unit including one or more of the conductive contacts, or a semiconductor inspection apparatus including the conductive contact unit.

  A conductive contact according to an embodiment of the present invention includes a first member including a first tip portion, a first flange portion, and a first boss portion, a second tip portion, and a second flange. A second member including a first portion, a second boss portion, a first proximal end portion, a third member including a cylindrical portion, a third boss portion, and a third distal end portion, and a first coil spring And a second coil spring.

  The second member of the conductive contact according to the embodiment of the present invention is disposed inside the first member, a part of the third member is disposed inside the first coil spring, The second coil spring may be disposed between the third member and the first base end, and the first base end may be inserted into the cylindrical portion.

  The 2nd member which the conductive contact concerning one embodiment of the present invention has and the 3rd member may move independently, respectively.

  One end portion of the first coil spring included in the conductive contact according to the embodiment of the present invention is in contact with the first boss portion, and the other end portion of the first coil spring is the third boss portion. And the first coil spring may bias the first member and the third member.

  One end portion of the second coil spring included in the conductive contact according to the embodiment of the present invention is in contact with the second boss portion, and the other end portion of the second coil spring is in contact with the third member. In contact therewith, the second coil spring may bias the second member and the third member.

  The second coil spring included in the conductive contact according to the embodiment of the present invention may be fully coarse.

  In the second coil spring included in the conductive contact according to the embodiment of the present invention, the side in contact with the third member may be relatively closely wound than the side in contact with the second boss portion. .

  The 1st tip part which the conductive contact concerning one embodiment of the present invention has may be a crown type, and the section of the 2nd tip part may be a cylinder type or a mortar type.

  The height of the 2nd member which the conductive contact concerning one embodiment of the present invention has may be higher than the height of the 1st member.

  The height of the 1st member which the conductive contact concerning one embodiment of the present invention has may be higher than the height of the 2nd member.

  The spring constant of the second coil spring included in the conductive contact according to the embodiment of the present invention may be relatively smaller than the spring constant of the first coil spring.

  One embodiment of the present invention is a conductive contact unit having a conductive contact.

  One embodiment of the present invention is a semiconductor inspection apparatus having a conductive contact.

It is a typical sectional view and a side view of a conductive contact and a conductive contact unit of one embodiment of the present invention. It is typical sectional drawing of the electroconductive contactor and electroconductive contactor unit of one Embodiment of this invention. It is typical sectional drawing of the electroconductive contactor and electroconductive contactor unit of one Embodiment of this invention. It is a typical figure of the electroconductive contactor of one Embodiment of this invention. It is a typical top view of the tip part which the conductive contact of one embodiment of the present invention has. It is a typical top view of the tip part which the conductive contact of one embodiment of the present invention has. It is a typical top view of the tip part which the conductive contact of one embodiment of the present invention has. It is a schematic diagram of the semiconductor inspection apparatus of one Embodiment of this invention.

  Hereinafter, embodiments of the invention disclosed in the present application will be described with reference to the drawings. However, the present invention can be implemented in various forms without departing from the gist thereof, and is not construed as being limited to the description of the embodiments exemplified below.

  Further, in order to make the explanation clearer, the drawings may be schematically represented with respect to the width, thickness, shape, and the like of each part as compared with the actual embodiment, but are merely examples, and the interpretation of the present invention. It is not intended to limit. In addition, in the present specification and each drawing, elements having the same functions as those described with reference to the previous drawings may be denoted by the same reference numerals and redundant description may be omitted.

(First embodiment)
In the present embodiment, configurations of the conductive contact and the conductive contact unit according to an embodiment of the present invention will be described.

  FIG. 1 is a schematic cross-sectional view of the conductive contact 110 and the conductive contact unit 120. As shown in FIG. 1, the conductive contact 110 is housed in a conductive contact unit 120.

  The conductive contact 110 includes the first member 10 including the first tip portion 12, the first flange portion 16, and the first boss portion 18, the second tip portion 22, and the second flange portion 26. The second member 20 including the second boss portion 27 and the first base end portion 28, the cylindrical portion 32, the third boss portion 34, the third flange portion 36, and the third distal end portion 38. The third member 30 including the first coil spring 40, and the second coil spring 50. The second member 20 is disposed inside the first member 10, a part of the first member 10 and a part of the third member 30 are disposed inside the first coil spring 40, and The coil spring 50 is disposed between the third member 30 and the first base end portion 28, and the first base end portion 28 is inserted into the cylindrical portion 32.

  The first member 10 and the second member 20 can be independently moved by the first coil spring 40 and the second coil spring 50. When the first boss portion 18 included in the first member 10 is in electrical contact with the second flange portion 26 included in the second member 20, the first member 10 and the second member 20 may be linked.

  As for the conductive contactor 110, the 1st front-end | tip part 12 which the 1st member 10 has, and the 2nd front-end | tip part 22 which the 2nd member 20 has are exposed. The first tip portion 12 and the second tip portion 22 are in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, and the electrical characteristics of the semiconductor integrated circuit 80 can be measured.

  In the conductive contact 110 having the above-described configuration, after one of the first member 10 and the second member 20 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, the other is Electrical contact can be made with the connection electrode 70 of the semiconductor integrated circuit 80. Therefore, when one of the first member 10 and the second member 20 is in electrical contact with the connection electrode 70, the position of the conductive contact 110 and the connection electrode 70 of the semiconductor integrated circuit 80 is determined. And reliable electrical contact. Subsequently, when the other of the first member 10 and the second member 20 is in electrical contact with the connection electrode 70, the electrical conduction path can be increased. That is, the conductive contact 110 and the connection electrode 70 of the semiconductor integrated circuit 80 can be more easily conducted, and the contact resistance can be reduced. Therefore, the electrical characteristics of the semiconductor integrated circuit 80 can be stably measured by using the conductive contact 110 according to the present invention.

  In addition, the conductive contact 110 according to the present invention includes two leading end portions of the first leading end portion 12 and the second leading end portion 22, and two coils of the first coil spring 40 and the second coil spring 50. Since the spring is provided, the electrical contact between the conductive contact 110 and the connection electrode 70 of the semiconductor integrated circuit 80 is at least 2 by the expansion and contraction of the coil spring in the axial direction of the conductive contact 110. Since the process is performed in stages, the impact on the inspection object can be reduced as compared with the case where electrical contact is performed in one stage.

  Hereinafter, a more detailed configuration of the conductive contact 110 will be described with reference to FIG.

  The first member 10 has a cylindrical shape, and may be in contact with the second tip portion 22 included in the second member 20 inside the cylinder. The first boss portion 18 included in the first member 10 is fitted to one of the first coil springs 40, and the first flange portion 16 serves as a stopper for the first coil spring 40. When the first tip portion 12 included in the first member 10 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, the first coil spring 40 is contracted in the axial direction of the conductive contact 110. As a result, the impact on the semiconductor integrated circuit 80 can be reduced, and a load can be applied to the semiconductor integrated circuit 80.

  The second boss portion 27 included in the second member 20 is fitted to one of the second coil springs 50, and the second flange portion 26 serves as a stopper for the second coil spring 50. When the second tip portion 22 included in the second member 20 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, the second coil spring 50 is contracted in the axial direction of the conductive contact 110. As a result, the impact on the semiconductor integrated circuit 80 can be reduced, and a load can be applied to the semiconductor integrated circuit 80.

  The third boss part 34 included in the third member 30 is fitted to the other of the first coil spring 40, and the third flange part 36 serves as a stopper for the first coil spring 40. Further, the inner side of the third member 30 is hollowed out, and the other side of the second coil spring 50 is in contact with the bottom of the third member 30. In addition, the second coil spring 50 may be in contact with the inner peripheral side surface of the third member 30. The hollowed bottom portion of the third member 30 serves as the other stopper of the second coil spring 50. When the conductive contact 110 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, the third member 30 is contracted in the axial direction of the conductive contact 110 and the first coil spring 40 and the second coil. By supporting the spring 50, the impact that the conductive contact 110 gives to the semiconductor integrated circuit 80 can be reduced, and a load can be applied to the semiconductor integrated circuit 80.

  The first coil spring 40 shows an example in which the side fitted to the first boss portion 18 is closely wound and the side fitted to the third boss portion 34 is coarsely wound. For example, even when the conductive contact 110 is in contact with the connection electrode 70 of the semiconductor integrated circuit 80 and tilted obliquely with respect to the axial direction, the first coil spring 40 is Since the side close to the tip portion 12 is closely wound, the tilt of the conductive contact 110 can be suppressed, and the side far from the first tip portion 12 of the first coil spring 40 is coarsely wound. The movement of the member 10 is flexible, so that the impact applied to the semiconductor integrated circuit 80 can be reduced and a load can be applied to the semiconductor integrated circuit 80. The structure of the first coil spring 40 is not limited to this example. Modifications can be made as appropriate without departing from the spirit of the invention. Similarly, the number of turns of the spring, the length, the thickness, and the like are not limited to the case shown in the drawings, and can be changed as appropriate without departing from the spirit of the present invention.

  The 2nd coiled spring 50 has shown the example which is a whole coarse winding. For example, when the conductive contact 110 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, the second coil spring 50 is relatively easy to drive, thereby further mitigating the impact on the semiconductor integrated circuit 80. And a sufficient load can be applied to the semiconductor integrated circuit 80. Note that the structure of the second coil spring 50 is not limited to this example. For example, the second coil spring 50 may be relatively tightly wound on the side in contact with the third member 30 than on the side in contact with the second boss portion 27. By making the second coil spring 50 in close contact with the third member 30, the second member 20 and the second coil spring 50 can be more reliably brought into contact with each other. Modifications can be made as appropriate without departing from the spirit of the invention. Similarly, the number of turns of the spring, the length, the thickness, and the like are not limited to the case shown in the drawings, and can be changed as appropriate without departing from the spirit of the present invention.

  The conductive contact unit 120 includes a probe holder 60. The probe holder 60 has a first probe holder member 62 and a second probe holder member 64 and accommodates the conductive contact 110. The configuration of the probe holder 60 is not limited to this configuration, and either the first probe holder member 62 or the second probe holder member 64 may be used, or three or more members may be used. Also good.

  The probe holder 60 is formed using an insulator such as resin or ceramic. The plurality of conductive contacts 110 are arranged so as to have the same height. Further, the arrangement may be determined according to the electrode to be inspected and the wiring pattern. The conductive contact 110 includes a conductive material, for example, a metal such as gold, copper, nickel, palladium, tungsten, or an alloy of the above metals. Alternatively, a conductive material may be included and the surface may be plated using gold or the like.

  FIG. 2 is a schematic cross-sectional view of the conductive contacts 110-1 to 110-3 and the conductive contact unit 120 according to an embodiment of the present invention. For the purpose of facilitating understanding, FIG. 2 is a diagram showing the state of a conductive contact, focusing on one conductive contact among a plurality of conductive contacts included in the semiconductor inspection apparatus.

  The conductive contact 110-1 shown in FIG. 2 shows a state before the conductive contact 110-1 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80.

  A conductive contact 110-2 shown in FIG. 2 shows a state immediately after the conductive contact 110-2 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80. The second member 20 of the conductive contact 110-2 protrudes from the first member 10 and is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80. In other words, the second member 20 is located above the first member 10 when the right side is the bottom and the left side is the top as viewed in the drawing. Alternatively, the second member 20 is positioned below the first member 10 when the right side is the top and the left side is the bottom as viewed in the drawing. Alternatively, when the right side is the bottom as viewed in the drawing, the height of the second member 20 is higher than the height of the first member 10. Alternatively, when the right side is the upper side toward the paper surface, the height of the second member 20 is lower than the height of the first member 10. At this time, the second tip 22 has a conical shape with a depressed center. For example, as shown in FIG. 2, when the connection electrode 70 has a curved surface such as a solder ball, the conductive tip 110 is formed by the second tip 22 having a conical shape. −2 and the connection electrode 70 of the semiconductor integrated circuit 80 can be easily determined in a uniform manner, and reliable electrical contact can be performed.

  Here, FIG. 2 shows an example in which the second tip 22 has a conical shape with a depressed center, but the present invention is not limited to this example. The second tip portion 22 may have a cylindrical shape or a shape in which the inside of the tip portion 22 is hollowed out, such as a cylindrical shape. In addition, the second tip portion 22 may have a mortar shape having a relatively smooth curved surface as compared with a conical shape, or a shape such as a mortar shape. Since the second tip 22 has such a shape, the contact position between the conductive contact 110-2 and the connection electrode 70 of the semiconductor integrated circuit 80 can be determined uniformly and reliably. Electrical contact can be made.

  2 shows a state in which the conductive contact 110-3 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80 and a load is applied to the semiconductor integrated circuit 80. Yes. The first member 10 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80 together with the second member 20 of the conductive contact 110-3. In addition, at this time, the 1st front-end | tip part 12 has shown the example which is carrying out crown shape (it is also called crown shape and crown shape) as shown in FIG.1 (B). Since the first tip portion 12 has a crown shape, the conductive contact 110 can surely make electrical contact with the connection electrode 70. When the first tip portion 12 included in the first member 10 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, the first coil spring 40 is moved in the axial direction of the conductive contact 110-3. By shrinking to, a load can be applied to the semiconductor integrated circuit 80. As described above, the conductive contact 110-3 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, whereby the number of electrical conduction paths can be increased. Specifically, the closely wound portion of the first coil spring 40 and the third member 30 come into contact to form a conduction path, and the first member 10, the first coil spring 40, and the third member 30 is a conduction path. In addition, the second tip 22, the first tip 12, the first coil spring 40, and the third member 30 may be a conduction path, or the second tip 22 The second coil spring 50 and the third member 30 may be a conduction path. Therefore, the conductive contact 110-3 and the connection electrode 70 of the semiconductor integrated circuit 80 are more easily conducted, and the contact resistance can be reduced. In this state, the electrical characteristics of the semiconductor integrated circuit 80 can be stably measured.

  The spring constant of the second coil spring 50 is preferably relatively smaller than the spring constant of the first coil spring 40. Thereby, the initial load of the second coil spring 50 can be reduced, and the first member is biased by the biasing force of the second coil spring 50 in a state before the conductive contact 110 is inserted into the probe holder 60. 10 can be prevented from detaching from the first coil spring 40.

  Since the conductive contact having the above-described configuration is in electrical contact with the connection electrode of the semiconductor integrated circuit, reliable electrical contact and electrical conduction paths can be increased. Therefore, the electrical characteristics of the semiconductor integrated circuit can be stably measured.

(Second Embodiment)
The other structure of the electroconductive contactor and electroconductive contactor unit which concerns on one Embodiment of this invention is demonstrated. In addition, description may be abbreviate | omitted regarding the structure similar to 1st Embodiment.

  FIG. 3 is a schematic cross-sectional view of other conductive contacts 111-1 to 111-3 and a conductive contact unit 120 according to an embodiment of the present invention. In order to facilitate understanding, FIG. 3 is a diagram showing the state of a conductive contact by focusing on one conductive contact among a plurality of conductive contacts included in the semiconductor inspection apparatus.

  The conductive contact 111-1 shown in FIG. 3 shows a state before the conductive contact 111-1 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80. Since the conductive contact 111-1 in FIG. 3 is in the same state as the conductive contact 110-1 in FIG. 2, the description thereof is omitted.

  The conductive contact 111-2 shown in FIG. 3 shows a state immediately after the conductive contact 111-2 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80. The first member 10 of the conductive contact 111-2 protrudes from the second member 20 and is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80. In other words, the first member 10 is located above the second member 20 when the right side is the bottom and the left side is the top as viewed in the drawing. Alternatively, the first member 10 is positioned below the second member 20 when the right side is the top and the left side is the bottom as viewed in the drawing. Alternatively, when the right side is the bottom as viewed in the drawing, the height of the first member 10 is higher than the height of the second member 20. Alternatively, the height of the first member is lower than the height of the second member 20 when the right side is the top as viewed in the drawing. When the first tip portion 12 is in electrical contact with the connection electrode 70, the first coil spring 40 is contracted in the axial direction of the conductive contact 111-2. At this time, the example which has the 1st front-end | tip part 12 has a cylindrical shape is shown. For example, as shown in FIG. 3, when the connection electrode 70 has a curved surface such as a solder ball, the first tip 12 has a cylindrical shape, so that the conductive contact 110. And the contact electrode 70 of the semiconductor integrated circuit 80 can be uniformly determined, and reliable electrical contact can be performed.

  3 shows a state in which the conductive contact 111-3 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80 and a load is applied to the semiconductor integrated circuit 80. Yes. Along with the first member 10 included in the conductive contact 111-3, the second member 20 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80. At this time, the second tip 22 has a crown shape (also called a crown shape or a crown shape). Since the second tip 22 has a crown shape, the conductive contact 111-3 can reliably make electrical contact with the connection electrode 70. When the second tip portion 22 included in the second member 20 is in electrical contact with the connection electrode 70 of the semiconductor integrated circuit 80, the second coil spring 50 and the first coil spring are electrically conductive. By contracting in the axial direction of the contact 111-3, an electrical conduction path can be increased. Specifically, first, the first tip portion 12, the first coil spring 40, and the third member serve as a conduction path, followed by the second tip portion 22 and the second coil spring. 50 and the third member serve as a conduction path. Since the first tip portion 12 and the second tip portion 22 are in contact with each other, the conductive contact 111-3 and the connection electrode 70 of the semiconductor integrated circuit 80 are more easily conducted, and the contact resistance is reduced. be able to. In addition, since a sufficient load can be applied to the semiconductor integrated circuit 80, the electrical characteristics of the semiconductor integrated circuit 80 can be stably measured.

  By inspecting the electronic circuit by the semiconductor inspection apparatus having the conductive contact as described above, it is possible to perform an inspection with a reliable and stable electrical contact.

(Third embodiment)
In the present embodiment, the configuration of the tip of the conductive contact according to an embodiment of the present invention will be described. In addition, description may be abbreviate | omitted regarding the structure similar to 1st Embodiment or 2nd Embodiment.

  4A to 4C are schematic views of the first tip portion 12 and the second tip portion 22 included in the conductive contact 110 according to the embodiment of the present invention.

  FIG. 4A is a perspective view of the first tip portion 12 and the second tip portion 22 of the conductive contact 110. As shown in FIG. 4A, the first tip portion 12 has a crown shape, and the second tip portion 22 has a conical shape.

  FIG. 4B is a side view of FIG. FIG. 4C is a cross-sectional view taken along A1-A2 in FIG. It can be seen that the conductive contact 110 has a first tip portion 12 included in the first member 20 and a second tip portion 22 included in the second member 20.

  5A and 5B are a schematic top view and a side view of the first tip 12 included in the first member 10 of the conductive contact 110 according to the embodiment of the present invention. Show.

  FIG. 5A shows a crown shape having four vertices. With such a shape, for example, contact with an electrode or wiring of an electronic component can be performed at a plurality of vertices. Therefore, more reliable electrical contact with the electrodes and wiring of the electronic component is possible. In addition, it is possible to reliably position the conductive contact and the electrode or wiring of the electronic component. The number of crown-shaped vertices is not limited to this example, and may have five or more vertices, or may have three vertices. Selection can be made without departing from the spirit of the present invention.

  FIG. 5B shows a cylindrical shape. With such a shape, for example, when the electrode of the electronic component is in the form of a solder ball, the conductive contact can be reliably positioned with respect to the electrode or wiring of the electronic component.

  6A to 6C are a schematic top view and a side view of the second tip portion 22 included in the second member 20 included in the conductive contact 110 according to the embodiment of the present invention. Show.

  FIG. 6A shows a crown shape having four vertices. With such a shape, for example, contact with an electrode or wiring of an electronic component can be performed at a plurality of vertices. Therefore, more reliable electrical contact with the electrodes and wiring of the electronic component is possible. In addition, it is possible to reliably position the conductive contact and the electrode or wiring of the electronic component. The number of crown-shaped vertices is not limited to this example, and may have five vertices or three vertices. Selection can be made without departing from the spirit of the present invention.

  FIG. 6B shows a cylindrical shape. FIG. 6C shows a conical shape (also called a conical shape). With such a shape, for example, when the electrode of the electronic component is in the form of a solder ball, the conductive contact can be reliably positioned with respect to the electrode or wiring of the electronic component.

  7A to 7C are a schematic top view and a side view of the second tip portion 22 included in the second member 20 included in the conductive contact 110 according to the embodiment of the present invention. Show.

  FIG. 7A shows a tip having a rounded tip. Such a shape can increase, for example, an area in electrical contact with an electrode or wiring of an electronic component. Therefore, it is possible to reduce the surface pressure when coming into contact with the electrode or wiring to be inspected.

  FIG. 7B shows a tip portion shaped like a cone. With such a shape, electrical contact with the electrode or wiring of the electronic component can be made with a point, so that local contact between the conductive contact and the electronic component is possible. Moreover, it can contact with a bigger load compared with the front-end | tip part of a shape which has a some nail | claw.

  FIG. 7C shows a tip portion having a shape like a tip of a minus driver (also referred to as a single wire type or a minus type). Such a shape can also increase the area in electrical contact with the electrode or wiring of the electronic component. Therefore, more reliable electrical contact with the electrode or wiring to be inspected is possible.

  The conductive contact having the tip as described above can reliably position the conductive contact and the electronic component, and can reliably make electrical contact. Since the conductive contact has two tip portions, an electrical conduction path between the conductive contact and the electronic component can be increased, thereby enabling stable inspection. Therefore, it is possible to provide a semiconductor inspection apparatus having a conductive contact that can stably inspect electronic components.

(Fourth embodiment)
In the present embodiment, a configuration of a semiconductor inspection apparatus according to an embodiment of the present invention will be described. In addition, description may be abbreviate | omitted regarding the structure similar to 1st Embodiment thru | or 3rd Embodiment.

  FIG. 8 is a schematic diagram showing a configuration of a semiconductor inspection apparatus according to an embodiment of the present invention. The semiconductor inspection apparatus 100 includes a conductive contact unit 120 and a conductive contact 110 provided therein. When inspecting an electronic circuit using the semiconductor inspection apparatus 100, the conductive contact 110 can take the states of the conductive contacts 110-1 to 110-4 shown in FIG. The number of the conductive contacts 110 may be one or more, and usually a plurality (for example, several tens to several thousands) of conductive contacts 110 are installed. The conductive contact 110 exchanges electric signals with the circuit board 140. In FIG. 8, the circuit board 140 is electrically connected to the tester 150. The tester 150 includes units such as a measurement power supply 152, an LCR measurement device 154, and a pulse generator 156.

  In addition, when the semiconductor inspection apparatus 100 has the conductive contact 111 and inspects an electronic circuit, the conductive contact 111 takes the state of the conductive contacts 111-1 to 111-4 shown in FIG. 3. be able to. Others are the same as the case where the semiconductor inspection apparatus 100 has the conductive contact 110.

  Although FIG. 8 shows an example in which the circuit board 140 is electrically connected to the tester 150, the present invention is not limited to this configuration. Another circuit board may be electrically connected between the circuit board 140 and the tester 150. For example, an operational amplifier circuit, a latch circuit, or the like may be mounted on another circuit board. Since the operational amplifier circuit is mounted on the other circuit board, an electric signal output from the circuit board 140 can be amplified and an electric signal with a uniform waveform can be supplied to the tester 150. Therefore, the circuit board 140 and the tester Stable measurement can be performed even when a load such as wiring for electrically connecting to 150, a load of the tester 150 and an electronic component to be inspected is large. In addition, since the latch circuit is mounted on the other circuit board, the timing of each electrical signal output from the circuit board 140 can be adjusted, so that an electrical signal with less delay can be supplied to the tester 150. Therefore, stable measurement with little measurement error with respect to time can be performed.

  With the configuration as described above, electrical contact between the conductive contact of the semiconductor inspection device and the electrode or wiring of the semiconductor integrated circuit to be inspected or an electronic component including the same can be reliably achieved. In addition, since a conductive path having a small resistance value after contact can be secured, a semiconductor inspection apparatus with high inspection accuracy can be provided.

  The embodiments described above as the embodiments of the present invention can be implemented in appropriate combination as long as they do not contradict each other. Moreover, what the person skilled in the art added, deleted, or changed the design as appropriate based on each embodiment is also included in the scope of the present invention as long as the gist of the present invention is included.

  Of course, other operational effects that are different from the operational effects provided by each of the above-described embodiments are obvious from the description of the present specification or can be easily predicted by those skilled in the art. It is understood that this is brought about by the present invention.

  10: 1st member, 12: 1st front-end | tip part, 16: 1st flange part, 18: 1st boss | hub part, 20: 2nd member, 22: 2nd front-end | tip part, 26: 2nd Flange part, 27: second boss part, 28: second base end part, 30: third member, 32: cylindrical part, 34: third boss part, 36: third flange part, 38 : Third tip, 40: first coil spring, 50: second coil spring, 60: probe holder, 62: first probe holder member, 64: second probe holder member, 70: for connection Electrode, 80: Semiconductor integrated circuit, 100: Semiconductor inspection device, 110, 111: Conductive contact, 120: Conductive contact unit, 140: Circuit board, 150: Tester, 152: Measuring power supply, 154: LCR measuring instrument 156: Pulse generator, 170: Inspection target

Claims (14)

A first member including a first tip, a first flange, and a first boss;
A second member including a second tip portion, a second flange portion, a second boss portion, and a first base end portion;
A third member including a cylindrical portion, a third boss portion, and a third tip portion;
A first coil spring; a second coil spring;
A conductive contact having The second member is disposed inside the first member;
A portion of the third member is disposed inside the first coil spring;
The second coil spring is disposed between the third member and the first base end;
The first proximal end portion is inserted into the cylindrical portion;
The conductive contact according to claim 1.   The conductive contact according to claim 1, wherein the second member and the third member move independently of each other. One end of the first coil spring is in contact with the first boss, the other end of the first coil spring is in contact with the third boss,
The first coil spring biases the first member and the third member;
The conductive contact according to claim 2. One end of the second coil spring is in contact with the second boss, and the other end of the second coil spring is in contact with the third member;
The second coil spring biases the second member and the third member;
The conductive contact according to claim 2.   The conductive contact according to claim 2, wherein the second coil spring is a full coarse winding.   3. The conductive contact according to claim 2, wherein a side of the second coil spring in contact with the third member is relatively densely wound than a side in contact with the second boss portion.   2. The conductive contact according to claim 1, wherein the first tip is a crown type, and a cross section of the second tip is a cylindrical shape or a mortar shape.   2. The conductive contact according to claim 1, wherein a cross section of the first tip portion is a cylindrical shape, and the second tip portion is a crown type.   The conductive contact according to claim 1 or 2, wherein a height of the second member is higher than a height of the first member.   The conductive contact according to claim 1 or 2, wherein a height of the first member is higher than a height of the second member.   3. The conductive contact according to claim 1, wherein a spring constant of the second coil spring is relatively smaller than a spring constant of the first coil spring.   The electroconductive contactor unit which has an electroconductive contactor of Claim 1 or Claim 2.   A semiconductor inspection apparatus comprising the conductive contact unit according to claim 13.

Images