JP2018139367A - Piezoelectric component - Google Patents

Abstract

A piezoelectric component capable of maintaining an oscillation frequency with high accuracy during mounting and use is provided. SOLUTION: The piezoelectric component of the present disclosure includes a rectangular parallelepiped piezoelectric element 2 having a pair of excitation electrodes 21 facing each other, and a support substrate 1 that supports both ends in the longitudinal direction of the piezoelectric element 2 by fixing them to the upper surface. A pair of capacitor electrodes 12 electrically connected to the pair of excitation electrodes 21 are provided on the upper surface of the support substrate 1, and a pair of capacitor electrodes 12 and A pair of electrically connected input/output terminal electrodes 13 and a ground terminal electrode 14 arranged between the pair of input/output terminal electrodes 13 are provided extending in the width direction of the support substrate 1, and ground terminals are provided. The thickness of the electrode 14 is thinner at the central portion than at both ends in the width direction of the support substrate 1 . [Selection drawing] Fig. 3

Description

  The present disclosure relates to a piezoelectric component used as an oscillator, for example.

  As a clock oscillator of a microcomputer, a piezoelectric oscillator (piezoelectric component) in which a piezoelectric element is mounted on a support substrate is known. A pair of input / output terminal electrodes are provided on the lower surface of the substrate body constituting the support substrate in such a piezoelectric component, and a ground terminal electrode is provided between the pair of input / output terminal electrodes. On the other hand, on the upper surface of the support substrate, a pair of capacitance electrodes that form a load capacitance with the ground terminal electrode is provided (see, for example, Patent Document 1).

JP-A-11-097965

  Here, when the ground terminal electrode is formed on the board body, the board body is distorted due to thermal contraction of the ground terminal electrode, or when the support board is mounted on the external circuit board, thermal expansion between the board body and the external circuit board is caused. Due to the difference, the substrate body may be distorted and the load capacity of the piezoelectric component may vary. In addition, the substrate body may be distorted due to temperature changes during use, and the load capacity of the piezoelectric component may fluctuate.

  Due to these fluctuations in load capacitance, the oscillation frequency varies during mounting on an external circuit board and during use, and it is difficult to maintain the oscillation frequency with high accuracy.

  The present disclosure has been made in view of the above circumstances, and an object thereof is to provide a piezoelectric component that can maintain an oscillation frequency with high accuracy during mounting and use.

  A piezoelectric component of the present disclosure includes a rectangular parallelepiped piezoelectric element having a pair of excitation electrodes opposed to each other, and a support substrate that supports both ends of the piezoelectric element in the longitudinal direction fixed to the upper surface. A pair of capacitive electrodes electrically connected to the pair of excitation electrodes are provided on the upper surface, and a pair of input electrodes electrically connected to the pair of capacitive electrodes are provided on the lower surface of the support substrate. An output terminal electrode and a ground terminal electrode disposed between the pair of input / output terminal electrodes are provided extending in the width direction of the support substrate, and the ground terminal electrode is provided in the width direction of the support substrate. The thickness at the center is thinner than the thickness at both ends.

  According to the piezoelectric component of the present disclosure, the oscillation frequency can be maintained with high accuracy during mounting and use.

It is a schematic perspective view which shows an example of embodiment of a piezoelectric component. (A) is a partially omitted plan view of the piezoelectric component shown in FIG. 1, and (b) is a bottom view of the piezoelectric component shown in FIG. (A) is sectional drawing cut | disconnected by the AA line of the piezoelectric component shown in FIG. 1, (b) is sectional drawing cut | disconnected by the BB line of the piezoelectric component shown in FIG. It is sectional drawing cut | disconnected by CC line of the piezoelectric component shown in FIG. (A) is a partially omitted plan view showing another example of the embodiment of the piezoelectric component, and (b) is a bottom view of the piezoelectric component shown in (a).

  Hereinafter, an example of an embodiment of a piezoelectric component will be described with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

  FIG. 1 is a schematic perspective view showing an example of an embodiment of a piezoelectric component. 2A is a partially omitted plan view of the piezoelectric component shown in FIG. 1, and FIG. 2B is a bottom view of the piezoelectric component shown in FIG. 3A is a cross-sectional view taken along the line AA of the piezoelectric component shown in FIG. 1, and FIG. 3B is a cross-sectional view taken along the line BB of the piezoelectric component shown in FIG. In addition, partial omission in Fig.2 (a) is what the cover body 5 is abbreviate | omitted.

  A piezoelectric component 100 shown in FIGS. 1 to 3 includes a rectangular parallelepiped piezoelectric element 2 and a support substrate 1 that supports the piezoelectric element 2 while being fixed to the upper surface.

  The support substrate 1 is a substrate that supports both ends of the piezoelectric element 2 in the longitudinal direction fixed to the upper surface. For example, the substrate main body 11 made of a dielectric formed as a rectangular flat plate in a plan view having a length of 2.5 mm to 7.5 mm, a width of 1.0 mm to 3.0 mm, and a thickness of 0.1 mm to 1 mm. Have. As the substrate body 11, a ceramic material such as alumina or barium titanate, or a resin material such as glass epoxy can be used.

  The support substrate 1 has a pair of capacitive electrodes 12 electrically connected to the pair of excitation electrodes 21 of the piezoelectric element 2 on the upper surface of the substrate body 11.

  The pair of capacitive electrodes 12 includes a first capacitive electrode 121 and a second capacitive electrode 122. The first capacitor electrode 121 and the second capacitor electrode 122 are electrodes that are electrically connected to the pair of excitation electrodes 21 of the piezoelectric element 2 and that form a capacitance with the ground terminal electrode 13 described later. is there. The first capacitor electrode 121 is disposed on one end side (left side in FIG. 2) in the longitudinal direction of the substrate body 11 and extends in the width direction (short direction) of the substrate body 11, and the substrate body 11. And a capacitance forming region extending from one end side in the longitudinal direction toward the central portion. The second capacitor electrode 122 is disposed on the other end side in the longitudinal direction of the substrate body 11 (on the right side in FIG. 2) and extends in the width direction (short direction) of the substrate body 11. And a capacitance forming region extending from the other end side in the longitudinal direction of the substrate 1 toward the central portion. Note that the capacitance formation region of the first capacitance electrode 121 and the capacitance formation region of the second capacitance electrode 122 are arranged with a space in the center of the upper surface of the substrate body 11 in the longitudinal direction.

  The support substrate 1 has a pair of input / output terminal electrodes 14 and a ground terminal electrode 13 disposed between the pair of input / output terminal electrodes 14 on the lower surface of the substrate body 11.

  The pair of input / output terminal electrodes 14 are terminal electrodes for inputting or outputting electric signals, and are provided on the lower surface of the substrate body 11 so as to extend in the width direction of the substrate body 11 (support substrate 1). The pair of input / output terminal electrodes 14 are electrically connected to a pair of capacitive electrodes 12 provided on the upper surface of the substrate body 11 and electrically connected to an external circuit when mounted on an external circuit board. Is done.

The ground terminal electrode 13 is disposed between the pair of input / output terminal electrodes 14 on the lower surface of the substrate body 11 and extends in the width direction of the substrate body 11 (support substrate 1). The ground terminal electrode 13 includes the first capacitor electrode 121 and the second capacitor electrode 12 with the substrate body 11 interposed therebetween.
2 to face each other and form a capacitance (load capacitance).

  When the first capacitor electrode 121 and the second capacitor electrode 122 and the ground terminal electrode 13 are opposed to each other via the substrate body 11 as in the present example, the first capacitor electrode 121 and the ground terminal electrode 13 are opposed to each other. And by setting the area of the area | region where the 2nd capacity | capacitance electrode 122 and the ground terminal electrode 13 oppose become equal, the electrostatic capacitance obtained by each area | region which opposes becomes equal. When the first capacitor electrode 121 and the second capacitor electrode 122 and the ground terminal electrode 13 are opposed to each other through the substrate body 11, the region where the first capacitor electrode 121 and the ground terminal electrode 13 are opposed and the second capacitor Since the region where the electrode 122 and the ground terminal electrode 13 face each other can be increased, the capacitance can be increased. In addition, the electrostatic capacitance obtained in each opposing area | region is set with the characteristic of the amplifier circuit element which the piezoelectric component 2 is connected and comprises an oscillation circuit together.

  Further, a side electrode 15 that electrically connects the first capacitor electrode 121 or the second capacitor electrode 122 and the input / output terminal electrode 14 is provided on a side surface along the longitudinal direction of the substrate body 11. Further, a side electrode 16 electrically connected to the ground terminal electrode 13 is also provided on the side surface along the longitudinal direction of the substrate body 11 due to solder bonding to an external circuit substrate. As shown in FIG. 1, the side electrode 15 and the side electrode 16 may be provided so as to extend from the longitudinal side surface of the substrate body 11 to the longitudinal side surface of the lid 5 described later.

  As the material of the first capacitor electrode 121, the second capacitor electrode 122, the ground terminal electrode 13, the input / output terminal electrode 14, and the side electrodes 15, 16, a metal powder such as gold, silver, copper, aluminum, tungsten or the like is contained in the resin. A dispersed conductive resin (conductive paste), a thick film conductor that is baked by adding an additive such as glass to the metal powder, and the like can be used. If necessary, Ni / Au or Ni / Sn plating may be formed.

  A rectangular parallelepiped piezoelectric element 2 is mounted on the support substrate 1 with both ends in the longitudinal direction fixed. If necessary, a first support portion 31 and a second support portion 32 are provided on the upper surface of the support substrate 1, and both ends in the longitudinal direction of the piezoelectric element 2 are the first support portion 31 and the second support portion. The piezoelectric element 2 is mounted so as to be vibrated so as to be supported by the portion 32.

  The first support portion 31 and the second support portion 32 are projecting portions formed by dispersing metal powder such as gold, silver, copper, aluminum, and tungsten in a resin. For example, the length (diameter) in the vertical and horizontal directions is 0.1 mm to 1.0 mm, the thickness is 10 μm to 100 μm, and the columnar shape or the columnar shape is formed. The first support part 31 and the second support part 32 may be one each or plural.

  Further, the conductive bonding material 4 is provided on the first support portion 31 and the second support portion 32, and at least the lower surface of both end portions of the piezoelectric element 2 and the first support portion 31 and the second support portion. The part 32 is joined. And since the 1st support part 31 and the 2nd support part 32 are formed with the material which has electroconductivity, the excitation electrode 21 of the piezoelectric element 2, and the 1st capacitive electrode 121 and the 2nd capacitive electrode 122 are conduction | electrical_connection. In addition, the excitation electrode 21 is electrically connected to the first capacitor electrode 121 or the second capacitor electrode 122. As such a conductive bonding material 4, for example, solder, a conductive adhesive, or the like is used, and if it is a solder, for example, a lead-free material such as copper, tin, or silver can be used. If it is an adhesive agent, the epoxy-type conductive resin or silicone-type resin containing 75-95 mass% of electroconductive particles, such as silver, copper, and nickel, can be used.

Although not shown, the conductive bonding material 4 is located on the side of the first support portion 31 and the second support portion 32 as necessary, and directly connects the excitation electrode 21, the first capacitance electrode 121, and the second capacitance electrode 122. It may be electrically connected or may be provided by scooping up the end face of the piezoelectric element 2.

  The piezoelectric element 2 includes a piezoelectric body 22 and a pair of excitation electrodes 21 provided so as to have areas (intersection areas) facing each other on one main surface (upper surface) and the other main surface (lower surface) of the piezoelectric body 22. It has.

  The piezoelectric body 22 constituting the piezoelectric element 2 is formed in a rectangular parallelepiped having a length of 1.0 mm to 4.0 mm, a width of 0.2 mm to 2 mm, and a thickness of 40 μm to 1 mm, for example. The piezoelectric body 22 is composed of, for example, piezoelectric ceramics or crystal based on lead titanate, lead zirconate titanate, lithium tantalate, lithium niobate, sodium niobate, potassium niobate, bismuth layered compound, etc. It can be formed using a single crystal such as lithium niobate.

  The excitation electrode 21 provided on one main surface (upper surface) of the piezoelectric body 22 is provided so as to extend from one end portion in the longitudinal direction toward the other end portion, and the other main surface ( The excitation electrode 21 provided on the lower surface is provided so as to extend from the other end in the longitudinal direction toward the one end, and has regions facing each other. The excitation electrode 21 can be made of metal such as gold, silver, copper, aluminum, chromium, nickel, and is applied to the surface of the piezoelectric body 22 to a thickness of 0.1 μm to 3 μm, for example. Then, as shown in the figure, end face electrodes 23 are provided on both end faces of the piezoelectric element 2, and the excitation electrode 21 on the top face is provided via the end face electrode 23, the conductive bonding material 4, and the first support portion 31. Is electrically connected to the first capacitor electrode 121. Further, the excitation electrode 21 on the lower surface is electrically connected to the second capacitor electrode 122 via the conductive bonding material 4 and the second support portion 32.

  Such a piezoelectric element 2 generates a piezoelectric vibration of thickness longitudinal vibration or thickness shear vibration at a specific frequency in a region (crossing region) where the excitation electrodes 21 face each other when a voltage is applied between the pair of excitation electrodes 21. It is intended to let you.

  As shown in FIGS. 1 and 3, a lid 5 may be provided on the support substrate 1 so as to cover the piezoelectric element 2. The lid 5 is preferably joined to the outer peripheral portion of the upper surface of the support substrate 1 with, for example, an epoxy or acrylic adhesive or an epoxy adhesive from the viewpoint of reflow heat resistance. Thereby, the function of protecting the piezoelectric element 2 accommodated in the internal space formed together with the support substrate 1 from the physical influence and chemical influence from the outside, the water in the space formed together with the support substrate 1, etc. It can be set as the piezoelectric component 100 which has the airtight sealing function for preventing invasion of the foreign material. In addition, as a material of the cover body 5, for example, a metal such as stainless steel, a ceramic such as alumina, a resin, glass, or the like can be used. Moreover, what contained the inorganic filler in the ratio of 5-80 mass% in insulating resin materials, such as an epoxy resin, may be used.

  As shown in FIG. 3A, the ground terminal electrode 13 constituting the piezoelectric component 100 is thinner at the center than at both ends in the width direction of the support substrate 1.

  In general, when the ground terminal electrode 13 is formed, the substrate main body 11 is distorted due to thermal contraction of the ground terminal electrode 13, so that the load capacity of the piezoelectric component 100 is likely to vary. The main load capacitance is formed between the grant terminal electrode 13, the first capacitance electrode 121, and the second capacitance electrode 122 with the substrate main body 11 interposed therebetween, and therefore varies when distortion occurs particularly in the central portion of the substrate main body 11. Because it does.

On the other hand, by reducing the thickness of the center portion in the width direction of the ground terminal electrode 13 of the support substrate 1, the amount of thermal contraction in the center portion in the width direction of the ground terminal electrode 13 when the ground terminal electrode 13 is formed is reduced. Therefore, the stress applied to the central portion in the width direction of the ground terminal electrode 13 can be reduced. Thereby, the distortion of the substrate body 11 is suppressed, and the fluctuation of the load capacity of the piezoelectric component 100 is suppressed.

  Further, when the piezoelectric component 100 is mounted on the external circuit board, the temperature changes from room temperature → high temperature (about 250 ° C.) → room temperature. Here, due to the difference in thermal expansion between the support substrate 1 and the external circuit substrate, stress is applied to the vicinity of the center portion of the ground terminal electrode 13 of the support substrate 1 after being mounted on the external circuit substrate. The load capacity of the component 100 is likely to fluctuate. On the other hand, by making the thickness of both end portions in the width direction of the ground terminal electrode 13 of the support substrate 1 thicker than the central portion, the stress applied to the vicinity of the central portion of the substrate body 11 when mounted on the external circuit board is It is alleviated by deformation of both ends of the ground terminal electrode 13. Thereby, the distortion of the board body 11 after being mounted on the external circuit board is suppressed, and the fluctuation of the load capacity of the piezoelectric component 100 is suppressed.

  Furthermore, by reducing the thickness of the central portion in the width direction of the ground terminal electrode 13 of the support substrate 1, the piezoelectric component 100 of the piezoelectric component 100 that is generated by strain applied to the vicinity of the central portion of the substrate body 11 due to a temperature change during use. Variations in load capacity can also be suppressed.

  That is, by increasing the thickness of both ends of the ground terminal electrode 13 in the width direction of the support substrate 1 and decreasing the thickness of the central portion, fluctuations in the load capacity of the piezoelectric component 100 are suppressed, and oscillation occurs during mounting and use. The piezoelectric component 100 that can maintain the frequency with high accuracy is obtained.

  In addition, when the thickness of the center part of the ground terminal electrode 13 is 2 micrometers-10 micrometers, for example, the thickness of the both ends of the ground terminal electrode 13 is set to thickness 1.5 times-4.0 times. The central portion of the ground terminal electrode 13 means a portion equidistant from both ends of the ground terminal electrode 13, and the both ends of the ground terminal electrode 13 are portions adjacent to both ends of the ground terminal electrode 13. This means that the portion is thicker than the central portion.

  Here, as shown in FIG. 3B, when the pair of input / output terminal electrodes 14 is viewed in a cross section cut along the short direction of the support substrate 1, the pair of input / output terminal electrodes 14 is also supported. The thickness at the center may be thinner than the thickness at both ends in the width direction of the substrate 1. In both the ground terminal electrode 13 and the pair of input / output terminal electrodes 14, the thickness at the center is thinner than the thickness at both ends in the width direction of the support substrate 1, so that these terminal electrodes are formed. In addition, since the stress applied to the substrate body 11 can be further reduced during mounting and use on an external circuit board, the piezoelectric component 100 capable of maintaining the oscillation frequency with higher accuracy can be obtained.

  When the thickness of the central portion of the input / output terminal electrode 14 is 2 μm to 10 μm, for example, the thickness of both end portions of the input / output terminal electrode 14 is set to 1.5 times to 5.0 times, for example.

  Further, as shown in FIG. 4, when viewed in a cross section cut along the longitudinal direction in the vicinity of the width direction (short direction) end portion of the support substrate 1, than the thickness of both end portions of the ground terminal electrode 13. The thickness of both ends of the pair of input / output terminal electrodes 14 may be thicker.

  By increasing the thickness of both ends of the pair of input / output terminal electrodes 14, the stress applied from the diagonal direction of the support substrate 1 at the time of mounting on the external circuit board and at the time of use is applied to both ends of the input / output terminal electrodes 14. The deformation is alleviated, and the distortion of the substrate body 11 is further reduced to further suppress the variation of the load capacity. Therefore, the oscillation frequency of the piezoelectric component 100 can be maintained with higher accuracy during mounting and use.

It should be noted that the thickness of both ends of the input / output terminal electrode 14 is set to 1.1 to 2.0 times the thickness of both ends of the ground terminal electrode 13, for example.

  As shown in FIG. 5, the ground terminal electrode 13 and the pair of input / output terminal electrodes 14 are narrower at the center than at both ends in the width direction of the support substrate 1 when viewed in plan. May be.

  By adopting such a configuration, the stress applied to the support substrate 1 at the time of mounting on the external circuit board and at the time of use is further alleviated by deformation of both ends of the ground terminal electrode 13 and the input / output terminal electrode 14, The distortion of the substrate body 11 is further reduced, and the variation in load capacity is further suppressed. Therefore, the oscillation frequency of the piezoelectric component 100 can be maintained with higher accuracy during mounting and use.

  When the width of the central portion of the ground terminal electrode 13 and the input / output terminal electrode 14 is, for example, 30 μm to 50 μm, the width of both ends of the ground terminal electrode 13 and the input / output terminal electrode 14 is, for example, 1.1 times to 1 times. .8 width is set.

  Further, as shown in FIGS. 1 to 3, each of the pair of capacitor electrodes 12 has a capacitor formation region extending in a direction approaching each other along the longitudinal direction of the support substrate 1. It is preferable that each capacitance forming region and both end portions of the ground terminal electrode 13 do not overlap each other, and a part of each capacitance forming region and the central portion of the ground terminal electrode 13 overlap each other.

  By adopting such a configuration, when mounted on an external circuit board and at the time of use, it is not affected by stress fluctuations due to deformation of both end portions of the ground terminal electrode 13 and the input / output terminal electrode 14. Distortion is further reduced and load capacity fluctuation is further suppressed. Therefore, the oscillation frequency of the piezoelectric component 100 can be maintained with higher accuracy during mounting and use.

  Next, an example of a method for manufacturing the piezoelectric component 100 will be described.

  First, a multi-piece substrate for producing the support substrate 1 is produced. For example, after mixing raw material powders such as lead titanate, lead zirconate titanate, and barium titanate together with water and a dispersant using a ball mill, a binder, a plasticizer, and the like are added, followed by drying and sizing. The granular raw material thus obtained is press-molded and, if necessary, subjected to hole processing, degreased at a predetermined temperature, then fired at a peak temperature of, for example, 900 ° C. to 1600 ° C., and polished to a predetermined thickness To implement. Thereafter, for example, a conductive paste containing a metal powder such as silver or nickel and glass is printed and fired at a predetermined temperature, and the first capacitor electrode 121, the second capacitor electrode 122, the ground terminal electrode 13, the input / output terminal electrode 14 etc. are formed and the support substrate 1 is obtained.

  Here, in order to provide a difference in thickness and width between the central portion and the end portion of the ground terminal electrode 13 and the input / output terminal electrode 14, the ground terminal electrode 13 and the input / output terminal electrode 14 are printed with the same plate making, After drying, a predetermined pattern is used, and only the vicinity of the end portions of the ground terminal electrode 13 and the input / output terminal electrode 14 is printed again and dried.

  In addition, in order to provide a thickness difference near the ends of the ground terminal electrode 13 and the pair of input / output terminal electrodes 14, the ground terminal electrode 13 and the input / output terminal electrode 14 are printed with the same plate making, dried, and then given a predetermined thickness. After the pattern is used, only the vicinity of the ends of the ground terminal electrode 13 and the input / output terminal electrode 14 is printed again and dried, and then only the vicinity of the ends of the input / output terminal electrode 14 is printed again using a predetermined plate making and dried. It is possible to make it.

On the upper surface of the obtained support substrate 1, support portions 31 and 32 made of a conductive paste are formed to a thickness of about 1 μm to 100 μm using screen printing or the like. Specifically, for example, a bump-shaped first support portion 31 formed by dispersing and solidifying metal powder in a resin, for example, is provided on the first capacitor electrode 121, and, for example, a metal is formed on the second capacitor electrode 122. A bump-like second support portion 32 is provided in which powder is dispersed in a resin and solidified.

  Next, the piezoelectric body 22 constituting the piezoelectric element 2 is prepared by, for example, mixing a raw material powder such as lead titanate or lead zirconate titanate together with water or a dispersant using a ball mill, and then adding a binder, a plasticizer, or the like. Dry, size. The granular raw material thus obtained is press-molded, degreased at a predetermined temperature, and then fired at a peak temperature of, for example, 900 ° C. to 1300 ° C. to obtain a piezoelectric ceramic. Thereafter, for example, in the case of a thickness shear vibration element, an end face electrode 23 is formed on the end face of the obtained piezoelectric ceramic and, for example, 0.4 kV / mm to 6 kV / mm in the end face direction at a temperature of 25 ° C. to 300 ° C., for example. Polarization is performed by applying a voltage of.

  The excitation electrodes 21 formed on the upper and lower surfaces of the piezoelectric body 22 are obtained by depositing metal films on the upper and lower surfaces of the piezoelectric body 22 using the vacuum deposition method, the PVD method, the sputtering method, or the like. A photoresist film having a thickness of about 1 μm to 10 μm can be formed by forming a photoresist film on each metal film using screen printing or the like and then patterning it by photoetching. The piezoelectric element 2 is manufactured by cutting the piezoelectric body 22 with the excitation electrode 21 patterned into a predetermined size by dicing or the like.

  Next, the piezoelectric element 2 is mounted on the first support portion 31 and the second support portion 32 of the support substrate 1 and fixed using the conductive bonding material 4. Here, in the case where the conductive bonding material 4 is a conductive adhesive in which metal powder is dispersed in a resin, the conductive adhesive is used for the first support portion 31 and the second support portion using a dispenser or the like. The piezoelectric element 2 may be applied on the first support portion 31 and the second support portion 32, and the resin of the conductive adhesive may be cured by heating or ultraviolet irradiation.

  Then, if necessary, the opening peripheral surface of the lid 5 is joined to the peripheral portion of the upper surface of the support substrate 1 so as to cover the piezoelectric element 2. As the lid body 5, a multi-piece collective cover sheet having a plurality of concave portions is used, and the multi-piece collective cover sheet is placed on the substrate so that the concave portions cover the piezoelectric elements 2. The convex portion of the collective lid sheet that becomes the peripheral edge surface of the opening is joined to the peripheral edge portion of the upper surface of the support substrate 1. For example, a thermosetting insulating adhesive is applied to the convex portion of the collective lid sheet that is the peripheral edge surface of the prepared lid body 5, and the lid body 5 is placed on the upper surface of the support substrate 1. Thereafter, the lid 5 or the support substrate 1 is heated to cure the insulating adhesive by raising the temperature to 100 to 150 ° C., and the lid 5 is bonded to the upper surface of the support substrate 1.

  Finally, after cutting by dicing or the like along the boundary of each piezoelectric component (individual piece), a conductive paste is printed on the side surface of each piezoelectric component that has become an individual piece using screen printing or the like, and 100 to 150 ° C. The piezoelectric component 100 can be obtained by forming the side electrodes 15 and 16 by increasing the temperature to cure. After this, plating of Ni, Au, etc. may be formed on the surface of the side electrodes 15, 16.

  With the above method, the piezoelectric component 100 of this example is manufactured. According to the above method, a piezoelectric component capable of maintaining the oscillation frequency with high accuracy during mounting and use can be manufactured.

100: Piezoelectric component 1: Support substrate 11: Substrate body 12: Capacitance electrode 13: Ground terminal electrode 14: Input / output terminal electrode 15, 16: Side electrode 2: Piezoelectric element 21: Excitation electrode 22: Piezoelectric body 23: End surface electrode 31 : 1st support part 32: 2nd support part 4: Conductive joining material 5: Lid

Claims (5)

A rectangular parallelepiped piezoelectric element having a pair of excitation electrodes opposed to each other, and a support substrate that supports both ends of the piezoelectric element in the longitudinal direction fixed to the upper surface, and
A pair of capacitive electrodes electrically connected to the pair of excitation electrodes is provided on the upper surface of the support substrate, and a lower surface of the support substrate is electrically connected to the pair of capacitance electrodes. A pair of input / output terminal electrodes and a ground terminal electrode arranged between the pair of input / output terminal electrodes are provided extending in the width direction of the support substrate,
The piezoelectric component according to claim 1, wherein the ground terminal electrode has a thinner thickness at a central portion than at both end portions in the width direction of the support substrate.   2. The piezoelectric component according to claim 1, wherein the pair of input / output terminal electrodes also has a thickness at a central portion smaller than a thickness at both end portions in the width direction of the support substrate.   3. The piezoelectric component according to claim 2, wherein the thickness of both ends of the pair of input / output terminal electrodes is thicker than the thickness of both ends of the ground terminal electrode.   The width of the center portion is narrower than the width of both ends of the support substrate in the width direction when the ground terminal electrode and the pair of input / output terminal electrodes are viewed in plan. Piezoelectric parts. Each of the pair of capacitance electrodes has a capacitance formation region extending in a direction approaching each other along the longitudinal direction of the piezoelectric element,
When viewed in plan, each of the capacitance forming regions does not overlap with both ends of the ground terminal electrode, and a portion of each of the capacitance forming regions overlaps with a central portion of the ground terminal electrode. The piezoelectric component according to any one of claims 1 to 4, wherein the piezoelectric component is characterized in that:

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