JP2018085377A5

JP2018085377A5 -

Info

Publication number: JP2018085377A5
Application number: JP2016226044A
Authority: JP
Filing date: 2016-11-21
Publication date: 2019-04-11
Anticipated expiration: 2036-11-21

Description

そこで、特開平６−１７７４９０号公報（特許文献１）には、フレキシブル配線板の上下からリジッド配線板で接着層を介して挟着することにより、フレキシブル配線板とリジッド配線板とを一体化したプリント配線板が開示されている。特開平６−１７７４９０号公報に記載の技術では、フレキシブル配線板とリジッド配線板とを、スルーホールなどの層間回路配線を用いることで接続することができる。これにより、フレキシブル型の基板との接続のために端子部を設ける必要がなく、基板面積の大型化を防止できる。 Therefore, the Japanese Laid-6-177490 (Patent Document 1), by pinched via the adhesive layer in Riji' de wiring board from above and below the flexible wiring board, integrating the flexible wiring board and Riji' de wiring board A printed wiring board is disclosed. In the technique disclosed in JP-A-6-177490, and a flexible wiring board and Riji' de wiring board can be connected by using the interlayer circuit wirings such as through-holes. Thereby, it is not necessary to provide a terminal part for connection with a flexible-type board | substrate, and enlargement of a board | substrate area can be prevented.

しかしながら、特開平６−１７７４９０号公報に記載の技術では、フレキシブル配線板の上下からリジッド配線板で挟むため、プリント配線基板が厚くなるという問題が生じる。さらに、プリント配線基板の上に電子部品が半田等により搭載されるため、さらに電子部品の分だけ厚くなる。 However, in the technique described in JP-A-6-177490, for sandwiching in Riji' de wiring board from above and below the flexible wiring board, a problem that the printed wiring board is increased occurs. Furthermore, since the electronic component is mounted on the printed wiring board by solder or the like, the thickness is further increased by the amount of the electronic component.

また、リジッド配線板とフレキシブル基板との多層化のために積層プレス等の工程や大型の装置を必要とするため、製造コストが高くなってしまう問題がある。 Moreover, since it requires a device process or large laminate press or the like for the multi-layered with Riji' de wiring board and the flexible board, there is a problem that manufacturing cost is increased.

第２型２２０における第１型２１０と対向する面は、第１型２１０の凹部２１１に対向する部分に深さｔ２の空間２２１を形成するとともに、第１型２１０の凹部２１１と対向しない部分に深さｔ１の空間２２２を形成するような形状を有する。空間２２１と空間２２２とは連通している。 The surface of the second mold 220 that faces the first mold 210 forms a space 221 having a depth t2 in a portion that faces the recess 211 of the first mold 210 and a part that does not face the recess 211 of the first mold 210. It has a shape that forms a space 222 having a depth t1 . The space 221 and the space 222 communicate with each other.

さらに、屈曲部２０が樹脂成形体１１に連接されるため、フレキシブル配線板を上下からリジッド配線板で挟む場合（特開平６−１７７４９０号公報参照）に比べて、電子装置１００を小型化および薄型化することができる。 Further, since the bent portion 20 is connected to the molded resin 11, as compared with the case where sandwich in Riji' de wiring board flexible wiring board from above and below (see JP-A-6-177490), miniaturized electronic device 100 and Thinning can be achieved.

電子部品４２（４２ａ〜４２ｃ）は、チップ型コンデンサ、チップ型抵抗、ＩＣ（Integrated Circuit）等の電子部品である。電子部品４２の数および種類は、特に限定されるものではない。 The electronic components 42 (42a to 42c) are electronic components such as a chip capacitor, a chip resistor, and an IC (Integrated Circuit). The number and type of electronic components 42 are not particularly limited.

１０，４０，５０本体部、１１，４１，５１樹脂成形体、１１ａ，４１ａ，５１ａ
上面、１２（１２ａ〜１２ｅ），４２（４２ａ〜４２ｃ），７１，７６ａ，７６ｂ電子部品、１３ａ〜１３ｅ，４３ａ〜４３ｃ電極、２０，６０屈曲部、２０ａ，６０ａ連続面、３０（３０ａ〜３０ｐ），６１（６１ａ〜６１ｃ），７２ａ，７２ｂ，７７ａ，７７ｃ配線、７０，７５，８０基板、８１導電層、９０ａ，９０ｂ導電性接着層、１００，１００Ａ，１００Ｂ，１００Ｃ電子装置、２００仮固定シート、２１０第１型、２１１凹部、２２０第２型、２２１，２２２空間、２３０，２４０構造体。 10, 40, 50 Main body, 11, 41, 51 Molded resin, 11a, 41a, 51a
Upper surface, 12 (12a-12e) , 42 (42a-42c), 71, 76a, 76b Electronic component, 13a-13e, 43a-43c Electrode, 20, 60 Bending part, 20a, 60a Continuous surface, 30 (30a- 30p), 61 (61a to 61c), 72a, 72b, 77a, 77c wiring, 70, 75, 80 substrate, 81 conductive layer, 90a, 90b conductive adhesive layer, 100, 100A, 100B, 100C electronic device, 200 Fixed sheet, 210 1st type, 211 recess, 220 2nd type, 221, 222 space, 230, 240 structure.

Claims

Electronic components,
A resin molded body for embedding and fixing the electronic component;
E Bei a bendable bending portion which connects to the resin molded body,
The bent portion is molded integrally with the resin molded body with resin,
The material of the bent portion and said resin molded body that Do different electronic device.

Electronic components,
A resin molded body for embedding and fixing the electronic component;
An electronic device comprising a bendable bendable portion connected to the resin molded body,
The resin molded body embeds and supports a part of the bent portion ,
The surface of the resin molded body includes an exposed surface that exposes the electronic component,
The surface of the bent portion includes a continuous surface continuous with the exposed surface,
The electronic device further includes:
An electronic device comprising wiring formed on the exposed surface and the continuous surface and connected to the electronic component .

The surface of the resin molded body includes an exposed surface that exposes the electronic component,
The surface of the bent portion includes a continuous surface continuous with the exposed surface,
The electronic device further includes:
The electronic device according to claim 1, further comprising a wiring formed on the exposed surface and the continuous surface and connected to the electronic component.

The electronic device according to claim 2 , wherein the wiring is continuously formed from the electronic component to the continuous surface.

The wiring is
A first wiring formed on the exposed surface and connected to the electronic component;
4. The electronic device according to claim 2 , further comprising: a second wiring formed in advance on the continuous surface and connected to the first wiring. 5.

The elongation at break of the bent portion of the material, the greater than the elongation at break of the material of the resin molded body, an electronic device according to any one of claims 1 to 5.

The electronic device according to claim 6 , wherein the bent portion is formed of a resin having an elongation at break of 300% or more.

The electronic device according to claim 7 , wherein the resin molded body is formed of a resin having an elongation at break of 150% or less.

The resin molded body includes a filler, an electronic device according to any one of claims 1 to 8.

A process of attaching electronic components to a sheet;
The sheet is sequentially disposed in two types of molds, and a resin molded body in which the electronic component is embedded and a bendable bent portion connected to the resin molded body are integrally molded by a two-color molding method. Process,
Wiring is formed on the sheet bonding surface that is in contact with the sheet in the resin molded body and the continuous surface that is continuous with the sheet bonding surface in the bent portion, which is exposed by peeling the sheet from the resin molded body. A method for manufacturing an electronic device.

A process of attaching an electronic component and a bendable bend to a sheet;
Placing the sheet in a mold and filling a resin in the mold to mold a resin molded body in which the electronic component and a part of the bent portion are embedded;
Forming a first wiring on a sheet bonding surface that is in contact with the sheet in the resin molded body, which is exposed by peeling the sheet from the resin molded body.

The surface of the bent portion includes a continuous surface continuous to the sheet bonding surface,
The method of manufacturing an electronic device according to claim 11 , wherein in the step of forming the first wiring, the first wiring is also formed on the continuous surface.

Second wiring is formed in advance on the surface of the bent portion,
In the attaching step, the bent portion is attached to the sheet so that the second wiring faces the sheet,
The method of manufacturing an electronic device according to claim 11 , wherein in the step of forming the first wiring, the first wiring is formed so as to be connected to the second wiring.