JP2018072104A - Method for acquiring polishing amount of metal component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for evaluating the state of a surface of a metal component and acquiring an optimal polishing amount.SOLUTION: The method includes the steps of: (a) measuring a parameter after use by irradiating a surface of a metal component after use with an X ray; (b) determining variation of the parameter after use with respect to a parameter before use of a metal component before use; (c) determining an actual value corresponding to the variation determined in the step (b) using actual polishing amount information, and acquiring a polishing amount which is a smaller value than the actual value; (d) polishing the surface of the metal component with the acquired polishing amount and then irradiating the surface of the metal component with an X ray, so as to measure a parameter after polishing; and (e) acquiring a polishing amount to bring the parameter after polishing closer to the parameter before use on the basis of a relation between the parameter after use and the parameter after polishing. The steps (d) and (e) are repeatedly performed until the parameter after polishing measured in the step (d) becomes a value equivalent to the parameter before use.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a polishing amount acquisition method that can be applied when polishing and reusing a surface of a metal part after use.

  A backup roll (for example, see Patent Document 1) of a multi-stage rolling apparatus is subjected to polishing after a predetermined operation time has elapsed since the surface is damaged, rolling fatigue, discoloration due to heat, etc. occurs on the surface. The backup roll is recovered by removing an influence layer such as a scratch generated on the surface and reused. Such reuse is performed until the outer diameter of the backup roll reaches a predetermined limit value (minimum value).

JP 2009-195928 A

  Conventionally, it has been left to the judgment of the user to determine the amount of polishing to remove scratches on the surface of the backup roll. For example, a method of performing polishing with a fixed amount uniquely determined by the user, a method of performing polishing with an arbitrary amount set each time according to the appearance of the backup roll, and the like have been adopted. For this reason, there is a possibility that the polishing amount varies greatly depending on the user, and if the polishing is performed more than necessary, the outer diameter may reach the limit value at an early stage or the polishing amount may be insufficient to recover sufficiently. Moreover, since the load received according to the kind and operating environment of a multi-stage rolling apparatus, the use location of the some division | segmentation roll which comprises a backup roll, etc. differ, the influence layer by rolling differs for every backup roll.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for obtaining a polishing amount of a metal part, which can obtain an optimum polishing amount by evaluating the state of the surface of the metal part after use. .

  The method for acquiring the polishing amount of a metal part according to the present invention measures predetermined information acquired non-destructively by irradiating the surface of the metal part with X-rays as a parameter, and uses this parameter to measure the surface of the metal part. (A) a step of measuring post-use parameters by irradiating the surface of a metal part after use with X-rays, and (b) before use of the metal part before use. A step of obtaining a change amount of the post-use parameter with respect to the parameter; (c) actual polishing amount information indicating a relationship between the change amount of the post-use parameter with respect to the pre-use parameter and the actual value of the polishing amount corresponding to the change amount; A step of obtaining an actual value corresponding to the change amount obtained in the step (b) and obtaining a polishing amount having a value smaller than the actual value; (d) the metal part with the obtained polishing amount; Measuring the post-polishing parameters by irradiating the surface of the metal part with X-rays after polishing the surface, and (e) based on the relationship between the post-use parameters and the post-polishing parameters, Obtaining a polishing amount that brings the post-polishing parameter close to the pre-use parameter, and the step (d) until the post-polishing parameter measured in the step (d) is equal to the pre-use parameter. And the step (e) is repeated.

  According to the above polishing amount acquisition method, the amount of polishing of a metal part can be quantitatively acquired using predetermined parameters measured in a non-contact and non-destructive manner by irradiating the surface of the metal part with X-rays. . Therefore, compared with the conventional method left to the user's judgment, more appropriate polishing can be performed, and the surface state of the metal part can be preferably recovered.

The parameter is preferably a half width of diffracted X-rays.
The half width of the diffracted X-ray appropriately reflects the state of scratches, fatigue, etc. on the surface of the metal part. Therefore, a more appropriate polishing amount can be obtained by using the half width as a parameter.

The parameter may be a residual stress obtained by diffracted X-rays.
Residual stress generated on the surface of the metal part, particularly tensile stress, causes cracking and the like. Therefore, by using the residual stress as a parameter and acquiring the polishing amount based on this parameter, it is possible to return (recover) the residual stress before use by polishing.

  The metal part may be an outer ring of a rolling bearing that is in rolling contact with an external part as a rotating wheel.

  According to the present invention, it is possible to obtain an optimum polishing amount by evaluating the surface state of a metal part after use.

It is a schematic side view of the multistage rolling apparatus provided with the metal component which concerns on embodiment. It is a schematic front view which shows a backup roll. It is sectional drawing which expands and shows a part of division | segmentation roll. It is a block diagram which shows the apparatus structure for performing the recovery | restoration operation | work of a support surface. It is sectional drawing of the outer ring | wheel which shows the location which measures a half width by an X-ray-diffraction apparatus. It is a graph explaining the relationship between a half value width and polishing amount. It is a graph explaining the relationship between a half width, an actual polishing amount, and an actual polishing amount. It is a flowchart which shows the flow of the recovery operation | work of a support surface.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic side view of a multi-high rolling mill provided with metal parts according to the embodiment.
[Structure of multi-high rolling mill]
The multi-high rolling mill 10 is a 20-high cluster rolling mill having a 1-2-3-4 roll arrangement. A material to be rolled W such as a thin plate material is passed between a pair of upper and lower rolling rolls 11 in the left-right direction in FIG. 1 and rolled.

  The pair of upper and lower rolling rolls 11 are supported by four (two upper and lower) first intermediate rolls 12. The four first intermediate rolls 12 are supported by six (three upper and lower) second intermediate rolls 13. The six second intermediate rolls 13 are supported by eight (upper and lower four) backup rolls 14.

FIG. 2 is a schematic front view showing the backup roll 14.
The backup roll 14 includes a plurality of divided rolls 15 arranged in the axial direction and a shaft 16 on which the plurality of divided rolls 15 are concentrically attached. As shown in FIG. 1, the shaft 16 is fixed to a saddle 18 attached to a housing 17 of the multistage rolling mill 10. In the present embodiment, six divided rolls 15 are arranged at predetermined intervals in the axial direction, and saddles 18 are arranged between the six divided rolls 15 and on the outer sides in the axial direction of the divided rolls 15 at both axial ends. Has been.

FIG. 3 is an enlarged cross-sectional view showing a part of the split roll 15.
The division | segmentation roll 15 is comprised by the rolling bearing. Specifically, the split roll 15 is constituted by a cylindrical roller bearing including an inner ring 20, an outer ring 21, a plurality of rolling elements 22, and a cage 23. The inner ring 20 is formed in a cylindrical shape using bearing steel, machine structural steel, or the like, and is fixed to the shaft 16 by being fitted to the outer peripheral surface of the shaft 16. A raceway surface 20 a is formed on the outer peripheral surface of the inner ring 20.

The outer ring 21 is formed in a cylindrical shape using bearing steel, machine structural steel, or the like, and is arranged concentrically with the inner ring 20 with a space on the radially outer side of the inner ring 20. A raceway surface 21 a is formed on the inner peripheral surface of the outer ring 21.
The rolling elements 22 are arranged in double rows (two rows) with a circumferential interval between the raceway surface 20a of the inner ring 20 and the raceway surface 21a of the outer ring 21, and roll on the raceway surfaces 20a and 21a. .
The cage 23 is disposed between the inner ring 20 and the outer ring 21 in the radial direction, and holds the circumferential spacing of the rolling elements 22.

The outer ring 21 of the split roll 15 is a rotating wheel that rotates around the axis of the shaft 16. And the outer ring | wheel 21 rotates because the outer peripheral surface 21b contact | connects the 2nd intermediate | middle roll 13 (refer FIG. 1). That is, the outer ring 21 is in rolling contact with the second intermediate roll 13. The outer peripheral surface 21 b of the outer ring 21 constitutes a support surface that supports the second intermediate roll 13.
With the operation of the multi-stage rolling apparatus 10, the support surface 21b of the split roll 15 receives scratches and rolling fatigue. Therefore, after operating for a predetermined period, the backup roll 14 is removed from the multistage rolling mill 10, the influence surface due to rolling is removed by polishing the support surface 21 b of the outer ring 21, and the split roll 15 is restored to a state equivalent to a new roll. Has been done. By performing such a recovery operation, the backup roll 14 can be used again for rolling, and the support function of the second intermediate roll 13 can be sufficiently exhibited.

[Split roll recovery]
The work for recovering the support surface 21b of the split roll 15 includes the following work.
(A) Work to measure the state of the support surface 21b (B) Work to acquire the polishing amount based on the state of the support surface 21b (C) Work to polish the support surface 21b

  FIG. 4 is a block diagram showing an apparatus configuration for performing the operations (A) to (C). Work (A) is performed using the X-ray diffractometer 31. The work (B) is performed using the processing device 32. The operation (C) is performed using the polishing apparatus 33. In FIG. 4, the dotted arrow indicates the flow of the outer ring 21 to be recovered (polishing target), and the solid line arrow indicates the flow of data (X-ray diffraction data, polishing amount data) used for the recovery operation. Yes.

<Details of work (A)>
In the present embodiment, as the state of the support surface 21b, a half width (half width) by an X-ray diffraction method is measured. This half-value width refers to a width at an intensity value that is half the peak intensity among the widths of the diffraction pattern obtained by irradiating the support surface 21b with X-rays. In the case of a hardened steel part, this half width shows a large value as an initial value, and the value becomes small when affected by scratches, rolling fatigue, and the like. Therefore, the half width can be a parameter for knowing the degree of damage or the like of the support surface 21b.

Moreover, in this embodiment, the half value width as shown below is measured.
(1) Preliminary measurement before using divided roll 15 (2) Primary measurement after using divided roll 15 (3) Secondary measurement after polishing support surface 21b

(Preliminary measurement)
The preliminary measurement is performed before the split roll 15 is used, that is, after the split roll 15 (outer ring 21) is manufactured and before it is incorporated in the rolling apparatus 10 as the backup roll 14. The preliminary measurement may be performed for all manufactured divided rolls 15 or may be performed for one or a plurality of divided rolls 15 included in the same production lot. In the former case, the half width is managed for each divided roll 15. In the latter case, the half width of the divided roll 15 is managed for each production lot. The pre-measured half-value width is stored in the storage unit of the processing device 32 and managed. In the following description, the pre-measured half width is also referred to as “half width before use”.

(Primary measurement)
The primary measurement is performed after using the split roll 15 by operating the multi-high rolling mill 10. For example, after the multi-stage rolling apparatus 10 has been operated for a predetermined period, the backup roll 14 is disassembled for maintenance and before the work of recovering the outer ring 21 of the split roll 15 is performed, the half-width primary measurement is performed. The half-value width measured at this time is usually a small value compared to a new state before using the split roll 15.

In the following description, the half-value width that is primarily measured is also referred to as “use half-value width”.
The first measured half-value width and the pre-measured half-width before use are the first polishing amount (primary polishing amount) when performing the work of recovering the outer ring 21 of the split roll 15 in the work (B). ) To set.

(Secondary measurement)
The secondary measurement is performed after the support surface 21b is polished to recover the state of the support surface 21b. In addition, the secondary measurement is performed after each polishing when the polishing is performed a plurality of times. The half width measured secondarily is measured in order to confirm the recovery state of the support surface 21b by polishing and to acquire the next (additional) polishing amount in the step (B). In the following description, the half-value width that is secondarily measured is also referred to as “the latter half-value width”.

(Measurement points)
FIG. 5 is a cross-sectional view of the outer ring showing the location where the half width is measured by the X-ray diffractometer 31. In this embodiment, as shown to Fig.5 (a), among the support surfaces (outer peripheral surface) 21b of the outer ring | wheel 21, the width direction (axial direction) center ((alpha)) and the crowning part ((beta)) in the width direction both ends The half width at five points of the linear part (γ) between the center (α) in the width direction and the crowning part (β) is measured. The reason why the half width is measured at a plurality of positions in the axial direction in this way is that there is a bias in the way the load is applied depending on the position in the axial direction, and the degree of scratches and the like varies.

  Further, the half width is measured in one phase (δ) in the circumferential direction on the support surface 21b of the outer ring 21, as shown in FIG. 5 (b). In the present embodiment, the half width is measured at one specific phase (δ) on the outer peripheral surface 21 b of the outer ring 21. For example, it is possible to set one phase specified by using a mark 21c (a mark indicating a manufacturer name) provided on the side surface of the outer ring 21 as a mark. However, since the outer peripheral surface 21b of the outer ring 21 can be estimated to have the same half-value width in any phase in the circumferential direction, any one phase may be set as a measurement location.

(Relationship between half width and polishing amount)
FIG. 6 is a graph for explaining the relationship between the half width and the polishing amount.
In FIG. 6, the half width of the support surface 21b before use is shown by (a), and the half width of the support surface 21b after use is shown by (b). By using the split roll 15, the half width is reduced from (a) to (b). Therefore, polishing is performed to restore the half width of the support surface 21b to (a) again. At this time, if the polishing amount is insufficient, the half width does not reach (a) and cannot be sufficiently recovered. Further, even if further polishing is performed after the half-value width reaches (a), the half-value width hardly rises, and the outer diameter of the support surface 21b is wasted due to overpolishing, reaching the limit value early. Will reach. Therefore, it is important to set the polishing amount without excess or deficiency. The operation (B) described next is performed in order to obtain an optimum polishing amount without excess or deficiency.

  The X-ray diffractometer 31 used in the operation (A) can be a portable type, and the processing device 32 used in the subsequent polishing amount acquisition operation (B) or the polishing device used in the polishing operation (C). Installation in the vicinity of 33 is preferable from the viewpoint of work efficiency.

<Details of work (B)>
The half width measured in the operation (A) is used exclusively for obtaining the polishing amount of the support surface 21b. This polishing amount is composed of a primary polishing amount of the polishing process that is performed first when performing the recovery operation and a secondary (additional) polishing amount of the second and subsequent polishing processes.
For example, a personal computer is used as the processing device 32 for acquiring each polishing amount. The processing device 32 includes an arithmetic unit configured by a processor such as a CPU, a storage unit such as a memory, and an input / output unit for inputting and outputting information. The storage unit stores a database DB that is referred to in order to acquire the primary polishing amount. The processing device 32 may be provided integrally with the X-ray diffraction device 31.

(Primary polishing amount)
The primary polishing amount is acquired with reference to a database (actual polishing amount information) DB stored in advance in the storage unit. This database DB accumulates information indicating the relationship between the change amount of the half width of the support surface 21b before and after use and the actual value of the polishing amount corresponding to this change amount. The processing device 32 obtains the amount of change in the half-value width before and after use from the pre-use half-value width that was preliminarily measured and the first-measurement half-value width that was primarily measured, and stores the actual polishing amount corresponding to this change amount in the database DB Get by reference. In addition, the actual value which comprises database DB applies the polishing amount when the division | segmentation roll 15 actually used with the rolling apparatus 10 was recovered | restored, or the polishing amount acquired using the specimen for database preparation be able to.

FIG. 7 is a graph for explaining the relationship between the half width, the actual polishing amount, and the actual polishing amount.
In FIG. 7, the half width before use is indicated by (a), and the half width after use is indicated by (b). Then, by referring to the database DB, the actual polishing amount is obtained from the amount of change in the half width before and after use ((a)-(b)).

  Since the change in the half width of the support surface 21b due to use varies depending on the type and operating environment of the multi-high rolling mill 10, the location where the split roll 15 is used in the backup roll 14, etc., the actual polishing accumulated in the database DB The amount is not necessarily optimal for all split rolls 15. Therefore, even if the support surface 21b is polished with the actual polishing amount, there is a possibility of overpolishing. Therefore, in this embodiment, excessive polishing is prevented by setting a value smaller than the actual polishing amount as the primary polishing amount. For example, as shown in FIG. 7, the processing device 32 sets half the actual polishing amount as the primary polishing amount.

(Secondary polishing amount)
Since the primary polishing amount is smaller than the actual polishing amount, even if polishing is performed with the primary polishing amount, it is highly possible that the polishing latter half width of the support surface 21b does not reach the half width before use. . Therefore, the processing device 32 calculates a secondary polishing amount for additional polishing. The secondary polishing amount is obtained by analyzing the relationship (half-width recovery tendency) between the latter half value width used by primary measurement and the second half price range polished by secondary measurement. For example, as shown in FIG. 7, it is considered that the polishing latter half width (c) secondarily measured after polishing with the primary polishing amount has a linear relationship with the post-use polishing width (b). Therefore, the secondary polishing amount is set in consideration of such a relationship. Specifically, the processing device 32 obtains a polishing amount (analytical polishing amount) that is considered to reach the pre-use half width (a) in consideration of the relationship, and is smaller than the polishing amount (for example, half of the polishing amount). ) Set the polishing amount as the secondary polishing amount.

After the support surface 21b is polished by the secondary polishing amount, the half width (polishing latter half width) of the support surface 21b is secondarily measured again by the X-ray diffractometer 31. At this stage, one use latter half price range and two polishing latter half price ranges are acquired. The processing device 32 analyzes the relationship (linear relationship or nonlinear relationship) of these three half widths, grasps the recovery tendency of the support surface 21b, and sets a further secondary polishing amount. Thus, the recovery tendency can be grasped more accurately by increasing the number of half-value widths used in the analysis.
The above secondary measurement is repeated until the polishing half-value width (c) reaches the pre-use half-value width (a).

  As described with reference to FIG. 5, the half-value width is measured at a plurality of locations in the width direction of the support surface 21b, but the half-value width is usually different depending on the measurement location. Therefore, when the polishing amount is set as described above, the smallest half width, that is, the half width that is considered to have the deepest affected layer such as a flaw is employed. Thereby, the state of the whole width direction of the support surface 21b is recoverable.

<Details of work (C)>
The polishing apparatus 33 polishes the support surface 21b with the primary polishing amount and the secondary polishing amount set in the operation (B). As the polishing apparatus 33, a conventionally known apparatus suitable for polishing cylindrical parts can be used. It is more preferable to use an NC polishing apparatus that is numerically controlled by inputting a primary polishing amount or a secondary polishing amount.

[Overall process in recovery work]
FIG. 8 is a flowchart showing a flow of recovery work of the support surface 21b. Hereinafter, the overall work flow of the X-ray diffraction apparatus 31 and the processing apparatus 32 will be mainly described with reference to FIG.
First, the half width (before use half width) of the support surface 21b is measured by the X-ray diffractometer 31 for the split roll 15 before being incorporated into the multi-high rolling mill 10 (step S1). The measured pre-use half-value width information is stored and managed in the storage unit of the processing device 32 (step S11).

Then, the division | segmentation roll 15 is integrated as the backup roll 14 in the multistage rolling apparatus 10, and a rolling operation is performed. After the multistage rolling mill 10 is operated for a predetermined period, the backup roll 14 is disassembled for maintenance, and the outer ring 21 of the split roll 15 is provided to the X-ray diffraction apparatus 31.
Next, the half-value width (use half-value width) of the support surface 21b of the split roll 15 after use is measured by the X-ray diffractometer 31 (step S2). The measured use latter half price range is transmitted to the processing device 32 and stored in the storage unit (step S12).

  The processing device 32 calculates the amount of change, which is the difference between the pre-use half-value width and the use half-value width (step S13), and further sets the primary polishing amount with reference to the database DB (step S14). As described above, as the primary polishing amount, a value smaller than the actual polishing amount obtained by referring to the database DB from the change amount of the half width before and after use (for example, a half value) is adopted. Information on the set primary polishing amount is sent to the polishing apparatus 33, and primary polishing is performed in the polishing apparatus 33.

Next, the half-value width (polishing latter half value width) of the primary-polished support surface 21b is measured by the X-ray diffractometer 31 (step S3). The latter half price range is transmitted to the processing device 32 and stored in the storage unit (step S15).
The processing device 32 compares the polishing half-value width with the pre-use half-value width and determines whether or not additional polishing is necessary (confirmation of the necessity for additional polishing) (step S16). When the polishing half-value width is equal to the pre-use half-value width, additional polishing is unnecessary and the recovery operation is terminated.

When determining that additional polishing is necessary, the processing device 32 analyzes the change (recovery tendency) of the half-value width before and after polishing from the latter half-use width and the latter half-value width (step S17). And the processing apparatus 32 calculates | requires secondary polishing amount based on the recovery tendency (step S18).
Thereafter, the information on the amount of secondary polishing is sent to the polishing apparatus 33, and the polishing apparatus 33 performs secondary polishing. Then, the process of secondary measurement (step S3) to the setting of the secondary polishing amount (step S18) (the process surrounded by the one-dot chain line in FIG. 8) is repeated, and the support surface 21b is equivalent to a new one before use. It is recovered to the state of.

  Note that the total polishing amount (the total of the primary polishing amount and the secondary polishing amount) until the support surface 21b is restored to a new product equivalent state is a database together with the change amount data of the half width before use and the latter half price range. You may accumulate in DB.

[Operational effects of this embodiment]
As described above, in the present embodiment, the polishing amount is quantitatively obtained using the half-value width representing the state of the support surface 21b of the split roll 15, and the support surface is obtained to a state equivalent to that before use based on the polishing amount. 21b is recovered. Therefore, appropriate polishing without excess or deficiency can be performed, the outer diameter of the split roll 15 can be prevented from reaching the limit value early, or the recovery can be insufficient, and optimal reuse can be achieved. It becomes possible.

Further, by using the half width of the diffracted X-ray reflecting the state of the support surface 21b, the state of the support surface 21b can be properly grasped in a non-contact / non-destructive manner, and a new scratch or the like can be obtained with the measurement. Can be prevented.
In order to prevent overpolishing of the support surface 21b, it is conceivable to repeat the polishing with an arbitrary minute amount and the measurement of the half width, but in this case, the repetition frequency of the polishing operation and the measurement operation Is very numerous and inefficient. In this embodiment, since the polishing amount is set based on the past actual value of the polishing amount and the recovery tendency of the half width by polishing, the repetition frequency between the polishing operation and the measurement operation is reduced as much as possible. , Efficient recovery work can be done.

[Other Embodiments]
The present invention is not limited to the above-described embodiment, and can be modified within the scope of the invention described in the claims. For example, the following embodiments can be adopted.
(1) In the above embodiment, the half width of the diffracted X-ray is used as a parameter indicating the state of the support surface 21b. As another embodiment, the residual stress obtained by diffracted X-rays in addition to the half width can be used as a parameter. It is conventionally known that the residual stress can be measured by diffracted X-rays, and by measuring the tensile stress or the compressive stress generated on the support surface 21b, it is possible to adopt a polishing amount in consideration of these. In particular, the tensile stress generated on the support surface 21b is a cause of occurrence of cracks and the like starting from fine scratches. Therefore, when tensile stress is measured by diffracted X-rays, it is used by polishing by setting a value larger than the primary polishing amount or secondary polishing amount obtained based only on the half-value width as the polishing amount. It is possible to return (recover) the previous residual stress. As a result, it is possible to prevent damage or cracking on the support surface 21b.

  (2) In the said embodiment, although demonstrated about recovering the state of the support surface 21b for the division | segmentation roll 15 applied to the backup roll 14 of the multistage rolling apparatus 10, it is not limited to this, It can be applied to restore the surface condition of any metal part. Further, the surface state of the metal part is not limited to the half-value width of the diffracted X-ray and the residual stress obtained by the diffracted X-ray, and other parameters such as retained austenite may be used. Here, for example, by using simultaneously the parameters of the half width of the diffracted X-ray and the retained austenite, it is possible to obtain a more accurate polishing amount.

10: Multi-stage rolling device, 15: Split roll (rolling bearing), 21: Outer ring (metal part), 21b: Outer peripheral surface (support surface), 31: X-ray diffraction device, 32: Processing device, 33: Polishing device, DB : Database (Actual polishing amount information)

Claims (4)

It is a method of measuring predetermined information acquired non-destructively by irradiating the surface of a metal part with X-rays as a parameter, and acquiring the polishing amount of the surface of the metal part using this parameter,
(A) a step of measuring post-use parameters by irradiating the surface of the metal part after use with X-rays;
(B) obtaining a change amount of the post-use parameter with respect to the pre-use parameter for the metal part before use;
(C) A change amount obtained in the step (b) using actual polishing amount information indicating a relationship between a change amount of the post-use parameter with respect to the pre-use parameter and an actual value of the polishing amount corresponding to the change amount. A process of obtaining a performance value corresponding to the above and obtaining a polishing amount of a value smaller than the performance value,
(D) measuring the post-polishing parameter by irradiating the surface of the metal part with X-rays after polishing the surface of the metal part with the obtained polishing amount; and (e) the post-use parameter and the Acquiring a polishing amount that brings the post-polishing parameter close to the pre-use parameter based on the relationship with the post-polishing parameter;
Including
Polishing amount of metal parts, wherein the step (d) and the step (e) are repeatedly performed until the post-polishing parameter measured in the step (d) is equal to the pre-use parameter. Method.   The method for obtaining a polishing amount of a metal part according to claim 1, wherein the parameter is a half width of diffracted X-rays.   The method for obtaining a polishing amount of a metal part according to claim 2, wherein the parameter is a residual stress obtained by diffracted X-rays.   The method for obtaining a polishing amount of a metal part according to any one of claims 1 to 3, wherein the metal part is an outer ring of a rolling bearing that is in rolling contact with an external part as a rotating wheel.

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