JP2018020547A - Three-dimensional structure modeling stage, three-dimensional structure manufacturing apparatus, and three-dimensional structure manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress deformation of a laminated body formed by laminating layers on a modeling stage, which is accompanied by degreasing or sintering of the laminated body. SOLUTION: This is used in a three-dimensional structure manufacturing apparatus 2000 that manufactures a three-dimensional structure by stacking layers to form a stack 500, and has a forming surface 121a on which the stack 500 is formed, A modeling stage 121 of a three-dimensional model is used, which is made of a high melting point material having a melting point higher than that of the constituent material of the original model, and is porous. By using such a modeling stage 121, the laminate 500 is deformed by degreasing or sintering the laminate 500 of the three-dimensional structure formed by stacking layers on the modeling stage 121. It becomes possible to suppress that. [Selection diagram] Fig. 7

Description

  The present invention relates to a modeling stage for a three-dimensional structure, a manufacturing apparatus for a three-dimensional structure, and a method for manufacturing a three-dimensional structure.

Conventionally, a manufacturing apparatus for manufacturing a three-dimensional structure by laminating layers has been used. In such a three-dimensional structure manufacturing apparatus, a laminate of three-dimensional structures is formed on a modeling stage.
For example, Patent Document 1 discloses a manufacturing method for manufacturing a three-dimensional structure using a three-dimensional structure manufacturing apparatus that can form a laminate of a three-dimensional structure on a modeling plate (modeling stage). It is disclosed.

JP 2010-1000088 A

  It is generally performed to degrease or sinter a laminate of a three-dimensional structure formed on a modeling stage. Degreasing and sintering the three-dimensional structure laminate removes materials other than the final three-dimensional structure constituent material (removal material) by volatilization, etc., so the three-dimensional structure is laminated. The body contracts. However, when degreasing and sintering a laminate of a three-dimensional structure, the method of volatilization of the removal material from the modeling stage differs from the method of volatilization of the removal material from the modeling stage, so there is a difference in the shrinkage rate. The laminate could be deformed with degreasing and sintering. In addition, in Patent Document 1, there is a description that a material having a low bondability with a three-dimensional structure is desirable as a material of the modeling stage. There is no description regarding the deformation of the laminate due to the difference in volatilization of the removal material. That is, a technique that makes it possible to suppress deformation of the laminate accompanying degreasing and sintering is not disclosed.

  Therefore, an object of the present invention is to suppress deformation of the laminate as a result of degreasing and sintering the laminate of the three-dimensional structure formed by stacking layers on the modeling stage. .

  The modeling stage of the three-dimensional structure according to the first aspect of the present invention for solving the above problem is a three-dimensional structure manufacturing apparatus that manufactures a three-dimensional structure by stacking layers and forming a laminate. It is used, has a formation surface on which the laminate is formed, and is made of a high melting point material having a melting point higher than that of the constituent material of the three-dimensional structure, and is porous.

  The modeling stage of this aspect is configured to be porous. For this reason, when degreasing and sintering a laminate of a three-dimensional structure formed by stacking layers on a modeling stage, the removal material volatilizes from the modeling stage side (downward) and on the modeling stage ( It is possible to reduce a difference (that is, a difference in shrinkage rate) from the manner of volatilization of the removal material from the upward direction and the lateral direction. Therefore, it is possible to suppress deformation of the laminate in accordance with degreasing and sintering the laminate of the three-dimensional structure formed by stacking layers on the modeling stage.

  The modeling stage of the three-dimensional structure according to the second aspect of the present invention is used in a three-dimensional structure manufacturing apparatus that manufactures a three-dimensional structure by stacking layers and forming a stacked body, It has a formation surface to be formed, and is made of a high melting point material having a higher melting point than the constituent material of the three-dimensional structure, and is configured to be porous so as to communicate from the formation surface side to a side different from the formation surface side. It is characterized by.

  The modeling stage of this aspect is configured to be porous so as to communicate with the side different from the forming surface side from the forming surface side. For this reason, when degreasing and sintering a laminate of a three-dimensional structure formed by stacking layers on a modeling stage, the removal material volatilizes from the modeling stage side (downward) and on the modeling stage ( The difference (that is, the difference in shrinkage rate) from the manner of volatilization of the removed material from the upward and lateral directions can be effectively reduced. Therefore, it is possible to effectively suppress deformation of the laminate in accordance with degreasing and sintering the laminate of the three-dimensional structure formed by laminating layers on the modeling stage.

  The modeling stage of the three-dimensional structure according to the third aspect of the present invention is detachable from the manufacturing apparatus in the first or second aspect, and has a melting point lower than that of the constituent material on the forming surface. An organic film is formed.

The modeling stage of this aspect is detachable from the three-dimensional structure manufacturing apparatus, and an organic film having a melting point lower than that of the constituent material of the three-dimensional structure is formed on the formation surface of the laminate. For this reason, for example, the organic film is removed by degreasing and sintering the laminate of the three-dimensional structure at a temperature lower than the melting point of the constituent material of the three-dimensional structure and higher than the melting point of the organic film. It is possible to remove the laminated body, and the laminated body can be particularly effectively prevented from being deformed, and the laminated body can be easily separated from the modeling stage. Furthermore, by making the modeling stage detachable from the three-dimensional model manufacturing apparatus, when moving the three-dimensional model stack to the apparatus for degreasing and sintering, the modeling stage can be moved along with the modeling stage. It can suppress that this laminated body is damaged.
Note that “an organic film having a melting point lower than that of the constituent material” means a film that covers at least a part of the formation surface and needs to contain an organic component having a melting point lower than that of the constituent material.

  The modeling stage of the three-dimensional structure according to the fourth aspect of the present invention is characterized in that, in the third aspect, the organic film contains a component having a melting point higher than that of the constituent material.

  According to this aspect, the organic film contains a component having a melting point higher than that of the constituent material of the three-dimensional structure. For this reason, when degreasing or sintering a laminate of a three-dimensional structure formed on a modeling stage, the high melting point component remains as a release material on the modeling stage after degreasing or sintering, Can be particularly easily separated from the modeling stage.

  The modeling stage of the three-dimensional structure according to the fifth aspect of the present invention is characterized in that, in the third or fourth aspect, the organic film contains an acrylic resin.

  According to this aspect, the organic film contains an acrylic resin. Acrylic resin has a low melting point, and after degreasing and sintering, carbon derived from the acrylic resin does not easily remain on the modeling stage. Can be suppressed.

  The modeling stage of the three-dimensional structure according to the sixth aspect of the present invention, in the first or second aspect, constitutes the porous hole and has an average pore diameter of 1 μm or more formed on the forming surface. It is characterized by being 5 μm or less.

  The laminate of the three-dimensional structure shrinks with degreasing and sintering. If a large hole is formed on the formation surface on which the laminate of the three-dimensional structure is formed, the three-dimensional structure remains constrained in the three-dimensional structure when degreasing and sintering are performed. The stack of shaped objects contracts. For this reason, there exists a possibility that the laminated body of a three-dimensional structure may deform | transform with degreasing and sintering. However, according to this aspect, since the average pore diameter that forms the porous pores and is formed on the formation surface is 1 μm or more and 5 μm or less, three-dimensional modeling is performed on the pores when degreasing and sintering are performed. It is possible to prevent the laminate of the three-dimensional structure from contracting while the constituent material of the object enters and the constituent material is restrained. Therefore, it can suppress that a laminated body of a three-dimensional structure is deformed due to degreasing and sintering.

  In the modeling stage of the three-dimensional structure according to the seventh aspect of the present invention, in any one of the first to sixth aspects, the refractory material contains at least one of alumina, silicon carbide, and zirconia. It is characterized by.

  According to this aspect, the high melting point material includes at least one of alumina, silicon carbide, and zirconia. Since these have a high melting point and are not easily deformed even at high temperatures, it is particularly effective to suppress deformation of the laminate as the laminate of the three-dimensional structure formed on the modeling stage is degreased or sintered. be able to.

  The apparatus for manufacturing a three-dimensional structure according to the eighth aspect of the present invention provides a three-dimensional structure by forming the laminate on the forming surface of the modeling stage described in any one of the first to seventh aspects. It is characterized by manufacturing a product.

  According to this aspect, when degreasing and sintering a layered product of a three-dimensional structure formed by stacking layers on a modeling stage, the removal material volatilizes from the modeling stage side and from the modeling stage. The difference from the method of volatilization of the removal material can be reduced. Therefore, it is possible to suppress deformation of the laminate in accordance with degreasing and sintering the laminate of the three-dimensional structure formed by stacking layers on the modeling stage.

  The manufacturing method of the three-dimensional structure according to the ninth aspect of the present invention includes a stacked body forming step of forming the stacked body on the forming surface of the modeling stage described in any one of the first to seventh aspects. And an energy applying step for applying energy to the laminate.

  According to this aspect, when the laminate of the three-dimensional structure formed by laminating the layers on the modeling stage in the laminate forming process is degreased or sintered in the energy application process, the removal material from the modeling stage side The difference between the method of volatilization and the method of volatilization of the removal material from the modeling stage can be reduced. Therefore, it is possible to suppress deformation of the laminate in accordance with degreasing and sintering the laminate of the three-dimensional structure formed by stacking layers on the modeling stage.

  The manufacturing method of the three-dimensional structure according to the tenth aspect of the present invention is characterized in that, in the ninth aspect, after the energy application step, a heating step of sintering or melting the constituent material is performed.

  According to this aspect, the heating process for sintering or melting the constituent material is performed after the energy application process. For this reason, the laminated body of the three-dimensional structure degreased in the energy application step can be sintered or melted.

FIG. 1A is a schematic configuration diagram showing a configuration of a three-dimensional structure manufacturing apparatus according to an embodiment of the present invention. FIG. 1B is an enlarged view of a portion C shown in FIG. 1A. FIG. 2A is a schematic configuration diagram showing a configuration of a three-dimensional structure manufacturing apparatus according to an embodiment of the present invention. 2B is an enlarged view of a C ′ portion shown in FIG. 2A. 1 is a schematic perspective view of a head base according to an embodiment of the present invention. FIG. 4A is a plan view for conceptually explaining the relationship between the arrangement of the head unit and the formation form of the three-dimensional structure according to the embodiment of the present invention. FIG. 4B is a plan view for conceptually explaining the relationship between the arrangement of the head unit and the formation form of the three-dimensional structure according to the embodiment of the present invention. FIG. 4C is a plan view conceptually illustrating the relationship between the arrangement of the head unit and the formation form of the three-dimensional structure according to the embodiment of the present invention. FIG. 5A is a schematic diagram conceptually illustrating a formation form of a three-dimensional structure. FIG. 5B is a schematic diagram conceptually illustrating the formation form of the three-dimensional structure. FIG. 6A is a schematic diagram showing another example of the arrangement of the head unit arranged on the head base. FIG. 6B is a schematic diagram illustrating an example of another arrangement of the head unit arranged on the head base. Schematic showing the modeling stage which concerns on one Example of this invention. The flowchart of the manufacturing method of the three-dimensional structure based on one Example of this invention. Schematic showing the modeling stage which concerns on one Example of this invention. Schematic showing the modeling stage which concerns on one Example of this invention.

Embodiments according to the present invention will be described below with reference to the drawings.
FIG.1 and FIG.2 is a schematic block diagram which shows the structure of the manufacturing apparatus of the three-dimensional structure based on one Embodiment of this invention.
Here, the three-dimensional structure manufacturing apparatus of the present embodiment includes two types of material supply units (head bases). Among these, FIG. 1 is a diagram illustrating one material supply unit (a material supply unit that supplies a constituent material (a material including a powder, a solvent, and a binder constituting a three-dimensional structure)). FIG. 2 shows another material supply part (a material supply part that supplies a support part forming material that forms a support part that supports the three-dimensional structure when the three-dimensional structure is formed). FIG.
In addition, “three-dimensional modeling” in the present specification indicates that a so-called three-dimensional model is formed, and for example, a plate shape, a so-called two-dimensional shape, has a shape having a thickness. Forming is also included. Further, “support” means not only the case of supporting from the lower side, but also the case of supporting from the lateral side and, in some cases, the case of supporting from the upper side.
In addition, the three-dimensional structure manufacturing apparatus of the present embodiment forms a support layer for supporting the constituent layer when forming the constituent layer of the three-dimensional structure using the constituent material of the three-dimensional structure. It has a possible configuration. For this reason, it is a structure which can be formed, without deform | transforming the part (what is called an overhang part) which became convex shape in the direction which cross | intersects a lamination direction. However, it is not limited to such a configuration, and may be a configuration in which a support layer is not formed (that is, a configuration in which a support layer forming material is not used).

A three-dimensional structure manufacturing apparatus 2000 (hereinafter, referred to as a forming apparatus 2000) illustrated in FIGS. 1 and 2 includes a base 110 and a driving device 111 as a driving unit included in the base 110, and illustrated X, Y, The stage 120 is provided so as to be movable in the Z direction or driven in the rotation direction around the Z axis.
As shown in FIG. 1, a head base 1100 that holds a plurality of head units 1400 having one end portion fixed to the base 110 and having a constituent material discharge portion 1230 that discharges a constituent material to the other end portion. Is provided with a head base support 130.
In addition, as shown in FIG. 2, a support layer forming material discharge unit that discharges a support layer forming material that supports the three-dimensional structure to the other end, with one end fixed to the base 110. A head base support portion 730 on which a head base 1600 that holds a plurality of head units 1900 including 1730 is held and fixed.
Here, the head base 1100 and the head base 1600 are provided in parallel in the XY plane.
The constituent material discharge unit 1230 and the support layer forming material discharge unit 1730 have the same configuration. However, it is not limited to such a configuration.

A detachable modeling stage 121 is placed on the stage 120, and the layers 501, 502, and 503 in the process of forming the three-dimensional model stack 500 on the forming surface 121a (see FIG. 3) of the modeling stage 121. Is formed. The three-dimensional structure laminate 500 formed on the formation surface 121a of the modeling stage 121 is degreased (solvent or binder contained in the constituent material) by applying energy such as thermal energy after being formed by the forming apparatus 2000. And at least a part thereof are decomposed and removed) and sintering is performed. The three-dimensional structure laminate 500 is degreased and sintered in a thermostat 650 (see FIG. 7) capable of applying thermal energy as an energy applying device provided separately from the forming device 2000, and the like. It is performed with 121 set. For this reason, the modeling stage 121 is required to have high heat resistance. Therefore, by using, for example, a ceramic plate as the modeling stage 121, high heat resistance can be obtained, and the reactivity with the constituent material of the three-dimensional structure to be sintered (or melted) is also low. The alteration of the three-dimensional structure laminate 500 can be prevented. In FIG. 1A and FIG. 2A, for convenience of explanation, three layers 501, 502, and 503 are illustrated, but the shape of the desired three-dimensional structure laminate 500 (the layer 50 n in FIGS. 1A and 2A). Up to).
Here, the layers 501, 502, 503,... 50 n are respectively formed from a support layer forming material discharged from a support layer forming material discharge unit 1730 and a constituent material discharge unit 1230. And a constituent layer 310 formed of the constituent material to be discharged.

  FIG. 1B is an enlarged conceptual view of a C portion showing the head base 1100 shown in FIG. 1A. As shown in FIG. 1B, the head base 1100 holds a plurality of head units 1400. As will be described in detail later, one head unit 1400 is configured by holding a constituent material discharge unit 1230 included in the constituent material supply apparatus 1200 by a holding jig 1400a. The constituent material discharge unit 1230 includes a discharge nozzle 1230a and a discharge driving unit 1230b that discharges the constituent material from the discharge nozzle 1230a by the material supply controller 1500.

  FIG. 2B is an enlarged conceptual diagram of a C ′ portion showing the head base 1600 shown in FIG. 2A. Here, the head base 1600 has the same configuration as the head base 1100. Specifically, as shown in FIG. 2B, the head base 1600 holds a plurality of head units 1900. The head unit 1900 is configured by holding a support layer forming material discharge unit 1730 included in the support layer forming material supply apparatus 1700 by a holding jig 1900a. The support layer forming material discharge unit 1730 includes a discharge nozzle 1730a and a discharge driving unit 1730b that discharges the support layer forming material from the discharge nozzle 1730a by the material supply controller 1500.

  Although not provided in the forming apparatus 2000 of the present embodiment, the constituent material discharged from the constituent material discharging unit 1230 and the support layer forming material discharged from the support layer forming material discharging unit 1730 are degreased or baked. You may provide the energy provision part which can be tied. If such an energy provision part is provided, the necessity for preparing an energy provision apparatus separately can be eliminated. Although the structure of an energy provision part or an energy provision apparatus is not specifically limited, For example, in addition to the thermostat 650 etc. which can provide thermal energy, a laser irradiation part and the galvanometer mirror which positions the laser beam from this laser irradiation part are provided. Examples include a laser irradiation device and an irradiation device for electromagnetic waves (infrared rays, ultraviolet rays, etc.).

  As shown in FIG. 1, the constituent material discharge unit 1230 is connected by a constituent material supply unit 1210 that stores constituent materials corresponding to each of the head units 1400 held by the head base 1100 and a supply tube 1220. . Then, a predetermined constituent material is supplied from the constituent material supply unit 1210 to the constituent material discharge unit 1230. In the constituent material supply unit 1210, the constituent material of the laminate 500 of the three-dimensional structure formed by the forming apparatus 2000 according to the present embodiment is accommodated in the constituent material accommodating portion 1210a, and the individual constituent material accommodating portions 1210a are Each constituent material discharge unit 1230 is connected by a supply tube 1220. In this manner, by providing the individual constituent material accommodating portions 1210a, a plurality of different types of materials can be supplied from the head base 1100.

  As shown in FIG. 2, the support layer forming material discharge unit 1730 has a support layer forming material supply unit 1710 that contains a support layer forming material corresponding to each head unit 1900 held by the head base 1600. And a supply tube 1720. Then, a predetermined support layer forming material is supplied from the support layer forming material supply unit 1710 to the support layer forming material discharge unit 1730. In the support layer forming material supply unit 1710, a support layer forming material that constitutes a support layer when the laminate 500 of the three-dimensional structure is modeled is accommodated in the support layer forming material accommodating portion 1710a, and each support is provided. The layer forming material accommodating portion 1710 a is connected to each support layer forming material discharging portion 1730 by a supply tube 1720. As described above, by providing the individual support layer forming material accommodating portions 1710 a, a plurality of different types of support layer forming materials can be supplied from the head base 1600.

For example, magnesium (Mg), iron (Fe), cobalt (Co), chromium (Cr), aluminum (Al), titanium (Ti), copper (Cu), nickel (Ni) ) Or a mixed powder such as an alloy containing one or more of these metals (maraging steel, stainless steel, cobalt chromium molybdenum, titanium alloy, nickel alloy, aluminum alloy, cobalt alloy, cobalt chromium alloy) and a solvent. In addition, it can be used as a slurry (or paste) mixed material containing a binder.
In addition, general-purpose engineering plastics such as polyamide, polyacetal, polycarbonate, modified polyphenylene ether, polybutylene terephthalate, and polyethylene terephthalate can be used. In addition, engineering plastics such as polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, polyimide, polyamideimide, polyetherimide, and polyetheretherketone can also be used.
Thus, there is no limitation in particular in a constituent material and a support layer formation material, Metals other than the said metal, ceramics, resin, etc. can be used. Further, silicon dioxide, titanium dioxide, aluminum oxide, zirconium oxide and the like can be preferably used.

Examples of the solvent include water; (poly) alkylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether; ethyl acetate, n-propyl acetate, acetic acid acetates such as iso-propyl, n-butyl acetate and iso-butyl acetate; aromatic hydrocarbons such as benzene, toluene and xylene; methyl ethyl ketone, acetone, methyl isobutyl ketone, ethyl n-butyl ketone, diisopropyl ketone, acetylacetone Ketones such as ethanol; alcohols such as ethanol, propanol, butanol; tetraalkylammonium acetates; dimethyl sulfoxide, diethyl sulfoxide, etc. One type selected from these, including phosphine solvents; pyridine solvents such as pyridine, γ-picoline, and 2,6-lutidine; and ionic liquids such as tetraalkylammonium acetate (for example, tetrabutylammonium acetate). Alternatively, two or more kinds can be used in combination.
Examples of the binder include acrylic resin, epoxy resin, silicone resin, cellulosic resin, other synthetic resins, PLA (polylactic acid), PA (polyamide), PPS (polyphenylene sulfide), and other thermoplastic resins. Further, an ultraviolet curable resin that is polymerized by irradiation with ultraviolet rays may be used as the binder.

  The forming apparatus 2000 includes a constituent material discharge unit 1230 provided in the above-described stage 120 and constituent material supply apparatus 1200 based on modeling data of a three-dimensional structure that is output from a data output device such as a personal computer (not shown). In addition, a control unit 400 is provided as a control means for controlling the support layer forming material discharge unit 1730 provided in the support layer forming material supply apparatus 1700. Although not shown, the control unit 400 controls the stage 120 and the constituent material discharge unit 1230 to drive and operate in cooperation, and the stage 120 and the support layer forming material discharge unit 1730 operate and operate in cooperation. The control part which controls to do is provided.

The stage 120 movably provided on the base 110 is a signal for controlling the start and stop of movement of the stage 120, the movement direction, the movement amount, the movement speed, and the like in the stage controller 410 based on the control signal from the control unit 400. Is sent to the driving device 111 provided in the base 110, and the stage 120 moves in the X, Y, and Z directions shown in the figure. The constituent material discharge unit 1230 provided in the head unit 1400 controls the material discharge amount from the discharge nozzle 1230a in the discharge drive unit 1230b provided in the constituent material discharge unit 1230 in the material supply controller 1500 based on the control signal from the control unit 400. And a predetermined amount of the constituent material is discharged from the discharge nozzle 1230a by the generated signal.
Similarly, in the support layer forming material discharge unit 1730 provided in the head unit 1900, the discharge nozzle in the discharge drive unit 1730 b provided in the support layer forming material discharge unit 1730 in the material supply controller 1500 based on the control signal from the control unit 400. A signal for controlling the material discharge amount and the like from the 1730a is generated, and a predetermined amount of the support layer forming material is discharged from the discharge nozzle 1730a by the generated signal.

Next, the head unit 1400 will be described in more detail. The head unit 1900 has the same configuration as the head unit 1400. Therefore, a detailed description of the configuration of the head unit 1900 is omitted.
FIGS. 3 and 4 show an example of a holding form of a plurality of head units 1400 and constituent material discharge units 1230 held by the head base 1100. FIG. 4 shows the head base 1100 from the direction of arrow D shown in FIG. 1B. FIG.

As shown in FIG. 3, a plurality of head units 1400 are held on a head base 1100 by fixing means (not shown). Further, as shown in FIG. 4, in the head base 1100 of the forming apparatus 2000 according to the present embodiment, the first row head unit 1401, the second row head unit 1402, the third row from the bottom of the drawing. The head unit 1403 and the head unit 1404 in the fourth row are provided with head units 1400 in which four units are arranged in a staggered manner (alternately). 4A, the constituent material is discharged from each head unit 1400 while moving the stage 120 in the X direction with respect to the head base 1100, and the constituent layer constituent parts 50 (the constituent layer constituent parts 50a and 50b). , 50c and 50d) are formed. A procedure for forming the constituent layer constituent unit 50 will be described later.
Although not shown, the constituent material discharge unit 1230 included in each of the head units 1401 to 1404 is connected to the constituent material supply unit 1210 via a supply tube 1220 via the discharge drive unit 1230b.

As shown in FIG. 3, the constituent material discharge unit 1230 discharges the material M, which is a constituent material of the three-dimensional structure, from the discharge nozzle 1230 a toward the formation surface 121 a of the modeling stage 121 placed on the stage 120. The The head unit 1401 illustrates a discharge form in which the material M is discharged in the form of droplets, and the head unit 1402 illustrates a discharge form in which the material M is supplied in a continuous form. The discharge form of the material M may be either a droplet form or a continuous form, but in the present embodiment, the material M is described as a form discharged in the form of a droplet.
The constituent material discharge unit 1230 and the support layer forming material discharge unit 1730 are not limited to such a configuration, and may be a material supply unit of a different method such as an extruder.

  The material M ejected in the form of droplets from the ejection nozzle 1230 a flies in a substantially gravitational direction and lands on the modeling stage 121. The stage 120 moves, and the constituent layer constituting part 50 is formed by the landed material M. The assembly of the constituent layer constituent portions 50 is formed as the constituent layer 310 (see FIG. 1) of the three-dimensional structure laminate 500 formed on the forming surface 121a of the modeling stage 121.

Next, a procedure for forming the constituent layer constituent unit 50 will be described with reference to FIGS. 4 and 5.
FIG. 4 is a plan view for conceptually explaining the relationship between the arrangement of the head unit 1400 of the present embodiment and the formation form of the constituent layer constituting unit 50. FIG. 5 is a side view conceptually showing the form of formation of the constituent layer constituting section 50.

First, when the stage 120 moves in the + X direction, the material M is discharged in droplets from the plurality of discharge nozzles 1230a, the material M is disposed at a predetermined position on the forming surface 121a of the modeling stage 121, and the constituent layer constituent unit 50 Is formed.
More specifically, as shown in FIG. 5A, first, the material is moved from the plurality of discharge nozzles 1230a to a predetermined position on the forming surface 121a of the modeling stage 121 at a constant interval while moving the stage 120 in the + X direction. Place M.

Next, as illustrated in FIG. 5B, the material M is newly disposed so as to fill the space between the materials M disposed at a constant interval while moving the stage 120 in the −X direction illustrated in FIG. 1.
However, a configuration in which the material M overlaps a predetermined position of the modeling stage 121 from a plurality of discharge nozzles 1230a while moving the stage 120 in the + X direction (so as not to leave a gap) (in the X direction of the stage 120) Instead of a configuration in which the constituent layer constituent unit 50 is formed by reciprocal movement, a configuration in which the constituent layer constituent unit 50 is formed only by moving one side of the stage 120 in the X direction may be employed.

  By forming the constituent layer constituting part 50 as described above, the head units 1401, 1402, 1403 and 1404 corresponding to one line in the X direction (first line in the Y direction) as shown in FIG. 4A. A constituent layer constituent part 50 (constituent layer constituent parts 50a, 50b, 50c and 50d) is formed.

Next, in order to form the second layer constituent layer constituent unit 50 ′ (the constituent layer constituent units 50a ′, 50b ′, 50c ′, and 50d ′) in the Y direction of the head units 1401, 1402, 1403, and 1404, − The head base 1100 is moved in the Y direction. When the pitch between the nozzles is P, the movement amount is moved in the −Y direction by P / n (n is a natural number) pitch. In this embodiment, n is assumed to be 3.
By performing the same operation as described above as shown in FIG. 5A and FIG. 5B, the constituent layer constituent unit 50 ′ (constituent layer constituent unit 50a) of the second line in the Y direction as shown in FIG. 4B is obtained. ', 50b', 50c 'and 50d') are formed.

Next, the third layer constituent layer constituent unit 50 ″ (the constituent layer constituent units 50a ″, 50b ″, 50c ″, and 50d ″) of each head unit 1401, 1402, 1403, and 1404 in the Y direction is inserted. In order to form, the head base 1100 is moved in the −Y direction. The movement amount is moved in the −Y direction by P / 3 pitch.
Then, by performing the same operation as described above as shown in FIG. 5A and FIG. 5B, the constituent layer constituting unit 50 ″ for the third line in the Y direction as shown in FIG. 4C.
(Constituent layer constituent portions 50a ″, 50b ″, 50c ″ and 50d ″) are formed, and the constituent layer 310 can be obtained.

  Further, the material M discharged from the component material discharge unit 1230 can be discharged from one of the head units 1401, 1402, 1403, and 1404, or a component different from the other head units. Therefore, by using the forming apparatus 2000 according to this embodiment, a three-dimensional structure formed from different materials can be obtained.

  In the first layer 501, before or after the formation of the constituent layer 310 as described above, the support layer forming material is discharged from the support layer forming material discharge portion 1730, and the support layer is formed in the same manner. Layer 300 can be formed. When the layers 502, 503,... 50n are stacked on the layer 501, the constituent layer 310 and the support layer 300 can be similarly formed.

  The number and arrangement of the head units 1400 and 1900 included in the forming apparatus 2000 according to the present embodiment described above are not limited to the number and arrangement described above. FIG. 6 schematically shows an example of another arrangement of the head unit 1400 arranged on the head base 1100 as an example.

  FIG. 6A shows a form in which a plurality of head units 1400 are arranged in parallel with the head base 1100 in the X-axis direction. FIG. 6B shows a form in which the head units 1400 are arranged in a grid pattern on the head base 1100. Note that the number of head units arranged in each case is not limited to the example shown.

Next, the modeling stage 121 which is a main part of the forming apparatus 2000 according to the above-described embodiment will be described in more detail.
FIG. 7 is a schematic diagram illustrating the modeling stage 121 of this embodiment. Specifically, the modeling stage 121 on which the three-dimensional modeled laminate 500 is formed is set in a thermostatic chamber 650 as an energy applying device and degreased.

The modeling stage 121 of the present embodiment is used in the forming apparatus 2000 that manufactures a three-dimensional structure by stacking layers and forming a three-dimensional structure stack 500 as described above, and is represented in FIG. As shown in the figure, it has a forming surface 121a on which a three-dimensional structure laminate 500 is formed.
The modeling stage 121 is configured to be porous with a high melting point material having a higher melting point than the constituent material of the three-dimensional structure. For this reason, the modeling stage 121 of the present embodiment starts from the modeling stage 121 side (downward) when degreasing and sintering the three-dimensional structure stack 500 formed by stacking layers on the modeling stage 121. The difference (that is, the difference in shrinkage rate) between the method of volatilization of the removal material (solvent, binder, etc. contained in the constituent material) and the method of volatilization of the removal material from the modeling stage 121 (upward and lateral directions) is reduced. It can be configured. Therefore, it is possible to suppress deformation of the three-dimensional structure laminate 500 by degreasing and sintering the three-dimensional structure laminate 500 formed by stacking layers on the modeling stage 121. It is configured to be able to.
Note that the arrows in FIG. 7 conceptually represent the direction in which the removal material volatilizes. When the modeling stage 121 is not configured to be porous, the removal material is hardly volatilized (downward arrow) from the modeling stage 121 side, and the modeling stage 121 side is less contracted than the other parts.

Further, the modeling stage 121 of this embodiment is detachable from the forming apparatus 2000, and an organic film 600 having a melting point lower than that of the constituent material is formed on the forming surface 121a. For this reason, for example, the organic film 600 is degreased and sintered at a temperature lower than the melting point of the constituent material of the three-dimensional structure and higher than the melting point of the organic film 600. Can be removed together with the removal material, and the three-dimensional structure laminate 500 can be particularly effectively prevented from being deformed, and the three-dimensional structure 500 after degreasing and sintering can be easily removed from the modeling stage 121. It can be separated into two. This is because, when degreased or sintered, the laminate 500 of the three-dimensional structure is shrunk, but by forming the organic film 600, degreasing and sintering are performed while the constituent materials are constrained by the unevenness of the formation surface 121a. It is because it can suppress that the laminated body 500 of a three-dimensional molded item shrink | contracts by this. In particular, when the modeling stage 121 is configured to be porous as in the present embodiment, the unevenness of the formation surface 121a tends to increase, and thus the effect of forming the organic film 600 is particularly great.
Furthermore, by making the modeling stage 121 detachable with respect to the forming apparatus 2000, when the laminate 500 of the three-dimensional structure is moved to the energy applying apparatus (constant temperature bath 650) in order to perform degreasing and sintering, The modeling stage 121 can be moved. For this reason, it can suppress that the laminated body 500 of this three-dimensional structure is damaged in connection with removing the laminated body 500 of the three-dimensional structure from the modeling stage 121 in order to set to the thermostat 650.
Needless to say, the modeling stage 121 on which the organic film 600 is formed in advance may be prepared, and the three-dimensional modeled laminate 500 may be formed on the modeling stage 121. However, a modeling stage 121 in which the organic film 600 is not formed in advance is prepared, and the support layer forming material is discharged from the support layer forming material discharge unit 1730 prior to the formation of the three-dimensional structure stack 500. The organic film 600 may be formed on the formation surface 121a, and then the three-dimensional structure laminate 500 may be formed. And it goes without saying that the modeling stage 121 in which the organic film 600 is formed on the formation surface 121a in this way is also included in the present invention.
Further, “an organic film having a melting point lower than that of the constituent material” means a film that covers at least a part of the formation surface 121a and needs to include an organic component having a melting point lower than that of the constituent material.

Here, the organic film 600 formed on the modeling stage 121 of the present embodiment contains an acrylic resin. Since the acrylic resin has a low melting point and the carbon derived from the acrylic resin hardly remains on the modeling stage 121 after degreasing and sintering, carbon as an impurity is present in the laminate 500 of the three-dimensional structure after degreasing and sintering. Mixing can be suppressed.
However, the formation component of the organic film 600 is not particularly limited, and an acrylic resin as well as a polyester resin can be used, and a plurality of types of resins may be contained.

The organic film 600 may contain a component having a melting point higher than that of the constituent materials. If the organic film 600 contains a component having a melting point higher than that of the constituent material, after degreasing and sintering the laminate 500 of the three-dimensional structure formed on the modeling stage 121, In this case, the high melting point component remains evenly on the modeling stage 121 as a release material on the modeling stage 121, and the laminate 500 of the three-dimensional model can be separated from the modeling stage 121 particularly easily (in a short time). Because.
In addition, although there is no limitation in particular about "the component of melting | fusing point higher than a constituent material", ceramics (Alumina, silicon carbide, zirconia, etc.) can be used, for example.

  The high melting point material in the modeling stage 121 preferably includes at least one of alumina, silicon carbide, and zirconia. Since these have a high melting point and are not easily deformed even at high temperatures, the three-dimensional structure laminate 500 is deformed as the three-dimensional structure laminate 500 formed on the modeling stage 121 is degreased or sintered. This is because this can be suppressed particularly effectively.

Thus, the forming apparatus 2000 according to the present embodiment manufactures a three-dimensional structure by forming the three-dimensional structure laminate 500 on the forming surface 121a of the modeling stage 121. And by such a structure, when degreasing and sintering the laminate 500 of the three-dimensional structure formed by stacking layers on the modeling stage 121, the removal material volatilizes from the modeling stage 121 side. This makes it possible to reduce the difference from the method of volatilization of the removal material from the modeling stage 121. Therefore, the forming apparatus 2000 according to the present embodiment is configured to degrease and sinter the three-dimensional structure laminated body 500 formed by stacking layers on the modeling stage 121, so that the three-dimensional structure laminated body is obtained. It is the structure which can suppress that 500 deform | transforms.
Furthermore, in the forming apparatus 2000 of the present embodiment, the organic film 600 having a melting point lower than that of the constituent material of the three-dimensional structure is formed on the forming surface 121a of the modeling stage 121 that can be detached from the apparatus. With the degreasing and sintering of the three-dimensional structure laminate 500, the organic film 600 can be removed together with the removal material, and the three-dimensional structure stack 500 can be easily separated from the modeling stage. It has become.

Next, an example of a manufacturing method of a three-dimensional structure performed using the forming apparatus 2000 will be described using a flowchart.
Here, FIG. 8 is a flowchart of the manufacturing method of the three-dimensional structure according to the present embodiment.

  As shown in FIG. 8, in the three-dimensional structure manufacturing method of the present embodiment, first, in step S <b> 110, data of the three-dimensional structure is acquired. Specifically, for example, data representing the shape of the three-dimensional structure is acquired from an application program or the like executed on a personal computer.

  Next, in step S120, data for each layer is generated. Specifically, in the data representing the shape of the three-dimensional structure, it is sliced according to the modeling resolution in the Z direction, and bitmap data (cross section data) is generated for each section.

  Next, when the modeling stage 121 on which the organic film 600 is not formed is prepared, in step S130, the support layer forming material is discharged from the support layer forming material discharge unit 1730 to form the organic film 600 on the forming surface 121a. To do. However, this step can be omitted when the modeling stage 121 in which the organic film 600 is formed in advance is prepared.

Next, in step S140, the three-dimensional structure laminate 500 is formed based on the data for each layer generated in step S120. In step S150, steps S140 and S150 are repeated until the data for each layer is completed, and the three-dimensional structure 500 is completed on the formation surface 121a of the modeling stage 121.
In addition, in step S140 to step S150, in the three-dimensional structure manufacturing method of the present embodiment, the solvent 500 is volatilized naturally without applying energy to form the three-dimensional structure stack 500 (constituent layer). Although the component 50 is fixed), the component layer component 50 may be fixed by applying energy such as heating.

  Next, in step S160, the three-dimensional structure laminate 500 together with the modeling stage 121 is taken out from the forming apparatus 2000, and this is set in a thermostat 650 as an energy applying apparatus to apply energy (heat). In this step, the organic components of the organic film 600 are decomposed and removed.

And finally, by step S170, the output of the energy of the thermostat 650 is raised, the laminated body 500 of a three-dimensional structure is heated, and the manufacturing method of the three-dimensional structure of a present Example is complete | finished.
In addition, when step S160 is an energy application process corresponding to degreasing, step S170 corresponds to a heating process corresponding to condensation or melting, and when step S160 is an energy application process corresponding to degreasing and condensation. Step S170 corresponds to a heating process corresponding to melting. Further, when the three-dimensional structure laminate 500 is completed by degreasing or condensing, the step S170 can be omitted when there is no need for condensation or melting.

Thus, the manufacturing method of the three-dimensional structure according to the present embodiment includes a stacked body forming step (step S140) of forming the three-dimensional structure stacked body 500 on the forming surface 121a using the modeling stage 121 described above. And an energy applying step (step S160) for applying energy to the laminate 500 of the three-dimensional structure.
For this reason, the three-dimensional structure laminate 500 formed by laminating layers on the modeling stage 121 (configured to be porous with a high melting point material having a higher melting point than that of the constituent materials) in the laminate formation step. When degreasing and sintering in the energy application step, the method of volatilization of the removal material from the modeling stage 121 side (downward) and the method of volatilization of the removal material from the modeling stage 121 (upward and lateral directions) The difference can be reduced. Therefore, it is possible to suppress deformation of the three-dimensional structure laminate 500 by degreasing and sintering the three-dimensional structure laminate 500 formed by stacking layers on the modeling stage 121. Can do.
Furthermore, a three-dimensional structure laminate 500 formed by laminating layers on the modeling stage 121 in the laminate formation step (the organic film 600 having a melting point lower than that of the constituent material is formed on the formation surface 121a). As a result of degreasing and sintering in the energy application step, the organic film 600 can be removed together with the removal material, and the three-dimensional structure laminate 500 can be easily separated from the modeling stage 121.

  Moreover, the manufacturing method of the three-dimensional structure according to the present embodiment may execute the organic film forming step (step S130) for forming the organic film 600 on the forming surface 121a before the stacked body forming step (step S140). it can. For this reason, the modeling stage 121 in which the organic film 600 is not formed in advance can be used.

  Moreover, the manufacturing method of the three-dimensional structure of a present Example can perform the heating process (step S170) which sinters or fuse | melts the constituent material of a three-dimensional structure after an energy provision process (step S160). For this reason, the laminate 500 of the three-dimensional structure that has been degreased in the energy application step can be sintered or melted.

In the modeling stage 121 of the above embodiment, the organic film 600 having a melting point lower than that of the constituent material is formed on the formation surface 121a. However, the present invention is not limited to such a configuration.
Here, FIGS. 9 and 10 are schematic views showing the modeling stage 121 having a configuration different from the modeling stage 121 of the above-described embodiment, and are diagrams corresponding to FIG. 7 in the modeling stage 121 of the above-described embodiment.

The modeling stage 121 shown in FIG. 7 is configured to be porous, and is formed when degreasing and sintering the three-dimensional structure stack 500 formed by stacking layers on the modeling stage 121. Difference between how the removal material (solvent, binder, etc. included in the constituent material) volatilizes from the stage 121 side (downward direction) and how the removal material volatilizes from the modeling stage 121 (upward and lateral directions) ( That is, the difference in shrinkage rate) can be reduced. This is based on the fact that the volatile component (removal material) can move to the pores associated with the porosity of the modeling stage 121 configured to be porous. Further, the holes are connected, and, for example, as shown by an arrow in FIG. 7, the formation surface 121a side (upper side) communicates with a side (lower side) different from the formation surface 121a side. Particularly effectively, the difference in volatilization can be reduced between the modeling stage 121 side (downward) and the modeling stage 121 (upward and lateral directions).
Here, the modeling stage 121 shown in FIG. 9 also communicates from the forming surface 121a side (upper side) to the side (lower side) different from the forming surface 121a side, like the modeling stage 121 shown in FIG. It is configured to be porous.

Here, the modeling stage 121 shown in FIG. 9 is different from the modeling stage 121 shown in FIG. 7 in that the organic film 600 is not formed on the formation surface 121a. In the case of such a configuration, if the pore diameter of the pores formed on the formation surface 121a is large, the constituent material of the three-dimensional structure enters the pores when degreasing and sintering are performed. The laminated body of the three-dimensional structure shrinks while the constituent materials are restrained. For this reason, there exists a possibility that the laminated body of a three-dimensional structure may deform | transform with degreasing and sintering.
However, the modeling stage 121 shown in FIG. 9 constitutes porous pores and has an average pore diameter of 1 μm or more and 5 μm or less formed on the formation surface 121a. The average pore diameter can be determined by, for example, a mercury intrusion method. By setting the average pore diameter to 1 μm or more, the solvent, the binder, and the like can be sufficiently volatilized from the lower side of the modeling stage 121. Moreover, by setting the average pore diameter to 5 μm or less, it is possible to prevent the constituent material of the three-dimensional structure from entering the pores, and when performing degreasing and sintering, the constituent material of the three-dimensional structure is contained in the pores. It can suppress that the laminated body of a three-dimensional molded item shrink | contracts, being restrained. That is, the modeling stage 121 shown in FIG. 9 can sufficiently evaporate a solvent, a binder, and the like from the lower side of the modeling stage 121, and suppress the deformation of the laminate of the three-dimensional structure with degreasing and sintering. It can be configured.

  The determination as to whether or not the structure is porous so as to communicate from the formation surface 121a side to a side different from the formation surface 121a side is performed by, for example, dropping a liquid such as ethanol on the formation surface 121a. It can be executed by confirming whether or not the liquid soaks into the surface opposite to the surface.

9 is configured to communicate from the upper side to the lower side, similar to the modeling stage 121 illustrated in FIG. 7, the modeling stage 121 illustrated in FIG. Not only the lower side from the region where the stacked body 500 is provided on the upper formation surface 121a side, but also the region where the stacked body 500 is not provided on the side surface and the formation surface 121a side.
Like the modeling stage 121 shown in FIG. 10, the formation surface 121a side may be configured to be porous so as to communicate with a side different from the formation surface 121a side from the region where the stacked body 500 is provided. . Here, the “different side” means that the laminated body 500 is not provided on the lower side, the side surface side, and the formation surface 121a side when the portion where the laminated body 500 is provided on the formation surface 121a side is the upper side. At least a portion of the region.
As described above, at least one of the region where the stacked body 500 is provided on the formation surface 121a side, the lower side, the side surface, and the region where the stacked body 500 is not provided on the formation surface 121a side communicates. Is preferred.
However, if it is “porous”, there are many holes, and volatile components can escape through the many holes, so they are not in communication (the laminated body 500 on the formation surface 121a side is provided). The structure which the hole which comprises porous from the area | region to the different side is not connected may be sufficient.

  The present invention is not limited to the above-described embodiments, and can be realized with various configurations without departing from the spirit of the present invention. For example, the technical features in the embodiments corresponding to the technical features in the embodiments described in the summary section of the invention are intended to solve part or all of the above-described problems, or one of the above-described effects. In order to achieve part or all, replacement or combination can be appropriately performed. Further, if the technical feature is not described as essential in the present specification, it can be deleted as appropriate.

50, 50 a, 50 b, 50 c, 50 d ... constituent layer constituent part, 110 ... base,
111 ... Drive device, 120 ... Stage, 121 ... Modeling stage, 121a ... Forming surface,
130 ... head base support, 300 ... support layer, 310 ... component layer,
400 ... control unit, 410 ... stage controller,
500 ... Laminated body of three-dimensional structure, 501, 502 and 503 ... layer, 600 ... organic film,
650 ... constant temperature bath, 730 ... head base support, 1100 ... head base,
1200 ... constituent material supply device, 1210 ... constituent material supply unit,
1210a ... Constituent material storage unit, 1220 ... Supply tube, 1230 ... Constituent material discharge unit,
1230a ... discharge nozzle, 1230b ... discharge drive unit, 1400 ... head unit,
1400a ... Holding jig, 1401, 1402, 1403, 1404 ... Head unit,
1500 ... Material supply controller, 1600 ... Head base,
1700: Support layer forming material supply device, 1710: Support layer forming material supply unit,
1710a: Support layer forming material container, 1720: Supply tube,
1730: Material discharge part for forming a support layer, 1730a: Discharge nozzle,
1730b ... Discharge drive unit, 1900 ... head unit, 1900a ... holding jig,
2000 ... Forming device (manufacturing device for three-dimensional structure), M ... Material (constituent material)

Claims (10)

It is used in a three-dimensional structure manufacturing apparatus that manufactures a three-dimensional structure by stacking layers to form a laminate,
Having a formation surface on which the laminate is formed;
A modeling stage for a three-dimensional structure, characterized by being made of a high melting point material having a higher melting point than that of the constituent material of the three-dimensional structure. It is used in a three-dimensional structure manufacturing apparatus that manufactures a three-dimensional structure by stacking layers to form a laminate,
Having a formation surface on which the laminate is formed;
The three-dimensional structure is made of a high melting point material having a melting point higher than that of the constituent material of the three-dimensional structure, and is porous so as to communicate from the forming surface side to a side different from the forming surface side. Modeling stage. In the modeling stage described in claim 1 or 2,
Detachable from the manufacturing apparatus,
A modeling stage of a three-dimensional structure, wherein an organic film having a melting point lower than that of the constituent material is formed on the forming surface. In the modeling stage described in claim 3,
The organic film contains a component having a melting point higher than that of the constituent material. In the modeling stage described in claim 3 or 4,
The modeling stage of the three-dimensional structure, wherein the organic film contains an acrylic resin. In the modeling stage described in claim 1 or 2,
A modeling stage for a three-dimensional structure, which constitutes the porous holes and has an average pore diameter of 1 μm or more and 5 μm or less formed on the forming surface. In the modeling stage described in any one of Claim 1 to 6,
The three-dimensional structure modeling stage, wherein the high melting point material includes at least one of alumina, silicon carbide, and zirconia.   An apparatus for manufacturing a three-dimensional structure, wherein the three-dimensional structure is manufactured by forming the laminate on the forming surface of the modeling stage according to any one of claims 1 to 7. A laminate forming step of forming the laminate on the forming surface of the modeling stage according to any one of claims 1 to 7,
An energy application step of applying energy to the laminate;
The manufacturing method of the three-dimensional structure characterized by having. In the manufacturing method of the three-dimensional structure according to claim 9,
The manufacturing method of the three-dimensional structure characterized by performing the heating process which sinters or fuse | melts the said structural material after the said energy provision process.

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