JP2018006716A - Substrate assembly, and air conditioning system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain dew condensation water from attaching to a lead part of a heat-generating electronic component, even in the case where condensation occurs on a block made of a heat transfer material.SOLUTION: A substrate assembly A comprises: a tabular substrate body 32; a heat-generating electronic component 33H mounted on the substrate body 32; a cooling block 40 provided so as to come into contact with the heat-generating electronic component 33H; a coolant pipe 2 which is provided so as to come into contact with the cooling block 40 and through which coolant cooling the cooling block 40 flows; and grooves 50A, 50B, 50C defined between step parts 47A, 47B, 48A which are formed on a portion in contact with the heat-generating electronic component 33H and the heat-generating electronic component 33H in the cooling block 40.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a substrate assembly and an air conditioning system.

  In many cases, an air conditioning system such as an air conditioner uses a highly exothermic electronic component such as a power transistor as a part of a controller that controls its operation. It is known that the operation of highly exothermic electronic components such as power transistors becomes unstable due to overheating. Therefore, such a highly heat-generating electronic component is cooled in order to stabilize its operation.

  As a method for cooling highly exothermic electronic components such as a power transistor, there are an air cooling method and a refrigerant cooling method. The air cooling system cools highly exothermic electronic parts by sending wind taken from outside by a cooling fan or the like. On the other hand, the refrigerant cooling system cools highly exothermic electronic components with a refrigerant such as cooling water flowing in the pipe. In general, this refrigerant cooling system can improve the cooling performance more than the air cooling system. Therefore, when sufficient cooling cannot be performed by the air cooling method, the refrigerant cooling method is adopted.

  In Patent Document 1, a plurality of highly exothermic electronic components mounted on a substrate are brought into contact with different surfaces of one heat transfer material block, and the heat transfer material block is cooled by a refrigerant flowing through a refrigerant pipe. Thus, a technique for simultaneously cooling a plurality of highly exothermic electronic components is disclosed.

JP 2016-18156 A

The above-described highly exothermic electronic component may be provided in an outdoor unit or the like of an air conditioning system. Therefore, when the heat transfer material block is cooled by the refrigerant flowing in the refrigerant pipe, dew condensation is likely to occur on the surface of the heat transfer material block due to moisture in the outside air.
For this reason, in the heat transfer material block described in Patent Document 1, condensed water (hereinafter referred to as “condensation water” as appropriate) travels along the surface of the heat transfer material block by its own weight. There is a possibility of reaching the lead part. When condensed water adheres to the lead portion of the highly exothermic electronic component, the heat transfer material block and the lead portion may be short-circuited. Furthermore, when the heat transfer material block is grounded, the lead portion may be grounded by electrically connecting the heat transfer material block and the lead portion.
The present invention has been made in view of the above circumstances, and is a substrate capable of suppressing the condensation water from adhering to the lead portion of the highly heat-generating electronic component even when condensation occurs in the heat transfer material block. The object is to provide an assembly and air conditioning system.

The present invention employs the following means in order to solve the above problems.
According to the first aspect of the present invention, the substrate assembly includes a substrate body, a heat generating electronic component mounted on the substrate body, and a heat transfer material block provided so as to contact the heat generating electronic component. Heat transfer material block is provided so as to be able to transfer heat, and a refrigerant pipe in which a refrigerant flows therein, the heat transfer material block is formed in a portion that contacts the heat-generating electronic component, A step portion for forming a groove is provided between the heat-generating electronic component.

  By comprising in this way, a refrigerant | coolant and heat-emitting electronic components are heat-exchanged by the refrigerant | coolant which flows through refrigerant | coolant piping via a heat-transfer material block, and the temperature rise of a heat-generating electronic component is suppressed. Further, when the heat transfer material block is cooled by the refrigerant flowing through the refrigerant pipe, condensation may occur on the surface of the heat transfer material block. However, the generated dew condensation water flows into a groove formed between the step portion formed at the portion that contacts the heat-generating electronic component in the heat transfer material block and the heat-generating electronic component. Thereby, it can suppress that dew condensation water flows to the lead part side of an exothermic electronic component, and can suppress adhering to the lead part of an exothermic electronic component.

According to the second aspect of the present invention, at least the heat transfer material block of the substrate assembly according to the first aspect is such that the dew condensation water generated on the surface of the heat transfer material block is generated in the groove. It may be provided so as to be inclined with respect to the vertical direction so as to be guided to the side away from the component.
With this configuration, the dew condensation water that has flowed into the groove is guided to the side away from the heat-generating electronic component inside the groove, so that it is more difficult to adhere to the lead portion of the heat-generating electronic component.

According to the third aspect of the present invention, an air conditioning system includes a compressor that compresses a refrigerant, a substrate assembly according to the first aspect that drives the compressor, and an outdoor unit that performs heat exchange between the refrigerant and outside air. An outdoor unit having a heat exchanger, and an indoor unit having an indoor heat exchanger that exchanges heat between the refrigerant and room air.
With this configuration, in the substrate assembly, the dew condensation water generated on the surface of the heat transfer material block cooled by the refrigerant flowing through the refrigerant pipe is transferred toward the lead portion due to its own weight or the like. It flows into a groove formed between the step formed in the heat-material block and the heat-generating electronic component. Therefore, it can suppress that dew condensation water adheres to the lead part of exothermic electronic components. Therefore, it is possible to suppress the occurrence of dielectric breakdown in the heat-generating electronic component and to improve the reliability of the air conditioning system.

According to the fourth aspect of the present invention, a mounting surface of the heat-generating electronic component in the board body of the air conditioning system according to the third aspect is formed so as to extend in a vertical direction, and the heat transfer material block is formed. The dew condensation water generated on the surface of the heat transfer material block may be provided so as to be inclined with respect to the substrate body so as to be guided to the side away from the heat-generating electronic component inside the groove.
In this way, the heat transfer material block is inclined with respect to the mounting surface of the substrate body extending in the vertical direction, so that the dew condensation water generated on the surface of the heat transfer material block It can be led to the side away from the part. Thereby, it can suppress that dew condensation water adheres to the lead part of a heat-generating electronic component.

According to a fifth aspect of the present invention, in the air conditioning system according to the third aspect, in the substrate assembly, the dew condensation water generated on the surface of the heat transfer material block is generated in the heat generating electronic component inside the groove. It may be provided so as to be inclined with respect to the vertical direction so as to be guided to the side separated from the vertical direction.
In this way, the substrate body and the heat transfer material block constituting the substrate assembly are inclined with respect to the vertical direction, so that dew condensation water generated on the surface of the heat transfer material block can be generated inside the groove. It can be led to the side away from the lead part of the component.

According to a sixth aspect of the present invention, in the air-conditioning system according to any one of the third to fifth aspects, the heat transfer material block extends in the vertical direction and extends from below to above. It may be provided so as to be gradually separated from the substrate body side.
When the heat transfer material block is provided so as to extend in the vertical direction as described above, the heat transfer material block is provided so as to be gradually separated from the substrate main body side from the lower side to the upper side. Condensed water generated on the surface of the block made of material can be guided to the side away from the lead portion of the heat-generating electronic component inside the groove.

According to a seventh aspect of the present invention, in the air-conditioning system according to any one of the third to fifth aspects, the heat transfer material block is continuous in a direction inclined with respect to the horizontal direction. And inclined so as to be gradually separated from the substrate body side from below to above.
In this way, when the heat transfer material block is provided so as to be inclined with respect to the horizontal direction, the heat transfer material block is inclined so as to be gradually separated from the substrate body side from the lower side to the upper side. By providing, the dew condensation water produced on the surface of the block made of heat transfer material can be guided to the side away from the lead portion of the heat-generating electronic component inside the groove.

  According to the substrate assembly and the air conditioning system, it is possible to prevent the condensed water from adhering to the lead portion of the heat-generating electronic component even when condensation occurs in the heat transfer material block.

It is a mimetic diagram showing the whole air harmony system composition in an embodiment of this invention. It is a front view which shows the controller of the air conditioning system in 1st embodiment. It is XX arrow sectional drawing of FIG. FIG. 3 is a side view of FIG. 2. It is sectional drawing which shows the structure of the modification of the board | substrate assembly in said 1st embodiment. It is a front view which shows the structure of the controller of the air conditioning system in 2nd embodiment. It is a YY arrow sectional drawing of FIG.

Next, a substrate assembly and an air conditioning system according to an embodiment of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a schematic diagram showing an overall configuration of an air conditioning system according to an embodiment of the present invention. FIG. 2 is a front view showing a controller of the air conditioning system. 3 is a cross-sectional view taken along the line XX of FIG. FIG. 4 is a side view of FIG.
As shown in FIG. 1, the air conditioning system 1 of the first embodiment includes an outdoor unit 10 and an indoor unit 20.

The indoor unit 20 includes an indoor fan 21 and an indoor heat exchanger 22.
The indoor fan 21 sends room air into the indoor heat exchanger 22.
The indoor heat exchanger 22 exchanges heat between the refrigerant and the indoor air sent by the indoor fan 21.

The outdoor unit 10 includes a compressor 11, a four-way switching valve 12, an outdoor fan 13, an outdoor heat exchanger 14, an electronic expansion valve 15, an accumulator 16, and a controller 30.
The compressor 11 is driven by a compressor motor (not shown) and compresses the refrigerant to increase the pressure.
The four-way switching valve 12 is formed so as to be able to switch the flow direction of the refrigerant in the refrigeration cycle 3 of the air conditioning system 1.
The outdoor heat exchanger 14 exchanges heat between the refrigerant and the outside air sent by the outdoor fan 13.
The electronic expansion valve 15 adiabatically expands the refrigerant.

  Furthermore, the compressor 11, the four-way switching valve 12, the outdoor heat exchanger 14, the electronic expansion valve 15 and the accumulator 16 that constitute the outdoor unit 10, and the indoor heat exchanger 22 that constitutes the indoor unit 20 are connected by the refrigerant pipe 2. It is connected. Thus, a closed cycle refrigeration cycle 3 is configured in the air conditioning system 1.

  The controller 30 controls the operation of the air conditioning system 1 based on an operation command from operation means (not shown) such as a remote controller. The controller 30 includes an inverter circuit that controls the rotational speed of a compressor motor (not shown) that drives the compressor 11. Further, the controller 30 performs switching control of the four-way switching valve 12 according to the operation mode, rotational speed control of the outdoor fan 13 and indoor fan 21, and opening degree control of the electronic expansion valve 15.

  The controller 30 is accommodated in the casing 18 of the outdoor unit 10. The internal space of the casing 18 is partitioned into a heat exchanger chamber 18h and a machine chamber 18m by a partition plate 18p. The controller 30 is installed in the machine room 18m together with the compressor 11, the four-way switching valve 12, the electronic expansion valve 15, the accumulator 16, and the like. The outdoor fan 13 and the outdoor heat exchanger 14 are installed in the heat exchanger chamber 18h.

As shown in FIGS. 2 to 4, the controller 30 includes a controller main body 31 and a substrate assembly A.
The controller body 31 is fixed to the casing 18 and the partition plate 18p of the outdoor unit 10 shown in FIG. 1 via brackets (not shown).

The substrate assembly A includes a substrate body 32, an electronic component 33, and a cooling block (heat transfer material block) 40.
As shown in FIG. 4, the substrate body 32 is plate-shaped and is fixed to the controller body 31 via support members 35A and 35B. In this embodiment, the substrate body 32 has a substrate surface (mounting surface) 32f that stands up with respect to a horizontal plane, is provided so as to be positioned in the vertical plane, and extends in the vertical direction.
A plurality of electronic components 33 constituting an inverter circuit and various control circuits for exhibiting a predetermined function as the controller 30 are mounted on the substrate body 32.

  The plurality of electronic components 33 include a heat-generating electronic component 33H that generates heat during operation, such as an active converter, a diode module, and a power transistor that constitute an inverter circuit. In this embodiment, the exothermic electronic component 33H includes a DIP (Dual Inline Package) type exothermic electronic component 36 and a SIP (Single Inline Package) type exothermic electronic component 37.

  As shown in FIG. 3, the DIP-type heat-generating electronic component 36 includes a flat rectangular parallelepiped package body 36A and a plurality of lead portions 36B extending from both side surfaces of the package body 36A and extending to the substrate body 32 side. Have. In the DIP type heat-generating electronic component 36, the main surface 36f of the package body 36A is mounted substantially parallel to the substrate surface 32f of the substrate body 32.

  The SIP-type heat-generating electronic component 37 has a flat rectangular parallelepiped package body 37A and a plurality of lead portions 37B extending in a row from one side surface of the package body 37A. The SIP-type heat-generating electronic component 37 is mounted such that the main surface 37f of the package body 37A is substantially perpendicular to the substrate surface 32f of the substrate body 32.

The cooling block 40 is made of, for example, an aluminum alloy or the like, and is formed of a bar-like block body that is continuous in the vertical direction along the substrate surface 32 f of the substrate body 32.
The cooling block 40 includes a first surface 41 disposed along the substrate surface 32f of the substrate body 32, a second surface 42 disposed in a direction intersecting the substrate surface 32f, the first surface 41, and the second surface 42. The cross-sectional shape orthogonal to the direction in which the cooling block 40 continues forms a substantially right triangle.
The cooling block 40 is fixed to the substrate surface 32f by screws (not shown) or the like with a space between the cooling block 40 and the substrate surface 32f of the substrate body 32 via a spacer (not shown) or the like.

  The first surface 41 of the cooling block 40 is in contact with the main surface 36f of the package body 36A of the DIP type heat-generating electronic component 36 mounted on the substrate surface 32f. In addition, the second surface 42 of the cooling block 40 is in contact with the main surface 37f of the package body 37A of the SIP type heat-generating electronic component 37 mounted on the substrate surface 32f.

  The inclined surface 43 of the cooling block 40 is formed with a concave groove 45 extending in the vertical direction where the cooling block 40 continues. A part of the refrigerant pipe 2 is fitted into the concave groove 45. In this embodiment, for example, as shown in FIG. 1, the refrigerant pipe 2 is fitted in the concave groove 45 of the cooling block 40 of the controller 30 between the electronic expansion valve 15 and the indoor heat exchanger 22 of the indoor unit 20. Combined, heat transfer is provided between the refrigerant pipe 2 and the cooling block 40.

  As shown in FIG. 3, the inclined surface 43 of the cooling block 40 is provided with a support member 46 that sandwiches and supports the refrigerant pipe 2 fitted in the concave groove 45 with the inclined surface 43. The support member 46 may have a certain length in the direction in which the cooling blocks 40 are continuous, or may be divided and arranged in at least two locations with an interval in the direction in which the cooling blocks 40 are continuous. Good.

  A low-pressure gas-liquid two-phase refrigerant throttled by the electronic expansion valve 15 flows through the refrigerant pipe 2 fitted in the concave groove 45 of the cooling block 40 to cool the cooling block 40. Further, the high-pressure liquid refrigerant condensed and liquefied by the indoor heat exchanger 22 flows through the refrigerant pipe 2 to cool the cooling block 40 during heating. In this way, by cooling the cooling block 40 with the refrigerant flowing through the refrigerant pipe 2, the plurality of heat generating electronic components 36 and 37 mounted on the substrate body 32 and disposed in contact with the cooling block 40 are cooled. The

  The cooling block 40 includes a first surface 41 in contact with the heat generating electronic component 36 and an end portion (part) near the second surface 42 from the end portion 36p of the package body 36A of the heat generating electronic component 36. Also, a stepped portion 47A that is recessed inward is formed. Further, the cooling block 40 is formed with a stepped portion 47B that is recessed inwardly from the end portion 36q of the package body 36A of the heat generating electronic component 36 at the end portion of the first surface 41 closer to the inclined surface 43. ing. The step portions 47A and 47B and the main surface 36f of the package body 36A form grooves 50A and 50B that are continuous in the longitudinal direction of the cooling block 40, respectively.

  In the cooling block 40, the second surface 42 that contacts the heat-generating electronic component 37 has an end portion (part) closer to the first surface 41 than the end portion 37 p of the package body 37 </ b> A of the heat-generating electronic component 37. A stepped portion 48 </ b> A that is recessed inward is formed. A groove 50C continuous in the longitudinal direction of the cooling block 40 is formed by the stepped portion 48A and the main surface 37f of the package body 37A. In an example of the grooves 50A, 50B, and 50C in this embodiment, all the grooves are formed in a square groove shape. Further, the depth direction of the groove 50A and the depth direction of the groove 50B are opposite to each other, and the depth direction of the groove 50A and the depth direction of the groove 50C are perpendicular to each other. Is formed.

As shown in FIG. 4, the cooling block 40 is provided so as to be gradually separated from the substrate body 32 side from the lower side to the upper side. In other words, the cooling block 40 is inclined with respect to the substrate surface 32f of the substrate body 32 so that the upper end portion 40t is separated from the lower end portion 40b to the side.
For example, when the cooling block 40 is cooled by the refrigerant flowing through the refrigerant pipe 2 and dew condensation occurs on the surface of the cooling block 40, the dew condensation water moves toward the lead portions 36B and 37B, so that the grooves 50A and 50B. , 50C. At this time, since the cooling block 40 is inclined, the condensed water that has entered the grooves 50A, 50B, and 50C is separated from the package bodies 36A and 37A of the heat-generating electronic components 36 and 37 in the grooves 50A, 50B, and 50C. Will flow.

  Therefore, according to the substrate assembly A and the air conditioning system 1 of the above-described embodiment, the condensed water generated on the surface of the cooling block 40 when the cooling block 40 is cooled by the refrigerant flowing through the refrigerant pipe 2 is the cooling block 40. Into the grooves 50A, 50B, and 50C formed between the stepped portions 47A, 47B, and 48A formed on the heat generating electronic component 33H. Thereby, it can suppress adhering to the lead parts 36B and 37B of the exothermic electronic component 33H.

  Further, the cooling block 40 is provided by being inclined so as to be gradually separated from the substrate body 32 side from the lower side to the upper side with respect to the substrate body 32 extending continuously in the vertical direction and rising from the horizontal plane. Condensed water generated on the surface of the block 40 can be guided inside the grooves 50A, 50B, 50C to the side away from the lead portions 36B, 37B of the heat generating electronic component 33H. Therefore, the condensed water is less likely to adhere to the lead portions 36B and 37B of the heat-generating electronic component 33H.

  As described above, according to the substrate assembly A and the air conditioning system 1, it is possible to suppress the occurrence of insulation breakdown between the lead portions 36A and 36B and the cooling block 40 in the heat generating electronic component 33H, and to improve the reliability of the air conditioning system 1. Can increase the sex.

(Modification of the first embodiment)
In the above embodiment, the cooling block 40 is provided so as to be inclined with respect to the substrate body 32, but is not limited thereto.
FIG. 5 is a cross-sectional view showing a configuration of a modified example of the substrate assembly in the first embodiment.
For example, as shown in FIG. 5, the substrate main body 32 and the cooling block 40 constituting the substrate assembly A are separated from the heat generation electronic component 33H by the condensed water generated on the surface of the cooling block 40 inside the grooves 50A, 50B, 50C. It may be provided so as to be inclined with respect to the vertical plane (vertical direction) V so as to be guided to the side away from the lead portions 36B and 37B.

In this way, even if the substrate body 32 and the cooling block 40 constituting the substrate assembly A are inclined with respect to the vertical plane V, the condensed water generated on the surface of the cooling block 40 can be removed from the grooves 50A, 50B, It can be led to the side away from the lead portions 36B and 37B of the heat-generating electronic component 33H inside 50C.
As a result, even when condensation occurs in the cooling block 40, it is possible to prevent the condensed water from adhering to the lead portions 36B and 37B of the heat-generating electronic component 33H.

  Further, the substrate assembly A as described above may be accommodated in a housing (not shown) of the controller 30 and the cooling block 40 may be tilted by tilting the entire housing.

(Second embodiment)
Next, a second embodiment of the present invention will be described with reference to the drawings. Since the second embodiment is different from the first embodiment only in the direction of installation of the cooling block 40, the same reference numerals are given to the same parts as those in the first embodiment with reference to FIG. The duplicated explanation is omitted.

FIG. 6 is a front view showing the configuration of the controller of the air conditioning system in the second embodiment. 7 is a cross-sectional view taken along line YY in FIG.
As shown in FIG. 6, in the controller 30 and the substrate assembly A of the air conditioning system 1 in this embodiment, the cooling block (heat transfer material block) 40B is inclined with respect to the horizontal direction when viewed from the front. It extends continuously.
As shown in FIG. 7, the substrate assembly A including the substrate body 32 and the cooling block 40B is provided so as to be gradually separated from the substrate body 32 side from the lower side to the upper side. In FIG. 7, the symbol “V” is the same vertical plane as in FIG. 5.

  As described above, even when the cooling block 40B is provided so as to continuously extend in a direction inclined with respect to the horizontal direction, the cooling block 40B is gradually separated from the substrate main body 32 side from the lower side to the upper side. By providing the inclined surface, the dew condensation water generated on the surface of the cooling block 40B can be guided to the side away from the lead portions 36B and 37B of the heat generating electronic component 33H inside the grooves 50A, 50B and 50C. And the dew condensation water which flowed into these groove | channel 50A, 50B, 50C flows diagonally downward along the cooling block 40B which inclines with respect to a horizontal direction, respectively.

  Thereby, it can suppress that dew condensation water adheres to the lead parts 36B and 37B of the exothermic electronic component 33H. Therefore, it is possible to suppress the occurrence of dielectric breakdown in the heat-generating electronic component 33H and to improve the reliability of the air conditioning system 1.

  In the second embodiment, the substrate body 32 and the cooling block 40B are provided so as to be inclined. However, only the cooling block 40B can be inclined with respect to the substrate body 32.

(Other variations)
The present invention is not limited to the above-described embodiment, and includes various modifications made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.
For example, in each of the above embodiments, the heat generating electronic components 36 and 37 are provided along the first surface 41 and the second surface 42 of the cooling block 40. It is good also as a structure which a heat-emitting electronic component contacts only in any one.

Furthermore, another heat-generating electronic component may be in contact with the inclined surface 43 of the cooling block 40.
Moreover, in each embodiment mentioned above, the case where the exothermic electronic components 36 and 37 contacted the cooling block 40 directly was demonstrated. However, a layer made of a material capable of reducing thermal resistance such as thermal grease may be formed between the cooling block 40 and the heat-generating electronic components 36 and 37.

  Furthermore, the cross-sectional shape of the cooling block 40 is not limited to a triangle. The cross-sectional shape of the cooling blocks 40 and 40B can be changed as appropriate. For example, the cross-sectional shape of the cooling block 40 may be a quadrangle.

  Moreover, in each embodiment mentioned above, the case where the board | substrate assembly A was provided in the controller 30 of the outdoor unit 10 was demonstrated. However, the substrate assembly A is not limited to the one provided in the outdoor unit 10 or the controller 30 of the outdoor unit 10 as long as it includes a heat generating electronic component.

Furthermore, in each embodiment mentioned above, the case where the shape of groove | channel 50A, 50B, 50C was a square groove shape was demonstrated. However, the shape of the grooves 50A, 50B, and 50C is not limited to the square groove shape, and may be various groove shapes such as a U-shaped groove shape.
Moreover, the refrigerant | coolant piping 2 and the cooling block 40 were made into a different body, and the case where the refrigerant | coolant piping 2 was fitted with respect to the ditch | groove 45 of the cooling block 40 was illustrated. However, the present invention is not limited to this configuration. For example, the refrigerant pipe 2 and the cooling block 40 may be integrally formed at a portion where heat exchange is performed.

DESCRIPTION OF SYMBOLS 1 Air conditioning system 2 Refrigerant piping 3 Refrigeration cycle 10 Outdoor unit 11 Compressor 12 Four-way switching valve 13 Outdoor fan 14 Outdoor heat exchanger 15 Electronic expansion valve 16 Accumulator 18 Case 18h Heat exchanger room 18m Machine room 18p Partition plate 20 Indoor Machine 21 Indoor fan 22 Indoor heat exchanger 30 Controller 31 Controller main body 32 Substrate main body 32f Substrate surface 33 Electronic component 33H Exothermic electronic component 35A Support fixture 35B Support fixture 36, 37 Exothermic electronic component 36A, 37A Package main body 36B, 37B Lead Portions 36f, 37f Main surfaces 36p, 36q, 37p End portions 40, 40B Cooling block (heat transfer material block)
40b Lower end portion 40t Upper end portion 41 First surface 42 Second surface 43 Inclined surface 45 Groove 46 Support members 47A, 47B, 48A Step portions 50A, 50B, 50C Groove A Substrate assembly V Vertical surface

Claims (7)

A substrate body;
An exothermic electronic component mounted on the substrate body;
A block made of heat transfer material provided to contact the heat-generating electronic component;
A refrigerant pipe provided so that heat can be transmitted to the heat transfer material block;
The heat transfer material block is a board assembly including a step portion formed at a portion in contact with the heat-generating electronic component and forming a groove with the heat-generating electronic component. At least the heat transfer material block is
The dew condensation water generated on the surface of the heat transfer material block is provided so as to be inclined with respect to a vertical direction so as to be guided to a side away from the heat-generating electronic component inside the groove. Board assembly. An outdoor unit comprising: a compressor that compresses refrigerant; the substrate assembly according to claim 1 that drives the compressor; and an outdoor heat exchanger that exchanges heat between the refrigerant and outside air;
An indoor unit having an indoor heat exchanger that exchanges heat between the refrigerant and room air;
Air conditioning system with The substrate body is formed such that a mounting surface of the heat-generating electronic component extends in a vertical direction,
The heat transfer material block is inclined with respect to the substrate body so that condensed water generated on the surface of the heat transfer material block is guided to a side away from the heat-generating electronic component inside the groove. The air conditioning system according to claim 3 provided.   The substrate assembly is provided so as to be inclined with respect to a vertical direction so that condensed water generated on the surface of the heat transfer material block is guided to a side away from the heat-generating electronic component inside the groove. The air conditioning system according to claim 3.   6. The heat transfer material block according to claim 3, wherein the heat transfer material block extends in a vertical direction and is inclined so as to be gradually separated from the substrate main body side from below to above. Air conditioning system.   6. The heat transfer material block according to claim 3, wherein the heat transfer material block is inclined so as to incline with respect to a horizontal direction and is gradually inclined away from the substrate body side from below to above. The air conditioning system according to claim 1.

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