JP2017220033A - Transparent planar device and method for producing transparent planar device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transparent planer device in which an upper part of a transparent conductive film formed on the surface of a transparent base material is covered with a curable resin layer that can be stably operated under various environments such as outdoor for a long period of time, and to provide a method for producing a transparent planer device.SOLUTION: A transparent planer device has a transparent base material 1 of which a rear face 1b faces a display device, a transparent conductive film 11 that contains a conductive pattern 12, is formed on a surface 1a of the transparent base material 1 and constitutes a contact input surface, and at least two or more curable resin layers 14 formed on at least a part of the conductive pattern 12, where a total thickness of the curable resin layer 14 is 15 μm or more and less than 300 μm, and at least one layer of the curable resin layer 14 is an electromagnetic wave shield functional film or a migration prevention functional film.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a transparent planar device and a method for producing the transparent planar device, and more specifically, a transparent planar device in which a transparent conductive film formed on the surface of a transparent substrate is covered with a cured resin layer, and is outdoors. The present invention relates to a transparent planar device that can be stably operated for a long time under various environments such as the above and a method for manufacturing the transparent planar device.

  Patent Document 1 describes a transparent planar device (touch panel film and touch panel) in which a transparent conductive film formed on the surface of a transparent substrate is covered with various functional films. Patent Document 2 describes a transparent planar device (touch panel film) configured by sequentially laminating a transparent electrode and a functional film on a base film.

  Various functional films are films having functions such as mechanical strength resistance and optical functions, such as a hard coat functional film, an antireflection functional film, an antistatic functional film, an anti-fingerprint functional film, an antiglare functional film, an anti-glare functional film, and an anti-glare functional film. For example, a blocking functional film.

Japanese Patent Laying-Open No. 2015-69622 Japanese Patent Laying-Open No. 2015-64855

  By the way, the functional film of the transparent planar device as described above has been conventionally formed of glass. However, particularly in a large transparent planar device used for a guide plate, a signage, etc., weight reduction, damage prevention, and cost From the viewpoint of down, it is proposed to form with a synthetic resin material.

  As such a functional film, what has various functions is calculated | required. For example, to realize a transparent planar device that can operate stably for a long period of time even in various environments such as outdoors, noise resistance is improved, migration is prevented, and the transparent conductive film is peeled off from the substrate. A functional film that can be prevented is required.

  Therefore, an object of the present invention is a transparent planar device in which a transparent conductive film formed on the surface of a transparent substrate is covered with a cured resin layer, and can be stably operated for a long time in various environments such as outdoors. It is providing the manufacturing method of a planar device and a transparent planar device.

  Other problems of the present invention will become apparent from the following description.

  The above problems are solved by the following inventions.

[Claim 1]
A transparent substrate with the back surface facing the display device;
A transparent conductive film comprising a conductive pattern and formed on the surface of the transparent base material to constitute a contact input surface;
A lead-out wiring pattern located on the outer edge side of the transparent substrate than the transparent conductive film and electrically connected to the conductive pattern of the transparent conductive film,
And at least one cured resin layer formed on at least a part of the conductive pattern and the lead-out wiring pattern,
At least one of the cured resin layers is an electromagnetic wave shielding functional film, a migration preventing functional film, or an adhesion improving functional film.
[Claim 2]
The transparent planar device according to claim 1, wherein the total thickness of the cured resin layer is 41 μm or more and less than 300 μm.
[Claim 3]
3. At least one of the cured resin layers is a hard coat functional film, an ultraviolet absorption functional film, a smoothing functional film, an antireflection functional film, or an anti-fingerprint functional film. Transparent planar device.
[Claim 4]
The curable resin layer includes at least two layers formed on at least a part of the conductive pattern and the lead-out wiring pattern, and at least two layers formed on the first layer group. It consists of the above second layer group,
At least one layer of the first layer group is a smoothing functional film or an adhesion improving functional film,
The at least one layer in the second layer group is a hard coat functional film, an antireflection functional film, an anti-fingerprint functional film, or an ultraviolet absorption functional film. Transparent planar device.
[Claim 5]
The transparent planar device according to claim 1, wherein the conductive pattern and the lead-out wiring pattern are made of a metal material.
[Claim 6]
6. The transparent planar device according to claim 1, wherein the conductive pattern and the lead wiring pattern are made of two or more kinds of metal materials.
[Claim 7]
The transparent planar device according to claim 6, wherein an outermost layer of the conductive pattern and the lead-out wiring pattern has an antioxidant function.
[Claim 8]
The transparent planar device according to claim 1, wherein the electromagnetic wave shielding functional film has a fine line pattern made of a metal material that performs electromagnetic wave shielding.
[Claim 9]
A back transparent conductive film formed on the back surface of the transparent substrate including a conductive pattern;
Located on the outer edge side of the transparent base material than the back transparent conductive film, and is electrically connected to the conductive pattern of the back transparent conductive film;
Comprising at least one or more back side cured resin layers formed on at least a part of the back side conductive pattern and the back side lead wiring pattern;
The film thickness of the said back surface cured resin layer is 0.5 times or more and less than 2 times the total thickness of the cured resin layer formed in the surface side of the said transparent base material, Any one of Claims 1-8 characterized by the above-mentioned. A transparent planar device according to claim 1.
[Claim 10]
10. The transparent planar device according to claim 9, wherein the total thickness of the back surface cured resin layer is 50% or more and less than 200% of the total thickness of the curable resin layer on the surface side of the transparent substrate.
[Claim 11]
The transparent surface device according to claim 9 or 10, wherein the back surface cured resin layer includes an ultraviolet absorbing functional film.
[Claim 12]
The transparent surface device according to claim 9 or 10, wherein the back surface cured resin layer includes an electromagnetic wave shielding functional film.
[Claim 13]
The transparent planar device according to claim 9, wherein the back surface conductive pattern and the back surface lead-out wiring pattern are made of a metal material.
[Claim 14]
13. The transparent planar device according to claim 9, wherein the back surface conductive pattern and the back surface lead-out wiring pattern are made of two or more kinds of metal materials.
[Claim 15]
15. The transparent planar device according to claim 14, wherein the outermost layer of the back surface conductive pattern and the back surface lead-out wiring pattern has an antioxidant function.
[Claim 16]
16. The transparent planar device according to claim 12, wherein the electromagnetic wave shielding functional film has a fine line pattern made of a metal material that performs electromagnetic wave shielding.
[Claim 17]
At least one line-shaped liquid containing a conductive material is applied on the transparent substrate, and a coffee stain phenomenon is caused in the line-shaped liquid to be dried and thinned to form a pair of thin lines per line-shaped liquid. A transparent planar device comprising: forming a pattern, and performing electroplating on the fine line pattern to form the conductive pattern, wherein the transparent planar device according to any one of claims 1 to 8 is manufactured. Manufacturing method.
[Claim 18]
At least one line-shaped liquid containing a conductive material is applied on the transparent substrate, and a coffee stain phenomenon is caused in the line-shaped liquid to be dried and thinned to form a pair of thin lines per line-shaped liquid. A transparent planar device characterized in that a pattern is formed, and the back surface conductive pattern is formed by performing electrolytic plating on a fine line pattern to produce the transparent planar device according to any one of claims 9 to 16. Device manufacturing method.

  According to the present invention, a transparent planar device in which a transparent conductive film formed on the surface of a transparent substrate is covered with a cured resin layer, which can be stably operated for a long time in various environments such as outdoors. And a method of manufacturing a transparent planar device can be provided.

Schematic plan view conceptually illustrating an embodiment of a transparent planar device of the present invention The top view which shows notionally an example of the electroconductive pattern formed on the to-be-plated surface of a transparent base material The top view which shows another example of the electroconductive pattern of the transparent planar device of this invention Partially cutaway perspective view for conceptually explaining how a parallel line pattern is formed from a line-shaped liquid Partially cutaway perspective view showing an example of parallel line patterns formed on a transparent substrate

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

[Configuration of transparent planar device]
FIG. 1 is a schematic plan view conceptually illustrating an embodiment of a transparent planar device of the present invention.

  As shown in FIG. 1, the transparent planar device of the present invention is configured to have a transparent substrate 1. The transparent substrate 1 is configured as a transparent plate material. A transparent conductive film 11 including a conductive pattern 12 is formed on the surface 1 a of the transparent substrate 1. The transparent conductive film 11 constitutes a contact input surface. And this transparent planar device is used by making the back surface 1b of the transparent base material 1 oppose the display device which is not shown in figure.

  The conductive pattern 12 is formed of a transparent conductive material (metal oxide, conductive polymer, carbon material, metal material (metal fine wire), etc.).

  In the conductive pattern 12, a sensor signal is generated by a stimulus received from the outside. As the stimulus received from the outside, for example, a change in capacitance or pressure due to the approach or contact of the human body to the conductive pattern 12 is assumed. The transparent conductive film 11 generates a sensor signal in response to the stimulus received from the outside. That is, the conductive pattern 12 of the transparent conductive film 11 is a probe (antenna) such as a capacitance sensor or a pressure sensor.

  When it is desired to detect a change in the capacitance of the conductive pattern 12, for example, a so-called self-capacitance method can be used. That is, when a finger touches the conductive pattern 12, the stray capacitance of the conductive pattern 12 changes and the input signal changes, and a signal corresponding to this change becomes a sensor signal.

  A sensor signal generated in the conductive pattern of the transparent conductive film 11 is sent to an arithmetic circuit (not shown) through the lead wiring pattern 13 formed on the transparent substrate 1. The arithmetic circuit performs a predetermined calculation based on the sent sensor signal and converts the sensor signal into an energization signal. That is, a capacitance sensor and a pressure sensor are constituted by the conductive pattern 12 of the transparent conductive film 11 and the arithmetic circuit.

(Transparent substrate)
The material which comprises the transparent base material 1 will not be specifically limited if it can comprise as a transparent board | plate material, Glass, a synthetic resin material, and other various transparent materials can be used, for example, a polyethylene terephthalate (PET) resin , Polyethylene naphthalate (PEN) resin, polybutylene terephthalate resin, cellulose resin (polyacetyl cellulose, cellulose diacetate, cellulose triacetate, etc.), polyethylene resin, polypropylene resin, methacrylic resin, cyclic polyolefin resin, polystyrene resin , Acrylonitrile- (poly) styrene copolymer (AS resin), acrylonitrile-butadiene-styrene copolymer (ABS resin), polyvinyl chloride resin, poly (meth) acrylic resin, polycarbonate resin, polyester Le resins, polyimide resins, polyamide resins, preferably such as a resin film composed of a polyamide-imide resin and the like.

  The thickness, size (area), and shape of the transparent substrate 1 are not particularly limited, and are appropriately determined according to the use and purpose of the transparent planar device. The thickness of the transparent substrate 1 is 20 μm to 300 μm. The degree is preferred.

  The degree of transparency of the transparent substrate 1 is not particularly limited, and the light transmittance may be any of several% to several tens%, and the spectral transmittance may be anything. These light transmittance and spectral transmittance are appropriately determined according to the use and purpose of the transparent planar device.

  Further, the transparent substrate 1 may be subjected to a surface treatment for changing the surface energy. Further, the transparent substrate 1 may be provided with a hard coat layer, an antireflection layer, or the like.

  The transparent substrate 1 may have a single material single layer structure, or may have a single material or a laminated structure of a plurality of materials. When the transparent base material 1 has a laminated structure, the layers may be bonded to each other, or each layer may be sequentially formed on another layer. Moreover, you may combine bonding and layer formation. Furthermore, the transparent substrate 1 may have a laminated structure by folding and laminating and laminating films having a single layer structure or a laminated structure.

[Transparent conductive film]
The conductive pattern 12 of the transparent conductive film 11 is formed of a metal oxide, a conductive polymer, a carbon material, a metal material, or the like. Preferred examples of the metal oxide include indium oxide, zinc oxide, cadmium oxide, tin oxide and the like, and ITO doped with a different metal is also suitable.

  Although it does not specifically limit as a conductive polymer, (pi) conjugated system conductive polymer is mentioned preferably. The π-conjugated conductive polymer is not particularly limited, and includes polythiophenes (including basic polythiophenes, the same applies hereinafter), polypyrroles, polyindoles, polycarbazoles, polyanilines, polyacetylenes, polyfurans, polyparaffins. A chain conductive polymer of phenylene vinylenes, polyazulenes, polyparaphenylenes, polyparaphenylene sulfides, polyisothianaphthenes, polythiazyls can be used. Of these, polythiophenes and polyanilines are particularly preferable in that high conductivity and good precision patterning characteristics can be obtained. Most preferred is polyethylene dioxythiophene.

  Carbon nanotubes, graphene, and the like can be used as the carbon material. As the metal material, thin film silver or the like can be used.

FIG. 2 is a plan view conceptually showing an example of the conductive pattern formed on the plated surface of the transparent substrate.
FIG. 3 is a plan view showing another example of the conductive pattern of the transparent planar device of the present invention.

  Further, as the conductive pattern 2, as shown in FIGS. 2 and 3, a film in which metal fine wires are loosely coupled can also be used. As the metal forming the metal thin wire, gold, silver, copper, nickel, cobalt, an alloy thereof, or a laminate of two or more metal materials can be used. The line width of the fine metal wire is preferably 20 μm or less, and particularly preferably about several nm to 10 μm. By setting the line width to 20 μm or less, the fine metal wire is not visually recognized by the naked eye and does not hinder the transparency of the transparent substrate 1. As shown in FIG. 2 (a), a plurality of stripes arranged in parallel in one direction, as shown in FIG. 2 (a), and a plurality of metal wires arranged in one direction as shown in FIGS. A mesh shape (lattice shape) obtained by intersecting a plurality of metal thin wires arranged in parallel in different directions, or a continuous polygon pattern and a part of adjacent patterns overlapped as shown in FIG. be able to. Furthermore, although not shown in the figure, a circular pattern or a pattern of other shapes that are continuous and part of adjacent patterns can be used.

  Such a conductive pattern 12 can be formed by a method using vacuum equipment such as an evaporation method or a sputtering method, a coating method, a printing method, an ink jet method, or the like. A method for forming the conductive pattern 12 by the inkjet method will be described later.

  Further, a lead wiring pattern 13 is formed on the surface of the transparent substrate 1 so as to be positioned on the outer edge side of the transparent conductive film 11. The lead wiring pattern 13 is electrically connected to the conductive pattern 12 of the transparent conductive film 11. As this lead-out wiring pattern 13, it is preferable to use a fine metal wire. As the metal forming the metal thin wire, gold, silver, copper, nickel, cobalt, an alloy thereof, or a laminate of two or more metal materials can be used. The line width of the fine metal wire is preferably about several μm to 200 μm.

  When the conductive pattern 12 and the lead-out wiring pattern 13 are formed from two or more kinds of metal materials, it is preferable that the outermost layer has an antioxidant function.

[Hardened resin layer]
Then, at least one or more cured resin layers 14 are formed on at least a part of the conductive pattern 12 and the lead wiring pattern 13. The cured resin layer 14 is a resin layer formed by applying a resin material on at least a part of the conductive pattern 12 and the lead wiring pattern 13 and then curing the resin material. The cured resin layer 14 may be a single layer or a laminate of a plurality of layers. The cured resin layer can also be formed by printing or an inkjet method. The cured resin layer 14 is also formed by applying an adhesive (OCR, OCA) on at least a part of the conductive pattern 12 and the lead-out wiring pattern 13 and vacuum-bonding a film-like cover material. can do. However, since it may be difficult to bond a film-like cover material to create a large transparent planar device, the cured resin layer 14 may be formed by application of a resin material, printing, or an inkjet method. preferable.

Conventionally, the total thickness of such a functional film is preferably in the range of 2 μm to 40 μm. However, such a functional film is insufficient when the total thickness is 2 μm or more and 40 μm or less, and the desired function cannot be exhibited. When the conductive pattern 12 is formed of a low-resistance metal material, depending on the functional film having a total thickness of 2 μm or more and 40 μm or less formed by applying a synthetic resin material, a functional film or glass made by bonding an optical film is used. Compared with a functional film, sufficient durability under various environments, migration prevention performance, and peeling prevention performance of the transparent conductive film 11 cannot be ensured. Further, in particular, in a large transparent planar device, it is difficult to uniformly form a functional film made of a synthetic resin material having a total thickness of 2 μm or more and 40 μm or less. Here, the large size means, for example, a size of 32 inches or more or 2816 cm ² or more.

  Therefore, the total thickness of the cured resin layer 14 is preferably 41 μm or more and less than 300 μm.

  As the resin material forming the cured resin layer 14, a resin that is cured by a chemical species such as a photocurable resin, a thermosetting resin, or a crosslinking agent can be used.

  The photocurable resin contains a monomer, an oligomer, and a photopolymerization initiator, and is mainly composed of an actinic radiation curable resin that is cured through a crosslinking reaction by irradiation with an actinic ray (also referred to as an active energy ray) such as an ultraviolet ray or an electron beam. It is a resin material. As the actinic radiation curable resin, a resin containing a monomer having an ethylenically unsaturated double bond is preferably used. Typical examples of the actinic radiation curable resin include an ultraviolet curable resin, an electron beam curable resin, and the like, and an ultraviolet curable resin that is cured by ultraviolet irradiation is particularly preferable because of excellent mechanical film strength. Examples of the ultraviolet curable resin include an ultraviolet curable acrylate resin, an ultraviolet curable urethane acrylate resin, an ultraviolet curable polyester acrylate resin, an ultraviolet curable epoxy acrylate resin, an ultraviolet curable polyol acrylate resin, and an ultraviolet curable resin. A curable epoxy resin or the like is preferably used, and an ultraviolet curable acrylate resin is particularly preferable.

  As the ultraviolet curable acrylate resin, a polyfunctional acrylate is preferable. The polyfunctional acrylate is preferably selected from the group consisting of pentaerythritol polyfunctional acrylate, dipentaerythritol polyfunctional acrylate, pentaerythritol polyfunctional methacrylate, and dipentaerythritol polyfunctional methacrylate. Here, the polyfunctional acrylate is a compound having two or more acryloyloxy groups or methacryloyloxy groups in the molecule. Examples of the polyfunctional acrylate monomer include ethylene glycol diacrylate, diethylene glycol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, and tetramethylolmethane triacrylate. , Tetramethylolmethane tetraacrylate, pentaglycerol triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tri / tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, pentaerythritol tetraacrylate, glycerol triacrylate relay , Dipentaerythritol triacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tris (acryloyloxyethyl) isocyanurate, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, 1,6-hexanediol di Methacrylate, neopentyl glycol dimethacrylate, trimethylolpropane trimethacrylate, trimethylolethane trimethacrylate, tetramethylolmethane trimethacrylate, tetramethylolmethane tetramethacrylate, pentaglycerol trimethacrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, pen Pentaerythritol tetramethacrylate, glycerol trimethacrylate, dipentaerythritol trimethacrylate, dipentaerythritol tetramethacrylate, dipentaerythritol penta methacrylate, dipentaerythritol hexa methacrylate, etc. isocyanurate derivatives of the active energy ray-curable are preferably exemplified.

[Method of forming functional film]
As a method of forming a functional film on at least a part of the conductive pattern 12 and the lead wiring pattern 13, a coating method, a printing method, an ink jet method, or the like can be used. As the coating method, a wet coating method can be used. Examples include roll coating, gravure roll coating, air doctor coating, blade coating, wire doctor coating, knife coating, reverse coating, transfer roll coating, micro gravure coating, and die coating. . If a micro gravure coating method or a die coating method is used, a thin and uniform layer can be formed.

  For the curing after the functional film composition is applied, for example, ultraviolet irradiation or heating can be used. Ultraviolet irradiation can be performed using a high-pressure mercury lamp, a halogen lamp, a xenon lamp, or the like.

  Moreover, a functional film can be formed also by apply | coating an adhesive (OCR, OCA) to the surface (on transparent conductive film 11) of the transparent base material 1, and vacuum-bonding a film. OCR is a liquid ultraviolet curable resin or the like, and is used for wet lamination. OCA is a sheet-like adhesive and is used for dry lamination.

[Electromagnetic wave shielding functional film, migration preventing functional film, adhesion improving functional film]
At least one of the cured resin layers 14 is an electromagnetic wave shielding functional film, a migration preventing functional film, or an adhesion improving functional film. In order to realize a transparent planar device that can operate stably for a long time even in various environments such as outdoors, it can improve noise resistance, prevent migration, and prevent peeling of the transparent conductive film from the substrate A functional membrane is required.

[Electromagnetic shielding film]
As the electromagnetic shielding functional film, it is preferable to use a film in which fine line patterns made of a metal material are loosely coupled. As the metal forming the metal thin wire, gold, silver, copper, nickel, cobalt, an alloy thereof, or a laminate of two or more metal materials can be used. The line width of the fine metal wire is preferably about several nm to 10 μm. As the fine metal wires, those arranged and bonded regularly or those arranged irregularly can be used. Examples of the thin metal wire include a linear shape, a curved shape, and a circular shape, and a combination of these can also be used.

  This electromagnetic wave shielding functional film may be formed using a metal material alone or in a transparent binder made of a polymer material or the like.

[Migration prevention function film]
Although the mechanism of migration is not specified in detail, it is presumed that the movement of metal ions is involved, so use a film to which a compound that stabilizes metal ions is added as the migration prevention functional film. Is preferred. As the compound to be added, for example, an organic compound having a mercapto group (—SH), amino group (—NH—), hydroxyl group (—OH), or carboxyl group (—COOH) that reacts with a metal in the molecule is preferable. Among these, a compound in which a mercapto group (—SH), an amino group (—NH—), a hydroxyl group (—OH), or a carboxyl group (—COOH) is bonded to an aromatic compound or a heterocyclic compound is preferable. A compound having a cyclic nitrogen atom (—NH—) of a heterocyclic compound is also preferred.

[Adhesion-improving functional film]
The adhesion improving functional film is a functional film that improves the adhesion between the transparent substrate 1 and the transparent conductive film 11. The adhesion improving function is a function of enhancing resistance to peeling of the transparent conductive film 11 from the transparent substrate 1 and tearing of the transparent conductive film 11 in tests such as preservation in a hot and humid environment and a bending test. This adhesion improving functional film is formed on the transparent conductive film 11. It is considered that the adhesion improving layer acts on the patterned transparent conductive film 11 or the end of the thin metal wire and the interface of the transparent substrate 1 to improve the adhesion. Alternatively, it is considered that the adhesion improving functional film improves the adhesion by relieving stress due to a hot and humid environment or bending.

  The inventors of the present application have found that the hardness of the adhesion improving functional film affects the expression of the adhesion improving function. The hardness of the adhesion improving functional film is preferably in the range of 50 Mpa to 160 Mpa. This hardness can be measured by a nanoindentation method in which a microneedle is pushed into the adhesion improving functional film. In the nanoindentation method, using the indenter for the nanoindentation method, the indentation load and the indentation depth of the indenter with respect to the adhesion-improving functional film are continuously measured and calculated from the obtained measurement results. For example, if the indenter indentation load is increased in increments of 0.1 μN to 0.3 μN and the indenter indentation depth is measured to such a degree that it sufficiently exceeds the thickness of the adhesion improving functional film (for example, 30 μm), the indenter The hardness of the adhesion-improving functional film can be calculated from the load curve at the time of pressing.

  Moreover, it is preferable that an adhesive improvement functional film is 40 mN / m or more as surface energy. In this case, it is considered that a resin layer is formed from the end of the thin metal wire to the interface of the transparent base material 1 to improve the adhesion.

  In addition, the surface energy as used in the field of this invention is a value showing the wettability of the surface of the base material 1 measured using the contact angle method with water and diiodomethane as standard solutions. Specifically, the contact angle between ultrapure water and diiodomethane can be measured using “DM-500” manufactured by Kyowa Interface Science Co., Ltd., and the surface energy in a two-component system can be calculated.

[Hard coat functional film, UV absorbing functional film, smoothing functional film, antireflection functional film, anti-fingerprint functional film]
At least one of the cured resin layers 14 is preferably a hard coat functional film, an ultraviolet absorption functional film, a smoothing functional film, an antireflection functional film, or a fingerprint resistant functional film.

[Hard coat functional film purple, UV absorbing functional film]
The hard coat functional film is a functional film that exhibits a hardness of “H” or higher in a pencil hardness test generally defined by JIS 5600-5-4 (1999). The hard coat functional film is a composition that is cross-linked and cured by ionizing radiation energy such as electromagnetic waves, ultraviolet rays, visible rays, and electron beams, and contains multiple (meth) acryloyl groups in one molecule. It is preferably formed with a functional monomer as a main component. If the film thickness of the hard coat functional film is 10 μm or more, sufficient strength can be secured.

  As polyfunctional monomers, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol diacrylate , Triethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, 3-methylpentanediol di (meth) acrylate, trimethylolethane tri (meth) acrylate, trimethylol Propane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate 1,2-bis (meth) acryloyloxymethylhexane, tetradecane ethylene glycol di (meth) acrylate, 10-decanediol (meth) acrylate, 3,8-bis (meth) acryloyloxymethyltricyclo [5.2. 10] Decane, hydrogenated bisphenol A di (meth) acrylate, 2,2-bis (4- (meth) acryloyloxydiethoxyphenyl) propane, 1,4-bis ((meth) acryloyloxymethyl) cyclohexane, hydroxypivalin Examples thereof include acid esters, neopentyl glycol di (meth) acrylate, bisphenol A diglycidyl ether di (meth) acrylate, and epoxy-modified bisphenol A di (meth) acrylate. A polyfunctional monomer may be used independently and may use 2 or more types together. Further, if necessary, it can be copolymerized in combination with a monofunctional monomer.

  Moreover, urethane acrylate is also mentioned as a polyfunctional monomer. Urethane acrylate can be easily formed by reacting a polyester polyol with an isocyanate monomer or a product obtained by reacting a prepolymer with an acrylate monomer having a hydroxyl group.

  Specific examples include pentaerythritol triacrylate hexamethylene diisocyanate urethane prepolymer, dipentaerythritol pentaacrylate hexamethylene diisocyanate urethane prepolymer, pentaerythritol triacrylate toluene diisocyanate urethane prepolymer, dipentaerythritol pentaacrylate toluene diisocyanate urethane prepolymer. Pentaerythritol triacrylate isophorone diisocyanate urethane prepolymer, dipentaerythritol pentaacrylate isophorone diisocyanate urethane prepolymer, and the like can be used. Moreover, these monomers can be used 1 type or in mixture of 2 or more types. Further, these may be monomers in the coating liquid, or may be oligomers partially polymerized.

  Examples of the photopolymerization initiator system include benzylmethyl ketals such as 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl phenyl ketone, and 2-hydroxy-2-methyl-1-phenylpropane. Α-hydroxy ketones such as -1-one, 2-methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4- Α-aminoketones such as morpholinophenyl) butanone-1, bisacylphosphine oxides such as bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, 2,2′-bis (O-chlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,1'-biimidazole, bis (2,4,5 Bisimidazoles such as -triphenyl) imidazole, N-arylglycines such as N-phenylglycine, organic azides such as 4,4'-diazidochalcone, 3,3 ', 4,4'-tetra (tert -Organic peroxides such as -butylperoxycarboxyl) benzophenone, J.M. Photochem. Sci. Technol. , 2, 283 (1987). And specifically, iron arene complexes, trihalogenomethyl-substituted s-triazines, sulfonium salts, diazonium salts, phosphonium salts, selenonium salts, arsonium salts, iodonium salts, and the like. Moreover, as an iodonium salt, Macromolecules, 10, 1307 (1977). Compounds such as diphenyliodonium, ditolyliodonium, phenyl (p-anisyl) iodonium, bis (m-nitrophenyl) iodonium, bis (p-tert-butylphenyl) iodonium, bis (p-chlorophenyl) iodonium, etc. Iodonium chloride, bromide, or sulfonium organoboron complexes such as borofluoride, hexafluorophosphate salt, hexafluoroarsenate salt, aromatic sulfonate, and diphenylphenacylsulfonium (n-butyl) triphenylborate There can be mentioned.

  Photosensitizers can also be used. Examples of the photosensitizer include tertiary amines such as triethylamine, triethanolamine and 2-dimethylaminoethanol, alkylphosphine such as triphenylphosphine, and thioethers such as β-thiodiglycol. These 1 type or 2 or more types can also be mixed and used.

  Further, the hard coat functional film may contain an antistatic agent, a surfactant, an antifoaming agent, an antioxidant, an ultraviolet absorber, a light stabilizer, a polymerization inhibitor and the like. A functional film containing an ultraviolet absorber can be used as an ultraviolet absorbing functional film.

[Smoothing function membrane]
As a smoothing functional film, a film formed by applying alkoxide is known.

[Anti-reflective function film]
As an antireflection functional film, a film to which fine particles are added is known. As these fine particles, those having transparency such as various metal oxides, glass, plastic and the like can be used. For example, metal oxides such as silica, zirconia, titania, calcium oxide, inorganic conductive fine particles such as conductive alumina, tin oxide, indium oxide, antimony oxide, polymethyl methacrylate, polystyrene, polyurethane, acrylic-styrene. Examples include crosslinked or uncrosslinked organic fine particles and silicone fine particles composed of various polymers such as polymers, melamine, and polycarbonate.

  In addition, the shape of these fine particles is not particularly limited, and may be spherical such as beads or may be indefinite such as powder. A spherical shape is preferred, and a true spherical shape is particularly preferred. These fine particles may be used alone or in combination of two or more. The average particle diameter of these fine particles is preferably 10 nm to 200 nm, particularly preferably 10 nm to 100 nm. If the average particle size is less than 10 nm, a sufficient uneven shape cannot be formed on the surface, which may cause sticking. When the average particle diameter is 200 nm or more, light scattering occurs in the antireflection functional film, and the transmittance is reduced. The proportion of the fine particles is determined in consideration of the thickness of the antireflection functional film and the average particle diameter of the fine particles. For example, 0.1 to 10 parts by weight with respect to 100 parts by weight of the base resin of the functional film. Part.

Further, by forming a low refractive index layer having a refractive index lower than that of the hard coat functional film on the hard coat functional film, an antireflection functional film can be obtained. For example, when the refractive index of the hard coat functional film is 1.5 or more, the refractive index of the antireflection functional film (low refractive index layer) is less than 1.5, preferably 1.45 or less, more preferably 1.35. The antireflection function is realized by the following. In this case, the film thickness d (nm) of the antireflection functional film is expressed by the following equation.
d = mλ / 4n (∵n is the refractive index of the antireflection functional film, m is a positive odd number, and λ is the wavelength)

  In order to lower the refractive index of the antireflection functional film, it is possible to add low refractive index particles. Examples of the low refractive index particles include fine particles having voids. Examples of the fine particles having voids include a structure in which a gas is filled in the fine particles and a porous structure containing a gas. In the fine particles having such a structure, the refractive index decreases in inverse proportion to the gas occupancy in the fine particles as compared with the refractive index of the fine particle constituent material.

  As fine particles having voids, for example, hollow silica fine particles can be used. Since the hollow silica fine particles are easy to manufacture and have high hardness, when mixed with the base resin of the antireflection functional film, the strength of the film is improved and the refractive index is adjusted to about 1.20 to 1.45. be able to. The average particle diameter of the hollow silica fine particles is preferably 5 nm to 300 nm, more preferably 8 nm to 100 nm, and even more preferably 10 nm to 80 nm in order to ensure the transparency of the antireflection functional film. . The hollow silica fine particles are preferably 0.1 parts by weight to 500 parts by weight, and more preferably 10 parts by weight to 200 parts by weight with respect to 100 parts by weight of the base resin in the antireflection functional film.

  Further, fine particles having a nanoporous structure inside or at least part of the surface can also be used as the low refractive index particles. In the antireflection functional film using the fine particles, the refractive index can be adjusted to about 1.30 to 1.45.

  A low refractive index antireflection functional film is added as a base resin of the antireflective functional film, a polyfunctional monomer having two or more (meth) acryloyl groups in one molecule, low refractive index particles, and if necessary Forming a coating film with a solution or dispersion in which an agent (known polymerization initiator, antistatic agent, antiglare agent, etc.) is dissolved or dispersed in a solvent, and curing the coating film by ultraviolet irradiation or heating. Can be formed.

  In addition, it is preferable that the coating film used as the low-refractive-index antireflection functional film is formed by diluting a film composition with a volatile solvent and applying it. The volatile solvent includes methanol, ethanol, isopropanol, n-butanol, s-butanol, t in consideration of stability of the film composition, wettability with respect to other functional films such as a hard coat functional film, and volatility. Alcohols such as butanol, 2-methoxyethanol, 1-methoxy-2-propanol (PGME), isopropyl alcohol (IPA), ketones such as acetone, methyl isobutyl ketone, methyl ethyl ketone, methyl isobutyl, methyl acetate, ethyl acetate, Esters such as butyl acetate, ethers such as diisopropyl ether, glycols such as ethylene glycol, propylene glycol, and hexylene glycol, glycol ethers such as ethyl cellosolve, butyl cellosolve, ethyl carbitol, and butyl carbitol Acetates such as propylene glycol 1-monomethyl ether 2-acetate (PGMEA), aliphatic hydrocarbons such as hexane, heptane and octane, halogenated hydrocarbons, aromatic hydrocarbons such as benzene, toluene and xylene, N-methyl Examples include pyrrolidone and dimethylformamide. You may use these individually or in mixture of 2 or more types.

[Anti-fingerprint film]
As the anti-fingerprint function film, a film surface-treated with a fluorine coating agent or an ultraviolet curable resin is known.

[Anti-blocking functional membrane]
Furthermore, as a functional film, to prevent slipping and blocking of the film in the production process, and to prevent blocking when wound and stored, a fine uneven shape is formed on the surface, or an anti-blocking functional film is provided. Is preferred. Blocking refers to adhesion of the functional film to a guide roll or the like in the production process, or mutual adhesion of the functional films during storage.

  In order to prevent blocking, it is effective to form a fine uneven shape on the surface of the functional film to reduce the contact area or to form an anti-blocking functional film to which an anti-blocking agent is added. Examples of the antiblocking agent include inorganic fine particles such as silica, talc, and diatomaceous earth, and polymers that can utilize compatibility.

[Other examples of cured resin layer]
The curable resin layer 14 includes at least two or more first layer groups formed on at least a part of the conductive pattern 12 and the lead-out wiring pattern 13, and at least the first layer group formed on the first layer group. It can be composed of two or more second layer groups. In this case, at least one layer of the first layer group is a smoothing functional film or an adhesion improving functional film, and at least one layer of the second layer group is a hard coat functional film or an antireflection functional film. It is preferable to use a fingerprint-resistant functional film or an ultraviolet absorbing functional film.

[Back cured resin layer]
Also on the back surface 1 b of the transparent substrate 1, the back surface conductive pattern 15 and the back surface lead wiring pattern 16 similar to the conductive pattern 12 and the lead wiring pattern 13 described above can be formed. In addition, a back surface cured resin layer 17 similar to the cured resin layer 14 can be formed on at least a part of the back surface conductive pattern 15 and the back surface lead-out wiring pattern 16 (on the back surface side).

  By forming both the cured resin layer 14 and the back surface cured resin layer 17, it is possible to balance the curing of the resin layers 14 and 17 on the front and back of the transparent substrate 1, and warp the transparent substrate 1 during curing. Can be prevented. The total thickness of the back surface cured resin layer 17 is preferably 50% or more and less than 200% of the total thickness of the curable resin layer 14 on the surface side of the transparent substrate 1.

  The back surface conductive pattern 15 and the back surface extraction wiring pattern 16 are formed in the same manner as the conductive pattern 12 and the extraction wiring pattern 13 on the front surface side of the transparent substrate 1, and can be formed from a metal material. Moreover, the back surface conductive pattern 15 and the back surface extraction wiring pattern 16 can be formed from two or more kinds of metal materials. In this case, it is preferable that the outermost layers of the back surface conductive pattern 15 and the back surface lead wiring pattern 16 have an antioxidant function.

  Similarly to the curable resin layer 14 on the front surface side of the transparent substrate 1, the back surface cured resin layer 17 preferably includes an ultraviolet absorbing functional film. Further, like the curable resin layer 14, the back surface cured resin layer 17 preferably includes an electromagnetic wave shielding functional film. This electromagnetic wave shielding functional film can be configured to have a fine line pattern made of a metal material that performs electromagnetic wave shielding.

[Method of forming conductive pattern by inkjet method]
The conductive pattern 12 and the backside conductive pattern 15 are formed by applying at least one line-shaped liquid containing a conductive material on the transparent base material 1, causing the coffee-stain phenomenon to occur in the line-shaped liquid, and drying the fine line. Then, a pair of fine line patterns can be formed per one line-shaped liquid, and the fine line patterns can be formed by electrolytic plating.

  The line-shaped liquid may be applied not only in a straight line as shown in FIG. 2, but also in a rectangular shape, a circular shape, or other shapes as shown in FIG.

  2 and 3, reference numeral 71 denotes a surface to be plated. The conductive pattern 12 is composed of an assembly of a plurality of conductive thin wires 23. As described above, the conductive pattern 12 is, for example, as shown in FIG. 2A, a stripe shape in which a plurality of conductive thin wires 23 are arranged in one direction, or as shown in FIGS. 2B and 2C. In addition, as shown in FIG. 3, a mesh shape (also referred to as a lattice shape) in which a plurality of conductive thin wires 23 arranged in parallel in one direction and a plurality of conductive thin wires 23 arranged in a direction crossing the conductive thin wires 23 are intersected. A form in which a part of adjacent patterns overlap each other in a continuous polygon pattern. Further, although not shown, a part of adjacent patterns in a continuous pattern of circular patterns or other shapes overlap. It is preferable that it is a form.

  In order to form the conductive pattern 2 with the conductive thin wires 23, it is preferable to apply electrolytic plating to a thin wire made of a conductive material and having a line width of 20 μm or less (particularly preferably about several nm to 10 μm).

  FIG. 4 is a partially cutaway perspective view conceptually illustrating the manner in which a parallel line pattern is formed from a line-shaped liquid.

  As shown in FIG. 4A, a line-shaped liquid 24 containing a conductive material is applied on the transparent substrate 1. The application of the line-shaped liquid 24 onto the transparent substrate 1 can be performed using an inkjet head (not shown). Specifically, by causing the inkjet head to move relative to the transparent substrate 1, a plurality of droplets containing a conductive material are ejected from the inkjet head, and the ejected droplets are combined on the base material, A line-like liquid 24 containing a conductive material can be formed. The line-like liquid 24 is a combination of a plurality of droplets in the length direction. In addition, the line-shaped liquid 24 may be formed by enlarging a plurality of droplets in the width direction.

  As shown in FIG. 4 (b), when the line-shaped liquid 24 is evaporated and dried, the coffee stain phenomenon is used to make both edges 25a and 25b along the length direction of the line-shaped liquid 24 conductive. The material is selectively deposited.

  It is preferable to set conditions for drying the line-shaped liquid 24 so as to promote the coffee stain phenomenon. That is, the drying of the line-shaped liquid 24 disposed on the transparent substrate 1 is faster at both edges 25a and 25b than at the center, and the conductive material is locally deposited on both edges 25a and 25b of the line-shaped liquid 24. Happens. With the conductive material deposited in this manner, both edges 25a and 25b of the line-shaped liquid 24 are fixed, and the shrinkage in the width direction of the line-shaped liquid 24 accompanying subsequent drying is suppressed.

  In the line-shaped liquid 24, a flow from the central portion toward both edges is formed so as to compensate for the liquid lost by evaporation at both edges 25a and 25b. By this flow, the conductive material is further transported to and deposited on both edges 25a and 25b. This flow is caused by immobilization of the contact line of the line-shaped liquid 24 accompanying drying and a difference in evaporation amount between the central portion of the line-shaped liquid 24 and both edges 25a and 25b. Therefore, in order to promote this flow, the concentration of the conductive material, the contact angle between the line-shaped liquid 24 and the transparent substrate 1, the liquid amount of the line-shaped liquid 24, the heating temperature of the transparent substrate 1, the arrangement of the line-shaped liquid 24 It is preferable to set conditions such as density or environmental factors such as temperature, humidity, and atmospheric pressure.

  As a result, as shown in FIG. 4C, fine wires 23 a and 23 b containing a conductive material are formed on the transparent substrate 1. These thin wires 23 a and 23 b are formed at positions corresponding to both edges 25 a and 25 b of the line-like liquid 24. That is, two thin wires 23 a and 23 b parallel to each other are formed from one line-shaped liquid 24. In the following description, the two thin lines 23 a and 23 b may be referred to as a parallel line pattern 27.

  The thin wires 23a and 23b formed as described above are preferably subjected to a firing treatment before the electrolytic plating.

  For example, as shown in FIGS. 2B and 2C, when the conductive portion of the surface 71 to be plated is formed by thin conductive wires that intersect each other, first, the first line is formed along the first direction. The liquid is formed and dried to form a first parallel line pattern 27 along the first direction, and then intersects the first direction so as to straddle the first parallel line pattern 27 A method of forming the second line-shaped liquid 24 along the second direction, and drying the liquid to form the second parallel line pattern 27 along the second direction can be preferably used.

  In addition, as shown in FIG. 3, when the line liquid is applied in a form in which a part of adjacent patterns overlap each other in a continuous polygonal pattern or circular pattern, electrolytic plating is applied to the thin wires 23a and 23b. Prior to application or during the electroplating process, the inner fine lines of the polygonal pattern or circular pattern are removed, leaving only the outer fine lines.

  The liquid discharged from the inkjet head to the transparent substrate 1 for forming the line-shaped liquid 24 contains a conductive material or a conductive material precursor. The conductive material precursor can be changed to a conductive material by appropriately performing post-treatment.

  Preferred examples of the conductive material include conductive fine particles and conductive polymers.

  The conductive fine particles are not particularly limited, but Au, Pt, Ag, Cu, Ni, Cr, Rh, Pd, Zn, Co, Mo, Ru, W, Os, Ir, Fe, Mn, Ge, Sn, Ga. In particular, fine particles such as In can be exemplified, and among them, use of fine metal particles such as Au, Ag, and Cu is more preferable because a circuit pattern having a low electric resistance and strong against corrosion can be formed. From the viewpoint of cost and stability, metal fine particles containing Ag are most preferable. The average particle diameter of these metal fine particles is preferably in the range of 1 to 100 nm, more preferably in the range of 3 to 50 nm.

  It is also preferable to use carbon fine particles as the conductive fine particles. Preferable examples of the carbon fine particles include graphite fine particles, carbon nanotubes, fullerenes and the like.

  Although it does not specifically limit as a conductive polymer, (pi) conjugated system conductive polymer can be mentioned preferably.

  The π-conjugated conductive polymer is not particularly limited, and polythiophenes, polypyrroles, polyindoles, polycarbazoles, polyanilines, polyacetylenes, polyfurans, polyparaphenylenes, polyparaphenylene vinylenes, poly Chain conductive polymers such as paraphenylene sulfides, polyazulenes, polyisothianaphthenes, and polythiazyl can be used. Among these, polythiophenes and polyanilines are preferable in that high conductivity can be obtained.

  The conductive polymer more preferably contains the above-described π-conjugated conductive polymer and polyanion. Such a conductive polymer can be easily produced by chemical oxidative polymerization of a precursor monomer that forms a π-conjugated conductive polymer in the presence of an appropriate oxidizing agent, an oxidation catalyst, and a polyanion.

  The polyanion is a substituted or unsubstituted polyalkylene, a substituted or unsubstituted polyalkenylene, a substituted or unsubstituted polyimide, a substituted or unsubstituted polyamide, a substituted or unsubstituted polyester, and a copolymer thereof. It consists of a structural unit having a group and a structural unit having no anionic group.

  This polyanion is a solubilized polymer that solubilizes the π-conjugated conductive polymer in a solvent. The anion group of the polyanion functions as a dopant for the π-conjugated conductive polymer, and improves the conductivity and heat resistance of the π-conjugated conductive polymer.

  The anion group of the polyanion may be a functional group capable of undergoing chemical oxidation doping to the π-conjugated conductive polymer. Among them, from the viewpoint of ease of production and stability, a monosubstituted sulfate group, A monosubstituted phosphate group, a phosphate group, a carboxyl group, a sulfone group and the like are preferable. Furthermore, from the viewpoint of the doping effect of the functional group on the π-conjugated conductive polymer, a sulfone group, a monosubstituted sulfate group, and a carboxyl group are more preferable.

  Specific examples of polyanions include polyvinyl sulfonic acid, polystyrene sulfonic acid, polyallyl sulfonic acid, polyacrylic acid ethyl sulfonic acid, polyacrylic acid butyl sulfonic acid, poly-2-acrylamido-2-methylpropane sulfonic acid, polyisoprene sulfone. Examples include acid, polyvinyl carboxylic acid, polystyrene carboxylic acid, polyallyl carboxylic acid, polyacryl carboxylic acid, polymethacryl carboxylic acid, poly-2-acrylamido-2-methylpropane carboxylic acid, polyisoprene carboxylic acid, polyacrylic acid and the like. . These homopolymers may be sufficient and 2 or more types of copolymers may be sufficient.

  Moreover, the polyanion which has F (fluorine atom) in a compound may be sufficient. Specific examples include “Nafion” containing a perfluorosulfonic acid group (manufactured by Dupont), “Flemion” (manufactured by Asahi Glass Co., Ltd.) made of perfluoro vinyl ether containing a carboxylic acid group.

  Among these, a compound having a sulfonic acid is more preferable since the ink ejection stability is particularly good when an ink jet head is used and high conductivity is obtained.

  Furthermore, among these, polystyrene sulfonic acid, polyisoprene sulfonic acid, polyacrylic acid ethylsulfonic acid, and polyacrylic acid butylsulfonic acid are preferable. These polyanions have the effect of being excellent in conductivity.

  The degree of polymerization of the polyanion is preferably in the range of 10 to 100,000 monomer units, and more preferably in the range of 50 to 10,000 from the viewpoint of solvent solubility and conductivity.

  A commercially available material can also be preferably used as the conductive polymer. For example, a conductive polymer (abbreviated as PEDOT / PSS) made of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid is H.264. C. It is commercially available as “CLEVIOS series” from Starck, as “PEDOT-PSS 483095, 560598” from Aldrich, and as “Denatron series” from Nagase Chemtex. Polyaniline is also commercially available from Nissan Chemical Company as “ORMECON series”.

  As a liquid containing a conductive material used when forming the line-shaped liquid 24, one or more of water, an organic solvent, and the like can be used in combination.

  The organic solvent is not particularly limited. For example, alcohols such as 1,2-hexanediol, 2-methyl-2,4-pentanediol, 1,3-butanediol, 1,4-butanediol, propylene glycol, Examples include ethers such as diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, dipropylene glycol monomethyl ether, and dipropylene glycol monoethyl ether.

  Further, the liquid containing the conductive material may contain various additives such as a surfactant. By using the surfactant, when the line-like liquid 24 is formed using the ink jet head, it becomes possible to stabilize the discharge by adjusting the surface tension and the like. The surfactant is not particularly limited, but a silicon surfactant or the like can be used. Silicon surfactants are those in which the side chain or terminal of dimethylpolysiloxane is modified with polyether. For example, “KF-351A, KF-642” manufactured by Shin-Etsu Chemical Co., Ltd. Are commercially available. The addition amount of the surfactant is preferably 1% by weight or less with respect to the total amount of the liquid forming the line-like liquid 24.

  The concentration range of the conductive material in the liquid discharged from the inkjet head to the transparent substrate 1 is preferably adjusted to a range of 0.01 wt% to 1.0 wt%, for example. Thereby, formation of the thin wires 23a and 23b can be stabilized.

  FIG. 5 is a partially cutaway perspective view showing an example of a parallel line pattern formed on a transparent substrate, and the cross section corresponds to a vertical cross section cut in a direction orthogonal to the direction in which the parallel line pattern is formed. To do.

  As shown in FIG. 5, the two thin lines 23a and 23b of the parallel line pattern 27 generated from one line-shaped liquid do not necessarily need to be islands completely independent from each other. The two thin wires 23a and 23b may be formed as a continuous body connected by the thin film portion 28 formed at a height lower than the height of the thin wires 23a and 23b between the thin wires 23a and 23b. .

  As described above, the line widths Wa and Wb of the fine lines 23a and 23b of the parallel line pattern 27 are preferably 20 μm or less, respectively. The widths Wa and Wb of the thin wires 23a and 23b are the height of the thinnest portion where the thickness of the conductive material is the thinnest between the thin wires 23a and 23b, and the protrusion of the thin wires 23a and 23b from the Z When the heights are Y1 and Y2, they are defined as the widths of the thin wires 23a and 23b at half the height of Y1 and Y2. For example, when the parallel line pattern 27 has the thin film portion 28 described above, the height of the thinnest portion in the thin film portion 28 can be set to Z. When the height of the thinnest portion of the conductive material between the thin wires 23 a and 23 b is 0, the line widths Wa and Wb of the thin wires 23 a and 23 b are the same as those of the thin wires 23 a and 23 b from the surface of the transparent substrate 1. The width of the thin wires 23a and 23b at half the height of the heights H1 and H2 can be set.

  Since the line widths W1 and W2 of the thin lines 23a and 23b constituting the parallel line pattern 27 are extremely thin as described above, from the viewpoint of securing a cross-sectional area and reducing the resistance, The heights H1 and H2 of the thin wires 23a and 23b are preferably higher. Specifically, the heights H1 and H2 of the thin wires 23a and 23b are preferably in the range of 50 nm to 5 μm.

  Furthermore, from the viewpoint of improving the stability of the parallel line pattern 27, the H1 / W1 ratio and the H2 / W2 ratio are preferably in the range of 0.01 or more and 1 or less, respectively.

  Further, from the viewpoint of further improving the thinning of the parallel line pattern 27, the height Z of the thinnest portion 28 of the thin film portion 28 between the thin wires 23a and 23b is preferably in the range of 10 nm or less. Most preferably, the thin film portion 28 is provided in the range of 0 <Z ≦ 10 nm in order to achieve a balance between transparency and stability.

  Further, in order to further improve the thinning of the parallel line pattern 27, the H1 / Z ratio and the H2 / Z ratio are each preferably 5 or more, more preferably 10 or more, and preferably 20 or more. Particularly preferred.

  The range of the arrangement interval I of the thin wires 23a and 23b is not particularly limited, and can be appropriately set by setting the formation width of the line liquid 24. For example, when the conductive pattern 2 is formed, the arrangement interval I is preferably in the range of 100 μm to 1000 μm, and more preferably in the range of 100 μm to 500 μm.

  In addition, the arrangement | positioning space | interval I of the thin wires 23a and 23b is taken as the distance between each maximum protrusion part of the thin wires 23a and 23b.

  Furthermore, it is preferable that the thin wire 23a and the thin wire 23b have the same shape (similar cross-sectional area). Specifically, the heights H1 and H2 of the thin wire 23a and the thin wire 23b are set to substantially equal values. Is preferred. Similarly, the line widths Wa and Wb of the thin wire 23a and the thin wire 23b are preferably set to substantially the same value.

  The thin wires 23a and 23b do not necessarily have to be parallel, and it is sufficient that the thin wires 23a and 23b are not coupled to each other over at least a certain distance J in the length direction of the thin wires 23a and 23b. Preferably, the thin wires 23a and 23b are substantially parallel over at least a certain distance J in the length direction.

  The length J of the fine wires 23a and 23b in the fine wire direction is preferably at least 5 times the arrangement interval I of the fine wires 23a and 23b, more preferably at least 10 times. The length J and the arrangement interval I can be set corresponding to the formation length and formation width of the line-like liquid 24.

  At the formation start point and end point of the line-shaped liquid 24 (start point and end point separated by a certain distance J in the length direction), the thin wires 23a and 23b may be connected to form a continuous body.

Hereinafter, specific examples of the present invention will be described. The layer configurations of the conductive pattern 12 and the cured resin layer 14 on the transparent substrate 1 in each Example and Comparative Example are as shown in [Table 1] below.

[Example 1]
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 on the PET film was formed of an ITO pattern, and the lead wiring pattern 13 was formed of silver wiring. The ITO pattern was formed by performing lattice-like channel patterning by a photolithography process using an ITO film (42 inch size, base material thickness 50 μm PET, sheet resistance 100Ω / □). The lattice width was 10 mm. A lead wire was formed from each channel to the end of the transparent substrate 1 by printing using silver nanopaste for this material. L / S = 60/60 (μm).

An electromagnetic wave shielding functional film having a thickness of 5 μm was formed on the conductive pattern 12. The electromagnetic shielding functional film is composed of 7 parts of silver nanowire, 50 parts of pentaerythritol acrylate (PETA (manufactured by Nippon Kayaku Co., Ltd.)), 5 parts of initiator (Irgacure 184 (manufactured by BASF)), 100 parts of solvent (MEK). After applying with a gravure and drying, it was cured by irradiation with ultraviolet rays (400 mJ / cm ² ).

A 10 μm thick hard coat functional film was formed on the electromagnetic shielding functional film. The hard coat functional film is composed of 100 parts of urethane acrylate (UV-1700B (manufactured by Nippon Synthetic Chemical)), 50 parts of dipentaerythritol hexaacrylate (DPHA (manufactured by Nippon Kayaku Co., Ltd.)), initiator (Irgacure 184 (BASF) 5 parts and 100 parts of solvent (MEK) were applied by microgravure, dried, and then cured by irradiation with ultraviolet rays (400 mJ / cm ² ).

  Then, this transparent planar device was bonded to face the display device (surface panel) through a 10 μm thick OCR layer (layer obtained by curing a liquid adhesive) to create a display device with a touch panel. . A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

[Example 2]
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 on the PET film was formed of an ITO pattern, and the lead wiring pattern 13 was formed of silver wiring (similar to Example 1).

A migration preventing functional film having a thickness of 5 μm was formed on the conductive pattern 12. The migration-preventing functional film comprises 50 parts of a phenolic compound (IRGANOX 1135 (manufactured by BASF)) and pentaerythritol acrylate (manufactured by PETA Nippon Kayaku Co., Ltd.), 5 parts of an initiator (Irgacure 184 (manufactured by BASF)), solvent (MEK). 100 parts were applied by microgravure and dried, and then cured by irradiation with ultraviolet rays (400 mJ / cm ² ).

  A hard coat functional film having a thickness of 10 μm was formed on the migration preventing functional film. The hard coat functional film was formed in the same manner as in Example 1.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

Example 3
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 on the PET film was formed of an ITO pattern, and the lead wiring pattern 13 was formed of silver wiring (similar to Example 2).

On the conductive pattern 12, an adhesion improving functional film having a thickness of 10 μm was formed. The functional film for improving adhesion has 40 parts of dipentaerythritol hexaacrylate (DPHA (manufactured by Nippon Kayaku Co., Ltd.)), 40 parts of UV-3520TL (manufactured by Nippon Gosei Co., Ltd.), and 200 parts of solvent (MEK) by microgravure. After coating and drying, the film was cured by irradiation with ultraviolet rays (400 mJ / cm ² ).

  A 10 μm thick hard coat functional film was formed on the adhesion improving functional film. The hard coat functional film was formed in the same manner as in Example 2.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

Example 4
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 on the PET film was formed of an ITO pattern, and the lead-out wiring pattern 13 was formed of silver wiring (similar to Example 3).

  On the conductive pattern 12, an adhesion improving functional film having a thickness of 25 μm was formed. The adhesion improving functional film was formed in the same manner as in Example 3.

  An electromagnetic wave shielding functional film having a thickness of 10 μm was formed on the adhesion improving functional film. The electromagnetic shielding functional film was formed in the same manner as in Example 1.

  A 10 μm thick hard coat functional film was formed on the electromagnetic shielding functional film. The hard coat functional film was formed in the same manner as in Example 3.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

Example 5
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 on the PET film was formed by silver nanowires, and the lead wiring pattern 13 was formed by silver wiring. Silver nanowires were applied to the entire view area on a 42-inch size PET with a substrate thickness of 50 μm and cured. It was formed by performing lattice-like channel patterning by a photolithography process. The lattice width was 10 mm. A lead wire was formed from each channel to the end of the transparent substrate 1 by printing using silver nanopaste for this material. L / S = 60/60 (μm).

  On the conductive pattern 12, an adhesion improving functional film having a thickness of 25 μm was formed. The adhesion improving functional film was formed in the same manner as in Example 4.

  An electromagnetic wave shielding functional film having a thickness of 10 μm was formed on the adhesion improving functional film. The electromagnetic shielding functional film was formed in the same manner as in Example 1.

  A 10 μm thick hard coat functional film was formed on the electromagnetic shielding functional film. The hard coat functional film was formed in the same manner as in Example 4.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

Example 6
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 and the lead-out wiring pattern 13 on this PET film are made of a copper sputter film (42-inch size, base material thickness 50 μm PET, sheet resistance 10 Ω / □), and lithographic channel patterning and lead-out wiring by a photolithography process. Patterning was performed simultaneously. The lattice width was 10 mm and L / S = 60/60 (μm).

  On the conductive pattern 12, an adhesion improving functional film having a thickness of 25 μm was formed. The adhesion improving functional film was formed in the same manner as in Example 5.

  An electromagnetic shielding functional film having a thickness of 15 μm was formed on the adhesion improving functional film. The electromagnetic shielding functional film was formed in the same manner as in Example 5.

  A 10 μm thick hard coat functional film was formed on the electromagnetic shielding functional film. The hard coat functional film was formed in the same manner as in Example 5.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

Example 7
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 and the lead wiring pattern 13 on the PET film were formed in the same manner as in Example 6 using a copper sputtered film.

  On the conductive pattern 12, an adhesion improving functional film having a thickness of 25 μm was formed. The adhesion improving functional film was formed in the same manner as in Example 6.

  An electromagnetic shielding functional film having a thickness of 15 μm was formed on the adhesion improving functional film. The electromagnetic shielding functional film was formed in the same manner as in Example 6.

  A 10 μm thick hard coat functional film was formed on the electromagnetic shielding functional film. The hard coat functional film was formed in the same manner as in Example 6.

  On the back surface of the transparent substrate 1, a back surface conductive pattern 15 and a back surface extraction wiring pattern 16 were formed. The back surface conductive pattern 15 and the back surface extraction wiring pattern 16 were formed in the same manner as in Example 6 using a copper sputtered film.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

Example 8
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 and the lead wiring pattern 13 on the PET film were formed in the same manner as in Example 7 using a copper sputtered film.

  On the conductive pattern 12, an adhesion improving functional film having a thickness of 25 μm was formed. The adhesion improving functional film was formed in the same manner as in Example 7.

  An electromagnetic shielding functional film having a thickness of 15 μm was formed on the adhesion improving functional film. The electromagnetic wave shielding functional film was formed in the same manner as in Example 7.

  A 10 μm thick hard coat functional film was formed on the electromagnetic shielding functional film. The hard coat functional film was formed in the same manner as in Example 7.

  On the back surface of the transparent substrate 1, a back surface conductive pattern 15 and a back surface extraction wiring pattern 16 were formed. The back surface conductive pattern 15 and the back surface extraction wiring pattern 16 were formed in the same manner as in Example 7 using a copper sputtered film.

  An electromagnetic wave shielding functional film having a thickness of 10 μm was formed on the back surface of the back surface conductive pattern 15 and the back surface extraction wiring pattern 16. The electromagnetic wave shielding functional film was formed in the same manner as in Example 7.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

Example 9
The transparent substrate 1 was a PET film having a thickness of 100 μm. On this PET film, first, a nickel layer (0.5 μm) was formed by electrolytic plating on a copper sputtered film (42 inch size, base material thickness 50 μm PET, sheet resistance 10 Ω / □). On this film, lattice-like channel patterning and lead wiring patterning were simultaneously performed by a photolithography process to form conductive patterns 12 and lead wiring patterns 13. The grating width was 5 mm and L / S = 60/60 (μm).

  On the conductive pattern 12, an adhesion improving functional film having a thickness of 25 μm was formed. The adhesion improving functional film was formed in the same manner as in Example 8.

  An electromagnetic shielding functional film having a thickness of 15 μm was formed on the adhesion improving functional film. The electromagnetic shielding functional film was formed in the same manner as in Example 8.

  A 10 μm thick hard coat functional film was formed on the electromagnetic shielding functional film. The hard coat functional film was formed in the same manner as in Example 8.

  On the back surface of the transparent substrate 1, a back surface conductive pattern 15 and a back surface extraction wiring pattern 16 were formed. The back surface conductive pattern 15 and the back surface lead wiring pattern 16 are made of a nickel layer (0.5 μm) by electrolytic plating on a copper sputtered film (42 inch size, base material thickness 50 μm PET, sheet resistance 10Ω / □), as described above. On the film, lattice-like channel patterning and lead wiring patterning were simultaneously performed by a photolithography process.

  An electromagnetic wave shielding functional film having a thickness of 10 μm was formed on the back surface of the back surface conductive pattern 15 and the back surface extraction wiring pattern 16. The electromagnetic shielding functional film was formed in the same manner as in Example 8.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

[Comparative Example 1]
The transparent substrate 1 was a PET film having a thickness of 100 μm. The conductive pattern 12 on the PET film was formed of an ITO pattern, and the lead wiring pattern 13 was formed of silver wiring (similar to Example 1).

  A 15 μm thick hard coat functional film was formed on the conductive pattern 12. The hard coat functional film was formed in the same manner as in Example 1.

  And this transparent planar device was bonded together facing the display device (surface panel) through the 10-micrometer-thick OCR layer, and the display device with a touch panel was created. A control IC (arithmetic circuit) was bonded to the lead wiring pattern 13.

[Evaluation]
(Scratch resistance)
About each Example and the comparative example, the hardness of the hard-coat functional film was confirmed by the pencil hardness test. That is, using a test pencil specified by JIS-S6006, according to the pencil hardness evaluation method specified by JIS-K5400, the hard coat functional film was repeatedly scratched with a pencil of each hardness using a weight of 500 g, and the scratch was damaged. Up to one hardness was measured. And hardness was evaluated based on the following criteria.

(Evaluation criteria)
3: 2H or more 2: H
1: F or less In all the examples, it was 3, and in Comparative Example 1, it was 1.

(Bending resistance)
About each Example and the comparative example, the transparent planar device before joining to a display device was bent 180 degree | times using the iron round bar of diameter 5mm, and was reciprocated n times. At this time, the edge of the transparent planar device was brought into contact with the opposite edge.

  After that, the function of the transparent planar device was evaluated and the presence or absence of errors such as disconnection or short circuit was evaluated.

(Evaluation criteria)
3: n = 3000 times or more without abnormality 2: n = no abnormality up to 1000 times, partial error occurring at 3000 times 1: partial error occurring at n = 100 times All of Examples 3 to 9 are 2 or more (Example 5) It was 3) in ˜9, and 1 in Comparative Example 1.

(Surface uniformity)
About each Example and the comparative example, about the outermost surface of the display device, the distance of 30 cm was set | placed from the front and the angle of 45 degrees diagonally, and the presence or absence of the nonuniformity was discriminate | determined visually.

(Evaluation criteria)
3: No unevenness 2: Unevenness in the area of 10% or less of the whole, but slight 1: Unevenness within 30% of the whole In each example, 2 or more (3 in Examples 4 to 9), Comparative Example 1 Then it was 1.

(Noise immunity)
About each Example and the comparative example, the fluorescent lamp of 30W was arrange | positioned in the distance of 20 cm in front of a display device, and the presence or absence of the malfunction by the noise of a transparent planar device was evaluated.

(Evaluation criteria)
3: No malfunction 2: Malfunction in several channels 1: Malfunction in more than half of the channels All the examples were 2 or more (3 in Examples 1 and 4 to 9), and 1 in Comparative Example 1. .

(High temperature and high humidity resistance)
About each Example and the comparative example, after putting a transparent planar device on the conditions of 85 degreeC and 85% RH, the presence or absence of malfunction of the transparent planar device was evaluated in normal temperature environment.

(Evaluation criteria)
4: No abnormality after 1000 hours of environmental evaluation 3: No abnormality until 500 hours of environmental evaluation 2: 500% of channel abnormalities in 500 hours of environmental evaluation 1: More than half of channel abnormalities in 500 hours of environmental evaluation Each implementation In the examples, all were 2 or more (3 in Examples 2-3, 4 in Examples 4-9), and 1 in Comparative Example 1.

1: Transparent substrate 1a: Front surface 1b: Back surface 11: Transparent conductive film 12: Conductive pattern 13: Lead wiring pattern 14: Cured resin layer 15: Back conductive pattern 16: Back lead wiring pattern 17: Back cured resin layer

Claims (18)

A transparent substrate with the back surface facing the display device;
A transparent conductive film comprising a conductive pattern and formed on the surface of the transparent base material to constitute a contact input surface;
A lead-out wiring pattern located on the outer edge side of the transparent substrate than the transparent conductive film and electrically connected to the conductive pattern of the transparent conductive film,
And at least one cured resin layer formed on at least a part of the conductive pattern and the lead-out wiring pattern,
At least one of the cured resin layers is an electromagnetic wave shielding functional film, a migration preventing functional film, or an adhesion improving functional film.   The transparent planar device according to claim 1, wherein the total thickness of the cured resin layer is 41 μm or more and less than 300 μm.   3. At least one of the cured resin layers is a hard coat functional film, an ultraviolet absorption functional film, a smoothing functional film, an antireflection functional film, or an anti-fingerprint functional film. Transparent planar device. The curable resin layer includes at least two layers formed on at least a part of the conductive pattern and the lead-out wiring pattern, and at least two layers formed on the first layer group. It consists of the above second layer group,
At least one layer of the first layer group is a smoothing functional film or an adhesion improving functional film,
The at least one layer in the second layer group is a hard coat functional film, an antireflection functional film, an anti-fingerprint functional film, or an ultraviolet absorption functional film. Transparent planar device.   The transparent planar device according to claim 1, wherein the conductive pattern and the lead-out wiring pattern are made of a metal material.   6. The transparent planar device according to claim 1, wherein the conductive pattern and the lead wiring pattern are made of two or more kinds of metal materials.   The transparent planar device according to claim 6, wherein an outermost layer of the conductive pattern and the lead-out wiring pattern has an antioxidant function.   The transparent planar device according to claim 1, wherein the electromagnetic wave shielding functional film has a fine line pattern made of a metal material that performs electromagnetic wave shielding. A back transparent conductive film formed on the back surface of the transparent substrate including a conductive pattern;
Located on the outer edge side of the transparent base material than the back transparent conductive film, and is electrically connected to the conductive pattern of the back transparent conductive film;
Comprising at least one or more back side cured resin layers formed on at least a part of the back side conductive pattern and the back side lead wiring pattern;
The film thickness of the said back surface cured resin layer is 0.5 times or more and less than 2 times the total thickness of the cured resin layer formed in the surface side of the said transparent base material, Any one of Claims 1-8 characterized by the above-mentioned. A transparent planar device according to claim 1.   10. The transparent planar device according to claim 9, wherein the total thickness of the back surface cured resin layer is 50% or more and less than 200% of the total thickness of the curable resin layer on the surface side of the transparent substrate.   The transparent surface device according to claim 9 or 10, wherein the back surface cured resin layer includes an ultraviolet absorbing functional film.   The transparent surface device according to claim 9 or 10, wherein the back surface cured resin layer includes an electromagnetic wave shielding functional film.   The transparent planar device according to claim 9, wherein the back surface conductive pattern and the back surface lead-out wiring pattern are made of a metal material.   13. The transparent planar device according to claim 9, wherein the back surface conductive pattern and the back surface lead-out wiring pattern are made of two or more kinds of metal materials.   15. The transparent planar device according to claim 14, wherein the outermost layer of the back surface conductive pattern and the back surface lead-out wiring pattern has an antioxidant function.   16. The transparent planar device according to claim 12, wherein the electromagnetic wave shielding functional film has a fine line pattern made of a metal material that performs electromagnetic wave shielding.   At least one line-shaped liquid containing a conductive material is applied on the transparent substrate, and a coffee stain phenomenon is caused in the line-shaped liquid to be dried and thinned to form a pair of thin lines per line-shaped liquid. A transparent planar device comprising: forming a pattern, and performing electroplating on the fine line pattern to form the conductive pattern, wherein the transparent planar device according to any one of claims 1 to 8 is manufactured. Manufacturing method.   At least one line-shaped liquid containing a conductive material is applied on the transparent substrate, and a coffee stain phenomenon is caused in the line-shaped liquid to be dried and thinned to form a pair of thin lines per line-shaped liquid. A transparent planar device characterized in that a pattern is formed, and the back surface conductive pattern is formed by performing electrolytic plating on a fine line pattern to produce the transparent planar device according to any one of claims 9 to 16. Device manufacturing method.

Images