JP2017207318A - Module and sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a module and a sensor device that dispense with a configuration used for only positioning, and with which it is possible to suppress an increase in component counts.SOLUTION: A sensor module 1 is approximately configured by comprising: an electronic circuit 3 for performing a predetermined process; a substrate 2 on which the electronic circuit 3 is arranged; a pin header 5 having one end bent and connected to a pad 4 provided on the substrate 2 and electrically connected to the electronic circuit 3 via the pad 4 and having the other end serving as a connector terminal 93; and a primary molded body 7 obtained by encapsulating the electronic circuit 3, the substrate 2 and one end of the pin header 5 with resin in such a way that the connector terminal 93 is exposed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a module and a sensor device.

  As a conventional technique, a magnetic sensor element, an IC (Integrated Circuit) that is wire-bonded to the magnetic sensor element, amplifies the output of the magnetic sensor element, performs a predetermined process, and outputs the magnetic sensor element, and applies a magnetic bias to the magnetic sensor element A magnetic sensor module including a magnet is known (for example, see Patent Document 1).

  In this magnetic sensor module, a magnetic sensor element and an IC are arranged on a frame. The magnetic sensor module has leads that are wire-bonded to the IC, and the magnetic sensor element, IC, magnet, frame, and leads are sealed with a sealing resin.

JP 2014-52267 A

  When a secondary mold body is formed by further performing secondary molding on a magnetic sensor module that has been subjected to primary molding such as a conventional magnetic sensor module, the structure for positioning with the mold becomes the magnetic sensor module. Necessary. As an example, when this positioning structure is such that a part of the frame or the like protrudes from the magnetic sensor module, a gap may be formed between the secondary mold body and liquid such as water may enter the interior. There is.

  Accordingly, an object of the present invention is to provide a module and a sensor device that do not require a configuration used only for positioning and can suppress an increase in the number of parts.

  According to one embodiment of the present invention, an electronic circuit that performs a predetermined process, a base body on which the electronic circuit is disposed, and a pad that is bent at one end and provided on the base body are bonded to the electronic circuit through the pad. A pin header that is electrically connected to the circuit and the other end of which is a connector terminal used for positioning in the secondary molding, and one end of the electronic circuit, the base, and the pin header so that the connector terminal is exposed And a primary mold body obtained by resin-sealing.

  According to the present invention, a configuration used only for positioning is not required, and an increase in the number of parts can be suppressed.

FIG. 1A is a schematic diagram illustrating an example of a sensor module according to the embodiment, and FIG. 1B is a side view illustrating an example of the sensor module. FIG. 2A is a side view showing an example of the pin header of the sensor module according to the embodiment, and FIG. 2B is a schematic view showing an example of an anchor portion of the pin header.

(Summary of embodiment)
The module according to the embodiment includes an electronic circuit that performs a predetermined process, a base body on which the electronic circuit is disposed, and a pad that is bent at one end and is provided on the base body. A primary molded body obtained by resin-sealing the electronic circuit, the base, and one end of the pin header so that the connector terminal is exposed, and a pin header that is electrically connected to the electronic circuit and the other end is a connector terminal And is schematically configured.

[Embodiment]
(Outline of sensor module 1)
FIG. 1A is a schematic diagram illustrating an example of a sensor module according to the embodiment, and FIG. 1B is a side view illustrating an example of the sensor module. FIG. 2A is a side view showing an example of the pin header of the sensor module according to the embodiment, and FIG. 2B is a schematic view showing an example of an anchor portion of the pin header. A short dotted line shown in FIG. 1A and FIG. 1B shows an example of a schematic shape of the primary mold body 7. A long dotted line indicates an example of the outline of the secondary mold body 90. Note that, in each drawing according to the embodiment described below, the ratio between figures may be different from the actual ratio.

  As an example, the module of the present embodiment is a sensor module 1 including a sensor element 30 that measures a physical quantity, as shown in FIGS. 1 (a) and 1 (b). Although this sensor module 1 is mounted in a vehicle as an example, it is not limited to this.

  The sensor module 1 is bonded to an electronic circuit 3 that performs a predetermined process, a substrate 2 as a base on which the electronic circuit 3 is disposed, and a pad 4 that is bent at one end and provided on the substrate 2. In addition, the pin header 5 is electrically connected to the electronic circuit 3 through the pad 4 and the other end thereof becomes the connector terminal 93, and one end of the electronic circuit 3, the substrate 2, and the pin header 5 so that the connector terminal 93 is exposed. And a primary mold body 7 obtained by resin-sealing the part.

  The sensor module 1 is further subjected to secondary molding and disposed as a sensor device 9 in the vehicle. As shown in FIGS. 1A and 1B, the sensor device 9 is formed by sealing the sensor module 1 with a resin so that a connector portion 92 from which the connector terminal 93 is exposed is formed. A secondary mold body 90 is provided for general configuration.

(Configuration of substrate 2)
As an example, the substrate 2 has a plate shape. The substrate 2 is, for example, a printed wiring board. The substrate 2 has an electronic circuit 3 formed on the surface 20. The substrate 2 also has a plurality of pads 4 that are electrically connected to the electronic circuit 3.

  The pad 4 has, for example, a rectangular shape. The pad 4 is formed using a conductive material such as gold or copper. The pad 4 of the present embodiment is formed by copper plating as an example.

(Configuration of electronic circuit 3)
As an example, the electronic circuit 3 includes a sensor element 30 and a plurality of electronic components 31 as shown in FIG.

  As an example, the sensor element 30 is a sensor that converts a detected physical quantity into an electrical quantity. As an example, this sensor is a magnetic sensor that converts a change in magnetic field accompanying the approach of a detection target into an electrical quantity. As an example, the detection target is an operation unit such as a brake lever.

  For example, the sensor element 30 has a detection surface 300 as shown in FIG. The sensor element 30 is positioned with reference to the center 301 of the detection surface 300, for example. The electronic component 31 is, for example, a resistor or a capacitor.

  For example, the electronic circuit 3 is configured to amplify a signal output from the sensor element 30 and output it to an electronic device electrically connected via the pad 4 and the pin header 5 as a predetermined process. ing. The predetermined process may include a correction process, an analog / digital conversion process, and the like as an example.

(Configuration of pin header 5)
In the sensor module 1, for example, as shown in FIG. 1A, a plurality of pin headers 5 are arranged at equal intervals. The pin header 5 is connected to a connector at a connection destination.

For example, as shown in FIGS. 2A and 2B, the pin header 5 is wider than the base 50 serving as the connector terminal 93, the bent portion 51, and the width W _{1 in} the short direction of the base 50. It is schematically configured to include an anchor portion 52 having a width W _2, a.

  The pin header 5 is formed in a quadrangular prism shape using, for example, a copper alloy. As an example, the pin header 5 may be nickel-plated on the surface, and a metal such as gold or tin or an alloy containing these metals may be plated on the nickel plating. The pitch of the pin header 5 is in accordance with the standard of the connector at the connection destination.

  The base 50 is sealed by the primary mold body 7 and the secondary mold body 90 on the bent portion 51 side. Further, the base 50 has a connector terminal 93 at a portion exposed from the secondary mold body 90.

  The bent portion 51 is formed by bending one end portion of the base portion 50. An anchor portion 52 is formed at the tip of the bent portion 51.

The anchor part 52 has the convex part 53 which protrudes from the both sides | surfaces of the bending part 51, as shown to Fig.2 (a) and FIG.2 (b). Due to the convex portion 53, the width W ₂ of the anchor portion 52 is wider than the width W _{1 of the} base portion 50. Therefore, since the anchor portion 52 has a larger contact area with the pad 4 than in the case where there is no convex portion, the bonding force with the substrate 2 is increased.

  Further, since the sensor module 1 is formed with the bent portion 51, even if a force acts in the direction of the arrow shown in FIG. 2B, the bent portion 51 becomes a resistance, compared with the case where only the anchor portion 52 is used. Thus, it is difficult for the connector terminal 93 to come off from the primary mold body 7 and the secondary mold body 90. Accordingly, in the sensor device 9, for example, peeling of the connector terminal 93 from the pad 4 and poor conduction between the pad 4 and the connector terminal 93 due to insertion / removal of the mating connector are suppressed.

  The bonding between the pad 4 and the anchor portion 52 is performed by an adhesive 6 as an example. As a modification, the pad 4 and the anchor portion 52 may be joined by welding or soldering.

(Configuration of primary mold body 7)
The primary mold body 7 covers and integrally forms the substrate 2, the electronic circuit 3, and the pin header 5 by molding with a sealing resin. The primary mold body 7 is obtained by curing a thermosetting molding material in which, for example, a PPS (Poly Phenylene Sulfide) resin or an epoxy resin is a main component and a silica filler is added. In the present embodiment, an epoxy resin is used as the thermosetting molding material. For example, the primary mold body 7 mainly protects the sensor element 30 and the like from environments such as light, heat, and humidity.

(Configuration of sensor device 9)
The sensor device 9 is formed by further performing secondary molding on the sensor module 1 formed by performing primary molding. By this secondary molding, a secondary mold body 90 is formed.

  The secondary mold body 90 is roughly configured to include a main body 91 that covers the primary mold body 7 and a connector portion 92 that has a cylindrical shape and exposes the connector terminals 93 inside the cylinder.

  The secondary mold body 90 is obtained by curing a thermosetting molding material containing, for example, a PPS resin or an epoxy resin. In the secondary mold body 90 of the present embodiment, an epoxy resin is used as a thermosetting molding material.

  Here, the secondary mold body 90 is formed by positioning the mold and the sensor module 1 and then pouring the sealing resin into the mold and curing the poured sealing resin. This positioning accuracy is mainly related to the detection accuracy and the connection with the mating connector.

  In the sensor module 1, the primary mold body 7 covers the sensor element 30. Since the sensor element 30 is thus covered, in the secondary molding, for example, the sensor module 1 can be set at a predetermined position of the mold while confirming the position of the sensor element 30 by imaging with a camera. Can not. Further, when a lead frame or the like protruding from the primary mold body 7 is provided only for positioning, a gap is generated between the secondary mold body 90 and the lead frame, and liquid or the like can enter the inside of the primary mold body 7. There is sex.

  In addition, when the position of the sensor module 1 and the mold used for the secondary molding is shifted, the relative positions of the sensor element 30 and the secondary mold body 90 are shifted. There is a possibility that the detection accuracy is lowered due to the displacement.

  Furthermore, when the relative position of the connector terminal 93 and the connector part 92 shift | deviates, the other party connector may be unable to connect to the connector part 92. FIG.

  In the present embodiment, since the pin header 5 is joined to the substrate 2, the distance L from the end surface 500 of the pin header 5 to the center 301 of the sensor element 30 can be directly measured, and an accurate distance L can be obtained. . Therefore, in the secondary molding, by positioning the mold with respect to the pin header 5 of the sensor module 1, the positional deviation between the sensor element 30 and the secondary mold body 90 can be reduced as compared with the case where this configuration is not adopted. Can be suppressed.

(Effect of embodiment)
Since the sensor module 1 according to the present embodiment does not require a configuration used only for positioning, an increase in the number of parts can be suppressed. The sensor module 1 is used for positioning the pin header 5 with a mold during secondary molding. Therefore, since the sensor module 1 does not need a configuration for positioning, an increase in the number of parts can be suppressed as compared with the case where it is necessary.

  Since the sensor module 1 does not need a configuration only for positioning, it is not necessary to change the structure in order to adopt this configuration.

  Since the sensor module 1 joins the pin header 5 to the pad 4 of the substrate 2, there is nickel plating or the like for improving the joining of the wire as compared with the case of using a lead frame that is electrically connected by the pad and the wire. There is no need and the manufacturing cost can be reduced. In the sensor module 1, the pin header 5 is joined to the pad 4 of the substrate 2, so that disconnection of the pin header 5 due to insertion / removal of the mating connector and poor conduction with the pad 4 are suppressed.

  In the sensor device 9, when the mating connector is inserted and removed, the bent portion 51 of the pin header 5 becomes a resistance, and the disconnection of the pin header 5 from the primary mold body 7 and the secondary mold body 90 and the poor conduction with the pad 4 are suppressed. .

  Since the sensor device 9 does not perform positioning with the mold by a member that is used only for positioning that protrudes from the sensor module 1, no gap is generated in places other than the connector terminal 93, and entry of liquid or the like can be suppressed. .

  The embodiment and the modification of the present invention have been described above. However, the embodiment and the modification are merely examples, and do not limit the invention according to the claims. The novel embodiments and modifications can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the spirit of the present invention. In addition, not all the combinations of features described in the embodiments and the modifications are essential to the means for solving the problems of the invention. Furthermore, this embodiment and modification are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 ... Sensor module, 2 ... Board | substrate, 3 ... Electronic circuit, 4 ... Pad, 5 ... Pin header, 6 ... Adhesive, 7 ... Primary molding body, 9 ... Sensor apparatus, 20 ... Surface, 30 ... Sensor element, 31 ... Electronics Components: 50 ... Base part, 51 ... Bent part, 52 ... Anchor part, 53 ... Convex part, 90 ... Secondary molded body, 91 ... Main body, 92 ... Connector part, 93 ... Connector terminal, 300 ... Detection surface, 301 ... Center, 500 ... end face

Claims (3)

An electronic circuit for performing a predetermined process;
A substrate on which the electronic circuit is disposed;
One end is bent and joined to a pad provided on the base and electrically connected to the electronic circuit through the pad, and the other end serves as a connector terminal during secondary molding. A pin header used for positioning;
A primary mold body obtained by resin sealing one end of the electronic circuit, the base body and the pin header so that the connector terminal is exposed;
With module. The pin header includes a base portion serving as the connector terminal, and an anchor portion having a width wider than a width in a short direction of the base portion,
The anchor portion is joined to the pad;
The module according to claim 1. The electronic circuit has a sensor element for measuring a physical quantity,
The sensor apparatus provided with the secondary mold body formed by resin-sealing the module of Claim 1 or 2 so that the connector part which the said connector terminal exposes may be formed.

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