JP2017199819A - Electronic control apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic control apparatus capable of enhancing solder connection reliability while ensuring heat radiation performance.SOLUTION: The electronic control apparatus includes: a circuit board 3; a BGA7; a cover 2; and a heat conductive material 8. The BGA7 has an arrangement of solder bumps and is electrically connected to the circuit board 3 via the solder bumps. The cover 2 accommodates the circuit board 3. The heat conductive material 8 is disposed between the BGA7 and the cover 2. A distance between the BGA7 and the cover 2 on at least one solder bump 9d arranged on the outermost periphery of the arrangement of the solder bumps is larger than a distance between the BGA7 and the cover 2 on a solder bump 9b arranged other than the outermost periphery.SELECTED DRAWING: Figure 3B

Description

  The present invention relates to an electronic control device.

  An automobile is equipped with an electronic control device such as an engine control unit or an automatic transmission control unit, and the electronic control device performs electronic control of the vehicle. The electronic control unit houses a circuit board on which various electronic components are mounted in a protective space (waterproof space) formed inside a casing formed by joining a plurality of casing members. Electronic components that generate heat during operation, such as an arithmetic processing unit (CPU) and a semiconductor switching element, are mounted on the circuit board. If the heat generated by these electronic components is confined in the housing and becomes high temperature, there is a risk of malfunction or component destruction, so a structure for radiating heat to the outside is required.

  Conventionally, in order to dissipate the heat inside the housing, a structure is known in which the heat is conducted to the inner wall surface of the housing member and radiated from the outer wall surface of the housing member to the atmosphere (for example, Patent Document 1). Patent Document 1 discloses a structure in which a space between an electronic component mounted on a back surface of a circuit board and a case is filled with a heat radiating material without a gap.

JP 2012-199451 A

  With the technique disclosed in Patent Document 1, heat dissipation performance can be ensured by interposing a component made of a heat conductive material between the surface facing the electronic component on the inner wall surface side of the housing member and the electronic component. .

  However, since the heat conducting material is in direct contact with the electronic component, the heat deformation of the casing and the influence of external force are transmitted to the electronic component. Due to this influence, stress is applied to an electrical connection portion by solder between the electronic component and the circuit board, and connection reliability is lowered. Furthermore, in recent years, the mounting environment of in-vehicle electronic devices has shifted to a severe high temperature environment, and thermal stress applied to the electrical connection portion has increased.

  On the other hand, among the electronic components, a package form such as an arithmetic processing unit (CPU) is a BGA in which bump-shaped connection terminals (hereinafter referred to as solder bumps) are provided on the bottom surface of the component for the purpose of downsizing the circuit board. A (Ball Grid Array) package is used to reduce the size of electronic components and increase the number of terminals. However, the BGA package has a structure in which it is difficult to relieve the thermal stress generated on the solder bump due to the difference in thermal expansion coefficient between the electronic component and the circuit board. For this reason, cracks may occur and propagate in the solder bumps, leading to breakage.

  An object of the present invention is to provide an electronic control device capable of improving solder connection reliability while ensuring heat dissipation performance.

  To achieve the above object, the present invention accommodates a circuit board, an electronic component having an array of solder bumps and electrically connected to the circuit board via the solder bumps, and the circuit board. A housing, a heat conductive material disposed between the electronic component and the housing, and the electronic component and the housing on at least one solder bump disposed on an outermost periphery of the solder bump array. The distance between the bodies is larger than the distance between the electronic component and the housing on the solder bumps arranged outside the outermost periphery.

  According to the present invention, it is possible to improve solder connection reliability while ensuring heat dissipation performance. Problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

1 is a perspective view of an electronic control device according to a first embodiment of the present invention. 1 is an exploded perspective view of an electronic control device according to a first embodiment of the present invention. FIG. 2B is a detailed view of a portion B shown in FIG. 2A. FIG. 3 is a top view of a protrusion formed on a cover of the electronic control device according to the first embodiment of the present invention. FIG. 3B is a cross-sectional view of the protrusion shown in FIG. 3A. FIG. 5 is an exploded perspective view of an electronic control device according to a second embodiment of the present invention. FIG. 4B is a detailed view of a part D shown in FIG. 4A. FIG. 6 is a top view of a protrusion formed on a cover of an electronic control device according to a second embodiment of the present invention. FIG. 5B is a cross-sectional view of the protrusion shown in FIG. 5A. FIG. 6 is an exploded perspective view of an electronic control device according to a third embodiment of the present invention. FIG. 6B is a detailed view of a portion F shown in FIG. 6A. FIG. 10 is a top view of a protrusion formed on a cover of an electronic control device according to a third embodiment of the present invention. FIG. 7B is a cross-sectional view of the protrusion shown in FIG. 7A. FIG. 7 is an exploded perspective view of an electronic control device according to a fourth embodiment of the present invention. FIG. 8B is a detailed view of a portion H shown in FIG. 8A. FIG. 10 is a top view of a protrusion formed on a cover of an electronic control device according to a fourth embodiment of the present invention. FIG. 9B is a cross-sectional view of the protrusion shown in FIG. 9A. FIG. 10 is an exploded perspective view of an electronic control device according to a fifth embodiment of the present invention. FIG. 10B is a detailed view of a portion K shown in FIG. 10A. FIG. 10 is a top view of a protrusion formed on a cover of an electronic control device according to a fifth embodiment of the present invention. FIG. 11B is a cross-sectional view of the protrusion shown in FIG. 11A. FIG. 10 is an exploded perspective view of an electronic control device according to a sixth embodiment of the present invention. FIG. 12B is a detailed view of a portion P shown in FIG. 12A. FIG. 10 is a top view of a protrusion formed on a cover of an electronic control device according to a sixth embodiment of the present invention. FIG. 13B is a cross-sectional view of the protrusion shown in FIG. 13A. FIG. 10 is an exploded perspective view of an electronic control device according to a seventh embodiment of the present invention. FIG. 14B is a detailed view of a portion R shown in FIG. 14A. FIG. 10 is a top view of a protrusion formed on a cover of an electronic control device according to a seventh embodiment of the present invention. FIG. 15B is a cross-sectional view of the protrusion shown in FIG. 15A. FIG. 20 is an exploded perspective view of an electronic control device according to an eighth embodiment of the present invention. FIG. 16B is a detailed view of a portion S shown in FIG. 16A. FIG. 20 is a top view of a protrusion formed on a cover of an electronic control device according to an eighth embodiment of the present invention. FIG. 17B is a cross-sectional view of the protrusion shown in FIG. 17A. FIG. 10 is an exploded perspective view of an electronic control device according to a ninth embodiment of the present invention. FIG. 18B is a detailed view of a portion S shown in FIG. 18A. FIG. 16 is a top view of a protrusion formed on a cover of an electronic control device according to a ninth embodiment of the present invention. FIG. 19B is a cross-sectional view of the protrusion shown in FIG. 19A.

  Hereinafter, the configuration and operational effects of the electronic control device according to the first to ninth embodiments of the present invention will be described with reference to the drawings. In each figure, the same numerals indicate the same parts.

(First embodiment)
FIG. 1 is a perspective view of the electronic control device A according to the first embodiment, and FIGS. 2 (2A, 2B) are exploded perspective views thereof. The electronic control device A is mounted on an automobile and used for controlling an engine, a transmission, a brake, or the like, for example.

  The electronic control device A includes a circuit board 3 on which electronic parts such as heat-generating parts are mounted, and a connector 4 that is attached to the circuit board 3 and electrically connects an external circuit formed on the circuit board 3 to an external device. And a base 1 in which the circuit board 3 is accommodated, a cover 2 that covers the circuit board 3 accommodated in the base 1, and a heat conductive material 8 disposed between the electronic component and the cover 2. Yes.

  The circuit board 3 is held on the cover 2 or the base 1 by, for example, board fixing screws 6 or the like. The base 1 and the cover 2 are fixed by, for example, a case fixing screw 5 or the like. The circuit board 3 is actually mounted with a plurality of various electronic components in addition to the illustrated electronic components.

  The electronic component is, for example, a BGA 7, and the BGA 7 is electrically connected to the circuit board 3 through a plurality of solder bumps 9 arranged in a lattice or staggered pattern. Therefore, the BGA 7 has a structure in which it is difficult to relieve the thermal stress generated in the solder bump due to the difference in coefficient of thermal expansion between the BGA 7 and the circuit board 3. As a result, cracks may be generated and propagated in the solder bumps 9, leading to breakage.

  In general, it is known that the connection reliability of the solder bumps 9a at the four corners where the difference in thermal expansion between the BGA 7 and the circuit board 3 is the largest is low. Therefore, when the heat conductive material 8 is arranged over the entire upper part of the BGA 7 as in the prior art, the heat conductive material 8 gives influences to the solder bumps 9a at the four corners due to the thermal deformation of the casing and external forces. Sex is reduced.

  3 (3A, 3B) is a projection 10 formed at a position 7e facing the BGA 7 when the cover 2 of the electronic control device A shown in FIG. 2 (2A, 2B) is viewed from the z direction, The cross section is shown.

  In order to improve the solder connection reliability of the BGA 7, it is desirable to separate the BGA 7 and the cover 2 as much as possible so that the BGA 7 is not affected by thermal deformation or external force of the cover 2. On the other hand, the heat resistance between the BGA 7 and the cover 2 increases as the distance between the BGA 7 and the cover 2 increases, so that the heat dissipation performance of the electronic control device A decreases.

  Therefore, in this embodiment, the distance formed between the BGA 7 and the cover 2 is far (distance y) above the outermost solder bump 9d in a lattice or staggered pattern, and close (distance x) above the solder bump 9b excluding the outermost circumference. Thus, the protrusion 10 is provided with a taper 15.

  In other words, as shown in FIG. 3B, the distance between BGA 7 (electronic component) and cover 2 (housing) on at least one solder bump 9d arranged on the outermost periphery of the solder bump array is the outermost periphery. It is larger than the distance between the BGA 7 and the cover 2 on the solder bump 9b arranged in the other area.

  The base 1 and the cover 2 constitute a housing that accommodates the circuit board 3. The cover 2 (housing) has a protrusion 10 (convex portion) formed at a position facing the BGA 7 (electronic component). In the present embodiment, the protrusion 10 (convex portion) has a quadrangular pyramid shape as shown in FIG. 2A, and as shown in FIG. 3B, at least one solder arranged on the outermost periphery of the solder bump array. On the bump 9d, there is a surface that is inclined with respect to the protruding direction of the protrusion 10 (convex portion).

  As a result, the thermal resistance between the BGA 7 and the cover 2 at the top of the semiconductor chip 7a that generates the most heat can be reduced, and the influence of thermal deformation of the cover 2 applied to the outermost solder bump 9d and external force can be suppressed.

  Therefore, according to the present embodiment, it is possible to improve the solder connection reliability while ensuring the heat dissipation performance. That is, the solder connection reliability can be increased without degrading the heat dissipation performance of the electronic control unit A.

  As shown in FIG. 3B, the cover 2 (housing) has a plurality of heat radiation protrusions (heat radiation fins) on the back surface of the protrusion 10 (convex portion). The shape of the heat dissipation protrusion is, for example, a flat plate or a substantially cylindrical shape. The heat conducting material 8 is in contact with the BGA 7 (electronic component). Thereby, heat dissipation performance can be improved.

(Second embodiment)
4 (4A, 4B) is a perspective view of the electronic control device A according to the second embodiment of the present invention, FIG. 5 (5A, 5B) is a cover of the electronic control device A shown in FIG. 4 (4A, 4B) 2 shows a protrusion 10 formed at a position 7e facing the BGA 7 when viewed from the z direction, and a cross section thereof.

  Only the distance y between the mold resin 7b on the solder bump 9a at the four corners and the protrusion 10 is farther than the distance x between the mold resin 7b on the solder bump excluding the four corners and the protrusion 10.

  In other words, as shown in FIG. 5B, the distance between the BGA 7 (electronic component) and the cover 2 (housing) on the solder bumps 9a arranged at the four corners of the solder bump array is arranged at other than the four corners. Greater than the distance between the BGA 7 and the cover 2 on the solder bumps to be made.

  In the present embodiment, as shown in FIG. 5B, the protrusions 10 (projections) are projected on the solder bumps 9a arranged at the four corners (the axis of the protrusion 10). Having a surface inclined with respect to.

  According to the present embodiment, since the area of the surface (upper surface) of the protrusion 10 facing the BGA 7 is larger than that in the first embodiment, the heat dissipation performance of the electronic control device A can be further enhanced.

(Third embodiment)
6 (6A, 6B) is a perspective view of the electronic control device A according to the third embodiment of the present invention, FIG. 7 (7A, 7B) is a cover of the electronic control device A shown in FIG. 6 (6A, 6B) 2 shows a protrusion 10 formed at a position 7e facing the BGA 7 when viewed from the z direction, and a cross section thereof.

  Compared with the second embodiment, the present embodiment is not limited to the solder bumps 9a at the four corners, but the mold resin on the outermost solder bumps 9c adjacent to the four corners, which is next to the four corners and has low solder connection reliability. Since the distance y formed between 7b and the protrusion 10 is farther than the distance x formed between the mold resin 7b and the protrusion 10 on the other solder bumps, the solder connection reliability of the electronic control device A can be further improved. .

  In other words, as shown in FIG. 7B, between the BGA 7 (electronic component) and the cover 2 (housing) on the solder bump 9a disposed at the four corners of the solder bump array and the solder bump 9c adjacent to the four corners. Is larger than the distance between the BGA 7 and the cover 2 on the solder bumps excluding the solder bumps 9a disposed at the four corners and the solder bumps 9c adjacent to the four corners. The solder bumps 9c adjacent to the four corners are arranged on the outermost periphery of the solder bump array.

  In the present embodiment, as shown in FIG. 7B, the protrusion 10 (projection) is formed on the solder bump 9a disposed at the four corners and the solder bump 9c adjacent to the four corners. It has a surface inclined with respect to the protruding direction (the axis of the protruding portion 10).

  According to the present embodiment, particularly, the solder connection reliability of the solder bumps 9a at the four corners and the outermost solder bump 9c adjacent to the four corners can be improved.

(Fourth embodiment)
8 (8A, 8B) is a perspective view of the electronic control device A according to the fourth embodiment of the present invention, and FIG. 9 (9A, 9B) is a cover of the electronic control device A shown in FIG. 8 (8A, 8B). 2 shows a protrusion 10 formed at a position 7e facing the BGA 7 when viewed from the z direction, and a cross section thereof.

  In the present embodiment, the protrusion 10 is formed in a substantially circular shape as compared with the third embodiment. In other words, the protrusion 10 (convex portion) has a truncated cone shape as shown in FIG. 8A. Also in this shape, similarly to the first embodiment, it is possible to improve the solder connection reliability without reducing the heat dissipation performance of the electronic control device A.

(Fifth embodiment)
10 (10A, 10B) is a perspective view of the electronic control device A according to the fifth embodiment of the present invention, and FIG. 11 (11A, 11B) is a cover of the electronic control device A shown in FIG. 10 (10A, 10B). 2 shows a protrusion 10 formed at a position 7e facing the BGA 7 when viewed from the z direction, and a cross section thereof.

  In this embodiment, the surface 11 of the protrusion 10 in contact with the heat conductive material 8 is formed in a curved surface as compared with the fourth embodiment. In other words, the protrusion 10 (convex portion) has a dome shape as shown in FIG. 10A. Also in this shape, similarly to the first embodiment, it is possible to improve the solder connection reliability without reducing the heat dissipation performance of the electronic control device A.

(Sixth embodiment)
12 (12A, 12B) is a perspective view of the electronic control device A according to the sixth embodiment of the present invention, and FIG. 13 (13A, 13B) is a cover of the electronic control device A shown in FIG. 12 (12A, 12B). 2 shows a protrusion 10 formed at a position 7e facing the BGA 7 when viewed from the z direction, and a cross section thereof.

  Since the distance between the BGA 7 and the cover 2 is long, the possibility that the heat conductive material 8 arranged on the solder bumps 9a at the four corners flows out from the upper part of the BGA 7 is increased. Accordingly, the protrusion 12 is formed on the outer periphery of the protrusion 10 so as to surround the region where the heat conductive material 8 is disposed. In other words, as shown in FIG. 13 (13A, 13B), the cover 2 (housing) has a projection 12 (first projection) formed on the outer periphery of the projection 10 (convex portion) so as to surround the heat conductive material 8. 1 protrusion).

  Therefore, this embodiment can suppress the deterioration of the heat dissipation performance of the electronic control device A due to the outflow of the heat conducting material 8, as compared with the fifth embodiment.

(Seventh embodiment)
14 (14A, 14B) is a perspective view of the electronic control device A according to the seventh embodiment of the present invention, and FIG. 15 (15A, 15B) is a cover of the electronic control device A shown in FIG. 14 (14A, 14B). 2 shows a protrusion 10 formed at a position 7e facing the BGA 7 when viewed from the z direction, and a cross section thereof.

  In the present embodiment, as compared with the sixth embodiment, the protrusions 13 and 14 are further formed on the inner periphery of the protrusion 12. In other words, as shown in FIG. 15 (15A, 15B), the cover 2 (housing) has at least one protrusion 13, 14 (second protrusion) in an area surrounded by the protrusion 12 (first protrusion). ). Therefore, the deterioration of the heat dissipation performance of the electronic control device A due to the outflow of the heat conductive material 8 can be further suppressed.

(Eighth embodiment)
16 (16A, 16B) is a perspective view of the electronic control device A according to the eighth embodiment of the present invention, and FIG. 17 (17A, 17B) is a cover of the electronic control device A shown in FIG. 16 (16A, 16B). 2 shows a protrusion 10 formed at a position 7e facing the BGA 7 when viewed from the z direction, and a cross section thereof.

  In the present embodiment, the BGA 7 is mounted on the circuit board 3 on the side opposite to the cover 2 as compared with the first embodiment. As a method for conducting heat generated by the BGA 7 to the cover 2 as shown in FIG. 17B, a method using a heat conducting material 8 and the circuit board 3 is generally widely known. As shown in FIG. 17B, the heat conductive material 8 is in contact with the circuit board 3.

  Even if this method is used, the distance between the circuit board 3 and the cover 2 is far (distance y) above the outermost solder bump 9d and close (distance x) above the solder bump 9b except the outermost periphery. By providing the protrusion 15 with the taper 15, it is possible to improve the solder connection reliability without degrading the heat dissipation performance of the electronic control unit A, as in the first embodiment.

(Ninth embodiment)
18 (18A, 18B) is a perspective view of the electronic control device A according to the ninth embodiment of the present invention, and FIG. 19 (19A, 19B) is a cover of the electronic control device A shown in FIG. 18 (18A, 18B). 2 shows a protrusion 10 formed at a position 7e facing the BGA 7 when viewed from the z direction, and a cross section thereof.

  In the present embodiment, compared with the eighth embodiment, the heat generated in the semiconductor chip 7a is conducted to the circuit board 3 through the heat spreader 7h formed in a block shape with a metal member such as copper. It is characterized by that. In other words, as shown in FIG. 19B, the electronic control unit A includes a block-shaped heat spreader 7h (metal member) disposed between the BGA 7 (electronic component) and the circuit board 3. Thereby, the heat dissipation performance of the electronic control unit A can be further enhanced as compared with the eighth embodiment.

  The heat spreader 7h is made of copper, for example. As shown in FIG. 19B, a through hole may be provided in the portion of the circuit board 3 that the heat spreader 7h contacts. Thereby, heat dissipation performance can be improved.

  In addition, this invention is not limited to above-described embodiment, Various modifications are included. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to the one having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. In addition, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

  In addition, the following aspects may be sufficient as embodiment of this invention.

  (1) An electronic control device having a circuit board on which an electronic component is mounted and a housing for housing the circuit board, wherein a heat conductive material is disposed between the electronic component and the housing. The component is electrically connected to the circuit board via a plurality of solder bumps arranged in a lattice or zigzag pattern, and the electronic component on the top of at least one solder bump in the outermost periphery of the lattice or zigzag pattern An electronic control device characterized in that a distance formed between a component and the casing is farther than a distance formed between an electric / electronic component and the casing at an upper portion of a solder bump excluding the outermost periphery.

  (2) In the electronic control device according to (1), the distance formed between the electronic component and the housing at the upper part of the grid-shaped or staggered four corners of the solder bump is at the upper part of the solder bump other than the four corners. An electronic control device characterized in that the electronic control device is farther than a distance formed by the electronic component and the housing.

  (3) In the electronic control device according to (1), the distance between the electronic component and the housing at the outermost solder bumps adjacent to the four corners and the four corners in a lattice or staggered shape is 4 An electronic control device characterized by being farther than the distance formed by the electronic component and the housing in the upper part of the solder bump excluding the outermost solder bump adjacent to the corner and the four corners.

  (4) In the electronic control device according to any one of (1), (2), and (3), the convex portion of the casing formed at a position facing the electronic component is substantially circular. Electronic control device.

  (5) In the electronic control device according to any one of (1), (2), (3), and (4), the convex portion of the housing formed at a position facing the electronic component is a curved surface. Electronic control device characterized.

  (6) In the electronic control device according to any one of (1), (2), (3), (4), and (5), the outer periphery of the convex portion of the casing formed at a position facing the electronic component Further, the electronic control device further comprises a protrusion formed so as to surround a region where the heat conductive material is disposed.

  (7) The electronic control device according to (6), wherein the electronic control device has one or a plurality of protrusions on an inner periphery of a protrusion formed so as to surround a region where the heat conductive material is disposed. apparatus.

  (8) In the electronic control device of any one of (1), (2), (3), (4), (5), (6), and (7), the casing faces the electronic component An electronic control device comprising a plurality of flat plate or substantially cylindrical protrusions on a back surface of a convex portion formed at a position.

  (9) In the electronic control device according to any one of (1), (2), (3), (4), (5), (6), (7), (8), the heat conducting material is the electron. An electronic control device that is in contact with a component.

  (10) In the electronic control device of any one of (1), (2), (3), (4), (5), (6), (7), (8), the heat conducting material is the circuit. An electronic control device which is in contact with a substrate.

  (11) The electronic control device according to (10), wherein a block-shaped metal member is provided between the semiconductor element of the electronic component and the circuit board.

  (12) The electronic control device according to (11), wherein the metal member is copper.

A ... Electronic control unit
1… Base
2… Cover
3… Circuit board
4… Connector
5… Housing fixing screw
6… Board fixing screws
7… BGA
7a ... Semiconductor chip
7b ... Mold resin
7c ... Interposer
7e: Position facing the BGA
7h ... heat spreader
8… Heat conductive material
9… Solder bump
9a… 4 corner solder bumps
9b… Solder bumps other than 4 corners
9c… The outermost solder bump adjacent to the four corners
9d ... outermost solder bump
10 ... Projection
11… Curved surface
12 ... Protrusions
13 ... Protrusion on the inner periphery from the protrusion 12
14… Protrusions on the inner periphery from the protrusions 13

Claims (14)

A circuit board;
An electronic component having an array of solder bumps and electrically connected to the circuit board via the solder bumps;
A housing for housing the circuit board;
A heat conducting material disposed between the electronic component and the housing,
The distance between the electronic component and the housing on at least one solder bump disposed on the outermost periphery of the solder bump array is such that the electronic component and the housing on the solder bump disposed on the outermost periphery. An electronic control device characterized by being larger than the distance between the bodies. The electronic control device according to claim 1,
The distance between the electronic component and the housing on the solder bumps arranged at the four corners of the solder bump array is between the electronic component and the housing on the solder bumps arranged at other than the four corners. An electronic control device characterized by being larger than the distance. The electronic control device according to claim 1,
The solder bumps arranged at the four corners of the solder bump array and the distance between the electronic component and the housing on the solder bumps adjacent to the four corners are the solder bumps arranged at the four corners and the 4 An electronic control device, wherein a distance between the electronic component and the housing on a solder bump excluding a solder bump adjacent to a corner is larger. The electronic control device according to claim 1,
The housing is
An electronic control device comprising a convex portion formed at a position facing the electronic component. The electronic control device according to claim 4,
The convex portion is
An electronic control device characterized by having a truncated cone shape. The electronic control device according to claim 4,
The convex portion is
An electronic control device characterized by a dome shape. The electronic control device according to claim 4,
The housing is
An electronic control device comprising a first protrusion formed on the outer periphery of the convex portion so as to surround the heat conductive material. The electronic control device according to claim 7,
The housing is
An electronic control apparatus comprising: at least one second protrusion in a region surrounded by the first protrusion. The electronic control device according to claim 4,
The housing is
An electronic control device comprising a plurality of heat-dissipating protrusions on the back surface of the convex portion. The electronic control device according to claim 1,
The heat conducting material is
An electronic control device, wherein the electronic control device is in contact with the electronic component. The electronic control device according to claim 1,
The heat conducting material is
An electronic control device, wherein the electronic control device is in contact with the circuit board. The electronic control device according to claim 11,
An electronic control device comprising: a block-shaped metal member disposed between the electronic component and the circuit board. The electronic control device according to claim 12,
The metal member is
An electronic control device characterized by being copper. The electronic control device according to claim 4,
The convex portion is
An electronic control device comprising: a surface that is inclined with respect to a protruding direction of the convex portion on at least one solder bump disposed on an outermost periphery of the solder bump array.

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