JP2017146492A - Film with protective film for laminating transparent conductive film, and method of manufacturing transparent conductive film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film with a protective film for laminating a transparent conductive film, which offers a superior property that prevents multiple sheet pickups, which is maintained even when a surface thereof is wiped clean.SOLUTION: A film with a protective film for laminating a transparent conductive film 1a, 1b comprises a film 3a, 3b for laminating a transparent conductive film and a protective film 2, the film 3a, 3b for laminating a transparent conductive film comprising a support material 31 and a first functional layer 32, and the protective film 2 comprising a base material 22, an adhesive layer 23, and a coating layer 21. A surface of the coating layer 21 on a side opposite the base material 22 has a surface resistance value of 1.0×10Ω/cmor less, and has a surface resistance value of 1.0×10Ω/cmor less even after wiping the surface under a predetermined condition, and at least either of this surface or a surface of the first functional layer 32 on a side opposite the support material 31 has an arithmetic mean roughness Ra of 7 nm or greater.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a transparent conductive film-laminated film with a protective film that can be used for the production of a transparent conductive film, and a method for producing a transparent conductive film.

  In various mobile electronic devices such as smartphones and tablet terminals in recent years, a touch panel is often used as a display. As a touch panel system, there are a resistive film system, a capacitive system, and the like. In the mobile electronic device, a capacitive system is mainly adopted.

  In these touch panels, a transparent conductive film in which a transparent conductive film made of patterned tin-doped indium oxide (ITO) or the like is laminated on a transparent conductive film lamination film mainly composed of a transparent plastic substrate is used. There is.

  In order to protect the surface of the transparent conductive film laminating film (or transparent conductive film) as described above where the transparent conductive film is not laminated, a protective film may be applied to the surface in order to improve handling properties. It has been proposed (Patent Document 1). This protective film is provided with the base film and the adhesive layer, and is affixed on the film for transparent conductive film lamination through the adhesive layer.

Japanese Patent No. 4137551

  By the way, the transparent conductive film laminating film to which the protective film is attached as described above (hereinafter sometimes referred to as “transparent conductive film laminating film with protective film”) may be handled as a single wafer type. is there. In this case, a plurality of transparent conductive film laminating films with a protective film are laminated, and from the laminate, the transparent conductive film laminating films with a protective film are taken one by one by machine or manual work and subjected to a desired process. .

  When handling a transparent conductive film laminated film with a protective film in a single-wafer type as described above, even if you try to take only the topmost one of the laminate, it is opposite to the transparent conductive film laminated film of the protective film A plurality of sheets can be removed at the same time due to sticking of the side surface and the surface opposite to the protective film of the transparent conductive film laminating film (hereinafter sometimes referred to as “multiple taking”). There is. When such multiple acquisition occurs, workability is significantly reduced.

  Moreover, when cutting (cutting) is performed on the protective film or the transparent conductive film-laminated film with the protective film, the adhesive of the adhesive layer of the protective film is protected from the cut portion of the adhesive layer. The film may move to the surface of the film for laminating a transparent conductive film and may adhere to the surface. In this case, the surface is wiped using a cloth impregnated with an organic solvent such as isopropyl alcohol, and the attached adhesive is removed.

  Here, in the protective film disclosed in Patent Document 1, an antistatic layer is provided on the surface of the base film opposite to the pressure-sensitive adhesive layer to prevent the generation of static electricity when the protective film is used. Is planned. However, in the protective film, when the above-described wiping is performed on the surface on the antistatic layer side, the antistatic layer may be removed together with the adhesive. When the antistatic layer is removed in this manner, the protective film cannot sufficiently prevent multiple taking.

  The present invention has been made in view of the above circumstances, and has an excellent anti-multiple property, even when the surface is wiped to remove the adhesive that has adhered, It aims at providing the film for transparent conductive film lamination | stacking with a protective film by which prevention property is maintained. Moreover, an object of this invention is to provide the manufacturing method of an efficient transparent conductive film.

In order to achieve the above object, first, the present invention provides a protection comprising a transparent conductive film laminating film and a protective film attached to the surface of the transparent conductive film laminating film on which the transparent conductive film is not laminated. A transparent conductive film laminating film with a film, wherein the transparent conductive film laminating film comprises a support and a first functional layer laminated on a surface of the support opposite to the protective film. The protective film is laminated on the surface of the base material, the pressure-sensitive adhesive layer on the transparent conductive film laminating film side of the base material, and the surface of the base material opposite to the pressure-sensitive adhesive layer. The surface resistance value of the surface of the coat layer opposite to the substrate is 1.0 × 10 ¹² Ω / cm ² or less, and is opposite to the substrate in the coat layer. The side surface is The surface resistance value of the surface after wiping 10 times with a load of 125 g / cm ² and a speed of 10 mm / s using a cellulose nonwoven fabric impregnated with propyl alcohol was 1.0 × 10 ¹² Ω / cm ² or less, and the substrate in the coating layer arithmetic average roughness Ra of at least one surface opposite to the support in the opposite side surface and the first functional layer, in 7nm more A transparent conductive film-laminated film with a protective film is provided (Invention 1).

  In the said invention (invention 1), since a protective film is provided with a coating layer and the surface resistance value of the said coating layer is the said range, generation | occurrence | production of static electricity is prevented, For transparent conductive film lamination with a protective film by static electricity Sticking between films is suppressed. Moreover, after wiping as described above, the film for transparent conductive film laminating with a protective film is provided even after the surface is wiped to remove the attached adhesive by showing the surface resistance value as described above. The effect of suppressing sticking between each other is maintained well. Furthermore, when arithmetic mean roughness Ra in any one surface of the transparent conductive film lamination film with a protective film is the said range, it becomes difficult to produce the blocking at the time of laminating | stacking the transparent conductive film lamination film with a protective film. . As described above, the transparent conductive film-laminated film with a protective film can exhibit an excellent anti-multiple property, and further, even when the surface is swept, the anti-multiple property is maintained.

  In the said invention (invention 1), it is preferable that the said coating layer is formed from the coating agent containing a binder and an antistatic agent (invention 2).

  In the said invention (invention 2), it is preferable that the said antistatic agent is a conductive polymer (invention 3).

  In the said invention (invention 1-3), it is preferable that said 1st functional layer is an optical adjustment layer (invention 4).

  In the said invention (invention 1-4), it is preferable that the said film for transparent conductive film lamination is further provided with the 2nd functional layer laminated | stacked on the surface on the opposite side to said 1st functional layer in the said support body. (Invention 5).

  2ndly, this invention is the process of forming the layer containing a transparent conductive material on the surface on the opposite side to the said protective film in the film for transparent conductive film lamination with the said protective film (invention 1-5), The step of cutting the transparent conductive film-laminated film with a protective film together with the layer containing the formed transparent conductive material into a predetermined size, crystallizing the layer containing the formed transparent conductive material, A process for producing a transparent conductive film, and a process for patterning the transparent conductive film are provided (Invention 6).

  The film for laminating a transparent conductive film with a protective film of the present invention has an excellent anti-multiple property, and even when the surface is wiped to remove the attached adhesive, etc. Is maintained. Moreover, according to the method of this invention, a transparent conductive film can be manufactured efficiently.

It is sectional drawing of the film for transparent conductive film lamination with a protective film which concerns on the 1st Embodiment of this invention. It is sectional drawing of the film for transparent conductive film lamination with a protective film which concerns on the 2nd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described.
FIG. 1 shows a transparent conductive film laminating film 1a with a protective film according to the first embodiment. This transparent conductive film laminating film 1a with a protective film is composed of a transparent conductive film laminating film 3a and a protective film 2 laminated on the transparent conductive film laminating film 3a. The transparent conductive film laminating film 3 a in this embodiment includes a support 31 and a first functional layer 32 laminated on one surface of the support 31. The protective film 2 includes a base material 22, a pressure-sensitive adhesive layer 23 laminated on one surface of the base material 22, and a coat layer 21 laminated on the other surface of the base material 22. Here, the transparent conductive film laminating film 3a and the protective film 2 are laminated so that the support 31 in the transparent conductive film laminating film 3a and the adhesive layer 23 in the protective film 2 are in contact with each other.

  FIG. 2 shows a transparent conductive film laminating film 1b with a protective film according to the second embodiment. This transparent conductive film laminating film 1b with a protective film is composed of a transparent conductive film laminating film 3b and a protective film 2 laminated on the transparent conductive film laminating film 3b. The transparent conductive film laminating film 3b in the present embodiment includes a support 31, a first functional layer 32 laminated on one surface of the support 31, and a second laminated on the other surface of the support 31. Functional layer 33. On the other hand, the protective film 2 has the same configuration as the protective film 2 of the transparent conductive film laminating film 1a with the protective film. Here, the transparent conductive film laminating film 3b and the protective film 2 are laminated so that the second functional layer 33 in the transparent conductive film laminating film 3b and the adhesive layer 23 in the protective film 2 are in contact with each other. .

  In addition, in film 1a, 1b for transparent conductive film lamination with a protective film which concerns on this embodiment, a transparent conductive film is formed on the surface by the side of the 1st functional layer 32 in film 3a, 3b for transparent conductive film lamination. Will be. In FIG. 1 and FIG. 2, the patterned transparent conductive film 4 formed on the said surface is shown with the broken line.

1. Physical Properties In the transparent conductive film laminating films 1a and 1b with a protective film, the surface resistance value of the surface of the coat layer 21 opposite to the substrate 22 is 1.0 × 10 ¹² Ω / cm ² or less. It is preferably 0 × 10 ¹¹ Ω / cm ² or less, and particularly preferably 1.0 × 10 ¹⁰ Ω / cm ² or less. When the surface resistance value exceeds 1.0 × 10 ¹² Ω / cm ² , the transparent conductive film laminating film with a protective film is laminated when the transparent conductive film laminating films 1a and 1b with a protective film are laminated. Static electricity is generated at 1a and 1b. Due to this static electricity, the coating layer 21 and the first functional layer 32 in contact with the coating layer 21 stick to each other, resulting in multiple capture. On the other hand, the lower limit value of the surface resistance value is not particularly limited, but may be 1.0 × 10 ⁵ Ω / cm ² or more from the viewpoint that a material design that does not cause a decrease in scratch resistance, transparency, or the like is possible. preferable. In addition, the measuring method of a surface resistance value is as showing to the test example mentioned later.

In the transparent conductive film-laminated films 1a and 1b with a protective film, a surface of the coat layer 21 opposite to the base material 22 is made of cellulose nonwoven fabric impregnated with isopropyl alcohol, and a load of 125 g / cm ² and 10 mm. The surface resistance value of the above surface after wiping 10 times at a speed of / s is 1.0 × 10 ¹² Ω / cm ² or less, and preferably 1.0 × 10 ¹¹ Ω / cm ² or less. In particular, it is preferably 5.0 × 10 ¹⁰ Ω / cm ² or less. On the other hand, the lower limit value of the surface resistance value is not particularly limited, but is 1.0 × 10 ⁶ Ω / cm ² or more from the viewpoint that a material design that does not cause deterioration of scratch resistance or transparency is possible. It is preferable. In addition, as an example of the said nonwoven fabric made from a cellulose, the waste marketed as a product name "Bencot S-2" from Asahi Kasei Fibers Corporation is mentioned. The transparent conductive film laminating films 1a and 1b with protective films exhibit such a surface resistance value, so that even after the surface has been wiped off in order to remove the adhesive or the like attached to the surface, an excellent multi-layering is achieved. Preventability is maintained. Furthermore, the fact that the surface resistance is exhibited after such wiping means that the coating layer 21 exists without being removed. Therefore, the oligomer block property described later is also maintained well after the above-described wiping.

  In the transparent conductive film-laminated films 1a and 1b with protective film, the arithmetic average of at least one of the surface of the coat layer 21 opposite to the base 22 and the surface of the first functional layer 32 opposite to the support 31 is obtained. The roughness Ra is 7 nm or more, preferably 10 nm or more, and particularly preferably 15 nm or more. The arithmetic average roughness Ra is preferably 500 nm or less, particularly preferably 200 nm or less, and more preferably 100 nm or less. When the arithmetic average roughness Ra is less than 7 nm, blocking tends to occur when the laminated transparent conductive film-laminated films 1a and 1b with protective film are laminated. Moreover, when the arithmetic average roughness Ra is 500 nm or less, the smoothness of the surfaces of the first functional layer 32 and the transparent conductive film 4 becomes good, and these functions are effectively exhibited. In addition, since the thickness of the transparent conductive film 4 formed on the surface of the first functional layer 32 opposite to the support 31 is very thin, what is the first functional layer 32 in the transparent conductive film 4? The arithmetic average roughness Ra on the opposite surface is substantially the same as the arithmetic average roughness Ra on the surface of the first functional layer 32 opposite to the support 31. Therefore, even when the transparent conductive film 4 is formed, the multi-layer preventing property when the transparent conductive film-laminated films 1a and 1b with protective films are laminated is effectively exhibited. Further, from the viewpoint of easy control of the arithmetic average roughness Ra, it is preferable that the surface of the coat layer 21 on the side opposite to the substrate 22 satisfies the arithmetic average roughness Ra described above. The method for measuring the arithmetic average roughness Ra is as shown in the test examples described later.

2. Protective film (1) Coat layer Although the material of the coat layer 21 is not particularly limited as long as it satisfies the above-described physical properties, the coat layer 21 is formed of a coating agent containing a binder and an antistatic agent. Is preferred. The coating agent preferably further contains a release agent.

  In particular, the material of the coating layer 21 is preferably a material that is difficult to be removed by the waste when the surface of the coating layer 21 is wiped with a waste impregnated with an organic solvent such as isopropyl alcohol. From this viewpoint, it is preferable to use a material having a relatively large molecular weight as the material of the coat layer 21. A material having a relatively large molecular weight easily forms a structure intertwined with each other, and the resulting coat layer 21 is hardly dissolved in an organic solvent. Thereby, the coat layer 21 has good resistance to wiping with a waste impregnated with an organic solvent.

  In general, when a protective film having an antistatic layer is used to obtain a laminate of a transparent conductive film laminating film with a protective film, the transparent conductive film laminating film is obtained from the antistatic layer of the protective film. In some cases, the components in the antistatic layer locally migrate to the surface on which the transparent conductive film is laminated. When a transparent conductive film is formed on the transparent conductive film laminating film in which such local migration has occurred, the transparent conductive film is formed in a state where defects such as unevenness and omission occur due to the influence of the migrated components. May end up. In addition, when laminating a transparent conductive film-laminated film with a protective film with a transparent conductive film formed, the components of the antistatic layer migrate from the antistatic layer to the transparent conductive film in contact therewith. The performance of the transparent conductive film may be adversely affected. In the transparent conductive film laminating films 1a and 1b with a protective film according to this embodiment, these problems can be effectively prevented.

  Examples of the binder include polyacrylic resins, polyurethane resins, epoxy resins, polyester resins, vinyl resins, amide resins, and the like. These resins may be used in combination of plural kinds. When the antistatic agent or release agent has a crosslinkable functional group, the binder is at least one of a carbonyl group, a hydroxy group, an acrylic group, a urethane group, a carboxy group, an epoxy group, an isocyanato group, an amide group, and an imide group. It is preferable to have a functional group of

  Examples of the antistatic agent include conductive polymers, surfactants, and conductive fine particles. These compounds may be used in combination of multiple types. When the coating agent contains an antistatic agent, the surface resistance value of the surface of the coating layer 21 obtained on the side opposite to the base material 22 can be easily adjusted to the above-described range. Among the antistatic agents, it is preferable to use a conductive polymer having a relatively large molecular weight from the viewpoint of easily forming a structure intertwined with the binder.

  Examples of the conductive polymer include polythiophenes such as polythiophene, poly (3-methylthiophene), poly (3,4-ethylenedioxythiophene), polymers having a sulfonic acid group such as polystyrene sulfonate, polyvinyl sulfonate, and polyacryl sulfonate. , Polyacetylene, polyaniline and the like. Surfactants include anionic surfactants such as fatty acid sodium and monoalkyl sulfates; cationic surfactants such as alkyltrimethylammonium salts and dialkyldimethylammonium salts; amphoteric interfaces such as sodium alkylamino fatty acids Activators: Nonionic surfactants such as polyoxyethylene alkyl ethers and alkyl monoglyceryl ethers are listed. Examples of the conductive fine particles include tin oxide, indium oxide, silver, carbon black, and carbon nanotube.

  The blending amount of the antistatic agent in the coating agent is preferably 1 part by mass or more, particularly preferably 5 parts by mass or more, and more preferably 10 parts by mass or more with respect to 100 parts by mass of the binder. Is preferred. Further, the blending amount of the antistatic agent in the coating agent is preferably 50 parts by mass or less, particularly preferably 40 parts by mass or less, and more preferably 20 parts by mass or less with respect to 100 parts by mass of the binder. Preferably there is. By mix | blending an antistatic agent in the said range, it becomes easy to adjust the surface resistance value in the surface on the opposite side to the base material 22 in the coat layer 21 obtained to the above-mentioned range.

  Examples of the release agent include silicone resin release agents, fluororesin release agents, long chain alkyl group-containing compound release agents, alkyd resin release agents, olefin resin release agents, acrylic release agents, rubber release agents, and the like. The release agent. These release agents may be used in combination of multiple types. When the coating agent contains a release agent, the surface free energy of the surface of the coating layer 21 obtained on the side opposite to the substrate 22 can be made relatively low. As a result, even when the adhesive is attached to the surface of the protective film or the transparent conductive film-laminated film with the protective film in a cutting process or the like, the coat layer 21 and the first functional layer 32 in contact therewith Sticking is less likely to occur, and multiple taking is effectively prevented.

  The silicone resin release agent includes a solvent type and a solventless type. Since the solvent-type silicone resin is diluted with a solvent to form a coating solution, it can be widely used from a high molecular weight / high viscosity polymer to a low viscosity low molecular weight polymer (oligomer). Therefore, it is easy to control the peelability as compared with the solventless type, and it is easy to design in accordance with the required performance (quality). Examples of the silicone resin release agent include addition reaction type, condensation reaction type, ultraviolet curable type, and electron beam curable type. The addition reaction type silicone resin has high reactivity and excellent productivity, and has advantages such as little change in peel strength after production and no cure shrinkage compared to the condensation reaction type, and therefore, the coat layer 21 is formed. It is preferable to use it as a release agent.

  There is no restriction | limiting in particular as an addition reaction type silicone resin, A various thing can be used. For example, what is conventionally used as a conventional thermosetting addition reaction type silicone resin release agent can be used. Examples of the addition reaction type silicone resin include those having an electrophilic group such as an alkenyl group such as a vinyl group or a hydrosilyl group as a functional group in the molecule, and examples of the addition reaction type silicone resin that can be easily cured. In addition, polydimethylsiloxane having such a functional group, or those obtained by substituting a part or all of the methyl group of polydimethylsiloxane with an aromatic functional group such as a phenyl group can be used.

  As the fluororesin-based release agent, a compound having a perfluoroalkyl group or a fluorinated alkenyl group in the main chain or side chain can be used.

  Examples of the long-chain alkyl group-containing compound-based release agent include, for example, polyvinyl carbamate obtained by reacting a polyvinyl alcohol polymer with a long-chain alkyl isocyanate having 8 to 30 carbon atoms, or polyethyleneimine having 8 to 30 carbon atoms. An alkylurea derivative obtained by reacting a long-chain alkyl isocyanate is used.

  In addition, as the long-chain alkyl group-containing compound-based release agent, co-polymerization of an acrylate ester having a long-chain alkyl chain having 12 to 30 carbon atoms (preferably 18 to 25 carbon atoms) and other radical polymerizable monomers. A coalescence may be used. In this case, it is preferable to copolymerize a monomer having a carboxyl group or a hydroxyl group as the other radical polymerizable monomer. By copolymerizing the monomer, a cross-linked structure is formed between the long-chain alkyl group-containing compound-based release agent and the corresponding functional group of the binder, and the release agent is transferred from the coating layer 21 to the outside. Can be prevented. In addition, it is preferable that the ratio of the acrylic ester which has a long-chain alkyl chain with respect to the monomer which comprises the said copolymer is 40-95 mass%, It is especially preferable that it is 50-90 mass%, Furthermore, 60 It is preferable that it is -80 mass%.

  The blending amount of the release agent in the coating agent is preferably 5 parts by mass or more, particularly preferably 10 parts by mass or more, and more preferably 15 parts by mass or more with respect to 100 parts by mass of the binder. preferable. Further, the blending amount of the release agent in the coating agent is preferably 50 parts by mass or less, particularly preferably 40 parts by mass or less, and further preferably 30 parts by mass or less with respect to 100 parts by mass of the binder. It is preferable. By mix | blending a release agent in the said range, the surface free energy in the surface on the opposite side to the base material 22 in the coat layer 21 obtained falls moderately, and multiple taking is prevented effectively.

  The coating agent may contain additives such as an antifoaming agent, a coating property improver, a thickener, an organic lubricant, organic particles, and inorganic particles, as necessary.

  In the transparent conductive film-laminated films 1a and 1b with a protective film, the thickness of the coat layer 21 is preferably 5 nm or more, particularly preferably 10 nm or more, and further preferably 15 nm or more. The thickness is preferably 1,000 nm or less, particularly preferably 100 nm or less, and further preferably 50 nm or less. When the thickness of the coat layer 21 is in the above range, the surface resistance value before and after the surface wiping can be easily set in the above-described range. In general, when the transparent conductive film-laminated film with a protective film is heated for the purpose of crystallizing the transparent conductive material, the oligomer present in the base material of the protective film may move outside the base material. It is likely to occur. In particular, when the substrate is exposed on the surface of the protective film, the oligomer is likely to be deposited on the exposed surface of the substrate. When such oligomer precipitation occurs, not only the appearance is deteriorated, but also the apparatus is contaminated, and visual inspection of a transparent conductive film or the like is hindered. However, in the transparent conductive film laminating films 1a and 1b with a protective film, the coat layer 21 having the above-described thickness is laminated on the base material 22 to effectively suppress such oligomer precipitation. (Hereinafter, the property of suppressing the precipitation of the oligomer may be referred to as “oligomer block property”).

(2) Base material The material of the base material 22 is not particularly limited as long as the above-described physical properties can be achieved. Specific materials for the substrate 22 include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyolefin films such as polyethylene and polypropylene, cellophane, diacetyl cellulose film, triacetyl cellulose film, and acetyl cellulose butyrate film. , Polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film, polyether ether ketone film, polyether sulfone film, poly Etherimide film, polyimide film, fluororesin film, polyamid Film, acrylic resin film, norbornene resin film, a cycloolefin resin film, a polyphenylene sulfide film, a liquid crystal polymer film, and the like. These films may be a single layer or may be a film in which multiple layers of the same or different types are laminated. Among these, those having heat resistance that can withstand the heating conditions when crystallizing the transparent conductive film are preferable, and such materials include polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, polyimide, polyetherimide, polycarbonate, Examples thereof include plastic films made of resins such as polymethylpentene, polyphenylene sulfide, and liquid crystal polymer, and polyethylene terephthalate film is particularly preferable.

  In general, because the coat layer 21 is provided with a very thin thickness, the arithmetic average roughness Ra of the surface of the coat layer 21 opposite to the substrate 22 is equal to the coat layer 21 of the substrate 22. It tends to reflect the arithmetic average roughness Ra of the side surface. Therefore, as the material of the base material 22, it is preferable to use a material that can easily adjust the arithmetic average roughness Ra of the surface of the coat layer 21 on the side opposite to the base material 22 to the above-described range. In order to achieve the arithmetic average roughness Ra described above, a filler may be added to the material of the base material 22.

  The material of the base material 22 may contain additives such as a heat resistance improver and an ultraviolet absorber in addition to the filler.

  In the said base material 22, in order to improve adhesiveness with the coating layer 21 and the adhesive layer 23, or in order to achieve desired arithmetic mean roughness Ra, surface treatment by an oxidation method, an uneven | corrugated method, etc. Alternatively, primer treatment can be performed. Examples of the oxidation method include corona discharge treatment, plasma discharge treatment, chromium oxidation treatment (wet), flame treatment, hot air treatment, ozone, ultraviolet irradiation treatment, and the like. Examples include a thermal spraying method. These surface treatment methods are appropriately selected according to the type of the base film.

  The thickness of the base material 22 can be appropriately set from the viewpoint of workability, cost, etc. For example, the thickness is preferably 50 μm or more, particularly preferably 75 μm or more, and more preferably 100 μm or more. It is preferable. Further, the thickness of the base material 22 is preferably 200 μm or less, particularly preferably 150 μm or less, and more preferably 135 μm or less.

(3) Pressure-sensitive adhesive layer The material of the pressure-sensitive adhesive layer 23 is not particularly limited as long as the above-described physical properties can be achieved. The pressure-sensitive adhesive or pressure-sensitive adhesive generally used for a protective film for a transparent conductive film lamination film It can be formed using a sheet. Examples of the pressure-sensitive adhesive include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, polyester-based pressure-sensitive adhesives, and polyvinyl ether-based pressure-sensitive adhesives, among which acrylic pressure-sensitive adhesives are preferable. The adhesive may be active energy ray curable, or may be inactive energy ray curable.

  The thickness of the pressure-sensitive adhesive layer 23 can be appropriately set from the viewpoints of the adhesive strength, workability, cost, and the like of the protective film 2 to the transparent conductive film laminating films 3a and 3b, and is, for example, 1 μm or more. In particular, it is preferably 5 μm or more, more preferably 10 μm or more. Further, the thickness of the pressure-sensitive adhesive layer 23 is preferably 500 μm or less, particularly preferably 100 μm or less, and further preferably 30 μm or less.

(4) Protective Film Manufacturing Method The protective film 2 can be manufactured by providing the coating layer 21 on one surface of the base material 22 and providing the pressure-sensitive adhesive layer 23 on the other surface of the base material 22. The order in which the coat layer 21 and the pressure-sensitive adhesive layer 23 are provided is not limited, and either may be provided first, but the coat layer 21 is usually provided first.

  The coat layer 21 can be provided on one surface of the substrate 22 by a general method. In particular, when the coating layer 21 is provided using the above-described coating agent, first, the coating agent is prepared by diluting a binder, an antistatic agent, and optionally other additives such as a release agent in a diluting solvent. Prepare. As the diluting solvent, an organic solvent, water or the like can be appropriately selected and used depending on the material to be used. Next, the prepared coating agent is applied to one surface of the substrate 22 to form a coating film. Finally, the coating layer 21 is obtained by curing the coating film by heating, drying, or the like as necessary.

  The pressure-sensitive adhesive layer 23 is formed on the other surface (the surface opposite to the surface on which the coat layer 21 is provided, or the surface opposite to the surface on which the coat layer 21 is provided) by a general method. Can be provided. For example, by applying a coating liquid containing the above-mentioned pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive and, if desired, a diluting solvent on the release surface of the release sheet, and curing the applied layer, the release sheet and A laminate with the pressure-sensitive adhesive layer 23 is obtained. When the pressure-sensitive adhesive is curable with active energy rays, it may be cured by irradiating with active energy rays. Then, the adhesive layer 23 is provided with respect to the said surface of the base material 22 by sticking the surface on the opposite side to the peeling sheet in the adhesive layer 23 of the said laminated body to the other surface in the base material 22. be able to.

  For example, a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, a gravure coating method, or the like can be used as a method for applying the coating liquid of the coating agent and the adhesive composition.

3. Transparent Conductive Film Laminating Film (1) Support As the support 31, a material having transparency can be appropriately selected from known materials as a conventional optical substrate. In particular, it is preferable to use a plastic film having transparency as the support 31, for example, a polyester film such as a polyethylene terephthalate film, a polybutylene terephthalate film, a polyethylene naphthalate film, a polyethylene film, a polypropylene film, or a diacetyl cellulose film. , Triacetyl cellulose film, acetyl cellulose butyrate film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film, poly Ether ether ketone film, polyether sulfone film, polyether Bromide films, polyimide films, fluororesin films, polyamide films, acrylic resin films, norbornene resin films, plastic films such as cycloolefin resin film or a laminated film of them, and the like.

  Among these, a polyester film, a polycarbonate film, a polyimide film, a norbornene-based resin film, a cycloolefin resin film, and the like are preferable because they have strength suitable for a touch panel and the like. Among these, from the viewpoints of transparency and thickness accuracy, a polyester film is particularly preferable, and among them, a polyethylene terephthalate film is more preferable.

  The support 31 can be subjected to the same surface treatment as that of the substrate 22 of the protective film 2 described above for the purpose of improving the adhesion with the layer provided on the surface.

  The thickness of the support 31 is not particularly limited, but is preferably 15 μm or more, and particularly preferably 30 μm or more. Further, the thickness is preferably 300 μm or less, and particularly preferably 250 μm or less.

(2) Functional layer As the 1st functional layer 32, the layer which provides a desired function to a transparent conductive film can be selected suitably, and can be used. In particular, the first functional layer 32 is preferably an optical adjustment layer. Examples of the optical adjustment layer include an index matching layer, a hard coat layer, a layer in which an index matching layer and a hard coat layer are laminated, and the like.

  The index matching layer is a layer for making it difficult to see the pattern of the transparent conductive film 4 formed on the transparent conductive film laminating films 3a and 3b. When using for the touch panel etc. which use the transparent conductive film obtained, the visibility can be improved. This index matching layer is configured by combining a high refractive index layer and a low refractive index layer, for example. The material of these layers is not particularly limited, and a general index matching layer material can be used.

  The thickness of the index matching layer is not particularly limited, and is preferably 0.03 μm or more, and particularly preferably 0.05 μm or more. The thickness is preferably 3 μm or less, particularly preferably 1 μm or less, and more preferably 0.5 μm or less.

  The material for the hard coat layer is not particularly limited, and a conventionally known material can be used. For example, the hard coat layer is preferably formed using a material containing an energy beam curable compound. Examples of the energy ray curable compound include acrylic monomers or oligomers, and specific examples include polyfunctional (meth) acrylates, urethane (meth) acrylates, and polyester (meth) acrylates.

  There is no restriction | limiting in particular in the thickness of a hard-coat layer, It is preferable that it is 1 micrometer or more, and it is preferable that it is especially 2 micrometers or more. Further, the thickness is preferably 20 μm or less, and particularly preferably 10 μm or less.

  As the second functional layer 33 included in the transparent conductive film-laminated film 1b with a protective film, a layer that imparts a desired function to the transparent conductive film is appropriately selected and used in the same manner as the first functional layer 32. can do. In particular, the second functional layer 33 is preferably an optical adjustment layer. As the optical adjustment layer, the index matching layer, the hard coat layer, and the index matching layer and the hard coat layer as described above are laminated. Layer and the like.

  In the transparent conductive film laminating film 1b with a protective film, the first functional layer 32 and the second functional layer 33 may be layers having the same type of function, or layers having different functions. There may be. In particular, from the viewpoint that the obtained transparent conductive film easily exhibits desired performance, the first functional layer 32 is an index matching layer, or a layer formed by laminating an index matching layer and a hard coat layer. The second functional layer 33 is preferably a hard coat layer.

(3) Manufacturing method of transparent conductive film laminating film The transparent conductive film laminating films 3a and 3b can be manufactured by a known method. The transparent conductive film laminating film 3 a can be manufactured by forming the first functional layer 32 on one surface of the support 31. Further, the transparent conductive film laminating film 3 b is manufactured by forming the first functional layer 32 on one surface of the support 31 and forming the second functional layer 33 on the other surface of the support 31. can do. At this time, either the first functional layer 32 or the second functional layer 33 may be manufactured first.

4). The manufacturing method of a transparent conductive film A transparent conductive film can be manufactured using the films 1a and 1b for transparent conductive film lamination with a protective film. Examples of the method for producing a transparent conductive film include the following first production method and second production method.

  In the first manufacturing method, first, the transparent conductive film laminating films 3a and 3b and the protective film 2 are bonded together. At this time, when the transparent conductive film laminating film 3a is used, the surface of the support 31 opposite to the first functional layer 32 and the base material 22 in the adhesive layer 23 of the protective film 2 are Paste the opposite side. Moreover, when using the film 3b for transparent conductive film lamination, the base 22 in the adhesive layer 23 of the protective film 2 and the surface on the opposite side to the 1st functional layer 32 in the 2nd functional layer 33 are used. The opposite surface is bonded. Thereby, the transparent conductive film-laminated films 1a and 1b with protective films are obtained. This pasting may be performed by roll-to-roll.

Next, a layer containing a transparent conductive material is formed on the surface of the first functional layer 32 opposite to the support 31. As the transparent conductive material, any material having both transparency and conductivity can be used without particular limitation. For example, tin-doped indium oxide (ITO), iridium oxide (IrO ₂ ), indium oxide (In ₂ O ₃ ), Tin oxide (SnO ₂ ), fluorine-doped tin oxide (FTO), indium oxide-zinc oxide (IZO), zinc oxide (ZnO), gallium-doped zinc oxide (GZO), aluminum-doped zinc oxide (AZO), molybdenum oxide (MoO) ₃ ), and transparent conductive metal oxides such as titanium oxide (TiO ₂ ). Examples of the film forming method include a vacuum deposition method, a sputtering method, a CVD method, and an ion plating method. In addition, when the said bonding process is performed by roll to roll, it can be performed by roll to roll also about the film forming process.

  Next, the transparent conductive film-laminated films 1a and 1b with a protective film are cut into a predetermined size together with the layer containing the formed transparent conductive material. In particular, when the above-mentioned bonding step and film-forming step are performed by roll-to-roll, the film 1a, 1b for laminating the transparent conductive film with protective film is drawn out from the roll to a predetermined size. Cut continuously. Then, the laminated | multilayer film of the said film is obtained by laminating | stacking the transparent conductive film laminated | multilayer film 1a, 1b with a cut protective film.

  Next, the formed layer containing the transparent conductive material is heated on the cut films 1a and 1b for transparent conductive film with protective film. Thereby, a transparent conductive material is crystallized and a transparent conductive film is formed. The heating temperature is preferably 100 ° C. or higher, and particularly preferably 130 ° C. or higher. The heating temperature is preferably 180 ° C. or less, and particularly preferably 150 ° C. or less. In addition, you may perform this process in the state of the laminated body mentioned above.

  Finally, the formed transparent conductive film is patterned on the transparent conductive film-laminated films 1a and 1b with protective films. Patterning can be performed by photolithography and etching. Thereby, a transparent conductive film is obtained. The obtained transparent conductive film can be used for manufacturing a capacitive touch panel and the like after removing the protective film 2.

  In the second manufacturing method, first, a layer containing a transparent conductive material is formed on the surface of the first functional layer 32 of the transparent conductive film laminating films 3a and 3b on the side opposite to the support 31. At this time, the above-described materials can be used as the transparent conductive material, and the above-described method can be performed as a film forming method. This film formation may be performed roll-to-roll.

  Next, in the transparent conductive film laminating films 3a and 3b, the surface on the side where the layer containing the transparent conductive material is not formed, and the surface on the side opposite to the base material 22 in the adhesive layer 23 of the protective film 2 And paste. Thereby, the transparent conductive film-laminated films 1a and 1b with a protective film in a state where the layers containing the transparent conductive material are laminated are obtained. When the film forming process is performed by roll-to-roll, the bonding process can also be performed by roll-to-roll.

  Then, the step of cutting the transparent conductive film-laminated films 1a, 1b with protective film into a predetermined size together with the layer containing the formed transparent conductive material, crystallizing the layer containing the formed transparent conductive material The step of forming and the step of patterning the formed transparent conductive film are sequentially performed. These steps can be performed in the same manner as in the first production method. As described above, a transparent conductive film is obtained.

  Note that the cutting step can be performed at a stage different from the above-described method. For example, in the first production method, cutting between the step of bonding the transparent conductive film laminating films 3a, 3b and the protective film 2 and the step of forming a layer containing a transparent conductive material may be performed. it can. Moreover, in the 1st or 2nd manufacturing method, it can cut | judge between the process of crystallizing the layer containing a transparent conductive material, and the process of patterning the formed transparent conductive film. Furthermore, in the 1st or 2nd manufacturing method, it can cut | judge after the process of patterning the formed transparent conductive film. Further, the crystallization step can be performed after the patterning step.

  The transparent conductive film laminating films 1a and 1b with a protective film have an excellent anti-multiple property, and even when the surface is wiped to remove the adhesive and the like attached to the surface, the multiple The prevention of removal is maintained. Therefore, when taking out the films one by one from the laminate of the transparent conductive film laminating films 1a and 1b with protective films, the films do not stick to each other, and only one can be easily taken out. Moreover, even when the surface is wiped off, the coat layer 21 remains without being removed, so that excellent oligomer blockability is maintained. By the above, a transparent conductive film can be manufactured efficiently.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, another layer may be interposed between the base material 22 and the pressure-sensitive adhesive layer 23 in the protective film 2.

  EXAMPLES Hereinafter, although an Example etc. demonstrate this invention further more concretely, the scope of the present invention is not limited to these Examples etc.

[Example 1]
1. Preparation of coating composition for adhesive composition 20 parts by mass of 2-ethylhexyl acrylate (in terms of solid content; the same shall apply hereinafter), 75 parts by mass of butyl acrylate and 5 parts by mass of 4-hydroxyethyl acrylate acrylate An acid ester copolymer was prepared. When the molecular weight of this acrylate copolymer was measured by the method described later, it was 200,000 in weight average molecular weight (Mw).

  Uniformly mixing 100 parts by mass of the above acrylate copolymer, 6 parts by mass of hexamethylene diisocyanate isocyanurate (manufactured by Nippon Polyurethane Co., Ltd., trade name “Coronate HX”) as a crosslinking agent, and methyl ethyl ketone as a diluting solvent Then, a coating solution of an adhesive composition having a solid content concentration of about 28% by mass was prepared.

Here, the above-mentioned weight average molecular weight (Mw) is a polystyrene-reduced weight average molecular weight measured under the following conditions (GPC measurement) using gel permeation chromatography (GPC).
<Measurement conditions>
GPC measurement device: manufactured by Tosoh Corporation, HLC-8020
GPC column (passed in the following order): TSK guard column HXL-H manufactured by Tosoh Corporation
TSK gel GMHXL (× 2)
TSK gel G2000HXL
・ Measurement solvent: Tetrahydrofuran ・ Measurement temperature: 40 ° C.

2. Adjustment of coating agent Epoxy resin as binder (manufactured by Dainippon Ink and Chemicals, product name “CR-5L”; epoxy equivalent 180; water content 100%) 100 parts by weight and docosyl methacrylate 65 as release agent 20 parts by mass of a long-chain alkyl group-containing compound-based release agent obtained by copolymerization using 25% by mass, 25% by mass of methacrylic acid and 10% by mass of 2-hydroxyethyl methacrylate as constituent units, and poly ( A coating agent was prepared by uniformly mixing 10 parts by mass of a 3,4-ethylenedioxythiophene) / polystyrene sulfonate complex (manufactured by H.C. Starck, product name “Baytron P”) in an aqueous solution. .

3. Production of Protective Film Step 1 on the release surface of a release sheet (product name “SP-PET381031” manufactured by Lintec Corporation) in which a silicone release agent layer is formed on one side of a 38 μm thick PET film The coating solution of the pressure-sensitive adhesive composition prepared in 1 was applied with a comma coater, and the coating layer was dried in an oven at 90 ° C. for 1 minute to form a pressure-sensitive adhesive layer having a thickness of 20 μm. Thereby, the 1st laminated body by which an adhesive layer was formed on a peeling sheet was obtained.

  In addition, the coating agent prepared in step 2 is applied on one side of a long polyethylene terephthalate film (product name “Diafoil T100”, thickness: 125 μm) as a base material with a Meyer bar. The coating layer was dried at 130 ° C. for 2 minutes to form a coating layer having a thickness of 0.1 μm. Thereby, the 2nd laminated body in which the coating layer was formed on the base material was obtained.

  Then, the surface opposite to the release sheet in the pressure-sensitive adhesive layer of the first laminate and the surface opposite to the coat layer in the base material of the second laminate are bonded to form a roll. Winded up. Subsequently, by carrying out seasoning for 7 days in an environment of 23 ° C. and 50% RH, a release protective film in which a release sheet, an adhesive layer, a base material, and a coat layer were sequentially laminated was obtained.

4). Production of Transparent Conductive Film Laminating Film with Protective Film The release sheet was peeled from the protective film obtained in Step 3 above. And, as a transparent conductive film laminating film, a long transparent conductive film having a hard coat layer on one surface and a hard coat layer and an index matching layer laminated on the hard coat layer on the other surface The exposed surface of the protective film was attached to the surface on which only the hard coat layer of the film for film lamination F1 (manufactured by Lintec Corporation, product name “OPTERIA HM540-50”, thickness: 50 μm) exists. This was wound up to obtain a film for laminating a transparent conductive film with a roll-shaped protective film.

[Example 2]
A roll-shaped transparent conductive film-laminated film with a protective film was produced in the same manner as in Example 1 except that the thickness of the coat layer was changed to 60 nm.

Example 3
As a film for laminating a transparent conductive film, for laminating a long transparent conductive film having a hard coat layer on one side and a hard coat layer and an index matching layer laminated on the hard coat layer on the other side A roll-shaped transparent conductive film-laminated film with a protective film was produced in the same manner as in Example 1 except that the film F2 (manufactured by Lintec Corporation, product name “OPTERIA HM535-50”, thickness: 50 μm) was used.

[Comparative Example 1]
As the second laminate, a polyester film having an antistatic layer on one side (Mitsubishi Chemical Polyester Film, product name “T100G”, thickness: 38 μm) is used, and the antistatic in the second laminate is performed. A roll-shaped transparent conductive film-laminated film with a protective film was produced in the same manner as in Example 1 except that the surface on the side opposite to the layer and the surface on the pressure-sensitive adhesive layer side in the first laminate were bonded.

[Comparative Example 2]
100 parts by mass of pentaerythritol hexaacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., product name “NK Ester A-DPH”) as a binder and α-hydroxyphenyl ketone (manufactured by BASF, product name “Irgacure 184”) ]) 5 parts by mass was uniformly mixed in toluene as a diluent solvent to prepare a coating agent having a solid content concentration of about 5% by mass.

  The coating agent is applied on one surface of a long polyethylene terephthalate film (product name “Diafoil T100”, thickness: 125 μm, manufactured by Mitsubishi Plastics) as a base material using a Meyer bar. After drying at 0 ° C. for 1 minute, the coating layer was cured by irradiating with ultraviolet rays to form a coating layer having a thickness of 0.5 μm. Thereby, the 2nd laminated body in which the coating layer was formed on the base material was obtained. Except having used the said 2nd laminated body, it carried out similarly to Example 1, and manufactured the film for transparent conductive film lamination with a roll-shaped protective film.

[Comparative Example 3]
A roll-shaped transparent conductive film-laminated film with a protective film was produced in the same manner as in Example 3 except that the thickness of the coat layer was changed to 60 nm.

[Test Example 1] (Measurement of surface resistance)
The test samples obtained by cutting the roll-shaped protective film-laminated transparent conductive film-laminated films produced in the examples and comparative examples were stored for 24 hours in a standard environment (23 ° C., 50% RH). Thereafter, the surface resistance value (Ω) of the surface of the protective film coating layer opposite to the substrate was measured with an applied voltage of 100 V using a resistivity meter (manufactured by Mitsubishi Chemical Analytech, Hiresta UP MCP-HT450 type). / Cm ² ). The results are shown in Table 1 as surface resistance values before wiping.

Subsequently, the surface on the coat layer side of the test sample was loaded with 125 g / cm ² load, 10 reciprocations, speed 10 mm using a waste impregnated with isopropyl alcohol (product name “Bencot S-2” manufactured by Asahi Kasei Corporation). Wiping was performed under the conditions of / s. About the test sample after wiping, the surface resistance value (Ω / cm ² ) was measured as described above. The results are shown in Table 1 as the surface resistance value after wiping.

[Test Example 2] (Measurement of arithmetic average roughness Ra)
About the test sample obtained by cutting the roll-shaped protective film-coated transparent conductive film-laminated film produced in Examples and Comparative Examples, the surface on the side opposite to the substrate in the coat layer, and Arithmetic mean roughness Ra on the surface of the first functional layer opposite to the support was measured. First, it fixed to the glass plate via the double-sided tape so that the surface opposite to the surface to be measured may be the glass plate side. Next, the arithmetic average roughness Ra (nm) on the surface to be measured is measured in accordance with JIS B0601: 2013 using a surface roughness measuring machine (product name “rSV-3000S4”, stylus type) manufactured by Mitutoyo Corporation. Measured. The results are shown in Table 1.

[Test Example 3] (Evaluation of prevention of multiple removal)
A transparent conductive film laminating film with a protective film having a length of 40 cm and a width of 50 cm in the unwinding direction was continuously cut while feeding out the roll-shaped protective film with a transparent conductive film produced in Examples and Comparative Examples. 30 sheets were obtained. Next, the surface on the coat layer side of these protective films was 125 g / cm ² load, 10 reciprocations, speed using waste impregnated with isopropyl alcohol (product name “Bencot S-2” manufactured by Asahi Kasei Fibers). Wiping was performed under conditions of 10 mm / s. About the film for transparent conductive film lamination with a protective film after wiping, it piles so that the surface by the side of the coating layer 21 of a protective film and the surface by the side of the 1st functional layer of the film for transparent conductive film lamination may contact. Thus, a laminate formed by laminating 30 films for laminating a transparent conductive film with a protective film was obtained.

A test in which all 30 samples are manually removed one by one from the obtained laminate in 5 minutes, and each of the three testers conducts multiple measurements. did. Furthermore, the average value was calculated from the test results of three people, and the multiple removal prevention property was evaluated based on the following criteria. The results are shown in Table 1.
A: The average number of multiple shots was 0.
○: The average number of times of multiple sampling was 1 to 2 times.
(Triangle | delta): The average frequency | count of multiple picking was 3-5 times.
X: The average number of times of multiple picking was 6 times or more.

[Test Example 4] (Evaluation of oligomer block property)
About the test sample obtained by cutting the roll-shaped transparent conductive film-laminated film with protective film produced in Examples and Comparative Examples, the thermostatic bath was placed at 150 ° C., 60 with the surface on the protective film side down. After heating for 30 minutes, it was allowed to stand for 60 minutes in a standard environment (23 ° C., 50% RH) and cooled. Then, the external appearance of the film for transparent conductive film lamination with a protective film was observed, and oligomer block property was evaluated based on the following reference | standard.
○: No change in appearance.
X: Whitening occurred.

[Test Example 5] (Evaluation of film forming property of transparent conductive film)
A tin-doped indium oxide (ITO) target (tin oxide 10) was applied to the first functional layer of the test sample obtained by cutting the roll-shaped protective film-laminated transparent conductive film-laminated film produced in Examples and Comparative Examples. The ITO was crystallized by annealing at 150 ° C. for 30 minutes. Thereby, a transparent conductive film having a thickness of 30 nm was formed.

The appearance of the formed transparent conductive film was observed under a three-wavelength fluorescent lamp, and the film forming property of the transparent conductive film was evaluated based on the following criteria.
○: There were no defects such as unevenness or omission.
X: There were defects such as unevenness and missing.

  As is clear from Table 1, the transparent conductive film-laminated film with a protective film produced in Examples 1 to 3 exhibited excellent anti-multiple property. Moreover, these transparent conductive film-laminated films with a protective film showed excellent oligomer block properties. Furthermore, by using these films for laminating a transparent conductive film with a protective film, an excellent transparent conductive film free from defects such as unevenness and omission could be obtained.

  The transparent conductive film-laminated film with a protective film according to the present invention is suitable for efficient production of a transparent conductive film.

DESCRIPTION OF SYMBOLS 1a, 1b ... Film for transparent conductive film lamination with protective film 2 ... Protective film 21 ... Coat layer 22 ... Base material 23 ... Adhesive layer 3a, 3b ... Film for transparent conductive film lamination 31 ... Support body 32 ... First function Layer 33 ... second functional layer 4 ... transparent conductive film

Claims (6)

A transparent conductive film laminating film with a protective film, comprising: a transparent conductive film laminating film; and a protective film affixed to a surface on which the transparent conductive film in the transparent conductive film laminating film is not laminated,
The transparent conductive film laminating film comprises a support and a first functional layer laminated on the surface of the support opposite to the protective film,
The said protective film was laminated | stacked on the surface on the opposite side to the said adhesive layer in the said base material, the adhesive layer laminated | stacked in the said transparent conductive film lamination | stacking film side surface in the said base material. With a coat layer,
The surface resistance value of the surface opposite to the base material in the coat layer is 1.0 × 10 ¹² Ω / cm ² or less,
The surface of the coat layer on the side opposite to the substrate after wiping 10 times with a load of 125 g / cm ² and a speed of 10 mm / s using a cellulose nonwoven fabric impregnated with isopropyl alcohol. The surface resistance value is 1.0 × 10 ¹² Ω / cm ² or less,
The arithmetic average roughness Ra on at least one of the surface of the coat layer opposite to the substrate and the surface of the first functional layer opposite to the support is 7 nm or more. A film for laminating a transparent conductive film with a protective film.   The film for laminating a transparent conductive film with a protective film according to claim 1, wherein the coating layer is formed from a coating agent containing a binder and an antistatic agent.   The said antistatic agent is a conductive polymer, The film for transparent conductive film lamination with a protective film of Claim 2 characterized by the above-mentioned.   The film for laminating a transparent conductive film with a protective film according to any one of claims 1 to 3, wherein the first functional layer is an optical adjustment layer.   The said transparent conductive film lamination film is further equipped with the 2nd functional layer laminated | stacked on the surface on the opposite side to said 1st functional layer in the said support body, The any one of Claims 1-4 characterized by the above-mentioned. The film for transparent conductive film lamination | stacking with a protective film of one term | claim. The process of forming the layer containing a transparent conductive material on the surface on the opposite side to the said protective film in the film for transparent conductive film lamination with a protective film as described in any one of Claims 1-5,
The step of cutting the transparent conductive film-laminated film with a protective film into a predetermined size together with the layer containing the formed transparent conductive material,
A method for producing a transparent conductive film, comprising: a step of crystallizing a layer containing the formed transparent conductive material to form a transparent conductive film; and a step of patterning the transparent conductive film.

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