JP2017138705A - Non-contact IC card - Google Patents

Abstract

An object of the present invention is to provide a non-contact IC card that can prevent electrostatic breakdown of an IC chip and can avoid an increase in manufacturing cost. A core material and an exterior sheet are laminated in that order on the front and back surfaces of an IC inlet including an antenna formed on a supporting base material and an IC chip connected to the antenna and mounted on the supporting base material. In the non-contact IC card thus formed, a lead wire is provided between the core material on which the IC chip is mounted and the exterior sheet so as to cross over the IC chip mounting portion where the IC chip of the IC inlet is mounted and the antenna. A non-contact IC card which is provided. [Selection] Figure 1

Description

  The present invention relates to a non-contact IC card. Furthermore, the present invention relates to a technique for improving electrostatic resistance by making an IC chip difficult to cause electrostatic breakdown when a non-contact IC card is charged.

  As a means to protect the IC chip of the non-contact IC module used in the non-contact IC card, a method of reinforcing by attaching a SUS (stainless steel) plate on the upper surface or both the upper and lower surfaces of the IC chip, or resin molding There is a way to package. Appropriate ones are selected according to required specifications (cost, mechanical strength, manufacturing method, etc.).

Depending on the various specifications required, electrostatic resistance will also vary.
For example, an aluminum antenna formed by patterning an aluminum foil on a film substrate and an electrostatic resistance of a card having a built-in inlet made up of a wound antenna and a package in which an IC chip on a lead frame is molded with resin. The static electricity resistance of a card having a built-in inlet in which an IC chip is mounted and the front and back surfaces thereof are reinforced by bonding a SUS plate may be different.

In addition, in order to improve static electricity resistance, there are cases where an IC chip with a countermeasure against static electricity is used, or an IC chip with no countermeasure against static electricity is used.
When an IC chip that does not take countermeasures against static electricity is used, the resistance to static electricity may be affected depending on the means for increasing the physical strength.
For example, in the case of a card with an IC chip mounted on an aluminum antenna and an inlet in which the front and back surfaces are reinforced by adhering a SUS plate, a countermeasure against static electricity is taken even if the IC chip takes countermeasures against static electricity. Even if not, there may be no difference in electrostatic resistance.

  In addition, in a card incorporating an inlet formed of a package in which a wound antenna and an IC chip on a lead frame are molded with a resin, there may be a clear difference if the IC chip has a countermeasure against static electricity.

  On the other hand, even in a card having a built-in inlet reinforced by bonding a SUS plate to the front and back surfaces of the part where the IC chip is mounted, when the SUS plate is charged and becomes a high voltage, the IC chip is electrostatically charged. May cause destruction.

  As a prior art for improving the electrostatic resistance of such a non-contact IC card, for example, Patent Document 1 discloses a non-contact IC having a structure in which an upper and lower sides of an IC chip are sandwiched between reinforcing plates having electrical conductivity and excellent in electrostatic resistance. A card is disclosed. However, in this non-contact IC card, a countermeasure when the SUS plate is charged is not considered. Further, since only the IC chip mounting portion is sandwiched between conductive reinforcing plates, static electricity induced by the antenna cannot be shielded electrostatically. There was a risk of electrical breakdown.

  Patent Document 2 discloses an RFID tag in which an IC chip and an antenna coil are covered with an insulating inlet that is an insulating plastic sheet and the outer periphery of the RFID tag is covered with a conductive resin and electrostatically shielded. Yes. This technique requires a process of coating the RFID tag with a conductive resin, and thus there is a problem that the manufacturing cost cannot be avoided.

JP 2002-366918 A JP 2008-263427 A

  In view of the above problems, an object of the present invention is to provide a non-contact IC card that can prevent electrostatic breakdown of an IC chip and can avoid an increase in manufacturing cost.

  As a means for solving the above problems, the invention according to claim 1 of the present invention includes an antenna formed on a support base material and an IC chip connected to the antenna and mounted on the support base material. In a non-contact IC card in which a core material and an exterior sheet are laminated in that order on the front and back surfaces of the IC inlet, the IC chip is crossed over the IC chip mounting portion on which the IC chip of the IC inlet is mounted and the antenna. The non-contact IC card is characterized in that a conductive wire is provided between the core material and the exterior sheet on which is mounted.

  According to a second aspect of the present invention, there is provided a core material on each of the front and back surfaces of an IC inlet provided with an antenna formed on a support base material and an IC chip connected to the antenna and mounted on the support base material. In a non-contact IC card in which the outer sheet and the outer sheet are laminated in that order, the upper surface of the outer sheet on which the IC chip is mounted so as to cross over the IC chip mounting portion on which the IC chip of the IC inlet is mounted and the antenna. Further, a non-contact IC card characterized in that a conducting wire is provided.

  The invention according to claim 3 is the non-contact IC card according to claim 1 or 2, wherein the conducting wire is a conductor made of a metal wire or a metal foil.

  According to a fourth aspect of the present invention, there is provided a core material on each of the front and back surfaces of an IC inlet provided with an antenna formed on a support base material and an IC chip connected to the antenna and mounted on the support base material. And non-contact IC card in which the outer sheets are laminated in that order, on the surface of the outer sheet on which the IC chip is mounted, an island-shaped conductor dispersion composed of island-shaped conductors dispersed close to each other is provided It is a non-contact IC card characterized by the above.

  The invention according to claim 5 is characterized in that the island-shaped conductor dispersion is an isolated metal pattern or a thin film in a state before a metal or a metal oxide grows in an island shape into a continuous thin film. The non-contact IC card according to claim 4.

  According to the non-contact IC card of the present invention, it can be manufactured by the same processes and man-hours as the conventional non-contact IC card manufacturing process, and electrostatic breakdown of the IC chip can be prevented.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic explanatory drawing which shows an example of embodiment of the non-contact IC card of this invention, Comprising: (a) is a top view, (b) shows sectional drawing corresponding to (a). BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic explanatory drawing which shows an example of embodiment of the non-contact IC card of this invention, Comprising: (a) is a top view, (b) shows sectional drawing corresponding to (a). BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic explanatory drawing which shows an example of embodiment of the non-contact IC card of this invention, Comprising: (a) is a top view, (b) shows sectional drawing corresponding to (a).

<First embodiment>
The non-contact IC card of the present invention will be described with reference to FIGS.
[Configuration of contactless IC card]
The non-contact IC card of the present invention includes an antenna formed on a support base material and an IC inlet provided with an IC chip connected to the antenna and mounted on the support base material. It is a non-contact IC card in which sheets are laminated in that order.
An IC wire is provided between the core material on which the IC chip is mounted and the exterior sheet so as to cross over the IC chip mounting portion where the IC chip of the IC inlet is mounted and the antenna. .

FIG. 1 shows a non-contact IC card 10 of the present invention, which will be described in more detail.
In the non-contact IC card 10 of the present invention, an IC chip 11 is electrically connected to a radio communication antenna 9 formed on a support substrate 1, and the IC chip 11 is mechanically connected from the front and back surfaces of the IC chip 11. The core material 6 and the exterior sheet 5 are respectively laminated in that order on the front and back surfaces of the IC inlet 4 to which the reinforcing plate 7 for protecting from damaging is bonded via the adhesive layer 12. The IC chip 11 is mounted, and the lead wire 2 is provided so as to cross a part of the antenna 9 and the IC chip mounting portion 1 provided with the reinforcing plate 7 on the front and back surfaces thereof via the adhesive layer 12. The conducting wire 1 is provided between the core material 6 on the side of the support base 13 on which the IC chip 11 is mounted and the exterior sheet 5.

  The reason why the IC chip of a non-contact IC card causes electrostatic breakdown and does not function is that the gate insulating film of the field effect transistor that constitutes the electronic circuit of the IC chip is electrostatically damaged by the voltage applied to the gate insulating film. It is for waking up. The reason why the voltage is applied is that the surface of the non-contact IC card is charged with static electricity, and the high potential determined by the charged amount and capacitance creates a potential difference applied between the gate insulating films. An electric field is formed in the gate insulating film due to the potential difference, and electrostatic breakdown occurs when the value exceeds the dielectric breakdown strength of the gate insulating film. If even one transistor in an IC chip causes an electrostatic breakdown and fails, the electronic circuit will not function.

  In this way, there is a possibility that the static electricity is charged on the surface of the non-contact IC card, causing the IC chip to be electrostatically destroyed and failing. However, in the non-contact IC card 10 of the present invention, the IC chip Since the conducting wire 2 is formed between the core material 6 and the exterior sheet 5 so as to cross over the chip mounting portion 1, at least the surface near the IC chip mounting portion 1 of the non-contact IC card 10 is charged with static electricity. However, since the stray capacitance formed by the conductive wire 2 and the electrostatic capacitance of other capacitors are larger than those without them, the potential generated by the charging can be lowered, and the charged electric charge passes through the conductive wire 2 to the human body. The effect which becomes easy to escape to conductors, such as, can also be expected.

  The conductor 2 is preferably not in contact with the reinforcing plate 7 bonded to the front and back surfaces of the IC chip 11 via the adhesive layer 12. Usually, the lead wire 2 is provided via the core material 6. However, if the reinforcing plate 7 and the lead wire 2 come into contact with each other because the core material 6 is thin, the lead wire 2 tends to be affected by an external potential. Become. When the non-contact IC card 10 comes into contact with an externally charged article, the potential increases to the reinforcing plate 7 of the IC chip 11 through the conductor 2, so that the IC chip 11 is likely to cause electrostatic breakdown. Become.

The electrostatic breakdown of the IC chip 11 also occurs when a high voltage is applied to the antenna 9 connected to the IC chip 11. However, in the non-contact IC card 10 of the present invention, since the conducting wire 2 is provided so as to cross the antenna 9, even if static electricity is charged in the vicinity of the antenna 9 as in the IC chip mounting portion 1. Since the effect that the static electricity charged through the conductor 2 can easily escape to a conductor such as a human body can be expected, the possibility that the antenna 9 becomes a high potential can be reduced.

(Method for manufacturing non-contact IC card)
The non-contact IC card of the present invention can be manufactured with almost the same manufacturing process and man-hour as the conventional non-contact IC card.

[IC inlet manufacturing method]
As the IC inlet used by the non-contact IC card of the present invention, an IC inlet of a conventional non-contact IC card can be used. For example, after forming a conductor layer to form a wiring pattern or antenna on a support substrate such as a resin film or resin sheet, patterning the conductor layer using photolithography technology to form a wiring circuit and an antenna Thereafter, an IC inlet used for the non-contact IC card of the present invention can be manufactured by mounting an IC chip. The conductor layer can be manufactured by forming a thin film of a conductor by using a metal foil such as a copper foil bonded together or a thin film forming technique such as vacuum deposition or sputtering. Moreover, you may form a conductor pattern on a support base material using a printing technique instead of forming a conductor layer.

[Method of manufacturing non-contact IC card]
Using the IC inlet, first, a resin sheet as a core material is laminated on the front and back surfaces. Next, after arranging the lead wires so as to straddle the part where the IC chip of the article in which the core material is laminated on the IC inlet is mounted, the outer sheet is laminated on the front and back surfaces and heat-pressed. The non-contact IC card of the invention can be manufactured.

  In the above description, the case where the two types of resin sheets, the core material and the exterior sheet, are laminated in this order from the front and back surfaces of the IC inlet and thermally laminated has been described, but it is not necessary to limit to this layer configuration, and various layers It is good also as a structure. For example, on the surface where the IC chip of the IC inlet is mounted, a resin layer is laminated for the purpose of flattening the protrusion of the IC chip, and further an exterior sheet is laminated, but there is no protrusion on the opposite surface of the IC inlet, In some cases, only the exterior sheets are laminated. When the protrusion of the IC chip of the IC inlet is small, it is possible to thermally laminate only the exterior sheet on the front and back surfaces. It is also possible to have a structure with more layers.

  Further, as the conducting wire, a metal wire that is not covered with an insulating coating such as a copper wire can be used as it is, and a copper wire with an insulating coating such as an enameled wire can also be used. Moreover, you may use metal foil instead of a metal wire. Instead of the metal foil, it is also possible to form by printing a conductor ink. Further, after laminating a resin sheet as a core material on the IC inlet, it is possible to transfer and form an elongated metal foil as a conductive wire.

<Second Embodiment>
Next, a second embodiment of the non-contact IC card of the present invention will be described.
[Configuration of contactless IC card]
The non-contact IC card of the present invention includes an antenna formed on a support base material and an IC inlet provided with an IC chip connected to the antenna and mounted on the support base material. It is a non-contact IC card in which sheets are laminated in that order.
A characteristic is that a lead wire is provided on an exterior sheet on the side where the IC chip is mounted so as to cross over the IC chip mounting portion where the IC chip of the IC inlet is mounted and the antenna.

FIG. 2 shows a non-contact IC card 10 of the present invention, which will be described in more detail.
The second embodiment of the non-contact IC card 10 of the present invention is different from the first embodiment in the position on the layer structure where the conductive wire 2 is formed. As shown in FIG. It is characterized by being provided on the surface of the exterior sheet 5 on the side where the chip 11 is mounted.

  With the configuration as described above, when static electricity is charged on the surface of the non-contact IC card 10, even if static electricity is charged at least in the IC chip mounting portion 1 and the vicinity thereof, the human body or There is a high possibility that the charge will move when it comes into contact with other articles. For this reason, static electricity is not charged directly above or around the IC chip mounting portion 1, and the possibility that the IC chip 11 is broken due to electrostatic breakdown is reduced.

  Further, similarly to the first embodiment, static electricity is charged on the surface of the non-contact IC card 10 and the possibility that the antenna 9 becomes a high potential can be reduced.

[Method of manufacturing non-contact IC card]
The only difference from the first embodiment is the formation position of the conducting wire, and the second embodiment is characterized in that it is formed on the surface of the exterior sheet on which the IC chip is mounted.

  The method of forming the conducting wire is the same as that of the first embodiment, and various forming methods can be adopted.

<Third embodiment>
Next, a third embodiment of the non-contact IC card of the present invention will be described.
[Configuration of contactless IC card]
The non-contact IC card of the present invention includes an antenna formed on a support base material and an IC inlet provided with an IC chip connected to the antenna and mounted on the support base material. It is a non-contact IC card in which sheets are laminated in that order.
A feature is that an island-shaped conductor dispersion composed of island-shaped conductors adjacent to each other is provided on the surface of the exterior sheet on which the IC chip is mounted.

FIG. 3 shows a non-contact IC card 10 of the present invention, which will be described in more detail.
The third embodiment of the non-contact IC card 10 of the present invention is different from the second embodiment in that a conductor is formed on the exterior sheet 5 on the side where the IC chip 11 is mounted. In this embodiment, the island-shaped conductor dispersion portion 3 is provided on the entire surface of the exterior sheet 5.

  The island-shaped conductor dispersion | distribution part 3 points out the state by which the isolated pattern formed with conductor foil, the conductor thin film, conductor ink, etc. was adjoined. Specifically, it is formed using metal foils such as copper and aluminum, thin films of metals and metal oxides, and inks using conductive materials such as gold, silver, copper, and conductive polymer materials. is there. In the case of a thin film, when a very thin thin film having a thickness of about 10 nm is formed on the support base 13, an island-shaped thin film material with an isolated thin film material is formed adjacently instead of a continuous film.

  In such a state, since the conductive material is not continuously connected, the surface cannot be said to be in a conductive state. However, in the electrical resistance (insulation resistance) in the region of the electrically insulating material, an electrically insulating resin base material is used as the exterior sheet 5, but the electrical resistance is reduced by orders of magnitude, and static electricity is charged. However, the surface can be moved quickly.

In addition, a resin material having a volume resistivity of 10 ⁹ Ω · cm or more by using various antistatic materials may be 10 ⁸ Ω · cm or less.

[Method of manufacturing non-contact IC card]
In the second embodiment, the conductive wire is formed on the surface of the exterior sheet so as to straddle the IC chip mounting portion and the antenna. In the third embodiment, the surface of the exterior sheet on the side where the IC chip is mounted. It is characteristic that an island-shaped conductor dispersion is formed as a whole. About others, it is the same as that of 2nd embodiment.

  The formation method of the island-shaped conductor dispersion includes the method of forming an isolated conductor pattern adjacent to the entire surface of the exterior sheet, and the initial stage of thin film growth with a film thickness of about 10 nm in the initial stage of thin film formation. An isolated island of nanometer order is formed. As the film thickness increases, the island size increases, and the island and island merge to form a continuous film. In the non-contact IC card of the present invention, it is possible to use a structure in which islands of isolated conductor material in the initial stage of thin film growth are adjacent to each other.

DESCRIPTION OF SYMBOLS 1 ... IC chip mounting part 2 ... Conductor 3 ... Island-like conductor dispersion part 4 ... IC inlet 5 ... Outer sheet 6 ... Core material 7 ... Reinforcement board 8 ... · Island conductor 9 · · · Antenna 10 · · · Contactless IC card 11 · · · IC chip 12 · · · Adhesive layer 13 · · · Support substrate

Claims (5)

  A core material and an exterior sheet are laminated in that order on the front and back surfaces of an IC inlet provided with an antenna formed on a supporting base material and an IC chip connected to the antenna and mounted on the supporting base material. In the contact IC card, a lead wire is provided between the core material on which the IC chip is mounted and the exterior sheet so as to cross over the IC chip mounting portion on which the IC chip of the IC inlet is mounted and the antenna. Non-contact IC card characterized by the above.   A core material and an exterior sheet are laminated in that order on the front and back surfaces of an IC inlet provided with an antenna formed on a supporting base material and an IC chip connected to the antenna and mounted on the supporting base material. The contact IC card is characterized in that a lead wire is provided on an exterior sheet on the side where the IC chip is mounted so as to cross over the IC chip mounting portion where the IC chip of the IC inlet is mounted and the antenna. Non-contact IC card.   The non-contact IC card according to claim 1, wherein the conductive wire is a conductor made of a metal wire or a metal foil.   A core material and an exterior sheet are laminated in that order on the front and back surfaces of an IC inlet provided with an antenna formed on a supporting base material and an IC chip connected to the antenna and mounted on the supporting base material. In a contact IC card, an island-shaped conductor dispersion comprising island-shaped conductors dispersed close to each other is provided on the surface of an exterior sheet on which an IC chip is mounted. card.   5. The contactless IC according to claim 4, wherein the island-shaped conductor dispersion is an isolated metal pattern or a thin film in a state before a metal or metal oxide is grown in an island shape to form a continuous thin film. card.