[go: up one dir, main page]

JP2017108045A - Liquid-cooled cooler - Google Patents

Liquid-cooled cooler Download PDF

Info

Publication number
JP2017108045A
JP2017108045A JP2015242014A JP2015242014A JP2017108045A JP 2017108045 A JP2017108045 A JP 2017108045A JP 2015242014 A JP2015242014 A JP 2015242014A JP 2015242014 A JP2015242014 A JP 2015242014A JP 2017108045 A JP2017108045 A JP 2017108045A
Authority
JP
Japan
Prior art keywords
wave
plate fin
plate
liquid
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015242014A
Other languages
Japanese (ja)
Other versions
JP6546521B2 (en
Inventor
誠二 松島
Seiji Matsushima
誠二 松島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP2015242014A priority Critical patent/JP6546521B2/en
Priority to DE102016124103.2A priority patent/DE102016124103A1/en
Publication of JP2017108045A publication Critical patent/JP2017108045A/en
Application granted granted Critical
Publication of JP6546521B2 publication Critical patent/JP6546521B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a liquid-cooled cooler capable of reducing pressure loss when a cooling liquid flows through a cooling liquid passage, while suppressing degradation of cooling performance.SOLUTION: A radiator of a cooling liquid passage in the casing of a liquid-cooled cooler has a plurality of plate fins 13. Each plate fin 13 has a waveform part of a certain length, in the plan view, and the waveform part consists of a rounded wave crest 16 projecting to any one of left or right, a rounded wave bottom 17 projecting to the other, and a linear ramp 18 coupling adjoining wave crest 16 and wave bottom 17. Assuming the radius of curvature of the projecting direction outer surface at the wave crest 16 and wave bottom 17 of the plate fin 13 is R1, the radius of curvature of the projecting direction inner surface is R2, the thickness at the wave crest 16 of the plate fin 13 is T1, the thickness at the wave bottom 17 is T2, and the thickness at the ramp 18 is T3, following relation is satisfied R1>R2, T1<T3 and T2<T3.SELECTED DRAWING: Figure 6

Description

この発明は、たとえば半導体素子などの電子部品からなる発熱体を冷却する液冷式冷却装置に関する。   The present invention relates to a liquid cooling type cooling device that cools a heating element made of an electronic component such as a semiconductor element.

この明細書および特許請求の範囲において、図２の左右を左右といい、図３の上下を上下というもとのとする。   In this specification and claims, left and right in FIG. 2 are referred to as left and right, and up and down in FIG.

たとえば、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴ（Insulated Gate Bipolar Transistor）などのパワーデバイス（半導体素子）を冷却する液冷式冷却装置として、本出願人は、先に、特許文献１記載のものを提案した。   For example, as a liquid-cooled cooling device for cooling a power device (semiconductor element) such as an IGBT (Insulated Gate Bipolar Transistor) used in a power conversion device mounted on an electric vehicle, a hybrid vehicle, a train, etc., The thing of patent document 1 was proposed previously.

特許文献１記載の液冷式冷却装置は、頂壁、底壁および周壁を有するとともに冷却液入口および冷却液出口が形成されたケーシングを備えており、ケーシング内に、外部から冷却液入口を通って流入した冷却液が冷却液出口に向かって一方向に流れる冷却液流路が設けられ、ケーシング内の冷却液流路に、ケーシングの頂壁外面および底壁外面のうち少なくともいずれか一方に取り付けられる発熱体から発せられる熱を、冷却液流路を流れる冷却液に放熱する放熱器が配置されており、放熱器が、長手方向を冷却液流路における冷却液の流れ方向に向けるとともに幅方向を上下方向に向けた状態で間隔をおいて並列状に配置された複数のプレートフィンを有し、各プレートフィンが、平面から見て波形でかつ一定の長さを有する波形部分を有し、当該波形部分が、左右いずれか一方に突出しかつ丸みを帯びた波頂部、同他方に突出しかつ丸みを帯びた波底部、および隣り合う波頂部と波底部とを連結する直線状傾斜部からなり、冷却液が隣り合う２つのプレートフィン間を蛇行状しつつ流れるようになされており、隣り合う２つのプレートフィンからなる組において、両プレートフィンのうちの第１のプレートフィンにおける隣り合う２つの波頂部、および両波頂部間に位置する波底部を連結する２つの傾斜部の第２のプレートフィン側を向いた面と、両プレートフィンの上下方向の中間部を通る水平面とからなる２つの交線が交わるすべての点が第１の直線により結ばれるとともに、当該水平面上において第１プレートフィンの両傾斜部の第２プレートフィン側を向いた面における第２プレートフィン側への延長部が交わる部分に位置しており、前記第２プレートフィンにおける隣り合う２つの波底部、および両波底部間に位置する波頂部を連結する２つの傾斜部の第１プレートフィン側を向いた面と前記水平面とからなる２つの交線が交わるすべての点が第２の直線により結ばれるとともに、当該水平面上において第２プレートフィンの両傾斜部の第１プレートフィン側を向いた面における第１プレートフィン側への延長部が交わる部分に位置している。特許文献１記載の装置においては、プレートフィンの波頂部および波底部における突出方向外側の曲率半径をＲ１、同じく突出方向内側の曲率半径をＲ２、プレートフィンの波頂部の肉厚をＴ１、波底部の肉厚をＴ２、傾斜部の肉厚をＴ３とした場合、Ｒ１＝２×Ｔ１、Ｒ１＝２×Ｒ２、Ｔ１＝Ｔ２＝Ｔ３となっている。   The liquid cooling type cooling device described in Patent Document 1 includes a casing having a top wall, a bottom wall, and a peripheral wall and having a cooling liquid inlet and a cooling liquid outlet formed therein. A coolant flow path is provided in which the coolant flowing in in one direction flows in one direction toward the coolant outlet, and is attached to the coolant flow path in the casing on at least one of the top wall outer surface and the bottom wall outer surface of the casing. A radiator that dissipates the heat generated from the generated heating element to the coolant flowing through the coolant flow path is disposed, and the heat radiator directs the longitudinal direction in the coolant flow direction in the coolant flow path and the width direction With a plurality of plate fins arranged in parallel at intervals, with each plate fin having a corrugated portion that is corrugated and has a certain length as viewed from above. The corrugated portion is composed of a wave crest portion that is rounded to the left or right, a wave bottom portion that is rounded to the other side, and a linear inclined portion that connects the adjacent wave crest portions to the wave bottom portion. The coolant flows in a meandering manner between two adjacent plate fins, and in a set of two adjacent plate fins, two adjacent ones in the first plate fin of the two plate fins. Two of the crest portion, a surface facing the second plate fin side of the two inclined portions connecting the wave bottom portions located between the crest portions, and a horizontal plane passing through the middle portion in the vertical direction of both plate fins All points where the intersecting line intersects are connected by the first straight line, and on the surface facing the second plate fin side of both inclined portions of the first plate fin on the horizontal plane. The second plate fin side is located at a portion where the extension portion intersects, and two adjacent wave bottom portions of the second plate fin and the two inclined portions connecting the wave crest portions located between the two wave bottom portions are connected to each other. The first plate fin of both inclined portions of the second plate fin on the horizontal plane is connected by the second straight line at all points where two intersecting lines composed of the plane facing the one plate fin side and the horizontal plane intersect. It is located in the part where the extension part to the 1st plate fin side in the surface which turned to the side crosses. In the apparatus described in Patent Document 1, the curvature radius outside the protruding direction at the wave crest and wave bottom of the plate fin is R1, the curvature radius inside the protruding direction is R2, the thickness of the wave fin at the plate fin is T1, and the wave bottom Where T2 is the thickness of T2 and T3 is the thickness of the inclined portion, R1 = 2 × T1, R1 = 2 × R2, and T1 = T2 = T3.

ところで、特許文献１記載の液冷式冷却装置においては、冷却性能の低下を抑制した上で、冷却液が冷却液流路を流れる際の圧力損失を低減する効果に限界がある。   By the way, in the liquid cooling type cooling device described in Patent Document 1, there is a limit to the effect of reducing the pressure loss when the cooling liquid flows through the cooling liquid flow path while suppressing the deterioration of the cooling performance.

特開２０１３−１６５２９８号公報JP 2013-165298 A

この発明の目的は、上記問題を解決し、冷却性能の低下を抑制した上で、冷却液が冷却液流路を流れる際の圧力損失を低減しうる液冷式冷却装置を提供することにある。   An object of the present invention is to provide a liquid cooling type cooling apparatus that can reduce the pressure loss when the cooling liquid flows through the cooling liquid flow path while solving the above-described problems and suppressing the deterioration of the cooling performance. .

本発明は、上記目的を達成するために以下の態様からなる。   In order to achieve the above object, the present invention comprises the following aspects.

1)頂壁、底壁および周壁を有するとともに冷却液入口および冷却液出口が形成されたケーシングを備えており、ケーシング内に、外部から冷却液入口を通って流入した冷却液が冷却液出口に向かって一方向に流れる冷却液流路が設けられ、ケーシング内の冷却液流路に、ケーシングの頂壁外面および底壁外面のうち少なくともいずれか一方に取り付けられる発熱体から発せられる熱を、冷却液流路を流れる冷却液に放熱する放熱器が配置されており、放熱器が、長手方向を冷却液流路における冷却液の流れ方向に向けるとともに幅方向を上下方向に向けた状態で間隔をおいて並列状に配置された複数のプレートフィンを有し、各プレートフィンが、平面から見て波形でかつ一定の長さを有する波形部分を有し、当該波形部分が、左右いずれか一方に突出しかつ丸みを帯びた波頂部、同他方に突出しかつ丸みを帯びた波底部、および隣り合う波頂部と波底部とを連結する直線状傾斜部からなり、冷却液が隣り合う２つのプレートフィン間を蛇行状しつつ流れるようになされている液冷式冷却装置において、
プレートフィンの波頂部および波底部における突出方向外側面の曲率半径をＲ１、同じく突出方向内側面の曲率半径をＲ２、プレートフィンの波頂部の肉厚をＴ１、波底部の肉厚をＴ２、傾斜部の肉厚をＴ３とした場合、Ｒ１＞Ｒ２、Ｔ１＜Ｔ３、Ｔ２＜Ｔ３という関係を満たす液冷式冷却装置。 1) A casing having a top wall, a bottom wall, and a peripheral wall and having a cooling liquid inlet and a cooling liquid outlet formed therein, and the cooling liquid flowing from the outside through the cooling liquid inlet into the casing is supplied to the cooling liquid outlet. A coolant flow path that flows in one direction is provided, and heat generated from a heating element attached to at least one of the top wall outer surface and the bottom wall outer surface of the casing is cooled in the coolant flow path in the casing. A radiator that dissipates heat to the coolant flowing through the liquid flow path is disposed, and the heat radiator has an interval in a state where the longitudinal direction is directed to the flow direction of the cooling liquid in the coolant flow path and the width direction is directed to the vertical direction. A plurality of plate fins arranged in parallel, and each plate fin has a corrugated portion having a certain length and a waveform when viewed from the plane, and the corrugated portion is either left or right Two plates, each of which is composed of a wave crest projecting toward and rounded, a wave bottom projecting toward the other and rounded, and a linear inclined section connecting adjacent wave crests and wave crests. In the liquid cooling type cooling device that is made to flow while meandering between the fins,
The radius of curvature of the outer surface in the protruding direction at the wave crest and wave bottom of the plate fin is R1, the radius of curvature of the inner surface of the protruding direction is R2, the wall thickness of the wave fin at the plate fin is T1, and the wall thickness of the wave bottom is T2. A liquid cooling type cooling device satisfying the relations of R1> R2, T1 <T3, and T2 <T3 when the thickness of the part is T3.

2)Ｒ２＝Ｔ３、２×Ｒ２＜Ｒ１＜６．５×Ｒ２という関係を満たす上記1)記載の液冷式冷却装置。   2) The liquid cooling type cooling apparatus according to 1), wherein R2 = T3, 2 × R2 <R1 <6.5 × R2.

3)Ｒ２＝Ｔ３という関係を満たす上記1)または2)記載の液冷式冷却装置。   3) The liquid cooling type cooling apparatus according to 1) or 2), which satisfies the relationship R2 = T3.

4)隣り合う２つのプレートフィンからなる組において、両プレートフィンのうちの第１のプレートフィンにおける隣り合う２つの波頂部、および両波頂部間に位置する波底部を連結する２つの傾斜部の第２のプレートフィン側を向いた面と、両プレートフィンの上下方向の中間部を通る水平面とからなる２つの交線が交わるすべての点が第１の直線により結ばれるとともに、当該水平面上において第１プレートフィンの両傾斜部の第２プレートフィン側を向いた面における第２プレートフィン側への延長部が交わる部分に位置しており、前記第２プレートフィンにおける隣り合う２つの波底部、および両波底部間に位置する波頂部を連結する２つの傾斜部の第１プレートフィン側を向いた面と前記水平面とからなる２つの交線が交わるすべての点が第２の直線により結ばれるとともに、当該水平面上において第２プレートフィンの両傾斜部の第１プレートフィン側を向いた面における第１プレートフィン側への延長部が交わる部分に位置している上記1)〜3)のうちのいずれかに記載の液冷式冷却装置。   4) In a set of two plate fins adjacent to each other, the two wave crests of the first plate fin of the two plate fins and the two inclined portions connecting the wave bottoms located between the wave crests. All points where two intersecting lines consisting of a surface facing the second plate fin side and a horizontal plane passing through the middle part in the vertical direction of both plate fins are connected by the first straight line, and on the horizontal plane The two inclined portions of the first plate fin are located at a portion where the extended portions to the second plate fin side of the surface facing the second plate fin side intersect, and two adjacent wave bottom portions of the second plate fin; All of the two intersecting lines formed by the surface facing the first plate fin side of the two inclined portions connecting the wave crest portions located between the wave bottom portions and the horizontal plane intersect each other. The point is connected by the second straight line, and is located at a portion where the extended portion to the first plate fin side of the inclined surface of the second plate fin facing the first plate fin side intersects on the horizontal plane. The liquid cooling type cooling device according to any one of the above 1) to 3).

上記1)〜4)の液冷式冷却装置によれば、プレートフィンの波頂部および波底部における突出方向外側の曲率半径をＲ１、同じく突出方向内側の曲率半径をＲ２、プレートフィンの波頂部の肉厚をＴ１、波底部の肉厚をＴ２、傾斜部の肉厚をＴ３とした場合、Ｒ１＞Ｒ２という関係を満たしているので、特許文献１記載の液冷式冷却装置に比べて、放熱器の隣り合うプレートフィン間を冷却液が直線的に流れる。したがって、冷却液が冷却液流路を流れる際の圧力損失を低減することが可能になる。しかも、Ｒ１＞Ｒ２の場合、プレートフィンの肉厚が全体に一定であると、特許文献１記載の液冷式冷却装置のプレートフィンに比べて伝熱面積が低下するが、Ｔ１＜Ｔ３、Ｔ２＜Ｔ３という関係を満たしているので、プレートフィンの伝熱面積の減少を抑制することができる。したがって、特許文献１記載の液冷式冷却装置に比べて、冷却性能の低下を抑制することが可能になる。   According to the liquid cooling type cooling apparatus of 1) to 4) above, the curvature radius outside the protruding direction at the wave crest and wave bottom of the plate fin is R1, the radius of curvature inside the protruding direction is R2, and the wave fin of the plate fin is When the thickness is T1, the wave bottom thickness is T2, and the slope thickness is T3, the relationship of R1> R2 is satisfied. Therefore, compared to the liquid cooling type cooling device described in Patent Document 1, heat radiation is achieved. Coolant flows linearly between adjacent plate fins of the vessel. Therefore, it is possible to reduce the pressure loss when the coolant flows through the coolant channel. Moreover, in the case of R1> R2, if the thickness of the plate fin is constant throughout, the heat transfer area is reduced as compared with the plate fin of the liquid cooling type cooling device described in Patent Document 1, but T1 <T3, T2 Since the relationship <T3 is satisfied, a decrease in the heat transfer area of the plate fin can be suppressed. Therefore, compared with the liquid cooling type cooling device described in Patent Document 1, it is possible to suppress a decrease in cooling performance.

上記2)の液冷式冷却装置によれば、Ｒ２＝Ｔ３、２×Ｒ２＜Ｒ１＜６．５×Ｒ２という関係を満たしているので、冷却性能の低下率を５％の以下に抑制した上で、冷却液が冷却液流路を流れる際の圧力損失を低減することが可能になる。   According to the liquid cooling type cooling device of the above 2), since the relationship of R2 = T3, 2 × R2 <R1 <6.5 × R2 is satisfied, the rate of decrease in cooling performance is suppressed to 5% or less. Thus, it is possible to reduce the pressure loss when the coolant flows through the coolant channel.

上記3)の液冷式冷却装置によれば、Ｒ２＝Ｔ３という関係を満たしているので、プレートフィンの伝熱面積の減少を効果的に抑制することができる。   According to the liquid cooling type cooling device of the above 3), since the relationship of R2 = T3 is satisfied, it is possible to effectively suppress the reduction of the heat transfer area of the plate fin.

上記4)の液冷式冷却装置によれば、冷却液は波形のフィンに沿って流れやすくなり、フィンにおける伝熱に有効に働く面積が効果的に増大し、冷却性能を向上させることができる。   According to the liquid cooling type cooling device of the above 4), the cooling liquid can easily flow along the corrugated fins, the area that effectively works for heat transfer in the fins can be effectively increased, and the cooling performance can be improved. .

この発明の液冷式冷却装置を示す斜視図である。It is a perspective view which shows the liquid cooling type cooling device of this invention. 図１のＡ−Ａ線断面図である。It is the sectional view on the AA line of FIG. 図２のＢ−Ｂ線断面図である。FIG. 3 is a sectional view taken along line B-B in FIG. 2. 図１の液冷式冷却装置に用いられる放熱器の一部分を示す拡大斜視図である。It is an expansion perspective view which shows a part of heat radiator used for the liquid cooling type cooling device of FIG. 図２の一部分を拡大して示す図である。It is a figure which expands and shows a part of FIG. 図５の要部拡大図である。It is a principal part enlarged view of FIG. 図１の液冷式冷却装置の放熱器におけるプレートフィンの波頂部および波底部の外側面の曲率半径Ｒ１と、圧力損失および熱抵抗との関係を示すグラフである。It is a graph which shows the relationship between the radius of curvature R1 of the outer surface of the wave-top part and wave-bottom part of a plate fin, pressure loss, and thermal resistance in the radiator of the liquid cooling type cooling device of FIG.

以下、この発明の実施形態を、図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.

この明細書において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。   In this specification, the term “aluminum” includes aluminum alloys in addition to pure aluminum.

また、以下の説明において、冷却液流路における冷却液の流れ方向下流側（図２の上側、図３の右側）を前、これと反対側を後というものとする。   In the following description, the downstream side in the coolant flow direction in the coolant channel (the upper side in FIG. 2 and the right side in FIG. 3) is referred to as the front, and the opposite side is referred to as the rear.

図１〜図３はこの発明による液冷式冷却装置の全体構成を示し、図４〜図６はその要部の構成を示す。   1 to 3 show the overall configuration of the liquid cooling type cooling apparatus according to the present invention, and FIGS. 4 to 6 show the configuration of the main part thereof.

図１〜図３において、液冷式冷却装置(1)は、頂壁(2a)、底壁(2b)および周壁(2c)を有するアルミニウム製ケーシング(2)を備えており、ケーシング(2)の周壁(2c)における左側壁部分の後端部に、左方に開口した冷却液入口(3)が形成され、同じく右側壁部分の前端部に右方に開口した冷却液出口(4)が形成されている。ケーシング(2)内には、後端部に位置しかつ冷却液が冷却液入口(3)を通って外部から流入する入口ヘッダ(5)と、前端部に位置しかつ冷却液が冷却液出口(4)を通って外部に流出する出口ヘッダ(6)と、入口ヘッダ(5)に流入した冷却液を出口ヘッダ(6)に流す冷却液流路(7)とが設けられている。ケーシング(2)内の冷却液流路(7)に、ケーシング(2)の頂壁(2a)外面および底壁(2b)外面のうちのいずれか一方、図示の例では頂壁(2a)外面に設けられた発熱体取付部(8)に取り付けられた発熱体(H)から発せられる熱を、冷却液流路(7)を流れる冷却液に放熱するアルミニウム製放熱器(10)が配置されている。   1 to 3, the liquid cooling type cooling device (1) includes an aluminum casing (2) having a top wall (2a), a bottom wall (2b), and a peripheral wall (2c), and the casing (2) A coolant inlet (3) that opens to the left is formed at the rear end of the left side wall portion of the peripheral wall (2c), and a coolant outlet (4) that opens to the right at the front end of the right side wall portion. Is formed. In the casing (2), an inlet header (5) located at the rear end and into which coolant flows from the outside through the coolant inlet (3) and a coolant located at the front end and the coolant outlet An outlet header (6) flowing out through (4) and a coolant flow path (7) for flowing the coolant flowing into the inlet header (5) to the outlet header (6) are provided. One of the top wall (2a) outer surface and the bottom wall (2b) outer surface of the casing (2), the top wall (2a) outer surface in the illustrated example, in the coolant flow path (7) in the casing (2) An aluminum radiator (10) that dissipates the heat generated from the heating element (H) attached to the heating element attachment part (8) provided in the cooling fluid flow path (7) is disposed. ing.

ケーシング(2)は、頂壁(2a)および周壁(2c)の上半部を形成するアルミニウム製上構成部材(11)と、底壁(2b)および周壁(2c)の下半部を形成するアルミニウム製下構成部材(12)とよりなる。上構成部材(11)の周壁(2c)を形成する部分の下端部、および下構成部材(12)の周壁(2c)を形成する部分の上端部に、それぞれ外向きフランジ(11a)(12a)が一体に形成されている。上構成部材(11)および下構成部材(12)は、少なくとも一面にろう材層を有するアルミニウムブレージングシートを使用して、ろう材層がケーシング(2)内側と、各外向きフランジ(11a)(12a)における他の外向きフランジ(12a)(11a)を向いた面に位置するように形成されたものであり、両構成部材(11)(12)の外向きフランジ(11a)(12a)どうしがろう材層を介して接合（ろう付）されている。   The casing (2) forms the upper half (11) made of aluminum that forms the upper half of the top wall (2a) and the peripheral wall (2c), and the lower half of the bottom wall (2b) and the peripheral wall (2c). It consists of an aluminum lower component (12). The outward flanges (11a) and (12a) are respectively provided at the lower end of the portion forming the peripheral wall (2c) of the upper component (11) and the upper end of the portion of the lower component (12) forming the peripheral wall (2c). Are integrally formed. The upper component member (11) and the lower component member (12) use an aluminum brazing sheet having a brazing material layer on at least one surface, and the brazing material layer is disposed inside the casing (2) and the outward flanges (11a) ( 12a) is formed so as to be located on the surface facing the other outward flange (12a) (11a), and the outward flanges (11a) (12a) of both components (11) (12) It is joined (brazed) through a brazing material layer.

発熱体(H)は、ＩＧＢＴなどのパワーデバイスや、ＩＧＢＴが制御回路と一体化されて同一パッケージに収納されたＩＧＢＴモジュールや、ＩＧＢＴモジュールにさらに保護回路が一体化されて同一パッケージに収納されたインテリジェントパワーモジュールなどからなり、絶縁部材(I)を介してケーシング(2)の頂壁(2a)外面の発熱体取付部(8)に取り付けられる。   The heating element (H) is a power device such as an IGBT, an IGBT module in which the IGBT is integrated with the control circuit and stored in the same package, or a protection circuit integrated with the IGBT module and stored in the same package. It consists of an intelligent power module or the like, and is attached to the heating element mounting portion (8) on the outer surface of the top wall (2a) of the casing (2) via the insulating member (I).

図２〜図５に示すように、放熱器(10)は、長手方向を冷却液流路(7)における冷却液の流れ方向(前後方向)に向けるとともに幅方向を上下方向に向けた状態で左右方向に間隔をおいて配置された複数のアルミニウム製プレートフィン(13)と、プレートフィン(13)の長手方向と交差する方向（左右方向）にのび、かつ全プレートフィン(13)を連結一体化する前後２つの棒状連結部材(14)とからなる。   As shown in FIG. 2 to FIG. 5, the radiator (10) is in a state in which the longitudinal direction is directed to the coolant flow direction (front-rear direction) in the coolant flow path (7) and the width direction is directed to the vertical direction. A plurality of aluminum plate fins (13) arranged at intervals in the left-right direction, extending in the direction (left-right direction) intersecting the longitudinal direction of the plate fins (13), and connecting all plate fins (13) integrally It consists of two rod-like connecting members (14) before and after forming.

すべてのプレートフィン(13)は、ケーシング(2)の頂壁(2a)内面および底壁(2b)内面のうち少なくとも発熱体取付部(8)が設けられている頂壁(2a)内面、ここでは頂壁(2a)および底壁(2b)の両者の内面にろう付されている。   All plate fins (13) are the inner surface of the top wall (2a) where at least the heating element mounting portion (8) is provided among the inner surface of the top wall (2a) and the inner surface of the bottom wall (2b) of the casing (2), Then, it is brazed to the inner surfaces of both the top wall (2a) and the bottom wall (2b).

前側の連結部材(14)は、全プレートフィン(13)の上側縁部の前端寄りの部分に形成された切り欠き(15)内に、切り欠き(15)内から突出しないように圧入され、後側の連結部材(14)は、全プレートフィン(13)の下側縁部の後端寄りの部分に形成された切り欠き(15)内に、切り欠き(15)内から突出しないように圧入されており、これにより全プレートフィン(13)が連結部材(14)により連結一体化されている。   The front connecting member (14) is press-fitted into the notch (15) formed in the portion near the front end of the upper edge of all the plate fins (13) so as not to protrude from the notch (15), The rear connection member (14) should not protrude from the notch (15) into the notch (15) formed in the portion near the rear edge of the lower edge of the entire plate fin (13). By press-fitting, all the plate fins (13) are connected and integrated by the connecting member (14).

プレートフィン(13)の両切り欠き(15)間の部分は平面から見て波形であり、当該波形部分は、冷却液流路(7)における冷却液の流れ方向(前後方向)と直交する左右方向のいずれか一方(左方)に突出しかつ丸みを帯びた波頂部(16)、同他方(右方)に突出しかつ丸みを帯びた波底部(17)、および隣り合う波頂部(16)と波底部(17)とを連結する直線状傾斜部(18)からなる。なお、図５においては、すべてのプレートフィン(13)のうち、左右方向に隣り合う２つのプレートフィン(13)からなる組において、両プレートフィン(13)のうちの左側の第１プレートフィンを(13A)で示し、右側の第２プレートフィンを(13B)で示すものとする。   The portion between both notches (15) of the plate fin (13) is a waveform when viewed from the plane, and the waveform portion is a horizontal direction orthogonal to the coolant flow direction (front-rear direction) in the coolant flow path (7). And a rounded wave peak (16) projecting to one (left) and the other (right) and rounded wave bottom (17), and an adjacent wave peak (16) and wave It consists of the linear inclined part (18) which connects a bottom part (17). In FIG. 5, in the set of two plate fins (13) adjacent in the left-right direction among all the plate fins (13), the left first plate fin of both plate fins (13) is shown. It is indicated by (13A), and the second plate fin on the right side is indicated by (13B).

図５に示すように、左右方向に隣り合う２つのプレートフィン(13A)(13B)からなる組において、第１プレートフィン(13A)における隣り合う２つの波頂部(16)、および両波頂部(16)間に位置する波底部(17)を連結する２つの傾斜部(18)の第２プレートフィン(13B)側を向いた右側面(18a)と、プレートフィン(13A)(13B)の上下方向の中間部を通る水平面（プレートフィン(13A)(13B)の高さ方向と直交する水平面)とからなる２つの交線が交わるすべての点(P1)は、前記水平面上において、当該２つの傾斜部(18)の右側面(18a)における右側への延長部が交わる部分に位置しており、これらの点(P1)は第１の直線(L1)により結ばれている。また、第２プレートフィン(13B)における隣り合う２つの波底部(17)、および両波底部(17)間に位置する波頂部(16)を連結する２つの傾斜部(18)の第１プレートフィン(13A)側を向いた左側面(18b)と前記水平面とからなる２つの交線が交わるすべての点(P2)は、前記水平面上において、当該２つの傾斜部(18)の左側面(18b)における左側への延長部が交わる部分に位置しており、これらの点(P2)は第２の直線(L2)により結ばれている。そして、第１の直線(L1)が第２の直線(L2)よりも第２プレートフィン(13B)側に位置している。   As shown in FIG. 5, in a set of two plate fins (13A) (13B) adjacent in the left-right direction, two adjacent wave crests (16) and both wave crests (in the first plate fin (13A)) 16) The right side surface (18a) facing the second plate fin (13B) side of the two inclined portions (18) connecting the wave bottom portion (17) located between the upper and lower sides of the plate fins (13A) (13B) All points (P1) where two intersecting lines consisting of a horizontal plane (horizontal plane orthogonal to the height direction of the plate fins (13A) and (13B)) passing through the middle part of the direction intersect the two planes on the horizontal plane. The right side surface (18a) of the inclined portion (18) is located at the intersection of the rightward extensions, and these points (P1) are connected by the first straight line (L1). Further, the first plate of the two inclined portions (18) connecting the two wave bottom portions (17) adjacent to each other in the second plate fin (13B) and the wave crest portion (16) located between both wave bottom portions (17). All the points (P2) where two intersecting lines consisting of the left side surface (18b) facing the fin (13A) and the horizontal plane intersect each other are on the left side surface of the two inclined portions (18) on the horizontal plane ( 18b) is located at the intersection of the leftward extensions, and these points (P2) are connected by the second straight line (L2). The first straight line (L1) is located closer to the second plate fin (13B) than the second straight line (L2).

図６に示すように、プレートフィン(13)の波頂部(16)および波底部(17)における突出方向外側面(波頂部(16)では左側面、波底部(17)では右側面)の曲率半径をＲ１mm、同じく突出方向内側面(波頂部(16)では右側面、波底部(17)では左側面)の曲率半径をＲ２mm、プレートフィン(13)の波頂部(16)の肉厚をＴ１mm、波底部(17)の肉厚をＴ２mm、傾斜部(18)の肉厚をＴ３mmとした場合、Ｒ１＞Ｒ２、Ｔ１＜Ｔ３、Ｔ２＜Ｔ３という関係を満たしている。なお、通常は、Ｔ１＝Ｔ２である。また、Ｒ２＝Ｔ３、２×Ｒ２＜Ｒ１＜６．５×Ｒ２、Ｒ２＝Ｔ３という関係を満たしていることが好ましい。   As shown in FIG. 6, the curvature of the outer surface in the protruding direction at the wave crest portion (16) and the wave bottom portion (17) of the plate fin (13) (the left side surface at the wave crest portion (16) and the right side surface at the wave bottom portion (17)). The radius is R1mm, the radius of curvature of the inner surface in the protruding direction (right side at the crest (16), left side at the crest (17)) is R2mm, and the thickness of the crest (16) of the plate fin (13) is T1mm. When the thickness of the wave bottom portion (17) is T2 mm and the thickness of the inclined portion (18) is T3 mm, the relationship of R1> R2, T1 <T3, T2 <T3 is satisfied. Normally, T1 = T2. Moreover, it is preferable that the relationship of R2 = T3, 2 × R2 <R1 <6.5 × R2, and R2 = T3 is satisfied.

Ｒ１＞Ｒ２であると、放熱器(10)の隣り合うプレートフィン(13)間を流れる冷却液の流れが比較的に直線的になり、その結果冷却液が冷却液流路(7)を流れる際の圧力損失を低減することが可能になる。しかも、Ｒ１＞Ｒ２の場合、プレートフィン(13)の肉厚が全体に一定であると、伝熱面積が低下するが、Ｔ１＜Ｔ３、Ｔ２＜Ｔ３という関係を満たしているので、プレートフィン(13)の伝熱面積の減少を抑制することができ、冷却性能の低下を抑制することが可能になる。   When R1> R2, the flow of the coolant flowing between the adjacent plate fins (13) of the radiator (10) becomes relatively linear, and as a result, the coolant flows through the coolant channel (7). It becomes possible to reduce the pressure loss at the time. Moreover, in the case of R1> R2, if the thickness of the plate fin (13) is constant throughout, the heat transfer area decreases, but since the relationship of T1 <T3, T2 <T3 is satisfied, the plate fin ( The reduction in the heat transfer area of 13) can be suppressed, and the deterioration of the cooling performance can be suppressed.

上述した関係は、１辺の長さが１０ｍｍの正方形状で、厚さが１〜５ｍｍである発熱体を１０〜１００Ｗで発熱させ、１５〜１８度の水およびエチレングリコール水溶液を隣り合うプレートフィン(13)に流速０．１〜１ｍ／ｓで流し、発熱体からプレートフィンまでの温度差により熱抵抗を算出し、さらに冷却液入口(3)と冷却液出口(4)との圧力差により圧力損失を算出するという条件で行ったコンピュータシミュレーション計算の結果から得られた図７に基づいて決められたものである。図７は、プレートフィン(13)の波頂部(16)および波底部(17)における突出方向内側面の曲率半径Ｒ２と傾斜部(18)とが等しい場合の、波頂部(16)および波底部(17)における突出方向外側面の曲率半径Ｒ１と、圧力損失および熱抵抗との関係を示す。なお、圧力損失および熱抵抗が１００％となる条件は、Ｒ１＝２×Ｒ２という条件である。   The above-described relationship is that a heating element having a square shape with a side length of 10 mm and a thickness of 1 to 5 mm generates heat at 10 to 100 W, and 15 to 18 degree water and an ethylene glycol aqueous solution are adjacent to plate fins. The heat resistance is calculated from the temperature difference from the heating element to the plate fin, and the pressure difference between the coolant inlet (3) and the coolant outlet (4) is calculated. This is determined based on FIG. 7 obtained from the result of the computer simulation calculation performed under the condition of calculating the pressure loss. FIG. 7 shows a wave crest (16) and a wave bottom when the curvature radius R2 of the inner surface in the protruding direction and the inclined portion (18) at the wave crest (16) and the wave bottom (17) of the plate fin (13) are equal. The relationship of the curvature radius R1 of the protrusion direction outer side surface in (17), pressure loss, and thermal resistance is shown. In addition, the conditions under which the pressure loss and the thermal resistance are 100% are the conditions of R1 = 2 × R2.

上述した構成の液冷式冷却装置(1)において、ケーシング(2)の外部から冷却液入口(3)を通って入口ヘッダ(5)内に流入した冷却液は、冷却液流路(7)に配置された放熱器(10)の隣り合う２つのプレートフィン(13)間を蛇行状に前方に流れて出口ヘッダ(6)内に入り、冷却液出口(4)を通ってケーシング(2)の外部に送り出される。発熱体(H)から発せられる熱は、絶縁部材(I)、ケーシング(2)の頂壁(2a)および放熱器(10)の各プレートフィン(13)を経て冷却液流路(7)を流れる冷却液に放熱され、発熱体(H)が冷却される。   In the liquid cooling type cooling device (1) having the above-described configuration, the coolant flowing from the outside of the casing (2) through the coolant inlet (3) into the inlet header (5) is the coolant channel (7). Between the two adjacent plate fins (13) of the heatsink (10) arranged in the direction of serpentine flow forward into the outlet header (6) and through the coolant outlet (4) to the casing (2) Sent to outside. Heat generated from the heating element (H) passes through the insulating liquid member (I), the top wall (2a) of the casing (2), and the plate fins (13) of the radiator (10) through the coolant channel (7). Heat is dissipated by the flowing coolant and the heating element (H) is cooled.

上記実施形態においては、プレートフィン(13)の長手方向の両端部の所定長さを除いた部分、すなわち両切り欠き(15)間の部分が平面から見て波形であるが、これに限定されるものではなく、全長にわたって平面から見て波形であってもよい。   In the above embodiment, the portion excluding the predetermined length at both ends in the longitudinal direction of the plate fin (13), that is, the portion between both notches (15) is a waveform when viewed from the plane, but is not limited thereto. It may be a waveform when viewed from the plane over the entire length.

また、上記実施形態においては、放熱器(10)の全プレートフィン(13)は、切り欠き(15)内に圧入された連結部材(14)により連結一体化されているが、これに限定されるものではない。   In the above embodiment, all the plate fins (13) of the radiator (10) are connected and integrated by the connecting member (14) press-fitted into the notch (15), but the present invention is not limited to this. It is not something.

この発明による液冷式冷却装置は、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴなどのパワーデバイスを冷却するのに好適に用いられる。   The liquid cooling type cooling device according to the present invention is suitably used for cooling a power device such as an IGBT used in a power conversion device mounted on an electric vehicle, a hybrid vehicle, a train or the like.

(1)：液冷式冷却装置
(2)：ケーシング
(2a)：頂壁
(2b)：底壁
(2c)：周壁
(3)：冷却液入口
(4)：冷却液出口
(7)：冷却液流路
(8)：発熱体取付部
(10)：放熱器
(13)(13A)(13B)：プレートフィン
(16)：波頂部
(17)：波底部
(18)：傾斜部
(18a)：傾斜部の右側面
(18b)：傾斜部の左側面
(H)：発熱体
(L1)(L2)：直線
(P1)(P2)：点
(1): Liquid cooling type cooling device
(2): Casing
(2a): Top wall
(2b): Bottom wall
(2c): Perimeter wall
(3): Coolant inlet
(4): Coolant outlet
(7): Coolant flow path
(8): Heating element mounting part
(10): Heatsink
(13) (13A) (13B): Plate fin
(16): Wave peak
(17): Wave bottom
(18): Inclined part
(18a): Right side of the slope
(18b): Left side of inclined part
(H): Heating element
(L1) (L2): Straight line
(P1) (P2): Points

特許文献１記載の液冷式冷却装置は、頂壁、底壁および周壁を有するとともに冷却液入口および冷却液出口が形成されたケーシングを備えており、ケーシング内に、外部から冷却液入口を通って流入した冷却液が冷却液出口に向かって一方向に流れる冷却液流路が設けられ、ケーシング内の冷却液流路に、ケーシングの頂壁外面および底壁外面のうち少なくともいずれか一方に取り付けられる発熱体から発せられる熱を、冷却液流路を流れる冷却液に放熱する放熱器が配置されており、放熱器が、長手方向を冷却液流路における冷却液の流れ方向に向けるとともに幅方向を上下方向に向けた状態で間隔をおいて並列状に配置された複数のプレートフィンを有し、各プレートフィンが、平面から見て波形でかつ一定の長さを有する波形部分を有し、当該波形部分が、左右いずれか一方に突出しかつ丸みを帯びた波頂部、同他方に突出しかつ丸みを帯びた波底部、および隣り合う波頂部と波底部とを連結する直線状傾斜部からなり、冷却液が隣り合う２つのプレートフィン間を蛇行しつつ流れるようになされており、隣り合う２つのプレートフィンからなる組において、両プレートフィンのうちの第１のプレートフィンにおける隣り合う２つの波頂部、および両波頂部間に位置する波底部を連結する２つの傾斜部の第２のプレートフィン側を向いた面と、両プレートフィンの上下方向の中間部を通る水平面とからなる２つの交線が交わるすべての点が第１の直線により結ばれるとともに、当該水平面上において第１プレートフィンの両傾斜部の第２プレートフィン側を向いた面における第２プレートフィン側への延長部が交わる部分に位置しており、前記第２プレートフィンにおける隣り合う２つの波底部、および両波底部間に位置する波頂部を連結する２つの傾斜部の第１プレートフィン側を向いた面と前記水平面とからなる２つの交線が交わるすべての点が第２の直線により結ばれるとともに、当該水平面上において第２プレートフィンの両傾斜部の第１プレートフィン側を向いた面における第１プレートフィン側への延長部が交わる部分に位置している。特許文献１記載の装置においては、プレートフィンの波頂部および波底部における突出方向外側の曲率半径をＲ１、同じく突出方向内側の曲率半径をＲ２、プレートフィンの波頂部の肉厚をＴ１、波底部の肉厚をＴ２、傾斜部の肉厚をＴ３とした場合、Ｒ１＝２×Ｔ１、Ｒ１＝２×Ｒ２、Ｔ１＝Ｔ２＝Ｔ３となっている。 The liquid cooling type cooling device described in Patent Document 1 includes a casing having a top wall, a bottom wall, and a peripheral wall and having a cooling liquid inlet and a cooling liquid outlet formed therein. A coolant flow path is provided in which the coolant flowing in in one direction flows in one direction toward the coolant outlet, and is attached to the coolant flow path in the casing on at least one of the top wall outer surface and the bottom wall outer surface of the casing. A radiator that dissipates the heat generated from the generated heating element to the coolant flowing through the coolant flow path is disposed, and the heat radiator directs the longitudinal direction in the coolant flow direction in the coolant flow path and the width direction With a plurality of plate fins arranged in parallel at intervals, with each plate fin having a corrugated portion that is corrugated and has a certain length as viewed from above. The corrugated portion is composed of a wave crest portion that is rounded to the left or right, a wave bottom portion that is rounded to the other side, and a linear inclined portion that connects the adjacent wave crest portions to the wave bottom portion. The coolant flows in a meandering manner between two adjacent plate fins, and in a set of two adjacent plate fins, two adjacent waves in the first plate fin of the two plate fins. Two intersections consisting of a top surface and a surface facing the second plate fin side of the two inclined portions connecting the wave bottom portions located between the wave top portions and a horizontal plane passing through an intermediate portion in the vertical direction of both plate fins. All the points where the lines intersect are connected by the first straight line, and on the surface facing the second plate fin side of both inclined portions of the first plate fin on the horizontal plane The first of the two inclined portions connecting the two wave bottom portions adjacent to each other in the second plate fin and the wave crest portions located between the two wave bottom portions. All points where two intersecting lines composed of the plane facing the plate fin side and the horizontal plane intersect are connected by the second straight line, and the first plate fin side of both inclined portions of the second plate fin on the horizontal plane It is located in the part which the extension part to the 1st plate fin side in the surface which faced. In the apparatus described in Patent Document 1, the curvature radius outside the protruding direction at the wave crest and wave bottom of the plate fin is R1, the curvature radius inside the protruding direction is R2, the thickness of the wave fin at the plate fin is T1, and the wave bottom Where T2 is the thickness of T2 and T3 is the thickness of the inclined portion, R1 = 2 × T1, R1 = 2 × R2, and T1 = T2 = T3.

3)Ｒ２＝Ｔ３という関係を満たす上記1)記載の液冷式冷却装置。
3) The liquid cooling type cooling apparatus according to 1), which satisfies the relationship R2 = T3.

Claims (4)

頂壁、底壁および周壁を有するとともに冷却液入口および冷却液出口が形成されたケーシングを備えており、ケーシング内に、外部から冷却液入口を通って流入した冷却液が冷却液出口に向かって一方向に流れる冷却液流路が設けられ、ケーシング内の冷却液流路に、ケーシングの頂壁外面および底壁外面のうち少なくともいずれか一方に取り付けられる発熱体から発せられる熱を、冷却液流路を流れる冷却液に放熱する放熱器が配置されており、放熱器が、長手方向を冷却液流路における冷却液の流れ方向に向けるとともに幅方向を上下方向に向けた状態で間隔をおいて並列状に配置された複数のプレートフィンを有し、各プレートフィンが、平面から見て波形でかつ一定の長さを有する波形部分を有し、当該波形部分が、左右いずれか一方に突出しかつ丸みを帯びた波頂部、同他方に突出しかつ丸みを帯びた波底部、および隣り合う波頂部と波底部とを連結する直線状傾斜部からなり、冷却液が隣り合う２つのプレートフィン間を蛇行状しつつ流れるようになされている液冷式冷却装置において、
プレートフィンの波頂部および波底部における突出方向外側面の曲率半径をＲ１、同じく突出方向内側面の曲率半径をＲ２、プレートフィンの波頂部の肉厚をＴ１、波底部の肉厚をＴ２、傾斜部の肉厚をＴ３とした場合、Ｒ１＞Ｒ２、Ｔ１＜Ｔ３、Ｔ２＜Ｔ３という関係を満たす液冷式冷却装置。 A casing having a top wall, a bottom wall, and a peripheral wall and having a cooling liquid inlet and a cooling liquid outlet formed therein, and the cooling liquid flowing from the outside through the cooling liquid inlet into the casing toward the cooling liquid outlet A coolant flow path that flows in one direction is provided, and heat generated from a heating element attached to at least one of the top wall outer surface and the bottom wall outer surface of the casing is supplied to the coolant flow path in the casing. A radiator that dissipates heat to the coolant flowing through the path is arranged, and the radiator is spaced with the longitudinal direction directed to the coolant flow direction in the coolant flow path and the width direction directed to the vertical direction. It has a plurality of plate fins arranged in parallel, and each plate fin has a corrugated portion that is corrugated and has a certain length when viewed from the plane, and the corrugated portion is either left or right Two plate fins, each of which has a crest protruding round and rounded, a wave bottom protruding and rounded on the other side, and a linear inclined portion connecting the adjacent wave crest and wave bottom. In the liquid cooling type cooling device that is made to flow while meandering between them,
The radius of curvature of the outer surface in the protruding direction at the wave crest and wave bottom of the plate fin is R1, the radius of curvature of the inner surface of the protruding direction is R2, the wall thickness of the wave fin at the plate fin is T1, and the wall thickness of the wave bottom is T2. A liquid cooling type cooling device satisfying the relations of R1> R2, T1 <T3, and T2 <T3 when the thickness of the part is T3. Ｒ２＝Ｔ３、２×Ｒ２＜Ｒ１＜６．５×Ｒ２という関係を満たす請求項１記載の液冷式冷却装置。 The liquid-cooling type cooling device according to claim 1, satisfying a relationship of R2 = T3, 2 × R2 <R1 <6.5 × R2. Ｒ２＝Ｔ３という関係を満たす請求項１または２記載の液冷式冷却装置。 The liquid-cooling type cooling device according to claim 1 or 2, satisfying a relationship of R2 = T3. 隣り合う２つのプレートフィンからなる組において、両プレートフィンのうちの第１のプレートフィンにおける隣り合う２つの波頂部、および両波頂部間に位置する波底部を連結する２つの傾斜部の第２のプレートフィン側を向いた面と、両プレートフィンの上下方向の中間部を通る水平面とからなる２つの交線が交わるすべての点が第１の直線により結ばれるとともに、当該水平面上において第１プレートフィンの両傾斜部の第２プレートフィン側を向いた面における第２プレートフィン側への延長部が交わる部分に位置しており、前記第２プレートフィンにおける隣り合う２つの波底部、および両波底部間に位置する波頂部を連結する２つの傾斜部の第１プレートフィン側を向いた面と前記水平面とからなる２つの交線が交わるすべての点が第２の直線により結ばれるとともに、当該水平面上において第２プレートフィンの両傾斜部の第１プレートフィン側を向いた面における第１プレートフィン側への延長部が交わる部分に位置している請求項１〜３のうちのいずれかに記載の液冷式冷却装置。
In a set of two adjacent plate fins, the second of the two inclined portions connecting the two adjacent wave crests in the first plate fin of the two plate fins and the wave bottom located between the two wave crests. All the points where two intersecting lines consisting of the plane facing the plate fin side and the horizontal plane passing through the middle part in the vertical direction of both plate fins are connected by the first straight line, and the first on the horizontal plane The two fin portions adjacent to each other in the second plate fin are located at a portion where the extended portions to the second plate fin side of the inclined surfaces of the plate fins facing the second plate fin side intersect, All of the two intersecting lines consisting of the surface facing the first plate fin side of the two inclined portions connecting the wave crest portions located between the wave bottom portions and the horizontal plane intersect each other. Is connected by the second straight line, and is located at a portion where the extended portions to the first plate fin side of the inclined surfaces of the second plate fins facing the first plate fin side intersect on the horizontal plane. The liquid cooling type cooling device according to any one of claims 1 to 3.
JP2015242014A 2015-12-11 2015-12-11 Liquid cooling system Active JP6546521B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015242014A JP6546521B2 (en) 2015-12-11 2015-12-11 Liquid cooling system
DE102016124103.2A DE102016124103A1 (en) 2015-12-11 2016-12-12 Liquid cooled cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015242014A JP6546521B2 (en) 2015-12-11 2015-12-11 Liquid cooling system

Publications (2)

Publication Number Publication Date
JP2017108045A true JP2017108045A (en) 2017-06-15
JP6546521B2 JP6546521B2 (en) 2019-07-17

Family

ID=58773284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015242014A Active JP6546521B2 (en) 2015-12-11 2015-12-11 Liquid cooling system

Country Status (2)

Country Link
JP (1) JP6546521B2 (en)
DE (1) DE102016124103A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190101287A1 (en) * 2016-06-01 2019-04-04 Kawasaki Jukogyo Kabushiki Kaisha Cooling structure for gas turbine engine
CN109944677A (en) * 2019-03-01 2019-06-28 冀凯河北机电科技有限公司 A kind of air engine new engine fin
WO2020031753A1 (en) * 2018-08-09 2020-02-13 富士電機株式会社 Cooler and semiconductor module
CN112514055A (en) * 2018-09-20 2021-03-16 日立汽车系统株式会社 Electronic control device
JP2021106220A (en) * 2019-12-26 2021-07-26 トヨタ自動車株式会社 Radiator
CN114667040A (en) * 2022-03-30 2022-06-24 合肥工业大学 A kind of micro jet cooling plate with uniform temperature and low resistance
WO2023127525A1 (en) * 2021-12-28 2023-07-06 京セラ株式会社 Cooler and power conversion device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022213942A1 (en) 2022-12-19 2024-06-20 Robert Bosch Gesellschaft mit beschränkter Haftung Cooling device for cooling at least one power semiconductor component
CN117663880B (en) * 2024-01-31 2024-04-30 哈尔滨空调股份有限公司 Flying wing type fin and application of flying wing type fin in air cooler

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5328069A (en) * 1976-08-27 1978-03-15 Toyota Motor Co Ltd Method of bending metal plates
JP2003025019A (en) * 2001-07-16 2003-01-28 Sumitomo Wiring Syst Ltd Metal plate folding method, and connector terminal
JP2008186820A (en) * 2007-01-26 2008-08-14 Aisin Aw Co Ltd Heating element cooling structure and driving device
JP2011091301A (en) * 2009-10-26 2011-05-06 Toyota Industries Corp Liquid cooling type cooling device
JP2013165298A (en) * 2013-05-17 2013-08-22 Toyota Industries Corp Liquid cooling device
JP2015126050A (en) * 2013-12-26 2015-07-06 昭和電工株式会社 Radiator for liquid cooling type cooling device and manufacturing method thereof
JP2015225953A (en) * 2014-05-28 2015-12-14 昭和電工株式会社 Liquid-cooled cooler

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5328069A (en) * 1976-08-27 1978-03-15 Toyota Motor Co Ltd Method of bending metal plates
JP2003025019A (en) * 2001-07-16 2003-01-28 Sumitomo Wiring Syst Ltd Metal plate folding method, and connector terminal
JP2008186820A (en) * 2007-01-26 2008-08-14 Aisin Aw Co Ltd Heating element cooling structure and driving device
JP2011091301A (en) * 2009-10-26 2011-05-06 Toyota Industries Corp Liquid cooling type cooling device
JP2013165298A (en) * 2013-05-17 2013-08-22 Toyota Industries Corp Liquid cooling device
JP2015126050A (en) * 2013-12-26 2015-07-06 昭和電工株式会社 Radiator for liquid cooling type cooling device and manufacturing method thereof
JP2015225953A (en) * 2014-05-28 2015-12-14 昭和電工株式会社 Liquid-cooled cooler

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190101287A1 (en) * 2016-06-01 2019-04-04 Kawasaki Jukogyo Kabushiki Kaisha Cooling structure for gas turbine engine
US11215361B2 (en) * 2016-06-01 2022-01-04 Kawasaki Jukogyo Kabushiki Kaisha Cooling structure with ribs for gas turbine engine
WO2020031753A1 (en) * 2018-08-09 2020-02-13 富士電機株式会社 Cooler and semiconductor module
JPWO2020031753A1 (en) * 2018-08-09 2020-12-17 富士電機株式会社 Cooler, semiconductor module
US11075144B2 (en) 2018-08-09 2021-07-27 Fuji Electric Co., Ltd. Cooler and semiconductor module
CN112514055A (en) * 2018-09-20 2021-03-16 日立汽车系统株式会社 Electronic control device
CN109944677A (en) * 2019-03-01 2019-06-28 冀凯河北机电科技有限公司 A kind of air engine new engine fin
CN109944677B (en) * 2019-03-01 2024-03-01 冀凯河北机电科技有限公司 Novel engine fin for air engine
JP2021106220A (en) * 2019-12-26 2021-07-26 トヨタ自動車株式会社 Radiator
JP7294126B2 (en) 2019-12-26 2023-06-20 トヨタ自動車株式会社 Cooler
WO2023127525A1 (en) * 2021-12-28 2023-07-06 京セラ株式会社 Cooler and power conversion device
CN114667040A (en) * 2022-03-30 2022-06-24 合肥工业大学 A kind of micro jet cooling plate with uniform temperature and low resistance

Also Published As

Publication number Publication date
DE102016124103A1 (en) 2017-06-14
JP6546521B2 (en) 2019-07-17

Similar Documents

Publication Publication Date Title
JP6546521B2 (en) Liquid cooling system
JP6247090B2 (en) Liquid cooling type cooling device and manufacturing method of radiator for liquid cooling type cooling device
JP6316096B2 (en) Liquid cooling system
JP6062516B1 (en) heatsink
JP4985382B2 (en) Semiconductor cooling structure
JP6349161B2 (en) Liquid cooling system
JP6735664B2 (en) Radiator for liquid cooling type cooling device and manufacturing method thereof
JP6279980B2 (en) Liquid cooling system
JP2010056130A (en) Liquid-cooled-type cooling device
JP6738226B2 (en) Cooling system
JP6534873B2 (en) Liquid cooling system
JP5608787B2 (en) Liquid cooling system
US9661780B2 (en) Heat-receiver, cooling unit and electronic device
JP2016004805A (en) Liquid cooling type cooling device
JP7133044B2 (en) Self-oscillating heat pipe cooler
JP2009182313A (en) Component cooling structure
JP6917230B2 (en) Dissipator and liquid-cooled cooling device using it
CN206388696U (en) Liquid-cooled-type cooling device
JP6623120B2 (en) Liquid cooling system
JP6932632B2 (en) Liquid cooling system
JP6469521B2 (en) Liquid cooling system
WO2025077584A1 (en) Heat dissipation apparatus, electronic device, and vehicle
JP2010093034A (en) Cooling device for electronic component
JP5114324B2 (en) Semiconductor device
JP6632879B2 (en) Liquid cooling system

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20170912

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20170912

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180910

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190522

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190528

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190621

R150 Certificate of patent or registration of utility model

Ref document number: 6546521

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D02

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350