JP2017092421A - Solid electrolyte capacitor, and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid electrolyte capacitor that can be made thinner.SOLUTION: This solid electrolyte capacitor includes a capacitor element 100 having a positive electrode and a negative electrode, a package 600 for packaging the capacitor element 100, a first electrode member 400 electrically connected to the positive electrode, and a second electrode member 500 electrically connected to the negative electrode. The package 600 has a bottom face 605, a top face 606 parted therefrom, and a side face 602 for connecting the bottom face 605 to the top face 606, and as to at least the second electrode member 500, a part thereof is exposed to the side face 602 of the package 600.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same.

  For example, as disclosed in Patent Document 1, a solid electrolytic capacitor includes a capacitor element having an anode and a cathode, a resin package that seals the capacitor element, and a first electrode that is electrically connected to the anode and faces the outer surface of the resin package. And a second electrode member that is electrically connected to the cathode and faces the outer surface of the resin package. The capacitor element includes an element body including a porous sintered body made of a valve action metal in which a derivative layer, a fixed electrolyte layer, and a conductor layer are laminated, and an anode wire protruding from the element body. The conductor layer on the surface of the element body functions as a cathode.

  Since the solid electrolytic capacitor having the above-described configuration disclosed in Patent Document 1 is of a surface mount type, the first electrode member and the second electrode member are exposed on the bottom surface of the resin package. In addition, regarding the relationship between the second electrode member that conducts to the cathode and the capacitor element, since the capacitor element is mounted on the second electrode member derived from the lead frame, the bottom surface of the element body of the capacitor element and the bottom surface of the resin package At least a part of the second electrode member must be positioned between the two.

  In the field of electronic components, there is a case where it is required to reduce the size, in particular, to reduce the thickness, but in the configuration of the solid electrolytic capacitor disclosed in Patent Document 1, the dimension between the element body and the bottom surface of the resin package is required. There is a limit to reducing the thickness, and it has not been possible to promote the reduction in thickness.

JP 2012-124240 A

  The present invention has been conceived under the above circumstances, and an object thereof is to provide a solid electrolytic capacitor that can be further reduced in thickness.

  A solid electrolytic capacitor provided by the first aspect of the present invention includes a capacitor element having an anode and a cathode, a package enclosing the capacitor element, a first electrode member electrically connected to the anode, and a first electrode electrically connected to the cathode. A solid electrolytic capacitor including a two-electrode member, wherein the package has a bottom surface, a top surface spaced from the bottom surface, and a side surface connecting the bottom surface and the top surface, and at least the second A part of the electrode member is exposed on the side surface of the package.

  In a preferred embodiment, the capacitor element includes an element body including a porous sintered body made of a valve action metal in which a dielectric layer, a solid electrolyte layer, and a conductive layer are laminated, and protrudes from the element body. The element body has a bottom surface parallel to the bottom surface of the package, and the second electrode member does not exist between the bottom surface of the package and the bottom surface of the element body. .

  In a preferred embodiment, the second electrode member is exposed flush with the side surface of the package.

  In a preferred embodiment, the second electrode member is not exposed flush with the bottom surface of the package.

  In a preferred embodiment, the first electrode member is exposed flush with the side surface of the package.

  In a preferred embodiment, the first electrode member is not exposed flush with the bottom surface.

  In a preferred embodiment, the anode wire extends parallel to the bottom surface of the element body.

  In a preferred embodiment, the first electrode member is conductively connected to the anode wire.

  In a preferred embodiment, the element body has an upper surface that is separated from the bottom surface of the element body, and a side surface that connects the bottom surface and the upper surface, and the anode wire protrudes from the side surface. And a second side surface different from the first side surface, and the second electrode member is connected to the second side surface.

  In a preferred embodiment, the second side surface of the element body is located on the opposite side of the first side surface.

  In a preferred embodiment, the side surface of the package has a first side surface from which the first electrode member is exposed and a second side surface from which the second electrode member is exposed, and the second side surface is The first side surface of the package and the first side surface of the element body are oriented in the same direction, and the second side surface of the package and the element body are positioned on the opposite side of the first side surface. The second side faces in the same direction.

  In a preferred embodiment, the package has a rectangular shape in plan view, connects the first side surface and the second side surface of the package, and is located on opposite sides of the third side surface and the fourth side surface. The element body has a rectangular shape in a plan view, and connects the first side surface and the second side surface of the element body, and a third side surface and a second side located opposite to each other. 4 side surfaces.

  In a preferred embodiment, the first electrode member includes a standing exposed surface that is flush with the first side surface of the package, and a downward direction that is connected to the standing exposed surface and retracts upward from the bottom surface of the package. And an exposed surface.

  In a preferred embodiment, the anode wire also serves as the first electrode member.

  In a preferred embodiment, the second electrode member includes a standing exposed surface that is flush with the second side surface of the package, and a downward direction that is connected to the standing exposed surface and retreats upward from the bottom surface of the package. And an exposed surface.

  In a preferred embodiment, the exposed surface of the first electrode member to the outer surface of the package and the exposed surface of the second electrode member to the outer surface of the package are covered with a secondary electrode film.

  In a preferred embodiment, the secondary electrode film is formed by plating.

  In a preferred embodiment, a side surface of the package where the first electrode member is exposed is covered with a secondary electrode film that is electrically connected to the first electrode member, and a side surface of the package where the second electrode member is exposed. Is covered with a secondary electrode film that is electrically connected to the second electrode member.

  In a preferred embodiment, the secondary electrode film is formed by applying and baking a conductive paste.

  In a preferred embodiment, the top surface of the package is parallel to the bottom surface of the package, and the top surface of the element body is parallel to the bottom surface of the element body.

  In a preferred embodiment, a dimension between the bottom surface of the package and the bottom surface of the element body is 0.15 to 0.25 mm.

  In a preferred embodiment, a dimension between the upper surface of the package and the upper surface of the element body is 0.15 to 0.25 mm.

  In a preferred embodiment, the thickness between the bottom surface of the element body and the top surface of the element body is 0.3 to 0.5 mm.

  In a preferred embodiment, the valve metal of the porous sintered body is Ta or Nb.

  In a preferred embodiment, the anode wire is made of the same material as the valve metal of the porous sintered body.

  According to a method of manufacturing a solid electrolytic capacitor provided by the second aspect of the present invention, a capacitor element having an element body and an anode wire exposed from the first side surface of the element body is wrapped in a package, and the anode wire A method of manufacturing a solid electrolytic capacitor in which a first electrode member that conducts and a second electrode member that conducts electricity to the element body are exposed on an outer surface of the package, the first step of preparing the capacitor element, A second step of connecting a first electrode member and connecting a second electrode member to a second side surface opposite to the first side surface of the element body; the capacitor element; the first electrode member; A third step of sealing the two-electrode member with a sealing resin to form a package intermediate, and the package intermediate in the element body Cutting the first electrode member together with the first electrode member at a predetermined distance from the side surface to form an exposed surface in which the cut surface of the first electrode member is flush with the first side surface of the package; The body is cut together with the second electrode member at a position separated from the second side surface of the element body by a predetermined distance, and the cut surface of the second electrode member is exposed to be flush with the second side surface of the package. A fourth step of forming a surface.

  In a preferred embodiment, the method further includes a fifth step of forming a secondary electrode film on the exposed surface of the first electrode member and forming a secondary electrode film on the exposed surface of the second electrode member.

  In a preferred embodiment, the secondary electrode film is formed by plating in the fifth step.

  In a preferred embodiment, the method further includes a sixth step of cutting the package from its bottom surface and forming a downward exposed surface connected to the exposed surface on the first electrode member and the second electrode member, respectively.

  In the method for manufacturing a solid electrolytic capacitor provided by the third aspect of the present invention, a capacitor element having an element body and an anode wire exposed from the first side surface of the element body is wrapped in a package, and the anode wire and A method of manufacturing a solid electrolytic capacitor in which a second electrode member electrically connected to the element body is exposed on an outer surface of the package, the first step of preparing the capacitor element, the opposite side of the element body from the first side surface A second step of connecting a second electrode member to the second side of the capacitor, a third step of sealing the capacitor element and the second electrode member with a sealing resin to form a package intermediate, and the package The package is cut together with the anode wire at a position spaced apart from the first side surface of the element body by a predetermined distance. An exposed surface in which the cut surface of the anode wire is flush with the first side surface is formed, and the second intermediate electrode member is positioned at a predetermined distance from the second side surface of the element body. And a fourth step of forming an exposed surface in which the cut surface of the second electrode member is flush with the second side surface of the package.

  In a preferred embodiment, a secondary electrode film that is electrically connected to the exposed surface of the anode wire is formed on the first side surface of the package, and the second electrode member is exposed on the second surface of the package. The method further includes a fifth step of forming a secondary electrode film that is electrically connected to the surface.

  In a preferred embodiment, the secondary electrode film is formed by printing and baking in the fifth step.

  In the above configuration, at least the second electrode member that conducts to the cathode of the capacitor element is exposed on the side surface of the package. Therefore, it is necessary to dispose the second electrode member between the bottom surface of the element body of the capacitor element and the bottom surface of the package. Disappears. Therefore, the dimension between the bottom surface of the element body and the bottom surface of the resin package can be further shortened, and the solid electrolytic capacitor can be further reduced in thickness.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

1 is a plan view of a solid electrolytic capacitor according to a first embodiment of the present invention. It is a front view of the solid electrolytic capacitor shown in FIG. It is a left view of the solid electrolytic capacitor shown in FIG. It is a right view of the solid electrolytic capacitor shown in FIG. It is sectional drawing which follows the V-V1 line | wire of FIG. It is sectional drawing which follows the VI-VI line of FIG. It is a partial expanded sectional view of a capacitor element. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is action | operation explanatory drawing of the solid electrolytic capacitor shown in FIG. It is a longitudinal cross-sectional view of the solid electrolytic capacitor which concerns on 2nd Embodiment of this invention. It is sectional drawing which follows the XV-XV line | wire of FIG. It is sectional drawing which follows the XVI-XVI line of FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG. It is explanatory drawing of the manufacturing method of the solid electrolytic capacitor shown in FIG.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 7 show a solid electrolytic capacitor A1 according to a first embodiment of the present invention. Solid electrolytic capacitor A1 includes a capacitor element 100, a first electrode member 400, a second electrode member 500, and a resin package 600.

  As shown in FIGS. 1, 5 and 6, the capacitor element 100 includes an element body 200 and an anode wire 300 protruding from the element body 200. The element body 200 includes a porous sintered body 210, a dielectric layer 221, a solid electrolyte layer 222, and a conductive layer 223. A spread-out prevention ring 230 is attached to the root portion of the anode wire 300.

  As shown in FIGS. 1 to 6, the element body 200 is formed in a flat rectangular parallelepiped shape reflecting the shape of the porous sintered body 210. That is, the element body 200 includes a bottom surface 205, a top surface 206 that is spaced a predetermined distance above the bottom surface 205 and parallel to the bottom surface 205, a first side surface 201 from which the anode wire 300 protrudes, It has the 2nd side 202 opposite to the 1st side 201, the 3rd side 203 which connects the 1st side 201 and the 2nd side 202, and the 4th side 204 opposite to this. The anode wire 300 has a rod shape with a circular cross section, and protrudes in parallel with the bottom surface 205, the top surface 206, the third and fourth side surfaces 203, 204 at a substantially central position in the width direction and height direction of the first side surface 201. . The anode wire 300 is formed of the same material as the valve metal that is a material constituting the porous sintered body 210 described later. The bleeding prevention ring 230 is made of, for example, a fluororesin having electrical insulation.

  As shown in FIGS. 5 to 7, the dielectric layer 221 is a region where the squeezing prevention ring 230 on the first side surface 201 of the element body 200 does not cover the inner surface of the pores 211 of the porous sintered body 210. , Bottom surface 205, top surface 206, second side surface 202, third side surface 203, and fourth side surface 204. The dielectric layer 221 is made of an oxide of a valve metal that constitutes the porous sintered body 210. Examples of the valve action metal constituting the porous sintered body 210 include tantalum (Ta) and niobium (Nb). Therefore, examples of the material constituting the dielectric layer 221 include tantalum pentoxide and niobium pentoxide.

  As shown in FIGS. 5 to 7, the solid electrolyte layer 222 is laminated on the dielectric layer 221. Part of the solid electrolyte layer 222 enters the pores 211 of the porous sintered body 210 and fills the pores 211 while covering the dielectric layer 221 in the pores 211, and part of the pores 211 are part of the element body 200. The surface of the dielectric layer 221 is covered. However, direct conduction between the solid electrolyte layer 222 and the anode wire 300 is interrupted by the bleed prevention ring 230 on the first side surface 201 of the element body 200. The solid electrolyte layer 222 is made of, for example, manganese dioxide or a conductive polymer. During the operation of the solid electrolytic capacitor A1, electric charges are held at the interface between the dielectric layer 221 and the solid electrolyte layer 222.

  As shown in FIGS. 5 to 7, the conductive layer 223 is laminated on the solid electrolyte layer 222 and is electrically connected to the solid electrolyte layer 222. The conductive layer 223 has, for example, a laminated structure composed of a graphite layer and a silver layer. The conductive layer 223 is laminated on the solid electrolyte layer 222 on the surface of the element main body 200. As described above with respect to the solid electrolyte layer 222, the conductive wire 223 is formed on the first side surface 201 of the element main body 200 by the bleed-up prevention ring 230 with the anode wire. Direct conduction with 300 is cut off.

  Regarding the size of the capacitor element 100 configured in this way, the width dimension w of the element body 200 is, for example, about 2.5 mm, the length dimension l is, for example, about 3.5 mm, and the height dimension t is, for example, .0. It is about 8 mm. The anode wire 300 has a diameter of, for example, about 0.2 mm, and is small and thin.

  The first electrode member 400 is joined to the anode wire 300 by welding or the like, and a part of the first electrode member 400 is exposed on the first side surface 601 of the resin package 600. In the present embodiment, the first electrode member 400 has a rectangular plate shape with a predetermined thickness, with an anode wire 300 bonded to the upper end surface. The first electrode member 400 is made of a Ni—Fe alloy such as 42 alloy, for example.

  The second electrode member 500 is joined to the second side surface 202 of the element body 200 by, for example, a conductive adhesive (not shown), and a part thereof is exposed to the second side surface 602 of the resin package 600 in a flush manner. ing. In the present embodiment, the second electrode member 500 includes a plate-like portion 510 joined to almost the entire second side surface 202 of the element body 200 and a block portion 520 joined to the plate-like portion 510. The block part 520 has a trapezoidal shape with a predetermined thickness. The second electrode member 500 is made of a Ni—Fe alloy such as 42 alloy, for example.

  The resin package 600 encloses the capacitor element 100, the first electrode member 400, and the second electrode member 500, and is made of, for example, an epoxy resin. The resin package 600 has a flat rectangular parallelepiped shape that efficiently wraps the capacitor element 100. The resin package 600 includes a bottom surface 605, a top surface 606 spaced apart from the bottom surface 605 by a predetermined distance, and four side surfaces connecting the bottom surface 605 and the top surface 606, that is, the first side surface of the element body 200 of the capacitor element 100. 201 corresponding to and parallel to the first side surface 601, on the opposite side to the first side surface 601, corresponding to the second side surface 202 of the element body 200 and parallel to the second side surface 602, and the element body 200. Corresponding to the third and fourth side surfaces 203 and 204, respectively, there are third and fourth side surfaces 603 and 604 parallel to them. As described above, the first electrode member 400 is exposed on the first side surface 601 of the resin package 600. The exposed surface 430 of the first electrode member 400 has an upright shape along the first side surface 601. The second electrode member 500 is exposed on the second side surface 602 in a flush manner. The exposed surface 530 of the second electrode member 500 is also upright along the second side surface 602.

  As clearly shown in FIG. 5, in the present embodiment, the first electrode member is provided by providing the cut portions 630 in the vicinity of the first side surface 601 and in the vicinity of the second side surface 602 on the bottom surface 605 of the resin package 600. A downward exposed surface 432 connected to the upright exposed surface 431 is formed at 400, and a downward exposed surface 532 connected to the upright exposed surface 531 is formed at the second electrode member 500.

  A secondary electrode film made of Sn or solder may be formed on the exposed surface 430 of the first electrode member 400 and the exposed surface 530 of the second electrode member 500 by plating.

  Next, a method for manufacturing the solid electrolytic capacitor A1 will be described.

  First, as shown in FIG. 8, the capacitor element 100 having the above-described configuration is prepared.

  Next, as shown in FIG. 9, the first electrode member 450 is connected to the anode wire 300, and the second electrode member 550 is connected to the second side surface 202 of the element body 200. For example, the first electrode member 450 is integrally extended from the manufacturing frame 710. The first electrode member 450 has a front end portion 451 having a rectangular plate shape as viewed from the side and having a notch 452 on which the anode wire 300 is placed. The thickness of the front end portion 451 is the first in the solid electrolytic capacitor A1 as a product. It is larger than the thickness of the electrode member 400. The second electrode member 550 has, for example, a form that is integrally extended from the manufacturing frame 720. The second electrode member 550 has a member 552 corresponding to the block portion 520 having a plate-like portion 510 formed at the tip. The length of the member 552 corresponding to the block portion 520 is a solid electrolytic capacitor A1 as a product. It is larger than the thickness of the block part 520 of the 2nd electrode member 500. The first electrode member 450 is connected to the anode wire 300 by, for example, laser welding in a state where the anode wire 300 is placed in the notch 452 (see FIG. 3). The second electrode member 550 is connected to the element body 200 by joining the plate-like portion 551 at the tip thereof to the second side surface 202 of the element body 200 with a conductive adhesive (not shown). The connection of the first electrode member 450 to the anode wire 300 and the connection of the second electrode member 550 to the element body 200 may be performed at the same time, either one is performed first, and the other is performed later. May be.

  Next, as shown in FIG. 10, the capacitor element 100, the first electrode member 450, and the second electrode member 550 are wrapped with a sealing resin to form a resin package intermediate 600a. This step can be performed by a so-called transfer molding method. At this time, as shown in the figure, the lower end 453 of the first electrode member 450 and the lower end 553 of the second electrode member 550 are spaced apart from the bottom surface 605 of the resin package intermediate body by a predetermined distance. Keep it.

  Next, as shown in FIG. 11, both ends in the longitudinal direction of the resin package intermediate 600 a are cut using, for example, a rotating blade B. This cutting is performed by cutting the resin package intermediate 600a together with the first electrode member 450 and the second electrode member 550. Accordingly, as illustrated in FIG. 12, the exposed surface 430 of the first electrode member 400 is formed on the first side surface 601 of the resin package 600 and the exposed surface 530 of the second electrode member 500 is formed on the second side surface 602. Are formed flush with each other.

  Next, cut portions 630 having a predetermined depth are formed at both ends of the bottom surface 605 of the resin package 600, and the first electrode member 400 and the second electrode member 500 are exposed downward so as to connect to the upright exposed surfaces 431 and 531. The surfaces 432 and 532 are formed, and the solid electrolytic capacitor A1 shown in FIGS. 1 to 6 is completed. For example, a sandblast method can be used to form the cut portion 630. Further, a secondary electrode film (not shown) by Sn or solder plating may be formed on the exposed surfaces 430 and 530 of the first electrode member 400 and the second electrode member 500.

  Next, the operation of the solid electrolytic capacitor A1 will be described.

  As shown in FIGS. 1, 5, and 6, in the solid electrolytic capacitor A <b> 1 according to the present embodiment, an electrode is disposed between the bottom surface 205 of the element body 200 of the capacitor element 100 and the bottom surface 605 of the resin package 600. There are no members. Therefore, the thickness of the sealing resin between the bottom surface 205 of the element body 200 and the bottom surface 605 of the resin package 600 can be reduced to the limit, for example, about 0.15 mm. Since the thickness of the sealing resin between the upper surface 206 of the element body 200 and the upper surface 606 of the resin package 600 can be reduced to the limit as well, the vertical dimension of the resin package 600 is, for example, about 0.5 to 0.8 mm. To reduce the thickness of the solid electrolytic capacitor A1.

  Further, as shown in FIG. 13, the solid electrolytic capacitor A <b> 1 is retracted from the bottom surface 605 of the resin package 600, and the downward exposed surface 432 connected to the upright exposed surface 431 of the first electrode member 400, and the second electrode Since the downward exposed surface 532 connected to the upright exposed surface 531 of the member 500 is formed, when the solid electrolytic capacitor A1 is mounted on the mounting substrate CB by the solder reflow method, the mounting substrate CB and the downward exposed surface 432 are disposed. As the molten solder enters the gap 532 by capillary action, a solder fillet H is formed by the molten solder climbing up to the standing exposed surfaces 431 and 531. As a result, the contact area between the solder fillet H and the first and second electrode members 400 and 500 is expanded, and a stable mounting state of the solid electrolytic capacitor A1 is maintained.

  14 to 16 show a solid electrolytic capacitor A2 according to a second embodiment of the present invention. In these drawings, the same or similar members or parts as those of the solid electrolytic capacitor A1 according to the first embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals.

  Solid electrolytic capacitor A2 includes a capacitor element 100, a second electrode member 500, and a resin package 600.

  The capacitor element 100 in the solid electrolytic capacitor A2 may be the same as the capacitor element 100 according to the first embodiment, and may have the flat rectangular parallelepiped element main body 200. Therefore, detailed description thereof is omitted here. .

  On the first side surface 601 of the resin package 600, the cut surface of the anode wire 300 that also serves as the first electrode member 400 becomes an exposed surface 330, and is exposed on the first side surface 601 in a flush manner.

  The second electrode member 500 is bonded to the second side surface 202 of the element body 200 by, for example, a conductive adhesive 540, and a part thereof is exposed on the second side surface 602 of the resin package 600. In the present embodiment, the second electrode member 500 includes a plate-like portion 510 joined to substantially the entire second side 202 of the element body 200, and a preferably flat rod portion joined to the plate-like portion 510. 520a, and a cut surface of the rod portion 520a becomes an exposed surface 530, and is exposed on the second side surface 602 in a flush manner. The second electrode member 500 is made of a Ni—Fe alloy such as 42 alloy, for example.

  The resin package 600 encloses the capacitor element 100 and the second electrode member 500, and is made of, for example, an epoxy resin. The resin package 600 has a flat rectangular parallelepiped shape that efficiently wraps the capacitor element 100. The resin package 600 includes a bottom surface 605, a top surface 606 spaced apart from the bottom surface 605 by a predetermined distance, and four side surfaces connecting the bottom surface 605 and the top surface 606, that is, the first side surface of the element body 200 of the capacitor element 100. 201 corresponding to and parallel to the first side surface 601, on the opposite side to the first side surface 601, corresponding to the second side surface 202 of the element body 200 and parallel to the second side surface 602, and the element body 200. Corresponding to the third and fourth side surfaces 203 and 204, respectively, there are third and fourth side surfaces 603 and 604 parallel to them. As described above, the cut surface of the anode wire 300 becomes the exposed surface 330 on the first side surface 601 of the resin package 600 and is exposed in a flush manner.

  As clearly shown in FIG. 14, a secondary electrode film 460 that is electrically connected to the exposed surface 330 of the anode wire 300 is formed on the first side surface 601 of the resin package 600. In the present embodiment, the secondary electrode film 460 extends from the first side surface 601 of the resin package 600 to the bottom surface 605 and the top surface 606. Of course, the resin package 600 may wrap around the third and fourth side surfaces 603 and 604 (see FIG. 15). In addition, a secondary electrode film 540 that is electrically connected to the exposed surface 530 of the second electrode member 500 is formed on the second side surface 602 of the resin package 600. In the present embodiment, the secondary electrode film 560 also extends from the first side surface 601 to the bottom surface 605 and the top surface 606 of the resin package 600, and of course, may also extend to the third and fourth side surfaces 603 and 604 ( FIG. 15). Such secondary electrode coatings 460 and 560 can be formed by printing / firing using a conductive paste or sputtering. Furthermore, a coating such as solder plating may be formed on the surface of these secondary electrode coatings 460 and 560.

  Next, a method for manufacturing the solid electrolytic capacitor A2 will be described.

  First, as shown in FIGS. 17 and 18, the capacitor element 100 having the above-described configuration is prepared. The anode wire 300 at this time has a sufficient length, and the anode wire 300 is joined and supported to the manufacturing frame 710.

  Next, as shown in FIG. 19, the second electrode member 550 is connected to the second side surface 202 of the element body 200. The second electrode member 550 has, for example, a form that is integrally extended from the manufacturing frame 720. The second electrode member 550 has a member 552 corresponding to the rod portion 520a having a plate-like portion 510 formed at the tip. The length of the member 552 corresponding to the rod portion is the same as that of the solid electrolytic capacitor A2 as a product. It is sufficiently longer than the length of the rod portion 520a of the second electrode member 500. The second electrode member 550 is connected to the element body 200 by joining the plate-like portion 510 at the tip thereof to the second side surface 202 of the element body 200 with the conductive adhesive 540.

  Next, as shown in FIG. 20, the capacitor element 100 and the second electrode member 550 are wrapped with a sealing resin to form a resin package intermediate 600a. This step can be performed by a so-called transfer molding method.

  Next, as shown in FIG. 21, both end portions in the longitudinal direction of the resin package intermediate 600 a are cut using, for example, a rotating blade B. This cutting is performed by cutting the resin package intermediate 600a together with the anode wire 300 and the second electrode member 550. Thus, as shown in FIG. 22, the exposed surface 330 of the anode wire 300 is formed on the first side surface 601 of the resin package 600 and the exposed surface 530 of the second electrode member 500 is formed on the second side surface 602. It is formed in one shape.

  Next, a secondary electrode film 460 that is electrically connected to the exposed surface 330 of the anode wire 300 is formed on the first side surface 601 of the resin package 600, and the exposed surface 530 of the second electrode member 500 is formed on the second side surface 602 of the resin package 600. Is formed, and the solid electrolytic capacitor A2 shown in FIGS. 14 and 23 is completed.

  Next, the operation of the solid electrolytic capacitor A2 will be described.

  As shown in FIG. 14, also in the solid electrolytic sander according to the present embodiment, there is no electrode member between the bottom surface 205 of the element body 200 of the capacitor element 100 and the bottom surface 605 of the resin package 600. Therefore, the thickness of the sealing resin between the bottom surface 205 of the element body 200 and the bottom surface 605 of the resin package 600 can be reduced to the limit, for example, about 0.15 mm. Since the thickness of the sealing resin between the upper surface 206 of the element body 200 and the upper surface 606 of the resin package 600 can be reduced to the limit as well, the vertical dimension of the resin package 600 is, for example, about 0.5 to 0.8 mm. This shortens the thickness of the solid electrolytic capacitor A2.

  Of course, the scope of the present invention is not limited to the above-described embodiments, and all design changes within the scope of the claims are all included in the scope of the present invention.

A1 Solid electrolytic capacitor A2 Solid electrolytic capacitor B Rotating blade CB Mounting substrate H Solder fillet 100 Capacitor element 200 Element body 201 First side surface 202 Second side surface 203 Third side surface 204 Fourth side surface 205 Bottom surface 206 Upper surface 210 Porous sintered body 211 Pore 221 Dielectric layer 222 Solid electrolyte layer 223 Conductive layer 230 Swelling prevention ring 300 Anode wire 330 Exposed surface 400 First electrode member 450 First electrode member 451 Tip portion 452 Notch 453 Lower end 430 Exposed surface 431 Standing exposure Surface 432 Downward exposed surface 460 Secondary electrode coating 500 Second electrode member 550 Second electrode member 553 Lower end portion 510 Plate-shaped portion 520 Block portion 520a Rod portion 530 Exposed surface 531 Standing exposed surface 532 Downward exposed surface 540 Conductive bonding Agent 560 Secondary Electrode film 600 resin package 600a resin package Intermediate 601 first side 602 second side 603 third side 604 fourth side 605 bottom 606 top 630 cutouts 710 for producing frames (for the first electrode member support)
720 Manufacturing frame (second electrode member support)

Claims (32)

A solid electrolytic capacitor comprising: a capacitor element having an anode and a cathode; a package enclosing the capacitor element; a first electrode member electrically connected to the anode; and a second electrode member electrically connected to the cathode,
The package has a bottom surface, a top surface spaced from the bottom surface, and a side surface connecting the bottom surface and the top surface,
At least a part of the second electrode member is exposed on the side surface of the package.   The capacitor element includes an element body including a porous sintered body made of a valve metal in which a dielectric layer, a solid electrolyte layer, and a conductive layer are laminated, and an anode wire protruding from the element body. The element body has a bottom surface parallel to the bottom surface of the package, and the second electrode member does not exist between the bottom surface of the package and the bottom surface of the element body. Solid electrolytic capacitor.   The solid electrolytic capacitor according to claim 2, wherein the second electrode member is exposed flush with the side surface of the package.   The solid electrolytic capacitor according to claim 3, wherein the second electrode member is not exposed flush with the bottom surface of the package.   5. The solid electrolytic capacitor according to claim 3, wherein the first electrode member is exposed flush with the side surface of the package.   The solid electrolytic capacitor according to claim 5, wherein the first electrode member is not exposed to be flush with the bottom surface.   The solid electrolytic capacitor according to claim 6, wherein the anode wire extends parallel to a bottom surface of the element body.   The solid electrolytic capacitor according to claim 7, wherein the first electrode member is conductively connected to the anode wire.   The element body has a top surface that is spaced apart from the bottom surface of the element body, and a side surface that connects the bottom surface and the top surface, and the side surface includes a first side surface from which the anode wire protrudes; The solid electrolytic capacitor according to claim 8, further comprising a second side surface different from the first side surface, wherein the second electrode member is connected to the second side surface.   The solid electrolytic capacitor according to claim 9, wherein the second side surface of the element body is located on the opposite side of the first side surface.   The side surface of the package has a first side surface from which the first electrode member is exposed, and a second side surface from which the second electrode member is exposed, and the second side surface is formed from the first side surface. Located on the opposite side, the first side surface of the package and the first side surface of the element body are in the same direction, and the second side surface of the package and the second side surface of the element body are the same. The solid electrolytic capacitor according to claim 10, which faces a direction.   The package has a rectangular shape in a planar projection view, connects the first side surface and the second side surface of the package, and has a third side surface and a fourth side surface located on opposite sides of each other, The element body has a rectangular shape in plan view, and has a third side face and a fourth side face that connect the first side face and the second side face of the element body and are opposite to each other. The solid electrolytic capacitor according to claim 11.   The first electrode member has a standing exposed surface that is flush with the first side surface of the package and a downward exposed surface that is connected to the standing exposed surface and retreats upward from the bottom surface of the package. The solid electrolytic capacitor according to claim 6.   The solid electrolytic capacitor according to any one of 6 to 12, wherein the anode wire also serves as the first electrode member.   The second electrode member has a standing exposed surface that is flush with the second side surface of the package, and a downward exposed surface that is connected to the standing exposed surface and retreats upward from the bottom surface of the package. The solid electrolytic capacitor according to claim 13 or 14.   The exposed surface of the first electrode member to the outer surface of the package and the exposed surface of the second electrode member to the outer surface of the package are covered with a secondary electrode film. A solid electrolytic capacitor according to claim 1.   The solid electrolytic capacitor according to claim 16, wherein the secondary electrode film is formed by plating.   The side surface of the package where the first electrode member is exposed is covered with a secondary electrode film that is electrically connected to the first electrode member, and the side surface of the package where the second electrode member is exposed is the second electrode. The solid electrolytic capacitor according to claim 6, wherein the solid electrolytic capacitor is coated with a secondary electrode film that is electrically connected to the member.   The solid electrolytic capacitor according to claim 18, wherein the secondary electrode film is formed by applying and baking a conductive paste.   The solid electrolytic capacitor according to claim 2, wherein the top surface of the package is parallel to the bottom surface of the package, and the top surface of the element body is parallel to the bottom surface of the element body. .   21. The solid electrolytic capacitor according to claim 20, wherein a dimension between the bottom surface of the package and the bottom surface of the element body is 0.15 to 0.25 mm.   The solid electrolytic capacitor according to claim 21, wherein a dimension between the upper surface of the package and the upper surface of the element body is 0.15 to 0.25 mm.   The solid electrolytic capacitor according to claim 22, wherein a thickness between the bottom surface of the element body and the top surface of the element body is 0.3 to 0.5 mm.   The solid electrolytic capacitor according to claim 23, wherein the valve metal of the porous sintered body is Ta or Nb.   The solid electrolytic capacitor according to claim 24, wherein the anode wire is made of the same material as the valve action metal of the porous sintered body. A capacitor element having an element body and an anode wire exposed from the first side surface of the element body is encased in a package, and a first electrode member electrically connected to the anode wire and a second electrode member electrically connected to the element body are A method of manufacturing a solid electrolytic capacitor exposed on an outer surface of a package,
A first step of preparing the capacitor element;
A second step of connecting a first electrode member to the anode wire and connecting a second electrode member to a second side surface of the element body opposite to the first side surface;
A third step of sealing the capacitor element, the first electrode member and the second electrode member with a sealing resin to form a package intermediate; and
The package intermediate body is cut together with the first electrode member at a predetermined distance from the first side surface of the element body, and the cut surface of the first electrode member is flush with the first side surface of the package. An exposed surface that is exposed is formed, and the package intermediate body is cut together with the second electrode member at a predetermined distance from the second side surface of the element body, and the cut surface of the second electrode member is the package. A fourth step of forming an exposed surface that is flush with the second side surface of
A method for producing a solid electrolytic capacitor, comprising:   27. The solid according to claim 26, further comprising a fifth step of forming a secondary electrode film on the exposed surface of the first electrode member and forming a secondary electrode film on the exposed surface of the second electrode member. Manufacturing method of electrolytic capacitor.   28. The method for manufacturing a solid electrolytic capacitor according to claim 27, wherein the formation of the secondary electrode film in the fifth step is performed by plating.   26. The solid according to claim 24, further comprising a sixth step of cutting the package from a bottom surface thereof and forming a downward exposed surface connected to the exposed surface on the first electrode member and the second electrode member, respectively. Manufacturing method of electrolytic capacitor. A capacitor element having an element body and an anode wire exposed from the first side surface of the element body is encased in a package, and a second electrode member that is electrically connected to the anode wire and the element body is exposed to an outer surface of the package. A method of manufacturing an electrolytic capacitor, comprising:
A first step of preparing the capacitor element;
A second step of connecting a second electrode member to a second side surface of the element body opposite to the first side surface;
A third step of sealing the capacitor element and the second electrode member with a sealing resin to form a package intermediate; and
The package intermediate body is cut together with the anode wire at a position separated from the first side surface of the element body by a predetermined distance, and an exposed surface on which the cut surface of the anode wire is exposed to be flush with the first side surface of the package. The package intermediate body is cut together with the second electrode member at a position spaced a predetermined distance from the second side surface of the element body, and the cut surface of the second electrode member is formed on the second side surface of the package. A fourth step of forming an exposed surface that is flush with the surface;
A method for producing a solid electrolytic capacitor, comprising:   A secondary electrode film that is electrically connected to the exposed surface of the anode wire is formed on the first side surface of the package, and a secondary electrode that is electrically connected to the exposed surface of a second electrode member is formed on the second surface of the package. The method for manufacturing a solid electrolytic capacitor according to claim 30, further comprising a fifth step of forming an electrode film.   32. The method of manufacturing a solid electrolytic capacitor according to claim 31, wherein the formation of the secondary electrode film in the fifth step is performed by printing and baking.

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