JP2017059918A - Crystal resonator and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal resonator in which a vibration part, having a crystal vibration piece consisting of various vibration modes, can be hermetically sealed easily and reliably by a pair of sealing bodies, and electrical connection of the crystal vibration piece and the outside can be enhanced.SOLUTION: A crystal resonator 11 includes a vibrator 12 having a crystal vibration piece, and a pair of sealing bodies 13, 14 for sealing this vibrator 12. The sealing bodies 13, 14 are bonded via conductive layers 30 formed on the upper and lower surfaces of the vibrator 12, and external electrodes 25a, 25b are formed and coat so as to cover side faces of the conductive layers 30 exposed on the side faces of the bonded vibrator 12 and sealing bodies 13, 14. The sealing bodies 13, 14 are bonded so that the upper and lower surfaces of the conductive layers 30 are exposed partially, and the external electrodes 25a, 25b are formed to cover a part of the upper and lower surfaces from the side face of the exposed conductive layers 30.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a quartz crystal resonator including a vibrating body having a crystal vibrating piece having various vibration modes and a pair of sealing bodies that seal the vibrating body, and a method for manufacturing the same.

  A conventional general crystal resonator includes a crystal resonator element having a predetermined vibration mode and shape, a ceramic case that accommodates the crystal resonator element, and a metal lid that seals the crystal resonator element. Is formed. In the quartz crystal resonator element, a base end portion that holds a vibrating arm portion is electrically connected to an electrode portion provided in the case via a conductive bonding agent.

  On the other hand, a vibrating body formed by etching or the like from the quartz crystal wafer and a pair of wafer-like sealing bodies that enclose the quartz vibrating piece are formed integrally by sandwiching the vibrating body. A crystal resonator manufactured by a wafer level package is known.

  Patent Documents 1 and 2 disclose a crystal resonator formed by the wafer level package. The crystal unit using the wafer level package includes a vibrating body composed of a crystal vibrating piece of various vibration modes and a support frame supported at one end so as to surround the crystal vibrating piece, and a pair of enclosing the crystal vibrating piece. The sealing body is formed by punching from a quartz wafer by etching or the like, and the vibrating body is sandwiched and stacked between a pair of sealing bodies.

JP 2004-328442 A Japanese Patent No. 4770721

  Since the crystal resonator formed by the wafer level package can manufacture a large amount of crystal resonators from a single crystal wafer, the number of manufacturing steps and the manufacturing cost can be reduced, and the crystal resonator itself can be made smaller and thinner. It has the advantage of being realized.

  In such a wafer level package, an internal electrode for electrical connection with a crystal vibrating piece is formed on the support frame of the vibrating body, and is formed by sandwiching the vibrating body between a pair of sealing bodies. Therefore, only the thickness of the internal electrode is exposed to the outside. For this reason, when an electrical connection with the internal electrode is made via an external electrode provided outside, the contact portion between the internal electrode of the vibrator and the external electrode formed by sputtering or the like in the structure of the conventional crystal unit However, since the thickness is only about 1000 to 2000 mm which is substantially the same as the thickness of the internal electrode, there may be a problem in electrical characteristics such as poor conduction or an increase in the electrical resistance value of the connection portion.

  With respect to the routing of the internal electrode, conventionally, a method of forming a through-hole wiring on a substrate and connecting an extraction electrode extending from the excitation electrode and an external terminal is used. However, as the package size decreases, it becomes difficult to form a through hole. As described above, the process of forming a through hole takes time and cost, and there is a problem in strength.

  Regarding sealing of the vibrating body, it is necessary to make the crystal vibrating piece close to a vacuum. For this reason, in Patent Document 1, a vent is provided in advance in a part of the sealing body, and after the vibrating body is joined with a pair of sealing bodies in a reduced pressure environment, the vent is closed from the outside. The quartz crystal resonator element is hermetically sealed. On the other hand, in Patent Document 2, a ventilation hole is provided in a part of a vibrating body or a sealing body, and after the vibration body is joined with the sealing body, the ventilation hole is closed with solder, tin, or the like. However, there is a problem that deformation, cracks, and the like occur when opening a vent hole directly on a wafer-like vibrating body or sealing body. In addition, there is a problem that additional material costs and man-hours are required, for example, a member for closing the vent hole later is required.

  In addition, in the conventional wafer level package manufacturing process, the vibrating body and the pair of sealing bodies are divided into small pieces by dicing, and terminals are formed, and conduction between the vibrating body and the sealing body is ensured by external electrodes. When forming the terminal, it is difficult to secure the degree of vacuum when forming the terminal, such as clogging of the air passage for vacuuming or the conductive part between the vibrating body and the external terminal due to cracks, dirt or dicing residue due to dicing. There is a problem that it is easy. Further, since the package is divided into small pieces, it is necessary to perform the post-process (sputtering, frequency adjustment) with the small pieces, which increases the number of manufacturing steps.

  Accordingly, an object of the present invention is to easily and reliably hermetically seal a vibrating portion having a quartz crystal vibrating piece having various vibration modes with a pair of sealing bodies, and to electrically connect the quartz vibrating piece and the outside. It is an object of the present invention to provide a crystal resonator and a method of manufacturing the same that can improve the general connection.

  In order to solve the above-described problems, a crystal resonator according to the present invention is bonded to a vibrating body including a crystal vibrating piece and a support frame that supports at least one end of the crystal vibrating piece, and an upper surface and a lower surface of the support frame. A pair of sealing bodies having a contact surface and a concave portion on the inside, and the contact surfaces of the pair of sealing bodies are bonded to the upper and lower surfaces of the support frame via conductive layers formed respectively. A quartz resonator in which an external electrode is formed so as to cover the side surfaces of the conductive layer exposed on the side surfaces of the bonded vibrating body and the pair of sealing bodies, and includes an upper surface and a lower surface from the side surfaces of the conductive layer. The contact surfaces of the pair of sealing bodies are bonded so as to expose one end of the conductive layer, and the external electrode is formed so as to cover one end of the upper surface and the lower surface from the side surface of the conductive layer. To do.

  The method for manufacturing a crystal resonator according to the present invention includes a step of forming a plurality of vibrators on a collective vibration substrate including a crystal vibrating piece and a support frame that supports at least one end of the crystal vibrating piece, respectively on the upper and lower surfaces of the support frame. A step of forming a plurality of sealing bodies having a contact surface to be joined and a concave portion on the inside thereof on a pair of collective sealing substrates, a pair of opposing side surfaces of each vibrating body formed on the collective vibration substrate, and the pair A step of providing through holes along a pair of opposing side surfaces of each sealing body formed on the assembly sealing substrate, and positioning the pair of assembly sealing substrates on the upper and lower surfaces of the assembly vibration substrate, Bonding a support frame of each vibrating body formed on the collective vibration substrate and a contact surface of each sealing body formed on the pair of collective sealing substrates via a conductive layer; and Along the inner wall surface, formed on the collective vibration substrate Forming an external electrode on a pair of opposing side surfaces of the vibrating body and a pair of opposing side surfaces of each sealing body formed on the pair of collective sealing substrates; and the joined collective vibration substrate and collective sealing And a step of dicing the substrate in a predetermined direction to divide the substrate into individual crystal resonators.

  According to the crystal resonator of the present invention, when the vibrating body and the pair of sealing bodies are bonded via the conductive layer, the side surface of the conductive layer and one end of the upper and lower surfaces are exposed, so that the exposed portion is It can be an electrical connection surface of the external electrode. This facilitates the formation of external electrodes for crystal resonators that are becoming smaller and thinner, and provides good conductivity for the vibrator.

  In addition, in the case where a ventilation path is provided in the conductive layer that joins the vibrating body and the pair of sealing bodies, without requiring processing such as providing holes in the vibrating body or the pair of sealing bodies, The air in the recessed part joined by a pair of sealing bodies can be extracted outside. Further, by closing one end portion of the air passage on one side surface of the vibrating body and the sealing body, the vibrating body can be easily and reliably formed without causing deformation or cracking in the vibrating body or the sealing body. It can be hermetically sealed.

  According to the method for manufacturing a crystal resonator of the present invention, a plurality of crystal resonators are collectively formed by a collective vibration substrate on which a plurality of vibration bodies are formed and a collective sealing substrate on which a plurality of sealing bodies are formed. Can be formed. In addition, through holes are provided along a pair of opposing side surfaces of each vibrating body formed on the collective vibration substrate and a pair of opposing side surfaces of each sealing body formed on the pair of collective sealing substrates, By performing sputtering along the inner wall surface of the through hole, the external electrodes can be collectively formed.

  In addition, by providing an air passage in a part of the conductive layer for joining the collective vibration substrate and the pair of collective sealing substrates, the hermetic sealing operation in a reduced pressure environment is surely and easily performed. Can do.

1 is an exploded perspective view of a crystal resonator according to a first embodiment of the present invention. It is sectional drawing which shows the laminated structure of the vibrating body which comprises the said crystal oscillator, and a pair of sealing body. It is a perspective view of the crystal oscillator which provided the external electrode. It is sectional drawing of the crystal oscillator which provided the external electrode. It is a top view which shows the example of formation of the internal (connection) electrode formed in a vibrating body and a pair of sealing body. It is sectional drawing of the crystal oscillator in which the said internal electrode and the external electrode were formed. It is sectional drawing of the vibrating body and a pair of sealing body which are joined with a level | step difference. It is a top view which shows the formation process of a collective vibration board | substrate and a pair of collective sealing board | substrate. It is a perspective view which shows the lamination | stacking process and external electrode formation process of a collective vibration board | substrate and a pair of collective sealing board | substrate. It is a disassembled perspective view of the crystal oscillator of 2nd Embodiment of this invention. It is sectional drawing which shows the laminated structure of the vibrating body which comprises the said crystal oscillator, and a pair of sealing body. It is a perspective view of the crystal oscillator which provided the external electrode. It is sectional drawing of the crystal oscillator which provided the external electrode. It is a top view which shows the example of formation of the internal (connection) electrode formed in a vibrating body and a pair of sealing body. It is a perspective view of the crystal oscillator which closed the air passage with the sealing member different from the above-mentioned external electrode. It is a top view of other embodiments of a vibrating body.

  Hereinafter, embodiments of the crystal resonator of the present invention will be described in detail with reference to the accompanying drawings. 1 to 6 show the crystal resonator 11 of the first embodiment. The crystal unit 11 has a three-layer structure including a wafer-like vibrating body 12 and a pair of wafer-like sealing bodies 13 and 14 that sandwich and seal the vibrating body 12 from both front and back surfaces. As will be described later, the crystal unit 11 forms the vibrating body 12 and the pair of sealing bodies 13 and 14 by etching and dicing a crystal wafer formed at a predetermined cut angle, and in a reduced pressure environment. Each is weld-joined through a conductive layer 30 made of a conductive metal film having a predetermined thickness.

  The quartz wafer is shaped like a plate with a cut angle obtained by rotating the X axis about 1 ° from the Z axis plane in an orthogonal coordinate system of the rough crystal with the X axis as the electrical axis, the Y axis as the mechanical axis, and the Z axis as the optical axis. It is formed by thinly slicing. Then, a mask pattern is formed on the crystal wafer by a photolithography process, and crystal etching is performed, so that a tuning-fork type crystal vibrating piece including a base 18 and a pair of vibrating arms 19 extending in parallel from the base 18 is obtained. 15 and a rectangular support frame 16 that surrounds the outer periphery of the crystal vibrating piece 15 and a connecting body 17 that connects one end of the support frame 16 and one end of the base 18 are formed. The vibrating arm portion 19 has a thickness of 50 to 200 μm, and the length and width are set according to the vibration frequency. Similarly, the pair of sealing bodies 13 and 14 are also formed by etching with a rectangular contact surface 21 and a recess 23 for accommodating the crystal vibrating piece 15. The shapes of the vibrating body 12 and the pair of sealing bodies 13 and 14 can also be formed by cutting or punching using a laser or powder beam suitable for fine processing.

  The vibrating body 12 and the pair of sealing bodies 13 and 14 are welded after contacting the conductive layers 30 formed on both circumferential surfaces of the support frame 16 and the pair of contact surfaces 21. Is done by.

  In the present embodiment, as shown in FIGS. 1 to 6, at least one side surface 13 a, 14 a of the pair of sealing bodies 13, 14 is inclined inward toward the vibrating body 12. Thus, when the other side surfaces other than the side surfaces 13a and 14a are joined to the side surface of the support frame 16 of the vibrating body 12, the side surface 13a of the conductive layer 30 and the side surface 13a side of the sealing body 13 are connected. One end of the upper surface 30b can be exposed. Further, the side surface 30 a of the conductive layer 30 and one end of the lower surface 30 c can be exposed on the side surface 14 a side of the sealing body 14. As a result, as shown in FIGS. 3 and 4, when the pair of external electrodes 25a and 25b are formed by sputtering or the like along the outer peripheral surface of the quartz crystal resonator 11, the side surface 30a to the upper surface 30b of the conductive layer 30 or It can be coated along one end of the lower surface 30c.

  Since the side surface 30a of the conductive layer 30 depends on the thickness of the metal material forming the conductive layer 30, the electrical connection with the external electrodes 25a and 25b is not sufficient only by this thickness, but the sealing body 13 , 14 can be made to be electrically connected to one end of the upper surface 30b and the lower surface 30c of the conductive layer 30 by inclining some of the side surfaces 13a, 14a. As a result, the contact area between the external electrodes 25a and 25b and the conductive layer 30 can be increased to prevent electrical contact failure, and the crystal vibrating piece 15 electrically connected to the conductive layer 30 can be stabilized. Electric power can be supplied. In addition, since the electrical junction with the external electrodes 25a and 25b extends from the side surface 30a of the conductive layer 30 to one end of the upper surface 30b and the lower surface 30c, the electrical resistance of the junction is reduced, and the equivalent series resistance in the crystal vibrating piece 15 is reduced. Can also be obtained.

  As shown in FIG. 8, the pair of sealing bodies 13 and 14 can utilize anisotropy in etching rate when the pair of sealing bodies 13 and 14 are removed from the pair of collective sealing substrates 43 and 44 by wet etching. . Due to the anisotropy of the etching rate, the side surfaces 13a and 14a inclined with respect to the etching depth direction can be formed. This wet etching may be performed on the side surfaces of the sealing bodies 13 and 14 which are desired to be inclined, and the other side surfaces can be cut by dicing.

  The external electrodes 25a and 25b can be formed by performing sputtering, plating, or soldering along the side surfaces 13a and 14a inclined by the wet etching.

  The conductive layer 30 is formed as an internal electrode for electrical connection between the pair of external electrodes 25 a and 25 b and the pair of excitation electrodes formed on the crystal vibrating piece 15 in the vibrating body 12. FIG. 5 shows a configuration example of the internal electrode, and FIG. 6 shows a cross-sectional configuration of the internal electrode. Here, FIG. 5A shows the upper surface of the support frame 16 of the vibrating body 12 and the contact surface 21 of the sealing body 13 opposed to the upper surface, and FIG. The lower surface of the support frame 16 of the vibrating body 12 and the contact surface 21 of the sealing body 14 facing the lower surface are shown in a double spread. A pair of excitation electrodes 31 a and 31 b are formed in a pattern from the base 18 to the pair of vibrating arms 19 on the surface of the crystal vibrating piece 15 in the vibrating body 12. In this embodiment, the conductive layer 30 is provided on both the upper and lower surfaces of the support frame 16 and the contact surfaces 21 of the pair of sealing bodies 13 and 14 joined to the upper and lower surfaces. Since the conductive layer 30 formed on each contact surface 21 of the sealing bodies 13 and 14 contributes to the bonding between the support frame 16 and the external electrodes 25a and 25b, the conductive layer 30 is at least the support frame 16. What is necessary is just to be formed in the upper and lower surfaces.

  A first internal electrode 32 a and a second internal electrode 32 b corresponding to the respective excitation electrodes 31 a and 31 b are formed on a pair of opposing side surfaces of the support frame 16 on the upper surface of the support frame 16 that surrounds the crystal vibrating piece 15. It is formed with an insulating portion 34 provided along the gap (FIG. 5A). The second internal electrode 32b is provided only to be exposed on one side surface 16b of the support frame 16.

  On the other hand, on the back surface of the support frame 16, the first internal electrode 32 a and the second internal electrode 32 b corresponding to the excitation electrodes 31 a and 31 b are provided along a pair of opposing side surfaces of the support frame 16. 34 (FIG. 5B). The first internal electrode 32a is provided only to expose the other side surface 16a of the support frame 16.

  As shown in FIG. 5A, the first inner electrode 32a formed on the surface of the support frame 16 is formed on the contact surface 21 of the sealing body 13 corresponding to the surface of the support frame 16. The first internal electrode 33a and the second internal electrode 33b are formed in a pattern so as to be plane-symmetric with the second internal electrode 32b. Further, as shown in FIG. 5B, the first internal electrode 32 a formed on the back surface of the support frame 16 is formed on the contact surface 21 of the sealing body 14 corresponding to the back surface of the support frame 16. The first internal electrode 33a and the second internal electrode 33b are formed in a pattern so as to be symmetrical with the second internal electrode 32b.

  FIG. 7 shows another embodiment of the sealing bodies 13 and 14. In the crystal resonator of this embodiment, the sealing bodies 13 and 14 are formed to have an outer size smaller than that of the support frame 16, and are stacked with a step on the side surfaces 13 a and 14 a side. By providing such a step, the pair of external electrodes 25a and 25b can be formed so as to be in contact with one end of the upper surface 30b and the lower surface 30c from the side surface 30a of the conductive layer 30.

  In the laminated structure of the vibrating body 12 and the pair of sealing bodies 13 and 14, sufficient electrical conductivity can be obtained if an electrical connection with the external electrodes 25 a and 25 b is attempted only by the side surface 30 a of the conductive layer 30 exposed on the outer peripheral surface. 1 to 7, the conductivity between the external electrodes 25 a and 25 b through the conductive layer 30 and the excitation electrode of the quartz crystal resonator element 15 is improved. It becomes possible. In addition, since the mechanical bonding strength between the pair of external electrodes 25a and 25b and the conductive layer 30 is increased, it is difficult to cause poor conduction or poor conduction due to an external impact or the external environment.

  8 and 9 show a method for manufacturing the crystal unit 11 of the above embodiment. The crystal unit 11 is formed by a collective vibration substrate 42 on which a plurality of vibrators 12 are formed, and a pair of collective sealing substrates 43 and 44 on which a plurality of sealing bodies 13 and 14 are formed.

  On the collective vibration substrate 42, a plurality of vibrating bodies 12 including a square-shaped support frame 16 and a tuning-fork type crystal vibrating piece 15 extending inside the support frame 16 via a connecting portion 17 are arranged. Each of the vibrating body forming regions is punched and formed by performing quartz etching through a mask pattern formed by a photolithography process, and a pair of excitation electrodes are formed on the surface of the quartz vibrating piece 15, Internal electrodes that are electrically connected to the pair of excitation electrodes are patterned on the front and back surfaces of the frame 16.

  On the other hand, the pair of collective sealing substrates 43 and 44 includes a contact surface 21 corresponding to the support frame 16 and a recess 23 formed by etching the inside of the contact surface 21 to a predetermined depth. A plurality of the sealing bodies 13 and 14 are arranged. Each of the sealing body forming regions is punched and formed by performing crystal etching through a mask pattern formed by a photolithography process.

  Further, through holes 45 having a predetermined width are formed along the outer sides of the opposite sides of the contact surfaces 21 formed on the support frames 16 and the pair of collective sealing substrates 43 and 44 formed on the collective vibration substrate 42. Each is formed. The through hole 45 is provided to form the external electrodes 25 a and 25 b along the outer peripheral surfaces of the laminated vibrator 12 and the pair of sealing bodies 13 and 14. The external electrodes 25a and 25b are formed by sputtering.

  FIG. 9 shows a manufacturing process in a reduced pressure environment with a degree of vacuum of 1.0 × 10 Pa or less. Under such a reduced pressure environment, as shown in FIG. 9 (a), both the support frame 16 and the pair of contact surfaces 21 are aligned so that the collective vibration substrate 42 is paired with the collective sealing. The substrates 43 and 44 are stacked so as to be sandwiched between the substrates 43 and 44, and are joined by welding through the conductive layer 30. As shown in FIGS. 5 and 6, the conductive layer 30 is patterned by a pair of internal electrodes, but the shape of each internal electrode is omitted here.

  Next, as shown in FIG. 9B, the support frame 16 is sputtered on the common through hole 45 of the stacked collective vibration substrate 42 and the pair of collective sealing substrates 43 and 44. Then, a pair of external electrodes 25a and 25b that are electrically connected to one end of the side surface and upper or lower surface of the conductive layer 30 formed along the contact surface 21 are formed. By forming the external electrodes 25a and 25b, the crystal vibrating piece 15 can be sealed in an airtight state.

  Finally, by dicing the laminated body of the collective vibration substrate 42 and the pair of collective sealing substrates 43 and 44 along the dicing line 46, the crystal resonators 11 having the three-layer structure shown in FIG. Multiple manufacturing is possible.

  Next, an embodiment of the crystal unit 51 of the second embodiment will be described with reference to FIGS. In this embodiment, a slit-like air passage 22 that opens the recess 23 in which the crystal vibrating piece 15 is accommodated is formed in at least one portion of the conductive layer 30 formed in the vibrating body 12. As shown in FIGS. 12 and 13, the air passage 22 is one of the external electrodes 25 a and 25 b provided on the pair of opposing side surfaces of the vibrating body 12 and the pair of sealing bodies 13 and 14. It is blocked by 25a.

  Next, a configuration example of the conductive layer 30 in the crystal resonator 51 is shown in FIG. In this embodiment, a slit-like air passage 22 is provided so as to penetrate a part of the first internal electrode 32 a formed on the support frame 16 on the surface side of the vibrating body 12. The ventilation path 22 can be formed by applying a mask having a streak pattern formed on a part of the crystal surface of the support frame 16 and sputtering the first internal electrode 32a. Further, a thin-film metal material for forming the first internal electrode 32a is uniformly formed on the surface of the support frame 16, and a part of the metal material is later removed in a slit shape. Can also be formed. The air passage 22 is a first frame formed in the support frame 16 as long as a part of the air passage 22 is releasable when the vibrating body 12 is sealed by a pair of sealing bodies 13 and 14. You may provide in any position of the internal electrode 32a, the 2nd internal electrode 32b, or the internal electrodes 33a and 33b formed in the contact surface 21, and you may provide more than one.

  By providing the air passage 22, when the vibrating body 12 and the pair of sealing bodies 13 and 14 are joined, an air passage leading to the outside from the concave portion 23 where the crystal vibrating piece 15 is sealed is secured. Thus, the inside of the recess 23 can be depressurized. Under this reduced pressure, as shown in FIG. 12, the pair of external electrodes 25a and 25b are formed so as to block the air passage 22 from the outside, so that the quartz crystal vibrating piece 15 can be placed under a highly reduced pressure environment. It becomes possible to seal.

  Since the external electrodes 25a and 25b that block the air passage 22 are formed by sputtering as described above, a part of the metal components enter the air passage 22 to further enhance electrical and mechanical joining. Can do.

  In this embodiment, although the said ventilation path 22 was provided in either one of the surface of the support frame 16, and the back surface, it can form in multiple numbers, such as making it oppose both. Further, as shown in FIG. 15, the air passage 22 may be provided on the long side joining surface where the external electrodes 25a and 25b are not formed. In this case, when the pressure is reduced, it is necessary to block the air passage 22 with a sealing material 26 such as another metal film or a resin film.

  According to the crystal resonator 51 of the second embodiment, since the air passage 22 is formed in the conductive layer 30 for electrical connection between the vibrating body 12 and the pair of sealing bodies 13 and 14, the external electrodes 25a and 25b The ventilation path 22 can be sealed simultaneously with the forming step. As a result, hermetic sealing can be performed more reliably, and electrical characteristics with the pair of excitation electrodes formed on the crystal vibrating piece 15 can be maintained well.

  Further, by providing the air passage 22 in a part of the conductive layer 30, the vibrator 12 and the pair of sealing bodies 13 and 14 can be easily and under a reduced pressure environment without adding processing such as drilling. Airtight sealing can be performed reliably. Thus, when the crystal vibrating piece 15 is hermetically sealed, no cracks or cracks are generated in the vibrating body 12 and the pair of sealing bodies 13 and 14, so that a thin crystal having predetermined vibration characteristics is provided. The vibrator can be mass-produced stably.

  FIG. 16 shows examples of forming the vibrating bodies 61 and 71 having the support frames 62 and 72 having various shapes. The vibrating bodies 61, 71 have outer peripheral parts 63, 73 whose support frames 62, 72 are rectangular, and inner peripheral parts 64, 74 surrounding the crystal vibrating piece 15, respectively. By forming a curved surface, the spaces 65 and 75 that enclose the quartz crystal vibrating piece 15 are regulated. FIG. 16A is a gourd shape in which the space on the upper end side and the lower end side of the crystal vibrating piece 15 is provided with a margin, while the space 65 on the center side of the crystal vibrating piece 15 is reduced. b) is formed in an oval shape having a sufficient space with respect to the center portion of the quartz crystal vibrating piece 15 and narrowing the gap toward the upper end side and the lower end side of the quartz crystal vibrating piece 15. A similar corresponding curved surface shape is also formed on the sealing frame of the pair of sealing bodies that sandwich the vibrating bodies 61 and 71.

  In the embodiment shown in FIGS. 16A and 16B, the spaces 65 and 75 surrounding the crystal vibrating piece 15 by the inner peripheral portions 64 and 74 of the support frames 62 and 72 are shown in FIGS. It can be made narrower than the vibrating body 12 shown. In particular, since the areas of the four corners of the support frames 62 and 72 can be secured widely, it is possible to effectively prevent deformation and destruction due to external impact received by the crystal resonator, and a stable vibration mode can be obtained. Can be maintained. Further, since the contact surface between the pair of sealing frames that overlap with the support frame is widened, the bonding strength is increased and the hermetic sealing can be more reliably performed.

DESCRIPTION OF SYMBOLS 11 Crystal oscillator 12 Vibrating body 13,14 Sealing body 13a, 14a Side surface 15 Crystal vibrating piece 16 Support frame 16a, 16b Side surface 17 Connection part 18 Base part 19 Vibrating arm part 21 Contact surface 22 Ventilation path 23 Recessed part 25a, 25b External Electrode 26 Sealing member 30 Conductive layer 30a Side surface 30b Upper surface 30c Lower surface 31a, 31b Excitation electrode 32a, 33a First internal electrode 32b, 33b Second internal electrode 34 Insulating part 42 Collective vibration substrate 43, 44 Collective sealing substrate 45 Through hole 46 Dicing line 51 Quartz crystal oscillator 61, 71 Vibrating body 62, 72 Support frame 63, 73 Outer peripheral part 64, 74 Inner peripheral part 65, 75 Space

Claims (9)

A vibrating body comprising a quartz crystal vibrating piece and a support frame that supports at least one end of the quartz crystal vibrating piece;
A pair of sealing bodies each having a contact surface joined to the upper and lower surfaces of the support frame and a concave portion on the inner side, and the pair of sealing members formed on the upper and lower surfaces of the support frame via conductive layers formed respectively. A crystal resonator in which an abutting surface of a sealing body is bonded and an external electrode is formed so as to cover a side surface of the conductive layer exposed to the side surfaces of the bonded vibrating body and a pair of sealing bodies. And
The contact surfaces of the pair of sealing bodies are joined so that one end of the upper surface and the lower surface is exposed from the side surface of the conductive layer, and the one end of the upper surface and the lower surface is covered from the side surface of the conductive layer. A crystal resonator in which an electrode is formed.   2. The crystal resonator according to claim 1, wherein the contact surfaces of the pair of sealing bodies are bonded in contact with the inner side of the conductive layer formed on the upper and lower surfaces of the support frame.   The conductive layer is formed by a pair of excitation electrodes provided on the quartz crystal vibrating piece and a pair of internal electrodes that electrically connect the pair of external electrodes corresponding to the pair of excitation electrodes, respectively. 2. The crystal resonator according to claim 1, wherein the internal electrode is formed on an upper surface and a lower surface of the support frame of the vibrating body and a contact surface of the pair of sealing bodies facing the upper and lower surfaces via an insulating portion.   One of the pair of internal electrodes formed by the upper and lower surfaces of the support frame and the contact surfaces of the pair of sealing bodies facing the upper and lower surfaces is electrically connected to the excitation electrode corresponding to the quartz crystal vibrating piece. 4. The crystal resonator according to claim 3, wherein the crystal resonator is connected to each other.   The conductive layer is provided with at least one air passage that communicates the concave portion of the sealing body with the outside, and one end portion of the air passage on one side surface of the vibrating body and the sealing body is formed by the external electrode. The crystal resonator according to claim 1, which is closed.   The conductive layer is provided on the entire circumferential surface of the support frame and on the entire circumferential surface of at least one of the contact surfaces of the pair of sealing bodies respectively bonded to both surfaces of the support frame. The crystal unit according to claim 5, wherein the air passage is formed by a slit formed in the conductive layer. Forming a plurality of vibrators comprising a quartz crystal vibrating piece and a support frame supporting at least one end of the quartz crystal vibrating piece on the collective vibrating substrate;
Forming a plurality of sealing bodies each having a contact surface to be bonded to the upper and lower surfaces of the support frame and a concave portion on the inside thereof on a pair of collective sealing substrates;
Providing a through hole along a pair of opposing side surfaces of each vibrating body formed on the collective vibration substrate and a pair of opposing side surfaces of each sealing body formed on the pair of collective sealing substrates;
The pair of collective sealing substrates are aligned with the upper and lower surfaces of the collective vibration substrate, and a support frame of each vibrator formed on the collective vibration substrate and each sealing body formed on the pair of collective sealing substrates A step of joining the contact surface of the two through a conductive layer;
Along the inner wall surface of the through hole, a pair of opposing side surfaces of each vibrating body formed on the collective vibration substrate and a pair of opposing side surfaces of each sealing body formed on the pair of collective sealing substrates Forming an external electrode;
Dicing the joined collective vibration substrate and collective sealing substrate in a predetermined direction and dividing them into individual crystal resonators;
A method for manufacturing a crystal resonator, comprising:   A support frame of each vibrating body formed on the collective vibration substrate and a contact surface of each sealing body formed on the pair of collective sealing substrates so that one end of the upper surface and the lower surface of the conductive layer is exposed. The method for manufacturing a crystal resonator according to claim 7, wherein the crystal resonator is bonded as described above. The step of joining the support frame of each vibrating body formed on the collective vibration substrate and the contact surface of each sealing body formed on the pair of collective sealing substrates with a conductive layer having an air passage in at least one place When,
Along the inner wall surface of the through hole, a pair of opposing side surfaces of each vibrating body formed on the collective vibration substrate and a pair of opposing side surfaces of each sealing body formed on the pair of collective sealing substrates The method for manufacturing a crystal resonator according to claim 7, further comprising: forming an external electrode, and closing one end portion of the air passage provided in the conductive layer with at least one external electrode of the pair of external electrodes.

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