JP2017017291A - Hoop load port device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hoop load port device capable of properly measuring the wafer surrounding environment and protecting a wafer surface in a hoop, which is a wafer transfer container, from oxidation or contamination.SOLUTION: Disclosed is a hoop load port device for a hoop, in which an opening for taking in and out a wafer is formed on a side surface. This device includes: a mount table having a first bottom nozzle communicable with a first bottom hole formed on the bottom surface of the hoop on one side: and a piping part communicated with the first bottom nozzle on the other side of the first bottom nozzle. In the piping part, a sensor part is provided which detects at least one of a component of gas flowing out from the inside of the hoop and cleanness of the gas.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a hoop load port device for a hoop in which an opening through which a wafer is taken in and out is formed.

  For example, in the semiconductor manufacturing process, wafers are transferred between the processing apparatuses using a transfer container called a SMIF or a FOUP. Furthermore, the transfer container is installed in a load port device provided in each processing apparatus, and the load port apparatus communicates the space in the transfer container and the space in the processing chamber. As a result, the wafer can be taken out from the transfer container by the robot arm or the like and transferred to the processing apparatus.

  Here, in order to protect the wafer surface from oxidation and contamination, the environment inside the transfer container in which the wafer is stored is preferably maintained in an inactive state and cleanliness exceeding a predetermined state. As a method for improving the inert state and cleanliness of the gas in the transport container, techniques such as gas purging for introducing a cleaning gas into the interior of the transport container or a space communicating with the transport container have been proposed. On the other hand, as a technique for detecting gas components in the transfer container and preventing contamination of the wafer surface, etc., there is a technique in which a pipe is connected to the side of the transfer container and a moisture concentration meter or an oxygen concentration meter is arranged in the pipe. It has been proposed (see Patent Document 1).

JP 2000-353738 A

  The conventional technique of detecting a gas component in the transport container by connecting a pipe to the side surface of the transport container is advantageous in terms of cleanliness because no detector is disposed in the transport container. However, the conventional technology detects the gas components in the transport container installed at the load port because the pipe is connected to the side of the smiff that moves the entire wafer from the transport container to the transfer unit. Even in such a case, the environment around the wafer may not be measured when the entire wafer is unloaded from the transfer container to the transfer unit.

  The present invention has been made in view of such a situation, and relates to a hoop load port device that can appropriately measure the environment around the wafer and can protect the wafer surface in the hoop as a wafer transfer container from oxidation and contamination.

In order to achieve the above object, a load port device according to the present invention comprises:
A hoop load port device for a hoop in which an opening through which a wafer is taken in and out is formed,
A mounting table having a first bottom nozzle capable of communicating on one side with respect to a first bottom hole formed on the bottom surface of the hoop;
A piping section communicating with the first bottom nozzle on the other side of the first bottom nozzle;
The pipe part is provided with a sensor part for detecting at least one of the component of the gas flowing out from the inside of the hoop and the cleanliness of the gas.

  In the hoop load port device according to the present invention, a sensor unit is provided in a pipe unit that can communicate with a first bottom nozzle of a mounting table connected to the hoop from the bottom surface with respect to a hoop capable of loading and unloading wafers one by one from the side surface. It has been. Therefore, the gas component flowing out from the inside of the hoop is detected by the sensor unit, so that the gas component and cleanliness around the wafer stored in the hoop can be appropriately measured. That is, in the hoop load port device according to the present invention, even if several wafers are unloaded during processing, the remaining wafers are placed on the bottom surface of the hoop in which the bottom holes are formed. Since the periphery is also covered with the side surface of the hoop except for the extraction opening, the gas component around the wafer accommodated in the hoop can be appropriately measured. Further, in the hoop load port device according to the present invention, since the piping portion communicates with the inside of the hoop through the first bottom nozzle on the mounting table, detection by the sensor unit immediately after the hoop is mounted on the mounting table. In addition, detection by the sensor unit is possible until immediately before the hoop is removed from the mounting table.

Further, for example, the mounting table may include a second bottom nozzle capable of communicating on one side with respect to a second bottom hole formed on the bottom surface of the hoop.
The piping part may be communicated with the second bottom nozzle on the side opposite to the first bottom nozzle with the sensor part interposed therebetween and on the other side of the second bottom nozzle. Good.

  In such a hoop load port device, since the piping part can communicate with the second bottom nozzle, the gas flowing out of the hoop and passing through the sensor part can be returned to the hoop again. Thereby, it is possible to continuously measure the environment around the wafer while preventing the outside air from flowing into the hoop.

Further, for example, the mounting table may include a second bottom nozzle capable of communicating on one side with respect to a second bottom hole formed on the bottom surface of the hoop.
The hoop load port device may include a gas supply unit that supplies gas to the inside of the hoop via the second bottom nozzle.

  Such a hoop load port device allows the gas in the hoop to flow out through the first bottom nozzle and the piping part, and supplies the gas into the hoop through the second bottom nozzle. Can be purged to clean the environment around the wafer.

Further, for example, the mounting table may include a second bottom nozzle capable of communicating on one side with respect to a second bottom hole formed on the bottom surface of the hoop.
The hoop load port device may include a gas supply unit that supplies gas into the hoop through the second bottom nozzle,
The piping part is connected to the second bottom nozzle and the gas supply part on the opposite side of the first bottom nozzle across the sensor part and on the other side of the second bottom nozzle. It may be possible.

  In such a hoop load port device, the gas detected by the sensor unit can be returned into the hoop via the second bottom nozzle, and separately from this, the gas supply unit allows the second bottom nozzle to The cleaning gas can also be supplied into the hoop. For example, if the sensor unit determines that the environment in the hoop is clean, the gas is returned from the piping unit via the second bottom nozzle, and if the sensor unit determines that the environment in the hoop is not clean, the gas is Purge in the hoop can be performed by supplying gas from the supply unit into the hoop.

  In addition, for example, the hoop load port device according to the present invention includes a control unit that changes a supply amount of the gas that the gas supply unit supplies to the inside of the hoop per unit time according to a detection result of the sensor unit. You may have.

  In such a hoop load port device, the control unit adjusts the gas supply amount to quickly increase the cleanliness in the hoop, or suppress the gas consumption when it is sufficiently clean. Can do.

  Further, for example, a discharge pump that allows the gas to flow out from the inside of the hoop to the pipe portion may be provided in the pipe portion.

  In such a hoop load port device, the gas in the hoop is surely drawn into the pipe, and the sensor unit can detect the gas component in the hoop more appropriately.

FIG. 1 is a schematic view of a hoop load port device according to an embodiment of the present invention. FIG. 2 is a perspective view of the main part showing the vicinity of the mounting table of the hoop load port device shown in FIG. FIG. 3 is a schematic sectional view showing a state in which the hoop load port device shown in FIG. 4A is a schematic cross-sectional view showing a nozzle driving mechanism for moving the bottom nozzle, and FIG. 4B is a schematic cross-sectional view showing the movement of the bottom nozzle. FIG. 5 is a schematic cross-sectional view showing the periphery of the piping portion of the hoop load port device shown in FIG. FIG. 6 is a schematic cross-sectional view showing the periphery of the piping portion of the hoop load port device according to the second embodiment. FIG. 7 is a schematic cross-sectional view showing the periphery of the piping portion of the hoop load port device according to the third embodiment. FIG. 8 is a schematic cross-sectional view showing the periphery of the piping portion of the hoop load port device according to the fourth embodiment. FIG. 9 is a schematic cross-sectional view showing the periphery of the piping portion of the hoop load port device according to the fifth embodiment.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
As shown in FIG. 1, a hoop load port apparatus 10 according to an embodiment of the present invention is connected to an EFEM 80 that connects the semiconductor processing apparatus and the hoop load port apparatus 10. The hoop load port device 10 includes a fixed base 12 and a mounting base 14 that can move in the Y-axis direction with respect to the fixed base 12. In the drawing, the Y axis indicates the moving direction of the mounting table 14, the Z axis indicates the vertical direction in the vertical direction, and the X axis indicates the direction perpendicular to the Y axis and the Z axis.

  A FOUP 2 for hermetically storing and transporting a plurality of wafers 1 as an accommodation can be detachably mounted on an upper portion of the mounting table 14 in the Z-axis direction. A space for accommodating the wafer 1 is formed inside the hoop 2. The hoop 2 has a box-like shape having a plurality of side surfaces positioned in the horizontal direction with respect to the inside of the hoop 2, and an upper surface and a bottom surface 2f positioned in the vertical direction. On the first side surface 2d, which is one of a plurality of side surfaces of the hoop 2, a carry-out port 2b is formed as an opening through which the wafer 1 accommodated in the hoop 2 is taken in and out.

  The hoop 2 includes a lid 4 for sealing the carry-out port 2b. A shelf (not shown) for stacking a plurality of horizontally held wafers 1 in the vertical direction is arranged inside the hoop 2, and the wafers 1 placed here are set at a constant interval. Housed in the hoop 2. Further, a first bottom hole 5-1, a second bottom hole 5-2, and a positioning portion 3 are formed on the bottom surface 2 f of the hoop 2.

  The hoop load port device 10 is a device for a hoop (Front Opening Unified Pod) 2 as shown in FIG. 1, but has a structure in which an opening for taking in and out a wafer is formed on the side surface like the hoop 2. Applicable to containers. The hoop load port device 10 automatically opens and closes the carry-out port 2b formed on the side surface of the hoop 2, and the wafer 1 accommodated in the hoop 2 in a sealed state is maintained in a clean state while the e-fem 80 Is an interface device for transfer to the inside of the semiconductor processing apparatus via The hoop load port device 10 includes a door 18 that opens and closes the delivery port 13 of the wall member 11. The wall member 11 functions as a part of a casing that seals the inside of the eFem 80 in a clean state, or as a part of a casing that seals the inside of a semiconductor processing apparatus connected via the eFem 80 in a clean state. ing.

  The unloading of the wafer 1 from the FOUP 2 is performed with the FOUP 2 installed on the mounting table 14. The mounting table 14 on which the hoop 2 is installed moves in the Y-axis direction, the lid 4 of the hoop 2 enters the delivery port 13 of the wall member 11, and the door 18 engages with the lid 4. Thereafter, as shown in FIG. 3, the door 18 is moved in parallel with the lid 4 in the Y-axis direction or is pivotally moved to remove the lid 4 from the hoop 2 and open the carry-out port 2b. In this way, the hoop load port device 10 communicates the inside of the hoop 2 and the inside of the eFem 80 to carry out the wafer 1 in the hoop 2 using a robot arm or the like provided in the eFem 80. Is possible.

  As shown in FIG. 2, one or more (preferably three) positioning pins 16 are embedded in the upper surface 14 a of the mounting table 14. The positioning pin 16 fits into a concave portion of the positioning portion 3 provided on the bottom surface 2 f of the hoop 2. Thereby, the X-axis-Y-axis positional relationship between the hoop 2 and the mounting table 14 is uniquely determined.

  Further, on the upper surface 14 a of the mounting table 14, a position detection sensor 19 is installed near each positioning pin 16. The position detection sensor 19 detects whether or not the hoop 2 is positioned and arranged at a predetermined position on the upper surface 14a of the mounting table 14 in the XY axis direction. The position detection sensor 19 is not particularly limited, and may be a contact type position detection sensor or a non-contact type position detection sensor.

  Further, heads of the first to fourth bottom nozzles 20-1 to 20-4 are exposed on the upper surface 14 a of the mounting table 14. The mounting table 14 has a total of four bottom nozzles including a first bottom nozzle 20-1, a second bottom nozzle 20-2, a third bottom nozzle 20-3, and a fourth bottom nozzle 20-4. Yes. The first bottom nozzle 20-1 can communicate with the first bottom hole 5-1 of the hoop 2 shown in FIG. 1 on the upper side (one side), and the second bottom nozzle 20-2 The second bottom hole 5-2 shown in FIG. 1 can communicate with the upper side (one side). The hoop 2 shown in FIG. 1 has third and fourth bottom holes (not shown), and the third and fourth bottom nozzles 20-3 and 20-4 of the mounting table are respectively connected to the hoop 2. The third and fourth bottom holes can communicate with each other.

  In the drawing, for easy understanding, the first bottom hole 5-1, the second bottom hole 5-2, the first bottom nozzle 20-1, the second bottom nozzle 20-2, Although the positioning pins 16 and the like are shown relatively large, they are different from the actual dimensional ratio.

  4A and 4B are enlarged cross-sectional views showing the detailed structure of the first bottom nozzle 20-1. Since the detailed structure of the second to fourth bottom nozzles 20-2 to 20-4 is substantially the same as that of the first bottom nozzle 20-1, the detailed structure of the first bottom nozzle 20-1 is also the same. Only the description will be given, and the detailed structure of the other bottom nozzles 20-2 to 20-4 will be omitted.

  The first bottom nozzle 20-1 includes a nozzle body 21, a flow path 22, a lower member 24, a partition plate 25, and the like. The nozzle body 21 has a cylindrical shape extending in the vertical direction, and the nozzle port 21 a which is a through hole formed in the nozzle body 21 is formed in the flow path 22 formed by the lower member 24 and the partition plate 25. Communicate. The first bottom nozzle 20-1 has a first nozzle drive mechanism 26-1 that drives the nozzle body 21.

  The first nozzle drive mechanism 26-1 includes a cylinder 27, an inflow valve 29a, a discharge valve 29b, and the like, and moves the nozzle body 21 of the first bottom nozzle 20-1 up and down (Z-axis direction). A piston chamber 28 is formed between the nozzle body 21 and the cylinder 27. By introducing or deriving a pressure fluid such as oil into the piston chamber 28 through the piston channel 27 a, the first nozzle drive mechanism 26-1 moves the nozzle body 21 relative to the cylinder 27 in the Z-axis direction. Can be moved up and down. Introduction and derivation of the pressure fluid to and from the piston chamber 28 are controlled by opening and closing an inflow valve 29a and an exhaust valve 29b connected to the piston flow path 27a.

  The first nozzle drive mechanism 26-1 has a lowered position in which the nozzle body 21 of the first bottom nozzle 20-1 is separated from the opening 5-1a of the first bottom hole 5-1, as shown in FIG. 4A. As shown in FIG. 4B, the first bottom hole 5-1 can be moved between the raised position where it is in airtight contact with the opening 5-1a. As shown in FIG. 4A, when the nozzle body 21 of the first bottom nozzle 20-1 is positioned at the lowered position, the head (upper part) in the Z-axis direction of the first bottom nozzle 20-1 is shown in FIG. As shown in FIG. 2, it is flush with or retracts from the upper surface 14a of the mounting table 14.

  As shown in FIG. 4B, when the nozzle body 21 of the first bottom nozzle 20-1 is positioned at the raised position, the head of the nozzle body 21 is moved from the upper surface 14a of the mounting table 14 shown in FIG. It protrudes to the upper part in the axial direction and comes into close contact with the lower surface of the first bottom hole 5-1 formed in the bottom surface 2f of the hoop 2 shown in FIG. Since a seal member 21b such as an O-ring is mounted on the head of the nozzle body 21, the nozzle port 21a of the first bottom nozzle 20-1 and the opening 5 of the first bottom hole 5-1. -1a communicates in an airtight manner.

  A protrusion is formed at the lower end of the nozzle body 21 in the Z-axis direction. As shown in FIG. 4B, even when the nozzle body 21 is in the raised position, the space 22a of the flow path 22 and the nozzle body The state where the 21 nozzle ports 21a communicate with each other is maintained. A pipe portion 40 (see FIG. 5) to be described later is connected to the space 22a of the flow path 22.

  In the state shown in FIG. 4B, the opening 5-1a of the first bottom hole 5-1 communicates with the nozzle port 21a of the first bottom nozzle 20-1, and the nozzle port 21a is connected to the flow path 22. It communicates with the space 22a. As a result, the gas inside the hoop 2 flows into the piping section 40 shown in FIG. 5 via the first bottom hole 5-1 and the first bottom nozzle 20-1. Further, the second bottom nozzle 20-2 is also connected to the second bottom hole 5-2 of the hoop 2 in the same manner as the first bottom nozzle 20-1 is connected to the first bottom hole 5-1. Connecting. As a result, the gas flowing out from the hoop 2 to the pipe part 40 passes through the sensor part 50 provided in the pipe part 40, and then passes through the second bottom nozzle 20-2 and the second bottom hole 5-2. , It is returned to the inside of the hoop 2 again.

  FIG. 5 is a schematic cross-sectional view showing the periphery of the piping section 40 of the hoop load port device 10. As illustrated in FIG. 5, the hoop load port device 10 includes a piping unit 40 that communicates with the first bottom nozzle 20-1 on the lower side (the other side) of the first bottom nozzle 20-1. In FIG. 5, the detailed structure as shown in FIGS. 4A and 4B is not shown.

  The piping unit 40 is provided with a sensor unit 50 that detects at least one of the component of the gas flowing out from the inside of the hoop 2 and the cleanliness of the gas (some particles contained in the gas). The sensor unit 50 preferably detects a gas component that can affect the contamination of the wafer 1 accommodated in the hoop 2 or some of particles in the gas. For example, an oxygen concentration meter, a moisture (water vapor) concentration meter is preferable. , Nitrogen concentration meter, particle counter and the like, but are not particularly limited.

  Furthermore, the piping unit 40 is on the opposite side of the second bottom nozzle 20-2 from the first bottom nozzle 20-1 with the sensor unit 50 interposed therebetween, and Communication is possible on the lower side (the other side). Therefore, the piping unit 40 includes a first piping unit 41 that connects the first bottom nozzle 20-1 and the sensor unit 50, and a second piping unit 42 that connects the second bottom nozzle 20-2 and the sensor unit 50. It is constituted by.

  The sensor unit 50 is connected to a discharge channel 51 that is a channel for discharging the gas flowing out from the inside of the hoop 2 to the outside. The sensor unit 50 is a switching valve capable of switching between a state in which the gas flowing out from the inside of the hoop 2 through the first piping unit 41 flows into the second piping unit 42 and a state in which the gas flows into the discharge channel 51 and its control means. have.

  For example, when the sensor unit 50 is an oxygen concentration meter, the sensor unit 50 may connect the first piping unit 41 and the second piping unit 42 when the oxygen concentration of the gas flowing out of the hoop 2 is smaller than a predetermined value. The gas that has been connected and has flowed out of the inside of the hoop 2 can be returned to the inside of the hoop 2 again via the second piping part 42. On the other hand, when the oxygen concentration of the gas flowing out from the inside of the hoop 2 is equal to or higher than a predetermined value, the sensor unit 50 connects the first piping unit 41 and the discharge flow channel 51 to the inside of the hoop 2. The gas that has flowed out of the air can be discharged outside without returning it to the inside of the hoop 2.

  A gas supply channel (not shown) for supplying a cleaning gas is connected to the third bottom nozzle 20-3 and the fourth bottom nozzle 20-4 (see FIG. 2) of the hoop load port device 10. . The hoop load port device 10 can introduce the cleaning gas into the hoop 2 through the third bottom nozzle 20-3 and the fourth bottom nozzle 20-4. When the gas flowing out from the inside of the hoop 2 is discharged from the discharge flow channel 51 to the outside, the third and fourth bottom nozzles 20-3 and 20-4 shown in FIG. And it is preferable that cleaning gas is supplied to the inside of the hoop 2 through the 4th bottom hole or the delivery port 13 and the carrying-out port 2b connected to this. Thereby, the hoop load port apparatus 10 can purge the gas inside the hoop 2 until the concentration and cleanliness of the gas component in the hoop 2 become a predetermined value or more.

  In the sensor unit 50 installed in the piping unit 40a shown in FIG. 5, the first and second bottom nozzles 20-1 and 20-2 are connected to the first and second bottom holes 5-1 and 5-2. During this time, it is possible to detect a gas component or the like inside the hoop 2. That is, the sensor unit 50 can detect a gas component or the like inside the hoop 2 immediately after the hoop 2 is placed on the mounting table 14, and the processing apparatus provided with the hoop load port device 10 is a wafer. 1 until the hoop 2 is removed from the mounting table 14 until the processing for 1 is finished. Further, the gas component in the hoop 2 can be continuously detected while the processing apparatus provided with the hoop load port device 10 is processing the wafer 1.

  As can be understood from the comparison between FIG. 3 and FIG. 5, the hoop load port device 10 includes the first bottom nozzle 20-1 and the second bottom nozzle 20-2 in the first bottom hole 5-1 in the hoop 2. And the mounting table 14 can be moved in the state connected to the 2nd bottom hole 5-2. That is, while the mounting table 14 moves in the Y-axis direction, the piping unit 40 communicates with the inside of the hoop 2 via the first and second bottom nozzles 20-1 and 20-2. The sensor unit 50 provided in the pipe unit 40 can detect a gas component or the like inside the hoop 2. In addition, the piping part 40 shown in FIG. 5 may have a flexible part so that it can deform | transform with the movement of the mounting base 14 and the bottom nozzles 20-1 and 20-2.

  As described above, in the hoop load port device 10 according to the present embodiment, the piping part 40 provided with the sensor part 50 is a gas component in the hoop 2 by the gas flowing out from the first bottom hole 5-1 of the hoop 2. For example, the gas component around the wafer 1 stored in the hoop 2 can be appropriately measured. Further, as shown in FIG. 3, the hoop load port apparatus 10 has the wafer 1 left in the hoop 2 even while the wafer 1 is being taken out from the carry-out port 2 b of the hoop 2 and processing is being performed. It is possible to appropriately measure the components of the gas around the gas.

  Further, the hoop load port device 10 can be communicated with the second bottom hole 5-2 of the hoop 2 via the second bottom nozzle 20-2 so that the pipe portion 40 flows out from the inside of the hoop 2. The returned gas is returned to the inside of the hoop 2 again through the second piping portion 42, so that the components of the gas inside the hoop 2 can be continuously supplied without supplying the cleaning gas to the inside of the hoop 2. Can be measured. Further, when the sensor unit 50 detects a decrease in the inertness or cleanliness inside the hoop 2, the hoop load port device 10 does not return the gas flowing out from the inside of the hoop 2 to the inside of the hoop 2. It can be discharged to the outside and the cleanliness inside the hoop 2 can be improved.

  FIG. 6 is a schematic cross-sectional view showing the periphery of the piping part 40a in the hoop load port device 10a according to the second embodiment. The hoop load port apparatus 10a is similar to the hoop load port apparatus 10 shown in FIGS. 1 to 5 except that the structure around the pipe portion 40a is different. Therefore, only the difference between the hoop load port device 10a and the hoop load port device 10 will be described, and the description of the common points will be omitted.

  As shown in FIG. 6, the piping unit 40 a includes a first piping unit 41 that connects the first bottom nozzle 20-1 and the sensor unit 50 a, and a second unit that connects the second bottom nozzle 20-2 and the sensor unit 50 a. It is comprised by 2 piping parts 42a. A discharge pump 53 that allows gas to flow out from the inside of the hoop 2 to the pipe part 40a is provided in the second pipe part 42a. The discharge pump 53 is not particularly limited as long as it generates a gas flow from the first bottom nozzle 20-1 to the second bottom nozzle 20-2. For example, a gear pump or the like can be used.

  In the hoop load port device 10a according to the second embodiment, not only the sensor unit 50a but also the discharge pump 53 is connected to the piping unit 40a that connects the first bottom nozzle 20-1 and the second bottom nozzle 20-2. Is provided. Thereby, the hoop load port apparatus 10a circulates the gas in the hoop 2 through the piping part 40a, so that the sensor part 50a can quickly detect the change in the gas component and the cleanliness level filled in the hoop 2. Is possible.

  The discharge part 51 is not connected to the sensor part 50a of the hoop load port apparatus 10a shown in FIG. 6, and the sensor part 50a also has a switching valve like the sensor part 50 shown in FIG. Absent. Therefore, the hoop load port device 10a cannot discharge the gas in the hoop 2 from the first bottom nozzle 20-1. Instead, in the hoop load port device 10a, one of the third and fourth bottom nozzles 20-3 and 20-4 is connected to the gas supply passage, and the other is connected to the discharge passage. Therefore, the hoop load port device 10a can also purge the gas in the hoop 2 by using the third and fourth bottom nozzles 20-3 and 20-4 and improve the cleanliness of the gas in the hoop 2. it can.

  FIG. 7 is a schematic cross-sectional view showing the periphery of the piping part 40b in the hoop load port device 10b according to the third embodiment. The hoop load port device 10b is the same as the hoop load port device 10 shown in FIGS. 1 to 5 except that the structure around the pipe portion 40b is different. Therefore, the hoop load port device 10b is the same as the hoop load port device 10b. Only differences will be described, and description of common points will be omitted.

  As shown in FIG. 7, the piping part 40b is comprised by the 1st piping part 41 which connects the 1st bottom nozzle 20-1 and the sensor part 50a. The 1st piping part 41 and the discharge flow path 51 are connected to the sensor part 50a. When the first bottom nozzle 20-1 communicates with the first bottom hole 5-1 of the hoop 2, the gas in the hoop 2 flows out to the first piping part 41 and further passes through the sensor part 50 a and passes through the discharge channel. 51 is discharged to the outside of the hoop load port device 10b.

  The hoop load port apparatus 10b includes a gas supply unit 60 that supplies a cleaning gas to the inside of the hoop 2 through the second bottom nozzle 20-2 and the second bottom hole 5-2. The gas supply unit 60 includes a gas supply channel 61 that connects a gas tank (not shown) and the second bottom nozzle 20-2. The gas supply channel 61 is provided with a first flow rate controller 62. ing. The first flow rate controller 62 can change the amount of gas supplied from the gas supply unit 60 to the inside of the hoop 2 per unit time according to the detection result of the sensor unit 50a.

  For example, when the sensor unit 50a detects that the gas in the FOUP 2 contains particles of a predetermined value or more, the first flow rate controller 62 performs the cleaning supplied from the gas supply unit 60 to the FOUP 2. The gas flow rate can be increased. Conversely, the first flow rate controller 62 is supplied from the gas supply unit 60 to the FOUP 2 when the sensor unit 50a detects that the particles contained in the gas in the FOUP 2 are less than a predetermined value. The flow rate of the cleaning gas to be reduced can be reduced, or the supply of the cleaning gas from the gas supply unit 60 to the FOUP 2 can be stopped. The first flow rate controller 62 is configured by, for example, an electromagnetic valve that can control and adjust the opening amount, but is not particularly limited as long as it is a valve that can control the flow rate.

  Although not shown in FIG. 7, in the hoop load port apparatus 10b, the gas supply flow path 61 of the gas supply unit 60 is connected to the third and fourth bottom nozzles 20-3 and 20-4 (see FIG. 2). Is also connected. Therefore, the gas supply unit 60 introduces clean gas into the inside of the FOUP 2 from a total of three locations including the second to fourth bottom nozzles 20-2 to 20-4 and the second to fourth bottom holes 5-2. can do.

  The cleaning gas introduced from the gas supply unit 60 into the FOUP 2 is not particularly limited, and nitrogen gas or other inert gas can be used. The pressure in the gas tank and the gas supply flow path 61 is set higher than the pressure in the FOUP 2, and the inside of the FOUP 2 and the gas supply flow path through the second to fourth bottom nozzles 20-2 to 20-4 and the like. When 61 is communicated, the cleaning gas is introduced into the inside of the hoop 2. Further, with the introduction of the cleaning gas into the FOUP 2, the gas inside the FOUP 2 flows out to the piping part 40b via the first bottom nozzle 20-1 and the like. By generating such a gas flow, the hoop load port device 10b continuously performs the detection of the cleanliness of the gas in the hoop 2 and the purge operation at an appropriate flow rate based on the detection result. Can do. In particular, in the hoop load port device 10b, when the first flow rate controller 62 adjusts the supply amount of the cleaning gas, the cleanness in the hoop 2 is quickly increased. When is sufficiently clean, consumption of the cleaning gas can be suppressed.

  FIG. 8 is a schematic cross-sectional view showing the periphery of the piping part 40c in the hoop load port device 10c according to the fourth embodiment. The hoop load port device 10c is the same as the hoop load port device 10b shown in FIG. 7 except that the second flow rate controller 54 and the discharge pump 53 are provided in the piping part 40c. In the description, only differences from the hoop load port device 10b will be described.

  As shown in FIG. 8, the piping unit 40 c includes a first piping unit 41 that connects the first bottom nozzle 20-1 and the sensor unit 50 a, the sensor unit 50 a and the second flow rate controller 54, and a second flow rate control. It is constituted by a relay pipe 43 that connects the vessel 54 and the discharge pump 53. The second flow rate controller 54 can change the outflow amount of the gas flowing out from the hoop 2 per unit time according to the detection result by the sensor unit 50a.

  For example, the second flow rate controller 54 can increase the flow rate of the gas flowing out of the FOUP 2 when the sensor unit 50a detects that the moisture concentration of the gas in the FOUP 2 is equal to or higher than a predetermined value. On the other hand, the second flow rate controller 54 reduces the flow rate of the gas flowing out of the FOUP 2 when the sensor unit 50a detects that the moisture concentration of the gas in the FOUP 2 is less than a predetermined value. be able to. The second flow rate controller 54 is configured by a solenoid valve or the like, similar to the first flow rate controller 62, but is not particularly limited.

  The hoop load port device 10c is configured so that the second flow rate controller 54 controls the flow rate of the gas flowing out of the hoop 2 in a state where the carry-out port 2b of the hoop 2 is closed. The flow rate of the cleaning gas introduced into the inside can also be controlled. Thereby, the hoop load port device 10c can continuously perform the detection of the cleanliness of the gas in the hoop 2 and the purge operation at an appropriate flow rate based on the detection result. However, the hoop load port device 10c is introduced into the hoop 2 by using both the first flow rate controller 62 provided in the gas supply channel 61 and the second flow rate controller 54 provided in the piping part 40c. It is also possible to individually control the flow rate of the cleaning gas and the flow rate of the gas flowing out of the hoop 2.

  FIG. 9 is a schematic cross-sectional view showing the periphery of the piping part 40d in the hoop load port device 10d according to the fifth embodiment. The hoop load port apparatus 10d is different from the hoop load port apparatus 10a according to the second embodiment in that the piping part 40d is connected to both the second bottom nozzle 20-2 and the gas supply part 60b. Since the portion is the same as that of the hoop load port device 10a, only the difference from the hoop load port device 10a will be described.

  As shown in FIG. 9, the piping part 40d includes a first piping part 41 that connects the first bottom nozzle 20-1 and the sensor part 50a, the sensor part 50a, the common flow path 70, and the gas supply flow path 61a. And a common flow path 70 connecting the fourth piping section 44, the gas supply flow path 61a, and the second bottom nozzle 20-2. The common flow path 70 is also a part of the gas supply section 60b. The gas supply section 60b includes a gas supply flow path 61a, an opening / closing valve 63 provided in the gas supply flow path 61a, and the common flow path 70. . The opening / closing valve 63 is constituted by, for example, an electromagnetic valve, and the opening / closing is controlled according to the detection value by the sensor unit 50a.

  Thus, the piping part 40d in the hoop load port device 10d is different from the second bottom nozzle 20-2 and the gas supply part 60b in that the first bottom nozzle 20-1 is sandwiched between the sensor part 50a and the discharge pump 53. It communicates with the other side.

  For example, when the sensor unit 50a is a nitrogen concentration meter, when the sensor unit 50a detects that the nitrogen concentration of the gas flowing out from the inside of the hoop 2 is equal to or higher than a predetermined value, the open / close valve 63 is closed. To do. When the open / close valve 63 is closed, the cleaning gas is not introduced into the common flow path 70 and the FOUP 2, so the FOUP load port device 10d circulates the gas in the FOUP 2 using the discharge pump 53 and the piping part 40d, Measurement of gas components and the like in the hoop 2 by the sensor unit 50a is continued.

  On the contrary, when the sensor unit 50a detects that the nitrogen concentration of the gas flowing out from the inside of the hoop 2 is less than a predetermined value, the open / close valve 63 is opened. When the opening / closing valve 63 is opened, the cleaning gas is introduced into the FOUP 2 through the common flow path 70. At this time, the gas that has flowed out to the pipe section 40d through the first bottom nozzle 20-1 is also returned to the FOUP 2 together with the cleaning gas through the common flow path 70 and the second bottom nozzle 20-2. It is.

  In the hoop load port device 10d, the second bottom nozzle 20-2 has two functions: a path function for returning the gas that has passed through the sensor unit 50a into the hoop 2, and a path function for introducing the cleaning gas into the hoop 2. Also serves as a function. Therefore, the hoop load port device 10d can introduce the cleaning gas into the hoop 2 from more paths than the hoop load port device 10a shown in FIG. 6, and the cleanliness inside the hoop 2 can be more effectively achieved. Can be improved.

  While the present invention has been described with reference to the embodiments, the present invention is not limited to these embodiments. Further, the configuration included in the hoop load port device shown in one embodiment may be combined with the configuration of the hoop load port device shown in another embodiment, and such a hoop load port device is also implemented in the present invention. Included in one of the forms. For example, a discharge channel 51 as shown in FIG. 8 may be provided in the piping part 40d in the hoop load port device 10d shown in FIG. 9, and the fourth connecting the sensor part and the gas supply part as shown in FIG. The piping part 44 may be provided in the piping part 40b of the hoop load port device 10b shown in FIG.

  The sensor units 50 and 50a may detect a single index such as oxygen, moisture, or particles, or may be capable of detecting a plurality of indices.

DESCRIPTION OF SYMBOLS 1 ... Wafer 2 ... Hoop 2f ... Bottom 5-1 ... 1st bottom hole 5-2 ... 2nd bottom hole 10 ... Load port apparatus 11 ... Wall member 14 ... Mounting base 20-1 ... 1st bottom nozzle 20 -2 ... 2nd bottom nozzle 21 ... Nozzle body 21a ... Nozzle port 21b ... Seal member 26-1 ... 1st nozzle drive mechanism 40 ... Piping part 41 ... 1st piping part 42 ... 2nd piping part 43 ... Relay piping part 44 ... fourth piping unit 50 ... sensor unit 51 ... discharge channel 53 ... discharge pump 54 ... second flow rate controller 60 ... gas supply unit 61 ... gas supply channel 62 ... first flow rate controller 63 ... open / close valve 70 ... Common flow path

Claims (6)

A hoop load port device for a hoop in which an opening through which a wafer is taken in and out is formed,
A mounting table having a first bottom nozzle capable of communicating on one side with respect to a first bottom hole formed on the bottom surface of the hoop;
A piping section communicating with the first bottom nozzle on the other side of the first bottom nozzle;
The hoop load port device, wherein the pipe portion is provided with a sensor portion for detecting at least one of a component of gas flowing out from the inside of the hoop and a cleanliness of the gas. The mounting table has a second bottom nozzle capable of communicating on one side with respect to a second bottom hole formed on the bottom surface of the hoop,
The piping portion is connected to the second bottom nozzle on the side opposite to the first bottom nozzle with the sensor portion interposed therebetween, and can communicate with the other side of the second bottom nozzle. The hoop load port device according to claim 1 characterized by things. The mounting table has a second bottom nozzle capable of communicating on one side with respect to a second bottom hole formed on the bottom surface of the hoop,
The hoop load port device according to claim 1, further comprising a gas supply unit configured to supply gas into the hoop through the second bottom nozzle. The mounting table has a second bottom nozzle capable of communicating on one side with respect to a second bottom hole formed on the bottom surface of the hoop,
A gas supply part for supplying gas into the hoop through the second bottom nozzle;
The piping part is connected to the second bottom nozzle and the gas supply part on the opposite side of the first bottom nozzle across the sensor part and on the other side of the second bottom nozzle. The hoop load port device according to claim 1, which is possible.   5. The control unit according to claim 3, further comprising a control unit configured to change a supply amount of the gas supplied to the inside of the hoop per unit time by the gas supply unit according to a detection result of the sensor unit. A hoop load port device according to claim 1.   The hoop load port according to any one of claims 1 to 5, wherein a discharge pump that allows the gas to flow out from the inside of the hoop to the pipe portion is provided in the pipe portion. apparatus.

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