JP2017014418A - Radical-polymerizable composition - Google Patents
Radical-polymerizable composition Download PDFInfo
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- JP2017014418A JP2017014418A JP2015133534A JP2015133534A JP2017014418A JP 2017014418 A JP2017014418 A JP 2017014418A JP 2015133534 A JP2015133534 A JP 2015133534A JP 2015133534 A JP2015133534 A JP 2015133534A JP 2017014418 A JP2017014418 A JP 2017014418A
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- carbon atoms
- alkyl group
- polymer
- mass
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- 239000000203 mixture Substances 0.000 title claims abstract description 69
- 229920000642 polymer Polymers 0.000 claims abstract description 66
- 150000001875 compounds Chemical class 0.000 claims abstract description 60
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 28
- -1 R 21 Chemical compound 0.000 claims description 124
- 125000004432 carbon atom Chemical group C* 0.000 claims description 121
- 125000000217 alkyl group Chemical group 0.000 claims description 61
- 125000003118 aryl group Chemical group 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 20
- 125000000623 heterocyclic group Chemical group 0.000 claims description 19
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 125000005843 halogen group Chemical group 0.000 claims description 13
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 8
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 125000004429 atom Chemical group 0.000 claims description 3
- 229910052717 sulfur Inorganic materials 0.000 claims description 3
- 125000004434 sulfur atom Chemical group 0.000 claims description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical group [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- 229910052711 selenium Inorganic materials 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 20
- 230000035945 sensitivity Effects 0.000 abstract description 11
- 238000009413 insulation Methods 0.000 abstract description 5
- 239000000047 product Substances 0.000 description 50
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 49
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 24
- 150000003254 radicals Chemical class 0.000 description 22
- 239000002904 solvent Substances 0.000 description 17
- 239000002253 acid Substances 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 239000000178 monomer Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 229920002554 vinyl polymer Polymers 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 230000002378 acidificating effect Effects 0.000 description 7
- 239000003513 alkali Substances 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 150000001299 aldehydes Chemical class 0.000 description 6
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 5
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 5
- 238000006482 condensation reaction Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- OGRAOKJKVGDSFR-UHFFFAOYSA-N 2,3,5-trimethylphenol Chemical compound CC1=CC(C)=C(C)C(O)=C1 OGRAOKJKVGDSFR-UHFFFAOYSA-N 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- 239000003377 acid catalyst Substances 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 150000001721 carbon Chemical group 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N dihydromaleimide Chemical group O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000012429 reaction media Substances 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical group C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000004061 bleaching Methods 0.000 description 3
- 230000005587 bubbling Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003759 ester based solvent Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229940049920 malate Drugs 0.000 description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-L malate(2-) Chemical compound [O-]C(=O)C(O)CC([O-])=O BJEPYKJPYRNKOW-UHFFFAOYSA-L 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 235000019198 oils Nutrition 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N 1-ethenoxybutane Chemical compound CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- LCSAOPVSVLGDLE-UHFFFAOYSA-N 2-[[4-[9-[4-(oxiran-2-ylmethoxy)phenyl]fluoren-9-yl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C1(C2=CC=CC=C2C2=CC=CC=C21)C(C=C1)=CC=C1OCC1CO1 LCSAOPVSVLGDLE-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
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- RFMXKZGZSGFZES-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-sulfanylacetic acid Chemical compound OC(=O)CS.OC(=O)CS.OC(=O)CS.CCC(CO)(CO)CO RFMXKZGZSGFZES-UHFFFAOYSA-N 0.000 description 2
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
- ZTMADXFOCUXMJE-UHFFFAOYSA-N 2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=CC=C1O ZTMADXFOCUXMJE-UHFFFAOYSA-N 0.000 description 2
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 2
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 236TMPh Natural products CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- SYBYTAAJFKOIEJ-UHFFFAOYSA-N 3-Methylbutan-2-one Chemical compound CC(C)C(C)=O SYBYTAAJFKOIEJ-UHFFFAOYSA-N 0.000 description 2
- IAVREABSGIHHMO-UHFFFAOYSA-N 3-hydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1 IAVREABSGIHHMO-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
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Landscapes
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
本発明は、テトラヒドロピラン骨格又はジヒドロマレイミド骨格を含むポリマー、オキシムエステル基を有するラジカル重合開始剤及びエチレン性不飽和結合を有する化合物を含有するラジカル重合性組成物に関する。 The present invention relates to a radical polymerizable composition containing a polymer having a tetrahydropyran skeleton or a dihydromaleimide skeleton, a radical polymerization initiator having an oxime ester group, and a compound having an ethylenically unsaturated bond.
ラジカル重合性組成物は、紫外線、電子線の照射、又は加熱等を行うことによって速やかに重合硬化させることができるので、様々な用途において有用である。 Since the radically polymerizable composition can be rapidly polymerized and cured by performing irradiation with ultraviolet rays, electron beams, heating, or the like, it is useful in various applications.
上記のラジカル重合性組成物は、液晶ディスプレイやタッチパネルセンサーにおいて透明絶縁膜を形成する際に用いられることがある。透明絶縁膜には可視域における高透明性、高絶縁性及び高い耐薬品性が求められているが、これらの特性を同時に満たすことは難しく、透明絶縁膜において問題となっている。 The above radical polymerizable composition may be used when forming a transparent insulating film in a liquid crystal display or a touch panel sensor. The transparent insulating film is required to have high transparency in the visible region, high insulating property, and high chemical resistance, but it is difficult to satisfy these characteristics at the same time, which is a problem in the transparent insulating film.
下記特許文献1には主鎖にテトラヒドロピラン骨格を主鎖に有するポリマーを含有する硬化性組成物が開示され、下記特許文献2には、主鎖にジヒドロマレイミド骨格を有するポリマーを含有するネガ型レジスト組成物が開示され、下記特許文献3には、オキシムエステル基を含有する可視光領域の透過性が高く、高感度の光重合開始剤が開示され、下記特許文献4には、ジヒドロマレイミド骨格を主鎖に有するポリマーを含有する感光性透明絶縁膜形成材料が開示されている。しかしながら高感度で硬化物を形成でき、得られた硬化物が透明性、耐薬品性、及び絶縁性に優れるラジカル重合性組成物は得られていない。 The following Patent Document 1 discloses a curable composition containing a polymer having a tetrahydropyran skeleton in the main chain, and the following Patent Document 2 contains a negative type containing a polymer having a dihydromaleimide skeleton in the main chain. A resist composition is disclosed. Patent Document 3 listed below discloses a highly sensitive photopolymerization initiator containing an oxime ester group and having a high visible light region transmittance. Patent Document 4 listed below discloses a dihydromaleimide skeleton. A photosensitive transparent insulating film forming material containing a polymer having a main chain as a main chain is disclosed. However, a radically polymerizable composition that can form a cured product with high sensitivity and the obtained cured product is excellent in transparency, chemical resistance, and insulation has not been obtained.
よって、本発明が解決しようとする課題は、高感度で硬化物を形成でき、得られた硬化物が透明性、耐薬品性、及び絶縁性に優れるラジカル重合組成物を提供することである。 Therefore, the problem to be solved by the present invention is to provide a radical polymerization composition that can form a cured product with high sensitivity, and the obtained cured product is excellent in transparency, chemical resistance, and insulation.
本発明者は、テトラヒドロピラン骨格又はジヒドロマレイミド骨格を含むポリマー、オキシムエステル基を有するラジカル重合開始剤及びエチレン性不飽和結合を有する化合物を併用することにより、上記課題を解決し得ることを見出し、本発明を完成させた。
即ち、本発明は、下記(Ia)及び(Ib)からなる群から選ばれる骨格
を少なくとも1つ有するポリマー(A)(以下、ポリマー(A)とも記載)と下記一般式(II)で表されるラジカル重合開始剤(B)(以下、ラジカル重合開始剤(B)とも記載)及びポリマー(A)を除くエチレン性不飽和化合物(C)(以下、エチレン性不飽和化合物(C)とも記載)を含有するラジカル重合性組成物を提供するものである。
上記炭素原子数1〜20のアルキル基及び炭素原子数7〜20のアリールアルキル基のアルキレン部分は更に置換基を有する場合があり、
上記炭素原子数1〜20のアルキル基及び炭素原子数7〜20のアリールアルキル基中のメチレン基は−O−、−S−、−NHCO−、−SO2−、−SS−、−SO−、−CO−又はOCO−で置換される場合もあり、
ポリマー(A)中に複数のR1及びR2が存在する場合、それぞれ同一の場合も異なる場合もある。)
R3及びR4で表される炭素原子数1〜20のアルキル基の末端は炭素原子数4〜10のシクロアルキル基である場合もあり、
R3及びR4で表される炭素原子数6〜20のアリール基は、炭素原子数1〜20のアルキル基又はORで置換される場合もあり、
Rは炭素原子数1〜20のアルキル基を表し、
Rで表される炭素原子数1〜20のアルキル基は、ハロゲン原子で置換される場合もあり、
Rで表される炭素原子数1〜20のアルキル基中のメチレン基は、−O−で置換される場合もあり、
R5、R6、R7、R8、R9、R10、R11、R12及びR13(以下、R5〜R13とも記載)は、それぞれ独立に、水素原子、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基、R14、OR15、SR16、NR17R18、COR19、SOR20、SO2R21又はCONR22R23を表し、
R14、R15、R16、R17、R18、R19、R20、R21、R22及びR23は、それぞれ独立に、炭素原子数1〜20のアルキル基、炭素原子数6〜20のアリール基、炭素原子数7〜20のアリールアルキル基又は炭素原子数2〜20の複素環含有基を表し、
R15で表される炭素原子数1〜20のアルキル基は、ハロゲン原子、ニトロ基、シアノ基、水酸基又はカルボキシル基で置換される場合もあり、
R19で表される炭素原子数6〜20のアリール基は、ニトロ基、OR'、炭素原子数1〜20のアルキル基又は炭素原子数2〜20の複素環含有基で置換される場合もあり、
R'は、炭素原子数1〜20のアルキル基を表し、
R'で表される炭素原子数1〜20のアルキル基は、その末端が、炭素原子数3〜10の複素環含有基である場合もあり、
X1は、酸素原子、硫黄原子、セレン原子、CR24R25、CO、NR26又はPR27を表し、
R24、R25、R26及びR27は、それぞれ独立に、炭素原子数1〜20のアルキル基、炭素原子数6〜20のアリール基、炭素原子数7〜20のアリールアルキル基、炭素原子数2〜20の複素環含有基を表し、
R26で表される炭素原子数6〜20のアリール基は、−C(R3)=N−O−C(=O)R4で置換される場合もあり、
X2は、単結合又はCOを表し、
R5とR6、R5とR24、R5とR25、R5とR26、R5とR27、R7とR8、R8とR9、R8とR24、R8とR25、R8とR26、R8とR27、R9とR10、R9とR24、R9とR25、R9とR26、R9とR27、R10とR11、R11とR12、R12とR13、R13とR24、R13とR25、R13とR26及びR13とR27は結合して環を形成する場合もある。)
The present inventor has found that the above problem can be solved by using a polymer having a tetrahydropyran skeleton or a dihydromaleimide skeleton, a radical polymerization initiator having an oxime ester group, and a compound having an ethylenically unsaturated bond, The present invention has been completed.
That is, the present invention is represented by a polymer (A) having at least one skeleton selected from the group consisting of the following (Ia) and (Ib) (hereinafter also referred to as polymer (A)) and the following general formula (II). Radical polymerization initiator (B) (hereinafter also referred to as radical polymerization initiator (B)) and ethylenically unsaturated compound (C) excluding polymer (A) (hereinafter also referred to as ethylenically unsaturated compound (C)) The radically polymerizable composition containing this is provided.
The alkylene part of the alkyl group having 1 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms may further have a substituent,
The methylene group in the alkyl group having 1 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms is —O—, —S—, —NHCO—, —SO 2 —, —SS—, —SO—. , -CO- or OCO-,
When a plurality of R 1 and R 2 are present in the polymer (A), they may be the same or different. )
The terminal of the alkyl group having 1 to 20 carbon atoms represented by R 3 and R 4 may be a cycloalkyl group having 4 to 10 carbon atoms,
The aryl group having 6 to 20 carbon atoms represented by R 3 and R 4 may be substituted with an alkyl group having 1 to 20 carbon atoms or OR,
R represents an alkyl group having 1 to 20 carbon atoms,
The alkyl group having 1 to 20 carbon atoms represented by R may be substituted with a halogen atom,
The methylene group in the alkyl group having 1 to 20 carbon atoms represented by R may be substituted with -O-,
R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 and R 13 (hereinafter also referred to as R 5 to R 13 ) are each independently a hydrogen atom, halogen atom, nitro Represents a group, a cyano group, a hydroxyl group, a carboxyl group, R 14 , OR 15 , SR 16 , NR 17 R 18 , COR 19 , SOR 20 , SO 2 R 21 or CONR 22 R 23 ;
R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 and R 23 are each independently an alkyl group having 1 to 20 carbon atoms or 6 to 6 carbon atoms. 20 represents an aryl group, an arylalkyl group having 7 to 20 carbon atoms or a heterocyclic ring-containing group having 2 to 20 carbon atoms,
The alkyl group having 1 to 20 carbon atoms represented by R 15 may be substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group or a carboxyl group,
The aryl group having 6 to 20 carbon atoms represented by R 19 may be substituted with a nitro group, OR ′, an alkyl group having 1 to 20 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. Yes,
R ′ represents an alkyl group having 1 to 20 carbon atoms,
The terminal of the alkyl group having 1 to 20 carbon atoms represented by R ′ may be a heterocyclic ring-containing group having 3 to 10 carbon atoms,
X 1 represents an oxygen atom, a sulfur atom, a selenium atom, CR 24 R 25 , CO, NR 26 or PR 27 ,
R 24 , R 25 , R 26 and R 27 are each independently an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, or a carbon atom. Represents a heterocyclic group containing 2 to 20,
The aryl group having 6 to 20 carbon atoms represented by R 26 may be substituted with —C (R 3 ) ═N—O—C (═O) R 4 ,
X 2 represents a single bond or CO,
R 5 and R 6 , R 5 and R 24 , R 5 and R 25 , R 5 and R 26 , R 5 and R 27 , R 7 and R 8 , R 8 and R 9 , R 8 and R 24 , R 8 And R 25 , R 8 and R 26 , R 8 and R 27 , R 9 and R 10 , R 9 and R 24 , R 9 and R 25 , R 9 and R 26 , R 9 and R 27 , R 10 and R 11 , R 11 and R 12 , R 12 and R 13 , R 13 and R 24 , R 13 and R 25 , R 13 and R 26, and R 13 and R 27 may combine to form a ring. )
また、本発明は、上記ラジカル重合性組成物を用いた硬化物の製造方法及び上記ラジカル重合組成物を用いて得られる硬化物を提供するものである。 Moreover, this invention provides the hardened | cured material obtained using the manufacturing method of the hardened | cured material using the said radically polymerizable composition, and the said radically polymerized composition.
本発明によれば、高感度のラジカル重合性組成物を提供することができる。また、該ラジカル重合性組成物を用いることによって透明性、耐薬品性及び絶縁性に優れた硬化物を提供することができる。 According to the present invention, a highly sensitive radically polymerizable composition can be provided. Moreover, the hardened | cured material excellent in transparency, chemical-resistance, and insulation can be provided by using this radically polymerizable composition.
以下、本発明のラジカル重合性組成物について、好ましい実施形態に基づき説明する。 Hereinafter, the radically polymerizable composition of the present invention will be described based on preferred embodiments.
本発明のラジカル重合成組成物は、ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C)を含有する。以下、各成分について順に説明する。 The radical polysynthetic composition of the present invention contains a polymer (A), a radical polymerization initiator (B), and an ethylenically unsaturated compound (C). Hereinafter, each component will be described in order.
<ポリマー(A)>
本発明の硬化性組成物に用いられるポリマー(A)は、上記(Ia)及び(Ib)からなる群から選ばれる骨格を少なくとも1つ有するポリマーであ
る。
(Ia)又は(Ib)で表される骨格をポリマー主鎖に少なくとも1つ有すると、ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C)を含有するラジカル重合性組成物より得られる硬化物の耐熱性が向上する。また、下記(Ic)に示す骨格を更に主鎖に有すると上記硬化物の硬度、耐薬品性が向上する。
R29は、炭素原子数1〜20のアルカンジイル基を表し、
上記アルカンジイル基は更に置換基を有する場合があり、
上記アルカンジイル基中のメチレン基は-O-、-S−、−NHCO−、−SO2−、−SS−、−SO−、−CO−又はOCO−で置換される場合もあり、
ポリマー(A)中に複数のR28、R29及びR30が存在する場合、それぞれ同一の場合も異なる場合もある。)
また、下記(Id)に示す骨格を主鎖に有すると上記ラジカル重合性組成物にアルカリ現像性を付与できる。
ポリマー(A)中に複数のR31が存在する場合、それぞれ同一の場合も異なる場合もある。)
<Polymer (A)>
The polymer (A) used in the curable composition of the present invention is a polymer having at least one skeleton selected from the group consisting of (Ia) and (Ib).
When having at least one skeleton represented by (Ia) or (Ib) in the polymer main chain, radical polymerizability containing polymer (A), radical polymerization initiator (B) and ethylenically unsaturated compound (C) The heat resistance of the cured product obtained from the composition is improved. Further, when the main chain further has a skeleton shown in (Ic) below, the hardness and chemical resistance of the cured product are improved.
R 29 represents an alkanediyl group having 1 to 20 carbon atoms,
The alkanediyl group may further have a substituent,
The methylene group in the alkanediyl group may be substituted with —O—, —S—, —NHCO—, —SO 2 —, —SS—, —SO—, —CO— or OCO—.
When a plurality of R 28 , R 29 and R 30 are present in the polymer (A), they may be the same or different. )
Moreover, when the skeleton shown in the following (Id) is included in the main chain, alkali developability can be imparted to the radical polymerizable composition.
When a plurality of R 31 are present in the polymer (A), they may be the same or different. )
上記骨格(Ia)及び(Ib)中のR1及びR2で表される炭素原子数1〜20のアルキル基としては、例えば、メチル、エチル、プロピル、iso−プロピル、ブチル、sec−ブチル、tert−ブチル、iso−ブチル、アミル、iso−アミル、tert−アミル、ヘキシル、ヘプチル、イソヘプチル、t−ヘプチル、n−オクチル、イソオクチル、t−オクチル、2−エチルヘキシル、n−ノニル、n−デシル、ウンデシル、ドデシル、トリデシル、イソトリデシル、ミリスチル、パルミチル、ステアリル、トリフルオロメチル、ジフルオロメチル、モノフルオロメチル、ペンタフルオロエチル、テトラフルオロエチル、トリフルオロエチル、ジフルオロエチル及びヘプタフルオロプロピル等が挙げられ、
上記骨格(Ia)及び(Ib)中のR1及びR2で表される炭素原子数6〜20のアリール基としては、例えば、フェニル、ナフチル、アントラセン−1−イル、フェナントレン−1−イル、o−トリル、m−トリル、p−トリル、4−ビニルフェニル、3−イソプロピルフェニル、4−イソプロピルフェニル、4−ブチルフェニル、4−イソブチルフェニル、4−t−ブチルフェニル、4−ヘキシルフェニル、4−シクロヘキシルフェニル、4−オクチルフェニル、4−(2−エチルヘキシル)フェニル、2,3−ジメチルフェニル、2,4−ジメチルフェニル、2,5−ジメチルフェニル、2,6−ジメチルフェニル、3,4−ジメチルフェニル、3,5−ジメチルフェニル、2,4−ジ−t−ブチルフェニル、2,5−ジ−t−ブチルフェニル、2,6−ジ−t−ブチルフェニル、2,4−ジ−t−ペンチルフェニル、2,5−ジ−t−アミルフェニル、シクロヘキシルフェニル、ビフェニル、2,4,5−トリメチルフェニル、4−クロロフェニル、3,4−ジクロロフェニル、4−トリクロロフェニル、4−トリフルオロフェニル及びパーフルオロフェニル等が挙げられ、
上記骨格(Ia)及び(Ib)中のR1及びR2で表される炭素原子数3〜20のシクロアルキル基とは、3〜20の炭素原子を有する、飽和単環式又は飽和多環式アルキル基を意味し、このような基として、例えば、シクロプロピル、シクロブチル、シクロペンチル、シクロヘキシル、シクロヘプチル、シクロオクチル、シクロノニル、シクロデシル、アダマンチル、デカハイドロナフチル、オクタヒドロペンタレン及びビシクロ[1.1.1]ペンタニル基等が挙げられる。
上記骨格(Ia)及び(Ib)中のR1及びR2で表される炭素原子数7〜20のアリールアルキル基としては、ベンジル、フェネチル、2−フェニルプロピル、ジフェニルメチル、トリフェニルメチル、スチリル、シンナミル及び4−クロロフェニルメチル等が挙げられ、
上記骨格(Ia)及び(Ib)中のR1及びR2で表される炭素原子数1〜20のアルキル基及び炭素原子数7〜20のアリールアルキル基のアルキレン部分の置換基としては、例えば、(メタ)アクリロイル基、ビニル基、アリル基、エポキシ基、アミノ基、イソシアネート基、カルボキシル基、ヒドロキシ基、アリール基、複素環含有基、脂環式炭化水素基、ハロゲン原子及びMgX基(ここで、Xはハロゲン原子、好ましくは臭素原子又は塩素原子)等が挙げられる。
上記骨格(Ia)中のR1としては、骨格(Ia)を形成するモノマーの反応性が良いことからα位が−CO−、β位が−O−で中断されていることがより好ましく、例えば、メチルアセテート基が挙げられ、
上記骨格(Ib)中のR2としては、耐熱性が良いことから、アリールアルキル基が好ましく、例えば、ベンジル基が挙げられる。
Examples of the alkyl group having 1 to 20 carbon atoms represented by R 1 and R 2 in the skeletons (Ia) and (Ib) include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl, amyl, iso-amyl, tert-amyl, hexyl, heptyl, isoheptyl, t-heptyl, n-octyl, isooctyl, t-octyl, 2-ethylhexyl, n-nonyl, n-decyl, Undecyl, dodecyl, tridecyl, isotridecyl, myristyl, palmityl, stearyl, trifluoromethyl, difluoromethyl, monofluoromethyl, pentafluoroethyl, tetrafluoroethyl, trifluoroethyl, difluoroethyl and heptafluoropropyl, etc.
Examples of the aryl group having 6 to 20 carbon atoms represented by R 1 and R 2 in the skeletons (Ia) and (Ib) include phenyl, naphthyl, anthracen-1-yl, phenanthren-1-yl, o-tolyl, m-tolyl, p-tolyl, 4-vinylphenyl, 3-isopropylphenyl, 4-isopropylphenyl, 4-butylphenyl, 4-isobutylphenyl, 4-t-butylphenyl, 4-hexylphenyl, 4 -Cyclohexylphenyl, 4-octylphenyl, 4- (2-ethylhexyl) phenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2,6-dimethylphenyl, 3,4- Dimethylphenyl, 3,5-dimethylphenyl, 2,4-di-t-butylphenyl, 2,5-di-t-butylphenyl Enyl, 2,6-di-t-butylphenyl, 2,4-di-t-pentylphenyl, 2,5-di-t-amylphenyl, cyclohexylphenyl, biphenyl, 2,4,5-trimethylphenyl, 4 -Chlorophenyl, 3,4-dichlorophenyl, 4-trichlorophenyl, 4-trifluorophenyl, perfluorophenyl, etc.
The cycloalkyl group having 3 to 20 carbon atoms represented by R 1 and R 2 in the skeletons (Ia) and (Ib) is a saturated monocyclic or saturated polycyclic ring having 3 to 20 carbon atoms. Meaning an alkyl group, such as cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, adamantyl, decahydronaphthyl, octahydropentalene and bicyclo [1.1 .1] pentanyl group and the like.
Examples of the arylalkyl group having 7 to 20 carbon atoms represented by R 1 and R 2 in the skeletons (Ia) and (Ib) include benzyl, phenethyl, 2-phenylpropyl, diphenylmethyl, triphenylmethyl, and styryl. , Cinnamyl and 4-chlorophenylmethyl, etc.
Examples of the substituent on the alkylene moiety of the alkyl group having 1 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms represented by R 1 and R 2 in the skeletons (Ia) and (Ib) include , (Meth) acryloyl group, vinyl group, allyl group, epoxy group, amino group, isocyanate group, carboxyl group, hydroxy group, aryl group, heterocyclic ring-containing group, alicyclic hydrocarbon group, halogen atom and MgX group (here X is a halogen atom, preferably a bromine atom or a chlorine atom).
As R 1 in the skeleton (Ia), it is more preferable that the α-position is interrupted by —CO— and the β-position is interrupted by —O— because the reactivity of the monomer forming the skeleton (Ia) is good. For example, a methyl acetate group can be mentioned,
R 2 in the skeleton (Ib) is preferably an arylalkyl group because of good heat resistance, and examples thereof include a benzyl group.
上記骨格(Ic)中のR28及びR30並びに上記骨格(Id)中のR31で表される炭素原子数1〜5のアルキル基としては、メチル、エチル、プロピル、iso−プロピル、ブチル、sec−ブチル、tert−ブチル、iso−ブチルアミル、iso−アミル及びtert−アミル等が挙げられ、
R28及びR31としてはポリマーを形成するモノマーの反応性が良いことから水素原子又はメチルが好ましく、R30としてはポリマーの側鎖に存在する不飽和性二重結合の反応性が良好なことから、水素原子又はメチル基が好ましい。
上記骨格(Ic)中のR29で表される炭素原子数1〜20のアルカンジイル基としては、例えば、メタンジイル、エタンジイル、プロパンジイル、iso−プロパンジイル、ブタンジイル、sec−ブタンジイル、tert−ブタンジイル、iso−ブタンジイル、ペンタンジイル、iso−ペンタンジイル、tert−ペンタンジイル、ヘキサンジイル、ヘプタンジイル、イソヘプタンジイル、t−ヘプタンジイル、n−オクタンジイル、イソオクタンジイル、t−オクタンジイル、2−エチルヘキサンジイル、n−ノナンジイル、n−デカンジイル、ウンデカンジイル、ドデカンジイル、トリデカンジイル、イソトリデカンジイル、テトラでカンジイル、ヘキサデカンジイル、オクタデカンジイル、トリフルオロメタンジイル及びジフルオロメタンジイル等が挙げられ、
上記骨格(Ic)中のR29で表される炭素原子数1〜20のアルカンジイル基の置換基としては、例えば、(メタ)アクリロイル基、ビニル基、アリル基、エポキシ基、アミノ基、イソシアネート基、カルボキシル基、ヒドロキシ基、アリール基、複素環含有基、脂環式炭化水素基、ハロゲン原子及びMgX基(ここで、Xはハロゲン原子、好ましくは臭素原子又は塩素原子)等が挙げられる。
上記骨格(Ic)中のR29で表される炭素原子数1〜20のアルカンジイル基としては、容易に入手できることから、α位のメチレン基が−O−に置換され、γ位にヒドロキシル基を有するブタンジイルがより好ましい。
Examples of the alkyl group having 1 to 5 carbon atoms represented by R 28 and R 30 in the skeleton (Ic) and R 31 in the skeleton (Id) include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl amyl, iso-amyl, tert-amyl and the like,
R 28 and R 31 are preferably a hydrogen atom or methyl since the reactivity of the monomer forming the polymer is good, and R 30 has a good reactivity of the unsaturated double bond present in the side chain of the polymer. Therefore, a hydrogen atom or a methyl group is preferable.
Examples of the alkanediyl group having 1 to 20 carbon atoms represented by R 29 in the skeleton (Ic) include methanediyl, ethanediyl, propanediyl, iso-propanediyl, butanediyl, sec-butanediyl, tert-butanediyl, iso-butanediyl, pentanediyl, iso-pentanediyl, tert-pentanediyl, hexanediyl, heptanediyl, isoheptanediyl, t-heptanediyl, n-octanediyl, isooctanediyl, t-octanediyl, 2-ethylhexanediyl, n-nonanediyl, n-decanediyl, undecanediyl, dodecanediyl, tridecanediyl, isotridecanediyl, tetracandedyl, hexadecanediyl, octadecanediyl, trifluoromethanediyl and difluoro Such as lomethanediyl,
Examples of the substituent of the alkanediyl group having 1 to 20 carbon atoms represented by R 29 in the skeleton (Ic) include (meth) acryloyl group, vinyl group, allyl group, epoxy group, amino group, and isocyanate. Group, carboxyl group, hydroxy group, aryl group, heterocycle-containing group, alicyclic hydrocarbon group, halogen atom and MgX group (where X is a halogen atom, preferably bromine atom or chlorine atom).
Since the alkanediyl group having 1 to 20 carbon atoms represented by R 29 in the skeleton (Ic) is easily available, the α-position methylene group is substituted with —O—, and the γ-position is a hydroxyl group. More preferred is butanediyl having
上記骨格(Ia)の割合は特に制限されないが、骨格(Ib)を含まない場合、骨格(Ia)に由来する質量がポリマー(A)の質量に対して2〜60質量%、より好ましくは、5〜50質量%である。骨格(Ia)に由来する質量が、60質量%より大きいと重合反応を制御することが困難になる場合があり、2質量%より小さいとラジカル重合性組成物より得られる硬化物の耐熱性が不十分となる場合がある。 The ratio of the skeleton (Ia) is not particularly limited, but when the skeleton (Ib) is not included, the mass derived from the skeleton (Ia) is 2 to 60% by mass with respect to the mass of the polymer (A), more preferably, It is 5-50 mass%. When the mass derived from the skeleton (Ia) is larger than 60% by mass, it may be difficult to control the polymerization reaction. When the mass is smaller than 2% by mass, the heat resistance of the cured product obtained from the radical polymerizable composition is low. It may be insufficient.
上記骨格(Ib)の割合は特に制限されないが、骨格(Ia)を含まない場合、骨格(Ib)に由来する質量がポリマー(A)の質量に対して50質量%以上、より好ましくは、70質量%以上であり、更に好ましくは90質量%以上である。骨格(Ib)に由来する質量が、50質量%より小さいとラジカル重合性組成物より得られる硬化物の耐熱性が不十分となる場合がある。 The ratio of the skeleton (Ib) is not particularly limited, but when the skeleton (Ia) is not included, the mass derived from the skeleton (Ib) is 50% by mass or more, more preferably 70% by mass with respect to the mass of the polymer (A). It is at least 90% by mass, more preferably at least 90% by mass. If the mass derived from the skeleton (Ib) is less than 50% by mass, the heat resistance of the cured product obtained from the radically polymerizable composition may be insufficient.
ポリマー(A)が上記骨格(Ia)及び骨格(Ib)の両方を含む場合、骨格(Ia)と骨格(Ib)に由来する質量の和がポリマー(A)の質量に対して5〜80質量%、より好ましくは、10〜70質量%である。骨格(Ia)及び骨格(Ib)を構成する骨格(Ia)と骨格(Ib)に由来する質量の和が、80質量%より大きいと重合反応を制御することが困難になる場合があり、5質量%より小さいとラジカル重合性組成物より得られる硬化物の耐熱性が不十分となる場合がある。 When the polymer (A) includes both the skeleton (Ia) and the skeleton (Ib), the sum of masses derived from the skeleton (Ia) and the skeleton (Ib) is 5 to 80 mass with respect to the mass of the polymer (A). %, More preferably 10 to 70% by mass. If the sum of the mass derived from the skeleton (Ia) and the skeleton (Ia) constituting the skeleton (Ia) and the skeleton (Ib) is more than 80% by mass, it may be difficult to control the polymerization reaction. If it is less than mass%, the heat resistance of the cured product obtained from the radical polymerizable composition may be insufficient.
上記骨格(Ic)の割合は特に制限されないが、骨格(Ic)に由来する質量がポリマー(A)の質量に対して0〜70質量%、より好ましくは、5〜70質量%であり、更に好ましくは10〜60質量%である。骨格(Ic)を構成する骨格(Ic)に由来する質量が、70質量%より大きいとラジカル重合性組成物より得られる硬化物の耐熱性が不十分となる場合があり、5質量%より小さいとラジカル重合性組成物の感度の低下やラジカル重合性組成物より得られる硬化物の耐薬品性が不十分となる場合がある。
The ratio of the skeleton (Ic) is not particularly limited, but the mass derived from the skeleton (Ic) is 0 to 70% by mass, more preferably 5 to 70% by mass with respect to the mass of the polymer (A). Preferably it is 10-60 mass%. If the mass derived from the skeleton (Ic) constituting the skeleton (Ic) is greater than 70% by mass, the heat resistance of the cured product obtained from the radical polymerizable composition may be insufficient, and is less than 5% by mass. In some cases, the sensitivity of the radical polymerizable composition is lowered, and the chemical resistance of the cured product obtained from the radical polymerizable composition is insufficient.
上記骨格(Id)の割合は特に制限されないが、骨格(Id)に由来する質量がポリマー(A)の質量に対して0〜70質量%、より好ましくは、5〜70質量%であり、更に好ましくは10〜60質量%である。骨格(Id)を構成する骨格(Id)に由来する質量が、70質量%より大きいとラジカル重合性組成物より得られる硬化物の耐熱性が不十分となる場合があり、5質量%より小さいとラジカル重合性組成物にアルカリ現像性を付与できない場合がある。 The ratio of the skeleton (Id) is not particularly limited, but the mass derived from the skeleton (Id) is 0 to 70% by mass, more preferably 5 to 70% by mass with respect to the mass of the polymer (A). Preferably it is 10-60 mass%. If the mass derived from the skeleton (Id) constituting the skeleton (Id) is greater than 70% by mass, the heat resistance of the cured product obtained from the radical polymerizable composition may be insufficient, and is less than 5% by mass. And the radically polymerizable composition may not be imparted with alkali developability.
ポリマー(A)の分子量は特に制限されないが、重量平均分子量が好ましくは2000〜50000であり、より好ましくは5000〜20000である。重量平均分子量が2000より小さいと、硬化物の耐熱性が低下する場合があり、重量平均分子量が50000を超えると、アルカリ現像性が低下する場合がある。 The molecular weight of the polymer (A) is not particularly limited, but the weight average molecular weight is preferably 2000 to 50000, more preferably 5000 to 20000. When the weight average molecular weight is less than 2000, the heat resistance of the cured product may be lowered, and when the weight average molecular weight is more than 50000, the alkali developability may be lowered.
本発明の硬化物の製造方法に用いる硬化性組成物において、ポリマー(A)の含有量は、ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C)の質量の和100質量部に対して、好ましくは20〜80質量部、より好ましくは、30〜60質量部である。上記ポリマー(A)の含有量が20質量部より小さいと、硬化物の体積抵抗率が低下する場合があり、80質量部より大きいと硬化物の耐薬品性が低下する場合がある。
例えば膜厚1〜100μmの硬化物を形成する場合には、ポリマー(A)の含有量は、ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C)の質量の和100質量部に対して、好ましくは20〜80質量部である。より好ましくは、30〜60質量部である。
上記ポリマー(A)の含有量が20質量部より小さいと、硬化物の体積抵抗率が低下する場合があり、80質量部より大きいと硬化物の耐薬品性が低下する場合がある。
In the curable composition used in the method for producing a cured product of the present invention, the content of the polymer (A) is the sum of the masses of the polymer (A), the radical polymerization initiator (B), and the ethylenically unsaturated compound (C). Preferably it is 20-80 mass parts with respect to 100 mass parts, More preferably, it is 30-60 mass parts. If the content of the polymer (A) is less than 20 parts by mass, the volume resistivity of the cured product may be reduced, and if it is greater than 80 parts by mass, the chemical resistance of the cured product may be reduced.
For example, when forming a cured product having a film thickness of 1 to 100 μm, the content of the polymer (A) is the sum of the masses of the polymer (A), the radical polymerization initiator (B) and the ethylenically unsaturated compound (C). Preferably it is 20-80 mass parts with respect to 100 mass parts. More preferably, it is 30-60 mass parts.
If the content of the polymer (A) is less than 20 parts by mass, the volume resistivity of the cured product may be reduced, and if it is greater than 80 parts by mass, the chemical resistance of the cured product may be reduced.
<ラジカル重合開始剤(B)>
本発明の硬化性組成物に用いられるラジカル重合開始剤(B)としては、ラジカル重合性組成物の感度及びラジカル重合性組成物より得られる硬化物の耐熱性及び耐薬品性がよいことから上記一般式(II)で表される化合物が用いられる。
<Radical polymerization initiator (B)>
As the radical polymerization initiator (B) used in the curable composition of the present invention, the sensitivity of the radical polymerizable composition and the heat resistance and chemical resistance of the cured product obtained from the radical polymerizable composition are good. A compound represented by the general formula (II) is used.
上記一般式(II)のR3、R4、R14〜R27で表される炭素原子数1〜20のアルキル基、炭素原子数6〜20のアリール基及び炭素原子数7〜20のアリールアルキル基、R、R'で表される炭素原子数1〜20のアルキル基の例としては、上記R1及びR2で例示したものと同様のものが挙げられる。
上記一般式(II)のR3、R4、R14〜R27で表される炭素原子数2〜20の複素環含有基としては、例えば、ピロリル、ピリジル、ピリジルエチル、ピリミジル、ピリダジル、ピペラジル、ピペリジル、ピラニル、ピラニルエチル、ピラゾリル、トリアジル、トリアジルメチル、ピロリジル、キノリル、イソキノリル、イミダゾリル、ベンゾイミダゾリル、トリアゾリル、フリル、フラニル、ベンゾフラニル、チエニル、チオフェニル、ベンゾチオフェニル、チアジアゾリル、チアゾリル、ベンゾチアゾリル、オキサゾリル、ベンゾオキサゾリル、イソチアゾリル、イソオキサゾリル、インドリル、ユロリジル、モルフォリニル、チオモルフォリニル、2−ピロリジノン−1−イル、2−ピペリドン−1−イル、2,4−ジオキシイミダゾリジン−3−イル及び2,4−ジオキシオキサゾリジン−3−イル等が挙げられる。
R3及びR4で表される炭素原子数1〜20のアルキル基の末端が炭素原子数3〜10のシクロアルキル基である場合の例としては、シクロプロピル、シクロブチル、シクロペンチル、シクロヘキシル、シクロヘプチル、シクロオクチル、シクロノニル、シクロデシル等が挙げられる。
R'で表される炭素原子数1〜20のアルキル基の末端が炭素原子数3〜10の複素環含有基である場合の例としては、R3等で表される複素環含有基のうち、所定の炭素原子数を満たすものの他、1,3−ジオキソラン等が挙げられる。
The alkyl group having 1 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms and the aryl group having 7 to 20 carbon atoms represented by R 3 , R 4 and R 14 to R 27 in the general formula (II). Examples of the alkyl group and the alkyl group having 1 to 20 carbon atoms represented by R and R ′ are the same as those exemplified for R 1 and R 2 above.
Examples of the heterocyclic group containing 2 to 20 carbon atoms represented by R 3 , R 4 , R 14 to R 27 in the general formula (II) include, for example, pyrrolyl, pyridyl, pyridylethyl, pyrimidyl, pyridadyl, piperazyl. , Piperidyl, pyranyl, pyranylethyl, pyrazolyl, triazyl, triazylmethyl, pyrrolidyl, quinolyl, isoquinolyl, imidazolyl, benzimidazolyl, triazolyl, furyl, furanyl, benzofuranyl, thienyl, thiophenyl, benzothiophenyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoyl Oxazolyl, isothiazolyl, isoxazolyl, indolyl, urolidyl, morpholinyl, thiomorpholinyl, 2-pyrrolidinon-1-yl, 2-piperidone-1-yl, 2,4-dioxyimidazo 3-yl and 2,4-dioxy-oxazolidinedione-3-yl, and the like.
Examples of the case where the terminal of the alkyl group having 1 to 20 carbon atoms represented by R 3 and R 4 is a cycloalkyl group having 3 to 10 carbon atoms include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl , Cyclooctyl, cyclononyl, cyclodecyl and the like.
Examples of the case where the terminal of the alkyl group having 1 to 20 carbon atoms represented by R ′ is a heterocyclic group containing 3 to 10 carbon atoms include the heterocyclic group represented by R 3 and the like In addition to those satisfying a predetermined number of carbon atoms, 1,3-dioxolane and the like can be mentioned.
R5〜R13は、互いに結合して環を形成する場合があり、またR5とR6、R5とR24、R5とR25、R5とR26、R5とR27、R7とR8、R8とR9、R8とR24、R8とR25、R8とR26、R8とR27、R9とR10、R9とR24、R9とR25、R9とR26、R9とR27、R10とR11、R11とR12、R12とR13、R13とR24、R13とR25、R13とR26及びR13とR27は結合して環を形成する場合もある。
このような環としては、シクロペンタン環、シクロヘキサン環、シクロペンテン環、ベンゼン環、ピロリジン環、ピロール環、ピペラジン環、ピペリジン環、モルホリン環、チオモルホリン環、テトラヒドロピリジン環、ラクトン環、ラクタム環等の5〜7員環及びナフタレン環、アントラセン環、カルバゾール環等の縮合環等が挙げられる。
R 5 to R 13 may be bonded to each other to form a ring, and R 5 and R 6 , R 5 and R 24 , R 5 and R 25 , R 5 and R 26 , R 5 and R 27 , R 7 and R 8 , R 8 and R 9 , R 8 and R 24 , R 8 and R 25 , R 8 and R 26 , R 8 and R 27 , R 9 and R 10 , R 9 and R 24 , R 9 And R 25 , R 9 and R 26 , R 9 and R 27 , R 10 and R 11 , R 11 and R 12 , R 12 and R 13 , R 13 and R 24 , R 13 and R 25 , R 13 and R 26 and R 13 and R 27 may combine to form a ring.
Examples of such rings include cyclopentane ring, cyclohexane ring, cyclopentene ring, benzene ring, pyrrolidine ring, pyrrole ring, piperazine ring, piperidine ring, morpholine ring, thiomorpholine ring, tetrahydropyridine ring, lactone ring, and lactam ring. Examples thereof include 5- to 7-membered rings and condensed rings such as naphthalene ring, anthracene ring, and carbazole ring.
上記一般式(II)で表されるオキシムエステル化合物のうち、下記一般式(IIa)〜(IId)で表される構造が、感度及び透明性の点から好ましい。 Of the oxime ester compounds represented by the general formula (II), structures represented by the following general formulas (IIa) to (IId) are preferable from the viewpoints of sensitivity and transparency.
上記一般式(II)で表されるオキシムエステル化合物の好ましい具体例としては、以下の化合物No.B1〜No.B26が挙げられる。但し、本発明は以下の化合物により何ら制限を受けるものではない。 Preferable specific examples of the oxime ester compound represented by the general formula (II) include the following compound Nos. B1-No. B26 may be mentioned. However, the present invention is not limited by the following compounds.
上記一般式(IIa)で表される化合物の中では、下記のものが好ましい。
・R3及びR4はそれぞれ独立に炭素原子数1〜6のアルキル基又は炭素原子数6〜10のアリール基(特に炭素原子数1〜6のアルキル基で置換されているもの)であるもの
・R10〜R13の何れか、特にR12が、ニトロ基又はCOR19〔R19は、炭素原子数6〜10のアリール基(特に無置換、炭素原子数1〜6のアルキル基若しくはニトロ基で置換されたベンゼン環又は無置換のナフタレン環)又は炭素原子数3〜10の複素環含有基(特にチオフェン環)であるもの〕であるもの
・R24及び/又はR25が、炭素原子数1〜10のアルキル基(特に炭素原子数3〜6のアルキル基)であるもの
また、上記一般式(IIb)で表される化合物の中では、下記のものが好ましい。
・R3又はR4が、炭素原子数1〜6のアルキル基であるもの
・R9〜R13の何れか、特にR11が、COR19〔R19は、炭素原子数6〜10のアリール基(特に無置換若しくは炭素原子数1〜6のアルキル基に置換されたベンゼン環又は無置換のナフタレン環)又は炭素原子数3〜10の複素環含有基(特にチオフェン環)であるもの〕であるもの
・R26が、炭素原子数6〜10のアリール基であって、且つ、−C(R3)=N−O−C(=O)R4に置換されているもの
また、上記一般式(IIc)で表される化合物の中では、下記のものが好ましい。
・R3又はR4が、炭素原子数1〜20のアルキル基(その末端が炭素原子数4〜6のシクロアルキル基であるものを含む)、炭素原子数6〜20のアリール基〔炭素原子数1〜6のアルキル基又はOR(Rは炭素原子数1〜6のアルキル基、但し、ハロゲン原子で置換されている場合もあり、途中のメチレンは−O−で置換されている場合もある)で置換されたものを含む〕であるもの
・R10〜R13の何れか、特にR11が、ニトロ基、COR19[R19は、炭素原子数6〜10のアリール基〔特に無置換、炭素原子数1〜6のアルキル基、炭素原子数3〜20の複素環含有基、OR'(但し、R'は、炭素原子数1〜6のアルキル基であって、その末端は、炭素原子数3〜10の複素環含有基(特に1,3−ジオキソラン)であるものを含む〕で置換されたもの]であるもの
・R26が、炭素原子数1〜6のアルキル基又は炭素原子数6〜10のアリール基であって、且つ、−C(R)=N−O−C(=O)R'で置換されているもの
また、上記一般式(IId)で表される化合物の中では、下記のものが好ましい。
・R3又はR4が、炭素原子数1〜20のアルキル基(その末端が炭素原子数4〜6のシクロアルキル基であるものを含む)、炭素原子数6〜20のアリール基(炭素原子数1〜6のアルキル基で置換されたものを含む)であるもの
・R9〜R13の何れか、特にR11が、OR15(R15は炭素原子数1〜6のアルキル基で、水酸基で置換されている場合もある)、COR19(R19は、炭素原子数6〜10のアリール基)であるもの
・R26が、炭素原子数1〜6のアルキル基又は炭素原子数6〜10のアリール基であって、且つ、−C(R3)=N−O−C(=O)R4で置換されているもの
Among the compounds represented by the general formula (IIa), the following are preferable.
R 3 and R 4 are each independently an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 10 carbon atoms (particularly one substituted with an alkyl group having 1 to 6 carbon atoms). Any of R 10 to R 13 , particularly R 12 is a nitro group or COR 19 [R 19 is an aryl group having 6 to 10 carbon atoms (particularly unsubstituted, an alkyl group having 1 to 6 carbon atoms or a nitro group) A benzene ring substituted with a group or an unsubstituted naphthalene ring) or a heterocyclic-containing group having 3 to 10 carbon atoms (particularly a thiophene ring)] R 24 and / or R 25 is a carbon atom What is a C1-C10 alkyl group (especially C3-C6 alkyl group) Moreover, among the compounds represented by the said general formula (IIb), the following are preferable.
-R 3 or R 4 is an alkyl group having 1 to 6 carbon atoms-Any of R 9 to R 13 , especially R 11 is COR 19 [R 19 is aryl having 6 to 10 carbon atoms A group (particularly an unsubstituted or substituted benzene ring or unsubstituted naphthalene ring substituted with an alkyl group having 1 to 6 carbon atoms) or a heterocyclic group containing 3 to 10 carbon atoms (particularly a thiophene ring)] Some where R 26 is an aryl group having 6 to 10 carbon atoms and substituted with —C (R 3 ) ═N—O—C (═O) R 4 Among the compounds represented by the formula (IIc), the following are preferable.
R 3 or R 4 is an alkyl group having 1 to 20 carbon atoms (including a terminal having a cycloalkyl group having 4 to 6 carbon atoms), an aryl group having 6 to 20 carbon atoms [carbon atom An alkyl group of 1 to 6 or OR (R is an alkyl group of 1 to 6 carbon atoms, provided that it may be substituted with a halogen atom, and methylene in the middle may be substituted with -O- Any one of R 10 to R 13 , particularly R 11 is a nitro group, COR 19 [R 19 is an aryl group having 6 to 10 carbon atoms [particularly unsubstituted] , An alkyl group having 1 to 6 carbon atoms, a heterocycle-containing group having 3 to 20 carbon atoms, OR ′ (where R ′ is an alkyl group having 1 to 6 carbon atoms, and the terminal thereof is carbon. Including those that are heterocycle-containing groups having 3 to 10 atoms (especially 1,3-dioxolane)] Those · R 26 is those substituted] is an alkyl group or an aryl group having 6 to 10 carbon atoms of 1 to 6 carbon atoms, and, -C (R) = N- O-C ( = O) Those substituted with R 'Further, among the compounds represented by the general formula (IId), the following are preferable.
R 3 or R 4 is an alkyl group having 1 to 20 carbon atoms (including a terminal having a cycloalkyl group having 4 to 6 carbon atoms), an aryl group having 6 to 20 carbon atoms (carbon atom) Any one of R 9 to R 13 , especially R 11 is OR 15 (R 15 is an alkyl group having 1 to 6 carbon atoms, May be substituted with a hydroxyl group), COR 19 (R 19 is an aryl group having 6 to 10 carbon atoms) R 26 is an alkyl group having 1 to 6 carbon atoms or 6 carbon atoms To 10 aryl groups and substituted with —C (R 3 ) ═N—O—C (═O) R 4
上記一般式(II)で表されるラジカル重合性化合物としては市販品を用いることもでき、例えば、DFI−091、DFI−120(ダイトーケミックス社製)、SOX−337(サンタイプ社製)、TR−PBG−304、TR−PBG−305、TR−PBG−309、TR−PBG−314、TR−PBG−327(TRONLY社製)、アデカオプトマーN−1919、アデカアークルズNCI−831、アデカアークルズNCI−930(ADEKA社製)、IRGACURE OXE01、IRGACURE OXE02、IRGACURE OXE03及びIRGACURE OXE04(BASF社製)等が挙げられる。 Commercially available products can also be used as the radical polymerizable compound represented by the general formula (II). For example, DFI-091, DFI-120 (manufactured by Daito Chemix), SOX-337 (manufactured by Suntype), TR -PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-314, TR-PBG-327 (manufactured by TRONLY), Adekaoptomer N-1919, Adeka Arcles NCI-831, Adeka Arc Ruse NCI-930 (manufactured by ADEKA), IRGACURE OXE01, IRGACURE OXE02, IRGACURE OXE03, IRGACURE OXE04 (manufactured by BASF) and the like.
これらのラジカル重合開始剤は1種又は2種以上のものを所望の性能に応じて配合して使用することができる。 These radical polymerization initiators can be used alone or in combination according to the desired performance.
本発明の硬化物の製造方法に用いる硬化性組成物において、ポリマー(A)の含有量は、ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C)の質量の和100質量部に対して、好ましくは2.0〜60質量部である。より好ましくは、10〜40質量部である。上記ラジカル重合開始剤(B)の含有量が2.0質量部より小さいと、ラジカル重合性組成物の感度が低下する場合があり、60質量部より大きいと硬化物の耐薬品性が低下する場合がある。
例えば膜厚1〜100μmの硬化物を形成する場合には、ラジカル重合開始剤(B)の含有量は、ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C)の質量の和100質量部に対して、好ましくは2.0〜60質量部である。より好ましくは、10〜40質量部である。上記ラジカル重合開始剤(B)の含有量が2.0質量部より小さいと、ラジカル重合性組成物の感度が低下する場合があり、60質量部より大きいと硬化物の耐薬品性が低下する場合がある。
In the curable composition used in the method for producing a cured product of the present invention, the content of the polymer (A) is the sum of the masses of the polymer (A), the radical polymerization initiator (B), and the ethylenically unsaturated compound (C). Preferably it is 2.0-60 mass parts with respect to 100 mass parts. More preferably, it is 10-40 mass parts. When the content of the radical polymerization initiator (B) is less than 2.0 parts by mass, the sensitivity of the radical polymerizable composition may be reduced. When the content is more than 60 parts by mass, the chemical resistance of the cured product is reduced. There is a case.
For example, when forming a cured product having a film thickness of 1 to 100 μm, the content of the radical polymerization initiator (B) is such that the polymer (A), the radical polymerization initiator (B), and the ethylenically unsaturated compound (C). Preferably it is 2.0-60 mass parts with respect to 100 mass parts of sum of mass. More preferably, it is 10-40 mass parts. When the content of the radical polymerization initiator (B) is less than 2.0 parts by mass, the sensitivity of the radical polymerizable composition may be reduced. When the content is more than 60 parts by mass, the chemical resistance of the cured product is reduced. There is a case.
<エチレン性不飽和化合物(C)>
本発明のラジカル重合性組成物に用いられるエチレン性不飽和化合物(C)としては、化合物中に炭素-炭素2重結合を有する化合物であればよく、特に限定されず、既存に用いられているものを用いることができる。
<Ethylenic unsaturated compound (C)>
The ethylenically unsaturated compound (C) used in the radically polymerizable composition of the present invention is not particularly limited as long as it is a compound having a carbon-carbon double bond in the compound, and is already used. Things can be used.
上記エチレン性不飽和化合物(C)としては、例えば、エチレン、プロピレン、ブチレン、イソブチレン、塩化ビニル、塩化ビニリデン、フッ化ビニリデン及びテトラフルオロエチレン等の不飽和脂肪族炭化水素;(メタ)アクリル酸、α―クロルアクリル酸、イタコン酸、マレイン酸、シトラコン酸、フマル酸、ハイミック酸、クロトン酸、イソクロトン酸、ビニル酢酸、アリル酢酸、桂皮酸、ソルビン酸、メサコン酸、コハク酸モノ[2−(メタ)アクリロイロキシエチル]、フタル酸モノ[2−(メタ)アクリロイロキシエチル]及びω−カルボキシポリカプロラクトンモノ(メタ)アクリレート等の両末端にカルボキシ基と水酸基とを有するポリマーのモノ(メタ)アクリレート;ヒドロキシエチル(メタ)アクリレート・マレート、ヒドロキシプロピル(メタ)アクリレート・マレート、ジシクロペンタジエン・マレート及び1個のカルボキシル基と2個以上の(メタ)アクリロイル基とを有する多官能(メタ)アクリレート等の不飽和一塩基酸;(メタ)アクリル酸−2−ヒドロキシエチル、(メタ)アクリル酸−2−ヒドロキシプロピル、(メタ)アクリル酸グリシジル、下記化合物No.C1〜No.C4、(メタ)アクリル酸メチル、 (メタ)アクリル酸ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸−t−ブチル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸n−オクチル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸ステアリル、(メタ)アクリル酸ラウリル、(メタ)アクリル酸メトキシエチル、(メタ)アクリル酸ジメチルアミノメチル、(メタ)アクリル酸ジメチルアミノエチル、(メタ)アクリル酸アミノプロピル、(メタ)アクリル酸ジメチルアミノプロピル、(メタ)アクリル酸エトキシエチル、(メタ)アクリル酸ポリ(エトキシ)エチル、(メタ)アクリル酸ブトキシエトキシエチル、(メタ)アクリル酸エチルヘキシル、(メタ)アクリル酸フェノキシエチル、(メタ)アクリル酸テトラヒドロフリル、(メタ)アクリル酸ビニル、(メタ)アクリル酸アリル、(メタ)アクリル酸ベンジル、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、トリシクロデカンジメチロールジ(メタ)アクリレート及びトリ[(メタ)アクリロイルエチル]イソシアヌレート及びポリエステル(メタ)アクリレートオリゴマー等の不飽和一塩基酸と多価アルコール又は多価フェノールのエステル;(メタ)アクリル酸亜鉛及び(メタ)アクリル酸マグネシウム等の不飽和多塩基酸の金属塩;マレイン酸無水物、イタコン酸無水物、シトラコン酸無水物、メチルテトラヒドロ無水フタル酸、テトラヒドロ無水フタル酸、トリアルキルテトラヒドロ無水フタル酸、5−(2,5−ジオキソテトラヒドロフリル)−3−メチル−3−シクロヘキセン−1,2−ジカルボン酸無水物、トリアルキルテトラヒドロ無水フタル酸−無水マレイン酸付加物、ドデセニル無水コハク酸及び無水メチルハイミック酸等の不飽和多塩基酸の酸無水物;(メタ)アクリルアミド、メチレンビス−(メタ)アクリルアミド、ジエチレントリアミントリス(メタ)アクリルアミド、キシリレンビス(メタ)アクリルアミド、α−クロロアクリルアミド及びN−2−ヒドロキシエチル(メタ)アクリルアミド等の不飽和一塩基酸及び多価アミンのアミド;アクロレイン等の不飽和アルデヒド;(メタ)アクリロニトリル、α−クロロアクリロニトリル、シアン化ビニリデン及びシアン化アリル等の不飽和ニトリル;スチレン、4−メチルスチレン、4−エチルスチレン、4−メトキシスチレン、4−ヒドロキシスチレン、4−クロロスチレン、ジビニルベンゼン、ビニルトルエン、ビニル安息香酸、ビニルフェノール、ビニルスルホン酸、4−ビニルベンゼンスルホン酸、ビニルベンジルメチルエーテル及びビニルベンジルグリシジルエーテル等の不飽和芳香族化合物;メチルビニルケトン等の不飽和ケトン;ビニルアミン、アリルアミン、N−ビニルピロリドン及びビニルピペリジン等の不飽和アミン化合物;アリルアルコール及びクロチルアルコール等のビニルアルコール;ビニルメチルエーテル、ビニルエチルエーテル、n−ブチルビニルエーテル、イソブチルビニルエーテル及びアリルグリシジルエーテル等のビニルエーテル;マレイミド、N−フェニルマレイミド及びN−シクロヘキシルマレイミド等の不飽和イミド類;インデン及び1−メチルインデン等のインデン類;1,3−ブタジエン、イソプレン及びクロロプレン等の脂肪族共役ジエン類;ポリスチレン、ポリメチル(メタ)アクリレート、ポリ−n−ブチル(メタ)アクリレート及びポリシロキサン等の重合体分子鎖の末端にモノ(メタ)アクリロイル基を有するマクロモノマー類;ビニルクロリド、ビニリデンクロリド、ジビニルスクシナート、ジアリルフタラート、トリアリルホスファート、トリアリルイソシアヌラート、ビニルチオエーテル、ビニルイミダゾール、ビニルオキサゾリン、ビニルカルバゾール、ビニルピロリドン、ビニルピリジン、水酸基含有ビニルモノマー、ポリイソシアネート化合物のビニルウレタン化合物、水酸基含有ビニルモノマー及びポリエポキシ化合物のビニルエポキシ化合物等が挙げられる。 Examples of the ethylenically unsaturated compound (C) include unsaturated aliphatic hydrocarbons such as ethylene, propylene, butylene, isobutylene, vinyl chloride, vinylidene chloride, vinylidene fluoride, and tetrafluoroethylene; (meth) acrylic acid, α-chloroacrylic acid, itaconic acid, maleic acid, citraconic acid, fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinyl acetic acid, allyl acetic acid, cinnamic acid, sorbic acid, mesaconic acid, monosuccinic acid [2- (meta ) Acryloyloxyethyl], phthalic acid mono [2- (meth) acryloyloxyethyl] and ω-carboxypolycaprolactone mono (meth) acrylate, etc., polymer mono (meth) having a carboxy group and a hydroxyl group at both ends Acrylate; hydroxyethyl (meth) acrylate malate, H Unsaturated monobasic acids such as roxypropyl (meth) acrylate malate, dicyclopentadiene malate and polyfunctional (meth) acrylate having one carboxyl group and two or more (meth) acryloyl groups; (meth) 2-hydroxyethyl acrylate, 2-hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, the following compound No. C1-No. C4, methyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, (t-butyl) (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate, ( Isooctyl (meth) acrylate, isononyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, methoxyethyl (meth) acrylate, dimethylaminomethyl (meth) acrylate, dimethyl (meth) acrylate Aminoethyl, aminopropyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, ethoxyethyl (meth) acrylate, poly (ethoxy) ethyl (meth) acrylate, butoxyethoxyethyl (meth) acrylate, (meta ) Ethylhexyl acrylate, (meth) acrylic acid Phenoxyethyl, tetrahydrofuryl (meth) acrylate, vinyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol Di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolethanetri (Meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol Unsaturated monobasic acids such as tra (meth) acrylate, pentaerythritol tri (meth) acrylate, tricyclodecane dimethylol di (meth) acrylate and tri [(meth) acryloylethyl] isocyanurate and polyester (meth) acrylate oligomers; Esters of polyhydric alcohols or polyphenols; metal salts of unsaturated polybasic acids such as zinc (meth) acrylate and magnesium (meth) acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyl Tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydro Phthalic anhydride Hydrous maleic acid adduct, acid anhydrides of unsaturated polybasic acids such as dodecenyl succinic anhydride and methyl hymic anhydride; (meth) acrylamide, methylene bis- (meth) acrylamide, diethylenetriamine tris (meth) acrylamide, xylylene bis (meta ) Unsaturated monobasic acids and amides of polyvalent amines such as acrylamide, α-chloroacrylamide and N-2-hydroxyethyl (meth) acrylamide; Unsaturated aldehydes such as acrolein; (meth) acrylonitrile, α-chloroacrylonitrile, cyanide Unsaturated nitriles such as vinylidene chloride and allyl cyanide; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyltoluene, vinyl Unsaturated aromatic compounds such as perfume acid, vinylphenol, vinylsulfonic acid, 4-vinylbenzenesulfonic acid, vinylbenzyl methyl ether and vinylbenzyl glycidyl ether; unsaturated ketones such as methyl vinyl ketone; vinylamine, allylamine, N-vinyl Unsaturated amine compounds such as pyrrolidone and vinylpiperidine; vinyl alcohols such as allyl alcohol and crotyl alcohol; vinyl ethers such as vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether, isobutyl vinyl ether and allyl glycidyl ether; maleimide, N-phenyl Unsaturated imides such as maleimide and N-cyclohexylmaleimide; indenes such as indene and 1-methylindene; 1,3-butadiene, isoprene and chloroprene Aliphatic monomers such as polystyrene; macromonomers having a mono (meth) acryloyl group at the end of a polymer molecular chain such as polystyrene, polymethyl (meth) acrylate, poly-n-butyl (meth) acrylate, and polysiloxane; Vinyl chloride, vinylidene chloride, divinyl succinate, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl thioether, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrolidone, vinyl pyridine, hydroxyl group-containing vinyl monomer, poly Examples thereof include vinyl urethane compounds of isocyanate compounds, vinyl monomers containing hydroxyl groups, and vinyl epoxy compounds of polyepoxy compounds.
上記エチレン性不飽和化合物(C)の中でも、酸性基を有する化合物を用いた場合、本発明のラジカル重合性組成物にアルカリ現像性を付与することができる。上記酸性基を有する化合物を用いる場合、その使用量は上記エチレン性不飽和化合物(C)全体の50〜99質量%となるようにすることが好ましい。
また、上記酸性基を有する化合物は、更に単官能又は多官能エポキシ化合物を反応させることにより酸価調整してから用いることもできる。上記酸性基を有する化合物の酸価を調整することにより、ラジカル重合性組成物のアルカリ現像性を改良することができる。上記酸性基を有する化合物(即ちアルカリ現像性を付与するエチレン性不飽和化合物(C)は、固形分の酸価が5〜120mgKOH/gの範囲であることが好ましく、単官能又は多官能エポキシ化合物の使用量は、上記酸価を満たすように選択するのが好ましい。
Among the ethylenically unsaturated compounds (C), when a compound having an acidic group is used, alkali developability can be imparted to the radically polymerizable composition of the present invention. When using the compound which has the said acidic group, it is preferable to make the usage-amount become 50-99 mass% of the said ethylenically unsaturated compound (C) whole.
The compound having an acidic group can be used after adjusting the acid value by further reacting with a monofunctional or polyfunctional epoxy compound. By adjusting the acid value of the compound having an acidic group, the alkali developability of the radical polymerizable composition can be improved. The compound having an acidic group (that is, the ethylenically unsaturated compound (C) imparting alkali developability) preferably has a solid acid value in the range of 5 to 120 mgKOH / g, and is a monofunctional or polyfunctional epoxy compound. Is preferably selected so as to satisfy the acid value.
上記単官能エポキシ化合物としては、グリシジルメタクリレート、メチルグリシジルエーテル、エチルグリシジルエーテル、プロピルグリシジルエーテル、イソプロピルグリシジルエーテル、ブチルグリシジルエーテル、イソブチルグリシジルエーテル、t−ブチルグリシジルエーテル、ペンチルグリシジルエーテル、ヘキシルグリシジルエーテル、ヘプチルグリシジルエーテル、オクチルグリシジルエーテル、ノニルグリシジルエーテル、デシルグリシジルエーテル、ウンデシルグリシジルエーテル、ドデシルグリシジルエーテル、トリデシルグリシジルエーテル、テトラデシルグリシジルエーテル、ペンタデシルグリシジルエーテル、ヘキサデシルグリシジルエーテル、2−エチルヘキシルグリシジルエーテル、アリルグリシジルエーテル、プロパルギルグリシジルエーテル、p−メトキシエチルグリシジルエーテル、フェニルグリシジルエーテル、p−メトキシグリシジルエーテル、p−ブチルフェノールグリシジルエーテル、クレジルグリシジルエーテル、2−メチルクレジルグリシジルエーテル、4−ノニルフェニルグリシジルエーテル、ベンジルグリシジルエーテル、p−クミルフェニルグリシジルエーテル、トリチルグリシジルエーテル、2,3−エポキシプロピルメタクリレート、エポキシ化大豆油、エポキシ化アマニ油、グリシジルブチレート、ビニルシクロヘキサンモノオキシド、1,2−エポキシ−4−ビニルシクロヘキサン、スチレンオキシド、ピネンオキシド、メチルスチレンオキシド、シクロヘキセンオキシド、プロピレンオキシド、上記化合物No.C2及びNo.C3等が挙げられる。 Examples of the monofunctional epoxy compound include glycidyl methacrylate, methyl glycidyl ether, ethyl glycidyl ether, propyl glycidyl ether, isopropyl glycidyl ether, butyl glycidyl ether, isobutyl glycidyl ether, t-butyl glycidyl ether, pentyl glycidyl ether, hexyl glycidyl ether, heptyl. Glycidyl ether, octyl glycidyl ether, nonyl glycidyl ether, decyl glycidyl ether, undecyl glycidyl ether, dodecyl glycidyl ether, tridecyl glycidyl ether, tetradecyl glycidyl ether, pentadecyl glycidyl ether, hexadecyl glycidyl ether, 2-ethylhexyl glycidyl ether, Allyl glycidylate , Propargyl glycidyl ether, p-methoxyethyl glycidyl ether, phenyl glycidyl ether, p-methoxy glycidyl ether, p-butylphenol glycidyl ether, cresyl glycidyl ether, 2-methyl cresyl glycidyl ether, 4-nonylphenyl glycidyl ether, benzyl glycidyl Ether, p-cumylphenyl glycidyl ether, trityl glycidyl ether, 2,3-epoxypropyl methacrylate, epoxidized soybean oil, epoxidized linseed oil, glycidyl butyrate, vinylcyclohexane monooxide, 1,2-epoxy-4-vinyl Cyclohexane, styrene oxide, pinene oxide, methyl styrene oxide, cyclohexene oxide, propylene oxide, the above-mentioned compound no. C2 and No. C3 etc. are mentioned.
上記エチレン性不飽和化合物(C)としては市販品を用いることができ、例えば、カヤラッドDPHA、DPEA−12、PEG400DA、THE−330、RP−1040、NPGDA、PET30(日本化薬社製)、SPC−3000(昭和電工製)、アロニックスM−140、M−215、M−350(東亞合成社製)、NKエステルA−DPHA−TMPT、A−DCP、A−HD−N、A−9300、TMPT、DCP、NPG及びHD−N(新中村化学工業社製)等が挙げられる。 A commercial item can be used as said ethylenically unsaturated compound (C), for example, Kayrad DPHA, DPEA-12, PEG400DA, THE-330, RP-1040, NPGDA, PET30 (made by Nippon Kayaku Co., Ltd.), SPC -3000 (made by Showa Denko), Aronix M-140, M-215, M-350 (made by Toagosei), NK ester A-DPHA-TMPT, A-DCP, A-HD-N, A-9300, TMPT , DCP, NPG and HD-N (manufactured by Shin-Nakamura Chemical Co., Ltd.).
本発明の硬化物の製造方法に用いる硬化性組成物において、エチレン性不飽和化合物(C)の含有量は、ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C)の質量の和100質量部に対して、好ましくは5.0〜70質量部である。より好ましくは、10〜50質量部である。上記エチレン性不飽和化合物(C)の含有量が5.0質量部より小さいと、ラジカル重合性組成物からなる硬化物の耐薬品性が低下する場合があり、70質量部より大きいと硬化物の体積抵抗率が低下する場合がある。
例えば膜厚1〜100μmの硬化物を形成する場合には、エチレン性不飽和化合物(C)の含有量は、ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C)の質量の和100質量部に対して、好ましくは5.0〜70質量部である。より好ましくは、10〜50質量部である。上記エチレン性不飽和化合物(C)の含有量が5.0質量部より小さいと、ラジカル重合性組成物からなる硬化物の耐薬品性が低下する場合があり、70質量部より大きいと硬化物の体積抵抗率が低下する場合がある。
In the curable composition used in the method for producing a cured product of the present invention, the content of the ethylenically unsaturated compound (C) is the polymer (A), the radical polymerization initiator (B), and the ethylenically unsaturated compound (C). Preferably it is 5.0-70 mass parts with respect to 100 mass parts of sum of mass. More preferably, it is 10-50 mass parts. If the content of the ethylenically unsaturated compound (C) is less than 5.0 parts by mass, the chemical resistance of the cured product made of the radical polymerizable composition may be lowered. If the content is more than 70 parts by mass, the cured product is obtained. The volume resistivity may decrease.
For example, when forming a cured product having a film thickness of 1 to 100 μm, the content of the ethylenically unsaturated compound (C) is such that the polymer (A), the radical polymerization initiator (B), and the ethylenically unsaturated compound (C). Preferably it is 5.0-70 mass parts with respect to 100 mass parts of sum of mass. More preferably, it is 10-50 mass parts. If the content of the ethylenically unsaturated compound (C) is less than 5.0 parts by mass, the chemical resistance of the cured product made of the radical polymerizable composition may be lowered. If the content is more than 70 parts by mass, the cured product is obtained. The volume resistivity may decrease.
本発明のラジカル重合性組成物は、エチレン性不飽和結合を有さず、アルカリ現像性を付与する化合物を含有してもよく、そのような化合物としては、酸性基を有することでアルカリ水溶液に可溶な化合物であれば特に限定されないが、代表的なものとしてアルカリ可溶性ノボラック樹脂(以下、単に「ノボラック樹脂」という)が挙げられる。ノボラック樹脂は、フェノール類とアルデヒド類とを酸触媒の存在下に重縮合して得られる。 The radically polymerizable composition of the present invention may contain a compound that does not have an ethylenically unsaturated bond and imparts alkali developability. As such a compound, an acidic aqueous solution can be obtained by having an acidic group. Although it will not specifically limit if it is a soluble compound, Alkali-soluble novolak resin (henceforth "novolak resin" only) is mentioned as a typical thing. The novolak resin is obtained by polycondensation of phenols and aldehydes in the presence of an acid catalyst.
上記フェノール類としては、例えばフェノール、o−クレゾール、m−クレゾール、p−クレゾール、o−エチルフェノール、m−エチルフェノール、p−エチルフェノール、o−ブチルフェノール、m−ブチルフェノール、p−ブチルフェノール、2,3−キシレノール、2,4−キシレノール、2,5−キシレノール、3,4−キシレノール、3,5−キシレノール、2,3,5−トリメチルフェノール、p−フェニルフェノール、ヒドロキノン、カテコール、レゾルシノール、2−メチルレゾルシノール、ピロガロール、α−ナフトール、ビスフェノールA及びジヒドロキシ安息香酸エステル及び没食子酸エステル等が用いられ、これらのフェノール類のうちフェノール、o−クレゾール、m−クレゾール、p−クレゾール、2,5−キシレノール、3,5−キシレノール、2,3,5−トリメチルフェノール、レゾルシノール、2−メチルレゾルシノール及びビスフェノールAが好ましい。これらのフェノール類は、単独で又は2種以上混合して用いられる。 Examples of the phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, p-butylphenol, 2, 3-xylenol, 2,4-xylenol, 2,5-xylenol, 3,4-xylenol, 3,5-xylenol, 2,3,5-trimethylphenol, p-phenylphenol, hydroquinone, catechol, resorcinol, 2- Methyl resorcinol, pyrogallol, α-naphthol, bisphenol A, dihydroxybenzoic acid ester, gallic acid ester and the like are used. Among these phenols, phenol, o-cresol, m-cresol, p-cresol, 2,5- Shirenoru, 3,5-xylenol, 2,3,5-trimethylphenol, resorcinol, 2-methyl resorcinol and bisphenol A are preferred. These phenols are used alone or in combination of two or more.
上記アルデヒド類としては、例えばホルムアルデヒド、パラホルムアルデヒド、アセトアルデヒド、プロピルアルデヒド、ベンズアルデヒド、フェニルアセトアルデヒド、α−フェニルプロピルアルデヒド、β−フェニルプロピルアルデヒド、o−ヒドロキシベンズアルデヒド、m−ヒドロキシベンズアルデヒド、p−ヒドロキシベンズアルデヒド、o−クロロベンズアルデヒド、m−クロロベンズアルデヒド、p−クロロベンズアルデヒド、o−ニトロベンズアルデヒド、m−ニトロベンズアルデヒド、p−ニトロベンズアルデヒド、o−メチルベンズアルデヒド、m−メチルベンズアルデヒド、p−メチルベンズアルデヒド、p−エチルベンズアルデヒド及びp−n−ブチルベンズアルデヒド等が用いられ、これらの化合物のうちホルムアルデヒド、アセトアルデヒド及びベンズアルデヒドが好ましい。これらのアルデヒド類は、単独で又は2種以上混合して用いられる。アルデヒド類はフェノール類1モル当たり、好ましくは0.7〜3モル、特に好ましくは0.7〜2モルの割合で使用される。 Examples of the aldehydes include formaldehyde, paraformaldehyde, acetaldehyde, propylaldehyde, benzaldehyde, phenylacetaldehyde, α-phenylpropylaldehyde, β-phenylpropylaldehyde, o-hydroxybenzaldehyde, m-hydroxybenzaldehyde, p-hydroxybenzaldehyde, o -Chlorobenzaldehyde, m-chlorobenzaldehyde, p-chlorobenzaldehyde, o-nitrobenzaldehyde, m-nitrobenzaldehyde, p-nitrobenzaldehyde, o-methylbenzaldehyde, m-methylbenzaldehyde, p-methylbenzaldehyde, p-ethylbenzaldehyde and p N-butylbenzaldehyde and the like are used, and among these compounds, formaldehyde Rudehydr, acetaldehyde and benzaldehyde are preferred. These aldehydes may be used alone or in combination of two or more. Aldehydes are preferably used in a proportion of 0.7 to 3 mol, particularly preferably 0.7 to 2 mol, per mol of phenol.
上記酸触媒としては、例えば塩酸、硝酸、硫酸等の無機酸、又は蟻酸、蓚酸、酢酸等の有機酸が用いられる。これらの酸触媒の使用量は、フェノール類1モル当たり、1×10-4〜5×10-1モルが好ましい。縮合反応においては、通常、反応媒質として水が用いられるが、縮合反応に用いられるフェノール類がアルデヒド類の水溶液に溶解せず、反応初期から不均一系になる場合には、反応媒質として親水性溶媒を使用することもできる。これらの親水性溶媒としては、例えばメタノール、エタノール、プロパノール及びブタノール等のアルコール類、又はテトラヒドロフラン及びジオキサン等の環状エーテル類が挙げられる。これらの反応媒質の使用量は、通常、反応原料100質量部当たり、20〜1000質量部である。縮合反応の反応温度は、反応原料の反応性に応じて適宜調整することができるが、通常、10〜200℃、好ましくは70〜150℃である。縮合反応終了後、系内に存在する未反応原料、酸触媒及び反応媒質を除去するため、一般的には内温を130〜230℃に上昇させ、減圧下に揮発分を留去し、次いで熔融したノボラック樹脂をスチール製ベルト等の上に流涎して回収する。
また縮合反応終了後に、前記親水性溶媒に反応混合物を溶解し、水、n−ヘキサン及びn−ヘプタン等の沈殿剤に添加することにより、ノボラック樹脂を析出させ、析出物を分離し、加熱乾燥することにより回収することもできる。
Examples of the acid catalyst include inorganic acids such as hydrochloric acid, nitric acid, and sulfuric acid, or organic acids such as formic acid, oxalic acid, and acetic acid. The amount of these acid catalysts used is preferably 1 × 10 −4 to 5 × 10 −1 mol per mol of phenols. In the condensation reaction, water is usually used as a reaction medium. However, if the phenols used in the condensation reaction do not dissolve in an aqueous solution of aldehydes and become heterogeneous from the beginning of the reaction, the reaction medium is hydrophilic. A solvent can also be used. Examples of these hydrophilic solvents include alcohols such as methanol, ethanol, propanol and butanol, or cyclic ethers such as tetrahydrofuran and dioxane. The amount of these reaction media used is usually 20 to 1000 parts by mass per 100 parts by mass of the reaction raw material. Although the reaction temperature of a condensation reaction can be suitably adjusted according to the reactivity of a reaction raw material, it is 10-200 degreeC normally, Preferably it is 70-150 degreeC. After completion of the condensation reaction, in order to remove unreacted raw materials, acid catalyst and reaction medium present in the system, the internal temperature is generally raised to 130 to 230 ° C., and volatile components are distilled off under reduced pressure. The molten novolac resin is collected on a steel belt or the like.
After completion of the condensation reaction, the reaction mixture is dissolved in the hydrophilic solvent and added to a precipitating agent such as water, n-hexane and n-heptane to precipitate a novolak resin, and the precipitate is separated and dried by heating. It can also be recovered by doing so.
上記ノボラック樹脂以外の例としては、ポリヒドロキシスチレン又はその誘導体、スチレン−無水マレイン酸共重合体及びポリビニルヒドロキシベンゾエート等が挙げられる。 Examples other than the novolak resin include polyhydroxystyrene or a derivative thereof, a styrene-maleic anhydride copolymer, and polyvinylhydroxybenzoate.
上記硬化性組成物には、必要に応じて上記の各成分(ポリマー(A)、ラジカル重合開始剤(B)及びエチレン性不飽和化合物(C))を溶解又は分散することが可能な溶剤を添加することができる。例えば、メチルエチルケトン、メチルアミルケトン、ジエチルケトン、アセトン、メチルイソプロピルケトン、メチルイソブチルケトン、シクロヘキサノン及び2−ヘプタノン等のケトン類;エチルエーテル、ジオキサン、テトラヒドロフラン、1,2−ジメトキシエタン、1,2−ジエトキシエタン及びジプロピレングリコールジメチルエーテル等のエーテル系溶剤;酢酸メチル、酢酸エチル、酢酸−n−プロピル、酢酸イソプロピル、酢酸n−ブチル、酢酸シクロヘキシル、乳酸エチル、コハク酸ジメチル及びテキサノール等のエステル系溶剤;エチレングリコールモノメチルエーテル及びエチレングリコールモノエチルエーテル等のセロソルブ系溶剤;メタノール、エタノール、イソ−又はn−プロパノール、イソ−又はn−ブタノール及びアミルアルコール等のアルコール系溶剤;エチレングリコールモノメチルアセテート、エチレングリコールモノエチルアセテート、プロピレングリコール−1−モノメチルエーテル−2−アセテート(PGMEA)、ジプロピレングリコールモノメチルエーテルアセテート、3−メトキシブチルアセテート及びエトキシエチルプロピオネート等のエーテルエステル系溶剤;ベンゼン、トルエン及びキシレン等のBTX系溶剤;ヘキサン、ヘプタン、オクタン及びシクロヘキサン等の脂肪族炭化水素系溶剤;テレピン油、D−リモネン及びピネン等のテルペン系炭化水素油;ミネラルスピリット、スワゾール#310(コスモ松山石油社製)及びソルベッソ#100(エクソン化学社製)等のパラフィン系溶剤;四塩化炭素、クロロホルム、トリクロロエチレン、塩化メチレン及び1,2−ジクロロエタン等のハロゲン化脂肪族炭化水素系溶剤;クロロベンゼン等のハロゲン化芳香族炭化水素系溶剤;カルビトール系溶剤、アニリン、トリエチルアミン、ピリジン、酢酸、アセトニトリル、二硫化炭素、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N−メチルピロリドン、ジメチルスルホキシド及び水等が挙げられ、これらの溶剤は1種又は2種以上の混合溶剤として使用することができる。これらの中でもケトン類、エーテルエステル系溶剤等、特にプロピレングリコール−1−モノメチルエーテル−2−アセテート(PGMEA)及びシクロヘキサノン等が、上記の各成分と相溶性がよいので好ましい。 The curable composition contains a solvent capable of dissolving or dispersing each of the above components (polymer (A), radical polymerization initiator (B) and ethylenically unsaturated compound (C)) as necessary. Can be added. For example, ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone and 2-heptanone; ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-di Ether solvents such as ethoxyethane and dipropylene glycol dimethyl ether; ester solvents such as methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate and texanol; Cellosolve solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; methanol, ethanol, iso- or n-propanol, iso- or n-butanol And alcohol solvents such as amyl alcohol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate and ethoxyethyl Ether ester solvents such as propionate; BTX solvents such as benzene, toluene and xylene; Aliphatic hydrocarbon solvents such as hexane, heptane, octane and cyclohexane; Terpene carbonization such as turpentine oil, D-limonene and pinene Hydrogen oil; paraffinic solvents such as mineral spirits, Swazol # 310 (manufactured by Cosmo Matsuyama Oil Co., Ltd.) and Solvesso # 100 (manufactured by Exxon Chemical); carbon tetrachloride, chloroform Halogenated aliphatic hydrocarbon solvents such as trichloroethylene, methylene chloride and 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, Examples thereof include carbon sulfide, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide and water, and these solvents can be used as one kind or a mixture of two or more kinds. . Among these, ketones, ether ester solvents, etc., particularly propylene glycol-1-monomethyl ether-2-acetate (PGMEA) and cyclohexanone are preferable because they are compatible with the above-described components.
本発明のラジカル重合性組成物において、溶剤の含有量は、特に限定されるものではないが、ハンドリングが良好になることから溶剤以外の組成物の濃度(以下、固形分とも記載)が5〜50質量%になることが好ましく、より好ましくは、10〜30質量%である。5質量%より小さい場合、十分な膜厚の硬化物が得られない場合があり、50質量%より大きいとラジカル重合性組成物の粘度が上がり、良好なハンドリングが得られない場合がある。例えば透明絶縁膜を形成する場合には、溶剤(D)の含有量は、溶剤以外の組成物の濃度が5〜50質量%になることが好ましく、より好ましくは、10〜30質量%である。5質量%より小さい場合、十分な膜厚の硬化物が得られない場合があり、50質量%より大きいとラジカル重合性組成物の粘度が上がり、良好なハンドリングが得られない場合がある。 In the radically polymerizable composition of the present invention, the content of the solvent is not particularly limited, but since the handling becomes good, the concentration of the composition other than the solvent (hereinafter also referred to as solid content) is 5 to 5. The amount is preferably 50% by mass, more preferably 10 to 30% by mass. When the amount is less than 5% by mass, a cured product having a sufficient film thickness may not be obtained. When the amount is more than 50% by mass, the radical polymerizable composition may increase in viscosity, and good handling may not be obtained. For example, when a transparent insulating film is formed, the content of the solvent (D) is preferably 5 to 50% by mass, more preferably 10 to 30% by mass of the composition other than the solvent. . When the amount is less than 5% by mass, a cured product having a sufficient film thickness may not be obtained. When the amount is more than 50% by mass, the radical polymerizable composition may increase in viscosity, and good handling may not be obtained.
本発明のラジカル重合性組成物には、必要に応じて、上記一般式(II)で表されるラジカル重合開始剤以外の開始剤;p−アニソール、ハイドロキノン、ピロカテコール、t−ブチルカテコール及びフェノチアジン等の熱重合抑制剤;可塑剤;接着促進剤;充填剤;消泡剤;カップリング剤;レベリング剤;表面調整剤;酸化防止剤;紫外線吸収剤;分散助剤;凝集防止剤;触媒;効果促進剤;架橋剤及び増粘剤等の慣用の添加物を加えることができる。 In the radically polymerizable composition of the present invention, if necessary, an initiator other than the radical polymerization initiator represented by the general formula (II); p-anisole, hydroquinone, pyrocatechol, t-butylcatechol and phenothiazine A thermal polymerization inhibitor such as a plasticizer; an adhesion promoter; a filler; an antifoaming agent; a coupling agent; a leveling agent; a surface conditioner; an antioxidant; an ultraviolet absorber; a dispersion aid; Effect promoters: Conventional additives such as crosslinking agents and thickeners can be added.
上記カップリング剤を添加することにより、硬化物と基材間の密着性を向上するので好ましい。例えば、ジメチルジメトキシシラン、ジメチルジエトキシシラン、メチルエチルジメトキシシラン、メチルエチルジエトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリメトキシシラン等のアルキル官能性アルコキシシラン、ビニルトリクロロシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、アリルトリメトキシシラン等のアルケニル官能性アルコキシシラン、3−メタクリロキシプロピルトリエトキシシラン、3−メタクリロキシプロピルトリメトキシシラン、3−メタクリロキシプロピルメチルジエトキシシラン、3−メタクリロキシプロピルメチルジメトキシシラン、2−メタクリロキシプロピルトリメトキシシラン等の(メタ)アクリル酸エステル官能性アルコキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−グリシドキシプロピルメチルジエトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−(3,4−エポキシシクロヘキシル)プロピルトリメトキシシラン等のエポキシ官能性アルコキシシラン、N−β(アミノエチル)−γ−アミノプロピルトリメトキシシラン、γ−アミノプロピルトリエトキシシラン、N−フェニル−γ −アミノプロピルトリメトキシシラン等のアミノ官能性アルコキシシラン、γ−メルカプトプロピルトリメトキシシラン等のメルカプト官能性アルコキシシラン、3−イソシアネートプロピルトリエトキシシラン等のイソシアネート官能性アルコキシシラン、3−ウレイドプロピルトリアルコキシシラン等のウレイド官能性アルコキシシラン、トリス−(トリメトキシシリルプロピル)イソシアヌレート等のイソシアヌレート官能性アルコキシシラン、チタンテトライソプロポキシド、チタンテトラノルマルブトキシド等のチタンアルコキシド類、チタンジオクチロキシビス(オクチレングリコレート)、チタンジイソプロポキシビス(エチルアセトアセテート)等のチタンキレート類、ジルコニウムテトラアセチルアセトネート、ジルコニウムトリブトキシモノアセチルアセトネート等のジルコニウムキレート類、ジルコニウムトリブトキシモノステアレート等のジルコニウムアシレート類、メチルトリイソシアネートシラン等のイソシアネートシラン類等を用いることができる。 It is preferable to add the coupling agent because the adhesion between the cured product and the substrate is improved. For example, dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltrimethoxysilane, and other alkyl functional alkoxysilanes, vinyl Alkenyl functional alkoxysilanes such as trichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldi (Meth) acrylic acid ester functionality such as ethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane Alkoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (3,4-epoxycyclohexyl) propyl Amino functionality such as epoxy-functional alkoxysilanes such as trimethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane -Functional alkoxysilanes, mercapto-functional alkoxysilanes such as γ-mercaptopropyltrimethoxysilane, isocyanate-functional alkoxysilanes such as 3-isocyanatopropyltriethoxysilane, and urethanes such as 3-ureidopropyltrialkoxysilane Functional alkoxysilanes, isocyanurate functional alkoxysilanes such as tris- (trimethoxysilylpropyl) isocyanurate, titanium alkoxides such as titanium tetraisopropoxide, titanium tetranormal butoxide, titanium dioctyloxybis (octyleneglycol) Rate), titanium chelates such as titanium diisopropoxybis (ethyl acetoacetate), zirconium chelates such as zirconium tetraacetylacetonate and zirconium tributoxymonoacetylacetonate, and zirconium acylates such as zirconium tributoxymonostearate Isocyanate silanes such as methyl triisocyanate silane can be used.
上記カップリング剤としては市販品を用いることができ、例えば、KA−1003、KBM−1003、KBE−1003、KBM−303、KBM−403、KBE−402、KBE−403、KBM−1403、KBM−502、KBM−503、KBE−502、KBE−503、KBM−5103、KBM−602、KBM−603、KBE−603,KBM−903,KBE−903,KBE−9103,KBM−573、KBM−575、KBM−6123、KBE−585、KBM−703、KBM−802、KBM−803、KBE−846、KBE−9007、KBM−04、KBE−04、KBM−13、KBE−13、KBE−22、KBE−103、HMDS−3、KBM−3063、KBM−3103C、KPN−3504及びKF−99(信越シリコーン製)等が挙げられる。 A commercial item can be used as said coupling agent, for example, KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403, KBM- 502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, KBE-603, KBM-903, KBE-903, KBE-903, KBM-573, KBM-575, KBM-6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007, KBM-04, KBE-04, KBM-13, KBE-13, KBE-22, KBE- 103, HMDS-3, KBM-3063, KBM-3103C, KPN 3504 and KF-99 (manufactured by Shin-Etsu Silicone), and the like.
本発明のラジカル重合性組成物には、更に、連鎖移動剤、増感剤、界面活性剤及びメラミン等を併用することができる。 In the radically polymerizable composition of the present invention, a chain transfer agent, a sensitizer, a surfactant, melamine, and the like can be further used in combination.
上記連鎖移動剤、増感剤としては、一般的に硫黄原子含有化合物が用いられる。例えばチオグリコール酸、チオリンゴ酸、チオサリチル酸、2−メルカプトプロピオン酸、3−メルカプトプロピオン酸、3−メルカプト酪酸、N−(2−メルカプトプロピオニル)グリシン、2−メルカプトニコチン酸、3−[N−(2−メルカプトエチル)カルバモイル]プロピオン酸、3−[N−(2−メルカプトエチル)アミノ]プロピオン酸、N−(3−メルカプトプロピオニル)アラニン、2−メルカプトエタンスルホン酸、3−メルカプトプロパンスルホン酸、4−メルカプトブタンスルホン酸、ドデシル(4−メチルチオ)フェニルエーテル、2−メルカプトエタノール、3−メルカプト−1,2−プロパンジオール、1−メルカプト−2−プロパノール、3−メルカプト−2−ブタノール、メルカプトフェノール、2−メルカプトエチルアミン、2−メルカプトイミダゾール、2−メルカプトベンゾイミダゾール、2−メルカプト−3−ピリジノール、2−メルカプトベンゾチアゾール、メルカプト酢酸、トリメチロールプロパントリス(3−メルカプトプロピオネート)及びペンタエリスリトールテトラキス(3−メルカプトプロピオネート)等のメルカプト化合物;該メルカプト化合物を酸化して得られるジスルフィド化合物、ヨード酢酸、ヨードプロピオン酸、2−ヨードエタノール、2−ヨードエタンスルホン酸、3−ヨードプロパンスルホン酸等のヨード化アルキル化合物、トリメチロールプロパントリス(3−メルカプトイソブチレート)、ブタンジオールビス(3−メルカプトイソブチレート)、ヘキサンジチオール、デカンジチオール、1,4−ジメチルメルカプトベンゼン、ブタンジオールビスチオプロピオネート、ブタンジオールビスチオグリコレート、エチレングリコールビスチオグリコレート、トリメチロールプロパントリスチオグリコレート、ブタンジオールビスチオプロピオネート、トリメチロールプロパントリスチオプロピオネート、トリメチロールプロパントリスチオグリコレート、ペンタエリスリトールテトラキスチオプロピオネート、ペンタエリスリトールテトラキスチオグリコレート、トリスヒドロキシエチルトリスチオプロピオネート、下記化合物No.D1、昭和電工社製カレンズPE1及びNR1等が挙げられる。 As the chain transfer agent and sensitizer, a sulfur atom-containing compound is generally used. For example, thioglycolic acid, thiomalic acid, thiosalicylic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, N- (2-mercaptopropionyl) glycine, 2-mercaptonicotinic acid, 3- [N- ( 2-mercaptoethyl) carbamoyl] propionic acid, 3- [N- (2-mercaptoethyl) amino] propionic acid, N- (3-mercaptopropionyl) alanine, 2-mercaptoethanesulfonic acid, 3-mercaptopropanesulfonic acid, 4-mercaptobutanesulfonic acid, dodecyl (4-methylthio) phenyl ether, 2-mercaptoethanol, 3-mercapto-1,2-propanediol, 1-mercapto-2-propanol, 3-mercapto-2-butanol, mercaptophenol , 2-me Captoethylamine, 2-mercaptoimidazole, 2-mercaptobenzimidazole, 2-mercapto-3-pyridinol, 2-mercaptobenzothiazole, mercaptoacetic acid, trimethylolpropane tris (3-mercaptopropionate) and pentaerythritol tetrakis (3- Mercapto compounds such as mercaptopropionate); iodo such as disulfide compounds obtained by oxidizing the mercapto compound, iodoacetic acid, iodopropionic acid, 2-iodoethanol, 2-iodoethanesulfonic acid, 3-iodopropanesulfonic acid, etc. Alkyl compound, trimethylolpropane tris (3-mercaptoisobutyrate), butanediol bis (3-mercaptoisobutyrate), hexanedithiol, decanedithiol, 1,4 Dimethyl mercaptobenzene, butanediol bisthiopropionate, butanediol bisthioglycolate, ethylene glycol bisthioglycolate, trimethylolpropane tristhioglycolate, butanediol bisthiopropionate, trimethylolpropane tristhiopropionate , Trimethylolpropane tristhioglycolate, pentaerythritol tetrakisthiopropionate, pentaerythritol tetrakisthioglycolate, trishydroxyethyl tristhiopropionate, the following compound no. D1, Showa Denko Co., Ltd. Karenz PE1 and NR1 etc. are mentioned.
上記増感剤の具体例としては、ベンゾフェノン、p,p ’− テトラメチルジアミノベンゾフェノン、p,p ’− テトラエチルアミノベンゾフェノン、2−クロロチオキサントン、アントロン、9−エトキシアントラセン、アントラセン、ピレン、ペリレン、フェノチアジン、ベンジル、アクリジンオレンジ、ベンゾフラビン、セトフラビン−T、9 , 1 0−ジフェニルアントラセン、9−フルオレノン、アセトフェノン、フェナントレン、2−ニトロフルオレン、5−ニトロアセナフテン、ベンゾキノン、2−クロロ−4−ニトロアニリン、N−アセチル−p−ニトロアニリン、p−ニトロアニリン、N−アセチル−4−ニトロ−1− ナフチルアミン、ピクラミド、アントラキノン、2−エチルアントラキノン、2−tert− ブチルアントラキノン、1,2−ベンズアンスラキノン、3−メチル−1,3−ジアザ−1,9−ベンズアンスロン、ジベンザルアセトン、1,2−ナフトキノン、3 ,3’−カルボニル−ビス( 5,7−ジメトキシカルボニルクマリン)及びコロネン等が挙げられる。 Specific examples of the sensitizer include benzophenone, p, p′-tetramethyldiaminobenzophenone, p, p′-tetraethylaminobenzophenone, 2-chlorothioxanthone, anthrone, 9-ethoxyanthracene, anthracene, pyrene, perylene, phenothiazine. , Benzyl, acridine orange, benzoflavin, cetoflavin-T, 9,10-diphenylanthracene, 9-fluorenone, acetophenone, phenanthrene, 2-nitrofluorene, 5-nitroacenaphthene, benzoquinone, 2-chloro-4-nitroaniline N-acetyl-p-nitroaniline, p-nitroaniline, N-acetyl-4-nitro-1-naphthylamine, picramide, anthraquinone, 2-ethylanthraquinone, 2-tert-butyl Nthraquinone, 1,2-benzanthraquinone, 3-methyl-1,3-diaza-1,9-benzanthrone, dibenzalacetone, 1,2-naphthoquinone, 3,3′-carbonyl-bis (5,7 -Dimethoxycarbonylcoumarin) and coronene.
上記界面活性剤としては、パーフルオロアルキルリン酸エステル、パーフルオロアルキルカルボン酸塩等のフッ素界面活性剤、高級脂肪酸アルカリ塩、アルキルスルホン酸塩、アルキル硫酸塩等のアニオン系界面活性剤、高級アミンハロゲン酸塩、第四級アンモニウム塩等のカチオン系界面活性剤、ポリエチレングリコールアルキルエーテル、ポリエチレングリコール脂肪酸エステル、ソルビタン脂肪酸エステル及び脂肪酸モノグリセリド等の非イオン界面活性剤、両性界面活性剤及びシリコーン系界面活性剤等の界面活性剤を用いることができ、これらは組み合わせて用いてもよい。 Examples of the surfactant include fluorine surfactants such as perfluoroalkyl phosphates and perfluoroalkyl carboxylates, anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates, and alkyl sulfates, and higher amines. Cationic surfactants such as halogenates and quaternary ammonium salts, nonionic surfactants such as polyethylene glycol alkyl ethers, polyethylene glycol fatty acid esters, sorbitan fatty acid esters and fatty acid monoglycerides, amphoteric surfactants and silicone surfactants Surfactants such as agents can be used, and these may be used in combination.
上記メラミン化合物としては、(ポリ)メチロールメラミン、(ポリ)メチロールグリコールウリル、(ポリ)メチロールベンゾグアナミン及び(ポリ)メチロールウレア等の窒素化合物中の活性メチロール基(CH2OH基)の全部又は一部(少なくとも2つ)がアルキルエーテル化された化合物を挙げることができる。ここで、アルキルエーテルを構成するアルキル基としては、メチル基、エチル基及びブチル基等が挙げられ、互いに同一であってもよいし、異なっていてもよい。また、アルキルエーテル化されていないメチロール基は、一分子内で自己縮合していてもよく、二分子間で縮合して、その結果オリゴマー成分が形成されていてもよい。具体的には、ヘキサメトキシメチルメラミン、ヘキサブトキシメチルメラミン、テトラメトキシメチルグリコールウリル及びテトラブトキシメチルグリコールウリル等を用いることができる。これらのなかでも、ヘキサメトキシメチルメラミン及びヘキサブトキシメチルメラミン等のアルキルエーテル化されたメラミンが好ましい。 Examples of the melamine compound include all or part of active methylol groups (CH 2 OH groups) in nitrogen compounds such as (poly) methylol melamine, (poly) methylol glycoluril, (poly) methylol benzoguanamine, and (poly) methylol urea. Mention may be made of compounds in which (at least two) are alkyl etherified. Here, examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group, and a butyl group, and they may be the same as or different from each other. Moreover, the methylol group which is not alkyletherified may be self-condensed within one molecule, or may be condensed between two molecules, and as a result, an oligomer component may be formed. Specifically, hexamethoxymethyl melamine, hexabutoxymethyl melamine, tetramethoxymethyl glycoluril, tetrabutoxymethyl glycoluril, and the like can be used. Among these, alkyl etherified melamines such as hexamethoxymethyl melamine and hexabutoxymethyl melamine are preferable.
本発明のラジカル重合性組成物において、ポリマー(A)、ラジカル重合開始剤(B)、及びエチレン性不飽和化合物(C)を除く任意成分の含有量は、その使用目的に応じて適宜選択され特に制限されないが、好ましくは、ラジカル重合性組成物の固形分100質量部に対して合計で20質量部以下とする。任意成分の含有量が20質量部を超えると本発明の効果が十分に発現できない場合がある。 In the radically polymerizable composition of the present invention, the content of optional components other than the polymer (A), the radical polymerization initiator (B), and the ethylenically unsaturated compound (C) is appropriately selected according to the purpose of use. Although it does not restrict | limit in particular, Preferably, it is 20 mass parts or less in total with respect to 100 mass parts of solid content of a radically polymerizable composition. When content of an arbitrary component exceeds 20 mass parts, the effect of this invention may not fully be expressed.
本発明のラジカル重合性組成物は、硬化性塗料或いはワニス、接着剤、印刷インク、ゲルコート、電子工学用のフォトレジスト、電気メッキレジスト、エッチングレジスト、液状及び乾燥膜の双方、はんだレジスト、LCDの製造工程において構造を形成するためのレジスト、電気及び電子部品を封入するための組成物、ソルダーレジスト、ガラス繊維ケーブルコーティング、ステレオリトグラフィによって三次元物体を製造するための材料、ホログラフィ記録用材料、画像記録材料、微細電子回路、脱色材料、画像記録材料のための脱色材料、マイクロカプセルを使用する画像記録材料用の脱色材料、印刷配線板用フォトレジスト材料、UV及び可視レーザー直接画像系用のフォトレジスト材料及びプリント回路基板の逐次積層における誘電体層形成に使用するフォトレジスト材料等の各種の用途に使用することができ、その用途に特に制限はない。 The radically polymerizable composition of the present invention is a curable paint or varnish, adhesive, printing ink, gel coat, electronic photoresist, electroplating resist, etching resist, both liquid and dry film, solder resist, LCD Resists for forming structures in the manufacturing process, compositions for encapsulating electrical and electronic components, solder resists, glass fiber cable coatings, materials for producing three-dimensional objects by stereolithography, holographic recording materials, Image recording materials, fine electronic circuits, bleaching materials, bleaching materials for image recording materials, bleaching materials for image recording materials using microcapsules, photoresist materials for printed wiring boards, UV and visible lasers for direct imaging systems Induction in sequential lamination of photoresist materials and printed circuit boards. Can be used in various applications of the photoresist material and the like used in the body layer forming, there is no particular limitation on the application.
本発明の硬化物の製造方法について、好ましい塗布方法、硬化方法及び硬化条件を以下に示す。 About the manufacturing method of the hardened | cured material of this invention, a preferable coating method, a hardening method, and hardening conditions are shown below.
本発明のラジカル重合性組成物は、スピンコーター、ロールコーター、バーコーター、ダイコーター、カーテンコーター、各種の印刷、浸漬等の公知の手段で、ジアセチルセルロース、トリアセチルセルロース(TAC)、プロピオニルセルロース、ブチリルセルロース、アセチルプロピオニルセルロース、ニトロセルロース等のセルロースエステル;ポリアミド;ポリカーボネート;ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンテレフタレート、ポリ−1,4−シクロヘキサンジメチレンテレフタレート、ポリエチレン−1,2−ジフェノキシエタン−4,4'−ジカルボキシレート、ポリブチレンテレフタレート等のポリエステル;ポリスチレン;ポリエチレン、ポリプロピレン、ポリメチルペンテン等のポリオレフィン;ポリメチルメタクリレート等のアクリル系樹脂;ポリカーボネート;ポリスルホン;ポリエーテルスルホン;ポリエーテルケトン;ポリエーテルイミド;ポリオキシエチレン、ノルボルネン樹脂等のプラスチック;ソーダガラス及び石英ガラス等のガラス;半導体基板;金属;及び紙等の支持基体上に適用することができる。また、一旦フィルム等の支持基体上に施した後、他の支持基体上に転写することもでき、その適用方法に制限はない。 The radical polymerizable composition of the present invention is a known method such as spin coater, roll coater, bar coater, die coater, curtain coater, various printing, dipping, diacetyl cellulose, triacetyl cellulose (TAC), propionyl cellulose, Cellulose esters such as butyrylcellulose, acetylpropionylcellulose, nitrocellulose; polyamides; polycarbonates; polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxyethane Polyester such as -4,4'-dicarboxylate, polybutylene terephthalate, etc .; polystyrene; poly, such as polyethylene, polypropylene, polymethylpentene Olefin; Acrylic resin such as polymethyl methacrylate; Polycarbonate; Polysulfone; Polyethersulfone; Polyetherketone; Polyetherimide; Plastic such as polyoxyethylene and norbornene resin; Glass such as soda glass and quartz glass; Semiconductor substrate; Metal And can be applied on a supporting substrate such as paper. Moreover, after once applying on support bases, such as a film, it can also transfer on another support base | substrate, There is no restriction | limiting in the application method.
また、本発明の着色組成物を硬化させる際に用いられる活性光の光源としては、波長300〜450nmの光を発光するものを用いることができ、例えば、超高圧水銀、水銀蒸気アーク、カーボンアーク及びキセノンアーク等を用いることができる。 Moreover, as the light source of the active light used when curing the colored composition of the present invention, one that emits light having a wavelength of 300 to 450 nm can be used, for example, ultrahigh pressure mercury, mercury vapor arc, carbon arc. And a xenon arc etc. can be used.
更に、露光光源にレーザー光を用いることにより、マスクを用いずに、コンピューター等のデジタル情報から直接画像を形成するレーザー直接描画法が、生産性のみならず、解像性や位置精度等の向上も図れることから有用であり、そのレーザー光としては、340〜430nmの波長の光が好適に使用されるが、アルゴンイオンレーザー、ヘリウムネオンレーザー、YAGレーザー、及び半導体レーザー等の可視から赤外領域の光を発するものも用いられる。これらのレーザーを使用する場合には、可視から赤外の当該領域を吸収する増感色素が加えられる。 Furthermore, by using laser light as the exposure light source, the laser direct drawing method that directly forms an image from digital information such as a computer without using a mask improves not only productivity but also resolution and positional accuracy. As the laser light, light having a wavelength of 340 to 430 nm is preferably used, but an argon ion laser, a helium neon laser, a YAG laser, a semiconductor laser, etc. are visible to infrared region. Those that emit light are also used. When these lasers are used, a sensitizing dye that absorbs the region from visible to infrared is added.
以下、硬化物の製造方法について具体例を挙げるが、本発明は下記の製造方法に限定されるものではない。
例えば、ガラス板に膜厚が2μmとなるようにスピンコーティングし、プレベイクとして110℃×2分焼成し、高圧水銀ランプにて100mJ/cm2露光、ポストベイクとして230℃×20分焼成し硬化物を作成した。
Hereinafter, although a specific example is given about the manufacturing method of hardened | cured material, this invention is not limited to the following manufacturing method.
For example, a glass plate is spin-coated so as to have a film thickness of 2 μm, baked at 110 ° C. for 2 minutes as a pre-bake, exposed to 100 mJ / cm 2 with a high-pressure mercury lamp, and baked at 230 ° C. for 20 minutes as a post-bake. Created.
本発明のラジカル重合性組成物を用いた硬化物は、プリント基板、カラーテレビ、PCモニタ、携帯情報端末、デジタルカメラ等のカラー表示の液晶表示パネルにおけるカラーフィルタ、CCDイメージセンサのカラーフィルタ、タッチパネル、プラズマ表示パネル用の電極材料、粉末コーティング、印刷版、高透明性絶縁膜、電気発光表示装置、磁気記録材料、微小機械部品、導波路、光スイッチ、めっき用マスク、エッチングマスク、ガラス繊維ケーブルコーティング、スクリーン印刷用ステンシル、及び保護膜等の各種の用途に使用することができ、その用途に特に制限はない。 Cured products using the radically polymerizable composition of the present invention include color filters in color display liquid crystal display panels such as printed boards, color televisions, PC monitors, personal digital assistants, digital cameras, color filters of CCD image sensors, and touch panels. , Electrode materials for plasma display panels, powder coatings, printing plates, highly transparent insulating films, electroluminescent display devices, magnetic recording materials, micro mechanical parts, waveguides, optical switches, plating masks, etching masks, glass fiber cables It can be used for various applications such as coating, stencil for screen printing, and protective film, and the application is not particularly limited.
本発明のラジカル重合性組成物を用いた硬化物は、上記用途の中でも、主に透明絶縁膜を形成する目的で使用され、該透明絶縁膜は、特にタッチパネル等の画像表示装置用の透明絶縁膜として有用である。 The cured product using the radically polymerizable composition of the present invention is used mainly for the purpose of forming a transparent insulating film among the above-mentioned uses, and the transparent insulating film is particularly transparent insulating for image display devices such as touch panels. Useful as a membrane.
以下、実施例等を挙げて本発明を更に詳細に説明するが、本発明はこれらの実施例に限定されるものではない。 EXAMPLES Hereinafter, although an Example etc. are given and this invention is demonstrated further in detail, this invention is not limited to these Examples.
[製造例1]ポリマー(A)No.1の調製
ジメチル−2,2’−[オキシビス(メチレン)]ジアクリレートを20質量部、メタクリル酸メチルを50質量部、メタクリル酸を65質量部、t−ブチルパーオキシ−2−エチルヘキサノエートを4質量部及びプロピレングリコールモノメチルエーテルアセテート(以下PGMEAとも記載する)100質量部を均一になるまで混合し、モノマー滴下層に充填した。他方、冷却管をつけたセパラブルフラスコからなる反応槽に、PGMEA130質量部を仕込み、窒素置換した後、攪拌しながらオイルバスで加熱し、反応槽の温度を90℃まで昇温させて同温度で安定させた。そして温度を90℃に保ちながら、120分間かけてモノマー滴下槽からモノマー滴下液を滴下した。滴下が終了してから60分後、反応槽を110℃に昇温させ、その状態で3時間維持した。更にその後、反応槽にガス導入管を介して酸素/窒素=5/95(v/v)混合ガスをバブリングしながら、反応槽に、メタクリル酸グリシジル30質量部、2,2’−メチレンビス(4−メチル−6−t−ブチルフェノール)0.2質量部、テトラフェニルホスフォニウムブロミド0.35質量部を仕込み、そのまま110℃で12時間反応させた後、室温まで冷却し、得られた重合体溶液をn−ヘキサンで再沈した後、減圧でn−ヘキサンを除去してポリマーを得た。その後、PGMEAに溶解させ、ポリマー成分が40wt%となるように調整し、ポリマー(A)No.1とした。
得られたポリマー(A)No.1の重量平均分子量は12000であり、酸価は70mgKOH/gであった。
[Production Example 1] Polymer (A) No. Preparation of 1 20 parts by mass of dimethyl-2,2 ′-[oxybis (methylene)] diacrylate, 50 parts by mass of methyl methacrylate, 65 parts by mass of methacrylic acid, t-butylperoxy-2-ethylhexanoate 4 parts by mass and 100 parts by mass of propylene glycol monomethyl ether acetate (hereinafter also referred to as PGMEA) were mixed until uniform and filled in the monomer dropping layer. On the other hand, 130 parts by mass of PGMEA was charged into a reaction vessel consisting of a separable flask equipped with a cooling tube, purged with nitrogen, heated with an oil bath while stirring, and the temperature of the reaction vessel was raised to 90 ° C. to the same temperature. And stabilized. And the monomer dropping liquid was dripped from the monomer dripping tank over 120 minutes, keeping temperature at 90 degreeC. Sixty minutes after the completion of dropping, the reaction vessel was heated to 110 ° C. and maintained in that state for 3 hours. Further, while bubbling a mixed gas of oxygen / nitrogen = 5/95 (v / v) through the gas introduction pipe into the reaction tank, 30 parts by mass of glycidyl methacrylate, 2,2′-methylenebis (4 -Methyl-6-tert-butylphenol) 0.2 parts by mass, tetraphenylphosphonium bromide 0.35 parts by mass, reacted as it is at 110 ° C. for 12 hours, cooled to room temperature, and obtained polymer After reprecipitating the solution with n-hexane, n-hexane was removed under reduced pressure to obtain a polymer. Thereafter, it was dissolved in PGMEA and adjusted so that the polymer component was 40 wt%. It was set to 1.
The obtained polymer (A) No. The weight average molecular weight of 1 was 12000, and the acid value was 70 mgKOH / g.
[製造例2]ポリマー(A)No.2の調製
重合槽に、溶媒としてPGMEA40.0質量部を仕込み、窒素雰囲気下に90℃に昇温した後、滴下系1としてベンジルマレイミド7質量部、PGMEA15質量部、メチルメタクリレート25質量部、メタクリル酸(MAA)12.55質量部、滴下系2として、パーブチルO(日本油脂製)0.6部、滴下系3としてn‐ドデシルメルカプタン(n−DM)1.2質量部を、それぞれ3時間かけて連続的に供給した。その後、30分90℃を保持した後、温度を105℃に昇温し、3時間重合を継続した。
続いてメタクリル酸グリシジル13質量部、触媒としてトリエチルアミン0.1質量部、重合禁止剤としてアンテージW400(川口化学工業製)0.1質量部を追加し、5%酸素濃度に調整した空気、窒素混合ガスを200ml/分の流量でバブリングしながら8時間反応を継続した。室温まで放冷後、固形分40wt%となるようにPGMEAを添加した。
ポリマー(A)No.2の平均分子量は7500であり、酸価は70mgKOH/gであった。
[Production Example 2] Polymer (A) No. Preparation of 2 In a polymerization tank, 40.0 parts by mass of PGMEA as a solvent was charged, and the temperature was raised to 90 ° C. in a nitrogen atmosphere. Then, 7 parts by mass of benzylmaleimide, 15 parts by mass of PGMEA, 25 parts by mass of methyl methacrylate, methacrylic Acid (MAA) 12.55 parts by mass, dropping system 2 as perbutyl O (manufactured by NOF Corporation) 0.6 parts, dropping system 3 as n-dodecyl mercaptan (n-DM) 1.2 parts by mass for 3 hours each Over time. Then, after maintaining 90 degreeC for 30 minutes, temperature was heated up to 105 degreeC and superposition | polymerization was continued for 3 hours.
Subsequently, 13 parts by mass of glycidyl methacrylate, 0.1 part by mass of triethylamine as a catalyst, and 0.1 part by mass of Antage W400 (manufactured by Kawaguchi Chemical Industry) as a polymerization inhibitor were added, and air and nitrogen mixed to adjust to 5% oxygen concentration The reaction was continued for 8 hours while bubbling gas at a flow rate of 200 ml / min. After allowing to cool to room temperature, PGMEA was added so that the solid content was 40 wt%.
Polymer (A) No. The average molecular weight of 2 was 7500, and the acid value was 70 mgKOH / g.
[製造例3]ポリマー(A)No.3の調製
ジメチル−2,2’−[オキシビス(メチレン)]ジアクリレートを20質量部、メタクリル酸メチルを50質量部、メタクリル酸を20質量部、t−ブチルパーオキシ−2−エチルヘキサノエートを4質量部及びPGMEA80質量部を均一になるまで混合し、モノマー滴下層に充填した。
他方、冷却管をつけたセパラブルフラスコからなる反応槽に、PGMEA130質量部を仕込み、窒素置換した後、攪拌しながらオイルバスで加熱し、反応槽の温度を90℃まで昇温させて同温度で安定させた。そして温度を90℃に保ちながら、120分間かけてモノマー滴下槽からモノマー滴下液を滴下した。滴下が終了してから60分後、反応槽を110℃に昇温させ、その状態で3時間維持した。更にその後、反応槽にガス導入管を介して酸素/窒素=5/95(v/v)混合ガスをバブリングしながら、反応槽に、メタクリル酸グリシジル30質量部、2,2’−メチレンビス(4−メチル−6−t−ブチルフェノール)0.2質量部、テトラフェニルホスフォニウムブロミド0.35質量部を仕込み、そのまま110℃で12時間反応させた後、室温まで冷却し、得られた重合体溶液をn−ヘキサンで再沈した後、減圧でn−ヘキサンを除去してポリマーを得た。その後、PGMEAに溶解させ、ポリマー成分が40wt%となるように調整し、ポリマー(A)No.3とした。
得られたポリマー(A)No.3の重量平均分子量は18000であり、酸価は2mgKOH/gであった。
[Production Example 3] Polymer (A) No. Preparation of 3 20 parts by mass of dimethyl-2,2 ′-[oxybis (methylene)] diacrylate, 50 parts by mass of methyl methacrylate, 20 parts by mass of methacrylic acid, t-butylperoxy-2-ethylhexanoate 4 parts by mass and 80 parts by mass of PGMEA were mixed until uniform, and filled in the monomer dropping layer.
On the other hand, 130 parts by mass of PGMEA was charged into a reaction vessel consisting of a separable flask equipped with a cooling tube, purged with nitrogen, heated with an oil bath while stirring, and the temperature of the reaction vessel was raised to 90 ° C. to the same temperature. And stabilized. And the monomer dropping liquid was dripped from the monomer dripping tank over 120 minutes, keeping temperature at 90 degreeC. Sixty minutes after the completion of dropping, the reaction vessel was heated to 110 ° C. and maintained in that state for 3 hours. Further, while bubbling a mixed gas of oxygen / nitrogen = 5/95 (v / v) through the gas introduction pipe into the reaction tank, 30 parts by mass of glycidyl methacrylate, 2,2′-methylenebis (4 -Methyl-6-tert-butylphenol) 0.2 parts by mass, tetraphenylphosphonium bromide 0.35 parts by mass, reacted as it is at 110 ° C. for 12 hours, cooled to room temperature, and obtained polymer After reprecipitating the solution with n-hexane, n-hexane was removed under reduced pressure to obtain a polymer. Thereafter, it was dissolved in PGMEA and adjusted so that the polymer component was 40 wt%. It was set to 3.
The obtained polymer (A) No. 3 had a weight average molecular weight of 18,000 and an acid value of 2 mgKOH / g.
[比較製造例1]エチレン性不飽和化合物No.1の製造
9,9−ビス(4−グリシジルオキシフェニル)フルオレン75.0g、アクリル酸23.8g、2,6−ジ−t−ブチル−p−クレゾール0.273g、テトラブチルアンモニウムクロリド0.585g、及びPGMEA65.9gを仕込み、90℃で1時間、100℃ で1時間、110℃ で1時間及び120℃ で14時間撹拌した。室温まで冷却し、無水コハク酸25.9g、テトラブチルアンモニウムクロリド0.427g、及びPGMEA1.37gを加えて、100℃ で5時間撹拌した。さらに、9,9−ビス(4
−グリシジルオキシフェニル)フルオレン30.0g、2,6−ジ−t−ブチル−p−クレゾール0.269g、及びPGMEA1.50gを加えて、90℃で90分、120℃で4時間撹拌後、PGMEA122.2gを加えて、PGMEA溶液として目的物であるエチレン性不飽和化合物No.1を得た(Mw=4190、Mn=2170,酸価(固形分)52mg・KOH/g)
[Comparative Production Example 1] Ethylenically unsaturated compound No. 1 Production of 1 9,9-bis (4-glycidyloxyphenyl) fluorene 75.0 g, acrylic acid 23.8 g, 2,6-di-t-butyl-p-cresol 0.273 g, tetrabutylammonium chloride 0.585 g And PGMEA 65.9 g, and stirred at 90 ° C. for 1 hour, 100 ° C. for 1 hour, 110 ° C. for 1 hour and 120 ° C. for 14 hours. After cooling to room temperature, 25.9 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride, and 1.37 g of PGMEA were added, and the mixture was stirred at 100 ° C. for 5 hours. Furthermore, 9,9-bis (4
-Glycidyloxyphenyl) fluorene 30.0 g, 2,6-di-t-butyl-p-cresol 0.269 g, and PGMEA 1.50 g were added, and after stirring at 90 ° C. for 90 minutes and 120 ° C. for 4 hours, PGMEA 122 .2 g is added, and the ethylenically unsaturated compound No. 1 as the target product as a PGMEA solution is added. 1 (Mw = 4190, Mn = 2170, acid value (solid content) 52 mg · KOH / g)
[実施例1〜8及び比較例1〜6]ラジカル重合組成物の調製
[表1]及び[表2]の配合に従って各成分を調製しラジカル重合性組成物(実施例1〜8及び比較例1〜6)を得た。尚、表中の数字は質量部を表す。また、表中の各成分の符号は、下記の成分を表す。
A-1 ポリマー(A)No.1(固形分40wt%PGMEA溶液)
A-2 ポリマー(A)No.2(固形分40wt%PGMEA溶液)
A-3 ポリマー(A)No.3(固形分40wt%PGMEA溶液)
B−1 アデカアークルズNCI−930
(オキシムエステル系ラジカル重合開始剤;ADEKA製)
B−2 IRGACURE OXE01
(オキシムエステル系ラジカル重合開始剤;BASF製)
C−1 カヤラッド DPHA(多官能アクリレート;日本化薬製)
C−2 SPC−3000(多官能アクリレート;昭和電工製)
C−3 エチレン性不飽和化合物No.1
(多官能アクリレート;固形分55wt%PGMEA溶液)
D−1 KBM−403(シランカップリング剤;信越化学製)
D−2 PGMEA
D−3 Irg−369
(α-アミノアルキルフェノン系ラジカル重合開始剤;BASF製)
D−4 Irg−907
(α-アミノアルキルフェノン系ラジカル重合開始剤;BASF製)
[Examples 1 to 8 and Comparative Examples 1 to 6] Preparation of radical polymerization composition
Each component was prepared according to the mixing | blending of [Table 1] and [Table 2], and the radically polymerizable composition (Examples 1-8 and Comparative Examples 1-6) was obtained. In addition, the number in a table | surface represents a mass part. Moreover, the code | symbol of each component in a table | surface represents the following component.
A-1 Polymer (A) No. 1 (Solid content 40 wt% PGMEA solution)
A-2 Polymer (A) No. 2 (Solid content 40 wt% PGMEA solution)
A-3 Polymer (A) No. 3 (Solid content 40 wt% PGMEA solution)
B-1 Adeka Arcles NCI-930
(Oxime ester radical polymerization initiator; manufactured by ADEKA)
B-2 IRGACURE OXE01
(Oxime ester radical polymerization initiator; manufactured by BASF)
C-1 Kayalad DPHA (polyfunctional acrylate; manufactured by Nippon Kayaku)
C-2 SPC-3000 (polyfunctional acrylate; Showa Denko)
C-3 ethylenically unsaturated compound No. 1 1
(Polyfunctional acrylate; solid content 55 wt% PGMEA solution)
D-1 KBM-403 (silane coupling agent; manufactured by Shin-Etsu Chemical)
D-2 PGMEA
D-3 Irg-369
(Α-aminoalkylphenone radical polymerization initiator; manufactured by BASF)
D-4 Irg-907
(Α-aminoalkylphenone radical polymerization initiator; manufactured by BASF)
[評価例1〜8及び比較評価例1〜6]
下記に示す硬化条件でそれぞれ硬化物を得た。得られた硬化物について透明性、耐薬品試験、体積抵抗率及び感度の評価を行った。結果を[表1]及び[表2]に示す。
[Evaluation Examples 1 to 8 and Comparative Evaluation Examples 1 to 6]
Each cured product was obtained under the following curing conditions. The resulting cured product was evaluated for transparency, chemical resistance test, volume resistivity and sensitivity. The results are shown in [Table 1] and [Table 2].
(感度)
露光量が30mJ/cm2で現像後のパターンの定着が良好となるものをAとし、露光量が40mJ/cm2で現像後のパターンの定着が不良で露光量が80mJ/cm2において現像後のパターンの定着が良好となるものをBとした。
(sensitivity)
When the exposure amount is 30 mJ / cm 2 and the pattern is fixed well after development, A is assumed. After the development when the exposure amount is 40 mJ / cm 2 and the pattern after development is poorly fixed and the exposure amount is 80 mJ / cm 2 . B was obtained when the pattern was fixed well.
(透明性)
硬化物が2μmとなるようにスピンコーティングし、プレベイクとして110℃×2分焼成し、高圧水銀ランプにて100mJ/cm2露光、ポストベイクとして230℃×20分焼成して得られた硬化物を作製した。得られた硬化物の、400nm透過率が95%以上あるものを○、95%未満のものを×とした。
(transparency)
Spin-coated so that the cured product has a thickness of 2 μm, baked at 110 ° C. for 2 minutes as a pre-bake, exposed to 100 mJ / cm 2 with a high-pressure mercury lamp, and baked at 230 ° C. for 20 minutes as a post-bake to produce a cured product did. The obtained cured product having a 400 nm transmittance of 95% or more was rated as “◯”, and the cured product having a transmittance of less than 95% as “×”.
(耐薬品試験)
硬化物が2μmとなるようにスピンコーティングし、プレベイクとして110℃×2分焼成し、高圧水銀ランプにて100mJ/cm2露光、ポストベイクとして230℃×20分焼成し硬化物を作製した。作製した硬化物の耐薬品試験は下記の方法で行った。
JIS D 0202の試験方法に従い、硬化物に基盤目状にクロスカットを入れた。次に、作製した硬化物を50℃王水に5分、40℃KOHに5分、45℃ Al酸水溶液(リン酸、硝酸水溶液) に5分及び80℃レジスト剥離液 N−300(ナガセケムテックス) 20分(5分×4回)に順番に浸漬し、水洗した。次いでセロハンテープによってピーリングテストを行い、基盤目の剥離の状態を目視により評価した。全く剥離が認められなかったものを○、剥離が認められたものを×とした。
(Chemical resistance test)
The cured product was spin-coated so as to have a thickness of 2 μm, fired at 110 ° C. for 2 minutes as a pre-baking, exposed to 100 mJ / cm 2 with a high-pressure mercury lamp, and fired at 230 ° C. for 20 minutes as a post-baking to produce a cured product. The chemical resistance test of the produced cured product was performed by the following method.
According to the test method of JIS D 0202, the cured product was cross-cut into a base shape. Next, the cured product thus prepared was placed in 50 ° C. aqua regia for 5 minutes, 40 ° C. in KOH for 5 minutes, 45 ° C. in an Al acid aqueous solution (phosphoric acid, nitric acid aqueous solution) in 5 minutes, and 80 ° C. resist stripping solution N-300 (Nagase Chem) Tex) It was immersed in order for 20 minutes (5 minutes × 4 times) and washed with water. Next, a peeling test was performed with a cellophane tape, and the peeled state of the base was visually evaluated. A sample in which no peeling was observed was marked with ○, and a sample in which peeling was observed was marked with ×.
(体積抵抗率)
クロム基板にクリア膜を2μmとなるようにスピンコーティングし、プレベイクとして110℃×2分焼成し、100mJ/cm2にて高圧水銀ランプにて露光、ポストベイクとして230℃×180分焼成して得られたクリア膜を、85℃、85%RHの高温高湿装置内に100時間静置した後、体積抵抗率の測定を行った。単位はΩ・cmである。
(Volume resistivity)
A clear film is spin-coated on a chromium substrate to a thickness of 2 μm, fired at 110 ° C. for 2 minutes as a pre-bake, exposed with a high-pressure mercury lamp at 100 mJ / cm 2 , and fired at 230 ° C. for 180 minutes as a post-bake. The clear film was allowed to stand in a high-temperature and high-humidity device at 85 ° C. and 85% RH for 100 hours, and then volume resistivity was measured. The unit is Ω · cm.
以上の結果より、本発明の硬化性組成物は、高感度で硬化物を形成でき、得られた硬化物が透明性、耐薬品性及び絶縁性に優れることが明らかである。よって、本発明のラジカル重合性組成物は、透明性を有する絶縁膜に対して特に有用である。 From the above results, it is clear that the curable composition of the present invention can form a cured product with high sensitivity, and the obtained cured product is excellent in transparency, chemical resistance and insulation. Therefore, the radically polymerizable composition of the present invention is particularly useful for an insulating film having transparency.
Claims (5)
有するポリマー(A)(以下、ポリマー(A)とも記載)と下記一般式(II)で表されるラジカル重合開始剤(B)(以下、ラジカル重合開始剤(B)とも記載)及びポリマー(A)を除くエチレン性不飽和化合物(C)(以下、エチレン性不飽和化合物(C)とも記載)を含有するラジカル重合性組成物。
上記炭素原子数1〜20のアルキル基及び炭素原子数7〜20のアリールアルキル基のアルキレン部分は更に置換基を有する場合があり、
上記炭素原子数1〜20のアルキル基及び炭素原子数7〜20のアリールアルキル基中のメチレン基は−O−、−S−、−NHCO−、−SO2−、−SS−、−SO−、−CO−又はOCO−で置換される場合もあり、
ポリマー(A)中に複数のR1及びR2が存在する場合、それぞれ同一の場合も異なる場合もある。)
R3及びR4で表される炭素原子数1〜20のアルキル基の末端は炭素原子数4〜10のシクロアルキル基である場合もあり、
R3及びR4で表される炭素原子数6〜20のアリール基は、炭素原子数1〜20のアルキル基又はORで置換される場合もあり、
Rは炭素原子数1〜20のアルキル基を表し、
Rで表される炭素原子数1〜20のアルキル基は、ハロゲン原子で置換される場合もあり、
Rで表される炭素原子数1〜20のアルキル基中のメチレン基は、−O−で置換される場合もあり、
R5、R6、R7、R8、R9、R10、R11、R12及びR13(以下、R5〜R13とも記載)は、それぞれ独立に、水素原子、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基、R14、OR15、SR16、NR17R18、COR19、SOR20、SO2R21又はCONR22R23を表し、
R14、R15、R16、R17、R18、R19、R20、R21、R22及びR23は、それぞれ独立に、炭素原子数1〜20のアルキル基、炭素原子数6〜20のアリール基、炭素原子数7〜20のアリールアルキル基又は炭素原子数2〜20の複素環含有基を表し、
R15で表される炭素原子数1〜20のアルキル基は、ハロゲン原子、ニトロ基、シアノ基、水酸基又はカルボキシル基で置換される場合もあり、
R19で表される炭素原子数6〜20のアリール基は、ニトロ基、OR'、炭素原子数1〜20のアルキル基又は炭素原子数2〜20の複素環含有基で置換される場合もあり、
R'は、炭素原子数1〜20のアルキル基を表し、
R'で表される炭素原子数1〜20のアルキル基は、その末端が、炭素原子数3〜10の複素環含有基である場合もあり、
X1は、酸素原子、硫黄原子、セレン原子、CR24R25、CO、NR26又はPR27を表し、
R24、R25、R26及びR27は、それぞれ独立に、炭素原子数1〜20のアルキル基、炭素原子数6〜20のアリール基、炭素原子数7〜20のアリールアルキル基、炭素原子数2〜20の複素環含有基を表し、
R26で表される炭素原子数6〜20のアリール基は、−C(R3)=N−O−C(=O)R4で置換される場合もあり、
X2は、単結合又はCOを表し、
R5とR6、R5とR24、R5とR25、R5とR26、R5とR27、R7とR8、R8とR9、R8とR24、R8とR25、R8とR26、R8とR27、R9とR10、R9とR24、R9とR25、R9とR26、R9とR27、R10とR11、R11とR12、R12とR13、R13とR24、R13とR25、R13とR26及びR13とR27は結合して環を形成する場合もある。) Polymer (A) having at least one skeleton selected from the group consisting of the following (Ia) and (Ib) (hereinafter also referred to as polymer (A)) and a radical polymerization initiator represented by the following general formula (II) ( B) radical polymerizability containing an ethylenically unsaturated compound (C) (hereinafter also referred to as ethylenically unsaturated compound (C)) excluding polymer (A) (hereinafter also referred to as radical polymerization initiator (B)). Composition.
The alkylene part of the alkyl group having 1 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms may further have a substituent,
The methylene group in the alkyl group having 1 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms is —O—, —S—, —NHCO—, —SO 2 —, —SS—, —SO—. , -CO- or OCO-,
When a plurality of R 1 and R 2 are present in the polymer (A), they may be the same or different. )
The terminal of the alkyl group having 1 to 20 carbon atoms represented by R 3 and R 4 may be a cycloalkyl group having 4 to 10 carbon atoms,
The aryl group having 6 to 20 carbon atoms represented by R 3 and R 4 may be substituted with an alkyl group having 1 to 20 carbon atoms or OR,
R represents an alkyl group having 1 to 20 carbon atoms,
The alkyl group having 1 to 20 carbon atoms represented by R may be substituted with a halogen atom,
The methylene group in the alkyl group having 1 to 20 carbon atoms represented by R may be substituted with -O-,
R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 and R 13 (hereinafter also referred to as R 5 to R 13 ) are each independently a hydrogen atom, halogen atom, nitro Represents a group, a cyano group, a hydroxyl group, a carboxyl group, R 14 , OR 15 , SR 16 , NR 17 R 18 , COR 19 , SOR 20 , SO 2 R 21 or CONR 22 R 23 ;
R 14 , R 15 , R 16 , R 17 , R 18 , R 19 , R 20 , R 21 , R 22 and R 23 are each independently an alkyl group having 1 to 20 carbon atoms or 6 to 6 carbon atoms. 20 represents an aryl group, an arylalkyl group having 7 to 20 carbon atoms or a heterocyclic ring-containing group having 2 to 20 carbon atoms,
The alkyl group having 1 to 20 carbon atoms represented by R 15 may be substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group or a carboxyl group,
The aryl group having 6 to 20 carbon atoms represented by R 19 may be substituted with a nitro group, OR ′, an alkyl group having 1 to 20 carbon atoms, or a heterocyclic group having 2 to 20 carbon atoms. Yes,
R ′ represents an alkyl group having 1 to 20 carbon atoms,
The terminal of the alkyl group having 1 to 20 carbon atoms represented by R ′ may be a heterocyclic ring-containing group having 3 to 10 carbon atoms,
X 1 represents an oxygen atom, a sulfur atom, a selenium atom, CR 24 R 25 , CO, NR 26 or PR 27 ,
R 24 , R 25 , R 26 and R 27 are each independently an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, or a carbon atom. Represents a heterocyclic group containing 2 to 20,
The aryl group having 6 to 20 carbon atoms represented by R 26 may be substituted with —C (R 3 ) ═N—O—C (═O) R 4 ,
X 2 represents a single bond or CO,
R 5 and R 6 , R 5 and R 24 , R 5 and R 25 , R 5 and R 26 , R 5 and R 27 , R 7 and R 8 , R 8 and R 9 , R 8 and R 24 , R 8 And R 25 , R 8 and R 26 , R 8 and R 27 , R 9 and R 10 , R 9 and R 24 , R 9 and R 25 , R 9 and R 26 , R 9 and R 27 , R 10 and R 11 , R 11 and R 12 , R 12 and R 13 , R 13 and R 24 , R 13 and R 25 , R 13 and R 26, and R 13 and R 27 may combine to form a ring. )
る請求項1記載のラジカル重合性組成物。
R29は、炭素原子数1〜20のアルカンジイル基を表し、
上記アルカンジイル基は更に置換基を有する場合があり、
上記アルカンジイル基中のメチレン基は-O-、-S−、−NHCO−、−SO2−、−SS−、−SO−、−CO−又はOCO−で置換される場合もあり、
ポリマー(A)中に複数のR28、R29及びR30が存在する場合、それぞれ同一の場合も異なる場合もある。) The radically polymerizable composition according to claim 1, wherein the polymer (A) further has a skeleton represented by the following (Ic).
R 29 represents an alkanediyl group having 1 to 20 carbon atoms,
The alkanediyl group may further have a substituent,
The methylene group in the alkanediyl group may be substituted with —O—, —S—, —NHCO—, —SO 2 —, —SS—, —SO—, —CO— or OCO—.
When a plurality of R 28 , R 29 and R 30 are present in the polymer (A), they may be the same or different. )
る請求項1又は2の何れか一項に記載のラジカル重合性組成物。
ポリマー(A)中に複数のR31が存在する場合、それぞれ同一の場合も異なる場合もある。) The radically polymerizable composition according to claim 1, wherein the polymer (A) further has a skeleton represented by (Id) below.
When a plurality of R 31 are present in the polymer (A), they may be the same or different. )
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