JP2016219335A - Led lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device capable of further reducing the thickness while reducing a ceiling through hole. An LED lighting device comprising a plurality of LED light emitting units 2 each including an LED chip 21 and a power source unit 5 for supplying power to the plurality of LED light emitting units 2 and fixed to a ceiling surface 81. The plurality of LED light emitting units 2 are all located on the indoor side of the ceiling surface 81, and at least a part of the power source unit 5 is positioned on the outdoor side of the ceiling surface 81. [Selection] Figure 4

Description

  The present invention relates to an LED lighting device fixed to a ceiling surface.

  Various LED illumination devices using LED chips as light sources have been proposed. Patent Document 1 discloses an LED illumination device used as a so-called downlight. This LED illumination device includes a plurality of LED chips and a power supply unit for lighting these LED chips. The plurality of LED chips and the power supply unit are disposed outside the room on the opposite side of the room from the ceiling surface. In order to realize such an arrangement, a ceiling through hole is provided on the ceiling surface. This ceiling through-hole needs to allow light from a plurality of LED chips to pass through. For this reason, a ceiling through-hole is made into the magnitude | size of the grade which substantially includes an LED lighting apparatus in planar view. Such a ceiling through hole has a problem that the heat insulating function to be performed by the ceiling is lowered.

  Patent Document 2 discloses another type of LED lighting device. In the LED lighting device, the plurality of LED chips and the power supply unit are all disposed on the indoor side of the ceiling surface. For this reason, what is necessary is just to provide the ceiling through-hole of the grade which lets a power feeding cable pass, for example in a ceiling surface. However, since the plurality of LED chips and the power supply unit are located on the indoor side, the LED lighting device has to protrude greatly to the indoor side.

Japanese Patent Laying-Open No. 2015-60832 JP2015-64947A

  The present invention has been conceived under the circumstances described above, and it is an object of the present invention to provide an LED lighting device capable of further reducing the thickness while reducing the ceiling through hole.

  The LED lighting device provided by the first aspect of the present invention includes a plurality of LED light emitting units each including an LED chip, and a power supply unit that supplies power to the plurality of LED light emitting units, and is provided on a ceiling surface. The plurality of LED light emitting units are all located on the indoor side of the ceiling surface, and at least a part of the power supply unit is located on the outdoor side of the ceiling surface. It is characterized by being located in.

  In a preferred embodiment of the present invention, the apparatus further comprises a case that houses the plurality of LED light emitting units, and a translucent cover that transmits light from the LED light emitting unit, and the ceiling surface of the case. The indoor part is comprised by the part located more indoors, and the said translucent cover.

  In a preferred embodiment of the present invention, the indoor portion has a circular shape in plan view.

  In preferable embodiment of this invention, the said translucent cover permeate | transmits, diffusing the light from these LED light emission parts.

  In a preferred embodiment of the present invention, the case is made of metal.

  In a preferred embodiment of the present invention, the power supply unit is connected to an external power supply path, and the power received at the connection unit is suitable for the plurality of LED light emitting units. A power conversion unit for converting to

  In a preferred embodiment of the present invention, all of the connection portions are located on the outdoor side of the ceiling surface.

  In a preferred embodiment of the present invention, all of the power conversion unit is located on the outdoor side of the ceiling surface.

  In a preferred embodiment of the present invention, a part of the power conversion unit is located on the outdoor side of the ceiling surface, and the other part is located on the indoor side of the ceiling surface. .

  In a preferred embodiment of the present invention, the power supply unit overlaps the center of the indoor portion in plan view.

  In preferable embodiment of this invention, the said power supply part is provided in the position which avoided the center of the said indoor part in planar view.

  In a preferred embodiment of the present invention, the power conversion unit is located between the connection unit and the indoor unit in a direction perpendicular to the ceiling surface.

  In preferable embodiment of this invention, the said connection part is supported in the state from which movement was blocked | prevented with respect to the said power conversion part.

  In a preferred embodiment of the present invention, the connection portion is supported so as to be movable with respect to the power conversion portion.

  In a preferred embodiment of the present invention, the connection part is supported by the power conversion part via a spring member.

  In a preferred embodiment of the present invention, the connection part and the power conversion part are located on the outdoor side of the ceiling surface and are provided at positions avoiding the indoor part in plan view.

  In preferable embodiment of this invention, the connecting cable which connects the said indoor part and the said power converter is further provided.

  In a preferred embodiment of the present invention, the power conversion unit and the connection unit are separately fixed to the indoor unit at different positions in plan view.

  In a preferred embodiment of the present invention, the power conversion part and the connection part are arranged on the same diameter of the indoor part and on opposite sides with respect to the center of the indoor part.

  In preferable embodiment of this invention, it has a pair of screw | thread for fixing the said indoor part to the said ceiling surface.

  In a preferred embodiment of the present invention, the pair of screws are arranged on opposite sides of the center of the indoor portion on the same diameter of the indoor portion.

  In a preferred embodiment of the present invention, the ceiling surface is formed with a circular ceiling through-hole for allowing the power supply unit to pass therethrough.

  In a preferred embodiment of the present invention, the diameter of the ceiling through hole is 10% to 50% of the diameter of the indoor portion.

  In preferable embodiment of this invention, the diameter of the said ceiling through-hole is 25 mm-50 mm.

  In preferable embodiment of this invention, the protrusion height from the said ceiling surface of the said indoor part is 5%-25% of the diameter of the said indoor part.

  In preferable embodiment of this invention, the protrusion height from the said ceiling surface of the said indoor part is 10 mm-20 mm.

  In a preferred embodiment of the present invention, an LED substrate on which the plurality of LED light emitting units are mounted is provided.

  In preferable embodiment of this invention, the said LED board is located in the room inner side rather than the said ceiling surface.

  In a preferred embodiment of the present invention, the plurality of LED light emitting units are surface-mounted on the LED substrate.

  In preferable embodiment of this invention, these LED light emission part is arrange | positioned concentrically.

  In a preferred embodiment of the present invention, the LED substrate has a circular shape in plan view.

  In a preferred embodiment of the present invention, each of the plurality of LED light emitting units includes the LED chip, a translucent resin that covers the LED chip, and a mounting terminal.

  In a preferred embodiment of the present invention, the translucent resin is mixed with a fluorescent material that emits light having a wavelength different from that of the light from the LED chip when excited by the light from the LED chip.

  The LED lighting device provided by the second aspect of the present invention includes a plurality of LED light emitting units each including an LED chip, a first surface, and a second surface, and the first surface is on the first surface. An LED lighting device comprising: an LED substrate on which the plurality of LED light emitting units are mounted; and a power supply unit that is formed on a second surface side of the LED substrate and supplies power to the plurality of LED light emitting units. In the plan view from the direction perpendicular to the second surface of the LED substrate, the power supply unit is included in the LED substrate, and the power supply unit and at least a part of the plurality of LED light emitting units overlap. It is characterized by having.

  In a preferred embodiment of the present invention, a main plate portion that holds the LED substrate from the second surface side, and a cylindrical portion that is connected to the main plate portion and accommodates at least a part of the power source portion. The cylindrical part covers the power supply part in a plan view from a direction perpendicular to the second surface of the LED board and is included in the board.

  In preferable embodiment of this invention, the translucent cover which permeate | transmits while diffusing the light from the said LED light emission part is provided.

  According to the present invention, at least a part of the power supply unit is arranged outside the ceiling surface, and not all of the power supply unit is included in the indoor unit. For this reason, the height which the said indoor part protrudes from the said ceiling surface can be restrained low. In addition, all of the plurality of LED light emitting units are disposed on the indoor side of the ceiling surface. For this reason, the ceiling through hole of the ceiling does not need to have a size that exposes all of the plurality of LED light emitting units in a plan view, and can be reduced to a size that allows a part of the power supply unit to pass through. It is. Therefore, it is possible to further reduce the thickness while reducing the ceiling through hole.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a perspective view which shows the LED lighting apparatus based on 1st Embodiment of this invention. It is a top view which shows the LED lighting apparatus of FIG. It is a bottom view which shows the LED lighting apparatus of FIG. It is sectional drawing which follows the IV-IV line of FIG. It is sectional drawing which shows an example of the LED light emission part of the LED lighting apparatus of FIG. It is a right view which shows an example of the power supply part of the LED lighting apparatus of FIG. It is a top view which shows the power supply part of FIG. It is sectional drawing which shows the modification of the LED lighting apparatus based on 1st Embodiment of this invention. It is a top view which shows the LED lighting apparatus based on 2nd Embodiment of this invention. It is a bottom view which shows the LED lighting apparatus of FIG. It is sectional drawing which follows the XX line of FIG. It is a top view which shows the LED lighting apparatus based on 3rd Embodiment of this invention. It is a bottom view which shows the LED lighting apparatus of FIG. It is sectional drawing which follows the XIV-XIV line | wire of FIG. It is a bottom view which shows the LED lighting apparatus based on 4th Embodiment of this invention. It is sectional drawing which follows the XVI-XVI line | wire of FIG. It is a bottom view which shows the LED lighting apparatus based on 5th Embodiment of this invention. It is sectional drawing which follows the XVIII-XVIII line of FIG. It is a bottom view which shows the LED lighting apparatus based on 6th Embodiment of this invention. It is sectional drawing which follows the XX-XX line of FIG. It is a bottom view which shows the LED lighting apparatus based on 7th Embodiment of this invention. It is sectional drawing which follows the XXII-XXII line | wire of FIG. It is sectional drawing which follows the XXIII-XXIII line | wire of FIG.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 4 show an LED lighting device according to a first embodiment of the present invention. The LED lighting device A1 according to the present embodiment includes a case 1, a plurality of LED light emitting units 2, an LED substrate 27, a translucent cover 3, and a power source unit 5. The LED lighting device A1 is a lighting device that is fixed to the ceiling surface 81 of the ceiling 8 and illuminates the room.

  FIG. 1 is a perspective view showing the LED illumination device A1. FIG. 2 is a plan view showing the LED illumination device A1. FIG. 3 is a bottom view showing the LED illumination device A1. 4 is a cross-sectional view taken along line IV-IV in FIG.

  In the following description, the indoor side in the direction perpendicular to the ceiling surface 81 may be referred to as the “lower” side, and the outdoor side may be referred to as the “upper” side. However, this does not limit the relationship between the LED lighting device according to the present invention and the vertical direction.

  Case 1 accommodates and supports a plurality of LED light emitting units 2, LED substrate 27, translucent cover 3, and power supply unit 5. The configuration of the case 1 is not particularly limited, but in the present embodiment, the case 1 includes a metal part 11 and a resin part 12.

The metal part 11 consists of metals, such as aluminum, for example. The metal part 11 of the present embodiment has a main plate part 111 and a cylindrical part 112. The main plate portion 111 is a plate-like portion having a circular shape in plan view, and is located on the indoor side of the ceiling surface 81 of the ceiling 8. The cylindrical portion 112 is connected to a through hole provided in the main plate portion 111. More specifically, the cylindrical portion 112 includes a cylindrical portion 1121 whose central axis is a direction from the through hole toward the outdoor side, and a bottom plate portion 1122 that closes the outdoor side end of the cylindrical portion 1121. Thereby, in this embodiment, the cylindrical part 112 is a bottomed cylindrical shape. However, the cylindrical portion 112 may be configured without the bottom plate portion 1122, and may be, for example, a rectangular tube shape. In addition, the cylindrical portion 112 is, in relation to the ceiling 8, a first portion 112 a located on the indoor side of the ceiling surface 81 of the ceiling 8, and a first portion located between the ceiling surface 81 of the ceiling 8 and the ceiling back surface 82. 2 part 112b and the 3rd part 112c located in an outdoor side rather than the ceiling back surface 82 are included. In FIG. 4, dotted lines surrounding each of the first part 112a, the second part 112b, and the third part 112c are shown. The boundary between adjacent dotted lines is slightly separated, but this is for convenience of understanding, and the first part 112a, the second part 112b, and the third part 112c are defined by the relative relationship between the ceiling surface 81 and the ceiling back surface 82. It is what is done. This also applies to the subsequent drawings.

  The resin portion 12 surrounds the main plate portion 111 of the metal portion 11 and has an annular shape in plan view. The resin portion 12 is made of a resin such as plastic.

  In the present embodiment, the heat insulating member 71 is provided in the gap between the main plate portion 111 of the metal portion 11 of the case 1 and the ceiling surface 81 of the ceiling 8. The heat insulating member 71 is made of, for example, a fiber heat insulating material typified by glass wool or a porous heat insulating material typified by polystyrene foam. With such a configuration, it is possible to suppress the movement of heat caused by the temperature difference between the room and the outside through the ceiling 8. Providing the ceiling through-hole 83 in the ceiling 8 is disadvantageous for suppressing such heat transfer, but by adopting the heat insulating member 71, an excessive change in room temperature can be avoided. In addition, in LED lighting apparatus A1, the structure which does not provide the heat insulation member 71 may be employ | adopted, and this is the same also in embodiment described below.

  Several LED light emission part 2 is a component which makes the light source of LED lighting apparatus A1. FIG. 5 is an enlarged cross-sectional view showing the LED light emitting unit 2 of the present embodiment. The LED light emitting unit 2 includes an LED chip 21, a pair of leads 22, a case 23, and a translucent resin 24.

  The LED chip 21 is made of, for example, a GaN-based semiconductor and emits blue light, for example. The translucent resin 24 covers the LED chip 21 and is made of, for example, a material in which a fluorescent material is mixed into a transparent resin. This fluorescent material emits yellow light when excited by blue light from the LED chip 21. The type and concentration of the fluorescent material are adjusted so that a white color such as a neutral white color is obtained by mixing the blue light from the LED chip 21 and the yellow light from the fluorescent material.

  The pair of leads 22 supports the LED chip 21 and serves as a conduction path to the LED chip 21 and is made of, for example, a Cu alloy. The bottom surfaces of the pair of leads 22 in the figure constitute the mounting terminals referred to in the present invention. The LED light emitting unit 2 is mounted on the LED substrate 27 by surface mounting.

  The case 23 is made of white resin, for example, and has a frame shape surrounding the LED chip 21. The inner surface of the case 23 functions as a reflector that emits light by reflecting light from the LED chip 21.

  The LED substrate 27 is a substrate on which a plurality of LED light emitting units 2 are mounted. As an example of such an LED board 27, the structure which has the base material which consists of glass epoxy resins, and the wiring pattern formed on this base material is mentioned. As shown in FIG. 4, the LED substrate 27 is located on the indoor side of the ceiling surface 81. The LED substrate 27 has a first surface 271 and a second surface 272. The first surface 271 is located on the indoor side with respect to the second surface 272. The plurality of LED light emitting units 2 are surface-mounted on the first surface 271 of the LED substrate 27. The plurality of LED light emitting units 2 are concentrically arranged in a plan view. The LED substrate 27 has a circular shape in plan view. The LED substrate 27 is attached to the peripheral end of the main plate portion 111 of the metal portion 11 of the case 1 and is held by the main plate portion 111 from the second surface 272 side. Further, the LED substrate 27 overlaps the main plate portion 111 in a plan view, and is the same size as or slightly smaller than the main plate portion 111. In the present embodiment, the center of the LED substrate 27 and the center of the cylindrical portion 112 of the metal portion 11 substantially coincide with each other in plan view. In plan view, the area of the LED substrate 27 is larger than the area of the ceiling through hole 83, the diameter of the LED substrate 27 is larger than the diameter of the ceiling through hole 83 of the ceiling 8, and the area of the LED substrate 27 is Is larger than the area of the power converter 52. Thereby, it is possible to secure the arrangement area of the LED light emitting section 2 while reducing the ceiling through hole 83 connecting the power supply cable 89 and the LED substrate 27, and higher luminance can be realized. The plurality of LED light emitting units 2 and the LED substrate 27 are located on the indoor side of the ceiling surface 81 of the ceiling 8. The LED substrate 27 is not limited to a circular shape in plan view, and may be, for example, a rectangular shape in plan view. Moreover, the ceiling through-hole 83 is not limited to a circular shape in plan view, and may be, for example, a rectangular shape in plan view.

  The translucent cover 3 transmits light from the plurality of LED light emitting units 2 and covers the plurality of LED light emitting units 2 in plan view. Moreover, in this embodiment, the translucent cover 3 permeate | transmits, diffusing the light from several LED light emission part 2. As shown in FIG. As such a translucent cover 3, what consists of translucent milky white resin is mentioned as an example, for example. The translucent cover 3 has a circular shape in plan view and is supported by the resin portion 12 of the case 1.

  Here, the part which comprises the external appearance of LED lighting apparatus A1 in the indoor side rather than the ceiling surface 81 among the external appearances of LED lighting apparatus A1 is called the indoor part 4. FIG. The indoor portion 4 includes a portion of the case 1 that is located on the indoor side of the ceiling surface 81 and the translucent cover 3. In the present embodiment, the resin portion 12 corresponds to a portion constituting the indoor portion 4 in the case 1. However, a part of the metal part 11 may constitute the indoor part 4 by exposing a part of the metal part 11 from the resin part 12. In the present embodiment, the indoor portion 4 has a circular shape in plan view.

  The power supply unit 5 is for supplying power to the plurality of LED light emitting units 2. In the present embodiment, the power supply unit 5 includes a connection unit 51 and a power conversion unit 52. The power supply unit 5 is formed on the second surface 272 side of the LED substrate 27. The power supply unit 5 is included in the LED board 27 in a plan view from the direction perpendicular to the second surface 272 of the LED board 27. Moreover, the power supply part 5 is covered with the cylindrical part 112 of the metal part 11 in planar view.

  The connection unit 51 is a part to be connected to a power supply cable 89 that is an external power supply path. In the present embodiment, the connection portion 51 includes a support member 511 and a connector 512. The connector 512 is a part that is directly connected to the power supply cable 89, and for example, a general-purpose connector is used. The support member 511 is a part that supports the connector 512.

  In the present embodiment, the support member 511 is attached to the outdoor side (upper side) with respect to the bottom plate portion 1122 of the cylindrical portion 112 of the metal portion 11 of the case 1, and is positioned immediately above the cylindrical portion 112. Yes. Further, the connector 512 is configured such that the power supply cable 89 is inserted from directly above.

  The power conversion unit 52 is for converting the power received at the connection unit 51 into power suitable for the plurality of LED light emitting units 2. For example, the input AC power is converted to constant DC power. Convert. FIG. 6 is a right side view showing the power supply unit 5, and FIG. 7 is a plan view showing the power supply unit 5. 6 is a view as seen from the direction of the VI line in FIG. As an example of the specifications of the power converter 52, the rated input voltage is about 100V, the rated output current is about 100mA, and the rated output voltage is 27V to 47V.

  The power conversion unit 52 of this embodiment includes a power supply substrate 521 and a plurality of electronic elements 522.

  The power supply substrate 521 is a substrate on which a plurality of electronic elements 522 are mounted. In the present embodiment, the power supply substrate 521 has a circular shape in plan view. The diameter of the power supply substrate 521 is, for example, 25 mm to 30 mm.

  The plurality of electronic elements 522 are elements constituting an electric circuit that realizes a power conversion function to be performed by the power conversion unit 52. In the present embodiment, the plurality of electronic elements 522 include a capacitor 523, a diode 524, a fuse 525, an IC 526, a coil 527, a chip resistor 528, a transformer 529, and a varistor 530. The plurality of electronic elements 522 include a rectifier diode bridge (not shown).

  Capacitor 523 has a capacity of about 6.8 μF and 33 μF, for example. The diode 524 is a fast recovery diode, and has a DC reverse voltage of about 400 V and an average rectified current of about 1A. The fuse 525 has a capacity of about 1.5A. The IC 526 has a built-in MOSFET and performs power conversion control. The coil 527 is a surface mount coil having a capacity of about 1.5 mH. The chip resistor 528 has a resistance value of about 75 kΩ to 510 kΩ. The transformer 529 is an element that performs a so-called transformer function. The varistor 530 is a so-called non-linear resistance element and has a withstand voltage of about 470V.

  The power conversion unit 52 has two input terminals 531 and two output terminals 532. The two input terminals 531 are terminals to which external AC power is input. The two output terminals 532 are terminals from which DC power is output to the plurality of LED light emitting units 2 via the LED substrate 27.

  As shown in FIG. 4, the power supply substrate 521 and the plurality of electronic elements 522 are accommodated in the cylindrical portion 112 of the metal portion 11 of the case 1. In the present embodiment, all of the connecting portions 51 are located outside the ceiling surface 81 of the ceiling 8. All of the power converters 52 are located outside the ceiling surface 81 of the ceiling 8. In addition, a part of the power conversion unit 52 is located outside the ceiling rear surface 82 of the ceiling 8. As shown in FIG. 3, the power supply unit 5 is provided at a position overlapping the center of the indoor portion 4 in plan view. In the present embodiment, the connection unit 51 and the power conversion unit 52 are connected via a connection cable 571. In addition, the power conversion unit 52 and the LED substrate 27 are connected via a connection cable 572.

  The ceiling 8 is provided with a ceiling through hole 83. The ceiling through hole 83 is for positioning the cylindrical portion 112 of the metal portion 11 of the case 1, that is, the power source portion 5 on the outdoor side of the ceiling surface 81. In the present embodiment, the ceiling through hole 83 has a circular shape in plan view.

  The pair of screws 6 are for fixing the LED lighting device A1 to the ceiling surface 81. More specifically, the pair of screws 6 fix the LED lighting device A <b> 1 to the ceiling surface 81 by fixing the main plate portion 111 of the metal portion 11 of the case 1 to the ceiling surface 81. The pair of screws 6 are arranged on opposite sides of the center of the indoor portion 4 on the same diameter of the indoor portion 4.

  The preferable example of the main dimension of LED lighting apparatus A1 is given. A diameter D1 of the indoor portion 4 is 70 mm to 300 mm. A diameter D2 of the ceiling through hole 83 of the ceiling 8 is 25 mm to 50 mm. The diameter D2 is 10% to 50% of the diameter D1. Moreover, the height H from the ceiling surface 81 of the indoor part 4 is 10 mm-20 mm. The height H is 5% to 25% of the diameter D1. In addition, the point with which these dimensions and ratios are preferable is the same also in the modification and embodiment mentioned later.

  Next, the operation of the LED lighting device A1 will be described.

  According to the present embodiment, at least a part of the power supply unit 5 is disposed outside the ceiling surface 81, and not all of the power supply unit 5 is included in the indoor unit 4. For this reason, the height H at which the indoor portion 4 protrudes from the ceiling surface 81 can be kept low. The plurality of LED light emitting units 2 are all disposed on the indoor side of the ceiling surface 81. For this reason, the ceiling through-hole 83 of the ceiling 8 does not need to have a size that exposes all of the plurality of LED light emitting units 2 in a plan view, and can be reduced to a size that allows a part of the power source unit 5 to pass. It is. Therefore, it is possible to further reduce the thickness of the indoor portion 4 while reducing the ceiling through hole 83.

  Since all of connection unit 51 and power conversion unit 52 are located outside the ceiling surface 81, the indoor unit 4 does not include the power supply unit 5 at all. This is preferable for reducing the thickness of the indoor portion 4.

  The translucent cover 3 diffuses the light from the plurality of LED light emitting units 2, thereby reducing the distance between the translucent cover 3 and the plurality of LED light emitting units 2, and each of the plurality of LED light emitting units 2 has an appearance. It can be suppressed from appearing clearly.

  The power supply unit 5 is provided at a position overlapping the center of the indoor unit 4 in plan view. Thereby, when opening the ceiling through-hole 83 in the ceiling 8, the ceiling through-hole 83 may be provided at the center position where the LED lighting device A1 is to be attached. This is preferable for simplification of construction work.

  Since the connection part 51 and the power conversion part 52 are in a vertical relationship, the ceiling through hole 83 can be further reduced.

  The pair of screws 6 are located on opposite sides of the power supply unit 5. Thereby, LED lighting apparatus A1 can be reliably fixed to the ceiling surface 81, avoiding that a pair of screw 6 and the power supply part 5 interfere.

  The diameter D2 of the ceiling through-hole 83 of the ceiling 8 is 25 mm to 50 mm, and the diameter D2 is 10% to 50% of the diameter D1, thereby suppressing a decrease in the heat insulating function due to the ceiling through-hole 83 being provided. In addition, the indoor portion 4 can be set to a size that can sufficiently illuminate the room. Moreover, while the height H from the ceiling surface 81 of the indoor part 4 is 10 mm-20 mm, and 5%-25% of the diameter D1, the external appearance similar to what is called a downlight can be achieved.

  FIGS. 8-23 has shown the modification and other embodiment of this invention. In these drawings, elements that are the same as or similar to those in the above embodiment are denoted by the same reference numerals as in the above embodiment, and the subsequent description is omitted as appropriate.

  FIG. 8 shows a modification of the LED lighting device A1. The LED lighting device A1 according to this modification includes a case 1, a plurality of LED light emitting units 2, an LED substrate 27, a translucent cover 3, and a power source unit 5. In this modification, a part of the power supply unit 5 is located on the outdoor side of the ceiling surface 81, and the other part is located on the indoor side of the ceiling surface 81. More specifically, the entire connecting portion 51 is located outside the ceiling surface 81 and further located outside the ceiling back surface 82. On the other hand, the power conversion unit 52 is arranged across the room through the ceiling through hole 83. More specifically, the power supply substrate 521 of the power conversion unit 52 of the power supply unit 5 is located on the indoor side of the ceiling surface 81. Further, a part of the electronic element 522 of the power conversion unit 52 is located on the outdoor side of the ceiling back surface 82. According to such a modified example, it is possible to further reduce the thickness of the indoor portion 4 while reducing the ceiling through hole 83. Such a modification can be appropriately employed in the embodiments described below.

  9 to 11 show an LED lighting device according to a second embodiment of the present invention. The LED illumination device A2 according to the present embodiment includes a case 1, a plurality of LED light emitting units 2, an LED substrate 27, a translucent cover 3, and a power supply unit 5. The LED lighting device A2 is different from the above-described embodiment in the configuration of the power supply unit 5.

  FIG. 9 is a plan view showing the LED illumination device A2. FIG. 10 is a bottom view showing the LED lighting device A2. 11 is a cross-sectional view taken along line XI-XI in FIG.

  The power supply unit 5 of the present embodiment has a spring member 55. The spring member 55 is for movably fixing the connection part 51 to the power conversion part 52 (the cylindrical part 112 of the metal part 11). In the present embodiment, the spring member 55 is made of a leaf spring that is bent into a bent shape. By having the spring member 55, the connecting portion 51 can be rotated with respect to the power converting portion 52 as shown in FIG. 11. According to such an embodiment, the indoor portion 4 can be further reduced in thickness while the ceiling through hole 83 is reduced. In addition, the direction in which the power feeding cable 89 connected to the power conversion unit 52 extends can be arbitrarily set in the horizontal direction or the vertical direction.

  FIGS. 12-14 has shown the LED lighting apparatus based on 3rd Embodiment of this invention. The LED lighting device A3 according to the present embodiment includes a case 1, a plurality of LED light emitting units 2, an LED substrate 27, a translucent cover 3, and a power supply unit 5. The LED illumination device A3 is different from the above-described embodiment in the configuration of the power supply unit 5.

  FIG. 12 is a plan view showing the LED illumination device A3. FIG. 13 is a bottom view showing the LED lighting device A3. 14 is a cross-sectional view taken along line XIV-XIV in FIG.

  In the present embodiment, the power supply unit 5 is provided at a position avoiding the center of the indoor portion 4 in plan view. In addition, the pair of screws 6 are respectively disposed in the directions shifted by 90 degrees in the circumferential direction with respect to the power supply unit 5. According to such an embodiment, the indoor portion 4 can be further reduced in thickness while the ceiling through hole 83 is reduced. Further, since the power supply unit 5 is arranged so as to avoid the center of the indoor portion 4 in plan view, the beam of the ceiling 8 and the like can pass through the center of the indoor portion 4. This is suitable for supporting the LED lighting device A3 more stably. In addition, interference between the beam of the ceiling 8 to which the pair of screws 6 should be fixed and the power supply unit 5 can be avoided.

  15 and 16 show an LED lighting device according to a fourth embodiment of the present invention. The LED illumination device A4 of the present embodiment includes a case 1, a plurality of LED light emitting units 2, an LED substrate 27, a translucent cover 3, and a power source unit 5. The LED lighting device A4 is different from the above-described embodiment in the configuration of the power supply unit 5.

  FIG. 15 is a bottom view showing the LED illumination device A4. 16 is a cross-sectional view taken along line XVI-XVI in FIG.

  In the present embodiment, the power supply unit 5 is provided at a position avoiding the center of the indoor portion 4 in plan view. In addition, the power supply unit 5 includes a spring member 55 interposed between the connection unit 51 and the power conversion unit 52. According to such an embodiment, the indoor portion 4 can be further reduced in thickness while the ceiling through hole 83 is reduced.

  17 and 18 show an LED lighting device according to a fifth embodiment of the present invention. The LED illumination device A5 of the present embodiment includes a case 1, a plurality of LED light emitting units 2, an LED substrate 27, a translucent cover 3, and a power supply unit 5. The LED illumination device A5 is different from the above-described embodiment in the configuration of the power supply unit 5.

  FIG. 17 is a bottom view showing the LED illumination device A5. 18 is a cross-sectional view taken along line XVIII-XVIII in FIG.

  In the present embodiment, the power supply unit 5 is provided at a position that avoids the entire interior 4 in plan view. The power conversion unit 52 of the power supply unit 5 and the LED substrate 27 are connected by a connection cable 56. Moreover, the connection part 51 and the power converter 52 are arranged in the horizontal direction. According to such an embodiment, the indoor portion 4 can be further reduced in thickness while the ceiling through hole 83 is reduced. Further, the power supply unit 5 can be largely separated from the pair of screws 6. Thereby, when attaching a pair of screw 6 to the beam 84 of the ceiling 8, it can prevent reliably that the power supply part 5 and the beam 84 interfere.

  19 and 20 show an LED lighting device according to a sixth embodiment of the present invention. The LED illumination device A6 according to this embodiment includes a case 1, a plurality of LED light emitting units 2, an LED substrate 27, a translucent cover 3, and a power supply unit 5. The LED lighting device A6 is different from the above-described embodiment in the configuration of the power supply unit 5.

  FIG. 19 is a bottom view showing the LED illumination device A6. 20 is a cross-sectional view taken along line XX-XX in FIG.

  In this embodiment, the connection part 51 and the power conversion part 52 are arrange | positioned on the opposite side on both sides of the center of the indoor part 4 in planar view. Correspondingly, the ceiling 8 is provided with two ceiling through holes 83. The connection portion 51 is inserted into one ceiling through hole 83, and the power conversion unit 52 is inserted into the other ceiling through hole 83. According to such an embodiment, the indoor portion 4 can be further reduced in thickness while the ceiling through hole 83 is reduced. Further, it is possible to avoid the connection part 51 and the power conversion part 52 from interfering with the beam 84.

  21 to 23 show an LED lighting device according to a seventh embodiment of the present invention. The LED illumination device A7 of the present embodiment includes a case 1, a plurality of LED light emitting units 2, an LED substrate 27, a translucent cover 3, and a power supply unit 5. The LED illumination device A7 is different from the above-described embodiment in the fixing mechanism to the ceiling 8.

  FIG. 21 is a bottom view showing the LED lighting device A6. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 23 is a cross-sectional view taken along line XXIII-XXIII in FIG.

  In the present embodiment, the LED lighting device A <b> 7 is fixed to the ceiling 8 by two fixing springs 61. The two fixing springs 61 are fixed to the cylindrical portion 112 of the metal portion 11 of the case 1 and extend to both sides in the radial direction of the cylindrical portion 112 as shown in FIG. The fixed spring 61 is formed, for example, by bending a strip made of spring steel. In FIG. 22, two fixed springs 61 indicated by imaginary lines indicate a natural state where no elastic force is exerted. When the LED lighting device A7 is attached to the ceiling 8, the two fixed springs 61 are deformed and attached to the power source 5 and the cylindrical portion 112 of the metal portion 11. Then, the power supply unit 5 and the cylindrical part 112 and the two fixing springs 61 are inserted through the ceiling through hole 83 of the ceiling 8. When the two fixing springs 61 are inserted to the state shown in FIG. 22, the two fixing springs 61 are deformed so as to be separated from each other. In FIG. 22, two fixed springs 61 indicated by solid lines indicate a state where the insertion is completed. The two fixed springs 61 in the expanded form serve to prevent the LED lighting device A7 from moving indoors (downward) with respect to the ceiling 8. Thereby, LED lighting apparatus A7 is fixed with respect to the ceiling 8.

  The LED lighting device according to the present invention is not limited to the embodiment described above. The specific configuration of each part of the LED lighting device according to the present invention can be varied in design in various ways.

A1 to A7 LED lighting devices D1, D2 Diameter H Height 1 Case 11 Metal part 111 Main plate part 112 Cylindrical part 112a First part 112b Second part 112c Third part 1121 Cylindrical part 1122 Bottom plate part 12 Resin part 2 LED light emitting part 21 LED chip 22 Lead 23 Case 24 Translucent resin 27 LED substrate 271 First surface 272 Second surface 3 Translucent cover 4 Indoor portion 5 Power supply portion 51 Connection portion 511 Support member 512 Connector 52 Power conversion portion 521 Power supply substrate 522 Electronic element 523 Capacitor 524 Diode 525 Fuse 526 IC
527 Coil 528 Chip resistor 529 Transformer 530 Varistor 531 Input terminal 532 Output terminal 55 Spring member 56 Connection cable 571 Connection cable 572 Connection cable 6 Screw 61 Fixing spring 71 Heat insulation member 8 Ceiling 81 Ceiling surface 82 Ceiling back surface 83 Ceiling through hole 84 Beam 89 Power supply cable

Claims (36)

A plurality of LED light emitting sections each including an LED chip;
A power supply unit that supplies power to the plurality of LED light emitting units,
An LED lighting device fixed to a ceiling surface,
All of the plurality of LED light emitting units are located on the indoor side of the ceiling surface,
At least a part of the power supply unit is located on the outdoor side of the ceiling surface. A case for housing the plurality of LED light emitting units;
A light-transmitting cover that transmits light from the LED light-emitting unit, and
The LED lighting device according to claim 1, wherein an indoor portion is configured by a portion of the case that is located on the indoor side of the ceiling surface and the translucent cover.   The LED lighting device according to claim 2, wherein the indoor portion has a circular shape in a plan view.   The LED illuminating device according to claim 3, wherein the translucent cover transmits light from the plurality of LED light emitting units while diffusing.   The LED lighting device according to claim 3 or 4, wherein the case has a portion made of metal. The power supply unit is connected to an external power supply path; and
The LED lighting device according to claim 3, further comprising: a power conversion unit configured to convert electric power received at the connection unit into electric power suitable for the plurality of LED light emitting units.   The LED lighting device according to claim 6, wherein all of the connection portions are located on the outdoor side of the ceiling surface.   8. The LED lighting device according to claim 6, wherein all of the power conversion units are located on an outdoor side of the ceiling surface.   8. The LED according to claim 6, wherein a part of the power conversion unit is located on the outdoor side of the ceiling surface, and the other part is located on the indoor side of the ceiling surface. Lighting device.   The LED lighting device according to claim 6, wherein the power supply unit overlaps a center of the indoor portion in plan view.   The LED lighting device according to claim 6, wherein the power supply unit is provided at a position avoiding the center of the indoor portion in plan view.   The LED lighting device according to claim 6, wherein the power conversion unit is located between the connection unit and the indoor unit in a direction perpendicular to the ceiling surface.   The LED lighting device according to claim 12, wherein the connection unit is supported in a state in which movement is prevented with respect to the power conversion unit.   The LED lighting device according to claim 12, wherein the connection unit is movably supported with respect to the power conversion unit.   The LED lighting device according to claim 14, wherein the connection part is supported by the power conversion part via a spring member.   The LED lighting device according to claim 6, wherein the connection unit and the power conversion unit are located on an outdoor side of the ceiling surface, and are provided at positions avoiding the indoor unit in a plan view.   The LED lighting device according to claim 16, further comprising a connection cable connecting the indoor portion and the power conversion portion.   The LED lighting device according to claim 6, wherein the power conversion unit and the connection unit are individually fixed to the indoor portion at positions different from each other in plan view.   The LED lighting device according to claim 18, wherein the power conversion unit and the connection unit are disposed on opposite sides of the center of the indoor part on the same diameter of the indoor part.   The LED lighting device according to claim 6, further comprising a pair of screws for fixing the indoor portion to the ceiling surface.   21. The LED lighting device according to claim 20, wherein the pair of screws are arranged on opposite sides of the center of the indoor portion on the same diameter of the indoor portion.   The LED lighting device according to any one of claims 3 to 21, wherein a circular ceiling through-hole for inserting the power supply unit is formed in the ceiling surface.   The LED lighting device according to claim 22, wherein a diameter of the ceiling through hole is 10% to 50% of a diameter of the indoor portion.   The LED lighting device according to claim 22 or 23, wherein the ceiling through hole has a diameter of 25 mm to 50 mm.   The LED lighting device according to any one of claims 22 to 24, wherein a protruding height of the indoor portion from the ceiling surface is 5% to 25% of a diameter of the indoor portion.   The LED lighting device according to any one of claims 22 to 25, wherein a protruding height of the indoor portion from the ceiling surface is 10 mm to 20 mm.   27. The LED lighting device according to claim 3, comprising an LED substrate on which the plurality of LED light emitting units are mounted.   28. The LED lighting device according to claim 27, wherein the LED substrate is located indoors relative to the ceiling surface.   The LED lighting device according to claim 27 or 28, wherein the plurality of LED light emitting units are surface-mounted on the LED substrate.   The LED lighting device according to claim 29, wherein the plurality of LED light emitting units are arranged concentrically.   The LED illumination device according to claim 30, wherein the LED substrate has a circular shape in a plan view.   32. The LED lighting device according to claim 27, wherein each of the plurality of LED light emitting units includes the LED chip, a translucent resin that covers the LED chip, and a mounting terminal.   The LED illumination device according to claim 32, wherein the translucent resin is mixed with a fluorescent material that emits light having a wavelength different from that of the light from the LED chip when excited by light from the LED chip. A plurality of LED light emitting sections each including an LED chip;
An LED substrate having a first surface and a second surface, wherein the plurality of LED light emitting units are mounted on the first surface;
A power supply unit that is formed on the second surface side of the LED substrate and supplies power to the plurality of LED light emitting units, and an LED lighting device comprising:
In a plan view from a direction perpendicular to the second surface of the LED substrate, the power supply unit is included in the LED substrate, and the power supply unit and at least a part of the plurality of LED light emitting units overlap. LED lighting device characterized by the above. A main plate portion for holding the LED substrate from the second surface side;
A cylindrical part connected to the main plate part and accommodating at least a part of the power supply part;
With
The LED lighting device according to claim 34, wherein the cylindrical portion covers the power supply unit and is included in the substrate in a plan view from a direction perpendicular to the second surface of the LED substrate.   36. The LED illumination device according to claim 34 or 35, further comprising a light-transmitting cover that allows light from the LED light-emitting unit to pass through while diffusing.

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