JP2016191867A - Exposure apparatus, exposure method, flat panel display production method, and device production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the overall alignment time.SOLUTION: In the exposure method for forming a given pattern for each of a plurality of shot areas Sto Sset on a base plate P, by a scanning exposure in which illumination light IL is used, before a scanning exposure of the first shot area S, a detection of all points of a mark Mk within the first and second shot areas Sand Sis carried out, and based on the detection result, a scanning exposure of the first shot area Sis carried out, as well as only a part of the marks Mk within the second shot area Sis detected, and based on the detection result as well as the previous detection result of the mark, a scanning exposure of teh second shot area Sis carried out.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an exposure apparatus, an exposure method, a flat panel display manufacturing method, and a device manufacturing method. More specifically, the present invention relates to an exposure apparatus, a scanning exposure that scans an energy beam in a predetermined scanning direction, and a predetermined pattern. The present invention relates to an exposure apparatus and method for forming on an object, and a flat panel display or device manufacturing method including the exposure method.

  2. Description of the Related Art Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (such as integrated circuits), an energy beam is applied to a pattern formed on a mask or reticle (hereinafter collectively referred to as “mask”) An exposure apparatus is used for transferring onto a glass plate or a wafer (hereinafter collectively referred to as “substrate”).

  In this type of exposure apparatus, a beam that forms a predetermined pattern on a substrate by scanning exposure illumination light (energy beam) in a predetermined scanning direction while the mask and the substrate are substantially stationary. A scanning-type scanning exposure apparatus is known (see, for example, Patent Document 1).

  In the exposure apparatus described in Patent Document 1, in order to correct the position error between the exposure target region on the substrate and the mask, the projection optical system is moved through the projection optical system while moving in the direction opposite to the scanning direction at the time of exposure. Then, the mark on the substrate and the mask is measured (alignment measurement) by the alignment microscope, and the position error between the substrate and the mask is corrected based on the measurement result. Here, since the alignment mark on the substrate is measured via the projection optical system, the alignment operation and the exposure operation are executed sequentially (serially), and the processing time (tact time) required for the entire exposure processing of the substrate is calculated. It was difficult to suppress.

JP 2000-12422 A

  The present invention has been made under the circumstances described above. From a first viewpoint, the object is exposed to a predetermined pattern by a scanning exposure operation in which an energy beam is scanned in a predetermined scanning direction. An exposure apparatus formed thereon, a mark detection system capable of detecting a mark provided on the object, a drive system for moving the pattern holding body having the predetermined pattern and the object, and the mark detection A control system that performs the scanning exposure operation on a partition area to be exposed among a plurality of partition areas provided on the object according to a detection result of the system, and the control system includes the pattern holder and the pattern holding body A mark provided in the first area in a state where the first divided area provided on the object is opposed, and a plurality of marks provided in a second divided area different from the first divided area are detected. The test After performing the scanning exposure operation on the first partition region based on the result, the plurality of marks provided in the second region with the pattern holder and the second partition region facing each other , Detecting a part of the plurality of marks detected before the scanning exposure operation for the first partition area, and at least based on a detection result of the mark provided in the second partition area An exposure apparatus that performs the scanning exposure operation on the second partition region.

  According to a second aspect of the present invention, there is provided an exposure method for forming a predetermined pattern on the object by a scanning exposure operation in which an energy beam is scanned in a predetermined scanning direction with respect to the object to be exposed. A pattern holding body having a predetermined pattern is opposed to a first partition area provided in the object, a mark provided in the first area is detected, and a first provided in the object is detected. Detecting a plurality of marks provided in a second partitioned area different from the partitioned areas, and performing the scanning exposure operation on the first partitioned area based on at least a detection result of the marks provided in the first area. Detection, detecting the plurality of marks among the plurality of marks provided in the second region, making the pattern holding body and the second partition region face each other Detecting a part of the marks, and performing the scanning exposure operation on the second partition area based on at least a detection result of the mark provided in the second partition area. It is an exposure method.

  According to a third aspect of the present invention, there is provided a flat panel display manufacturing method including exposing a substrate using the exposure method of the present invention and developing the exposed substrate.

  From a fourth viewpoint, the present invention is a device manufacturing method including exposing the object using the exposure method of the present invention and developing the exposed object.

1 is a conceptual diagram of a liquid crystal exposure apparatus according to a first embodiment. FIG. 2 is a block diagram showing an input / output relationship of a main controller that mainly constitutes a control system of the liquid crystal exposure apparatus of FIG. 1. FIG. 3A to FIG. 3C are diagrams (No. 1 to No. 3) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. FIGS. 4A to 4C are views (Nos. 4 to 6) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. FIGS. 5A and 5B are views (No. 1 and No. 2) for explaining the operation of the alignment system according to the first modification. FIGS. 6A and 6B are views (No. 1 and No. 2) for explaining the operation of the alignment system according to the second modification. FIGS. 7A to 7C are views (No. 1 to No. 3) for explaining the operation of the liquid crystal exposure apparatus according to the second embodiment. It is a figure for demonstrating the structure of the measurement system of the projection system main body which concerns on 2nd Embodiment, and an alignment microscope. It is a figure which shows the modification of 2nd Embodiment.

<< First Embodiment >>
Hereinafter, a first embodiment will be described with reference to FIGS.

  FIG. 1 shows a conceptual diagram of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object. A projection exposure apparatus, a so-called scanner.

  The liquid crystal exposure apparatus 10 includes an illumination system 20 that irradiates illumination light IL that is an energy beam for exposure, and a projection optical system 40. Hereinafter, the direction parallel to the optical axis of the illumination light IL applied to the substrate P from the illumination system 20 via the projection optical system 40 is referred to as the Z-axis direction, and the X-axis is orthogonal to each other in a plane orthogonal to the Z-axis. The explanation will be given with the Y axis set. In the coordinate system of the present embodiment, it is assumed that the Y axis is substantially parallel to the direction of gravity. Therefore, the XZ plane is substantially parallel to the horizontal plane. The rotation (tilt) direction around the Z axis will be described as the θz direction.

  Here, in this embodiment, a plurality of exposure target areas (which will be referred to as partition areas or shot areas as appropriate) are set on one substrate P, and a mask pattern is sequentially transferred to the plurality of shot areas. Is done. In the present embodiment, a case where four partition areas are set on the substrate P (so-called four-chamfering) will be described, but the number of partition areas is not limited to this and can be changed as appropriate. is there.

  The liquid crystal exposure apparatus 10 performs a so-called step-and-scan exposure operation. During the scan exposure operation, the mask M and the substrate P are substantially stationary, and the illumination system 20 and the projection optical system. 40 (illumination light IL) moves relative to the mask M and the substrate P with a long stroke in the X-axis direction (referred to as the scanning direction as appropriate) (see the white arrow in FIG. 1). On the other hand, at the time of the step operation for changing the partition area to be exposed, the mask M is stepped with a predetermined stroke in the X-axis direction, and the substrate P is stepped with a predetermined stroke in the Y-axis direction (see FIGS. 1 black arrow).

  The illumination system 20 includes an illumination system body 22 including a light source (for example, a mercury lamp) of illumination light IL (see FIG. 1). During the scan exposure operation, the main controller 90 scans the illumination system main body 22 with a predetermined long stroke in the X-axis direction by controlling the drive system 24 including, for example, a linear motor. The main controller 90 obtains position information of the illumination system body 22 in the X-axis direction via the measurement system 26 including, for example, a linear encoder, and performs position control of the illumination system body 22 based on the position information. In the present embodiment, for example, g-line, h-line, i-line or the like is used as the illumination light IL.

  The mask stage apparatus 30 includes a stage main body 32 that holds the mask M. The stage main body 32 is configured to be appropriately step-movable in the X-axis direction and the Y-axis direction by a drive system 34 including, for example, a linear motor. During the step operation for changing the exposure target partition area with respect to the X-axis direction, the main controller 90 controls the drive system 34 to step-drive the stage body 32 in the X-axis direction. Further, as will be described later, during the step operation for changing the scanning exposure region (position) in the Y-axis direction in the partition region to be exposed, the main controller 90 controls the drive system 34 to control the stage. The main body 32 is step-driven in the Y-axis direction. The drive system 34 can also appropriately finely drive the mask M in the direction of three degrees of freedom (X, Y, θz) in the XY plane during an alignment operation described later. The position information of the mask M is obtained by a measurement system 36 including a linear encoder, for example.

  The projection optical system 40 includes a projection system main body 42 including an optical system that forms an erect image of a mask pattern on a substrate P (see FIG. 1) in the same magnification system. The projection system main body 42 is disposed in a space formed between the substrate P and the mask M (see FIG. 1). During the scan exposure operation, the main controller 90 controls the drive system 44 including, for example, a linear motor, so that the projection system main body 42 has a predetermined length in the X-axis direction so as to synchronize with the illumination system main body 22. Scan drive with stroke. The main controller 90 obtains position information in the X-axis direction of the projection system main body 42 via the measurement system 46 including, for example, a linear encoder, and controls the position of the projection system main body 42 based on the position information.

  Returning to FIG. 1, in the liquid crystal exposure apparatus 10, when the illumination area IAM on the mask M is illuminated by the illumination light IL from the illumination system 20, the illumination light IL that has passed through the mask M passes through the projection optical system 40. A projection image (partial upright image) of the mask pattern in the illumination area IAM is formed in the irradiation area (exposure area IA) of the illumination light IL conjugate to the illumination area IAM on the substrate P. Then, the scanning light exposure operation is performed when the illumination light IL (the illumination area IAM and the exposure area IA) moves relative to the mask M and the substrate P in the scanning direction. That is, in the liquid crystal exposure apparatus 10, the pattern of the mask M is generated on the substrate P by the illumination system 20 and the projection optical system 40, and the sensitive layer (resist layer) on the substrate P is exposed by the illumination light IL. The pattern is formed.

  Here, in the present embodiment, the illumination area IAM generated on the mask M by the illumination system 20 includes a pair of rectangular areas that are separated in the Y-axis direction. The length in the Y-axis direction of one rectangular area is, for example, 1 in the length in the Y-axis direction of the pattern surface of the mask M (that is, the length in the Y-axis direction of each partition area set on the substrate P). / 4 is set. Similarly, the distance between the pair of rectangular areas is set to, for example, 1/4 of the length of the pattern surface of the mask M in the Y-axis direction. Accordingly, the exposure area IA generated on the substrate P similarly includes a pair of rectangular areas spaced apart in the Y-axis direction. In the present embodiment, in order to completely transfer the pattern of the mask M onto the substrate P, it is necessary to perform two scanning exposure operations for one partition region. However, the illumination system main body 22 and the projection system main body 42 are required. There is an advantage that can be downsized. A specific example of the scanning exposure operation will be described later.

  The substrate stage apparatus 50 includes a stage main body 52 that holds the back surface of the substrate P (the surface opposite to the exposure surface). Returning to FIG. 2, during the step operation for changing the partition area to be exposed in the Y-axis direction, the main controller 90 controls the drive system 54 including, for example, a linear motor to move the stage main body 52 to Step drive in the axial direction. The drive system 54 can also minutely drive the substrate P in the direction of three degrees of freedom (X, Y, θz) in the XY plane during a substrate alignment operation described later. The position information of the substrate P (stage main body 52) is obtained by a measurement system 56 including, for example, a linear encoder.

  Returning to FIG. 1, the alignment system 60 includes, for example, two alignment microscopes 62 and 64. The alignment microscopes 62 and 64 are disposed in a space formed between the substrate P and the mask M (position between the substrate P and the mask M with respect to the Z-axis direction), and the alignment microscope is formed on the substrate P. A mark Mk (hereinafter simply referred to as a mark Mk) and a mark (not shown) formed on the mask M are detected. In the present embodiment, one mark Mk is formed near each of the four corners of each partition area (for example, four for each partition area), and the mark on the mask M is marked via the projection optical system 40. It is formed at a position corresponding to Mk. Note that the numbers and positions of the marks Mk and the marks of the mask M are not limited to this, and can be changed as appropriate. In each drawing, the mark Mk is shown larger than the actual size for easy understanding.

  The alignment microscope 62 has, for example, four detection fields (detection regions) that are separated in the X-axis direction. For example, the intervals in the X-axis direction of the four detection visual fields are simultaneously detected, for example, for four marks Mk having the same position in the Y-axis direction among, for example, a total of 16 marks Mk formed on the substrate P. Is set to be able to.

  The alignment microscope 62 can simultaneously detect the mark formed on the mask M and the mark Mk formed on the substrate P (in other words, without changing the position of the alignment microscope 62). . For example, each time the mask M performs an X-step operation or the substrate P performs a Y-step operation, the main controller 90 performs information on the relative displacement between the mark formed on the mask M and the mark Mk formed on the substrate P. Then, relative positioning of the substrate P and the mask M in the direction along the XY plane is performed so as to correct (cancel or reduce) the positional deviation. In the alignment microscope 62, a mask detection unit for detecting (observing) the mark on the mask M and a substrate detection unit for detecting (observing) the mark Mk on the substrate P are integrally configured by a common housing or the like. And is driven by a drive system 66 through the common housing. Alternatively, the mask detection unit and the substrate detection unit may be configured by separate housings, and in that case, for example, the mask detection unit and the substrate detection unit are substantially equivalent by a common drive system 66. It is preferable to be configured so that it can move with operating characteristics.

  The main controller 90 drives the alignment microscope 62 in the Y-axis direction by controlling a drive system 66 including, for example, a linear motor. The position information of the alignment microscope 62 is obtained by a measurement system 68 including a linear encoder, for example. The operation of the alignment microscope 62 will be described later.

  Main controller 90 (see FIG. 2) detects a plurality of marks Mk formed on substrate P using alignment microscope 62, and based on the detection results (position information of the plurality of marks Mk), Arrangement information (including information on the position (coordinate value), shape, etc. of the partition area) of the partition area in which the mark Mk to be detected is formed is calculated by an enhanced global alignment (EGA) method.

  Specifically, in the scanning exposure operation, the main controller 90 (see FIG. 2) uses the alignment microscope 62 prior to the scanning exposure operation to form a plurality of marks formed at least in the partition area to be exposed. Mk and the position information of the plurality of marks Mk formed in the partition area adjacent to the partition area to be exposed in the scanning direction (X-axis direction) are detected, and the arrangement information of the partition area to be exposed is calculated. To do. The main controller 90 performs precise positioning (substrate alignment operation) in the three-degree-of-freedom direction in the XY plane of the substrate P based on the calculated arrangement information of the partition regions to be exposed, and the projection of the illumination system 20 and the projection. The optical system 40 is controlled as appropriate to perform a scanning exposure operation (mask pattern transfer) on the target partition region.

  Next, an example of the operation of the liquid crystal exposure apparatus 10 during the scanning exposure operation will be described with reference to FIGS. 3 (a) to 4 (c). The following exposure operations (including alignment measurement operations) are performed under the control of the main controller 90 (not shown in FIGS. 3A to 4C, see FIG. 2).

In this embodiment, divided areas exposed order is the first (hereinafter referred to as the first shot area S ₁₎ is set on the -X side and -Y side of the substrate P. In FIGS. 3A to 4C, a rectangular area denoted by reference symbol A indicates the movement range (movement path) of the projection system main body 42 during the scanning exposure operation. The movement range A of the projection system main body 42 is set, for example, mechanically and / or electrically. Further, the symbols S _{2 to} S ₄ given to the partitioned areas on the substrate P indicate that the exposure areas are the second to fourth shot areas, respectively.

As shown in FIG. 3 (a), before starting exposure, main controller 90 within the detection field of the alignment microscope 62, formed in the first shot area S _1, for example, among the four marks Mk , Two marks Mk on the −Y side and two marks on the −Y side among the four marks Mk formed in the second shot region S ₂ (the + X side partition region of the first shot region S ₁ ), for example. The substrate P is positioned so that the mark Mk is positioned. In this state, the main controller 90 uses the alignment microscope 62 to detect the positions of, for example, four marks Mk (first mark group) (see the bold circles in FIG. 3A) (first time). Mark detection operation).

Next, as shown in FIG. 3B, the main controller 90 moves the substrate P stepwise in the −Y direction (see the black arrow in FIG. 3B). At this time, the main controller 90, within the detection field of the alignment microscope 62, formed in the first shot area S _1, for example, of the four marks Mk, + Y side of the two marks Mk, and a second shot of formed, for example, four mark Mk in the region S _2, the two marks Mk the + Y side so as to be positioned to position the substrate P. In this state, the main controller 90 uses the alignment microscope 62 to detect the positions of, for example, four marks Mk (second mark group) (see the bold circles in FIG. 3B) (second time). Mark detection operation). As a result, the main controller 90 has detected all of the eight marks Mk formed in the first and second shot regions S ₁ and S ₂ in total.

The main control unit 90, based on the plurality of marks Mk detection result by EGA calculation, sequence information (coordinate values of the divided areas, and a shape) of the first shot area S ₁ is calculated, and this calculation result based performing first shot area S ₁ of the scanning exposure operation.

  Here, in the present embodiment, since the projection system main body 42 and the alignment microscope 62 are respectively disposed in the space formed between the substrate P and the mask M, their movable ranges partially overlap each other. doing. Therefore, the main controller 90 moves the alignment microscope 62 stepwise in the Y-axis direction prior to driving the projection system main body 42 in the scanning direction, as indicated by the white arrow in FIG. The alignment microscope 62 is retracted from the movement path A of the main body 42.

When the alignment microscope 62 is retracted, the main controller 90 performs the fine positioning (substrate alignment operation) in the three-degree-of-freedom direction in the XY plane of the substrate P, as shown in FIG. 20 and the projection optical system 40 (see FIG. 1 respectively) are appropriately controlled to synchronize the projection system main body 42 and the illumination system main body 22 of the illumination system 20 (not shown in FIG. 4A, see FIG. 1). Te + X direction by driving performs first scanning exposure for the first shot area S _1.

  As described above, in this embodiment, the illumination area IAM (see FIG. 1) generated on the mask M and the exposure area IA generated on the substrate P are a pair of rectangular areas separated in the Y-axis direction. Therefore, the pattern image of the mask M transferred to the substrate P by one scanning exposure operation is a band-like region extending in the X-axis direction and separated from the Y-axis direction (of the total area of one partition region). Half area).

Then, the main controller 90, as shown in FIG. 4 (b), for scanning exposure operation for the second time in the first shot area S ₁ (return path), the step moves the substrate P and the mask M in the -Y direction (See the black arrow in FIG. 4 (b)). The step movement amount of the substrate P at this time is, for example, 1/4 of the length of one partition region in the Y-axis direction. In this case, in the step movement of the substrate P and the mask M in the −Y direction, the relative positional relationship between the substrate P and the mask M is not changed (or the relative positional relationship can be corrected). ) It is preferable to move the step.

Thereafter, main controller 90 synchronizes projection system main body 42 and illumination system main body 22 of illumination system 20 (not shown in FIG. 4C, see FIG. 1), as shown in FIG. Then, it is driven in the −X direction. The main controller 90 controls the illumination system 20 while performing minute position control of the substrate P according to the calculation result of the array information, and the illumination light IL is not shown in the mask M (not shown in FIG. 4C). And a part of the mask pattern is formed in the exposure area IA generated on the substrate P by the illumination light IL. Thus, the mask pattern transferred by the first scanning exposure operation, a mask pattern portion transferred by the second time of the scanning exposure operation is joined together with the first shot in region S _1, the overall pattern of the mask M There is transferred to the first shot area S _1.

Hereinafter, although not shown, the main controller 90, in order to perform the scanning exposure operation on the second shot area S _2, a second shot region by the step moving the mask M (see FIG. 1) in the + X direction to face the S ₂ and the mask M. At the same time, the substrate P is moved stepwise in the + X direction (returned to the state shown in FIG. 3A).

Scanning exposure operation for the second shot area S ₂ will be omitted because it is identical to the scanning exposure operation for the first shot area S ₁ described above. However, in the alignment measurement operation performed prior to the scanning exposure operation for the second shot area S _2, formed in the second shot area S _2, of the four marks Mk example, -Y side (or + Y side) detects only two marks Mk, in response to this detection result, the main controller 90 updates the sequence information of the second shot area S _2. This is the second shot area S ₂ prior to exposure scanning of the first shot area S _1, for example, because the four marks Mk detects all.

Thereafter, the main controller 90 performs the scanning exposure operation on the third and fourth shot regions S ₃ and S ₄ while appropriately performing at least one of the X step operation of the mask M and the Y step operation of the substrate P.

It should be noted that in order to expose the partition area to be exposed, when obtaining the array information of the partition area, the array information may be calculated based only on the mark Mk in the partition area. The position information of the mark Mk formed in the partitioned area may be used. Specifically, for example, when determining the first shot arrangement information of the area S _1, the main controller 90 may use the position information of the mark Mk in the second shot area S _2. Thereby, the overall distortion of the substrate P can be corrected.

According to the described the first embodiment above, prior to the scanning exposure operation for the first shot area S _1, and detects the pre-second mark Mk shot area S _2, the scanning for the second shot area S ₂ prior to the exposure operation, without leaving again all check marks Mk in the second shot area S _2, it is possible to determine the sequence information of the second shot area S ₂ with high accuracy. Thus, prior to scanning exposure operation of the second shot area S ₂ can be shortened overall alignment time since only a part of the mark Mk of the second shot area S ₂ is not detected.

In addition, the alignment microscope 62 is adjacent to the X-axis direction, for example, two partitioned regions (in this embodiment, for example, the first shot region S ₁ and the second shot region S ₂ , or the third shot region S ₃ and the fourth shot Since a plurality of (in the present embodiment, for example, four) marks Mk provided across the region S ₄ ) can be measured simultaneously, the distortion of the substrate P across the plurality of partitioned regions can be easily and quickly (increased in the number of marks). Can be measured less). Accordingly, it is possible to shorten a time required for a series of operations including the alignment operation and the scanning exposure operation, that is, a series of processing times (tact time) required for the exposure processing of the substrate P.

  Further, by moving the substrate P stepwise in the Y-axis direction, it is possible to detect a plurality of marks Mk having different positions in the Y-axis direction, so that the distortion of the entire substrate P can be measured easily and quickly.

Incidentally, in the first embodiment, before the start of the scanning exposure of the first shot area S _1, for example, performs the Y stepping of the substrate P only once, the first and second shot area S _1, S in ₂ However, the present invention is not limited to this. For example, four mark detection operations (three Y-step operations on the substrate P) are performed in total, and the first to fourth shot regions S are detected. formed in ₁ to S _4, a total first may be subjected to all point detection, for example, 16 marks Mk.

In the first embodiment, the Y step operation of the substrate P is performed before the start of the scanning exposure of the first shot region S _1. However, by performing the Y step operation of the alignment microscope 62, The mark Mk may be detected by the alignment microscope 62. The main control device 90 drives the alignment microscope 62 stepwise in the Y-axis direction by controlling a drive system 66 including, for example, a linear motor. The position information of the alignment microscope 62 is obtained by a measurement system 68 including a linear encoder, for example.

  In the first embodiment, the mark Mk is detected by the alignment microscope 62 positioned in the movement path A of the projection system main body 42, and the alignment microscope 62 is moved to the movement path A of the projection system main body 42 before the exposure starts. (See FIG. 3C), but is not limited to this. For example, as in the first modification shown in FIG. 5A, the alignment microscope is previously placed outside the movement path A of the projection system main body 42. 62, and the mark Mk detection operation may be performed only by step movement of the substrate P in the Y-axis direction, as shown in FIG.

In addition, the alignment microscope 62 in the first embodiment has a configuration in which the positions in the Y-axis direction are substantially the same and the positions in the X-axis direction are different from each other, for example, the positions of four marks Mk are simultaneously detected. The number of marks Mk to be detected simultaneously is not limited to this. For example, as in the second modification shown in FIG. 6A, for example, two alignment microscopes 62 are arranged apart from each other in the Y-axis direction. May be. In this case, it is formed in two shot regions (first and second shot regions S ₁ and S ₂ , or third and fourth shot regions S ₃ and S ₄ ) adjacent in the X-axis direction by one detection operation. For example, eight marks Mk can be detected simultaneously. Therefore, as shown in FIG. 6B, all the points of, for example, 16 marks Mk formed on the substrate P can be detected by one Y-step operation of the substrate P. Further, in the case of the second modification, during the scanning exposure operation, for example, the two alignment microscopes 62 are driven in opposite directions (+ Y direction and −Y direction) to move the projection system main body 42 along the movement path. It is good to evacuate outside A.

<< Second Embodiment >>
Next, a liquid crystal exposure apparatus according to the second embodiment will be described with reference to FIGS. Since the configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment except that the configuration and operation of the alignment system are different, only the differences will be described below. Elements having the same configuration and function as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

In the first embodiment, the alignment microscope 62, the shot area adjacent to the scanning direction (e.g., the first shot area S ₁ and the second shot area S ₂₎ the mark Mk formed simultaneously detectable as However, in the second embodiment, as shown in FIG. 7A, a pair of detection fields separated in the Y-axis direction are provided. A pair of alignment microscopes 162 and 164 are arranged on the front and rear (+ X side and −X side) in the scanning direction of the projection system main body 42. The distance between the pair of detection visual fields of the alignment microscopes 162 and 164 is set to be substantially the same as the distance between the pair of marks Mk that are formed in each partition region and are separated in the Y-axis direction, for example, among the four marks Mk. .

  The alignment microscopes 162 and 164 are driven in the scanning direction by a main controller 90 (see FIG. 2) independently of each other by a drive system (not shown) including a linear motor, for example, and independently of the projection system main body 42. It is driven with a predetermined stroke.

  Here, the alignment microscopes 162 and 164 and the projection system main body 42 of the projection optical system 40 described above are physically (mechanically) independent (separated) elements, and are controlled by the main controller 90 (see FIG. 2). Driving (speed and position) control is performed independently of each other. The driving system 66 that drives the alignment microscopes 162 and 164 and the driving system 44 that drives the projection system main body 42 are related to driving in the X-axis direction. For example, a part of a linear motor, a linear guide, etc. is shared, and the drive characteristics of the alignment microscopes 162 and 164 and the projection system main body 42 or the control characteristics by the main controller 90 are substantially equal. Has been.

  Specifically, for example, when each of the alignment microscopes 162 and 164 and the projection system main body 42 is driven in the X-axis direction by a moving coil linear motor, for example, a magnetic body (for example, a permanent magnet) is used as a stator. ) The unit is shared by the drive system 66 and the drive system 44. On the other hand, the coil unit which is a mover has the alignment microscopes 162 and 164 and the projection system main body 42 independently, and the main controller 90 (see FIG. 2) individually supplies power to the coil unit. Thus, the drive (speed and position) of the alignment microscopes 162 and 164 in the X-axis direction and the drive (speed and position) of the projection system main body 42 in the X-axis direction are controlled independently. Therefore, the main controller 90 can change (arbitrarily change) the intervals (distances) between the alignment microscopes 162 and 164 and the projection system main body 42 in the X-axis direction. The main controller 90 can also move the alignment microscopes 162 and 164 and the projection system main body 42 at different speeds in the X-axis direction.

  Here, a measurement system 46 (see FIG. 2) for obtaining position information of the projection system main body 42 included in the projection optical system 40 and a measurement system 68 for obtaining position information of the alignment microscope 162 included in the alignment system 60 are described. A typical configuration will be described.

  As shown in FIG. 8, the liquid crystal exposure apparatus 10 includes a guide 80 for guiding the projection system main body 42 in the scanning direction. The guide 80 is made of a member extending in parallel with the scanning direction. The guide 80 also has a function of guiding the movement of the alignment microscope 162 in the scanning direction. In FIG. 8, the guide 80 is illustrated between the mask M and the substrate P. Actually, however, the guide 80 is disposed at a position avoiding the optical path of the illumination light IL in the Y-axis direction. .

  A scale 82 including a reflective diffraction grating having a periodic direction at least in a direction parallel to the scanning direction (X-axis direction) is fixed to the guide 80. In addition, the projection system main body 42 has a head 84 disposed so as to face the scale 82. In the present embodiment, the scale 82 and the head 84 form an encoder system that constitutes a measurement system 46 (see FIG. 2) for obtaining position information of the projection system main body 42. The alignment microscopes 162 and 164 each have a head 86 disposed so as to face the scale 82 (the alignment microscope 164 is not shown in FIG. 8). In the present embodiment, the scale 82 and the head 86 form an encoder system that constitutes a measurement system 68 (see FIG. 2) for obtaining positional information of the alignment microscopes 162 and 164. Here, each of the heads 84 and 86 irradiates the scale 82 with a beam for encoder measurement, receives a beam (reflected beam by the scale 82) via the scale 82, and based on the light reception result, the scale 82. Relative position information can be output.

  Thus, in this embodiment, the scale 82 constitutes the measurement system 46 (see FIG. 2) for obtaining the position information of the projection system main body 42, and the measurement system for obtaining the position information of the alignment microscopes 162 and 164. 68 (see FIG. 2). That is, the position control of the projection system main body 42 and the alignment microscopes 162 and 164 is performed based on a common coordinate system (measurement axis) set by the diffraction grating formed on the scale 82. Note that a drive system 44 (see FIG. 2) for driving the projection system main body 42 and a drive system 66 (see FIG. 2) for driving the alignment microscopes 162 and 164 may have some common elements. It may be good or may be composed of completely independent elements.

  The encoder system constituting the measuring systems 46 and 68 (see FIG. 2 respectively) may be a linear (1 DOF) encoder system whose length measuring axis is only in the X-axis direction (scanning direction), for example. There may be more measuring axes. For example, the rotation amounts of the projection system main body 42 and the alignment microscopes 162 and 164 in the θz direction may be obtained by arranging a plurality of heads 84 and 86 at predetermined intervals in the Y-axis direction. Alternatively, an XY two-dimensional diffraction grating may be formed on the scale 82, and a 3DOF encoder system having measurement axes in the three degrees of freedom in the X, Y, and θz directions may be used. Further, as the heads 84 and 86, by using a plurality of known two-dimensional heads capable of measuring in the direction orthogonal to the scale surface together with the periodic direction of the diffraction grating, the projection system main body 42, the alignment microscopes 162 and 164 Position information in the direction of 6 degrees of freedom may be obtained.

As shown in FIG. 7 (a), before starting exposure, the projection system main body 42, and the alignment microscopes 162, 164 respectively, to the initial position set in the -X side of the first shot area S ₁ in a plan view Be placed. At this time, the Y position of the detection visual field of the alignment microscope 162 and the Y position of the mark Mk formed in the first and second shot regions S ₁ and S ₂ substantially coincide. Although not shown, (see FIG. 1) Mask M is opposed to the first shot area S _1.

Then, the main controller 90, while driving the alignment microscope 162 in the + X direction, formed in the first shot area S ₁ is detected, for example, four marks Mk. The main control device 90, the formed first shot area S _1, for example based on the four marks Mk detection result (position information) to obtain the sequence information of the first shot area S _1, the sequence information + X in synchronism between the projection system main body 42 and the illumination system main body 22 (see FIG. 1) of the illumination system 20 while performing fine positioning (substrate alignment operation) in the direction of three degrees of freedom in the XY plane of the substrate P based on and driven in the direction, performs first scanning exposure for the first shot area S _1.

The main control unit 90, as shown in FIG. 7 (b), in parallel with the start of the first scanning exposure operation for the first shot area S _1, the second shot area S using the alignment microscope 162 For example, four marks Mk formed in ₂ are detected. FIG. 7B shows a state in which the alignment microscope 162 detects, for example, two marks Mk formed near the end on the −X side.

As described above, in the present embodiment, in parallel with the scanning exposure operation, using the alignment microscope 162 disposed in front of the projection system main body 42 in the scanning direction, a partition area (here, the first shot) to be exposed. The mark Mk formed in the partition area (here, the second shot area S ₂ ) set in front of the area S ₁ ) in the scanning direction is detected.

  Further, when the main controller 90 drives the projection system main body 42 in the + X direction for the scanning exposure operation, the main control device 90 moves the alignment microscope 164 disposed behind the projection system main body 42 in the scanning direction to the projection system main body 42. Is driven in the + X direction so as to follow (see FIG. 7B).

In this second embodiment, as in the first embodiment, after the substrate P is moved Y step in the -Y direction, performs two scanning exposure operation for the first shot area S ₁ (Not shown). When the scanning exposure of the first shot area S ₁ is completed, the main controller 90, for scanning exposure operation for the second shot area S _2, by moving the mask M in the + X direction, the mask M and the second shot area It is opposed to the S _2. Further, the main controller 90 moves the substrate P stepwise in the + Y direction (returns to the position shown in FIG. 7A).

In the second embodiment, the first scanning exposure operation for the second shot area S ₂ in order to perform the projection system main body 42 is moved in the -X direction, before the start of the exposure operation, the projection system main body 42, The alignment microscopes 162 and 164 are arranged on the + X side of the substrate P, respectively.

Thereafter, as shown in FIG. 7C, the alignment microscope 164 disposed on the front side in the traveling direction of the projection system main body 42 is formed in the second shot region S ₂ prior to the projection system main body 42. , for example, among the four marks Mk, + X side of the detecting only two marks Mk, the detection result and first shot area S ₁ of the exposed and scanned before discovered the other marks (second shot area S in ₂ formed, for example, among the four marks Mk, formed near the edge of the -X side, for example, two marks Mk, and formed in the first shot area S _1, for example four marks) based on the detection result, obtaining the sequence information of the second shot area S _2. The main controller 90, based on the sequence information, performs the scanning exposure operation on the second shot area S _2.

Although not shown, the main controller 90 scans the third and fourth shot regions S ₃ and S ₄ while appropriately performing at least one of the X step operation of the mask M and the Y step operation of the substrate P. Perform exposure operation.

  Also in the second embodiment, the same effect as in the first embodiment can be obtained.

Note that the alignment microscopes 162 and 164 of the second embodiment have a pair of detection visual fields that are separated in the Y-axis direction. However, the present invention is not limited to this, and the Y-axis is not limited to this. spaced in a direction, for example, has four detection field, adjacent to the Y-axis direction, for example, is formed across the two compartments regions (e.g. the first shot area S ₁ and the third shot area S _3), For example, four marks Mk having the same X position may be detected simultaneously.

  In addition, the structure of each embodiment demonstrated above can be changed suitably. For example, in the first embodiment, a plurality of marks Mk having different positions in the Y-axis direction are detected by step-moving the substrate P in the Y-axis direction with respect to the detection field of the alignment microscope 62. However, by moving the alignment microscope 62 in the Y-axis direction with respect to the substrate P (without Y-step operation of the substrate P), a plurality of marks Mk having different positions in the Y-axis direction are detected. Also good.

In each of the above embodiments, the mark Mk is formed in each partition area (first to fourth shot areas S _{1 to} S ₄ ). However, the present invention is not limited to this, and the mark Mk is between adjacent partition areas. It may be formed in this area (so-called scribe line).

  In each of the above embodiments, a pair of illumination area IAM and exposure area IA that are separated in the Y-axis direction are generated on mask M and substrate P, respectively (see FIG. 1), but illumination area IAM and exposure area IA The shape and length are not limited to this, and can be changed as appropriate. For example, the length of the illumination area IAM and the exposure area IA in the Y-axis direction may be equal to the pattern surface of the mask M and the length of one partition area on the substrate P in the Y-axis direction, respectively. In this case, the transfer of the mask pattern is completed with a single scanning exposure operation for each partitioned region. Alternatively, the illumination area IAM and the exposure area IA are one area whose length in the Y-axis direction is half the length in the Y-axis direction of one partition area on the pattern surface of the mask M and the substrate P, respectively. Also good. In this case, similarly to the above embodiment, it is necessary to perform the scanning exposure operation twice for one partitioned area.

  Further, as in the second embodiment, in the case of performing joint exposure by reciprocating the projection system main body 42 in order to form one mask pattern in the partitioned area, the forward path and the backward path having different detection fields of view are used. These alignment microscopes may be arranged before and after the projection system main body 42 in the scanning direction (X direction). In this case, for example, the mark Mk at the four corners of the partitioned area is detected by an alignment microscope for the forward path (for the first exposure operation), and the mark near the joint is detected by the alignment microscope for the backward path (for the second exposure operation). Mk may be detected. Here, the joint portion means a joint portion between an area exposed by the forward scanning exposure (area where the pattern is transferred) and an area exposed by the backward scanning exposure (the area where the pattern is transferred). To do. As the mark Mk in the vicinity of the joint portion, the mark Mk may be formed on the substrate in advance, or an exposed pattern may be used as the mark Mk.

Moreover, in each said embodiment, the wavelength of the light source used in the illumination system 20 and the illumination light IL irradiated from this light source is not specifically limited, For example, ArF excimer laser light (wavelength 193 nm), KrF excimer laser light ( Ultraviolet light having a wavelength of 248 nm) or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm) may be used.

  In the above embodiment, the illumination system main body 22 including the light source is driven in the scanning direction. However, the present invention is not limited to this. For example, as in the exposure apparatus disclosed in Japanese Patent Laid-Open No. 2000-12422, the light source is fixed. Only the illumination light IL may be scanned in the scanning direction.

  Further, in the above embodiment, the illumination area IAM and the exposure area IA are formed in a strip shape extending in the Y-axis direction. However, the present invention is not limited to this. For example, as disclosed in US Pat. No. 5,729,331. A plurality of regions arranged in a staggered pattern may be combined.

  In each of the above embodiments, the mask M and the substrate P are arranged so as to be orthogonal to the horizontal plane (so-called vertical arrangement). However, the present invention is not limited to this, and the mask M and the substrate P are parallel to the horizontal plane. It may be arranged. In this case, the optical axis of the illumination light IL is substantially parallel to the direction of gravity.

  In addition, fine positioning in the XY plane of the substrate P was performed in accordance with the alignment measurement result during the scanning exposure operation. In addition to this, the surface of the substrate P before the scanning exposure operation (or in parallel with the scanning exposure operation). Position information may be obtained, and surface position control (so-called autofocus control) of the substrate P may be performed during the scanning exposure operation.

  Further, the use of the exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, a semiconductor The present invention can be widely applied to an exposure apparatus for manufacturing, an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern.

  The object to be exposed is not limited to a glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or mask blanks. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member). The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is a flexible sheet, the sheet may be formed in a roll shape. In this case, the partition area to be exposed can be easily changed with respect to the illumination area (illumination light) by rotating (winding) the roll regardless of the step operation of the stage apparatus.

  For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

  As described above, the exposure apparatus and method of the present invention are suitable for scanning exposure of an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for production of a flat panel display. The device manufacturing method of the present invention is suitable for the production of micro devices.

  DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20 ... Illumination system, 30 ... Mask stage apparatus, 40 ... Projection optical system, 50 ... Substrate stage apparatus, 60 ... Alignment system, M ... Mask, P ... Substrate.

Claims (11)

An exposure apparatus that forms a predetermined pattern on the object by a scanning exposure operation that scans an object to be exposed with an energy beam in a predetermined scanning direction,
A mark detection system capable of detecting a mark provided on the object;
A drive system for relatively moving the pattern holding body having the predetermined pattern and the object;
A control system that performs the scanning exposure operation on a partition area to be exposed among a plurality of partition areas provided on the object according to a detection result of the mark detection system;
The control system includes a mark provided in the first region in a state where the pattern holding body and the first partition region provided on the object are opposed to each other, and a second partition different from the first partition region. After detecting a plurality of marks provided in the region and performing the scanning exposure operation on the first partition region based on the detection result, the pattern holder and the second partition region are opposed to each other, Among the plurality of marks provided in the second region, a part of the plurality of marks detected before the scanning exposure operation for the first partition region is detected, and at least the second partition is detected. An exposure apparatus that performs the scanning exposure operation on the second partition region based on a detection result of a mark provided in the region. On the object, a plurality of partitioned regions are provided at least in a direction parallel to the scanning direction,
The exposure apparatus according to claim 1, wherein the first and second partition regions are adjacent to each other in a direction parallel to the scanning direction. On the object, a plurality of partitioned regions are provided at least in a direction orthogonal to the scanning direction,
The exposure apparatus according to claim 1, wherein the first and second partition regions are adjacent to each other in a direction orthogonal to the scanning direction. The optical axis of the energy beam is parallel to a horizontal plane;
The exposure apparatus according to any one of claims 1 to 4, wherein the object is disposed in a state where an exposure surface is orthogonal to the horizontal plane. An exposure method for forming a predetermined pattern on the object by a scanning exposure operation in which an energy beam is scanned in a predetermined scanning direction with respect to an object to be exposed,
Opposing a pattern holder having the predetermined pattern and a first partition region provided in the object;
Detecting a mark provided in the first region;
Detecting a plurality of marks provided in a second partition region different from the first partition region provided in the object;
Performing the scanning exposure operation on the first partition region based on at least a detection result of a mark provided in the first region;
Opposing the pattern holder and the second partition region;
Detecting a part of the marks detected by detecting the plurality of marks among the plurality of marks provided in the second region;
An exposure method comprising: performing the scanning exposure operation on the second partition region based on at least a detection result of a mark provided in the second partition region. On the object, a plurality of partitioned regions are provided at least in a direction parallel to the scanning direction,
The exposure method according to claim 5, wherein the first and second partition regions are adjacent to each other in a direction parallel to the scanning direction. On the object, a plurality of partitioned regions are provided at least in a direction orthogonal to the scanning direction,
The exposure method according to claim 5, wherein the first and second partitioned regions are adjacent to each other in a direction orthogonal to the scanning direction.   The exposure method according to claim 5, wherein the object is a substrate used for a flat panel display.   The exposure method according to claim 8, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more. Exposing the substrate using the exposure method according to claim 8 or 9,
Developing the exposed substrate. A method of manufacturing a flat panel display. Exposing the object using the exposure method according to any one of claims 5 to 7,
Developing the exposed object.

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