JP2016177534A - Information medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fold and fix a substrate in a frame without reducing workability in an information medium that the folded substrate is fixed and glued in the frame.SOLUTION: A framing that an electrode substrate 40 and a controller substrate 50 are glued by an anisotropically conductive glue film 43, and the controller substrate 50 folded near the glued part with the electrode substrate 40 is fixed and glued in a frame 11 and has adhesive 60 sticking temporarily the electrode substrate 40 and the controller substrate 50 in a folded state between the electrode substrate 40 and the controller substrate 50 in the folded state.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an information medium that is fixed and bonded in a frame in a state in which a substrate is folded, and particularly relates to a technique for improving workability when fixed in a frame.

  Conventionally, as a display device for displaying information, a CRT display, a liquid crystal display, a plasma display, or the like is used. These are used for a television receiver to display a television image transmitted from a television station or a personal computer. By being used as a display, it is possible to display information stored in a personal computer or information distributed via the Internet.

  In recent years, in addition to the display devices as described above, thin information display media that display digital information on a thin display medium such as paper have begun to spread. In recent years, it has been considered that such a thin information display medium is provided with a non-contact communication function.

  In general, since the communication performance in non-contact communication depends on the size of the antenna, it is preferable to enlarge the antenna in order to improve the communication performance. On the other hand, an information display unit that displays information is also desired to be enlarged in order to improve visibility.

  In view of this, an information display medium in which a non-contact communication function unit and an information display unit are arranged adjacent to each other and fixed and bonded in a frame in a folded state is considered (see, for example, Patent Document 1). With such a configuration, the entire surface of one surface can be used as an information display unit, and the size of the antenna in the non-contact communication function unit can be close to the outer shape of the information display medium.

Japanese Patent Laid-Open No. 2014-119883

  By the way, in order to construct an information medium by folding a substrate as in the information display medium described above, it is conceivable that at least a folded portion of the substrate is composed of a flexible film.

  However, when the folded part of the substrate is made of a film, when the substrate is fixed and bonded in the frame in the folded state, the force to return the original shape to the substrate by the restoring force of the film works, and workability And the position at which the substrate is fixed in the frame and the folded portion are displaced, and the information medium may become defective.

  In addition, by applying a strong force to the folded part of the board to make a crease, it is possible to avoid the above-mentioned deterioration in workability and generation of defective products, but when wiring is formed in the folded part on the board The wiring may be disconnected by applying a strong force.

  The present invention has been made in view of the problems of the prior art as described above, and reduces workability in an information medium that is fixed and bonded in a frame in a state where the substrate is folded. An object of the present invention is to provide an information medium that is fixed in a frame in a state in which the substrate is folded.

In order to achieve the above object, the present invention provides:
An information medium in which a substrate having a portion having flexibility and restoring force is fixed and bonded in a frame in a state of being folded at the portion,
Temporary adhering means for temporarily adhering the two regions in the folded state is provided between the two regions facing each other in the folded state of the substrate.

  In the present invention configured as described above, when the substrate is folded at a portion having flexibility and restoring force and fixed and bonded in the frame, the two regions facing each other in the folded state of the substrate are Since the substrate is temporarily attached by the temporary attachment means, the folded state of the substrate is maintained even if the substrate is restored to the original shape by the restoring force. Thereby, it is avoided that workability of fixing and bonding the folded substrate in the frame is lowered. In addition, since it is not necessary to crease the folded portion of the substrate in order to maintain the folded state of the substrate, it is avoided that the wiring is disconnected even when the wiring is formed on the substrate. The

  Moreover, when the restoring force of the substrate is strong, it is preferable that the temporary adhering means is provided in a region along the folding portion for folding the substrate.

  Moreover, in the structure which has a buffering material between the two area | regions which oppose in the folded state of a board | substrate, it is possible to use the adhesive provided in the front and back of the buffering material as a temporary sticking means.

  According to the present invention, when the substrate is folded at a portion having flexibility and restoring force and fixed and bonded in the frame, the two regions facing each other in the folded state of the substrate are formed by the temporary sticking means. Since it is configured to be temporarily attached, even if the substrate returns to its original shape due to the restoring force, the folded state of the substrate is maintained and fixed in the frame in that state. The substrate is fixed in the frame in a folded state without deteriorating the properties.

  Further, in the case where the temporary adhering means is provided in the region along the folding portion for folding the substrate, the folded substrate may swell at the folded portion even when the restoring force of the substrate is strong. Is avoided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows one Embodiment of the information medium of this invention, (a) is a surface figure, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows the internal structure of the electronic paper tag shown in FIG. 1, (a) is a surface view of the state which opened the electrode board | substrate and the controller board | substrate, (b) is AA 'sectional drawing shown to (a). It is. It is a figure for demonstrating the process of the first half in the manufacturing method of the electronic paper tag shown in FIG. It is a figure which shows the structure of the shock absorbing material shown in FIG. 1, (a) is a figure which shows the structure of one surface, (b) is A-A 'sectional drawing shown to (a). It is a figure for demonstrating the latter half process in the manufacturing method of the electronic paper tag shown in FIG. It is a figure which shows the structural example of a surface base material and a flame | frame for performing position alignment with a surface base material and a flame | frame easily in the process shown in FIG. It is a figure which shows other embodiment of the information medium of this invention, (a) is a surface figure, (b) is A-A 'sectional drawing shown to (a).

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing an embodiment of an information medium according to the present invention, in which FIG. 1A is a front view and FIG. 1B is a cross-sectional view taken along line A-A ′ shown in FIG. 2A and 2B are diagrams showing the internal structure of the electronic paper tag 1 shown in FIG. 1, wherein FIG. 2A is a surface view of the electrode substrate 40 and the controller substrate 50 opened, and FIG. 2B is a diagram shown in FIG. It is AA 'sectional drawing.

  As shown in FIG. 1, the present embodiment is an electronic paper tag 1 in which a display section 2 for displaying information is surrounded by an outer frame section 3, and information is provided between two surface base materials 10a and 10b. An electronic paper 30 serving as a display layer, an electrode substrate 40, and a controller substrate 50 are sandwiched.

  As shown in FIGS. 1 and 2, the electrode substrate 40 is configured by forming a plurality of display electrodes 41 and wiring electrodes 42 connected thereto on one surface. The plurality of display electrodes 41 are formed in a segment shape in a pattern corresponding to information displayed on the display unit 2. For example, the display unit 2 displays a two-digit number from “00” to “99”. Is for. The wiring electrode 42 is connected to each of the plurality of display electrodes 41 and is for applying a potential to the display electrode 41.

  The electronic paper 30 is laminated on the surface of the electrode substrate 40 on which the display electrodes 41 and the wiring electrodes 42 are formed. As the electronic paper 30, a general type such as an electrophoresis type, an electronic particle type, or an electrochromic is used. In this electronic paper 30, a transparent electrode 32 such as ITO which is a full surface electrode is laminated on the entire surface of one surface of the transparent substrate 31, and a potential difference between the transparent electrode 32 and the display electrode 41 is formed on the transparent electrode 32. Accordingly, an information display layer 33 that variably displays information by changing a visually recognized color is configured to be stacked, and the information display layer 33 side is disposed so as to face the electrode substrate 40.

  The controller board 50 is made of a film made of polyimide or the like which is a flexible material. As shown in FIGS. 1 and 2, a coiled antenna 51 is formed on one surface and display control is performed on the other surface. IC 53 for communication and IC 52 for communication control are provided. The display control IC 53 and the communication control IC 52 are arranged so as to face the inside of the coiled antenna 51. Further, through holes 57 penetrating the front and back of the controller board 50 are formed at both ends of the antenna 51. The controller board 50 is made of a film, but has a restoring force by having a certain thickness.

  The display control IC 53 controls the voltage applied to the transparent electrode 32 of the electronic paper 30 and the display electrode 41 of the electrode substrate 40 in order to variably display information on the display unit 2. It is connected to one end of a wiring 56 formed on the same surface as the control IC 53. The communication control IC 52 controls non-contact communication via the antenna 51, and is connected to one end of a wiring 54 formed on the same surface as the communication control IC 52 of the controller board 50. Is connected to the display control IC 53 through a wiring 55 formed on the same surface. Further, the other end of the wiring 54 is connected to the through hole 57, whereby the antenna 51 formed on one surface of the controller board 50 and the wiring 54 formed on the other surface of the controller board 50. However, they are electrically connected through the through hole 57. Further, in this way, one end of the wiring 56 is connected to the display control IC 53, the display control IC 53 is connected to the communication control IC 52 via the wiring 55, and the wiring 54 connected to the communication control IC 52 is a through hole. By being electrically connected to the antenna 51 through 57, the wiring 56 is indirectly connected to the antenna 51 through the display control IC 53, the communication control IC 52, the wirings 54 and 55, and the through hole 57. Will be. The wiring 56 is connected to the transparent electrode 32, and a voltage is applied to the transparent electrode 32 under the control of the display control IC 53.

  As shown in FIG. 2, the electrode substrate 40 and the controller substrate 50 configured as described above have an end portion where the wiring electrode 42 of the electrode substrate 40 is formed and an end portion where the wiring 56 of the control substrate 50 is formed. The surface of the electrode substrate 40 on which the wiring electrode 42 is formed and the surface of the control substrate 50 on which the wiring 56 is formed are overlapped via an anisotropic conductive adhesive film (ACF) 43. It is configured as a single substrate. When configured as a single substrate, the electrode substrate 40 becomes the first region 4, and the portion of the controller substrate 50 excluding the region overlapped with the electrode substrate 40 becomes the second region 5. The electronic paper 30 and the antenna 51 are electrically connected and provided on one surface of one substrate made of the substrate 50.

  As shown in FIG. 1, the controller board 50 is folded so that the surface on which the antenna 51 is formed is the outside with the boundary portion between the first region 4 and the second region 5 being a fold. . As a result, the region of the controller substrate 50 that is overlapped with the electrode substrate 40 becomes the folded portion 50a, and the first region 4 and the second region 5 face each other. One end of the side not connected to the IC 53 and one end of the wiring electrode 42 of the electrode substrate 40 are electrically connected by the anisotropic conductive adhesive film 43. Moreover, the buffer material 80 is interposed between the 1st area | region 4 and the 2nd area | region 5 of the folded state, and the buffer material 80 is temporarily stuck provided along the folding | returning part 50a. The electrode substrate 40 and the controller substrate 50 are adhered to each other by an adhesive 60 that serves as a means. As a result, the electrode substrate 40 and the controller substrate 50 are adhered to each other by the adhesive 60 in a region along the boundary portion between the first region 4 and the second region 5. As the cushioning material 80, for example, silicone rubber or the like that is self-supporting and has few dents when pressed can be used. A region where the wiring 56 and the wiring electrode 42 are electrically connected is sealed with a sealant 44. The sealant 44 is for preventing moisture from entering a region where the wiring 56 of the controller substrate 50 and the wiring electrode 42 of the electrode substrate 40 are electrically connected.

  In this way, the substrate composed of the electrode substrate 40 and the controller substrate 50 is folded, so that the electrode substrate 40 and the controller substrate 50 are opposite to the surface of the electrode substrate 40 on which the display electrodes 41 and the wiring electrodes 42 are formed. And the surface on which the communication control IC 52 and the display control IC 53 of the control board 50 are provided so as to face each other with the buffer material 80 therebetween, so that the electronic paper 30 and the antenna 51 are connected to the electrode. The substrate 40, the buffer material 80, and the controller substrate 50 are opposed to each other.

  The module composed of the electronic paper 30, the electrode substrate 40, the buffer material 80, and the controller substrate 50 stacked in this way is arranged between the surface base materials 10a and 10b so that the electronic paper 30 is on the surface base material 10a side. Yes.

  As described above, the electronic paper 30, the electrode substrate 40, the buffer material 80, and the controller substrate 50 are sequentially stacked between the two surface base materials 10a and 10b from the surface base material 10a side. The space between the surface base materials 10 a and 10 b is sealed by a frame 11 provided around the periphery, and a transparent resin 70 is filled in a space formed by the surface base materials 10 a and 10 b and the frame 11. The transparent resin 70 is made of a liquid material, and examples of the material thereof include urethane resin, polyethylene resin, CR rubber, NR rubber, NBR rubber, EPDM rubber, silicon rubber, melamine resin, and acrylic resin. Examples thereof include, but are not particularly limited to, resins and EVA resins. The frame 11 may be made of an opaque resin such as polyvinyl chloride.

  The surface substrate 10a is made of a transparent material so that the color change in the electronic paper 30 can be visually recognized, and the mask layer 20 is laminated on the surface thereof. The mask layer 20 includes a concealing layer 21 and a color printing layer 22. The concealing layer 21 is stacked on the entire surface of the surface of the surface base material 10a that does not face the display electrode 41. For example, the electronic paper 30 is visually recognized in a state where no information is displayed on the display unit 2. The color is colored. This concealing layer 21 makes it impossible to visually recognize the wiring board 42 from the surface base material 10a side. The color print layer 22 is laminated so as to surround the display unit 2, and the outer frame unit 3 is formed by being colored in a color different from that of the concealment layer 21.

  In the electronic paper tag 1 configured as described above, with the transparent electrode 32 of the electronic paper 30 set to the ground potential, a plurality of displays are provided via the wiring electrodes 42 according to information displayed on the display unit 2. By selectively applying a positive or negative voltage to the electrode 41, a potential is applied to the electronic paper 30, and the state of the electronic paper 30 is changed by this potential, and the change in this state is visually recognized from the surface substrate 10a side. In such a case, information is displayed in two colors on the display unit 2.

  Below, the manufacturing method of the electronic paper tag 1 mentioned above is demonstrated.

  First, a manufacturing method of a module including the electronic paper 30, the electrode substrate 40, the buffer material 80, and the controller substrate 50 shown in FIG. 1, which is the first half of the manufacturing method of the electronic paper tag 1 shown in FIG. .

  FIG. 3 is a diagram for explaining the first half of the manufacturing method of the electronic paper tag 1 shown in FIG.

  In the first half of the method of manufacturing the electronic paper tag 1 shown in FIG. 1, first, as shown in FIG. 3A, the display electrode 41 and the electrode substrate 40 on which the wiring electrodes 42 are formed are displayed. And the electronic paper 30 is laminated | stacked on the surface in which the wiring electrode 42 was formed.

  Next, the end of the electrode substrate 40 where the wiring electrode 42 is formed and the end of the control substrate 50 where the wiring 56 is formed are connected to the surface of the electrode substrate 40 where the wiring electrode 42 is formed and the control substrate 50. They are superposed via an anisotropic conductive adhesive film 43 so as to face the surface on which the wiring 56 is formed, and are bonded by applying pressure while heating using a heating head (not shown).

  Further, the antenna 51, the wirings 54 to 56 and the through hole 57 are formed, and the communication control IC 52 and the display control IC 53 are mounted on the controller board 50 on which the communication control IC 52 and the display control IC 53 are mounted. The buffer material 80 is placed on the surface, and the controller substrate 50 and the buffer material 80 are temporarily attached by the adhesive 80.

  4A and 4B are diagrams illustrating the configuration of the cushioning material 80 illustrated in FIG. 1, in which FIG. 4A is a diagram illustrating the configuration of one surface, and FIG. 4B is a cross-sectional view taken along line AA ′ illustrated in FIG. is there.

  As shown in FIG. 4, the cushioning material 80 shown in FIG. 1 is configured by forming recesses 81 and 82 having a size sufficient to allow the communication control IC 52 and the display control IC 53 to enter. ing. Moreover, the adhesive 60 is applied along the one end side of the buffer material 80 on both surfaces. The adhesive 60 may be provided by sticking an adhesive tape.

  The buffer material 80 thus configured is placed on the controller board 50 so that the communication control IC 52 and the display control IC 53 enter the recesses 81 and 82, respectively.

  Thereafter, as shown in FIG. 3 (b), the controller board 50 is folded so that the surface on which the antenna 51 is formed becomes the outside with the boundary portion between the first region 4 and the second region 5 being a fold portion. By temporarily sticking the electrode substrate 40 and the buffer material 80 with the adhesive 60, the module 6 including the electronic paper 30, the electrode substrate 40, the buffer material 80, and the controller substrate 50 shown in FIG. 1 is completed. In this module 6, the electrode substrate 40 and the controller substrate 50 are temporarily attached to each other by the adhesive 60 in a region along the boundary portion between the first region 4 and the second region 5. Yes.

  Next, the latter half process in the manufacturing method of the electronic paper tag 1 shown in FIG. 1 is demonstrated.

  FIG. 5 is a diagram for explaining the latter half of the manufacturing method of the electronic paper tag 1 shown in FIG.

  In the latter half of the manufacturing method of the electronic paper tag 1 shown in FIG. 1, first, as shown in FIG. 5A, the entire surface of the surface base material 10a placed on the metal plate 91 is cured. The transparent resin 70 is applied so as to be uniform, and the frame 11 is placed thereon. At this time, an alignment pin (not shown) is installed on the metal plate 91, and the surface base material 10a and the frame 11 are aligned using this pin.

  FIG. 6 is a diagram showing a configuration example of the surface base materials 10a and 10b and the frame 11 for easily aligning the surface base materials 10a and 10b and the frame 11 in the process shown in FIG.

  The surface base material 10a used in the process shown in FIG. 5 has a shape that is slightly larger than the surface base material 10a shown in FIG. 1, as shown in FIG. Two pin holes 12 penetrating front and back are provided in a region larger than the surface base material 10a.

  Further, as shown in FIG. 6B, the frame 11 used in the process shown in FIG. 5 has a shape that is slightly larger than the frame 11 shown in FIG. Two pin holes 13 penetrating front and back are provided in a region facing the pin holes 12 of the surface base material 10a when arranged so as to overlap the surface base material 10a shown.

  Further, as shown in FIG. 6C, the surface base material 10b used in the process shown in FIG. 5 has a shape that is slightly larger than the surface base material 10b shown in FIG. Two pin holes 14 penetrating front and back are provided in a region facing the pin holes 12 and 13 when arranged so as to be superimposed on the surface base material 10a and the frame 11 shown in (a) and (b). Yes.

  Therefore, the surface base material 10 a and the frame 11 can be easily aligned by inserting the pins installed on the metal plate 91 into the pin holes 12 and 13.

  As described above, the transparent resin 70 is interposed between the surface base material 10a and the frame 11 by placing the frame 11 on the surface base material 10a coated with the transparent resin 70 before curing. Then, as the transparent resin 70 is cured, the surface base material 10a and the frame 11 are bonded.

  Next, as shown in FIG. 5B, the module 6 shown in FIG. 3B is installed in the frame 11 so that the electronic paper 30 is on the surface base material 10a side, and the transparent resin 70 The module 6 is placed on the surface base material 10a to which is applied. At this time, if the inner shape of the frame 11 is the same as the outer shape of the module 6, when the module 6 is installed in the frame 40, the surface base is aligned with the frame 11 by the alignment pins. The relative position between the material 10a and the module 6 is determined in advance, whereby the area other than the electronic paper 30 of the module 6 faces the color print layer 22, and the information displayed on the electronic paper 30 is the surface group. The portion of the module 6 other than the electronic paper 30 becomes invisible due to the color printing layer 22.

  Next, as shown in FIG. 5C, the transparent resin 70 before curing is applied again on the module 6.

  Next, as shown in FIG. 5 (d), the surface base material 10 b is placed on the module 6 to which the transparent resin 70 is applied, and is pressurized by the pressure plate 92 from the surface base material 10 b side. At this time, since the surface base material 10 b is formed with pin holes 14 penetrating front and back in a region facing the pin holes 13 of the frame 11 when arranged so as to be superimposed on the frame 11, the metal plate 91. By positioning the positioning pins inserted in the pin holes 12 and 13 into the pin holes 14, the surface base material 10a, the module 6 and the frame 11 and the surface base material 10b can be easily aligned. It can be carried out.

  When pressure is applied from the surface base material 10b side by the pressure plate 92, as shown in FIG. 5D, on the surface base material 10a side of the module 6, the transparent resin 70 before curing is the module 6 and the surface base material 10a. In addition, on the surface base material 10b side of the module 6, the transparent resin 70 before curing is thinly and uniformly extended between the module 6 and the surface base material 10b. The module 6, the surface base materials 10 a and 10 b, and the frame 11 are fixed and bonded together by entering the space between the material 10 b and the frame 11 and then curing the transparent resin 70.

  In this way, the transparent resin 70 is spread by pressurization, so that the thickness thereof becomes constant with reference to the thickness of the frame 11 as shown in FIG. As shown in FIG. 1, the electronic paper tag 1 is completed by cutting it into a shape corresponding to the size of the electronic paper tag 1 shown in FIG.

  In the latter half of the method for manufacturing the electronic paper tag 1 described above, the controller substrate 50 and the electrode substrate 40 are temporarily attached by the adhesive 60 via the buffer material 80 in a state where the controller substrate 50 is folded. Therefore, even if the controller board 50 tries to return to the original shape by the restoring force of the film of the controller board 50, the folded state is maintained. Thereby, it is avoided that workability of fixing and bonding the module 6 in the frame 11 is lowered. Further, since it is not necessary to apply a strong force to the controller board 50 to make a crease, it is possible to prevent the wiring 56 formed on the controller board 50 from being disconnected.

(Other embodiments)
7A and 7B are diagrams showing another embodiment of the information medium of the present invention, in which FIG. 7A is a front view and FIG. 7B is a cross-sectional view taken along line AA ′ shown in FIG.

  In the present embodiment, as shown in FIG. 7, a buffer material is not interposed between the electrode substrate 140 and the controller substrate 150, and the electrode substrate 140 and the controller substrate 150 are not attached to the adhesive 160. Is different in that it is temporarily temporarily attached.

  As shown in FIG. 1, the buffer substrate is not interposed between the electrode substrate 140 and the controller substrate 150 and the electrode substrate 140 and the controller substrate 150 are temporarily attached directly by the adhesive 160. After the controller board 150 is folded, the folded state is maintained even if the controller board 150 returns to its original shape by the restoring force of the film of the controller board 150 in the manufacturing process of the electronic paper tag 101. Therefore, it is avoided that workability is deteriorated. Further, since it is not necessary to apply a strong force to the controller board 150 to make a crease, it is possible to prevent the wiring 156 formed on the controller board 150 from being disconnected.

  In the above-described embodiment, the electrode substrate 40 and the controller substrate 50 are temporarily attached to each other by the adhesive 60 in a region along the boundary portion between the first region 4 and the second region 5. Although it is in a state, the region where the electrode substrate 40 and the controller substrate 50 are temporarily attached is not limited to this region. However, when the restoring force of the film constituting the controller substrate 50 is strong, the electrode substrate 40 and the controller substrate 50 are temporarily attached at the end of the electrode substrate 40 opposite to the folded portion 50a of the controller substrate 50. This is not preferable because the folded portion may swell.

  Further, in the above-described embodiment, the electrode substrates 40 and 140 for displaying information and the controller substrates 50 and 150 made of film and performing non-contact communication are anisotropically conductive adhesive films 43 and 143. However, the substrate applied to the information medium of the present invention is made of a material having flexibility and restoring force, and is fixed in the frame in a folded state. As long as it adhere | attaches, what is comprised from 1 sheet | seat and what was adhere | attached in the edge part may be 3 or more sheets.

  Furthermore, you may equip only a part which has flexibility and a restoring force. In that case, the substrate is folded at a portion having flexibility and restoring force.

DESCRIPTION OF SYMBOLS 1,101 Electronic paper tag 2,102 Display part 3,103 Outer frame part 4 1st area | region 5 2nd area | region 6 Module 10a, 10b, 110a, 110b Surface base material 11,111 Frame 20,120 Mask layer 21, 121 concealing layer 22,122 color printing layer 30,130 electronic paper 31,131 transparent substrate 32,132 transparent electrode 33,133 information display layer 40,140 electrode substrate 41,141 display electrode 42,142 wiring electrode 43,143 anisotropic Conductive adhesive film 44, 44 Sealant 50, 150 Controller board 50a, 150a Folded part 51, 151 Antenna 52, 152 Communication control IC
53,153 Display control IC
54 to 56, 156 Wiring 57 Through hole 60, 160 Adhesive 70, 170 Transparent resin 80 Buffer material 81, 82 Recess 91 Metal plate 92 Pressure plate

Claims (3)

An information medium in which a substrate having a portion having flexibility and restoring force is fixed and bonded in a frame in a state of being folded at the portion,
An information medium having temporary adhering means for temporarily adhering the two regions in a folded state between two regions facing each other in the folded state of the substrate. The information medium according to claim 1,
The temporary sticking means is an information medium provided in a region along a folding portion for folding the substrate. The information medium according to claim 1 or 2,
Having a cushioning material between the two regions in the folded state;
The temporary sticking means is an information medium that is an adhesive provided on the front and back of the cushioning material.

Images