JP2016169969A - Particle count device and particle count system using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a particle count device that makes placement at a desired position or connection to a desired piping connection port possible.SOLUTION: Provided is a particle count device 10 comprising: a measurement head 21 having window parts 18a, 18b for introducing particles into a measurement object area, light irradiation means 13 for emitting light to the measurement object area, and scattered light detection means 14a, 14b for detecting scattered light by the particles introduced into the measurement object area and generating a detection signal; a piping connection part 22 for connecting to a prescribed piping connection port 41a; a case part 23 having a component 16 for controlling the light irradiation means 13 and the scattered light detection means 14a, 14b; and a cable 34 for connecting a control unit 30 for creating particle information on the basis of the detection signal and the case part 23, the particle count device being provided with a trestle 50 having a fitting part 51 connectable to the case part 23 and an installation part 52 for being installed at a connection port 43a other than a prescribed piping connection port.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a particle counting device for detecting fine dust (particles) and a particle counting system using the same.

  For example, semiconductor manufacturing apparatuses such as an ion implantation apparatus and an organic EL film forming apparatus are known that when particles exist in a semiconductor manufacturing apparatus (vacuum processing chamber), the particles adhere to the wafer and the yield decreases. It has been. In particular, as the density and miniaturization of semiconductor devices progress in recent years, the reduction in manufacturing yield due to the particles becomes a serious problem.

  Therefore, the semiconductor manufacturing apparatus is provided with a particle counting device that detects particles floating in the processing chamber in real time (see, for example, Patent Document 1). Particles present in the processing chamber are measured using this particle measuring device, and the manufacturing process conditions are optimized and cleaned based on the measured values, thereby preventing a decrease in manufacturing yield.

Here, the configuration will be described with reference to the schematic configuration diagram of FIG. 1 showing an example of the particle measurement system of the present invention. 6 is a perspective view of the particle measuring apparatus shown in FIG. 1, and FIG. 7 is a cross-sectional view of FIG.
The particle measurement system 1 includes a particle measurement device 10, a control unit 30, a personal computer 40, a serial cross cable 33 for connecting the control unit 30 and the personal computer 40, a particle measurement device 10 and a control unit 30. And a control cable 34 for connecting the two.

  The particle measuring apparatus 10 includes, for example, a stainless steel housing 20, a semiconductor laser element 13 serving as a light emitting element (light irradiation means), photodiodes 14a and 14b serving as light receiving elements (scattered light detecting means), an optical lens 15a, 15 b, a beam stopper 19, and a preamplifier (component) 16 for driving the semiconductor laser element 13.

The housing 20 includes a cylindrical measuring head 21 having an axis in the horizontal direction, a cylindrical ICF 70 hermetic flange (pipe connecting portion) 22, and a cylindrical case portion 23.
The case portion 23 is formed with a connection port 23 a for connecting to the control cable 34. Thereby, the particle measuring device 10 and the control unit 30 can transmit and receive signals via the control cable 34.

  The ICF 70 hermetic flange 22 has a plurality of screw holes 22a penetrating in the horizontal direction. Thus, by passing the screw 42 through the screw hole 22a, the ICF 70 connection port 41a and the ICF 70 hermetic flange 22 formed in the semiconductor manufacturing apparatus 41 can be fixed.

Inside the measuring head 21, a beam stopper 19, photodiodes 14a and 14b, optical lenses 15a and 15b, and a semiconductor laser element 13 are arranged in this order.
As shown in FIG. 7, the semiconductor laser element 13 and the optical lenses 15a and 15b are arranged in the right end portion of the measurement head 21, and output laser light L having a predetermined wavelength to the left. The beam stopper 19 is disposed in the left end portion of the measuring head 21 and absorbs the laser beam L.

In addition, at a predetermined position on the wall surface in the vicinity of the central portion of the measurement head 21, a long-hole-shaped window portion 18a penetrating in the vertical direction and extending in the horizontal direction is formed, and the measurement head is opposed to the window portion 18a in the vertical direction. A long hole-like window portion 18b that penetrates in the vertical direction and is long in the horizontal direction is also formed at a predetermined position on the wall surface 21. That is, the structure is such that the particles enter the central portion (measurement target region) inside the measurement head 21 through the windows 18a and 18b.
As a result, the laser light L emitted from the semiconductor laser element 13 is condensed by the optical lenses 15 a and 15 b, passes through the central portion (measurement target region) inside the measurement head 21, and then enters the beam stopper 19. Absorbed. At this time, if the particles are present in the measurement target region, the laser light L and the particles collide, and the laser light L is scattered by the particles to generate scattered light.

  In addition, a rectangular photodiode 14a is disposed at a predetermined position on the wall surface in the vicinity of the central portion inside the measurement head 21 between the window 18a and the window 18b, and is opposed to the photodiode 14a in the front-rear direction. A rectangular photodiode 14b is also disposed at a predetermined position. Thereby, the scattered light generated by the particles entering the measurement target region (between the pair of photodiodes 14a and 14b) is received by the photodiodes 14a and 14b.

  The photodiodes 14a and 14b are configured to generate pulsed electrical signals (hereinafter referred to as “particle signals”) when irradiated with light. The particle signals are sequentially output to the control unit 30 via the control cable 34.

  The control unit 30 shapes the particle signal (measured value), counts the particles (processing result), calculates the particle size (processing result) of the particles, and sends them to the personal computer 40 to the serial cross cable 33. And a control unit (not shown) for controlling the operation of the particle measuring device 10 via the control cable 34.

  The personal computer 40 includes an input unit (not shown) composed of operation buttons, a keyboard and the like, a display unit 40a composed of a monitor and the like, and displays processing results and measurement values from the signal processing unit on the display unit 40a. A control unit (not shown) that outputs the measurement conditions (sampling frequency, threshold voltage, measurement time, etc.) set by using the serial cross cable 33 to the control unit 30, and a storage unit (not shown). Z)). Thereby, for example, the display unit 40a displays the particle information (for example, the number of particles that have passed during a certain period of time, the particle size, the passing speed, and the like) in real time. When the measurement is finished, a series of measurement results (number of passing particles at each time point during measurement, total number of particles passed during measurement, distribution of particle size and passing speed, etc.) are stored in the storage unit as a measurement file. Is done.

JP-A-6-26823

However, when the ICF 70 connection port 41 a is provided in the semiconductor manufacturing apparatus 41, the particle measuring device 10 can be disposed in the semiconductor manufacturing apparatus 41, but the ICF 70 connection port 41 a is provided in the semiconductor manufacturing apparatus 41. If the measurement head 21 cannot be inserted into the ICF 70 connection port 41a, the particle measuring device 10 cannot be used.
In addition, even if the particle measuring device 10 can be arranged in the semiconductor manufacturing apparatus 41, if the part that seems to be a particle generation source is located in the center of the semiconductor manufacturing apparatus 41, the measuring head is located near the particle generation source. There was a problem that 21 could not be arranged.
Accordingly, an object of the present invention is to provide a particle measuring device that can be arranged at a desired position or connected to a desired pipe connection port.

  The particle measuring apparatus of the present invention made to solve the above problems includes a window for introducing particles into the measurement target region, a light irradiation means for emitting light to the measurement target region, and the measurement target region. A measuring head having a scattered light detecting means for detecting scattered light caused by the introduced particles and generating a detection signal, a pipe connecting portion for connecting to a predetermined pipe connection port, the light irradiation means and the scattered light detection A particle measuring device comprising: a case part having a part for controlling the means; a control unit for creating particle information based on the detection signal; and a cable for connecting the case part. A gantry having a possible attachment part and an installation part for installation other than the predetermined pipe connection port is provided.

  Here, the “predetermined pipe connection port” is a pipe connection port provided in a semiconductor manufacturing apparatus or the like, for example, “ICF70” of an ICF flange, “KF40” of a KF flange, or the like.

  According to the particle measuring apparatus of the present invention, when a predetermined pipe connection port is provided in the semiconductor manufacturing apparatus and a particle generation source exists in the vicinity of the predetermined pipe connection port, By connecting the predetermined pipe connection port, the measurement head is arranged in the semiconductor manufacturing apparatus. Next, the analyst connects the case unit and the control unit with a cable and transmits the particle information to the control unit. On the other hand, when a particle generation source exists in the central part of the semiconductor manufacturing apparatus, first, the analyst connects the case part and the mounting part of the gantry and connects the mounting part of the gantry to the central part in the semiconductor manufacturing apparatus. The measurement head is placed in the semiconductor manufacturing apparatus. Next, the analyst connects the case unit and the control unit with a cable and transmits the particle information to the control unit.

  As described above, the particle measuring device of the present invention can be arranged in the vicinity of the predetermined pipe connection port or in the central portion in the semiconductor manufacturing apparatus.

(Means and effects for solving other problems)
The particle measuring device of the present invention may include a cable in which a pipe connection part for connecting to a specific pipe connection port and a control unit connection part for connecting to the control unit are formed.
Here, the “specific pipe connection port” is a pipe connection port provided in a semiconductor manufacturing apparatus or the like, and may be the same as or different from the predetermined pipe connection port. For example, “KF40” of KF flange or ICF flange “ICF70” and the like.

According to the particle measuring apparatus of the present invention, when the specific pipe connection port is provided in the semiconductor manufacturing apparatus, the analyst first connects the case part and the mounting part of the gantry, and sets the mounting part of the gantry. The measuring head is placed in the semiconductor manufacturing apparatus by being placed at the center in the semiconductor manufacturing apparatus. Next, the analyst connects the cable pipe connection portion and the specific pipe connection port, and connects the cable control unit connection portion and the control unit. Next, the analyst connects the pipe connection portion of the cable and the case portion with the cable, and transmits the particle information to the control unit.
As described above, according to the particle measuring apparatus of the present invention, either the KF flange or the ICF flange can be used.

  Further, in the particle measuring apparatus of the present invention, the installation portion is a horizontal plate, the attachment portion is a vertical plate perpendicular to the horizontal plate, and the case portion is screwed to the attachment portion. May be.

  The particle measurement system of the present invention may include a particle counting device as described above and a control unit that creates particle information based on the detection signal.

1 is a schematic configuration diagram showing an example of a particle measurement system of the present invention. The schematic block diagram which shows another Example of the particle | grain measurement system of FIG. The schematic block diagram which shows another example of the particle measurement system of this invention. The perspective view which shows a mount frame. The figure which shows the structure of a cable with a flange. The perspective view of the particle | grain measuring apparatus shown in FIG. Sectional drawing of the particle | grain measuring apparatus shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below, and includes various modes without departing from the spirit of the present invention.

1 to 3 are schematic configuration diagrams showing an example of a particle measurement system of the present invention. FIG. 4 is a perspective view of a gantry installed in the semiconductor manufacturing apparatus. FIG. 5 is a diagram showing the configuration of the flanged cable used in the present invention. FIG. 5A shows a cable with a predetermined flange, and FIG. 5B shows a cable with a specific flange. In addition, below, about the thing similar to the particle | grain measuring system and particle | grain measuring apparatus of FIG. 1 mentioned above, description is abbreviate | omitted by attaching | subjecting the same code | symbol.
The particle measurement system 1 includes a particle measurement device 10, a control unit 30, a personal computer 40, a serial cross cable 33 for connecting the control unit 30 and the personal computer 40, a particle measurement device 10 and a control unit 30. A cable 35 with a predetermined flange for connecting the connection port 41a for the ICF 70 and the control unit 30, and a connection port 43a for the KF 40 and the control unit 30. And a cable 36 with a specific flange.

The gantry 50 has an L shape having, for example, a stainless steel horizontal plate (installation portion) 52 and a stainless steel vertical plate (attachment portion) 51 erected on the right end of the horizontal plate 52.
The vertical plate 51 has a plurality of screw holes 51a penetrating in the horizontal direction. Thereby, the left side surface of the case portion 23 and the right side surface of the vertical plate 51 can be fixed by passing the screw 53 through the screw hole 51a in a state where the window portion 18a and the window portion 18b are aligned in the vertical direction. It is possible. The horizontal plate 52 can be placed at an arbitrary position in the semiconductor manufacturing apparatuses 41 and 43.

  An ICF 70 hermetic flange (pipe connection part) 35a is formed at one end of the cable 35 with the predetermined flange, and a control unit connectable to the connection port of the control unit 30 at the other end of the cable 35 with the predetermined flange. A connecting portion 35d is formed. The ICF 70 hermetic flange 35 a has a plurality of screw holes 35 b penetrating in the horizontal direction and a connection port 35 c that can be connected to the control cable 34. Thereby, by passing the screw 42 through the screw hole 35b, it is possible to fix the ICF70 connection port 41a and the ICF70 hermetic flange 35a formed in the semiconductor manufacturing apparatus 41 as shown in FIG.

  A KF40 hermetic flange (pipe connection part) 36a is formed at one end of the cable 36 with specific flange, and a control unit connectable to the connection port of the control unit 30 at the other end of the cable 36 with specific flange. A connecting portion 36d is formed. The KF 40 hermetic flange 36 a has a plurality of screw holes 36 b penetrating in the horizontal direction and a connection port 36 c that can be connected to the control cable 34. Thereby, by passing the screw 44 through the screw hole 36b, it is possible to fix the KF40 connection port 43a and the KF40 hermetic flange 36a formed in the semiconductor manufacturing apparatus 43 as shown in FIG. .

Here, a method of using the particle measurement system of the present invention will be described.
(1) When a semiconductor manufacturing apparatus is provided with a connection port for ICF70 and a particle generation source exists in the vicinity of the connection port (see FIG. 1)
First, the analyst connects the ICF 70 hermetic flange 22 and the ICF 70 connection port 41 a using the screw 42, and arranges the measuring head 21 in the semiconductor manufacturing apparatus 41. Next, the analyst connects the connection port 23 a of the case unit 23 and the connection port of the control unit 30 with the control cable 34. Finally, the analyst connects the connection port of the control unit 30 and the connection port of the personal computer 40 with the serial cross cable 33 and transmits the particle information to the personal computer 40.

(2) When the ICF 70 connection port is provided in the semiconductor manufacturing apparatus and the particle generation source is present in the center of the semiconductor manufacturing apparatus (see FIG. 2).
First, the analyst fixes the left side surface of the case portion 23 and the right side surface of the vertical plate 51 of the gantry 50 and places the horizontal plate 52 of the gantry 50 on the central portion in the semiconductor manufacturing apparatus 41 to measure the measurement head. 21 is arranged in the semiconductor manufacturing apparatus 41. Next, the analyst connects the ICF 70 hermetic flange 35 a of the cable 35 with a predetermined flange and the connection port 41 a for ICF 70 using the screw 42. Next, the analyst connects the connection port 23 a of the case portion 23 and the connection port 35 c of the ICF 70 hermetic flange 35 a with the control cable 34. Finally, the analyst connects the connection port of the control unit 30 and the connection port of the personal computer 40 with the serial cross cable 33 and transmits the particle information to the personal computer 40.

(3) When a semiconductor manufacturing apparatus is provided with a connection port for KF40 (see FIG. 3)
First, the analyst fixes the left side surface of the case portion 23 and the right side surface of the vertical plate 51 of the gantry 50 and places the horizontal plate 52 of the gantry 50 on the central portion in the semiconductor manufacturing apparatus 41 to measure the measurement head. 21 is arranged in the semiconductor manufacturing apparatus 43. Next, the analyst connects the KF 40 hermetic flange 36 a of the cable 36 with the specific flange and the KF 40 connection port 43 a using the screw 44. Next, the analyst connects the connection port 23 a of the case portion 23 and the connection port 36 c of the KF 40 hermetic flange 36 a with the control cable 34. Finally, the analyst connects the connection port of the control unit 30 and the connection port of the personal computer 40 with the serial cross cable 33 and transmits the particle information to the personal computer 40.

  As described above, according to the particle measuring system of the present invention, the particle measuring apparatus 10 can be arranged at a desired position and connected to the desired pipe connection ports 41a and 43a.

<Other embodiments>
(1) In the particle measurement system described above, the gantry 50 is L-shaped, but the shape is not particularly limited, and may be T-shaped.

(2) In the particle measuring apparatus 10 described above, the configuration in which the beam stopper 19 is disposed in the left end portion of the measuring head 21 is shown, but instead of this, a reflecting member that reflects light is disposed outside the measurement target region. It is good also as a structure which is.

  The present invention can be used in a particle counting device for detecting particles.

1: Particle measuring system 10: Particle measuring device 13: Semiconductor laser element (light irradiation means)
14a, 14b: Photodiode (scattered light detection means)
16: Preamplifier (component)
18a, 18b: Window part 21: Measuring head 22: ICF70 hermetic flange (piping connection part)
23: Case part 30: Control unit 34: Control cable 41a: Connection port for ICF70 (predetermined piping connection port)
50: Mount 51: Vertical plate (mounting part)
52: Horizontal plate (installation part)

Claims (4)

A window for introducing particles into the measurement target area, a light irradiating means for emitting light to the measurement target area, and a scatter for detecting scattered light from the particles introduced into the measurement target area and generating a detection signal A measuring head having a light detecting means;
A pipe connection for connecting to a predetermined pipe connection port;
A case portion having components for controlling the light irradiation means and the scattered light detection means;
A particle measuring device comprising a control unit for creating particle information based on the detection signal and a cable for connecting the case part,
A particle counting device comprising: a mount having an attachment portion connectable to the case portion and an installation portion for installation other than the predetermined pipe connection port.   The particle counter according to claim 1, further comprising a cable in which a pipe connection part for connecting to a specific pipe connection port and a control unit connection part for connecting to the control unit are formed. The installation part is a horizontal plate,
The mounting portion is a vertical plate perpendicular to the horizontal plate;
The particle counter according to claim 1, wherein the case portion is screwed to the attachment portion. The particle counter according to any one of claims 1 to 3,
A particle counting system comprising: a control unit that creates particle information based on the detection signal.

Images