JP2016158145A - Crystal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal device which reduces fluctuation of an oscillatory frequency of a crystal element.SOLUTION: A crystal device includes: a substrate 110a; a first frame body 110b provided on an upper surface of the substrate 110a; a second frame body 110c provided on a lower surface of the substrate 110a; a pair of electrode pads 111 provided on the upper surface of the substrate 110a; a plurality of connection pads 116 provided on the lower surface of the substrate 110a; a crystal element 120 mounted on the pair of electrode pads 111; an integrated circuit element 150 mounted on the connection pads 116; a first monitor electrode 118 which is electrically connected with the pair of electrode pads 111 and is provided on the lower surface of the substrate 110a along an inner peripheral edge of the second frame body 110c; a second monitor electrode 119 which is electrically connected to the first monitor electrode 118 and is provided on the lower surface of the substrate 110a so as to be positioned between the connection pads 116; and a lid body 130 for hermetically sealing the crystal element 120.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a crystal device used in, for example, an electronic apparatus.

  A quartz crystal device uses a piezoelectric effect of a quartz crystal element to cause a thickness-shear vibration so that both surfaces of a quartz base plate are shifted from each other, thereby generating a specific frequency. A quartz crystal element mounted on an electrode pad provided on the upper surface of the substrate via a conductive adhesive, an integrated circuit element mounted on a connection pad provided on the lower surface of the substrate via a conductive bonding material, and a crystal In order to measure the electrical characteristics of the element, a device having a monitor electrode provided near the center of the lower surface of the substrate has been proposed (for example, see Patent Document 1 below).

JP 2003-163540 A

  Although the above-described quartz device is remarkably miniaturized, there is a possibility that the area of the monitor electrode provided on the substrate may be reduced. For this reason, when measuring the electrical characteristics of a crystal element, the conventional crystal device requires a measuring probe to contact a monitor electrode with a small area, which requires labor and time for measurement. There was a risk of lowering.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a quartz crystal device that can be reduced in size while improving the area of the monitor electrode and can improve productivity.

  A quartz crystal device according to one aspect of the present invention includes a rectangular substrate, a first frame provided along the outer periphery of the upper surface of the substrate, and a second frame provided along the outer periphery of the lower surface of the substrate. A body, a pair of electrode pads provided on the upper surface of the substrate, a plurality of connection pads provided on the lower surface of the substrate, a crystal element mounted on the pair of electrode pads, and an integrated circuit device mounted on the connection pads And a first monitor electrode provided on the lower surface of the substrate along the inner peripheral edge of the second frame, and electrically connected to the first monitor electrode. A second monitor electrode provided on the lower surface of the substrate so as to be positioned therebetween, and a lid for hermetically sealing the quartz crystal element are provided.

  A quartz crystal device according to one aspect of the present invention includes a rectangular substrate, a first frame provided along the outer periphery of the upper surface of the substrate, and a second frame provided along the outer periphery of the lower surface of the substrate. A body, a pair of electrode pads provided on the upper surface of the substrate, a plurality of connection pads provided on the lower surface of the substrate, a crystal element mounted on the pair of electrode pads, and an integrated circuit device mounted on the connection pads And a first monitor electrode provided on the lower surface of the substrate along the inner peripheral edge of the second frame, and electrically connected to the first monitor electrode. A second monitor electrode provided on the lower surface of the substrate so as to be positioned therebetween, and a lid for hermetically sealing the crystal element. By doing in this way, it becomes possible to reduce in size, ensuring the area which combined the 1st monitor electrode and the 2nd monitor electrode. In addition, when measuring the electrical characteristics of the quartz element, the quartz device stably measures the electrical characteristics of the quartz element by bringing a measurement probe into contact with the boundary between the first monitor electrode and the second monitor electrode. Therefore, productivity can be improved.

It is a disassembled perspective view which shows the crystal device in this embodiment. (A) It is sectional drawing in AA of the quartz crystal device shown in FIG. 1, (b) It is sectional drawing in BB of the quartz crystal device shown in FIG. (A) It is the top view which looked at the package which comprises the crystal device in this embodiment from the top, (b) The top view which looked at the board | substrate of the package which comprises the crystal device in this embodiment from the top. (A) It is the top view which looked at the board | substrate of the package which comprises the crystal device in this embodiment from the bottom, (b) The top view which looked at the package which comprises the crystal device in this embodiment from the bottom.

  As shown in FIGS. 1 and 2, the crystal device in this embodiment includes a package 110, a crystal element 120 bonded to the upper surface of the package 110, and an integrated circuit element 150 bonded to the lower surface of the package 110. And a lid 130 joined to the upper surface of the package 110. The package 110 has a first recess K1 surrounded by the upper surface of the substrate 110a and the inner surface of the first frame 110b. The package 110 has a second recess K2 formed by the lower surface of the substrate 110a and the inner surface of the second frame 110c. Such a crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape, and functions as a mounting member for mounting the crystal element 120 on the upper surface and mounting the integrated circuit element 150 on the lower surface. A pair of electrode pads 111 for bonding the crystal element 120 are provided on the upper surface of the substrate 110a, and a pair of connection pads 116 for bonding the integrated circuit element 150 are provided on the lower surface. The substrate 110a is made of an insulating layer made of a ceramic material such as alumina ceramic or glass-ceramic. The substrate 110a may be one using an insulating layer or may be a laminate of a plurality of insulating layers. An electrode pad 111 provided on the upper surface, a connection pad 116 provided on the lower surface of the substrate 110a, and an external terminal 112 provided on the lower surface of the second frame 110c described later are electrically connected to the surface and the inside of the substrate 110a. A wiring pattern 113, a conductor portion 114, and a via conductor 115 are provided for connection.

  The first frame 110b is disposed on the upper surface of the substrate 110a, and is for forming the first recess K1 on the upper surface of the substrate 110a. The second frame 110c is disposed on the lower surface of the substrate 110a and is for forming the second recess K2 on the upper surface of the substrate 110a. The first frame 110b and the second frame 110c are made of a ceramic material such as alumina ceramics or glass-ceramics, and are formed integrally with the substrate 110a.

  Here, the case where the dimension of one side when the package 110 is viewed in plan is 1.0 to 3.0 mm and the dimension of the package 110 in the vertical direction is 0.2 to 1.5 mm is taken as an example. The sizes of the first recess K1 and the second recess K2 will be described. The lengths of the long sides of the first recess K1 and the second recess K2 are 0.7 to 2.0. mm, and the length of the short side is 0.5 to 1.5 mm. Moreover, the length of the up-down direction of the 1st recessed part K1 and the 2nd recessed part K2 is 0.1-0.5 mm.

  In addition, external terminals 112 are provided at the four corners of the lower surface of the second frame 110c. The external terminal 112 is electrically connected to a connection pad 116 provided on the lower surface of the substrate 110a.

  The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. The electrode pad 111 includes a first electrode pad 111a and a second electrode pad 111b. The electrode pad 111 is electrically connected to an external terminal 112 provided on the lower surface of the substrate 110a via a wiring pattern 113 and a conductor portion 114 provided on the substrate 110a.

  On the pair of electrode pads 111, a pair of convex portions B1 that are rectangular in plan view are provided. In addition, the pair of convex portions B1 is provided along the outer peripheral edge on the electrode pad 111 whose one side faces the center side of the substrate 110a when seen in a plan view, and another side connected to the one side. Is provided along the outer peripheral edge on the electrode pad 111 facing the outer peripheral edge of the substrate 110a.

  The external terminal 112 is used for bonding to a mounting pad (not shown) on an external mounting substrate such as an electric device. The external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. The third external terminal 112c is electrically connected to the sealing conductor pattern H through the third via conductor 115c. The third external terminal 112c is connected to a mounting pad connected to a ground potential that is a reference potential on a mounting substrate of an electronic device or the like. As a result, the lid 130 bonded to the sealing conductor pattern H is connected to the third external terminal 112c having the ground potential. Therefore, the shielding property in the recessed part K by the cover body 130 is improved.

  The wiring pattern 113 is for electrically connecting the electrode pad 111 and the via conductor 115 and electrically connecting the via conductor 115 and the conductor portion 114. The wiring pattern 113 includes a first wiring pattern 113a and a second wiring pattern 113b. The wiring pattern 113 is provided so as to overlap the first frame 110b in plan view. By doing so, the crystal device suppresses the generation of stray capacitance between the wiring pattern 113 and the crystal element 120, so that this stray capacitance is not added to the crystal element 120, and therefore the oscillation frequency Can be prevented from fluctuating.

  The first wiring pattern 113a is electrically connected to the second electrode pad 111b and the second via conductor 115b. The first wiring pattern 113a extends in the long side direction of the first frame 110b adjacent to the second electrode pad 111b, and a part of the first wiring pattern 113a is exposed. The second wiring pattern 113b is electrically connected to the third conductor portion 114c and the third via conductor 115c. The second wiring pattern 113b extends from the third via conductor 115c toward the third conductor portion 114c provided at the corner of the substrate 110a adjacent thereto.

  Thus, when the crystal element 120 is mounted, a part of the wiring pattern 113 is provided so as to extend from the electrode pad 111 toward the long side direction of the first frame 110b and to be exposed. In addition, since the conductive adhesive 140 that is about to overflow flows out along the wiring pattern 113, the conductive adhesive 140 does not flow toward the center of the package 110 and adheres to the excitation electrode 122. Can be suppressed.

  The conductor 114 is for electrically connecting the wiring pattern 113 or the connection pattern 117 and the external terminal 112. The conductor part 114 is provided inside a notch provided in a corner part of the substrate 110a. Both ends of the conductor portion 114 are connected to the wiring pattern 113 or the connection pattern 117 and the external terminal 112. In this way, the connection pad 116 is electrically connected to the external terminal 112 via the connection pattern 117 and the conductor portion 114. The conductor part 114 includes a first conductor part 114a, a second conductor part 114b, a third conductor part 114c, and a fourth conductor part 114d.

  The via conductor 115 is provided inside the substrate 110a, and both ends thereof are electrically connected to the electrode pad 111 and one of the first monitor electrodes 118a, and are electrically connected to a sealing conductor pattern H and an external terminal 112 described later. It is intended for connection. The via conductor 115 includes a first via conductor 115a, a second via conductor 115b, and a third via conductor 115c. The via conductor 115 is provided by filling a conductor in a through hole provided in the substrate 110a.

  The connection pad 116 is used for mounting the integrated circuit element 150 on the connection pad. The connection pad 116 is provided on the lower surface of the substrate 110a, and is provided along the inside of the second frame 110c in plan view. Three connection pads 116 are provided along one long side of the substrate 110a, and three connection pads 116 are provided along opposite sides. As shown in FIG. 4A, the connection pad 116 includes a first connection pad 116a, a second connection pad 116b, a third connection pad 116c, a fourth connection pad 116d, a fifth connection pad 116e, and a sixth connection. It is constituted by a pad 116f. The first connection pad 116a and the first external terminal 112a are connected by a first connection pattern 117a provided on the lower surface of the substrate 110a and a first conductor portion 114a provided at a corner of the substrate 110a and the second frame 110c. Has been. The second connection pad 116b and the other second monitor electrode 119b are electrically connected. The third connection pad 116c and the third external terminal 112c are connected by a third connection pattern 117c provided on the lower surface of the substrate 110a and a third conductor portion 114c provided at a corner of the second frame 110c. . The fourth connection pad 116d and the second external terminal 112b are connected by a second connection pattern 117b provided on the lower surface of the substrate 110a and a second conductor portion 114b provided at a corner of the second frame 110c. . The fifth connection pad 116e and the one second monitor electrode 119a are electrically connected. The sixth connection pad 116f and the fourth external terminal 112d are connected by a fourth connection pattern 117d provided on the lower surface of the substrate 110a and a fourth conductor portion 114d provided at a corner of the second frame 110c. .

  The connection pattern 117 is for electrically connecting the connection pad 115 and the conductor portion 114. The connection pattern 117 is provided on the lower surface of the substrate 110a, and is drawn from the connection pad 115 toward the nearby conductor 114.

  The first monitor electrode 118 and the second monitor electrode 119 are for measuring the characteristics of the crystal element 120 by bringing a measurement probe into contact therewith. The first monitor electrodes 118 are provided as a pair along the short side of the substrate 110a. The first monitor electrode 118 includes one first monitor electrode 118a and the other first monitor electrode 118b. One first monitor electrode 118a is electrically connected to a first electrode pad 111a provided on the upper surface of the substrate 110a via a first via conductor 115a provided on the substrate 110a. The other first monitor electrode 118b is a second electrode pad provided on the upper surface of the substrate 110a via a first wiring pattern 113a provided on the upper surface of the substrate 110a and a second via conductor 115b provided on the substrate 110a. 111b is electrically connected.

  One first monitor electrode 118a, which is one of the first monitor electrodes 118, is provided at a position overlapping the pair of electrode pads 111 in plan view. Further, by doing so, heat transmitted from the crystal element 120 is transmitted to one first monitor electrode 118a through the substrate 110a directly below the electrode pad 111, and heat is transmitted from one first monitor electrode 118a. Released. Therefore, since such a quartz crystal device can shorten the heat conduction path, it is possible to further reduce a difference from the temperature around the actual quartz crystal element 120, and temperature correction is performed by the integrated circuit element 150 described later. Can be made easier.

  The second monitor electrode 119 includes one second monitor electrode 119a and the other second monitor electrode 1119. As shown in FIG. 4A, the second monitor electrode 119 is provided so as to be positioned between the connection pads 116 provided so as to face the long side of the substrate 110a. One second monitor electrode 119a is electrically connected to the fifth connection pad 116e. The other second monitor electrode 119b is electrically connected to the second connection pad 116b. The second monitor electrode 119 is provided at a position overlapping the integrated circuit element 150 in plan view. By doing so, the stray capacitance generated between the mounting pattern on the mounting substrate of the electronic device or the like and the second monitor electrode 119 is reduced, so that the stray capacitance is not added to the crystal element 120. The fluctuation of the oscillation frequency of 120 can be reduced.

  In addition, one second monitor electrode 119a of the second monitor electrode 119 is provided so as to be positioned between the pair of electrode pads 111 in plan view. Further, by doing so, the heat transferred from the crystal element 120 is transferred to one of the second monitor electrodes 119a via the substrate 110a directly below the electrode pad 111, and the heat is transferred from one of the second monitor electrodes 119a. Released. Therefore, since such a quartz crystal device can shorten the heat conduction path, it is possible to further reduce a difference from the temperature around the actual quartz crystal element 120, and temperature correction is performed by the integrated circuit element 150 described later. Can be further facilitated.

  Such a quartz crystal device can be reduced in size while ensuring an area combined with the first monitor electrode 118 and the second monitor electrode 119 as compared with the monitor electrode of the conventional piezoelectric device. Further, when measuring the electrical characteristics of the crystal element 120, the quartz crystal device brings the measurement probe into contact with the boundary between the first monitor electrode 118 and the second monitor electrode 119, so that the first monitor electrode 118 or the second monitor electrode is contacted. It is possible to reliably contact either one of the electrodes 119. Since such a quartz crystal device can stably measure the electrical characteristics of the quartz crystal element 120, productivity can be improved.

  The convex portion B1 is intended to suppress the vertical inclination of the short side of the crystal element 120 and to prevent the end of the long side of the crystal element 120 from contacting the substrate 110a or the lid 130. The convex portion B1 is for suppressing the free end of the crystal element 120 from coming into contact with the substrate 110a. A pair of convex part B1 is comprised by 1st convex part B1a and 2nd convex part B1b. The first convex portion B1a is provided on the upper surface of the first electrode pad 111a, and the second convex portion B1b is provided on the upper surface of the second electrode pad 111b. Similarly to the electrode pad 111, the convex portion B1 is provided by performing gold plating or nickel plating on the upper surface of a sintered body of a metal powder such as tungsten, molybdenum, copper, silver, or silver palladium.

  Also, one side of the pair of convex portions B1 facing the center side of the substrate 110a is provided so as to be aligned on the same straight line as shown in FIG. In this way, when the extraction electrode 123 of the crystal element 120 is mounted on the electrode pad 111 while being in contact with the pair of convex portions B1, the crystal element 120 can be mounted in a stable state without being inclined.

  Further, the convex portion B <b> 1 is provided at a position facing the extraction electrode 123 on the outer peripheral edge of the crystal element 120. By doing so, when the crystal element 120 is mounted on the electrode pad 111 via the conductive adhesive 140, even if the crystal element 120 is inclined, the lead electrode 123 is in contact with the convex portion B1. Thus, the crystal element 120 can be mounted in a stable state without tilting downward from the convex portion B1. Further, the convex portion B <b> 1 is provided at a position overlapping the extraction electrode 123 on the outer peripheral edge on the fixed end side of the crystal element plate 121 in plan view. By doing in this way, it can reduce that the fixed end of crystal element 120 contacts the upper surface of substrate 110a.

  The projection B2 has a rectangular shape in plan view and is provided at a position facing the free end side of the crystal element 120 to prevent the free end side of the crystal element 120 from contacting the substrate 110a. It is. The projection B2 is provided on the substrate 110a in the first recess K1 so that the long side of the projection B2 and the long side of the substrate 110a are substantially parallel. By doing so, it is possible to suppress chipping or the like due to the free end side of the crystal element 120 coming into contact with the substrate 110a when an impact such as dropping is applied to the crystal device.

  Here, when the package 110 is viewed in plan, the dimension of one side is 1.0 to 3.0 mm, and the vertical dimension of the package 110 is 0.7 to 1.5 mm as an example. The size of the pad 111 and the convex portion B1 will be described. The side length of the electrode pad 111 is 250 to 400 μm. The length of the thickness of the electrode pad 111 in the vertical direction is 10 to 50 μm. The length of the side of the triangular convex portion B1 formed along the outer peripheral edge of the electrode pad 111 is 200 to 400 μm. The length of the thickness of the convex part B1 in the vertical direction is 7 to 30 μm. Further, the length of the protrusion B2 parallel to the long side direction of the substrate 110a is 500 to 800 μm, and the length of the protrusion B2 parallel to the short side direction of the substrate 110a is 150 to 300 μm. Further, the length in the vertical direction of the protrusion B2 is about 30 to 100 μm.

  In addition, the arithmetic average surface roughness of the electrode pad 111 is 0.02 to 0.10 μm, and the arithmetic average surface roughness of the surface of the substrate 110a is 0.5 to 1.5 μm. Therefore, although the conductive adhesive 140 spreads in the direction of the wiring pattern 113 which is a place where the convex portion B1 on the electrode pad 111 is not provided, the conductive adhesive 140 spreads from the electrode pad 111 to the substrate. It becomes difficult to spread toward 110a.

  The sealing conductor pattern H plays a role of improving the wettability of the sealing member 131 when it is joined to the lid 130 via the sealing member 131. As shown in FIGS. 3 and 4, the sealing conductor pattern H is electrically connected to the external terminal 112 c through the third via conductor 115 c. The sealing conductor pattern H has a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating on the surface of the conductor pattern made of tungsten or molybdenum, for example, so as to surround the upper surface of the first frame 110b in an annular shape. Is formed.

  The conductive adhesive 140 contains conductive powder as a conductive filler in a binder such as silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, One containing either nickel or nickel iron, or a combination thereof is used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or a bismaleimide resin is used, for example.

  The conductive adhesive 140 is disposed so as to be spaced from the excitation electrode 122 of the crystal element 120. In the quartz crystal device, the conductive adhesive 140 and the excitation electrode 122 are arranged with a space therebetween, so that a short circuit caused by the conductive adhesive 140 adhering to the excitation electrode 122 can be reduced. .

  Further, by using a conductive adhesive 140 having a viscosity of 35 to 45 Pa · s, the conductive adhesive 140 does not flow from the electrode pad 111 to the upper surface of the substrate 110a when applied. Since it remains on the pad 111, the thickness of the conductive adhesive 140 in the vertical direction can also be secured. The length of the thickness of the conductive adhesive 140 in the vertical direction is 10 to 25 μm. By ensuring the thickness of the conductive adhesive 140 in this way, even if an impact applied by dropping or the like is applied to the quartz crystal element 120 in the vertical direction around the conductive adhesive 140, the impact is made conductive. The adhesive 140 can sufficiently absorb and relax the absorption.

  Here, a method for manufacturing the package 110 will be described. When the substrate 110a and the frame 110b are made of alumina ceramics, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder is prepared. In addition, a predetermined conductor paste is applied to the surface of the ceramic green sheet or a through-hole previously punched by punching the ceramic green sheet by screen printing or the like. Further, these green sheets are laminated and press-molded and fired at a high temperature. Finally, nickel plating or gold plating is applied to a predetermined portion of the conductor pattern, specifically, the pair of electrode pads 111 or the external terminals 112, the first convex portion B1a, the second convex portion B1b, and the protruding portion B2. It is produced by. Moreover, the conductor paste is comprised from the sintered compact etc. of metal powders, such as tungsten, molybdenum, copper, silver, or silver palladium, for example.

  As shown in FIG. 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  As shown in FIG. 2, the quartz crystal element 120 has the excitation electrode 122 and the extraction electrode 123 attached to the upper and lower surfaces of the quartz base plate 121, as shown in FIGS. 1 and 2. It has the structure made. The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on each of the upper surface and the lower surface of the quartz base plate 121. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the crystal base plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123 a is extracted from the first excitation electrode 122 a and is provided so as to extend toward one side of the crystal base plate 121. The second extraction electrode 123 b is extracted from the second excitation electrode 122 b and is provided so as to extend toward one side of the crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the crystal base plate 121. In the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111 a and the second electrode pad 111 b is a fixed end connected to the upper surface of the substrate 110, and the other end is between the upper surface of the substrate 110. The quartz crystal element 120 is fixed on the substrate 110 by a cantilevered support structure having a free end with a gap.

  The first lead electrode 123a of the crystal element 120 is in contact with the first convex portion B1a, and the second lead electrode 123b of the crystal element 120 is in contact with the second convex portion B1b. Thus, by bringing the lead electrode 123 of the crystal element 120 into contact with the convex portion B1, in the process of mounting the crystal element 120 on the electrode pad 111, even if the mounting position of the crystal element 120 is shifted and the mounting angle is inclined. The long-side end of the crystal element 120 is supported by being in contact with the convex portion B1, the inclination of the short-side of the crystal element 120 is suppressed, and the long-side end of the crystal element 120 is attached to the substrate 110a or the lid 130. Contact can be prevented. Therefore, fluctuations in the oscillation frequency of the crystal element 120 are prevented, and productivity can be improved.

  Further, the quartz crystal device adjusts the oscillation frequency of the quartz crystal element 120 by scraping the surface of the excitation electrode 122 of the quartz crystal element 120 with, for example, an ion gun. Further, in the conventional quartz device, the wiring pattern provided on the upper surface of the substrate is exposed even in the vicinity of the excitation electrode of the crystal element, and therefore the wiring pattern is scraped when the excitation electrode is shaved with an ion gun. There is. Further, in the conventional crystal device, the shavings of the wiring pattern may adhere to the excitation electrode of the crystal element, and the oscillation frequency may fluctuate. However, in the quartz crystal device of this embodiment, as shown in FIG. 3A, the wiring pattern 113 is not exposed in the vicinity of the excitation electrode 122 of the quartz crystal element 120. Since they are provided at the overlapping positions, it is possible to prevent the wiring pattern 113 from being removed when the excitation electrode 122 is removed by the ion gun. Further, in such a crystal device, since the shavings of the wiring pattern 113 are not generated, the shavings do not adhere to the excitation electrode 122 of the crystal element 120, and the oscillation frequency can be output stably. Become.

  Further, the lead electrode 123 of the crystal element 120 has a convex portion B1. Even if the crystal element 120 is tilted at the time of mounting, the lead electrode 123 contacts the convex portion B1, so that the fixed end side of the crystal element 120 has the convex portion B1. Since the distance corresponding to the thickness in the vertical direction can be ensured, the free end of the crystal element 120 does not float too much, and the free end of the crystal element 120 can be prevented from contacting the lid 130.

  Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a manufacturing method of the crystal element 120 will be described. First, the crystal element 120 is cut from the artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer periphery of the crystal base plate 121, and the central portion of the crystal base plate 121 is thicker than the outer peripheral portion of the crystal base plate 121. The bevel processing provided is performed. Then, the quartz crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by depositing a metal film on both main surfaces of the quartz base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Is done.

  A method for bonding the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied so as to spread on the electrode pad 111 by, for example, a dispenser. The crystal element 120 is conveyed onto the conductive adhesive 140. Further, the quartz crystal element 120 is placed on the conductive adhesive 140 such that the lead-out electrode 123 on the outer peripheral edge of the quartz crystal element 120 on the fixed end side overlaps the convex portion B1 in plan view. At this time, the overflowing conductive adhesive 140 flows along the exposed first wiring pattern 113a. The conductive adhesive 140 is cured and contracted by being heated and cured. In the crystal element 120, when the conductive adhesive 140 is cured and contracted, the fixed end side of the crystal element 120 is pulled downward, and the principle of the insulator using the second convex portion B1b as a fulcrum works. It joins to a pair of electrode pad 111 so that the free end side of 120 may float up. Further, when the fixed end side of the crystal element 120 is pulled downward when the conductive adhesive 140 is cured and contracted, the electrode pad 111 is in a state where the protruding portion B1 and the lead electrode 123 on the outer peripheral edge of the crystal element 120 are in contact with each other. To be joined.

  As the integrated circuit element 150, for example, a rectangular flip-chip type integrated circuit element having a plurality of connection pads is used, and a temperature sensor for detecting an ambient temperature state is provided on a circuit forming surface (upper surface), a crystal. Storage element unit for storing temperature compensation data for compensating temperature characteristic of element 120, temperature compensation circuit unit for correcting vibration characteristic of crystal element 120 according to temperature change based on temperature compensation data, and temperature compensation circuit unit thereof And an oscillation circuit unit that generates a predetermined oscillation output. The output signal generated by the oscillation circuit unit is output outside the temperature-compensated crystal oscillator via one of the external terminals 112, and is used as a reference signal such as a clock signal, for example.

  The storage element unit is composed of PROM or EEPROM. Temperature compensation control data for each of the following three-dimensional functions, which are temperature compensation functions, such as the third-order component adjustment value α, the first-order component adjustment value β, and the zero-order component adjustment value γ, are stored in the external terminal 112. The data is input and stored from one of the write / read terminals. A register map is stored in the storage element section. The register map indicates what operation is performed when the control data is input to each address data and the control section reads the data and outputs a signal.

  The temperature compensation circuit unit includes a cubic function generating circuit, a quintic function generating circuit, and the like. For example, in the case of a cubic function generation circuit, the temperature compensation control data input to the storage element section is read, and a voltage derived from the temperature compensation control data with a cubic function is generated for each temperature. The external ambient temperature at this time is obtained from a temperature sensor in the integrated circuit element 150. The temperature compensation circuit unit is connected to the cathode of the variable capacitance diode, and a voltage is applied from the temperature compensation circuit unit. As described above, the frequency temperature characteristic is flattened by applying the voltage from the temperature compensation circuit unit to the variable capacitance diode and correcting the frequency temperature characteristic of the crystal element 120.

  As shown in FIG. 2, the integrated circuit element 150 is mounted on a connection pad 116 provided on the lower surface of the substrate 110a via a conductive bonding material 160 such as solder. Further, the connection terminal 151 of the integrated circuit element 150 is connected to the connection pad 116. The connection pad 116 is electrically connected to the external terminal 112 through the connection pattern 117 and the conductor portion 115. One of the external terminals 112 plays a role of a ground terminal by being connected to a mounting pad connected to a ground which is a reference potential on a mounting board of an electronic device or the like. Therefore, one of the connection terminals 151 of the integrated circuit element 150 is connected to the ground that is the reference potential.

  The temperature sensor provided in the integrated circuit element 150 is provided so as to be positioned in the monitor electrode 119 in plan view. By doing so, the heat transferred from the crystal element 120 to the first monitor electrode 118 or the second monitor electrode 119 via the wiring pattern 113 and the via conductor 114 from the electrode pad 111 is transferred to the first monitor electrode 119. Heat is dissipated from the electrode 118 or the second monitor electrode 119 and transmitted to a temperature sensor provided in the integrated circuit element 150. Therefore, since the temperature compensation type crystal oscillator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the integrated circuit element 150 are approximated, and the temperature sensor of the integrated circuit element 150 is obtained. The difference between the temperature and the actual temperature around the quartz crystal element 120 can be further reduced.

  A method for bonding the integrated circuit element 150 to the substrate 110a will be described. First, the conductive bonding material 160 is applied to the connection pad 116 by, for example, a dispenser. The integrated circuit element 150 is placed on the conductive bonding material 160. The conductive bonding material 160 is melt bonded by heating. Therefore, the integrated circuit element 150 is bonded to the connection pad 116.

  As shown in FIGS. 1 and 2, the integrated circuit element 150 has a rectangular shape, and six connection terminals 151 are provided on the lower surface thereof. Three connection terminals 151 are provided along one side, and three connection terminals 151 are provided along one side facing the one side. The long side length of the integrated circuit element 150 is 0.5 to 1.2 mm, and the short side length is 0.3 to 1.0 mm. The length of the integrated circuit element 150 in the thickness direction is 0.1 to 0.3 mm.

  The conductive bonding material 160 is made of, for example, silver paste or lead-free solder. In addition, the conductive bonding material 160 contains an added solvent for adjusting the viscosity to be easily applied. The component ratio of the lead-free solder is 95 to 97.5% for tin, 2 to 4% for silver, and 0.5 to 1.0% for copper.

  As shown in FIG. 2B, the insulating resin 170 is provided between the surface of the integrated circuit element 150 where the connection terminal 151 is provided and the connection pad 116. By doing so, the insulating resin 170 can increase the adhesive strength between the integrated circuit element 150 and the lower surface of the substrate 110a. Further, even if a foreign substance such as solder enters the second recess K2 when the temperature-compensated crystal oscillator is mounted on a mounting pad of a mounting board of an electronic device or the like, the insulating resin 170 Since foreign matter is prevented from adhering between the connection terminals 151 of the integrated circuit element 150, a short circuit between the connection terminals 151 of the integrated circuit element 150 can be reduced. The insulating resin 170 is made of an epoxy resin or a resin material such as a composite resin mainly composed of an epoxy resin.

  The insulating resin 170 is provided so as to cover the first monitor electrode 118 or the second monitor electrode 119. By doing so, it is possible to suppress the foreign matter from adhering to the first monitor electrode 118 or the second monitor electrode 119, so that the additional resistance of the foreign matter can be suppressed from being applied to the crystal element 120. Therefore, it is possible to reduce fluctuations in the oscillation frequency of the crystal element 120.

  A method for forming the insulating resin 170 on the substrate 110a will be described. The tip of the resin dispenser is inserted into the gap of the second recess K2, and the insulating resin 170 is injected. Next, the insulating resin 180 is heated and cured. Therefore, the insulating resin 170 is provided so as to cover the lower surface of the substrate 110a, between the integrated circuit element 150 and the connection pad 116, and the first monitor electrode 118 or the second monitor electrode 119.

  The lid 130 has a rectangular shape, and is for hermetically sealing the first recess K1 in a vacuum state or the first recess K1 filled with nitrogen gas or the like. Specifically, the lid 130 is placed on the upper surface of the joining member 131 provided on the frame 110b in a predetermined atmosphere. When heat is applied to the joining member 131 provided on the upper surface of the frame 110b, it is melt-joined. The lid 130 is made of an alloy containing at least one of iron, nickel, and cobalt, for example.

  The joining member 131 is provided at a location of the lid 130 facing the sealing conductor pattern H provided on the upper surface of the first frame 110b of the package 110. The sealing member 131 is provided by, for example, silver solder or gold tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, the thickness is 10 to 40 μm. For example, the component ratio is 78 to 82% for gold and 18 to 22% for tin.

  For example, when the joining member 131 is gold tin, the thickness of the layer of the joining member 131 is 10 to 40 μm. For example, the component ratio is 70 to 80% for gold and 20 to 30% for tin. May be used. For example, when the joining member 131 is silver brazing, the thickness of the layer of the joining member 131 is 10 to 40 μm. For example, the component ratio is 70 to 80% for silver and 20 to 30% for copper. May be used.

  The quartz crystal device in this embodiment includes a rectangular substrate 110a, a first frame 110b provided along the outer peripheral edge of the upper surface of the substrate 110a, and a second provided along the outer peripheral edge of the lower surface of the substrate 110a. Mounted on frame 110c, a pair of electrode pads 111 provided on the upper surface of substrate 110a, a connection pad provided on the lower surface of substrate 110a, a crystal element 120 mounted on the pair of electrode pads, and connection pad 116 Integrated circuit element 150, first monitor electrode 118 electrically connected to the pair of electrode pads 111, provided on the lower surface of substrate 110a along the inner peripheral edge of second frame 110c, and first monitor electrode 118, the second monitor electrode 119 provided on the lower surface of the substrate 110a so as to be located between the connection pads 115 and the crystal element 120 are hermetically sealed. It includes a lid 130 for a. By doing in this way, compared with the monitor electrode of the conventional piezoelectric device, it becomes possible to reduce in size while ensuring the area combined with the first monitor electrode 118 and the second monitor electrode 119. Further, when measuring the electrical characteristics of the crystal element 120, the quartz crystal device brings the measurement probe into contact with the boundary between the first monitor electrode 118 and the second monitor electrode 119, so that the first monitor electrode 118 or the second monitor electrode is contacted. It is possible to reliably contact either one of the electrodes 119. Since such a quartz crystal device can stably measure the electrical characteristics of the quartz crystal element 120, productivity can be improved.

  In the quartz crystal device according to the present embodiment, one first monitor electrode 118a of the first monitor electrode 118 is provided at a position where it overlaps with the pair of electrode pads 111 in plan view. Further, by doing so, heat transmitted from the crystal element 120 is transmitted to one first monitor electrode 118a through the substrate 110a directly below the electrode pad 111, and heat is transmitted from one first monitor electrode 118a. Released. Therefore, since such a quartz crystal device can shorten the heat conduction path, it is possible to further reduce a difference from the temperature around the actual quartz crystal element 120, and temperature correction is performed by the integrated circuit element 150 described later. Can be made easier.

  Further, the crystal device according to the present embodiment is provided such that one second monitor electrode 119a of the second monitor electrode 119 is positioned between the pair of electrode pads 111 in plan view. Further, by doing so, the heat transferred from the crystal element 120 is transferred to one of the second monitor electrodes 119a via the substrate 110a directly below the electrode pad 111, and the heat is transferred from one of the second monitor electrodes 119a. Released. Therefore, since such a quartz crystal device can shorten the heat conduction path, it is possible to further reduce the difference from the temperature around the actual quartz crystal element 120, and temperature correction is performed by the integrated circuit element 150 described later. Can be further facilitated.

  In the crystal device according to the present embodiment, the insulating resin 170 is provided so as to cover the first monitor electrode 118 or the second monitor electrode 119. By doing so, it is possible to suppress the foreign matter from adhering to the first monitor electrode 118 or the second monitor electrode 119, so that the additional resistance of the foreign matter can be suppressed from being applied to the crystal element 120. Therefore, it is possible to reduce fluctuations in the oscillation frequency of the crystal element 120.

  In the quartz crystal device according to the present embodiment, the electrode pad 111 is provided along one side of the substrate 110a, and includes the convex portion B1 provided on the upper surface of the electrode pad 111. When the crystal element 120 is mounted on the electrode pad 111 via the conductive adhesive 140, even if the crystal element 120 is tilted, the extraction electrode 123 comes into contact with the convex portion B1, and the crystal element 120 is more than the convex portion B1. The crystal element 120 can be mounted in a stable state without being tilted downward. Further, the convex portion B <b> 1 is provided at a position overlapping the extraction electrode 123 on the outer peripheral edge on the fixed end side of the crystal element plate 121 in plan view. By doing in this way, it can reduce that the fixed end of crystal element 120 contacts the upper surface of substrate 110a.

  In addition, the crystal device according to the present embodiment includes a protrusion B2 provided along a side facing one side of the substrate 110a. By doing so, when an impact such as a drop is applied to the crystal device, the free end side of the crystal element 120 comes into contact with the protrusion B2, so that chipping due to direct contact with the substrate 110a can be suppressed. .

  In addition, it is not limited to this embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. In the above embodiment, the case where the frame 110b is provided on the upper surface of the substrate 110a has been described. However, after the crystal element is mounted on the substrate, the lid having the sealing frame provided on the lower surface of the sealing base is provided. The quartz element may be hermetically sealed. The lid is composed of a rectangular sealing base and a sealing frame portion provided along the outer peripheral edge of the lower surface of the sealing base. The lower surface of the sealing base and the inner side of the sealing frame portion An accommodation space is formed with the side surface. The sealing frame portion is for forming an accommodation space on the lower surface of the sealing base. The sealing frame part is provided along the outer edge of the lower surface of the sealing base.

  In the above embodiment, the case where the frame 110b is provided on the upper surface of the substrate 110a has been described. However, after mounting the crystal element on the substrate, the crystal element is mounted using the lid having the wall portion provided on the lower surface. The structure may be hermetically sealed.

  In the above embodiment, the case where an AT crystal element is used as the crystal element has been described. However, a tuning fork-type bent crystal having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base. An element may be used. The crystal element includes a crystal piece, an excitation electrode provided on the surface of the crystal piece, an extraction electrode, and a metal film for frequency adjustment. The crystal piece includes a crystal base portion and a crystal vibration portion, and the crystal vibration portion includes a first crystal vibration portion and a second crystal vibration portion. The crystal base has an orthogonal coordinate system in which the electrical axis is the X axis, the mechanical axis is the Y axis, and the optical axis is the Z axis as the crystal axis direction, within a range of −5 ° to + 5 ° around the X axis. This is a flat plate having a substantially rectangular shape in a plan view in which the direction of the rotated Z ′ axis is the thickness direction. The first crystal vibrating part and the second crystal vibrating part are extended in parallel with the Y′-axis direction from one side of the crystal base part. Such a crystal piece has a tuning fork shape in which a crystal base and each crystal vibration part are integrated, and is manufactured by a photolithography technique and a chemical etching technique.

DESCRIPTION OF SYMBOLS 110 ... Package 110a ... Board | substrate 110b ... 1st frame 110c ... 2nd frame 111 ... Electrode pad 112 ... External terminal 113 ... Wiring pattern 114 ... Conductor part 115: Via conductor 116 ... Connection pad 117 ... Connection pattern 118 ... First monitor electrode 119 ... Second monitor electrode B1 ... Projection B2 ... Projection H ... Conductive pattern for sealing 120: Crystal element 121 ... Crystal base plate 122 ... Excitation electrode 123 ... Lead electrode 130 ... Lid 131 ... Joining member 140 ... Conductive adhesion Agent 150 ... Integrated circuit element 160 ... Conductive bonding material 170 ... Insulating resin K1 ... First recess K2 ... Second recess

Claims (6)

A rectangular substrate;
A first frame provided along the outer peripheral edge of the upper surface of the substrate;
A second frame provided along the outer peripheral edge of the lower surface of the substrate;
A pair of electrode pads provided on the upper surface of the substrate;
A plurality of connection pads provided on the lower surface of the substrate;
A crystal element mounted on the pair of electrode pads;
An integrated circuit element mounted on the connection pad;
A first monitor electrode electrically connected to the pair of electrode pads and provided on the lower surface of the substrate along the inner periphery of the second frame;
A second monitor electrode electrically connected to the first monitor electrode and provided on the lower surface of the substrate so as to be positioned between the connection pads;
And a lid for hermetically sealing the crystal element. The crystal device according to claim 1,
One of the first monitor electrodes is provided at a position overlapping the pair of electrode pads in plan view. The quartz crystal device according to claim 1 or 2,
One of the second monitor electrodes is provided so as to be positioned between the pair of electrode pads in plan view. The quartz crystal device according to claim 1, wherein
A quartz crystal device comprising an insulating resin provided to cover the first monitor electrode and the second monitor electrode. The crystal device according to claim 1, wherein:
The electrode pads are provided along one side of the substrate;
A crystal device comprising a convex portion provided on an upper surface of the electrode pad. The quartz crystal device according to claim 1, wherein
A crystal device comprising: a protrusion provided along a side facing one side of the substrate.

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