JP2016152254A - Electronic device and radio communication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device capable of dissipating heat generated from a heating component to the outside more efficiently, while achieving the compactness of the electronic device itself.SOLUTION: In an electronic device, a first substrate and a second substrate are arranged to be overlapped with each other with a space therebetween in a housing. The first substrate mounts a heating component thereon, and the second substrate includes an opening which is located at least at a projection plane with respect to the second substrate of the heating component mounted on the first substrate and forms a communication part for heat dissipation.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic device in which a board on which electronic components are mounted is housed in a housing, and a wireless communication device to which the electronic device is applied.

  Conventionally, a substrate on which a plurality of electronic components are mounted is disposed in various devices in a state of being housed in a casing. As various electronic devices are miniaturized, there is a great demand for miniaturization of an electronic device that houses a substrate on which the electronic component is mounted. With the expansion of functions and the like, for electronic devices including a plurality of substrates, when these substrates are arranged in the same plane, a housing for accommodating these substrates is enlarged. Therefore, conventionally, a substrate in which these substrates are arranged in a casing so as to overlap each other has been developed.

  For example, Patent Document 1 states that “a printed circuit board and an alumina substrate, one end of which is fixed by an F-shaped terminal and supported substantially in parallel with the printed circuit board at a distance, are included in the printed circuit board. It is disclosed that a hybrid IC module in which discrete components having low heat resistance are mounted and components having no lead wires are mounted on the alumina substrate is disclosed.

  Further, Patent Document 2 discloses that “a first substrate, a second substrate, and a housing are provided, and the first substrate and the second substrate are assembled to the housing so as to overlap vertically. An electronic device in which the first substrate has an end portion that does not face the second substrate, and heat is transferred from the end portion to the upper surface and the bottom surface of the housing by contact heat conduction. Employment is disclosed.

Japanese Utility Model Publication No. 62-140765 JP 2003-209383 A

  However, in Patent Document 1 described above, the purpose is to efficiently accommodate a large discrete component that is vulnerable to heat, such as an electrolytic capacitor, and the large discrete component is placed in a region A having no alumina substrate at the top of the printed circuit board. In addition to a power transistor, a diode having a small lead wire, etc., is arranged in a region B where an alumina substrate is placed on the top of the printed circuit board. Therefore, since the heat generating electronic member is arranged between the printed circuit board and the alumina substrate, there is a problem that the heat released from the heat generating electronic member is trapped in the casing constituting the electronic device.

  In Patent Document 2 described above, the first substrate that generates heat is disposed above the second substrate, and the end of the first substrate that does not face the second substrate is brought into contact with the housing. Since heat dissipation is performed, among the electronic components mounted on the second substrate, when the heat generating electronic component is disposed below the first substrate, the heat generating electronic component is The heat cannot be released efficiently. In addition, since the first substrate that contacts the housing is only the end portion that does not face the second substrate, the heat conduction efficiency to the housing is poor, and considering the heat dissipation efficiency, the housing is interposed via the shield case. It needs to be in contact with the body. Therefore, there is a problem that causes an increase in manufacturing cost.

  Accordingly, there has been a demand from the market for the development of an electronic device capable of releasing the heat generated from the heat generating component to the outside more efficiently while realizing the compactness of the electronic device itself.

  Therefore, as a result of intensive research, the inventors have provided the following electronic device and a wireless communication device using the electronic device.

  That is, the electronic device according to the present invention is configured such that the first substrate and the second substrate are disposed in the casing so as to overlap with each other, and the first substrate has a heat generating component mounted thereon. The second substrate includes an opening that forms a communication part for heat radiation at least on a projection surface of the heat generating component mounted on the first substrate with respect to the second substrate.

  In the electronic device according to the present invention, the first substrate includes a heat generating region in which the plurality of heat generating components are locally mounted, and the communication portion of the second substrate is the heat generating region of the first substrate. It is preferable that it is disposed at least on the projection surface with respect to the second substrate.

  Further, in the electronic device according to the present invention, the housing includes a resin box having an opening surface that opens to the outside, and a lid made of a thermally conductive material that closes the opening surface so as to be openable and closable. And a heat transfer member disposed in contact with the heat generating component disposed on the first substrate and the lid.

  The wireless communication device according to the present invention uses the above-described electronic device, wherein the first substrate mounts a communication module, and the second substrate mounts the communication module mounted on the first substrate. It is characterized by comprising an opening which is located at least on the projection plane with respect to the second substrate and forms a communicating portion for heat dissipation.

  In the wireless communication apparatus according to the present invention, it is preferable that the second board is an extension board to be mounted in order to add an extension function.

  According to the electronic device according to the present invention, the second substrate includes an opening that forms a communication part for heat dissipation located at least on a projection surface of the heat generating component mounted on the first substrate with respect to the second substrate. In the state where the first board and the second board are arranged so as to overlap each other in the casing, heat from the heat-generating component mounted on the first board is provided for heat dissipation provided on the second board. It can discharge | release outside through a part.

  Therefore, by arranging the first substrate and the second substrate so as to overlap each other with an interval therebetween, the heat generated from the heat-generating component mounted on the first substrate can be reduced while realizing the compactness of the electronic device itself. Without being shielded by the two substrates, it is possible to efficiently dissipate heat via the heat radiation communicating portion provided on the second substrate. Therefore, it is not necessary to dissipate heat through the shield case as in the prior art, and the cost can be reduced.

  Moreover, the wireless communication device according to the present invention uses the above-described electronic device, and the second substrate is a heat dissipation located at least on a projection surface of the communication module mounted on the first substrate with respect to the second substrate. Therefore, the heat generated from the communication module having a large calorific value can be released to the outside through the heat dissipation communication portion of the second substrate without being shielded by the second substrate. . Therefore, it is possible to efficiently eliminate the inconvenience that the communication module abnormally rises in temperature, and to realize a stable operation.

1 is a schematic perspective configuration diagram of a wireless communication device as an example of an electronic device according to the present invention. It is a perspective view of the state before opening the cover body of the radio | wireless communication apparatus of FIG. 1, and attaching a 2nd board | substrate. It is a disassembled perspective view of the radio | wireless communication apparatus of FIG. It is the sectional view on the AA line of FIG. It is the BB sectional view taken on the line of FIG.

  Hereinafter, a wireless communication apparatus M will be described as an example of an electronic apparatus as an embodiment of the present invention. FIG. 1 is a schematic perspective configuration diagram of a wireless communication apparatus M as an example of an electronic apparatus according to the present invention. FIG. 2 is a perspective view of a state before the cover of the wireless communication apparatus M is opened and a second substrate is attached. 3 is an exploded perspective view of the wireless communication apparatus M, FIG. 4 is a sectional view taken along line AA in FIG. 1, and FIG. 5 is a sectional view taken along line BB in FIG.

  The wireless communication device M mentioned as the present embodiment is installed in, for example, a vending machine and has a function of performing communication with the outside as a main function. An extended function such as a memory that can store data information generated in the machine can be installed.

  The wireless communication apparatus M according to the present embodiment is configured such that the first substrate 30 and the second substrate 40 are disposed in the casing 10 so as to overlap each other with an interval. Hereinafter, after describing the housing 10, the first substrate 30 and the second substrate 40 will be described.

  The housing 10 includes a box body 11 having an opening surface 12 opened to the outside on at least one surface, and a lid body 21 that closes the opening surface 12 of the box body 11 so as to be freely opened and closed. In the present embodiment, the box 11 is preferably molded from a hard synthetic resin such as ABS. The opening surface 12 provided in the housing 11 is preferably one in which at least the entire surface is opened in consideration of the ease of assembly of the substrate and the like accommodated therein.

  In this embodiment, the lid 21 that closes the opening surface 12 of the box 11 so as to be freely opened and closed is preferably formed of a metal plate such as aluminum, which is a thermally conductive material. And the edge part which the said cover body 21 mutually opposes is provided with the collar part 22 and the engaging part 23 which were each formed in the box 11 inside. Therefore, with the engaging portion 23 of the lid body 21 engaged with the engaging groove 17 formed on the box body 11 side, the collar portion 22 is inserted into the box body 11, and the box body 11 and the collar portion 22 are inserted. The lid body 21 is detachably attached to the box body 11 by fixing with screws or the like at the overlapping portion. In addition, the assembly method of the box 11 and the lid 21 is not limited to this, and an existing method can be employed.

  The box 11 has a plurality of terminals connected to a substrate housed in the housing 10, particularly the first substrate, on the side surface 14 other than the opening surface 12 and the bottom surface 13 facing the opening surface 12. Terminal openings 15 are formed for drawing out to the outside. The terminal openings 15 are preferably formed by concentrating on one side surface 14 in consideration of wiring handling.

  Next, the first substrate 30 and the second substrate 40 accommodated in the housing 10 will be described. The first substrate 30 is a control substrate for performing communication control, and an electronic circuit on which the communication module 31 is mounted is mounted. The communication module 31 is a heat generating component that generates heat due to a communication operation of input / output data. In addition to the electronic circuit including the communication module 31, a connector 32 for connection such as a serial interface is mounted on the first substrate 30.

  In the present invention, when a plurality of heat generating components are mounted on the first substrate 30, it is preferable that these heat generating components are locally mounted in a predetermined heat generating region.

  On the other hand, the second substrate 40 is an expansion substrate added to the first substrate 30 in order to expand the function of the first substrate 30. In this embodiment, a board provided with a memory that can store data information generated in the vending machine corresponds to the expansion board. The second substrate 40 is located on the lid 21 side facing the bottom surface 13 with respect to the first substrate 30 disposed on the bottom surface 13 side of the box 11 in the housing 10, and It arrange | positions so that it may overlap with 1 board | substrate 30 at intervals.

  The second substrate 40 is disposed in the housing 10 and is located on at least a projection surface of the communication module 31 as a heat generating component mounted on the first substrate 30 with respect to the second substrate 40 for heat dissipation. An opening 42 forming the communication part 41 is provided. The opening 42 is formed on the projection surface of the communication module 31 as a heat generating component mounted on the first substrate 30 with respect to the second substrate 40 in a state where the second substrate 40 is disposed in the housing 10. Any configuration can be adopted as long as the configuration enables communication between the 30 side and the lid 21 side. That is, the opening 42 may be an opening formed by punching out a portion including at least the projection surface of the communication module 31 as the heat generating component mounted on the first substrate 30 with respect to the second substrate 40, and corresponds to the projection surface. A region including the portion may be cut out, and the second substrate 40 may be formed in a substantially L shape so as to be configured as an enclosed region.

  As described above, when a plurality of heat generating components are locally mounted on the first substrate 30 in a predetermined heat generating region, the communication portion 41 of the second substrate 40 is connected to the first heat generating region of the first substrate 30. It is preferable that the two substrates 40 be arranged at least on the projection plane.

  Hereinafter, a specific method for attaching the first substrate 30 and the second substrate 40 in the present embodiment will be described. In the present embodiment, two holding surfaces of a first holding surface 16A located on the bottom surface 13 side and a second holding surface 16B located on the lid body 11 side are provided on the inner wall surface of the box 11 constituting the housing 10. A plurality of step-like ribs 16 are formed. The first holding surface 16A is formed at a predetermined interval from the bottom surface 13 of the box 11, and is held with the edge of the first substrate 30 in contact with the first holding surface 16A. The

  In the present embodiment, a plurality of engaging portions 17 provided with engaging claws 17 </ b> A positioned at the height of the first holding surface 16 </ b> A are erected from the bottom surface 13. Therefore, the first substrate 30 is sandwiched between the engagement claw 17A and the first holding surface 16A by inserting the engagement claw 17A into the engagement hole 30 formed in the first substrate 30. Therefore, the first substrate 30 is attached with a predetermined gap between the first substrate 30 and the bottom surface 13 of the housing 10.

  The second holding surface 16B is formed at a predetermined interval from the first holding surface 16A, and the second holding surface 16B is held with the edge of the second substrate 40 in contact with the second holding surface 16B. . In the present embodiment, the second substrate 40 is fixed to the second holding surface 16B by screws (not shown). In addition, the attachment method to the housing | casing 10 of the 1st board | substrate 30 and the 2nd board | substrate 40 is not limited to the method described here. For example, the first substrate 30 may be fixed to the first holding surface 16A by screwing without using the engaging claw 17A, and the second substrate 40 may be fixed by the engaging portion erected from the bottom surface 13 of the housing 10. The engagement may be held. The first substrate 30 and the second substrate 40 can be attached to the housing 10 as long as the first substrate 30 and the second substrate 40 can be arranged so as to overlap each other with a gap therebetween. Other known methods can be adopted.

  With the configuration described in detail above, the second substrate 40 is located at least on the projection surface of the communication module 31 that is a heat generating component mounted on the first substrate 30 and forms the heat radiation communication portion 41. By providing the opening 42, the communication module 31 is disposed such that the second substrate 40 side communicates with the lid 21 side. Therefore, the communication module 31 as a heat-generating component mounted on the first substrate 30 despite the state in which the first substrate 30 and the second substrate 40 are disposed so as to overlap each other in the housing 10 with a space therebetween. Heat can be released to the lid 21 side through the heat radiating communication portion 41 formed by the opening 42 formed in the second substrate 40 and to the outside through the lid 21.

  Therefore, by arranging the first substrate 30 and the second substrate 40 so as to overlap each other with a gap therebetween, the wireless communication device M itself as an electronic device is mounted on the first substrate 30 while realizing compactness. Heat generated from the communication module 31 that is a heat-generating component can be efficiently radiated through the heat radiating communication portion 41 formed on the second substrate 40 without being shielded by the second substrate 40. . Therefore, the inconvenience that the communication module 31 abnormally rises in temperature can be efficiently eliminated, and a stable operation can be realized. Further, in the present invention, since a high heat radiation effect can be realized only by forming the communication portion 41 on the second substrate 40 disposed so as to overlap with the first substrate 30, a shield case as in the conventional case. Further, it is not necessary to perform heat dissipation through the heat absorbing resin, and the cost can be reduced.

  In particular, as described above, the opening 42 formed in the second substrate 40 is cut out in a region including a portion corresponding to the projection surface of the communication module 31 with respect to the second substrate 40, so that the second substrate 40 is substantially L-shaped. When formed in the enclosed region, the productivity can be improved and the cost can be further reduced.

  Further, in the present embodiment, as shown in FIG. 4, the communication module 31 as the heat generating component disposed on the first substrate 30 and the substantially U-shaped cross section disposed in contact with the lid body 21. It is preferable to include the heat transfer member 50. The heat transfer member 50 may be configured by bending a plate made of a heat conductive material such as aluminum.

  As a result, the heat released from the communication module 31 can be transferred to the lid 21 via the heat transfer member 50, and the heat transferred to the heat transfer member 50 or directly released from the communication module 31. The heat can be efficiently transferred to the lid 21 made of a thermally conductive material via the communication portion 41 of the second substrate 40 without being retained between the first substrate 30 and the second substrate 40. it can. Therefore, further improvement in heat dissipation efficiency can be realized.

  In the electronic device according to the present invention, the second substrate includes a heat radiating communication portion located at least on a projection surface of the heat generating component mounted on the first substrate with respect to the second substrate, whereby the first substrate is provided in the housing. In a state where the board and the second board are arranged so as to overlap each other with an interval, heat from the heat generating component mounted on the first board is released to the outside through the heat radiating communication portion provided on the second board. can do. Therefore, by adopting the electronic device of the present invention in a wireless communication device or the like having a communication module with a large calorific value as the first substrate, the second substrate having an expansion function or the like without any trouble is the same as the first substrate. It is possible to achieve stable communication by increasing the heat dissipation capability while being arranged in the housing.

M Wireless communication device (electronic device)
DESCRIPTION OF SYMBOLS 10 Housing | casing 11 Box body 12 Opening surface 13 Bottom surface 14 Side surface 15 Terminal opening 16 Rib 16A 1st holding surface 16B 2nd holding surface 17 Engaging groove 21 Lid body 22 Brim part 23 Engaging part 30 1st board | substrate 31 Communication module (Heat generation parts)
32 Connector 33 Engagement hole 40 2nd board | substrate 41 Communication part 42 Opening 50 Heat transfer member

Claims (5)

In an electronic device in which a first substrate and a second substrate are disposed so as to overlap each other in a casing,
The first board has a heat generating component mounted thereon,
The second device includes an opening that is located on at least a projection surface of the heat generating component mounted on the first substrate with respect to the second substrate and forms a communication part for heat dissipation. The first substrate includes a heat generating region in which a plurality of the heat generating components are locally mounted,
2. The electronic device according to claim 1, wherein the communication portion of the second substrate is disposed at least on a projection surface of the heat generation area of the first substrate with respect to the second substrate. The housing includes a resin box having an opening surface that opens to the outside, and a lid made of a heat conductive material that closes the opening surface so as to be freely opened and closed.
The electronic device according to claim 1, further comprising: a heat transfer member disposed in contact with the heat generating component disposed on the first substrate and the lid. In the radio | wireless communication apparatus using the electronic device in any one of Claims 1-3,
The first substrate has a communication module mounted thereon,
The wireless communication apparatus, wherein the second substrate includes an opening that is located at least on a projection surface of the communication module mounted on the first substrate with respect to the second substrate and forms a communication portion for heat dissipation.   The wireless communication device according to claim 4, wherein the second substrate is an expansion substrate added to expand the function of the first substrate with respect to the first substrate.

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