JP2016149530A - Lithography apparatus, control method therefor, and article manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lithography apparatus that performs imprint processing while suppressing productivity reduction or product yield reduction caused by interruption of lot processing.SOLUTION: The lithography apparatus comprises: a transfer part 100 for transferring a pattern that is formed on an original plate 18 to a substrate; an original plate storage part that stores a plurality of original plates; a control part 400 that selects an original plate to be used in the transfer part from among the plurality of original plates; and a conveyance part by which the original plate selected by the control part is extracted from the original plate storage part and conveyed to an original plate holding position of the transfer part. The control part 400 acquires information about predetermined processing times in which the transfer part 100 should perform processing with lots, acquires information about cumulative processing times in the transfer part for the original plates in the original plate storage part, and preferentially selects an original plate of which the processable times are equal to or more than the predetermined processing times until the cumulative processing times reach predetermined times, from among the plurality of original plates.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a lithography technique.

  The imprint technique is a technique that enables formation (transfer) of a nanoscale pattern, and an imprint apparatus using such a technique has attracted attention as one of lithographic apparatuses for mass production of magnetic storage media and semiconductor devices. Yes. The imprint apparatus cures the imprint material in a state where the imprint material on the substrate (silicon wafer, glass plate, etc.) and the original plate (mold) are in contact, and pulls the original plate away from the cured imprint material. A pattern of the imprint material is formed on the substrate.

  By the way, in the imprint apparatus and the semiconductor exposure apparatus, it is necessary to determine the replacement time or cleaning time of the original. Patent Document 1 discloses a method for estimating a deterioration state of a photomask which is an original using a photomask inspection apparatus in an exposure apparatus.

JP 2011-017914 A

However, even if the deterioration state is estimated using such a method, the productivity may be reduced. For example, when the original reaches the use limit during the lot processing, the lot processing is interrupted and the original is replaced. Such a decline in productivity due to the replacement work of the original plate cannot be ignored.
Further, when the lot processing is interrupted and the original plate is replaced during the lot processing, the manufacturing error of the product may exceed the allowable range due to a change in the apparatus state due to the interruption. In particular, in a lithographic apparatus in which two or more sets of pattern transfer portions are accommodated in one chamber, when the original plate is changed only by a specific transfer mechanism (pattern transfer portion), the variation in the lot exceeds the allowable range, and the product yield is increased. It may also cause a decline.

  An object of the present invention is to provide a lithographic apparatus capable of suppressing a decrease in productivity or a decrease in product yield due to an interruption of lot processing.

  According to one aspect of the present invention, a transfer unit that transfers a pattern formed on an original plate to a substrate, an original plate storage unit that stores a plurality of original plates, and an original plate that is used in the transfer unit is selected from the plurality of original plates. A control unit; and a transport unit that takes out the original selected by the control unit from the original storage unit and conveys it to the original holding position of the transfer unit. The control unit processes the transfer unit in a lot. Information on the expected number of times to be processed, information on the number of times of accumulated processing in the transfer unit of each original plate in the original plate storage unit, information of the plurality of original plates until the cumulative number of processing times reaches a predetermined number of times A lithographic apparatus is provided that preferentially selects an original having a processable number of times equal to or greater than the scheduled number of processes.

  According to the present invention, there is provided a lithographic apparatus that can suppress a decrease in productivity or a decrease in product yield due to the interruption of lot processing.

The figure which shows the structure of the imprint process part which concerns on embodiment. 6 is a flowchart of imprint processing according to the embodiment. The figure explaining how an original plate deteriorates by the repetition of an imprint process. The figure which shows the structure of the imprint apparatus in which one imprint process part of FIG. 1 was accommodated in the chamber. The figure which shows the structure of the imprint apparatus with which the two imprint process parts of FIG. 1 were accommodated in the chamber. FIG. 5 is a diagram for explaining the cumulative number of processed substrates of a plurality of original plates in the embodiment in comparison with the prior art. The figure explaining the use order of the some original plate in embodiment compared with a prior art. 6 is a flowchart illustrating processing of the imprint apparatus according to the embodiment. The flowchart which shows the process of the control computer in embodiment. 5 is a flowchart showing original plate recovery processing in the embodiment. 6 is a flowchart illustrating another example of the original plate recovery process according to the embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments, but merely shows specific examples advantageous for the implementation of the present invention. Moreover, not all combinations of features described in the following embodiments are indispensable for solving the problems of the present invention. In addition, in each figure, about the same member, the same reference number is attached | subjected and the overlapping description is abbreviate | omitted.

<First Embodiment>
The present embodiment relates to a lithography apparatus that performs an imprint process for forming an imprint material pattern on a substrate by forming the imprint material on the substrate with a mold as an original plate (mask). FIG. 1 is a diagram illustrating a configuration of an imprint processing unit 100 that is a transfer unit in the imprint apparatus according to the present embodiment. As a practical embodiment, one or two or more imprint processing units 100 can be accommodated and operated in one chamber. Such a form will be described later with reference to FIGS. 4 and 5.

  In the imprint processing unit 100 of the present embodiment, a resin is used as the imprint material. As a resin curing method, a photocuring method is employed in which the resin is cured by irradiation with ultraviolet rays (UV light). Therefore, the imprint processing unit 100 supplies a resin to the substrate, and performs pattern formation (transfer) on the substrate by curing the resin in a state where the resin and the pattern surface of the original plate are in contact with each other. However, the imprint processing unit 100 may cure the resin by irradiation with light in other wavelength ranges, or may employ a thermosetting method in which the resin is cured by other energy, for example, heat. In the following, the direction parallel to the optical axis of the ultraviolet rays irradiated to the resin on the substrate is defined as the Z axis, and the directions perpendicular to each other in a plane perpendicular to the Z axis are defined as the X axis and the Y axis.

  The imprint processing unit 100 includes a measuring instrument 4, a measuring instrument 6, a substrate stage 7, a bridge structure 8, a measuring instrument 9, a curing light source 11, an alignment measuring unit 12, a half mirror 13, An exhaust duct 14, a connecting member 15, and an original plate head 16 are included. Further, the imprint processing unit 100 includes an original plate chuck 17, an air spring 19, a base surface plate 20, a gas supply unit 21, a holder 22, a resin supply unit 23, an off-axis scope 24, and a pressure sensor 25. And a signal processing unit 26 and a control unit 400.

  The master head 16 includes a master chuck 17 that holds a master 18 having a pattern surface P. An uneven pattern corresponding to the pattern to be formed on the substrate 1 (wafer) is formed on the pattern surface P of the original 18.

  The original chuck 17 holds the original 18 by vacuum suction, for example. The original chuck 17 may have a structure that prevents the original 18 from falling off the original chuck 17. In the present embodiment, the original chuck 17 is firmly coupled to the original head 16. Accordingly, the master head 16 can be regarded as a part of the master chuck 17 or can be regarded as a member coupled to the master chuck 17. The original head 16 has a mechanism capable of moving (driving) at least in the three axial directions of Z, ωX, and ωY with reference to the bridge structure 8.

  The original plate head 16 is supported by the bridge structure 8 via the connecting member 15. Similarly to the original plate head 16, an alignment measurement unit 12 that forms an alignment detection system is also supported by the bridge structure 8.

  The alignment measurement unit 12 performs alignment measurement for alignment (alignment) between the original 18 and the substrate 1. In the present embodiment, the alignment measurement unit 12 includes an alignment detection system that detects a mark provided on the original 18 and a mark provided on the substrate stage 7 or the substrate 1 to generate an alignment signal. The alignment measurement unit 12 may include a camera, and may have a function of observing (confirming) the cured state (imprint state) of the resin on the substrate via the half mirror 13. In this case, the alignment measurement unit 12 is not limited to the cured state of the resin on the substrate, but also from the stamped state of the original 18 on the resin on the substrate, the filled state of the resin 18 on the substrate, and the cured resin on the substrate. It is also possible to observe the release state of the original plate 18.

  A half mirror 13 is disposed above the connecting member 15. The light from the curing light source 11 is reflected by the half mirror 13, passes through the original 18, and is applied to the resin on the substrate 1. The resin on the substrate 1 is cured by irradiation with light from the curing light source 11.

  The bridge structure 8 is supported on the base surface plate 20 via an air spring 19 for insulating vibrations from the floor. The air spring 19 has a structure generally used in an exposure apparatus as an active image stabilization function. For example, the air spring 19 includes an XYZ relative position measurement sensor provided on the bridge structure 8 and the base surface plate 20, an XYZ driving linear motor, a servo valve for controlling the air capacity inside the air spring, and the like.

  A resin supply unit 23 (dispenser) including a nozzle for supplying (applying) resin to the substrate 1 is attached to the bridge structure 8 via a holder 22. The resin supply unit 23 supplies resin droplets to the substrate 1 in a linear form using, for example, an inkjet head of an inkjet printer. The resin can be applied to a rectangular region on the substrate by moving (scanning) the substrate stage 7 (ie, the substrate 1) while supplying the resin from the resin supply unit 23 to the substrate 1. In addition, the area | region which applies resin on a board | substrate does not need to be rectangular shape, and resin can be supplied to the area | regions of arbitrary shapes (for example, circular shape, fan shape, etc.).

  In the present embodiment, the substrate 1 has a circular shape. Therefore, when a rectangular shot area is defined on the substrate, in the peripheral area (the area including the outer periphery of the substrate 1), the shot area protrudes from the outer periphery of the substrate 1 and a rectangular shot area can be secured. Can not. Such a shot area is generally called a “missing shot area”. At present, it is possible to form a plurality of chips in one shot area of 33 mm × 26 mm. Therefore, in order to efficiently form a chip on the substrate 1, it is necessary to form a pattern also in the missing shot region.

  In the imprint processing unit 100, since the resin film (residual film) remains in the concave portions of the concave / convex pattern formed in the resin on the substrate 1, it is necessary to etch the residual film. The thickness of the remaining film is called RLT (Residual Layer Thickness). When a film having a thickness corresponding to the RLT is not formed in the shot region, the substrate 1 is removed by etching. In order to prevent this, it is effective to apply resin to the peripheral region of the substrate 1, that is, the chipped shot region. However, at this time, if the resin supply unit 23 applies the resin in a rectangular shape, the resin protrudes from the substrate 1. In this state, when light is irradiated from the curing light source 11, the resin is cured and adhered on a holding surface (for example, a substrate chuck provided on the substrate stage 7) that holds the substrate 1. Thereby, in addition to the substrate 1 being bonded to the holding surface, the substrate 1 to be imprinted next is held with the adhering substance (cured resin) interposed therebetween, and the surface accuracy of the surface of the substrate 1 is lowered. As a result, the pattern cannot be formed normally. Therefore, in this embodiment, the resin is applied to an appropriate region of the substrate 1 by a combination of the resin discharge by the resin supply unit 23 and the movement of the substrate stage 7.

  The substrate stage 7 holds the substrate 1 via a substrate chuck, for example. The substrate stage 7 has a mechanism capable of moving (driving) in six axial directions of X, Y, Z, ωX, ωY, and ωZ. In the present embodiment, the substrate stage 7 is supported by the bridge structure 8 via the X slider 3 including an X direction moving mechanism and the Y slider 5 including a Y direction moving mechanism. The X slider 3 is provided with a measuring instrument 4 that measures the relative position of the X slider 3 and the Y slider 5. The Y slider 5 is provided with a measuring instrument 6 that measures the relative position between the Y slider 5 and the bridge structure 8. Therefore, the measuring instruments 4 and 6 measure the position of the substrate stage 7 with the bridge structure 8 as a reference. Each of the measuring instruments 4 and 6 is composed of an encoder (linear encoder) in this embodiment.

  The distance in the Z direction between the substrate stage 7 and the bridge structure 8 is determined by the bridge structure 8, the X slider 3, and the Y slider 5. By maintaining the rigidity in the Z direction and the tilt direction of the X slider 3 and the Y slider 5 as high as about 10 nm / N, the fluctuation of the imprint operation between the substrate stage 7 and the bridge structure 8 in the Z direction is several tens of nm. It can be suppressed to a fluctuation of the degree.

  The measuring instrument 9 is provided in the bridge structure 8, and is configured by an interferometer in the present embodiment. The measuring instrument 9 irradiates the measurement light 10 toward the substrate stage 7 and detects the measurement light 10 reflected by the interferometer mirror provided on the end surface of the substrate stage 7, thereby determining the position of the substrate stage 7. measure. The measuring instrument 9 measures the position of the substrate stage 7 at a position closer to the holding surface of the substrate stage 7 of the substrate 1 than the measuring instruments 4 and 6. In FIG. 1, only one measurement light 10 irradiated from the measuring instrument 9 to the substrate stage 7 is illustrated, but the measuring instrument 9 measures at least the XY position, the rotation amount, and the tilt amount of the substrate stage 7. It is configured to be able to.

  The gas supply unit 21 supplies a filling gas to the vicinity of the original plate 18, specifically, to the space between the original plate 18 and the substrate 1 in order to improve the filling property of the resin into the pattern of the original plate 18. The filling gas rapidly reduces the filling gas (bubbles) sandwiched between the original 18 and the resin, and promotes the filling of the resin into the pattern of the original 18 so that the permeable gas and the condensable gas are used. At least one of the following. Here, the permeable gas is a gas that has high permeability to the original 18 and permeates the original 18 when the original 18 is pressed against the resin on the substrate (that is, during molding). The condensable gas is a gas that liquefies (condenses) when the original 18 is pressed against the resin on the substrate (that is, during molding).

  The off-axis scope 24 detects the reference marks and alignment marks provided on the reference plate disposed on the substrate stage 7 without using the original plate 18. The off-axis scope 24 can also detect alignment marks provided in each shot area of the substrate 1.

  In this embodiment, the pressure sensor 25 is provided on the substrate stage 7 and detects the pressure acting on the substrate stage 7 by pressing the original 18 against the resin on the substrate. The pressure sensor 25 functions as a sensor that detects the contact state between the original 18 and the resin on the substrate by detecting the pressure acting on the substrate stage 7. Further, the pressure sensor 25 may be provided in the original head 16 as long as it is provided in at least one of the original head 16 and the substrate stage 7.

  The control unit 400 includes a CPU, a memory, and the like, and comprehensively controls the operation of the imprint processing unit 100. In the present embodiment, the control unit 400 controls imprint processing and related processing.

  As described above, the gas supply unit 21 supplies the filling gas to the space between the original 18 and the substrate 1 during the imprint process. The filling gas supplied between the original 18 and the substrate 1 is sucked from the upper part of the original 16 through the exhaust duct 14 and discharged to the outside of the imprint processing unit 100. Further, the filling gas supplied between the original 18 and the substrate 1 may be recovered by a gas recovery mechanism (not shown) instead of being discharged outside the imprint processing unit 100.

Next, the flow of imprint processing by the imprint apparatus will be described with reference to the flowchart of FIG. Here, the flow of imprint processing in units of lots including a plurality of substrates will be described.
In S <b> 101, the control unit 400 performs alignment (alignment) between the original 18 and the substrate stage 7 based on the alignment measurement result by the alignment measurement unit 12. At this time, the original 18 is carried into the imprint processing unit 100 by an original conveying system (not shown) and is held by the original chuck 17. The alignment mark detected by the alignment measurement unit 12 may be provided on the substrate stage 7 as a dedicated reference mark or may be provided on a dedicated alignment substrate.

  In S102, the substrate 1 is carried into the imprint processing unit 100 by a substrate transport system (not shown), and the substrate 1 is held on the substrate stage 7 (substrate chuck). In other words, the substrate 1 is fixed to the substrate stage 7.

  In S103, the control unit 400 performs pre-alignment (PA). Specifically, the substrate stage 7 is moved below the off-axis scope 24 and the position of the substrate 1 held on the substrate stage 7 by the off-axis scope 24 is measured. The pre-alignment is performed with an accuracy (about 1 μm to 2 μm) such that the alignment mark provided in each shot region of the substrate 1 is within the measurement range of the alignment measurement unit 12 in the alignment between the original 18 and the substrate 1 (S106). Just do it.

  In step S <b> 104, the substrate stage 7 is moved so that the target shot area of the substrate 1 (shot area where imprint processing will be performed from now on) is positioned below the resin supply unit 23. In addition, the gas supply unit 21 supplies a filling gas to the space between the original 18 and the substrate 1.

  In S <b> 105, the resin is supplied to the target shot area of the substrate 1 by the resin supply unit 23. Specifically, the resin supply unit 23 supplies the resin to the target shot area of the substrate 1 that has moved under the resin supply unit 23 according to a predetermined application pattern. When the resin is supplied to the target shot area of the substrate 1, the substrate stage 7 is moved so that the target shot area is located below the pattern surface P of the original 18.

  In S106, the control unit 400 determines whether the original 18 and the target shot area of the substrate 1 are based on the result of alignment measurement by the alignment measurement unit 12 in a state where the pattern surface P of the original 18 is in contact with the resin on the substrate. Align. Since this alignment is performed for each shot region (die) of the substrate 1, it is called “die-by-die alignment”.

  In S <b> 107, the control unit 400 transmits light from the curing light source 11 on the target shot region of the substrate 1 in a state where the pattern surface P of the original 18 is in contact with the resin on the substrate (that is, via the original 18). Irradiate the resin.

  In S108, the original head 16 is raised, and the original 18 is separated from the cured resin on the target shot area of the substrate 1 (released). As a result, a resin pattern corresponding to the pattern surface P of the original 18 remains in the target shot area of the substrate 1. That is, a pattern corresponding to the pattern surface P of the original 18 is formed in the target shot area of the substrate 1. When the original 18 is released, the original head 16 is raised so that the shearing force applied to the pattern surface P of the original 18 is equal to or lower than the breaking stress of the resin pattern so that the resin pattern is not broken.

  In S <b> 109, the control unit 400 determines whether a pattern has been formed in all shot regions of the substrate 1. If no pattern is formed in all shot areas, the process proceeds to S103 in order to form a pattern in the next target shot area. When the pattern is formed in all shot areas, the process proceeds to S110.

  In S110, the substrate 1 having the pattern formed in all the shot areas is unloaded by the substrate transport system (not shown).

  In S <b> 111, the control unit 400 determines whether imprint processing has been performed on all the substrates 1. If the imprint process has not been performed on all the substrates 1, the process proceeds to S102 in order to perform the imprint process on the next substrate 1. If the imprint process has been performed on all the substrates 1, the process ends.

FIG. 3 is a diagram for explaining how an original plate deteriorates due to repetition of imprint processing.
3A shows a state before the pattern surface of the original 18 starts to contact the substrate 1 in a state where the resin 27a is supplied to the target shot region by the resin supply unit 23. FIG. FIG. 3B shows a state where the pattern surface of the original 18 and the resin on the substrate are in contact with each other. In this state, the resin on the target shot area of the substrate 1 is irradiated with light from the curing light source 11. At this point, the resin 27b is cured. FIG. 3C shows a state in which the original plate head 16 is raised and the original plate 18 is separated from the cured resin on the target shot region of the substrate 1. As a result, the resin pattern 27 c corresponding to the pattern surface of the original 18 remains in the target shot area of the substrate 1.

  The processing flow in FIGS. 3D to 3F is the same as the processing flow in FIGS. FIG. 3D shows that the pattern surface of the original 18 is deteriorated by repeating the imprint process, and the width L2 of the convex portion is narrower than the width L1 of the convex portion in FIG. Show. For this reason, the shape of the formed resin pattern 27c is different between FIG. 3C and FIG. If the difference in shape becomes larger than the allowable value, the substrate is determined to be defective and cannot be used.

The inventor has found through experiments that, for example, the following parameters are correlated with the cause of deterioration of the pattern surface of the original plate.
・ Number of substrates processed,
・ The number of cleanings as the original recovery process,
・ Number of stamps corresponding to the number of shots,
・ Integrated exposure of ultraviolet rays used for resin curing,
・ Original pattern image detection information, detected images are stored in time series, coefficients calculated from the amount of change,
・ Release force required to separate the original and the substrate,
-A coefficient calculated from the change in mold release force.

FIG. 4 is a diagram illustrating a configuration in which the imprint processing unit 100 of FIG. 1 is accommodated in a chamber 200 for maintaining the imprint environment at a constant temperature and humidity and eliminating intrusion of foreign matter.
The original stocker 28 is an original storage unit that stores a plurality of originals. The original exchange robot 29 serving as a transport unit takes out a new original 18 from the original stocker 28 and transports it to the original chuck 17 which is the original holding position of the transfer unit, and can collect the old original 18 from the original chuck 17. . The original exchange robot 29 further has a function of taking the original into and out of the apparatus via an original pod (not shown). The original plate exchange robot 29 has a rotation mechanism, a vertical movement function, a horizontal movement function, and a hand extension / contraction function.

  The control unit 400 includes a notification unit 401, a selection unit 402, and a management unit 403. The notification unit 401 can notify the control computer 500 and the display unit 30 of warning information via a network. In response to this, the display unit 30 can display the apparatus state. The selection unit 402 selects the optimum original 18 and controls the conveyance of the original 18 in order to improve productivity and keep manufacturing errors within a certain range. The management unit 403 manages the information on the original stored in the original stocker 28. The original plate information includes information related to the drawing error of the pattern drawn on the original plate, alignment mark information for aligning the original plate head 16 and the original plate 18, information related to deterioration of the original plate such as the number of times of use and the number of times of cleaning. Is included.

  The present invention can also be applied to a configuration including a plurality of transfer units (imprint processing units). FIG. 5 shows a configuration in which two imprint processing units 100 are accommodated in one chamber 200 as an example. Here, the control computer 500, the display unit 30, the control unit 400, the original stocker 28, and the original exchange robot 29 can be shared by the respective imprint processing units. However, the display unit 30, the original stocker 28, and the original exchange robot 29 may be provided independently for each imprint processing unit without being shared.

FIG. 6 is a diagram for explaining the cumulative number of processed substrates of each original plate in comparison with the prior art when the imprint apparatus of FIG. 5 continuously performs lot processing.
In the apparatus of FIG. 5, five original plates A to E on which the same pattern capable of processing the same lot is drawn are stored in the original stocker 28. For example, the management unit 403 stores information on the cumulative number of processing times in the transfer unit of each original plate. The management of such information may be performed by the control computer 500. The “cumulative number of times of processing in the transfer unit” may be the number of times of imprint execution, or the cumulative number of substrates on which imprinting has been performed (cumulative substrate processing number). In the following description, it is assumed that the cumulative number of processed substrates is managed.

In FIG. 6, the cumulative number of processed substrates before starting the lot processing for each of the original plates A to E is 60, 90, 0, 80, and 50, respectively. The use limit number of the original plate is obtained in advance by experiments, but in this example, it is 100 sheets. In this example, it is assumed that the first lot of 40 processed lots, the second lot of 20 processed lots, and the third lot of 80 processed lots are sequentially processed in this order.
FIG. 6A shows the cumulative number of processed sheets of each original at the end of each lot according to the prior art. FIG. 6B shows the cumulative number of processed plates of each original at the end of each lot according to this embodiment.

In the prior art, each master was only exchanged in the order in which it was transported to the stocker each time the number of treatments reached a predetermined number of times indicated by the use limit. On the other hand, in the present embodiment, the usage history of each original plate is managed, and the original plate is selected based on the usage history, thereby minimizing the number of original plate replacement operations. The exchange of the original plate can be controlled to be performed between lots. An outline of the process of the selection unit 402 in the present embodiment is as follows. That is, the selection unit 402 acquires information on the scheduled number of times that the transfer unit should process a lot, and also acquires information on the cumulative number of processing times in the transfer unit of each original plate in the original stocker 28. After that, the selection unit 402 preferentially selects an original plate in which the number of processable times until the cumulative number of processing times reaches a predetermined number among the plural original plates in the original plate stocker 28 is equal to or greater than the scheduled processing number.
A specific example of this process will be described below with reference to FIGS.

  FIG. 7 is a diagram for explaining the use order of the original plate in the case where the imprint apparatus of FIG. In the chamber 200 of FIG. 5, the left imprint processing unit 100 is a first booth and the right imprint processing unit 100 is a second booth. FIG. 8 is a flowchart of an original conveyance process that can be executed by the control unit 400 in the imprint apparatus of FIG. Hereinafter, the flow of processing will be described with reference to FIGS.

  In S201, the control unit 400 acquires the number of usable booths. For example, in the case of an imprint apparatus in which four imprint booths are accommodated in the chamber 200, the number of usable booths is four, and in the case of the apparatus configuration of FIG. Here, since the apparatus configuration of FIG. 5 is assumed, 2 is acquired as the number of usable booths.

  In S202, the control unit 400 acquires information on the scheduled number of times (lot size) to be processed in the lot. Here, the scheduled processing number (lot size) refers to the number of substrates to be processed in the lot. In the example of FIG. 6, when the first lot is processed, the lot size representing the number of substrates to be processed is 40. The lot size information is acquired from the control computer 500. The lot size information may be input from an input / output device (not shown) such as a keyboard terminal, a CD drive, or a USB drive.

  In step S <b> 203, the control unit 400 acquires information on the original that can be used in the lot from the control computer 500. Alternatively, this information may be input from an input / output device (not shown) such as a keyboard terminal, a CD drive, or a USB drive.

  In S204, the control unit 400 calculates the number of substrates that can be processed for each original plate from the accumulated number of processed substrates and the number of use limits of the original plate included in the information of the original plate acquired in S203, and calculates the total of them. To do. The control unit 400 compares the total number of substrates that can be processed with the lot size. If the total number of substrates that can be processed (number of times that can be processed) is equal to or greater than the lot size (that is, the number of times that is scheduled to be processed), the process proceeds to S205. If the total number of substrates that can be processed (processable number of times) is less than the lot size, the process proceeds to S210.

  In S210, the notification unit 401 operates because the original stored in the apparatus cannot process all the number of substrates corresponding to the lot size. The notification unit 401 notifies the control computer 500 and the display unit 30 of a warning message indicating that there is a master shortage error or a master request. The display unit 30 can display a warning in response to the notified message.

  In S205, the control unit 400 determines the number of processed booths. When the imprint apparatus includes a plurality of transfer units, the scheduled number of times to be processed in a lot can be distributed to the plurality of transfer units. Here, since the lot size of the first lot is 40 sheets and the number of usable booths is 2, it is decided to divide into two at the first booth and the second booth, and to execute a series of imprint processes for 20 sheets each. To do.

  In S206, the control unit 400 determines whether or not there is a sufficient original in the apparatus that does not reach the use limit during lot processing. If there are enough masters in the apparatus that do not reach the use limit during lot processing, the process proceeds to S207. Otherwise, the process proceeds to S211. For example, if there is no original plate whose number of substrates that can be processed (number of times that can be processed) is equal to or greater than the lot size (that is, the number of times that is scheduled to be processed), the process proceeds to S211.

  In the example of FIG. 6, in the case of the processing of the first lot, it is determined whether there are at least two booths that are capable of continuously processing the 20 sheets calculated in S <b> 205. Here, it can be seen that there are three original plates A, C, and E that have more than 20 pre-startable sheets.

  In S211, the notification unit 401 operates because the original plate must be replaced during the lot processing. The notification unit 401 notifies the control computer 500 and the display unit 30 of a lot interruption warning or an original request message. The display unit 30 can display a corresponding warning message in response to the notified message.

  In S207, the selection unit 402 determines whether there is an original in the apparatus in which the accumulated number of processed substrates after the end of the lot matches the processing limit. If there is a matching original, the original has priority over the lot processing. Select and use. In FIG. 6B, the master D has 20 sheets that can be processed before the start, which is the same as the number of sheets processed in one booth, and the accumulated number of sheets after the end of the lot matches the processing limit of 100 sheets. Therefore, the selection unit 402 selects and uses the original D as the first lot.

In S208, the selection unit 402 selects an original plate whose accumulated substrate processing number after the end of the lot does not reach the processing limit. When there are a plurality of such original plates, the original plate having the earliest order in which it has been carried into the apparatus is selected. In FIG. 6B, the original A is selected for the first lot.
In S209, the selection unit 402 instructs the original exchange robot 29 to convey the selected original to the original head 16 of each booth.

  With reference to FIG. 7, the effect by the processing flow of FIG. 8 is demonstrated compared with a prior art. In FIG. 7, the numbers described in the arrows indicate the number of substrates to be processed, and the arrows described as “Ex” indicate the original plate replacement operation.

  When the processing of the first lot is executed using the original A and the original D selected by the processing of this embodiment, the processing ends at time t1. According to the prior art, when the original A and the original B are selected in the order of loading into the apparatus and the processing of the first lot is executed, the original B is processed at the processing limit of the original (100 Lot processing is interrupted. Therefore, the original exchange robot 29 receives the original B from the original chuck 17 and collects and conveys it to the original stocker 28. Further, the original exchange robot 29 acquires the original C stored in the original stocker 28 and conveys it to the original chuck 17. Thereafter, the processing of the first lot is restored, and the processing ends at time t2.

  In the processing of the first lot, it can be seen that the present embodiment ends earlier by a time corresponding to the difference between the time t1 and the time t2 as compared with the prior art (effect 1). Furthermore, in the prior art, it is necessary to interrupt the lot processing halfway and replace the original. In this case, the manufacturing error of the product may exceed the allowable range due to a change in the apparatus state due to the interruption. On the other hand, according to the present embodiment, since it is not necessary to interrupt the lot processing and replace the original plate, there is no change in the apparatus state due to the interruption, and the product manufacturing error does not exceed the allowable range (Effect 2).

  When the processing of the second lot for processing 20 substrates and the processing of the third lot for processing 80 substrates are performed following the processing of the first lot, As shown in FIG. 4, the conventional technique is time t5, and in the present embodiment, time t4. It can be seen from FIG. 7 that the two effects described in the first lot appear more remarkably.

In FIG. 8 described above, an example of processing that can be executed by the control unit 400 is shown, but the control computer 500 can also perform similar processing. FIG. 9 is a flowchart of the original conveyance process in the imprint apparatus of FIG. 5 when executed by the control computer 500.
In S301, the control computer 500 acquires the number of usable booths. For example, in the case of an imprint apparatus in which four imprint booths are accommodated in the chamber 200, the number of usable booths is four, and in the case of the apparatus configuration of FIG. Here, since the apparatus configuration of FIG. 5 is assumed, 2 is acquired as the number of usable booths.

  In S302, the control computer 500 acquires a lot size representing the number of substrates to be processed in the lot. In the example of FIG. 6, when the first lot is processed, the lot size representing the number of substrates to be processed is 40. This lot size is determined from, for example, a production plan for the product, and information is directly input to the control computer 500.

  In S303, the control computer 500 acquires information on the original plate that can be used in the lot. This information is centrally managed by the control computer 500 and can be distributed to the control unit 400 via the network immediately before manufacturing the product.

  In S304, the control computer 500 calculates the number of substrates that can be processed for each original plate from the accumulated number of processed substrate and the number of use limits of the original plate included in the information of the original plate acquired in S303, and calculates the total of them. To do. The control computer 500 compares the total and the lot size. If the total number of substrates that can be processed (number of times that can be processed) is equal to or greater than the lot size (that is, the number of times that are scheduled to be processed), the process proceeds to S305. If the total number of substrates that can be processed (processable number of times) is less than the lot size, the process proceeds to S305.

  In S310, the control computer 500 instructs the target imprint apparatus to supply an original that does not reach the use limit during lot processing. By this instruction, an automatic conveyance preparation can be made from an original plate storage device (not shown) in the semiconductor manufacturing factory by an automatic original plate transfer device (not shown). Alternatively, the operator may directly carry the corresponding original plate to the imprint apparatus.

  In S305, the control computer 500 determines the number of processed booths. Here, since the lot size of the first lot is 40 sheets and the number of usable booths is 2, it is decided to divide into two at the first booth and the second booth, and to execute a series of imprint processes for 20 sheets each. To do. This determination information is notified to the control unit 400 of the imprint apparatus via the network.

  In S306, the control computer 500 determines whether or not there are sufficient masters in the apparatus that do not reach the use limit during lot processing. If there are enough masters in the apparatus that do not reach the use limit during the lot processing, the process proceeds to S307. Otherwise, the process proceeds to S311. For example, if there is no original plate having the number of substrates that can be processed (number of times that can be processed) equal to or larger than the lot size (that is, the number of times that is scheduled to be processed), the process proceeds to S311.

  In the example of FIG. 6, in the case of the processing of the first lot, it is determined whether there are at least two booths that are capable of continuously processing the 20 sheets calculated in S <b> 205. Here, it can be seen that there are three original plates A, C, and E that have more than 20 pre-startable sheets.

  In step S311, the control computer 500 instructs the target imprint apparatus to supply an original that does not reach the use limit during the lot processing. By this instruction, an automatic conveyance preparation can be made from an original plate storage device (not shown) in the semiconductor manufacturing factory by an automatic original plate transfer device (not shown). Alternatively, the operator may directly carry the corresponding original plate to the imprint apparatus. Note that the processing of S310 described above may be collectively executed in S311.

In S307, the control computer 500 determines whether or not there is an original in the apparatus in which the accumulated number of processed substrates after completion of the lot matches the processing limit, and if there is a matching original, selects the original for lot processing. The imprint device to use. In S308, the control computer 500 selects an original plate whose accumulated substrate processing number after the end of the lot does not reach the processing limit, and notifies the imprint apparatus. When there are a plurality of such original plates, the original plate having the earliest order in which it has been carried into the apparatus is selected. In FIG. 6B, the original A is selected for the first lot.
In S309, the control computer 500 instructs the original exchange robot 29 to convey the selected original to the original head 16 of each booth.

FIG. 10 is a flowchart showing original plate recovery processing in the imprint apparatus of FIG.
In step S <b> 401, the control unit 400 acquires information on a master that can be used in a lot from the control computer 500. Alternatively, this information may be input from an input / output device (not shown) such as a keyboard terminal, a CD drive, or a USB drive.
In S <b> 402, the control unit 400 acquires a lot size representing the number of substrates to be processed in the lot from the control computer 500. The lot size information may be input from an input / output device (not shown) such as a keyboard terminal, a CD drive, or a USB drive.

  In S403, the control unit 400 calculates the number of substrates that can be processed for each original from the accumulated number of processed substrates and the number of used original plates included in the information of the original acquired in S401. The control unit 400 compares the number of processable substrates for each original plate with the lot size acquired in S402. If the number of substrates that can be processed (number of times that can be processed) is equal to or larger than the lot size (that is, the number of times that is scheduled to be processed), the process proceeds to S405. If the number of substrates that can be processed is less than the lot size, the process proceeds to S404.

In step S404, the control unit 400 instructs the original plate recovery process of the corresponding original plate to be executed. As the original plate recovery process, for example, there is an original plate cleaning process. The original recovery process may be provided with an original recovery mechanism in the imprint apparatus, or may be configured such that the original is once taken out of the apparatus, the original recovery process is performed, and then returned to the imprint apparatus again.
In S <b> 405, the selection unit 402 instructs the original exchange robot 29 to convey the selected original to the original head 16.

FIG. 11 is a flowchart showing another example of the original plate recovery process in the imprint apparatus of FIG.
In step S <b> 501, the control unit 400 acquires information on the original that can be used in a lot from the control computer 500. Alternatively, this information may be input from an input / output device (not shown) such as a keyboard terminal, a CD drive, or a USB drive.
In S502, the control unit 400 acquires information on a predetermined limit margin number. This information is a parameter for setting how many margins are allowed with respect to the number of substrates representing the use limit of the original plate to execute the recovery process. This information can be acquired from the control computer 500, but may be input from an input / output device (not shown) such as a keyboard terminal, a CD drive, or a USB drive.

  In step S503, the control unit 400 calculates the number of substrates that can be processed for each original plate from the accumulated number of processed substrates and the number of original plate uses included in the original plate information acquired in step S501. The control unit 400 compares the number of substrates that can be processed and the limit margin number. If the number of substrates that can be processed (number of times that can be processed) is greater than or equal to the limit margin number for each original, the process proceeds to S505. If the number of substrates that can be processed is less than the limit margin, the process proceeds to S504.

In step S504, the control unit 400 instructs the original plate recovery process to be executed. As the original plate recovery process, for example, there is an original plate cleaning process. The original recovery process may be provided with an original recovery mechanism in the imprint apparatus, or may be configured such that the original is once taken out of the apparatus, the original recovery process is performed, and then returned to the imprint apparatus again.
In step S <b> 505, the selection unit 402 instructs the original exchange robot 29 to convey the selected original to the original head 16.

In the above embodiment, the number of substrates to be processed (for example, the cumulative number) is used as information for determining the degree of deterioration of the original plate. However, the present invention is not limited to this. For example, the same applies even when using the number of original plate washing times, the number of stamping times, the integrated exposure amount, the digitized detected image information, the coefficient calculated from the change in the detected image, the release force, and the coefficient calculated from the change in the release force. An effect is obtained.
Further, the same effect can be obtained by using the remaining number of possible processings instead of using the number of substrates to be processed as information for determining the deterioration degree of the original plate. The number of remaining treatments can be, for example, the number of remaining processable substrates, the number of remaining cleanings, and the number of remaining stamps possible until the number of substrates at the processing limit is reached.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to the present embodiment includes a step of forming a pattern on a substrate using the above-described lithography apparatus, and a step of processing (for example, developing) the substrate on which the pattern is formed in such a step. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

100: imprint apparatus, 7: substrate stage, 11: light source for curing, 16: original plate head, 23: resin supply unit, 400: control unit

Claims (10)

A transfer section for transferring the pattern formed on the original plate to the substrate;
An original storage unit for storing multiple originals;
A control unit that selects a master to be used in the transfer unit from the plurality of masters;
A transport unit that takes out the master selected by the control unit from the master storage unit and transports the master to a master holding position of the transfer unit;
Have
The controller is
Acquire information on the number of times the transfer unit should process a lot,
Acquire information on the cumulative number of processing times in the transfer section of each original plate in the original storage section,
A lithographic apparatus that preferentially selects an original plate having a processable number of times until the cumulative processing number reaches a predetermined number among the plurality of original plates being equal to or more than the scheduled processing number.   The lithographic apparatus according to claim 1, wherein the control unit notifies a master shortage error or a master request message when the total number of times the masters can be processed is less than the scheduled processing number.   3. The lithographic apparatus according to claim 1, wherein the control unit outputs a lot interruption warning or an original request message when there is no original whose number of processable times is equal to or more than the scheduled number of processes.   4. The lithographic apparatus according to claim 2, further comprising a display unit that displays a corresponding warning in response to a message from the control unit.   2. The control unit according to claim 1, wherein the control unit preferentially selects an original plate having a processable number of times until the cumulative number of processing times reaches a predetermined number among the plurality of original plates. 4. The lithographic apparatus according to claim 1.   2. The lithographic apparatus according to claim 1, wherein the control unit instructs the original plate recovery process to be executed for an original plate in which the processable number of times is less than the scheduled processing number.   2. The lithographic apparatus according to claim 1, wherein for a master whose total number of processable times is less than a predetermined limit margin number, the control unit issues a command to execute a master recovery process for the master.   The lithographic apparatus according to claim 1, further comprising a plurality of the transfer units, wherein the scheduled number of times to be processed in the lot is distributed to the plurality of transfer units. A transfer unit that transfers the pattern formed on the original plate to the substrate, an original storage unit that stores a plurality of original plates, and a transfer unit that takes out the selected original plate from the original storage unit and transfers it to the original holding position of the transfer unit A method of controlling a lithographic apparatus, comprising:
A step of acquiring information on a scheduled number of times that the transfer unit should process in a lot;
Obtaining information on the cumulative number of processing times in the transfer portion of each original plate in the original plate storage unit;
A step of preferentially selecting an original plate used by the transfer unit as an original plate to be used in the transfer unit, the original plate having a processable number of times until the cumulative processing number reaches a predetermined number among the plurality of original plates;
A control method for a lithographic apparatus, comprising: Performing pattern formation on a substrate using the lithographic apparatus according to any one of claims 1 to 8,
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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