JP2016129172A - Semiconductor light emitting element bulb and lighting system including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element bulb improved in heat dissipation performance even at a high output while securing compatibility with a halogen bulb, an HID bulb or the like, and a lighting system including the semiconductor light emitting element bulb.SOLUTION: The whole of one surface of heat dissipation substrates 2a and 2b is in contact with flat surfaces 4a and 4b of a flat plate-like pole 4 with a flange together with heat sinks 3a and 3b, respectively. Each of the heat dissipation substrates 2a and 2b is a so-called copper inlay substrate and comprises an FR-4 layer 21, a copper core 22 and a copper foil 23. Semiconductor light emitting element packages 1a and 1b are mounted such that LED elements 11a, 12a and 11b, 12b face the respective copper cores 22, respectively. Recessed portions 31 for receiving the heat dissipation substrates 2a and 2b are formed at the inside of the heat sinks 3a and 3b, respectively, and openings 32 are formed at the recessed portions 31 in order to expose the semiconductor light emitting element packages 1a and 1b, respectively. A semicircular fin 33 is formed at the outside of each of the heat sinks 3a and 3b. An external heat sink 6 is mounted to a flange 4c of the flat plate-like pole 4.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a semiconductor light-emitting element bulb made of a semiconductor light-emitting element such as a light-emitting diode (LED) element or a laser diode (LD) element, and an illumination device using the same, and more particularly to an improvement in the heat dissipation structure.

  Conventionally, halogen bulbs and HID (High Intensity Discharge) bulbs are often used in automobiles, motorcycle headlamps, fog lamps, etc., but in recent years, LEDs using light-emitting diode (LED) elements with energy saving and long life are used. Valves are attracting attention.

  In the LED element, the electric power not used as the light output among the electric power input to achieve the desired brightness becomes heat and heats itself. Therefore, the LED element has a negative characteristic that its life and performance are reduced by heat generated by itself. Moreover, the phosphor layer used for the purpose of changing the emission color by the combination with the LED element also has a negative characteristic due to heat. For this reason, in the LED bulb, the heat of the LED element and the phosphor layer is dissipated into the air using a heat dissipation structure such as a heat sink as a heat design for keeping the temperature of the LED element and the phosphor layer below an appropriate temperature. In particular, since a high-power LED element is used in order to realize a luminous flux such as a headlamp and a fog lamp, the heat dissipation structure is increased in size.

  On the other hand, it is possible to ensure compatibility with halogen bulbs and HID bulbs by reducing the shape, size and luminous flux distribution of LED bulbs to the same as those of halogen bulbs and HID bulbs. Necessary from a viewpoint.

  8A and 8B show a first conventional LED bulb in which the above-described compatibility is ensured, in which FIG. 8A is a cross-sectional view, and FIG. 8B is a partially enlarged cross-sectional view of FIG. , FIG. 4).

  In FIG. 8, two LED packages 101 a and 101 b are mounted on both main surfaces of the heat dissipation substrate 102. The heat dissipation substrate 102 is fixed to the bulb body 104 inserted into the lighting device by screws 103. The heat dissipation substrate 102 includes a metal or ceramic base material 1021, an insulating layer 1022 that covers the base material 1021, a wiring pattern layer 1023 on the insulating layer 1022, and a protective layer 1024. At this time, the wiring pattern layers 1023 on both main surfaces are commonly connected through the through-holes 1023a, and are further electrically connected to the wires 105 in common. Therefore, heat from the LED packages 101 a and 101 b is radiated to the valve body 104 via the heat dissipation substrate 102.

  The second conventional LED bulb ensuring the above-mentioned compatibility is supported by an LED package, an LED package provided at the tip, a valve body inserted into the lighting device, and three columns on the bulb body, It is comprised from the reflector curved in the conical shape toward the light emission surface of an LED element, and the heat sink fitted by the reflector (refer: patent document 2).

  The third conventional LED bulb ensuring the above-mentioned compatibility is an LED package, the bulb body provided at the tip, and inserted into the lighting device, and a plurality of grooves are cut in the columnar portion of the bulb body. It is comprised from the heat sink formed by doing (refer: patent document 3).

JP, 2014-120388, A Japanese Patent No. 4687762 JP 2007-48727 A

  However, in the above-described conventional first LED bulb shown in FIG. 8, only a part of the heat dissipation substrate 102 is in contact with the bulb body 104, and the LED packages 101a and 101b are opposed to the bulb body 104. Therefore, the distance from the LED packages 101a and 101b to the bulb body 104 is large, and the heat resistance of the heat dissipation board 102 including the insulating layer 1022 and the protective layer 1024 is also large. Therefore, the thermal resistance from the LED packages 101a and 101b to the valve body 104 increases, and as a result, there is a problem that the heat dissipation performance in the case of a high-power LED element is insufficient.

  Further, in the above-described conventional second LED bulb, the contact area between the bulb main body and the heat sink is limited by a support column or the like, so that the heat dissipation performance of the heat sink becomes insufficient. There exists a subject that the heat dissipation performance in the case of an output LED element is inadequate.

  Furthermore, in the above-described conventional third LED bulb, the heat sink groove is provided so as to cross the natural convection flow in the case of a lighting device such as a headlamp or a fog lamp. As a result, there is a problem that the heat dissipation performance in the case of a high-power LED element is insufficient.

  In order to solve the above-described problems, a semiconductor light emitting device valve according to the present invention includes first and second semiconductor light emitting device packages, and first and second semiconductor light emitting device packages each mounted with the first and second semiconductor light emitting device packages. Each of the first and second semiconductor light-emitting elements, and the first and second semiconductor light-emitting elements. The package is opposed to the flat pole via the first and second heat dissipation substrates. Thereby, the distance from the first and second semiconductor light emitting device packages to the flat pole is substantially reduced. Each of the first and second heat dissipation substrates includes first and second metal inlay substrates, and each of the first and second semiconductor light emitting device packages is formed on a metal core of the first and second metal inlay substrates. Implemented in opposition. This reduces the thermal resistance of the heat dissipation board itself.

  Further, the first and second heat sinks attached to the first and second flat surfaces of the plate-shaped pole are provided, and the first and second heat radiating substrates are the first of the first and second heat sinks. The first and second semiconductor light emitting device packages are received in the first and second openings provided in the first and second recesses of the first and second heat sinks. It is a thing. As a result, the contact area between the first and second heat sinks and the flat pole increases, and the heat dissipation performance of the first and second heat sinks is improved.

  Furthermore, each of the first and second heat sinks is provided between at least the first and second semiconductor light emitting device packages and the flange of the flat pole, and is a semicircular fin provided in parallel to natural convection. It comprises. Thereby, the heat dissipation performance with respect to the natural convection of the first and second heat sinks is improved.

  According to the present invention, since the distance from the semiconductor light emitting device package to the flat pole is substantially reduced, the thermal resistance from the semiconductor light emitting device package to the flat pole as the valve body can be reduced, and thus the heat dissipation performance can be reduced. It can be improved.

1 is a perspective view showing a first embodiment of a semiconductor light emitting element bulb according to the present invention. FIG. 2 is a partially exploded view of the semiconductor light emitting device bulb of FIG. 1. FIG. 2 is a detailed cross-sectional view in the vicinity of a flat pole of the semiconductor light emitting device bulb of FIG. 1. It is a perspective view which shows 2nd Embodiment of the semiconductor light-emitting device valve | bulb which concerns on this invention. It is a figure explaining the effect of the plate fin of FIG. 1, and the pin fin of FIG. 2 is a table showing the relationship between the mounting position of a flat pole on the heat sink of FIG. 1 and the temperature of the semiconductor light emitting element. It is a perspective view which shows the reflector type illuminating device which mounted | wore the semiconductor light-emitting device bulb | bulb of FIG. The 1st conventional LED bulb is shown, (A) is a sectional view and (B) is a partial expanded sectional view of (A).

  1 is a perspective view showing a first embodiment of a semiconductor light emitting element valve according to the present invention, FIG. 2 is a partially exploded view of the semiconductor light emitting element valve of FIG. 1, and FIG. 3 is a flat plate of the semiconductor light emitting element valve of FIG. FIG.

  1, 2, and 3, the semiconductor light emitting device packages 1 a and 1 b are mounted on the heat dissipation substrates 2 a and 2 b. The entire surface of the heat radiating boards 2a and 2b is in contact with the flat surfaces 4a and 4b of the flanged flat pole 4 as a valve body together with the heat sinks 3a and 3b, and the heat radiating boards 2a and 2b are fixed by screws 5a and 5b. The flat pole 4 has a uniform thickness. Therefore, the distance from the semiconductor light emitting device packages 1a and 1b to the flat pole 4 via the heat dissipation substrates 2a and 2b is substantially reduced. Further, between the heat radiating substrates 2a and 2b, the heat sinks 3a and 3b, and the flat pole 4, a thermal conductive member (TIM) (not shown) such as grease or a thermal conductive adhesive is used to reduce thermal resistance. ).

  The semiconductor light emitting device packages 1a and 1b are white light sources, for example, two blue LED devices 11a and 12a; 11b and 12b, and a yttrium aluminum garnet (YAG) oxide phosphor that converts part of the blue light into yellow light. It consists of layers 13a; 13b. A laser diode (LD) element can be used in place of the LED element.

  The heat radiating substrates 2a and 2b have a function of a printed wiring board of the semiconductor light emitting device packages 1a and 1b, and are made of a double-sided glass epoxy substrate so-called a copper inlay substrate into which a copper core having high thermal conductivity and high heat radiating properties is press-fitted. That is, each heat dissipation board 2a, 2b consists of the copper core 22 which penetrated FR-4 layer 21, FR-4 layer 21, and copper foil 23 as a wiring layer. As a result, the thermal resistance of the heat dissipation boards 2a and 2b itself is reduced. In this case, the semiconductor light emitting device packages 1 a and 1 b are mounted such that the LED devices 11 a and 12 a; 11 b and 12 b are opposed to the copper core 22. As a result, the distance from the semiconductor light emitting device packages 1a, 1b to the flat pole 4 via the copper core 22 is substantially reduced to enhance the heat conduction effect. The copper inlay substrate may be a metal inlay substrate into which a metal other than copper is press-fitted. Further, the heat dissipation substrates 2a and 2b may be ceramic substrates, or may be a metal base substrate made of an aluminum alloy or copper base metal that is thin but has high heat dissipation performance and high thermal conductivity.

  As described above, by reducing the thermal resistance of the heat dissipation substrates 2a and 2b themselves, the entire surface of the heat dissipation substrates 2a and 2b is brought into contact with the flat surfaces 4a and 4b of the flat pole 4 having the same thickness. Since the distance from the package 1a, 1b to the flat pole 4 is substantially reduced, the thermal resistance from the semiconductor light emitting device package 1a, 1b to the flange 4c of the flat pole 4 can be reduced. As a result, a high output semiconductor Even in the case of the light emitting element packages 1a and 1b, the heat dissipation performance can be improved.

  The heat sinks 3a and 3b are symmetrically divided so as to sandwich the flat pole 4 therebetween. A recess 31 for accommodating the heat dissipation substrates 2a and 2b is formed inside the heat sinks 3a and 3b, and an opening 32 is formed in the recess 31 to expose the semiconductor light emitting device packages 1a and 1b. Has been. On the other hand, semicircular fins 33 are formed outside the heat sinks 3a and 3b. The semicircular fins 33 are provided in parallel along the flow of natural convection, so that the heat dissipation performance of the heat sinks 3a and 3b can be sufficiently exhibited. The semicircular fins 33 are designed in consideration of the light flux, luminous intensity, and light distribution characteristics necessary for the lighting device. However, the semicircular fins 33 improve the heat dissipation performance while reducing the light extraction effect. For this reason, by reducing the size of the semicircular fins 33 in the vicinity of the semiconductor light emitting device packages 1a and 1b to be smaller than the size of the semicircular fins 33 in the vicinity of the flange 4c, the heat radiation performance is improved without reducing the light extraction effect. The heat sinks 3a and 3b are made of, for example, a high thermal conductivity aluminum alloy, and black marmite treatment, coating, or the like is applied to the surfaces of the heat sinks 3a and 3b in order to increase the emissivity of the surface. In particular, the surface treatment of the heat sinks 3a and 3b absorbs light in the visible light region, and therefore does not hinder light distribution control.

  Thus, the contact area is increased by bringing the heat sinks 3a and 3b into contact with the flat surfaces 4a and 4b and the flange 4c of the flat plate pole 4 having the same thickness, and the flat plate can be formed from the high-power semiconductor light emitting device packages 1a and 1b. The heat radiation performance to the heat sinks 3a and 3b through the pole 4 is improved.

  The flat pole 4 is made of a metal such as copper or an alloy such as an aluminum alloy that has a high heat dissipation performance even though it is thin in order to reduce the distance between the semiconductor light emitting device packages 1a and 1b. Further, the flat surfaces 4a and 4b of the flat pole 4 are formed as a smooth surface or a mirror-finished smooth surface in order to reduce the contact thermal resistance.

  An external heat sink 6 of the lighting device is attached to the flange 4c of the flat pole 4 by screws (not shown). At this time, the external heat sink 6 is rotatable in the plane of the flange 4 c of the flat pole 4. Further, an O-ring (not shown) is provided on the flange 4c of the flat pole 4 in order to provide a waterproof structure when the semiconductor light emitting element bulb is mounted on a housing such as a headlamp. The external heat sink 6 is larger than the socket size of the conventional halogen bulb and HID bulb.

  Plate fins 61 are formed on the external heat sink 6. The plate fins 61 are provided in parallel along the flow of natural convection, so that the heat dissipation performance of the external heat sink 6 can be sufficiently exhibited. The external heat sink 6 is made of, for example, a high thermal conductivity aluminum alloy, and the surface of the external heat sink 6 is subjected to black malmite treatment, coating, or the like in order to increase the surface emissivity. At this time, a heat conductive member (TIM) (not shown) such as grease or a heat conductive adhesive is interposed between the flange 4c of the flat pole 4 and the external heat sink 6 in order to reduce thermal resistance. Let

  FIG. 4 is a perspective view showing a second embodiment of the semiconductor light emitting element bulb according to the present invention. In FIG. 4, the flange 4c is not shown.

  In FIG. 4, heat sinks 3 a ′ and 3 b ′ are provided in place of the heat sinks 3 a and 3 b in FIGS. 1 to 3, and an external heat sink 6 ′ is provided in place of the external heat sink 6 in FIGS. 1 to 2.

  In the heat sinks 3 a ′ and 3 b ′, priority is given to improving the light extraction efficiency while suppressing heat dissipation performance a little by deleting the semicircular fins on the front side of the heat dissipation boards 3 a and 3 b.

  Further, in the external heat sink 6 ', pin fins 61' are provided instead of the plate fins 61 shown in FIGS. In the case of the plate fin 61, the best heat dissipation performance is exhibited when parallel to the natural convection, but as shown in FIG. 5A, the heat dissipation performance decreases when the plate fin 61 is inclined with respect to the natural convection. However, when it becomes perpendicular to natural convection, the heat dissipation performance is reduced by about 30%. On the other hand, in the case of the pin fin 61 ′, as shown in FIG. 5B, even if the pin fin 61 ′ is inclined with respect to natural convection, the heat dissipation performance does not deteriorate. That is, the external heat sink 6 'can exhibit the best heat dissipation performance at any rotational mounting position. Further, the external heat sink 6 ′ of the pin fin 61 ′ can be reduced by about 30% compared to the external heat sink 6 of the plate fin 61.

  FIG. 6 is a table showing the relationship between the mounting position of the flat pole 4 as the valve body with respect to the external heat sink 6 of FIG. 1 and the temperatures of the semiconductor light emitting device packages 1a and 1b.

  As shown in FIG. 6, when the flat pole 4 is attached to the upper position of the external heat sink 6, the semiconductor light emitting device package is compared with the case where the flat pole 4 is attached to the center position or the lower position of the external heat sink 6. It can be seen that the temperatures of 1a and 1b are lowered by about 0.3 ° C. This is because the heat flow field of the flat pole 4 due to natural convection and the heat flow field of the external heat sink 6 are likely to develop on both sides. That is, the upper part of the flat pole 4 and the upper part of the external heat sink 6 can be brought close to each other to enhance the effect of natural convection, and as a result, the heat dissipation performance can be improved. Similarly, with respect to the mounting position of the flat pole 4 as the valve body with respect to the external heat sink 6 ′ of FIG. 4, it is preferable that the flat pole 4 is mounted on the upper position of the external heat sink 6 ′.

  FIG. 7 is a perspective view showing a reflector type illumination device equipped with the semiconductor light emitting element bulb of FIG.

  In FIG. 7, a reflector 7 is provided so as to cover the semiconductor light emitting element bulb of FIG. The reflector 7 constitutes a projection optical unit that projects light emitted from the semiconductor light emitting element bulb in a predetermined direction. The reflector 7 is a paraboloid in which a reflective layer such as Al is formed on a resin material. In this case, the semiconductor light emitting element packages 1a and 1b are provided at positions that cannot be seen from the outside of the reflector 7, thereby reducing glare due to direct light from the semiconductor light emitting element packages 1a and 1b.

  In the illumination device equipped with the semiconductor light emitting element bulb of FIG. 4, since the semiconductor light emitting element packages 1a and 1b can be seen from the outside of the reflector, the light extraction efficiency can be improved although glare is likely to occur.

  Further, the semiconductor light emitting element bulb of FIGS. 1 and 4 can be mounted on other illumination devices such as a projector illumination device, a direct projection illumination device, etc. in addition to the reflector illumination device shown in FIG.

  The present invention can be applied to any modifications within the obvious range of the above-described embodiment.

  The lighting device according to the present invention can be used for a vehicular lamp, for example, a headlamp, a fog lamp, a daytime running lamp (DRL), a strobe, and other general lighting devices.

1a, 1b: Semiconductor light emitting device package 2a, 2b: Heat dissipation substrate 21: FR-4 layer 22: Insulating layer 23: Copper cores 3a, 3b; 3a ′, 3b ′: Heat sinks (first and second heat sinks)
31: Recess 32: Opening 33: Semi-circular fin 4: Flat pole (valve body)
4a, 4b: flat surface 4c: flange 5a, 5b: screw 6, 6 ': external heat sink (third heat sink)
61: Plate fin 61 ': Pin fin 7: Reflector 101a, 101b: LED package 102: Heat dissipation substrate 1021: Base material 1022: Insulating layer 1023: Wiring pattern layer 1023a: Through hole 1024: Protective layer 103: Screw 104: Valve body 105 : Wire

Claims (10)

First and second semiconductor light emitting device packages;
First and second heat dissipation substrates on which the first and second semiconductor light emitting device packages are mounted;
A flat pole having first and second flat surfaces that are in contact with the entire surface of each of the first and second heat dissipation substrates;
Each said 1st, 2nd semiconductor light-emitting device package is a semiconductor light-emitting device valve | bulb which has opposed the said flat pole via the said 1st, 2nd heat dissipation board | substrate. Each of the first and second heat dissipation substrates includes first and second metal inlay substrates,
2. The semiconductor light emitting device bulb according to claim 1, wherein each of the first and second semiconductor light emitting device packages is mounted to face a metal core of the first and second metal inlay substrates. Furthermore, it comprises first and second heat sinks attached to the first and second flat surfaces of the flat pole,
Each of the first and second heat dissipation substrates is housed in the first and second recesses of the first and second heat sinks,
2. The first and second semiconductor light emitting device packages according to claim 1, wherein the first and second semiconductor light emitting device packages are exposed through first and second openings provided in first and second recesses of the first and second heat sinks, respectively. Semiconductor light emitting element bulb.   Each of the first and second heat sinks is provided between at least the first and second semiconductor light emitting device packages and the flange of the flat pole, and is a semicircular fin provided in parallel to natural convection. The semiconductor light-emitting element bulb according to claim 3 comprising:   5. The semiconductor light emitting element bulb according to claim 4, wherein a size of the semicircular fin in the vicinity of the first and second semiconductor light emitting element packages is smaller than a size of the semicircular fin in the vicinity of the flange of the flat pole.   The semiconductor light-emitting element valve according to claim 1, further comprising a third heat sink attached to a flange of the flat pole.   The semiconductor light-emitting element bulb according to claim 6, wherein the third heat sink has plate fins parallel to natural convection.   The semiconductor light-emitting element bulb according to claim 6, wherein the third heat sink has a pin fin.   The semiconductor light-emitting element bulb according to claim 6, wherein a flange of the flat pole is attached to an upper part of the third heat sink. A semiconductor light-emitting element bulb according to any one of claims 1 to 9,
An illumination apparatus comprising: a projection optical unit that is mounted with the semiconductor light emitting element bulb and projects light emitted from the semiconductor light emitting element bulb in a predetermined direction.