JP2016100484A - Semiconductor element container for storing semiconductor element - Google Patents

Abstract

PURPOSE: To provide a micro semiconductor element container suitable for storing a micro semiconductor element; further provide a semiconductor element container which prevents a joining material from protruding when a lid body is joined to a container body by using the joining material even in the case where a side wall of the container body of the semiconductor element container is extremely thin.SOLUTION: A semiconductor element container of one embodiment comprises: a container body 1 which is a metal container body 1 formed in a trough shape with a square opening in plan view and has a flange part projecting toward an outer periphery side in a horizontal direction from a top part of a side wall 1c of the container body, and in which a groove 1e which circles around along a top face of the flange part and along a top face of the side wall is formed; and a lid body 2 which has a semiconductor 3 attached to a rear face of the lid body and which is formed by a material consisting primarily of a ceramic material or ceramic.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a container for housing a semiconductor element, and more particularly to a container for a semiconductor element for housing a very small semiconductor element.

  2. Description of the Related Art Conventionally, a container for a semiconductor element that accommodates an extremely small semiconductor element is composed of a container to which the semiconductor element is attached and a lid that is a lid formed so as to seal the container. After the semiconductor element was attached to the bottom, the lid was joined by brazing or the like.

  That is, the conventional semiconductor element container is formed by placing a semiconductor element in a tank-shaped ceramic container and covering it with a lid made of metal or the like.

  By the way, in recent years, semiconductor elements have been miniaturized to sub-millimeter size or sub-micron size, and it is desirable to have a very small semiconductor element container suitable for accommodating such a small semiconductor element. However, if the container of the semiconductor element container is made of ceramic as in the conventional product, it is difficult to mold it to a minimum size, especially because it is difficult to make the side wall of the ceramic container thin, It has not been possible to provide a container for a semiconductor device that is suitable for a semiconductor of a minimum size.

  In addition, even if an extremely small semiconductor element container can be made, when the container of the extremely small semiconductor element container and the lid are bonded using a bonding agent, the bonding applied to the top of the thin side wall of the container If the agent protrudes (sagging), the electronic substrate on which the semiconductor element container is mounted may be damaged.

Japanese Patent Laid-Open No. 06-151628

  An object of the present invention is to provide a container for a minimal semiconductor element suitable for accommodating a minimal semiconductor element. Furthermore, even when the side wall of the container of the semiconductor device container of extremely small dimensions is extremely thin, the bonding agent applied to the top of the side wall protrudes when the lid is bonded to the container using the bonding agent. An object of the present invention is to provide a container for a semiconductor device that does not have any.

  Conventional semiconductor element containers are generally composed of a ceramic container in which a semiconductor element is accommodated and a metal lid. On the other hand, the container for a semiconductor device of the present invention is a conventional product in that it comprises a metal container that is relatively easy to mold and a lid formed from a ceramic material or a material mainly composed of ceramic. The basic configuration is different.

  In one aspect, the container for a semiconductor device of the present invention is a container made of metal (for example, iron) formed in a tank shape having a square opening in plan view, and is along the upper surface of the side wall of the container. And a lid formed of a ceramic material or a ceramic-based material with a semiconductor element attached to the back surface of the lid. Become.

  In another aspect, the container for a semiconductor device of the present invention is a metal container formed in a tank shape having a square opening in a plan view, and the outer periphery in the horizontal direction from the top of the side wall of the container A container having a flange projecting to the side, and having a groove formed around the upper surface of the flange or the upper surface of the side wall, and a lid for closing the opening of the container, A semiconductor element is attached to the back surface, and the lid is formed of a ceramic material or a material mainly composed of ceramic. In this specification, the “groove that circulates along the upper surface of the flange or the upper surface of the sidewall” refers to the upper surface of the flange or the upper surface of the sidewall that protrudes from the top of the sidewall toward the outer periphery in the horizontal direction. In addition to a groove to be formed, a groove formed on a boundary line between the upper surface of the flange portion and the upper surface of the side wall is included. Further, the “main component” in the present specification means containing 50% or more as a component of the material.

  In still another aspect, the container for a semiconductor element of the present invention is a metal container formed in a tank shape having a square opening in plan view, and is lower than the top of the side wall of the container A container having a flange projecting from the position to the outer peripheral side in the horizontal direction, and a lid, the semiconductor element being attached to the back surface of the lid, formed from a ceramic material or a material mainly composed of ceramic And a lid.

  In the present invention, a semiconductor element is attached to the back surface of a lid formed of a ceramic material or a material containing ceramic as a main component. In addition, since the container made of ceramic in the past can be made of metal, the side wall of the container can be made thin, so that there is provided a container for a semiconductor element that is suitable for accommodating a semiconductor element. can do. In one example, the container in the container for a semiconductor element of the present invention has vertical and horizontal dimensions with an opening of 1 mm × 1.5 mm in plan view. In another example, the container in the container for a semiconductor device of the present invention has a vertical and horizontal dimension slightly larger than 1 mm × 1.5 mm (for example, 2 mm × 2 mm) or a slightly smaller vertical and horizontal dimension (for example, 1 mm × 1.2 mm). Furthermore, as semiconductor devices are being miniaturized in this technical field, there is a possibility that the size will be reduced (downsized) to the vertical and horizontal dimensions of a submillimeter size.

The perspective view which shows an example of the container for semiconductor elements of this invention. Sectional drawing of the container for semiconductor elements shown by FIG. Sectional drawing which shows the other Example of the container for semiconductor elements of this invention. Sectional drawing which shows the state with which the container and the cover body were joined. Sectional drawing which shows a container and the cover body to which the semiconductor element was attached. Sectional drawing which shows the state with which the container and the cover body were joined. Sectional drawing which shows the further another Example of the container for semiconductor elements of this invention.

  The container for a semiconductor device of the present invention will be described in detail below with reference to the accompanying drawings.

  FIG. 1 shows one embodiment of a container for a semiconductor element. The container for a semiconductor element of the present invention comprises a container 1 formed from a metal material and a lid 2 formed from a ceramic material or a material containing ceramic as a main component.

  The metal container 1 is formed in a tank shape having a square opening 1b in a plan view, and has an inner bottom 1a and a side wall 1c. In one embodiment, as shown in FIG. 3, the groove 1 e that circulates along the upper surface of the side wall of the container 1 can be formed by various known techniques (which may include laser processing techniques). In another embodiment, a flange 1d that protrudes from the top of the side wall 1c of the container 1 to the outer peripheral side in the horizontal direction is formed, and circulates along the upper surface of the flange 1d or the upper surface of the sidewall 1c. A groove 1e is formed.

  The lid 2 is put on the container 1 so as to cover the entire groove 1e of the container 1, and is joined to the container 1. The bonding between the container body and the lid will be described. A gold-tin alloy paste (bonding agent) is applied to a groove formed so as to circulate along the upper surface of the side wall of the container, and the lid is attached to the container. Be joined. Since bonding is performed using a gold-tin alloy paste applied to a groove formed on the upper surface of the side wall of the container, the bonding agent does not protrude when the container and the lid are bonded. It is possible to realize a strong joint that is highly resistant to impact.

  2 is a cross-sectional view of the semiconductor element container shown in FIG. In this embodiment, a groove 1e is formed along the upper surface of the flange 1d of the container 1 or the upper surface of the side wall 1c. In FIG. 2, the groove 1e having a semicircular (U-shaped) cross-sectional shape is shown, but a groove having another cross-sectional shape such as a wedge-shaped (V-shaped) cross-sectional shape may be employed. is there.

  FIG. 3 is a cross-sectional view of the container 1 and the lid 2 in the semiconductor element container of another embodiment. A circulating groove 1e is formed along the upper surface of the side wall 1c of the container 1.

  As shown in FIG. 4, the lid 2 is bonded to the container 1 using the bonding agent 4 applied to the groove 1e of the container 1 of the semiconductor element container, so that the inside of the semiconductor element container is sealed. Is done.

  FIG. 5 is a cross-sectional view showing the container 1 in the semiconductor element container of the embodiment shown in FIGS. 1 and 2 and the lid 2 to which the semiconductor element 3 is attached. The semiconductor element 3 is attached to the back surface 2a of the lid 2 using an adhesion technique well known in the art.

  As shown in FIG. 6, the lid 2 to which the semiconductor element 3 is attached is bonded to the container 2 using a bonding agent 4 applied to the groove 1 e of the container 1. After the bonding agent 4 is applied to the groove 1e, when the container 1 and the lid 2 of the semiconductor element container are bonded in a vacuum atmosphere, the inside of the semiconductor element container is sealed. As the bonding agent 4, a gold-tin alloy paste is preferably used, but other appropriate bonding agents such as silver paste (silver brazing), low-melting glass, or solder may be used.

  FIGS. 7A and 7B are cross-sectional views of the container 1 and the lid 2 in the container for a semiconductor element of still another embodiment of the present invention. In this embodiment, the flange is not projected from the height of the top of the side wall 1c of the container 1 of the container for semiconductor elements to the outer peripheral side in the horizontal direction, but is lower than the top of the side wall 1c of the container 1. 1d protrudes from the horizontal direction to the outer peripheral side in the horizontal direction, and the bonding agent 4 is applied to the upper surface of the flange 1d. As shown in the drawing, since there is a gap between the surface to which the bonding agent 4 is to be applied and the lid body 2, when bonding the container 1 and the lid body 2, the bonding agent 4 is not applied too much. By doing so, the bonding agent 4 does not protrude to the outer peripheral side.

DESCRIPTION OF SYMBOLS 1 ... Container 1a ... Inner bottom 1b ... Opening 1c ... Side wall 1d ... Gutter 1e ... Groove 2 ... Lid 2a ... Back surface 3 ... Semiconductor element 4 ... Bonding agent

Claims (4)

A metal container formed in a tank-like shape having a square opening in plan view, and a container formed with a groove that circulates along the upper surface of the side wall of the container;
A lid having a semiconductor element attached to the back surface of the lid and formed from a ceramic material or a material mainly composed of ceramic; and
A container for a semiconductor element for containing a semiconductor element. A metal container formed in a tank shape having a quadrangular opening in plan view, and having a flange protruding from the top of the side wall of the container toward the outer peripheral side in the horizontal direction, and an upper surface of the flange Or a container having a groove formed around the upper surface of the side wall;
A lid having a semiconductor element attached to the back surface of the lid and formed from a ceramic material or a material mainly composed of ceramic; and
A container for a semiconductor element for containing a semiconductor element.   The container for a semiconductor element for housing a semiconductor element according to claim 1 or 2, wherein the lid is bonded to the container using a bonding agent applied to the groove. A metal container formed in a tank shape having a square opening in plan view, the container having a flange projecting from the position lower than the top of the side wall of the container to the outer peripheral side in the horizontal direction;
A lid having a semiconductor element attached to the back surface of the lid and formed from a ceramic material or a material mainly composed of ceramic; and
A container for a semiconductor element for containing a semiconductor element.

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