JP2016100314A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which prevents a short circuit from occurring between a first electrode and a second electrode while reducing the number of terminals connected with the first electrode when multiple areas, which are supplied with electric power, are provided in the first electrode.SOLUTION: A light emitting part 140 is formed on a first surface of a substrate 100 and has a first electrode 110; a second substrate 130; and an organic layer 120. The second electrode 130 is positioned on the first electrode 110. The organic layer 120 is positioned between the first electrode 110 and the second electrode 130. A conductive film 170 is formed on the first surface of the substrate 100 and electrically connected with portions of the first electrode 110 which are different from each other. A moistureproof film 101 is formed on the first surface of the substrate 100 to cover the conductive film 170. A first terminal 112 is formed on the first surface of the substrate 100 and connected with the conductive film 170. A second terminal 132 is formed on the first surface of the substrate 100 and connected with the second electrode 130.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device.

  In recent years, development of light-emitting devices having organic EL (Organic Electroluminescence) elements as light-emitting elements has been progressing. The organic EL element has a configuration in which an organic layer is sandwiched between a first electrode that is a transparent electrode and a second electrode. The transparent conductive material has a higher resistance than a metal material such as Al. For this reason, the first electrode is often provided with a plurality of regions to be fed. For example, Patent Document 1 describes that a plurality of conductive columnar members are provided on a first electrode and power is supplied to the first electrode through the columnar members.

  Patent Document 2 describes that a terminal connected to the first electrode and a terminal connected to the second electrode are formed in the same layer as the first electrode.

JP 2008-166181 A International Publication No. 2012/133715

  A wiring such as a lead terminal is connected to the first electrode and the second electrode via the above-described terminals. In order to simplify this connection process, it is preferable to reduce the number of terminals of the first electrode. On the other hand, as described above, the first electrode made of a transparent conductive material is often provided with a plurality of regions to be fed. In this case, in order to reduce the number of terminals of the first electrode, it is necessary to draw a conductive layer between the terminal and the first electrode. However, since the potential of the first electrode is different from that of the second electrode, it is necessary to prevent the above-described conductive layer from being short-circuited with the second electrode.

  As a problem to be solved by the present invention, when a plurality of regions to be fed to the first electrode are provided, the first electrode and the second electrode are short-circuited while reducing the number of terminals connected to the first electrode. One example is to avoid this.

The invention according to claim 1 is a substrate;
A light-emitting unit formed on the first surface of the substrate and having a first electrode, a second electrode located on the first electrode, and an organic layer located between the first electrode and the second electrode;
A conductive film formed on the first surface of the substrate and electrically connected to a plurality of portions of the first electrode;
A first insulating film formed on the first surface of the substrate and covering the conductive film;
A first terminal formed on the first surface of the substrate and connected to the conductive film;
A second terminal formed on the first surface of the substrate and connected to the second electrode;
It is a light-emitting device provided with.

It is a top view which shows the structure of the light-emitting device which concerns on embodiment. It is the figure which removed the 2nd electrode, the 2nd terminal, and the extraction wiring from FIG. It is the figure which removed the organic layer from FIG. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. 6 is a plan view showing a configuration of a light emitting device according to Modification Example 1. FIG. It is AA sectional drawing of FIG. 12 is a plan view of a light emitting device according to Modification 2. FIG. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a plan view showing a configuration of a light emitting device 10 according to the embodiment. FIG. 2 is a diagram in which the second electrode 130, the second terminal 132, and the lead wiring 134 are removed from FIG. 1. FIG. 3 is a diagram in which the organic layer 120 is removed from FIG. The light emitting device 10 according to the embodiment includes a substrate 100, a light emitting unit 140, a conductive film 170, a moisture-proof film 101 (an example of a first insulating film), a first terminal 112, and a second terminal 132. The light emitting unit 140 is formed on the first surface of the substrate 100 and includes the first electrode 110, the second electrode 130, and the organic layer 120. The second electrode 130 is located on the first electrode 110. The organic layer 120 is located between the first electrode 110 and the second electrode 130. The conductive film 170 is formed on the first surface of the substrate 100 and is electrically connected to different portions of the first electrode 110, that is, a plurality of portions. The moisture-proof film 101 is formed on the first surface of the substrate 100 and covers the conductive film 170. The first terminal 112 is formed on the first surface of the substrate 100 and is connected to the conductive film 170. The second terminal 132 is formed on the first surface of the substrate 100 and is connected to the second electrode 130. Details will be described below.

  The substrate 100 is a light-transmitting substrate such as a glass substrate or a resin substrate. The substrate 100 may have flexibility. In the case of flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. The substrate 100 is, for example, a polygon such as a rectangle. When the substrate 100 is a resin substrate, the substrate 100 is formed using, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide.

In the example shown in the figure, the substrate 100 is a resin substrate. For this reason, in order to suppress moisture from passing through the substrate 100, the moisture-proof film 101 is formed on at least the surface (preferably both surfaces) of the substrate 100 where the light emitting unit 140 is formed. The moisture-proof film 101 includes an inorganic film such as a SiN _x film or a SiON film. The moisture-proof film 101 may be a film in which this inorganic film and an organic film are laminated. Here, as the organic film, for example, an acrylic resin or an epoxy resin that is cured by ultraviolet rays or heat and has a gas barrier property can be used. The thickness of the moisture-proof film 101 is, for example, not less than 0.1 μm and not more than 10 μm.

  The planar shape of the substrate 100 is a polygon such as a rectangle. The first terminal 112 and the second terminal 132 described above are arranged along one side of the substrate 100. The conductive film 170 extends along this one side.

  A light emitting unit 140 is formed on the first surface of the substrate 100. The light emitting unit 140 has an organic EL element. This organic EL element has a configuration in which a first electrode 110, an organic layer 120, and a second electrode 130 are laminated in this order. The first electrode 110 is, for example, an anode, and the second electrode 130 is, for example, a cathode.

  The first electrode 110 is a transparent electrode having optical transparency. The material of the transparent electrode is a material containing a metal, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). The thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm. The first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method. The first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS. In this case, the first electrode 110 may be formed by a printing method.

  The organic layer 120 has a light emitting layer. The organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a vapor deposition method. In addition, at least one layer of the organic layer 120, for example, a layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 are formed by vapor deposition. Moreover, all the layers of the organic layer 120 may be formed using the apply | coating method.

  The second electrode 130 is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from the first group. Contains a metal layer. In this case, the second electrode 130 has a light shielding property. The thickness of the second electrode 130 is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode 130 may be formed using the material exemplified as the material of the first electrode 110, or may be a thin film made of the above-described metal or metal alloy. In this case, the second electrode 130 is in a transparent or translucent state. The second electrode 130 is formed using, for example, a sputtering method, a vapor deposition method, or a printing method. The organic layer 120 is formed wider than the second electrode 130. For this reason, the 1st electrode 110 and the 2nd electrode 130 do not short-circuit.

  The light emitting device 10 has a first terminal 112. The first terminal 112 is electrically connected to the first electrode 110. In the example shown in the drawing, the first terminal 112 is one end of the lead wiring 114.

  Specifically, a lead-out wiring 114 is formed between the moisture-proof film 101 and the first electrode 110. The lead wiring 114 is, for example, a metal film or a laminated film in which metal films are laminated. The lead-out wiring 114 has a configuration in which, for example, a film made of Mo or Mo alloy, a film made of Al or Al alloy, and a film made of Mo or Mo alloy are stacked in this order. One end of the lead wiring 114 extends to the outside of the first electrode 110 and serves as a first terminal 112. In the example shown in the figure, the substrate 100 is rectangular, and the first electrode 110 is also rectangular. The lead-out wiring 114 is formed along each of two sides extending in a direction intersecting the conductive film 170 among the four sides of the first electrode 110. The first terminal 112 is formed only on one lead wiring 114. The lead-out wiring 114 that does not have the first terminal 112 is connected to the first terminal 112 through the conductive film 170.

  Note that in the direction along the conductive film 170, the lead-out wiring 134 and the second terminal 132 are connected to the connection point (intersection in plan view) of the first lead-out wiring 114 and the conductive film 170, and the second lead-out wiring 114 and the conductive film. It is located between 170 connection points (intersection points in plan view).

  In addition, the light emitting device 10 has a second terminal 132. The second terminal 132 is located on the moisture-proof film 101 and is connected to the second electrode 130. In the example shown in this drawing, a part of the second electrode 130 protrudes from the main body of the second electrode 130 toward the edge of the substrate 100 and serves as a lead-out wiring 134. One end of the lead wiring 134 serves as the second terminal 132. The lead wiring 134 extends in a direction overlapping the conductive film 170. In this way, the first terminal 112 and the second terminal 132 are disposed along the same side of the substrate 100.

  4 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 5 is a cross-sectional view taken along the line BB in FIG. As shown in FIG. 5, a conductive film 170 is formed between the substrate 100 and the moisture-proof film 101. The conductive film 170 may have a laminated structure of, for example, a metal film made of silver or the like and a film made of a transparent conductive material such as ITO or IZO, or may be formed of only a metal film.

  Further, as shown in FIGS. 4 and 5, the lead-out wiring 114 is formed on the moisture-proof film 101. An opening 103 is formed in a portion of the moisture-proof film 101 that overlaps both the lead-out wiring 114 and the conductive film 170. A part of the lead wiring 114 enters the opening 103 and is connected to the conductive film 170. In this way, the lead wiring 114 is connected to the conductive film 170.

  The light emitting device 10 may further include a sealing member. The sealing member is formed using, for example, glass, resin, or metal foil, and has the same polygon or circle as the substrate 100. Moreover, you may have the shape which provided the recessed part in the center of the sealing member. The edge of the sealing member is fixed to the substrate 100 with an adhesive. Thereby, the space surrounded by the sealing member and the substrate 100 is sealed. And the light emission part 140 is located in this sealed space. The sealing member may be a film formed by the ALD method or a film formed by the CVD method.

  The light emitting device 10 may further have a desiccant. The desiccant is disposed, for example, in the space sealed by the sealing member, for example, on the surface of the sealing member that faces the substrate 100.

  Next, a method for manufacturing the light emitting device 10 will be described. First, the substrate 100 before forming the moisture-proof film 101 is prepared. Next, a conductive film to be the conductive film 170 is formed over the first surface of the substrate 100. Next, a resist pattern is formed on the conductive film, and the conductive film is etched using the resist pattern. Thereby, the conductive film 170 is formed. Note that the conductive film 170 may be formed by a sputtering method using a mask or a coating method such as an inkjet method.

  Next, a moisture-proof film 101 is formed on the substrate 100. The moisture-proof film 101 is formed using, for example, a CVD method or a sputtering method. Next, a resist pattern is formed on the moisture-proof film 101, and the moisture-proof film 101 is removed using this resist pattern as a mask. Thereby, an opening 103 is formed in the moisture-proof film 101. The opening 103 is formed by dry etching such as RIE (Reactive Ion Etching) or wet etching. Alternatively, the moisture-proof film 101 may be patterned by a vacuum film forming method using a mask provided with an opening or a printing method using a coating type material.

  Next, a conductive film to be the lead wiring 114 is formed on the moisture-proof film 101 by using, for example, a sputtering method. Next, the conductive film is formed into a predetermined pattern using, for example, a photolithography method. Thereby, the lead wiring 114 and the first terminal 112 are formed. In this process, since a part of the lead wiring 114 is located in the opening 103, the lead wiring 114 is connected to the conductive film 170.

  Next, a conductive film to be the first electrode 110 is formed on the moisture-proof film 101 and the lead wiring 114 by using, for example, a sputtering method. Next, the conductive film is formed into a predetermined pattern using, for example, a photolithography method. Thereby, the first electrode 110 is formed. The first electrode 110 may be formed in a predetermined pattern by using a mask provided with an opening when forming a film by a sputtering method, or may be formed by a printing method using a coating type material. Good.

  Next, the organic layer 120 and the second electrode 130 are formed in this order. When the organic layer 120 includes a layer formed by an evaporation method, this layer is formed in a predetermined pattern using, for example, a mask. The second electrode 130 is also formed in a predetermined pattern using, for example, a mask. Thereafter, the light emitting unit 140 is sealed using a sealing member (not shown).

  In the above-described example, the lead-out wiring 114 is formed before the first electrode 110 is formed, but may be formed after the first electrode 110 is formed. In this case, a portion of the lead-out wiring 114 that overlaps the first electrode 110 is located on the first electrode 110.

  Further, the conductive film 170 may be a pattern in which the conductive film 170 and the lead wiring 114 in this embodiment are combined without providing the lead wiring 114. In this case, the conductive film 170 has a pattern along the three sides of the substrate 100. The moisture-proof film 101 is not formed on the line corresponding to the lead wiring 114 in the conductive film 170, and is directly connected to the first electrode 110.

  As described above, according to the present embodiment, the conductive film 170 is electrically connected to different portions of the first electrode 110. For this reason, by connecting the conductive film 170 to the first terminal 112, power can be supplied from the first terminal 112 to different portions of the first electrode 110. Therefore, it is possible to increase the power supply area of the first electrode 110 without increasing the number of the first terminals 112. The conductive film 170 is covered with an insulating moisture-proof film 101. For this reason, even if the conductive film 170 is provided, there is no possibility that the first electrode 110 and the second electrode 130 are short-circuited.

  In this embodiment, a conductive film 170 is provided between the moisture-proof film 101 and the substrate 100. Therefore, it is not necessary to newly provide an insulating film that covers the conductive film 170. Therefore, an increase in the manufacturing cost of the light emitting device 10 can be suppressed.

  The second terminal 132 and the first terminal 112 are arranged along the same side of the substrate 100. For this reason, labor when connecting a conductive member such as a lead terminal to the first terminal 112 and the second terminal 132 is reduced. In particular, in the present embodiment, the second terminal 132 is located between the two lead wires 114. Therefore, since the first terminal 112 and the second terminal 132 can be brought closer to each other, the above-described labor is further reduced. Further, even when it is necessary to connect to an FPC (Flexible Printed Circuits), it is possible to use an FPC with a small area, and an increase in manufacturing cost of the light emitting device 10 can be suppressed.

(Modification 1)
FIG. 6 is a plan view showing a configuration of the light emitting device 10 according to the first modification, and corresponds to FIG. 3 in the embodiment. FIG. 7 shows a cross-sectional view taken along the line AA of FIG. However, for the sake of explanation, FIG. 7 also shows the organic layer 120 and the second electrode 130.

  The light emitting device 10 according to this modification has the same configuration as that of the light emitting device 10 according to the embodiment, except that a plurality of auxiliary wirings 160 are provided. The auxiliary wiring 160 is formed under the first electrode 110. Specifically, the plurality of auxiliary wirings 160 extend in parallel between the two lead wirings 114. The auxiliary wiring 160 is formed in the same process as the extraction wiring 114 and is integrated with the extraction wiring 114. For this reason, the layer structure of the auxiliary wiring 160 is the same as the layer structure of the lead-out wiring 114.

  Note that, also in this modification, the lead-out wiring 114 and the auxiliary wiring 160 may be formed after the first electrode 110 is formed. In this case, a portion of the extraction wiring 114 that overlaps the first electrode 110 and the auxiliary wiring 160 are located on the first electrode 110.

  Also according to the present modification, similarly to the embodiment, it is possible to increase the power supply area of the first electrode 110 without increasing the number of the first terminals 112. Further, even if the conductive film 170 is provided, the possibility that the first electrode 110 and the second electrode 130 are short-circuited does not increase. Further, labor for connecting a conductive member such as a lead terminal to the first terminal 112 and the second terminal 132 is reduced. Furthermore, when connecting with FPC (Flexible Printed Circuits), it becomes possible to use FPC with a small area, and an increase in manufacturing cost of the light emitting device 10 can be suppressed.

  Further, since the auxiliary wiring 160 is provided on the first electrode 110, the apparent resistance of the first electrode 110 can be reduced. Therefore, the in-plane distribution of luminance of the light emitting device 10 can be reduced.

(Modification 2)
FIG. 8 is a plan view of the light emitting device 10 according to the second modification. 9 is a cross-sectional view taken along the line AA in FIG. 8, and FIG. 10 is a cross-sectional view taken along the line BB in FIG. The light emitting device 10 according to this modification has the same configuration as that of the light emitting device 10 according to the embodiment or modification 1 except for the following points.

  First, the substrate 100 is a glass substrate. Therefore, the moisture-proof film 101 is not formed between the first electrode 110 and the lead wiring 114 and the substrate 100.

  The edge of the first electrode 110 is covered with the second insulating film 150. The second insulating film 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes a light emitting region of the light emitting unit 140. By providing the second insulating film 150, it is possible to prevent the first electrode 110 and the second electrode 130 from being short-circuited at the edge of the first electrode 110.

  The conductive film 170 is covered with the first insulating film 152. The first insulating film 152 is made of, for example, a photosensitive resin material. Further, the first insulating film 152 is formed only in a region overlapping with the conductive film 170. The first insulating film 152 is formed after the conductive film 170 is formed and before the extraction wiring 114 is formed.

  Also according to the present modification, similarly to the embodiment, it is possible to increase the power supply area of the first electrode 110 without increasing the number of the first terminals 112. Further, even if the conductive film 170 is provided, the possibility that the first electrode 110 and the second electrode 130 are short-circuited does not increase. Further, labor for connecting a conductive member such as a lead terminal to the first terminal 112 and the second terminal 132 is reduced. Furthermore, when connecting with FPC (Flexible Printed Circuits), it becomes possible to use FPC with a small area, and an increase in manufacturing cost of the light emitting device 10 can be suppressed.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

DESCRIPTION OF SYMBOLS 10 Light-emitting device 100 Substrate 101 Moisture-proof film 103 Opening 110 1st electrode 112 1st terminal 120 Organic layer 130 2nd electrode 132 2nd terminal 140 Light-emitting part 150 2nd insulating film 152 1st insulating film 160 Auxiliary wiring 170 Conductive film

Claims (6)

A substrate,
A light-emitting unit formed on the first surface of the substrate and having a first electrode, a second electrode located on the first electrode, and an organic layer located between the first electrode and the second electrode;
A conductive film formed on the first surface of the substrate and electrically connected to a plurality of portions of the first electrode;
A first insulating film formed on the first surface of the substrate and covering the conductive film;
A first terminal formed on the first surface of the substrate and connected to the conductive film;
A second terminal formed on the first surface of the substrate and connected to the second electrode;
A light emitting device comprising: The light-emitting device according to claim 1.
The substrate is polygonal;
The conductive film is formed along one side of the polygon;
The light emitting device, wherein the first terminal and the second terminal are disposed at a position along the one side and are located on the first insulating film. The light-emitting device according to claim 2.
In the direction along the one side, the second terminal is located between a plurality of connection points at which the conductive film and the first electrode are electrically connected. In the light-emitting device as described in any one of Claims 1-3,
The substrate is a resin substrate;
The first insulating film is a moisture-proof film formed on the first surface of the substrate;
The light emitting device, wherein the first terminal is formed on the moisture-proof film and is electrically connected to the first electrode through an opening formed in the moisture-proof film. The light-emitting device according to claim 4.
The moisture-proof film is a light emitting device having an inorganic film. In the light-emitting device as described in any one of Claims 1-3,
The light emitting device wherein the first insulating film is a resin film.

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