JP2016099583A - Interference filter, optical module, electronic device, and manufacturing method of structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an interference filter capable of cutting off a substrate while preventing a liquid from coming into contact with a substrate.SOLUTION: The manufacturing method of an interference filter 12 includes the steps of: forming a first groove 54 in a first composition surface 53b enclosing a movable part 13b which is formed on a first substrate 53; forming a second groove 56 in a second composition surface 55b enclosing a reflection film formation part 14a which is formed on the second substrate 55; bonding the first composition surface 53b and the second composition surface 55b with the first groove 54 and the second groove 56 being faced to each other; cutting off the first substrate 53 along the first groove 54; and cutting off the second substrate 55 along the second groove 56.SELECTED DRAWING: Figure 11

Description

  The present invention relates to an interference filter, an optical module, an electronic device, and a method for manufacturing a structure.

  Conventionally, an optical filter that selectively passes light having a specific wavelength from incident light has been used. An optical filter that passes light of a specific wavelength is disclosed in Patent Document 1. According to this, the optical filter has a pair of substrates facing each other, and a reflective film is provided on each of the facing surfaces of these substrates. This optical filter can selectively extract light having a wavelength corresponding to the gap between a pair of opposing reflective films. The gap between the reflective films was set by the depth of the step provided on the substrate.

  The material of the substrate constituting the optical filter is a brittle material, and the substrate is thick enough to have rigidity. Therefore, after forming a large number of optical filters on the motherboard, they are cut and separated into optical filters. At this time, it was cut with a dicing blade while applying liquid to the mother board using a dicer type cutting machine.

JP 2005-309174 A

  When the liquid is applied to the motherboard and cut, a part of the liquid may adhere to the reflective film. At this time, the reflectance of the reflective film decreases. And the efficiency with which an optical filter separates light falls. Therefore, there has been a demand for a method of manufacturing a structure that can cut the mother board without causing liquid to touch the mother board.

  The present invention has been made to solve the above-described problems, and can be realized as the following forms or application examples.

[Application Example 1]
A structure manufacturing method according to this application example is a structure manufacturing method, in which a first groove is provided on a first surface surrounding a first structure provided on a first substrate, and the second substrate is provided with a first groove. Surrounding the installed second structure, installing a second groove on the second surface, joining the first surface and the second surface, cutting the first substrate along the first groove, The second substrate is cut along the second groove.

  According to this application example, the first structure is installed on the first substrate, and the second structure is installed on the second substrate. A first groove is provided on the first surface of the first substrate so as to surround the first structure. And the 2nd groove part is installed in the 2nd surface of the 2nd board | substrate surrounding the 2nd structure. Next, the first surface and the second surface are joined. As a result, the first substrate and the second substrate are combined into one substrate. Next, the first substrate is cut along the first groove portion, and the second substrate is cut along the second groove portion.

  Since the thickness of the first substrate is thin at a place where the first groove is present, the first substrate is easily cut. Therefore, the first substrate can be cut by a dry method. Similarly, since the thickness of the second substrate is thin at a place where the second groove is present, the second substrate is easily cut. Therefore, the second substrate can be cut by a dry method. As a result, since the board | substrate with which the 1st board | substrate and the 2nd board | substrate were united can be cut | disconnected by a dry type, a board | substrate can be cut | disconnected without making a liquid touch the 1st structure body and the 2nd structure body.

[Application Example 2]
In the structure manufacturing method according to the application example described above, the depth of the first groove portion is 50% to 95% of the thickness of the first substrate, and the depth of the second groove portion is equal to the thickness of the second substrate. It is characterized by being 50% to 95%.

  According to this application example, the depth of the first groove is 50% to 95% of the thickness of the first substrate. Further, the depth of the second groove is 50% to 95% of the thickness of the second substrate. At this time, the thickness of the 1st board | substrate in a 1st groove part is 50%-5% of the thickness of a place without a 1st groove part. Similarly, the thickness of the second substrate in the second groove portion is 50% to 5% of the thickness of the place where the second groove portion is not present. At this time, since the first substrate and the second substrate ensure rigidity, the first substrate and the second substrate can be joined. And a load required when cut | disconnecting a 1st board | substrate by a 1st groove part can be reduced. Similarly, the load required when cutting the second substrate at the second groove can be reduced. Therefore, the board | substrate which united and united the 1st board | substrate and the 2nd board | substrate can be cut | disconnected easily.

[Application Example 3]
In the structure manufacturing method according to the application example, when the first substrate is cut, a crack is formed along the first groove portion on the surface opposite to the first surface in the first substrate, The first substrate is cut along the line.

  According to this application example, a crack is formed along the first groove on the surface of the first substrate opposite to the first surface, and the first substrate is cut along the crack. The surface on the opposite side of the first surface is the opposite side of the surface on which the first groove is provided, and since there is no first groove, a crack can be easily formed. And the surface cut | disconnected when cut | disconnecting a 1st board | substrate along a crack can be formed accurately along the shape of a crack.

[Application Example 4]
In the method for manufacturing a structure according to the application example, when the first substrate is cut, the first substrate is irradiated with laser light along the first groove portion from the surface opposite to the first surface. The first substrate is cut by applying stress along the first groove.

  According to this application example, the first substrate is irradiated with laser light along the first groove portion on the surface opposite to the first surface, and the first substrate is cut along the first groove portion. The surface on the opposite side of the first surface is the opposite side of the surface on which the first groove is provided, and since there is no first groove, the laser beam can be easily irradiated. In the place where the laser beam is irradiated, the substrate is easily modified or melted by heat to be easily cut. And when applying a stress along a 1st groove part and cut | disconnecting a 1st board | substrate, a cut surface can be formed with a sufficient positional accuracy along a 1st groove part. Therefore, the shape of the first substrate can be formed with high positional accuracy.

[Application Example 5]
An interference filter according to this application example, wherein a first substrate on which a first reflective film is installed, and a second substrate on which a second reflective film facing the first reflective film is installed and bonded to the first substrate And an interval controller that controls an interval between the first reflection film and the second reflection film, and a side surface of the substrate where a bonding surface where the first substrate and the second substrate are bonded is located Is characterized in that a third groove is provided along the joint surface.

  According to this application example, the first substrate is provided with the first reflective film, and the second substrate is provided with the second reflective film. The first reflective film and the second reflective film are installed at locations facing each other. And the space | interval control part controls the space | interval of a 1st reflective film and a 2nd reflective film. Thereby, the interference filter can control the wavelength of light reflected between the first reflective film and the second reflective film.

  The first substrate and the second substrate are bonded at the bonding surface to form a single substrate. And the 3rd groove part is installed in the side surface of a board | substrate along the joining surface. Where the third groove is present, the thickness of the first substrate and the second substrate is reduced. Therefore, the first substrate and the second substrate can be cut by a dry method. As a result, since the board | substrate with which the 1st board | substrate and the 2nd board | substrate were united can be cut | disconnected by a dry type, a board | substrate can be cut | disconnected without making a liquid touch a 1st reflective film and a 2nd reflective film.

[Application Example 6]
An optical module according to this application example, including an interference filter, a housing having an internal space and housing the interference filter in the internal space, a lid connected to the housing and sealing the internal space, The interference filter includes: a first substrate on which a first reflective film is installed; a second substrate on which a second reflective film facing the first reflective film is installed and bonded to the first substrate; An interval control unit that controls an interval between the first reflection film and the second reflection film, and the side surface of the substrate where the bonding surface where the first substrate and the second substrate are bonded is located on the side surface of the substrate A third groove is provided along the joint surface.

  According to this application example, the optical module has an internal space sealed by the housing and the lid, and an interference filter is installed in the internal space. In the interference filter, the first reflective film and the second reflective film are installed at locations facing each other. And the space | interval control part controls the space | interval of a 1st reflective film and a 2nd reflective film. Thereby, the interference filter can control the wavelength of light reflected between the first reflective film and the second reflective film.

  In the interference filter, the first substrate and the second substrate are bonded to each other at the bonding surface, and a third groove portion is provided along the bonding surface on the side surface of the bonded substrate. Thereby, the thickness of the 1st substrate and the 2nd substrate is thin in the place with the 3rd slot. And since the board | substrate with which the 1st board | substrate and the 2nd board | substrate were united can be cut | disconnected by a dry type, a board | substrate can be cut | disconnected without making a liquid touch a 1st reflective film and a 2nd reflective film. Therefore, the optical module can be a module including an interference filter in which the substrate is cut without touching the liquid with the first reflective film and the second reflective film.

[Application Example 7]
An electronic apparatus according to this application example, comprising: an optical module; and a control unit that controls the optical module, wherein the optical module includes an interference filter, an internal space, and the interference filter in the internal space. A housing that houses the lid, and a lid that is connected to the housing and seals the internal space, wherein the interference filter is opposed to the first substrate on which the first reflective film is disposed, and the first reflective film A second substrate that is installed and bonded to the first substrate, and an interval control unit that controls an interval between the first reflection film and the second reflection film, and the first substrate; A third groove is provided along the bonding surface on the side surface of the substrate where the bonding surface where the second substrate is bonded is located.

  According to this application example, the electronic apparatus includes the optical module and a control unit that controls the optical module. The optical module has an internal space sealed by a housing and a lid, and an interference filter is installed in the internal space. In the interference filter, the first reflective film and the second reflective film are installed at locations facing each other. And the space | interval control part controls the space | interval of a 1st reflective film and a 2nd reflective film. Thereby, the interference filter can control the wavelength of light reflected between the first reflective film and the second reflective film.

  In the interference filter, the first substrate and the second substrate are bonded to each other at the bonding surface, and a third groove portion is provided along the bonding surface on the side surface of the bonded substrate. Thereby, the thickness of the 1st substrate and the 2nd substrate is thin in the place with the 3rd slot. And since the board | substrate with which the 1st board | substrate and the 2nd board | substrate were united can be cut | disconnected by a dry type, a board | substrate can be cut | disconnected without making a liquid touch a 1st reflective film and a 2nd reflective film. Accordingly, the optical module includes an interference filter in which the substrate is cut without touching the liquid with the first reflective film and the second reflective film. As a result, the electronic device can be a device including an interference filter in which the substrate is cut without touching the liquid with the first reflective film and the second reflective film.

(A) And (b) is a schematic perspective view which shows the structure of an optical module in connection with 1st Embodiment. (A) is a schematic plan view which shows the structure of an optical module, (b) and (c) is a schematic sectional side view which shows the structure of an optical module. (A) is a schematic sectional side view showing the structure of the interference filter, (b) is a schematic plan view showing the structure of the movable substrate, and (c) is a schematic plan view showing the structure of the fixed substrate. (A) And (c) is a principal part enlarged view which shows the structure of a groove part, (b) is a typical sectional side view which shows the structure of an interference filter. The electric control block diagram of a control part. The flowchart which shows the manufacturing method of an interference filter. The schematic diagram for demonstrating the manufacturing method of an interference filter. The schematic diagram for demonstrating the manufacturing method of an interference filter. The schematic diagram for demonstrating the manufacturing method of an interference filter. The schematic diagram for demonstrating the manufacturing method of an interference filter. The schematic diagram for demonstrating the manufacturing method of an interference filter. (A) And (b) is a schematic diagram for demonstrating the manufacturing method of an interference filter in connection with 2nd Embodiment. (A) And (b) is a principal part schematic sectional side view which shows the structure of an optical module in connection with 3rd Embodiment. FIG. 10 is a block diagram illustrating a configuration of a color measurement device according to a fourth embodiment. The schematic front view which shows the structure of the gas detection apparatus in connection with 5th Embodiment. The block diagram which shows the structure of the control system of a gas detection apparatus. The block diagram which shows the structure of the food analyzer concerning 6th Embodiment. The schematic perspective view which shows the structure of the spectroscopic camera in connection with 7th Embodiment.

  Hereinafter, embodiments will be described with reference to the drawings. In addition, each member in each drawing is illustrated with a different scale for each member in order to make the size recognizable on each drawing.

(First embodiment)
In the present embodiment, an optical module having a characteristic structure and a method for manufacturing the optical module will be described with reference to FIGS. First, the optical module will be described with reference to FIGS. FIG. 1A and FIG. 1B are schematic perspective views showing the structure of an optical module. FIG. 1A is a view from the first lid side of the optical module, and FIG. 1B is a view from the second lid side of the optical module. As shown in FIG. 1A, the optical module 1 has a substantially rectangular parallelepiped shape. The downward direction of the optical module 1 in the figure is the Z direction, and the two directions orthogonal to the Z direction are the X direction and the Y direction. The X direction, the Y direction, and the Z direction are directions along the sides of the optical module 1 and are orthogonal to each other.

  The optical module 1 includes a bottomed rectangular tube-shaped housing 2, and a circular first hole 2 a is formed on the −Z direction side of the housing 2. And the 1st cover body 3 is installed so that the 1st hole 2a may be plugged up. The housing 2 and the first lid 3 are joined by a first low melting point glass 4. In the housing 2, the first terminal 5, the second terminal 6, the third terminal 7, and the fourth terminal 8 are disposed on the surface on the −Z direction side. A second lid 9 serving as a lid is installed on the Z direction side of the housing 2, and the housing 2 and the second lid 9 are joined by a second low melting point glass 10.

  As shown in FIG. 1B, a rectangular second hole 2 b is formed in the Z direction of the housing 2. The second hole 2b is larger than the first hole 2a. And the 2nd cover body 9 is installed so that the 2nd hole 2b may be plugged up. An internal space 11 surrounded by the housing 2, the first lid 3, and the second lid 9 is a sealed space, and an interference filter 12 is installed in the internal space 11.

  FIG. 2A is a schematic plan view showing the structure of the optical module, and is a view of the optical module 1 viewed from the Z direction side. FIG. 2A is a diagram excluding the second lid body 9. FIG. 2B is a schematic side cross-sectional view showing the structure of the optical module, as viewed from the cross-sectional side along the line AA in FIG. FIG. 2C is a schematic side cross-sectional view showing the structure of the optical module, and is a view seen from a cross section taken along line BB in FIG. As shown in FIG. 2, an interference filter 12 is installed on the bottom surface 2c of the housing 2, and the interference filter 12 has a structure in which a movable substrate 13 as a first substrate and a fixed substrate 14 as a second substrate are joined and overlapped. It has become.

  The movable substrate 13 is provided with a first terminal 15, a second terminal 16, a third terminal 17 and a fourth terminal 18 at the end in the X direction. A first terminal 22, a second terminal 23, a third terminal 24, and a fourth terminal 25 are provided on the bottom surface 2c on the X direction side. The first terminal 15 is connected to the first terminal 22 by a gold wire 26, and the second terminal 16 is connected to the second terminal 23 and a gold wire 26. Further, the third terminal 17 is connected to the third terminal 24 by a gold wire 26, and the fourth terminal 18 is connected to the fourth terminal 25 and a gold wire 26.

  A through electrode 27 is installed in the housing 2, and the first terminal 22 is connected to the first terminal 5 by the through electrode 27. Similarly, the second terminal 23 is connected to the second terminal 6 by the through electrode 27, and the third terminal 24 is connected to the third terminal 7 by the through electrode 27. Further, the fourth terminal 25 is connected to the fourth terminal 8 by the through electrode 27. That is, the first terminal 15 is connected to the first terminal 5, and the second terminal 16 is connected to the second terminal 6. The third terminal 17 is connected to the third terminal 7, and the fourth terminal 18 is connected to the fourth terminal 8.

  The first terminal 5 to the fourth terminal 8 are connected to a voltage control unit 21 as a control unit. The voltage control unit 21 controls the voltages of the first terminal 15 to the fourth terminal 18 through the first terminal 5 to the fourth terminal 8, the through electrode 27, the first terminal 22 to the fourth terminal 25, and the gold wire 26.

  The 1st cover body 3 and the 2nd cover body 9 are formed with the glass which has a light transmittance. As materials for the movable substrate 13 and the fixed substrate 14, various glasses such as soda glass, crystalline glass, quartz glass, lead glass, potassium glass, borosilicate glass, and alkali-free glass, crystal, and the like can be used. Therefore, the light 28 can pass through the first lid 3, the interference filter 12, and the second lid 9. The material of the housing 2 is not particularly limited as long as it is a material having a linear expansion coefficient close to that of the first lid body 3 and the second lid body 9. In this embodiment, for example, ceramic is used as the material of the housing 2. .

  Fixed portions 29 are installed at the corners of the movable substrate 13 in the X direction and the Y direction, and the movable substrate 13 is fixed to the side wall portion 2d of the housing 2 at the side surfaces of the end portions by the fixed portions 29. The fixing portion 29 is made of, for example, an epoxy or silicone adhesive.

  The housing 2 and the interference filter 12 are fixed at one place by a fixing portion 29. On the −X direction side and the −Y direction side, the side surface of the interference filter 12 is in contact with the side wall 2 d on the inner side of the housing 2. Thereby, the position of the interference filter 12 with respect to the housing | casing 2 is being fixed. There may be a gap between the bottom surface 2c and the movable substrate 13, but it is preferable that there is no gap. Vibration can be easily attenuated by rubbing the movable substrate 13 and the bottom surface 2c.

  FIG. 3A is a schematic side sectional view showing the structure of the interference filter, as viewed from the Y direction. FIG. 3B is a schematic plan view showing the structure of the movable substrate, and FIG. 3C is a schematic plan view showing the structure of the fixed substrate. As shown in FIG. 3A, in the interference filter 12, the movable substrate 13 and the fixed substrate 14 are bonded by the bonding film 30. As the bonding film 30, for example, a film made of a plasma polymerization film mainly containing siloxane can be used. The joined movable substrate 13 and fixed substrate 14 are used as a joining substrate 31 as a substrate. A surface in contact with the bonding film 30 in the movable substrate 13 is defined as a first bonding surface 13f as a bonding surface, and a surface in contact with the bonding film 30 in the fixed substrate 14 is defined as a second bonding surface 14f as a bonding surface. An aperture 32 is provided on the surface of the fixed substrate 14 on the Z direction side.

  The aperture 32 is a film of a non-translucent member such as Cr. The aperture 32 has an annular shape, and the inner diameter of the ring is set to the effective diameter of the light 28 that causes interference by the interference filter 12. Thereby, the aperture 32 can limit the light 28 incident on the optical module 1 to a predetermined range.

  As shown in FIGS. 3A and 3B, the movable substrate 13 is provided with an annular ring groove 13a surrounding the center in a plan view viewed from the Z direction. A columnar portion surrounded by the annular groove 13a is defined as a movable portion 13b as a first structure. A portion located around the movable portion 13b and thinned by the annular groove 13a is defined as a holding portion 13c. Since the holding portion 13c is thin, it is easily deformed. Thereby, the movable part 13b can be easily moved in the Z direction. The movable substrate 13 is formed by processing a glass substrate having a thickness of, for example, 600 μm. On the side surface of the movable substrate 13, a side groove portion 13d as a third groove portion is provided over the entire circumference at a position where the first bonding surface 13f is located.

  In the movable portion 13b, a movable reflective film 33 and a movable electrode 34 as a first reflective film are installed on the surface on the + Z direction side. The movable reflective film 33 is a substantially circular film and is connected to the third terminal 17. Since the third terminal 17 is connected to the third terminal 7 of the housing 2, the movable reflective film 33 is connected to the third terminal 7.

  On the surface on the −X direction side of the bonding substrate 31, the side surface 14 e protruding from the side surface groove portion 14 d as the third groove portion in the fixed substrate 14 contacts the side wall portion 2 d of the housing 2. Then, on the surface on the + X direction side of the bonding substrate 31, the fixed portion 29 is installed between the side surface 13 e protruding from the side surface groove portion 13 d on the movable substrate 13 and the side surface groove portion 13 d and the side wall portion 2 d of the housing 2.

  The movable electrode 34 is located around the movable reflective film 33 and surrounds the movable reflective film 33 in an annular shape. The movable electrode 34 is divided on the + X direction side of the annular shape, and a part of the movable reflection film 33 is installed at the divided position. The movable electrode 34 is connected to the second terminal 16. Since the second terminal 16 is connected to the second terminal 6 of the housing 2, the movable electrode 34 is connected to the second terminal 6.

  As shown in FIGS. 3A and 3C, a reflective film is installed as a second structure projecting in the −Z direction in a cylindrical shape in the center of the fixed substrate 14 in a plan view as viewed from the −Z direction. The part 14a is installed. An electrode installation groove 14b that is recessed in an annular shape is provided around the reflective film installation portion 14a. Furthermore, the electrode installation groove 14 b extends to the + X direction side and extends to the outer periphery of the fixed substrate 14. Therefore, the interference filter 12 has an electrode installation groove 14b opened. The fixed substrate 14 is formed by processing a glass substrate having a thickness of, for example, 600 μm. Side groove portions 14d are provided over the entire circumference at locations where the second bonding surfaces 14f are located on the side surfaces of the fixed substrate 14.

  A fixed reflective film 35 as a second reflective film is installed on the surface on the −Z direction side in the reflective film installation part 14a. The fixed reflection film 35 is a substantially circular film and is connected to a reflection film terminal 36 located on the X direction side of the fixed reflection film 35. Around the fixed reflective film 35, a fixed electrode 37 is installed in the electrode installation groove 14b. The fixed electrode 37 is positioned around the fixed reflective film 35 and surrounds the fixed reflective film 35 in an annular shape. The fixed electrode 37 is divided at the annular −X direction side, and a part of the fixed reflection film 35 is installed at the divided position. The fixed electrode 37 is connected to a fixed electrode terminal 38.

  A bump electrode 41 is provided between the reflective film terminal 36 and the fourth terminal 18, and the reflective film terminal 36 is connected to the fourth terminal 18 by the bump electrode 41. Since the fourth terminal 18 is connected to the fourth terminal 8 of the housing 2, the fixed reflective film 35 is connected to the fourth terminal 8. Similarly, a bump electrode 41 is provided between the fixed electrode terminal 38 and the first terminal 15, and the fixed electrode terminal 38 is connected to the first terminal 15 by the bump electrode 41. Since the first terminal 15 is connected to the first terminal 5 of the housing 2, the fixed electrode 37 is connected to the first terminal 5.

As a material of the movable reflective film 33 and the fixed reflective film 35, for example, a metal film such as Ag or an alloy film such as an Ag alloy can be used. As the material of the movable reflective film 33 and the fixed reflective film 35, for example, a dielectric multilayer film in which the high refractive layer is TiO ₂ and the low refractive layer is SiO ₂ may be used. Further, a reflective film in which a metal film (or alloy film) is laminated on a dielectric multilayer film, a reflective film in which a dielectric multilayer film is laminated on a metal film (or alloy film), a single-layer refractive layer (TiO ₂ , SiO ₂₎ and a metal film (or alloy film) may be a reflective film or the like laminated.

  The movable electrode 34 and the fixed electrode 37 are disposed so that the annular portions face each other. Then, the voltage control unit 21 applies a predetermined step voltage between the second terminal 6 and the first terminal 5. Thereby, an electrostatic attractive force is generated between the movable electrode 34 and the fixed electrode 37. When the holding portion 13c is bent by the electrostatic attractive force, the movable portion 13b is displaced to the fixed substrate 14 side, and the gap 42 between the reflection films can be set to a desired dimension. The movable electrode 34, the fixed electrode 37, the holding unit 13c, and the like constitute an electrostatic actuator 43 as a distance control unit.

  The movable reflective film 33 and the fixed reflective film 35 reflect a part of the light 28 incident on the interference filter 12 and transmit a part thereof. Multiple reflection occurs between the movable reflective film 33 and the fixed reflective film 35, and the light 28 in phase is transmitted and travels in the direction in which the light 28 travels. When the voltage control unit 21 controls the gap 42 between the reflection films, the interference filter 12 can transmit the light 28 having a predetermined wavelength.

  The movable reflective film 33 and the fixed reflective film 35 are connected to the voltage control unit 21. The voltage control unit 21 sets the potential of the movable reflective film 33 to the same potential as that of the fixed reflective film 35. As a result, the voltage control unit 21 prevents electrostatic attraction between the movable reflective film 33 and the fixed reflective film 35. Therefore, the voltage control unit 21 can accurately control the gap 42 between the reflection films.

  Further, the voltage control unit 21 has a function of estimating the gap 42 between the reflection films by measuring the capacitance between the movable reflection film 33 and the fixed reflection film 35.

  FIG. 4A is an enlarged view of a main part showing the structure of the groove. As shown in FIG. 4A, the fixed substrate 14 is provided with a side groove 14d. The thickness of the fixed substrate 14 is a fixed substrate thickness 44. The length of the side groove 14 d in the thickness direction of the fixed substrate 14 is defined as a fixed plate groove depth 45. The fixed plate groove depth 45 is 50% to 95% of the fixed substrate thickness 44. Further, the fixed plate groove depth 45 is preferably 65% to 95% of the fixed substrate thickness 44. Furthermore, the fixed plate groove depth 45 is preferably 80% to 95% of the fixed substrate thickness 44.

  Similarly, the movable substrate 13 is provided with a side groove 13d. The thickness of the movable substrate 13 is defined as a movable substrate thickness 46. The length of the side groove 13 d in the thickness direction of the movable substrate 13 is defined as a movable plate groove depth 47. The movable plate groove depth 47 is 50% to 95% of the movable substrate thickness 46. Further, the movable plate groove depth 47 is preferably 65% to 95% of the movable substrate thickness 46. Furthermore, the movable plate groove depth 47 is preferably 80% to 95% of the movable substrate thickness 46.

  At this time, since the movable substrate 13 and the fixed substrate 14 have rigidity, the movable substrate 13 and the fixed substrate 14 can be joined. And a load required when the movable substrate 13 is cut by the side groove portion 13d can be reduced. Similarly, it is possible to reduce the load required when cutting the fixed substrate 14 with the side surface groove 14d. Therefore, it is possible to easily cut the bonded substrate 31 in which the movable substrate 13 and the fixed substrate 14 are bonded and combined.

  FIG. 4B is a schematic side sectional view showing the structure of the interference filter, as viewed from the X direction. As shown in FIG. 4B, side groove portions 14d are also provided on the side surface on the + Y direction side and the side surface on the −Y direction side of the fixed substrate 14. Side groove portions 13d are provided at positions where the first bonding surface 13f is located also on the side surface on the + Y direction side and the side surface on the −Y direction side of the movable substrate 13. On the side surface on the + Y direction side, the surface facing the + Y direction side of the side surface groove portion 13d and the surface facing the + Y direction side of the side surface groove portion 14d are arranged on substantially the same plane. Similarly, on the side surface on the −Y direction side, the surface facing the −Y direction side of the side surface groove portion 13d and the surface facing the −Y direction side of the side surface groove portion 14d are arranged on substantially the same plane.

  On the surface on the −Y direction side of the bonding substrate 31, the side surface 14 e protruding from the side surface groove portion 14 d in the fixed substrate 14 is in contact with the side wall portion 2 d of the housing 2. Further, the side surface 13 e protruding from the side surface groove portion 13 d in the movable substrate 13 contacts the side wall portion 2 d of the housing 2. Then, on the surface on the + Y direction side of the bonding substrate 31, the fixed portion 29 is installed between the side surface 13 e protruding from the side surface groove portion 13 d on the movable substrate 13 and the side surface groove portion 13 d and the side wall portion 2 d of the housing 2.

  FIG. 4C is an enlarged view of a main part showing the structure of the groove. As shown in FIG. 4C, the fixed plate groove depth 45 is 50% to 95% of the fixed substrate thickness 44 also on the side surface on the + Y direction side and the side surface on the −Y direction side of the fixed substrate 14. Further, the fixed plate groove depth 45 is preferably 65% to 95% of the fixed substrate thickness 44. Furthermore, the fixed plate groove depth 45 is preferably 80% to 95% of the fixed substrate thickness 44. Similarly, on the side surface on the + Y direction side and the side surface on the −Y direction side of the movable substrate 13, the movable plate groove depth 47 is 50% to 95% of the movable substrate thickness 46. Further, the movable plate groove depth 47 is preferably 65% to 95% of the movable substrate thickness 46. Furthermore, the movable plate groove depth 47 is preferably 80% to 95% of the movable substrate thickness 46.

  FIG. 5 is an electric control block diagram of the control unit. As shown in FIG. 5, the voltage control unit 21 is provided with two switches, a first switch 48 and a second switch 49, and a switch control unit 50 that controls the first switch 48 and the second switch 49. . Each switch is in the form of a two-circuit, two-contact switch. The first switch 48 includes a first movable piece 48a, a second movable piece 48b, a first contact 48c, a second contact 48d, a third contact 48e, and a fourth contact 48f.

  Both the first movable piece 48a and the second movable piece 48b are grounded. The first contact 48c is a contact that is isolated and not connected. The second contact 48 d is connected to the fixed reflective film 35 via the fourth terminal 8. The first movable piece 48a is electrically connected to one of the first contact 48c and the second contact 48d. Similarly, the third contact 48e is an isolated and not connected contact. The fourth contact 48 f is connected to the movable reflective film 33 via the third terminal 7. The second movable piece 48b is electrically connected to one of the third contact 48e and the fourth contact 48f.

  The first movable piece 48a and the second movable piece 48b are interlocked and controlled by the switch controller 50. When the switch control unit 50 connects the first movable piece 48a to the first contact 48c and connects the second movable piece 48b to the third contact 48e, the fixed reflective film 35 is connected to the first movable piece 48a in the first switch 48. The movable reflective film 33 is cut off from the second movable piece 48b. On the other hand, when the switch control unit 50 connects the first movable piece 48a to the second contact 48d and connects the second movable piece 48b to the fourth contact 48f, the first switch 48 includes the movable reflective film 33 and the fixed reflective film 35. Is grounded. Accordingly, the switch control unit 50 can control whether the movable reflective film 33 and the fixed reflective film 35 are short-circuited and grounded or opened.

  The second switch 49 includes a first movable piece 49a, a second movable piece 49b, a first contact 49c, a second contact 49d, a third contact 49e, and a fourth contact 49f. The first movable section 49a and the second movable section 49b are connected to the distance detection unit 51. The first contact 49 c is connected to the fixed reflective film 35 via the fourth terminal 8. The second contact 49d is an isolated and not connected contact. The first movable piece 49a is electrically connected to one of the first contact 49c and the second contact 49d. Similarly, the third contact 49 e is connected to the movable reflective film 33 via the third terminal 7. The fourth contact 49f is an isolated and not connected contact. The second movable piece 49b is electrically connected to one of the third contact 49e and the fourth contact 49f. The distance detection unit 51 has a function of detecting the distance between the movable reflective film 33 and the fixed reflective film 35 by measuring the electric capacity between the movable reflective film 33 and the fixed reflective film 35.

  The interference filter 12 includes external terminals such as a third terminal 7 and a fourth terminal 8. The distance detection unit 51 can detect the distance between the movable reflective film 33 and the fixed reflective film 35 using the external terminals of the third terminal 7 and the fourth terminal 8.

  The first movable piece 49a and the second movable piece 49b are interlocked and controlled by the switch control unit 50. When the switch control unit 50 connects the first movable piece 49a to the first contact 49c and connects the second movable piece 49b to the third contact 49e, the movable switch 33 and the fixed reflection film 35 are separated from each other by the second switch 49. Connected to the detector 51. On the other hand, when the switch control unit 50 connects the first movable piece 49a to the second contact 49d and connects the second movable piece 49b to the fourth contact 49f, the second switch 49 includes the movable reflective film 33 and the fixed reflective film 35. Is disconnected from the distance detector 51. Accordingly, the switch control unit 50 can control whether the movable reflection film 33 and the fixed reflection film 35 are connected to the distance detection unit 51 or grounded.

  When the voltage control unit 21 detects the inter-reflection film gap 42, first, the switch control unit 50 switches the first switch 48 and the second switch 49. In the first switch 48, the switch control unit 50 brings the first movable piece 48a into contact with the first contact 48c. Further, the switch control unit 50 brings the second movable piece 48b into contact with the third contact 48e. Further, in the second switch 49, the switch control unit 50 brings the first movable piece 49a into contact with the first contact 49c. Further, the switch control unit 50 brings the second movable piece 49b into contact with the third contact 49e. Thereby, the movable reflective film 33 and the fixed reflective film 35 are connected to the distance detection unit 51, respectively. Then, the distance detection unit 51 energizes the movable reflective film 33 and the fixed reflective film 35 to measure the electric capacity between the movable reflective film 33 and the fixed reflective film 35. Thereby, the distance detection part 51 detects the gap 42 between reflective films.

  When the distance detector 51 does not measure the inter-reflective film gap 42, in the first switch 48, the switch controller 50 brings the first movable piece 48a into contact with the second contact 48d. Further, the switch control unit 50 brings the second movable piece 48b into contact with the fourth contact 48f. In the second switch 49, the switch control unit 50 brings the first movable piece 49a into contact with the second contact 49d. Further, the switch control unit 50 brings the second movable piece 49b into contact with the fourth contact 49f. Thereby, the movable reflective film 33 and the fixed reflective film 35 are grounded and are electrically connected to each other.

  Molecules such as water molecules and oxygen molecules move between the movable reflective film 33 and the fixed reflective film 35, and the molecules collide with each other. At this time, static electricity may be generated in each molecule. When the molecules having static electricity come into contact with the movable reflective film 33 and the fixed reflective film 35, the movable reflective film 33 and the fixed reflective film 35 are charged. When a voltage difference is generated between the movable reflective film 33 and the fixed reflective film 35 due to static electricity, an electrostatic force is generated between the movable reflective film 33 and the fixed reflective film 35. As a result, the gap 42 between the reflection films varies. The wavelength of the light passing through the interference filter 12 varies as the gap 42 between the reflection films varies. Therefore, the switch control unit 50 grounds the movable reflective film 33 and the fixed reflective film 35 at predetermined time intervals. Thereby, since the static electricity of the movable reflective film 33 and the fixed reflective film 35 is removed, the gap 42 between the reflective films can be accurately controlled.

  The first switch 48 and the second switch 49 may use switching elements made of semiconductors such as transistors or electromagnetic switches. When the current is small, it is preferable to use a switching element made of a semiconductor because it is easy to manufacture and durable. In the present embodiment, for example, the first switch 48 and the second switch 49 use switching elements made of semiconductors.

  A voltage control unit 52 is installed in the voltage control unit 21, and the movable electrode 34 and the fixed electrode 37 are electrically connected to the voltage control unit 52. The voltage control unit 52 can control the gap 42 between the reflection films by controlling the voltage applied to the movable electrode 34 and the fixed electrode 37. The voltage controller 52 changes the gap 42 between the reflection films to a predetermined interval. Then, the light 28 enters the interference filter 12. The light 28 undergoes multiple reflections between the movable reflective film 33 and the fixed reflective film 35, and light having a wavelength corresponding to the dimension of the gap 42 between the reflective films passes through the interference filter 12. Therefore, the voltage controller 52 can control the wavelength of the light 28 that passes through the interference filter 12 by controlling the gap 42 between the reflection films.

  Next, a method for manufacturing the interference filter 12 will be described. FIG. 6 is a flowchart showing a manufacturing method of the interference filter, and FIGS. 7 to 11 are schematic diagrams for explaining the manufacturing method of the interference filter. In FIG. 6, step S1 corresponds to a movable substrate manufacturing process. In this step, the movable substrate 13 is manufactured by etching and forming a film on the substrate. Next, the process proceeds to step S2. Step S2 corresponds to a fixed substrate manufacturing process. This step is a step of manufacturing the fixed substrate 14 by etching and depositing the substrate. Next, the process proceeds to step S3. Step S3 corresponds to a substrate bonding step. This step is a step of bonding the movable substrate 13 and the fixed substrate 14 together. Next, the process proceeds to step S4. Step S4 corresponds to a cutting process. This step is a step of dividing the bonded bonding substrate 31 into a plurality of interference filters 12. The interference filter 12 is manufactured by the above process.

Next, the manufacturing method will be described in detail using FIGS. 7 to 11 in association with the steps shown in FIG.
7 and 8 are diagrams corresponding to the movable substrate manufacturing process in step S1. As shown in FIG. 7A, a first substrate 53 is prepared in step S1. The first substrate 53 is a plate obtained by grinding a disk-shaped quartz substrate to a thickness of 0.6 mm and polishing the surface. The first substrate 53 is a substrate on which the movable substrate 13 is based.

  Next, as shown in FIG. 7B, the annular groove 13 a and the holding portion 13 c are formed on the first surface 53 a as the surface opposite to the first surface of the first substrate 53. The annular groove 13a and the holding portion 13c can be formed by patterning and etching using a known lithography method. For example, it can be formed by patterning a layer made of a chromium layer and a gold layer to form a mask and etching using ultra-high purity buffered hydrofluoric acid. For example, in this embodiment, a quartz substrate having a thickness of 0.6 mm is etched to form the holding portion 13c with a thickness of about 30 μm. The movable part 13b is formed by forming the annular groove 13a.

  A surface of the first substrate 53 opposite to the first surface 53a is a first bonding surface 53b as a first surface. Next, as shown in FIG. 7C, the first groove portion 54 is installed in the first joint surface 53b. The 1st groove part 54 is a site | part used as the side surface groove part 13d. The first groove portion 54 constitutes a part of the side surface of the interference filter 12. The 1st groove part 54 is installed in several places along the straight line extended in two orthogonal directions. As a result, the first groove portion 54 is installed on the first bonding surface 53 b so as to surround the movable portion 13 b installed on the first substrate 53.

  The 1st groove part 54 can be installed using a dicer type cutting machine. The width of the first groove portion 54 is set according to the width of the dicing blade. And the 1st groove part 54 is installed leaving the thickness of 30 micrometers. The first groove portion 54 may be installed by using a wet or dry etching method.

  Next, as shown in FIG. 7D, the movable electrode 34 is installed on the first bonding surface 53b. First, a solid film in which ITO (Indium Tin Oxide), which is a material of the movable electrode 34, and Au are stacked is formed on the first substrate 53. The solid film is a film installed on the entire first substrate 53 with the same film thickness. Next, a solid film of Au film is formed on the solid ITO film. A film formation method such as a vapor deposition method or a sputtering method can be used to form the solid film. Next, the solid film is patterned to form the movable electrode 34. The movable electrode 34 can be formed by patterning a mask using a known lithography method and etching the solid film.

  Next, the first terminal 15 to the fourth terminal 18 and the bump electrode 41 are formed on the first substrate 53. The first terminal 15 to the fourth terminal 18 and the bump electrode 41 are composed of two layers of a metal underlayer and a metal upper layer. First, an underlying conductor solid film made of Cr, which is a material for the metal underlayer, is formed on the first substrate 53. The underlying conductor solid film is a solid film made of a Cr material. Next, an upper conductor solid film made of Au, which is a material of the metal upper layer, is formed so as to overlap the base conductor solid film. The upper conductor solid film is a solid film made of Au. Film formation methods such as vapor deposition and sputtering can be used to form the underlying conductor solid film and the upper conductor solid film.

  Next, the bump electrode 41 is formed by patterning the surface of the upper conductor solid film. Further, the remaining film of the upper conductor solid film is patterned to form a metal upper layer of the first terminal 15 to the fourth terminal 18. Further, the base conductor solid film is patterned to form metal base layers of the first terminal 15 to the fourth terminal 18. The first terminal 15 to the fourth terminal 18 and the bump electrode 41 can be formed by patterning a mask using a known lithography method and etching the conductive solid film. Although the etching solution of Au is not particularly limited, for example, an iodine-based etching solution can be used. The etching solution when Cr or NiCr is used as the material for the metal underlayer is not particularly limited, but for example, a cerium nitrate-based etching solution can be used. TiW may be used as the material for the metal underlayer. Although the etching solution at this time is not particularly limited, for example, a perchloric acid-based etching solution can be used.

  Next, as shown in FIG. 7E, the movable reflective film 33 is installed on the first bonding surface 53b. A protective film (not shown) is provided on the movable reflective film 33. First, a reflective solid film made of the material of the movable reflective film 33 is formed on the first substrate 53. The reflective solid film is a solid film made of, for example, AgSmCu. A protective solid film made of a protective film material is formed on the reflective solid film. The protective solid film is a solid film made of IGO (Indium-gallium oxide). Film formation methods such as vapor deposition and sputtering can be used to form the reflective solid film and the protective solid film. Next, the protective solid film is patterned to form a protective film. Subsequently, the reflective solid film is patterned to form the movable reflective film 33. At this time, the movable reflective film 33 and the protective film are formed in the same shape. The protective film and the movable reflective film 33 can be formed by patterning a mask using a known lithography method and etching the protective solid film and the reflective solid film. An oxalic acid-based etching solution can be used as the etching solution for the IGO film. As the etching solution for the reflective solid film, a mixed etching solution of phosphoric acid, nitric acid, and acetic acid can be used.

  FIG. 8 is a schematic plan view showing the structure of the first substrate 53. As shown in FIG. 8, the 1st groove part 54 is installed in the grid | lattice form in the 1st joint surface 53b surrounding the movable part 13b. Although the first substrate 53 has a disc shape, it may have a quadrangular shape. The movable part 13b can be arranged efficiently.

  9 and 10 are diagrams corresponding to the fixed substrate manufacturing process of step S2. As shown in FIG. 9A, a second substrate 55 is prepared in step S2. The second substrate 55 is a plate obtained by grinding a disk-shaped quartz substrate to a thickness of 0.6 mm and polishing the surface. The second substrate 55 is a substrate on which the fixed substrate 14 is based.

  Next, as illustrated in FIG. 9B, the reflective film installation portion 14 a and the electrode installation groove 14 b are formed on the second bonding surface 55 b as the second surface of the second substrate 55. The reflective film installation part 14a and the electrode installation groove 14b can be formed by patterning and etching using a known lithography method. For example, it can be formed by patterning a layer made of a chromium layer and a gold layer to form a mask and etching using ultra-high purity buffered hydrofluoric acid. For example, in this embodiment, a quartz substrate having a thickness of 0.6 mm is formed by etching. In the second substrate 55, a surface opposite to the second bonding surface 55b is defined as a second surface 55a as a surface opposite to the second surface.

  Next, as shown in FIG. 9C, the second groove portion 56 is installed in the second bonding surface 55 b of the second substrate 55. The 2nd groove part 56 is a site | part used as the side surface groove part 14d. The second groove portion 56 constitutes a part of the side surface of the interference filter 12. The second groove portions 56 are installed at a plurality of locations along straight lines extending in two orthogonal directions. As a result, the second groove portion 56 is installed on the second bonding surface 55b so as to surround the reflective film installation portion 14a installed on the second substrate 55.

  The 2nd groove part 56 can be installed using a dicer type cutting machine. The width of the second groove portion 56 is set according to the width of the dicing blade. And the 2nd groove part 56 is installed leaving the thickness of 30 micrometers. The second groove 56 may be installed using a wet or dry etching method.

  Next, as shown in FIG. 9D, the aperture 32 is installed on the second surface 55 a of the second substrate 55. In order to install the aperture 32, first, a solid film of the material of the aperture 32 is formed. A film formation method such as a vapor deposition method or a sputtering method can be used to form the solid film. Next, the aperture film 32 is formed by patterning the solid film. The aperture 32 can be formed by patterning a mask using a known lithography method and etching the solid film.

  Next, the fixed electrode 37, the reflective film terminal 36, and the fixed electrode terminal 38 are installed on the second bonding surface 55 b side of the second substrate 55. First, a solid film in which ITO and Au, which are materials of the fixed electrode 37, are stacked is formed on the second substrate 55. A film formation method such as a vapor deposition method or a sputtering method can be used to form the solid film. Next, the solid film is patterned to form the fixed electrode 37, the reflective film terminal 36, and the fixed electrode terminal 38. The fixed electrode 37, the reflective film terminal 36, and the fixed electrode terminal 38 can be formed by patterning a mask using a known lithography method and etching the solid film.

  Next, as shown in FIG. 9E, the fixed reflective film 35 is installed on the second bonding surface 55 b of the second substrate 55. A protective film (not shown) is provided on the fixed reflective film 35. First, a reflective solid film made of the material of the fixed reflective film 35 is formed on the second substrate 55. The reflective solid film is a solid film made of, for example, AgSmCu. A protective solid film made of a protective film material is formed on the reflective solid film. The protective solid film is a solid film made of IGO. Film formation methods such as vapor deposition and sputtering can be used to form the reflective solid film and the protective solid film. Next, the protective solid film is patterned to form a protective film. Subsequently, the fixed reflective film 35 is formed by patterning the reflective solid film. At this time, the fixed reflective film 35 and the protective film are formed in the same shape. The protective film and the fixed reflective film 35 can be formed by patterning a mask using a known lithography method and etching the reflective solid film. An oxalic acid-based etchant can be used as an etchant for the IGO film that is a protective solid film. A phosphoric acid, nitric acid, and acetic acid mixed etching solution can be used as an etching solution for the reflective solid film.

  FIG. 10 is a schematic plan view showing the structure of the second substrate 55. As shown in FIG. 10, the second groove portions 56 are installed in a lattice pattern on the second bonding surface 55b so as to surround the reflective film installation portion 14a. The second substrate 55 has a disc shape, but may have a quadrangular shape. The reflective film installation part 14a can be arranged efficiently.

  FIG. 11A is a diagram corresponding to the substrate bonding step of step S3. As shown in FIG. 11A, in step S3, the first bonding surface 53b of the first substrate 53 and the second bonding surface 55b of the second substrate 55 are bonded. A plasma polymerization film mainly composed of siloxane is formed on the first bonding surface 53b of the first substrate 53 and the second bonding surface 55b of the second substrate 55, respectively. Next, the first polymer 53 and the second substrate 55 are bonded by bonding the plasma polymerization film. The bonded plasma polymerization film becomes the bonding film 30. The bump electrode 41 connects the reflective film terminal 36 and the fourth terminal 18, and connects the fixed electrode terminal 38 and the first terminal 15. Then, the first substrate 53 and the second substrate 55 are joined to form a substrate 57 so that a part of the first groove part 54 and a part of the second groove part 56 face each other.

  FIG.11 (b) and FIG.11 (c) are figures corresponding to the cutting process of step S4. As shown in FIG. 11B, in step S4, the glass scribing wheel 58 is rolled on the first surface 53a along the first groove 54. The scribing wheel 58 is formed by sintering a super steel alloy or diamond. The scribing wheel 58 is in the form of a disk with side surfaces protruding. The operator rolls the scribing wheel 58 while pressing it against the first substrate 53 to form the crack 61 in the first substrate 53.

  Similarly, the glass scribing wheel 58 rolls on the second surface 55 a along the second groove portion 56. The operator can form the crack 61 on the second substrate 55 by rolling the scribe wheel 58 while pressing it against the second substrate 55. The crack 61 is formed along a locus along which the scribing wheel 58 rolls. Therefore, the crack 61 can be formed with high positional accuracy by rolling the scribing wheel 58 with high positional accuracy.

  Next, as shown in FIG. 11C, the crack 61 of the first substrate 53 is pressed by the pressing jig 62 in the thickness direction of the first substrate 53. The crack 61 advances from the first surface 53a to the first groove portion 54 by the pressing. Then, the first substrate 53 is cut along the crack 61 to become the movable substrate 13. Similarly, the crack 61 of the second substrate 55 is pressed by the pressing jig 62 in the thickness direction of the second substrate 55. The crack 61 advances from the second surface 55a to the second groove portion 56 by the pressing. The second substrate 55 is cut along the crack 61 to become the fixed substrate 14. And the 1st groove part 54 and the 2nd groove part 56 become the side surface groove part 13d and the side surface groove part 14d. The interference filter 12 is completed through the above steps.

  Furthermore, you may install the interference filter 12 in the inside of the housing | casing 2 continuously. The housing 2 is provided with the first lid 3, the first terminal 5 to the fourth terminal 8, the through electrode 27, the first terminal 22 to the fourth terminal 25, and the like. In addition, the manufacturing method of the housing | casing 2 can be manufactured using a well-known method, and description is abbreviate | omitted.

  Next, the material of the fixing portion 29 is disposed on the housing 2 or the interference filter 12, and the interference filter 12 is joined to the side wall portion 2 d of the housing 2 with the material of the fixing portion 29 interposed therebetween. At this time, the positional relationship between the housing 2 and the interference filter 12 is fixed using a jig. Subsequently, when the fixing portion 29 is a thermosetting adhesive, the fixing portion 29 is heated and dried, and further heated to solidify the fixing portion 29. After the fixing portion 29 is solidified, the jig is removed.

  Next, the first terminal 15 and the first terminal 22 are connected by a gold wire 26, and the second terminal 16 and the second terminal 23 are connected by a gold wire 26. Further, the third terminal 17 and the third terminal 24 are connected by a gold wire 26, and the fourth terminal 18 and the fourth terminal 25 are connected by a gold wire 26. The gold wire 26 is connected by using a wire bonding method.

  Next, the second lid 9 is joined to the housing 2. First, a low melting point glass paste is disposed on the surface of the housing 2 on which the second lid body 9 is to be installed. Next, the 2nd cover body 9 is arrange | positioned on the housing | casing 2, and it heats in the environment set to the vacuum atmosphere by the vacuum chamber apparatus etc. After the low melting glass paste is melted, it is gradually cooled. Thereby, the optical module 1 is sealed in a state where the internal space 11 is decompressed. The optical module 1 is completed through the above steps.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the first substrate 53 is cut along the first groove portion 54, and the second substrate 55 is cut along the second groove portion 56. Since the thickness of the first substrate 53 is small at a place where the first groove portion 54 is present, the first substrate 53 is easily cut. Therefore, even if the first substrate 53 is a hard substrate such as a quartz substrate, the first substrate 53 can be cut by a dry method. Similarly, since the thickness of the second substrate 55 is small at a place where the second groove portion 56 is present, the second substrate 55 is easily cut. Therefore, the second substrate 55 can be cut by a dry method. As a result, since the substrate 57 in which the first substrate 53 and the second substrate 55 are combined can be cut by a dry method, the substrate 57 is cut without touching the movable portion 13b and the reflective film installation portion 14a. be able to. Therefore, it is possible to prevent the reflectance of the movable reflective film 33 and the fixed reflective film 35 from being lowered by the liquid.

  (2) According to this embodiment, the depth of the first groove portion 54 is 50% to 95% of the thickness of the first substrate 53. Further, the depth of the second groove portion 56 is 50% to 95% of the thickness of the second substrate 55. At this time, the thickness of the first substrate 53 in the first groove portion 54 is 50% to 5% of the thickness where the first groove portion 54 is not present. Similarly, the thickness of the second substrate 55 in the second groove portion 56 is 50% to 5% of the thickness where the second groove portion 56 is not present. At this time, since the first substrate 53 and the second substrate 55 have sufficient rigidity, the first substrate 53 and the second substrate 55 can be joined. And a load required when the 1st board | substrate 53 is cut | disconnected by the 1st groove part 54 can be reduced. Similarly, the load required when the second substrate 55 is cut by the second groove portion 56 can be reduced. Therefore, the board | substrate 57 which joined and united the 1st board | substrate 53 and the 2nd board | substrate 55 can be cut | disconnected easily.

  (3) According to the present embodiment, the crack 61 is formed along the first groove portion 54 on the first surface 53 a of the first substrate 53, and the first substrate 53 is cut along the crack 61. The first surface 53a is the opposite side of the surface on which the first groove portion 54 is installed, and the crack 61 can be easily formed. A cut surface to be cut when the first substrate 53 is cut along the crack 61 can be formed with high accuracy along the shape of the crack 61.

  Similarly, in the second substrate 55, the crack 61 is formed along the second groove portion 56 on the second surface 55 a, and the second substrate 55 is cut along the crack 61. The second surface 55a is on the opposite side of the surface on which the second groove portion 56 is installed, and the crack 61 can be easily formed. And when the 2nd board | substrate 55 is cut | disconnected along the crack 61, a cut surface can be accurately formed along the shape of a crack. Therefore, the substrate 57 can be cut with high positional accuracy.

  (4) According to the present embodiment, the movable substrate 13 and the fixed substrate 14 are bonded by the bonding film 30 to form one bonded substrate 31. And the side surface groove part 13d and the side surface groove part 14d are installed in the side surface of the bonding substrate 31 along the 1st bonding surface 13f and the 2nd bonding surface 14f. The thickness of the first substrate 53 and the second substrate 55 is reduced where the side groove 13d and the side groove 14d are present. Therefore, the first substrate 53 and the second substrate 55 can be cut by a dry method. As a result, since the substrate 57 in which the first substrate 53 and the second substrate 55 are combined can be cut by a dry method, the substrate 57 is cut without touching the movable reflective film 33 and the fixed reflective film 35 with liquid. be able to.

  (5) According to this embodiment, since the substrate 57 can be cut by a dry method, the substrate can be cut without touching the movable reflective film 33 and the fixed reflective film 35 with liquid. Therefore, the optical module 1 can be a module including the interference filter 12 in which the substrate 57 is cut without causing the liquid to come into contact with the movable reflective film 33 and the fixed reflective film 35.

  (6) According to the present embodiment, the plate thickness of the place where the crack 61 is formed using the scribing wheel 58 is thin. Accordingly, the force for pressing the scribing wheel 58 against the first substrate 53 and the second substrate 55 can be reduced. Therefore, wear of the scribing wheel 58 is reduced and the life of the scribing wheel 58 can be extended.

  (7) According to this embodiment, the place where the crack 61 is formed using the scribing wheel 58 is the side surface of the movable substrate 13 or the fixed substrate 14. Then, by using the XY stage, the scribing wheel 58 can be moved with respect to the first substrate 53 or the second substrate 55 with high positional accuracy. Therefore, the planar shapes of the movable substrate 13 and the fixed substrate 14 can be manufactured with high accuracy.

  (8) According to this embodiment, the plate | board thickness of the place cut | disconnected by the cutting process of step S4 is formed thinly. Therefore, it is possible to prevent an impact on the holding portion 13c of the movable substrate 13 during cutting. As a result, the movable substrate 13 can be manufactured so that no residual stress remains in the holding portion 13c. Similarly, since it is possible to prevent the movable substrate 13 and the fixed substrate 14 from being damaged due to an impact at the time of cutting, the interference filter 12 can be manufactured with high quality.

(Second Embodiment)
Next, an embodiment of a method for manufacturing the interference filter 12 will be described with reference to schematic views for explaining the method for manufacturing the interference filter in FIGS. 12 (a) and 12 (b). This embodiment is different from the first embodiment in that the scribing method shown in FIG. 11B is different. Note that description of the same points as in the first embodiment is omitted.

  That is, in the present embodiment, as shown in FIG. 12A, the first substrate 53 and the second substrate 55 are scribed using the laser scribing device 63 in the cutting process of step S4. The laser scribing device 63 includes a laser light source 63 a that emits a laser beam 64. As the laser light source 63a, a YAG laser or a femtosecond laser can be used. The laser light 64 emitted from the laser light source 63a travels toward the substrate 57 while changing the traveling direction by the reflecting mirror 63b. Next, the laser beam 64 passes through the condenser lens 63 c and is condensed inside the first substrate 53 or the second substrate 55.

  In the place where the laser beam 64 is condensed, a modified portion 65 is formed by multiphoton absorption of quartz glass. The modified portion 65 has a brittle structure and is easily destroyed when stress is applied. In the first substrate 53, the laser scribing device 63 sequentially forms the reforming portion 65 from a location near the first groove portion 54 toward the first surface 53a. Then, the reforming part 65 is arranged along the first groove part 54.

  Similarly, in the second substrate 55, the laser scribing device 63 sequentially forms the modified portion 65 from a location near the second groove portion 56 toward the second surface 55a. Then, the reforming part 65 is arranged along the second groove part 56. Note that the first substrate 53 may be formed next to the second substrate 55 in the order of forming the modified portion 65. Next, as in the first embodiment, the first substrate 53 and the second substrate 55 are cut by applying stress to the modified portion 65 using the pressing jig 62.

  In the next embodiment, as shown in FIG. 12B, the first substrate 53 and the second substrate 55 are scribed using a laser scribing device 66 in the cutting process of step S4. The laser scribing device 66 includes a laser light source 66 a that emits a laser beam 64. A carbon dioxide laser can be used for the laser light source 66a. The laser light 64 emitted from the laser light source 66a travels toward the substrate 57 while changing the traveling direction by the reflecting mirror 66b. Next, the laser beam 64 passes through the condenser lens 66 c and is condensed inside the first substrate 53 or the second substrate 55.

  In the place where the laser beam 64 is collected, a melted portion 67 is formed in which the quartz glass is heated and melted. The laser scribing device 66 includes a nozzle 66d that injects a gas 68. In the melting part 67, a part of the melted material is blown off by the gas 68 and removed. Therefore, the melted portion 67 becomes a brittle structure and is easily destroyed when stress is applied. In the first substrate 53, the laser scribing device 66 sequentially forms the dissolving portion 67 from a location near the first surface 53 a toward the first groove portion 54. Then, the dissolving portion 67 is disposed along the first groove portion 54.

  Similarly, in the second substrate 55, the laser scribing device 66 sequentially forms the dissolving portion 67 from a location near the second surface 55a toward the second groove portion 56. Then, the melting portions 67 are arranged along the second groove portions 56. Note that the first substrate 53 may be formed next to the second substrate 55 in the order of forming the melting portion 67. Next, as in the first embodiment, stress is applied to the melting portion 67 using the pressing jig 62 to cut the first substrate 53 and the second substrate 55.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the first substrate 53 is irradiated with the laser beam 64 along the first groove portion 54 on the first surface 53 a, and the first substrate 53 is cut along the first groove portion 54. . The first surface 53a is the opposite side of the surface on which the first groove portion 54 is installed, and the laser beam 64 can be easily irradiated. In the place where the laser beam 64 is irradiated, the first substrate 53 is modified by heat and easily cut. When the first substrate 53 is cut by applying stress along the first groove portion 54, the cut surface can be formed along the first groove portion 54 with high positional accuracy.

  Similarly, also on the second substrate 55, the second surface 55 a is irradiated with the laser beam 64 along the second groove portion 56, and the second substrate 55 is cut along the second groove portion 56. The second surface 55a is the opposite side of the surface on which the second groove portion 56 is installed, and the laser beam 64 can be easily irradiated. In the place irradiated with the laser beam 64, the second substrate 55 is modified by heat and easily cut. Further, when the second substrate 55 is cut by applying stress along the second groove portion 56, the cut surface can be formed along the second groove portion 56 with high positional accuracy. Therefore, the shape of the substrate 57 can be formed with high positional accuracy.

(Third embodiment)
Next, an embodiment of the optical module will be described with reference to a schematic side sectional view of a main part showing the structure of the optical module shown in FIGS. 13 (a) and 13 (b). This embodiment is different from the first embodiment in that the side surface groove portion 13d and the side surface groove portion 14d of the interference filter 12 are in contact with the protruding portion of the housing. Note that description of the same points as in the first embodiment is omitted.

  That is, in the present embodiment, as shown in FIG. 13A, the optical module 71 includes a bottomed rectangular tube-shaped casing 72, and the second lid 9 is installed on the Z direction side of the casing 72. ing. A protruding surface 72e that protrudes toward the internal space 11 in the middle of the Z direction is provided on the side wall 72d facing the internal space 11 in the housing 72.

  On the −X direction side of the interference filter 12, the side surface groove portion 14 d of the fixed substrate 14 is in contact with the protruding surface 72 e of the housing 72. Then, on the + X direction side of the interference filter 12, the fixed portion 29 is installed between the side surface groove portion 13 d of the movable substrate 13 and the protruding surface 72 e of the housing 72.

  As shown in FIG. 13B, the side groove 14 d of the fixed substrate 14 contacts the protruding surface 72 e of the housing 72 on the surface on the −Y direction side of the interference filter 12. Further, the side surface groove 13 d in the movable substrate 13 contacts the protruding surface 72 e of the housing 72. Then, on the surface on the + Y direction side of the interference filter 12, the fixing portion 29 is installed between the side surface 13 e and the side surface groove portion 13 d of the movable substrate 13 and the protruding surface 72 e of the housing 72.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, the side groove 13d and the side groove 14d are used for positioning the housing 72 and the interference filter 12. The side groove 13d and the side groove 14d are grooves formed by a dicing blade in the movable substrate manufacturing process in step S1 and the fixed substrate manufacturing process in step S2. Therefore, the side groove 13d and the side groove 14d are manufactured with high positional accuracy. Therefore, the interference filter 12 can be installed with high positional accuracy with respect to the casing 72.

(Fourth embodiment)
Next, an embodiment of a color measuring device including the optical module 1 or the optical module 71 will be described with reference to FIG. In addition, description is abbreviate | omitted about the same point as said embodiment.

(Color measuring device)
FIG. 14 is a block diagram illustrating a configuration of the color measurement device. As shown in FIG. 14, a color measurement device 75 as an electronic apparatus includes a light source device 77 that emits light 28 onto a measurement object 76, a color measurement sensor 78, and a control device that controls the overall operation of the color measurement device 75. 81. The color measuring device 75 reflects the light 28 emitted from the light source device 77 by the measurement object 76. The colorimetric sensor 78 receives the reflected light to be inspected, and the colorimetric device 75 analyzes the chromaticity of the light to be inspected, that is, the color of the measurement object 76 based on the detection signal output from the colorimetric sensor 78. taking measurement.

  The light source device 77 includes a light source 82 and a plurality of lenses 83 (only one is shown in the drawing), and emits, for example, reference light (for example, white light) to the measurement object 76. The plurality of lenses 83 may include a collimator lens. In this case, the collimator lens converts the reference light emitted from the light source 82 into parallel light, and the light source device 77 emits light from the projection lens (not shown) toward the measurement object 76. In the present embodiment, the color measuring device 75 including the light source device 77 is illustrated. However, for example, when the measurement object 76 is a light emitting member such as a liquid crystal panel, the light source device 77 may not be provided.

  The colorimetric sensor 78 includes an optical filter 84 as an optical module, a detector 79 that receives light transmitted through the optical filter 84, and a wavelength control unit 80 as a control unit that controls the wavelength of light transmitted through the optical filter 84. Prepare. The optical module 1 or the optical module 71 is used for the optical filter 84. The wavelength control unit 80 has the function of the voltage control unit 21 in the first embodiment.

  The colorimetric sensor 78 includes an incident optical lens (not shown) at a location facing the optical filter 84. The incident optical lens guides the reflected light (inspection target light) reflected by the measurement object 76 into the colorimetric sensor 78. In the colorimetric sensor 78, light having a predetermined wavelength out of the inspection target light incident from the incident optical lens is dispersed by the optical filter 84, and the detected light is received by the detector 79.

  The control device 81 controls the overall operation of the color measuring device 75. As the control device 81, for example, a computer for exclusive use of color measurement can be used in addition to a general-purpose personal computer or a portable information terminal. The control device 81 includes a light source control unit 85, a colorimetric sensor control unit 86, a colorimetric processing unit 87, and the like. The light source control unit 85 is connected to the light source device 77 and, for example, outputs a predetermined control signal to the light source device 77 based on an operator's setting input to emit white light with a predetermined brightness. The colorimetric sensor control unit 86 is connected to the colorimetric sensor 78. For example, the colorimetric sensor control unit 86 sets the wavelength of light received by the colorimetric sensor 78 based on the setting input by the operator. Then, the colorimetric sensor control unit 86 outputs a control signal for detecting the amount of received light of the set wavelength to the colorimetric sensor 78. Thereby, the wavelength control unit 80 drives the optical filter 84 based on the control signal. The colorimetric processing unit 87 analyzes the chromaticity of the measurement object 76 from the amount of received light detected by the detector 79.

  The optical module 1 or the optical module 71 is used for the optical filter 84. In the optical filter 84, the substrate 57 is cut without touching the movable reflective film 33 and the fixed reflective film 35 with liquid. Therefore, the movable reflective film 33 and the fixed reflective film 35 are films having high reflectance, and the optical filter 84 can efficiently split the light 28. The color measuring device 75 can be an electronic device including an optical filter 84 that can efficiently split the wavelength of light to be measured.

(Fifth embodiment)
Next, an embodiment of a gas detection apparatus provided with either the optical module 1 or the optical module 71 will be described with reference to FIGS. 15 and 16. This gas detection device is used for, for example, a vehicle-mounted gas leak detector that detects a specific gas with high sensitivity, a photoacoustic noble gas detector for a breath test, and the like. In addition, description is abbreviate | omitted about the same point as said embodiment.

  FIG. 15 is a schematic front view showing the configuration of the gas detection device, and FIG. 16 is a block diagram showing the configuration of the control system of the gas detection device. As shown in FIG. 15, a gas detection device 90 as an electronic device includes a sensor chip 91, a suction port 92 a, a suction channel 92 b, a discharge channel 92 c, and a channel 92 including a discharge port 92 d and a main body 93. It has a configuration.

  The main body portion 93 includes a sensor portion cover 94, a discharge means 95, and a housing 96. The flow path 92 can be attached and detached by opening and closing the sensor unit cover 94. The main body 93 further includes a detection device including an optical unit 97, a filter 98, an optical filter 99 as an optical module, a light receiving element 100 (detection unit), and the like. The optical module 1 or the optical module 71 is used for the optical filter 99.

  Furthermore, the main body 93 includes a control unit 101 (processing unit) that processes the detected signal and controls the detection unit, a power supply unit 102 that supplies power, and the like. The optical unit 97 includes a light source 103 that emits light, a beam splitter 104, a lens 105, a lens 106, and a lens 107. The beam splitter 104 reflects light incident from the light source 103 to the sensor chip 91 side and transmits light incident from the sensor chip side to the light receiving element 100 side.

  As shown in FIG. 16, the gas detection device 90 includes an operation panel 108, a display unit 109, a connection unit 110 for interface with the outside, and a power supply unit 102. When the power supply unit 102 is a secondary battery, a connection unit 111 for charging may be provided. Further, the control unit 101 of the gas detection device 90 includes a signal processing unit 114 configured by a CPU or the like and a light source driver circuit 115 for controlling the light source 103. The control unit 101 further includes a wavelength control unit 116 as a control unit for controlling the optical filter 99 and a light receiving circuit 117 that receives a signal from the light receiving element 100. The wavelength controller 116 has the function of the voltage controller 21 in the first embodiment. The control unit 101 further includes a sensor chip detection circuit 119 that reads a code of the sensor chip 91 and receives a signal from a sensor chip detector 118 that detects the presence or absence of the sensor chip 91. Further, the control unit 101 includes a discharge driver circuit 120 for controlling the discharge unit 95 and the like.

  Next, the operation of the gas detection device 90 will be described. A sensor chip detector 118 is provided inside the sensor unit cover 94 above the main body unit 93. The sensor chip detector 118 detects the presence or absence of the sensor chip 91. When the signal processing unit 114 detects the detection signal from the sensor chip detector 118, the signal processing unit 114 determines that the sensor chip 91 is attached. Then, the signal processing unit 114 outputs a display signal for displaying on the display unit 109 that the detection operation can be performed.

  Then, the operator operates the operation panel 108, and an instruction signal for starting the detection process is output from the operation panel 108 to the signal processing unit 114. First, the signal processing unit 114 outputs a light source driving instruction signal to the light source driver circuit 115 to operate the light source 103. When the light source 103 is driven, a linearly polarized laser beam having a single wavelength is emitted from the light source 103. The light source 103 includes a temperature sensor and a light amount sensor, and sensor information is output to the signal processing unit 114. When the signal processing unit 114 determines that the light source 103 is stably operating based on the temperature and light quantity input from the light source 103, the signal processing unit 114 controls the discharge driver circuit 120 to operate the discharge unit 95. Thereby, the gas sample containing the target substance (gas molecule) to be detected is guided from the suction port 92a to the suction flow channel 92b, the sensor chip 91, the discharge flow channel 92c, and the discharge port 92d. The suction port 92a is provided with a dust removal filter 92e, which removes relatively large dust, some water vapor, and the like.

  The sensor chip 91 is an element in which a plurality of metal nanostructures are incorporated, and is a sensor using localized surface plasmon resonance. In such a sensor chip 91, an enhanced electric field is formed between the metal nanostructures by laser light. When gas molecules enter the enhanced electric field, Raman scattered light and Rayleigh scattered light including molecular vibration information are generated. These Rayleigh scattered light and Raman scattered light enter the filter 98 through the optical unit 97. Rayleigh scattered light is separated by the filter 98, and Raman scattered light is incident on the optical filter 99.

  Then, the signal processing unit 114 outputs a control signal to the wavelength control unit 116. As a result, the wavelength controller 116 drives the actuator of the optical filter 99 to cause the optical filter 99 to split the Raman scattered light corresponding to the gas molecules to be detected. When the dispersed light is received by the light receiving element 100, a received light signal corresponding to the amount of received light is output to the signal processing unit 114 via the light receiving circuit 117.

  The signal processing unit 114 compares the obtained spectrum data of the Raman scattered light corresponding to the gas molecules to be detected with the data stored in the ROM. Then, it is determined whether the gas molecule to be detected is the target gas molecule, and the substance is specified. Further, the signal processing unit 114 displays the result information on the display unit 109 and outputs the result information from the connection unit 110 to the outside.

  A gas detection device 90 that divides the Raman scattered light with the optical filter 99 and detects gas from the dispersed Raman scattered light is exemplified. The gas detection device 90 may be used as a gas detection device that detects gas-specific absorbance and identifies the gas type. In this case, an optical filter 99 is used for a gas sensor that allows gas to flow into the sensor and detects light absorbed by the gas in incident light. The gas detection device is an electronic device that analyzes and discriminates gas introduced into the sensor by the gas sensor. With this configuration, the gas detection device 90 can detect a gas component using the optical filter 99.

  The optical module 1 or the optical module 71 is used for the optical filter 99. In the optical filter 99, the substrate 57 is cut without touching the movable reflective film 33 and the fixed reflective film 35 with liquid. Therefore, the movable reflective film 33 and the fixed reflective film 35 are films having high reflectivity, and the optical filter 99 can efficiently split the light 28. The gas detection device 90 can be an electronic device including an optical filter 99 that can efficiently split the wavelength of light to be measured.

(Sixth embodiment)
Next, an embodiment of a food analysis apparatus including the optical module 1 or the optical module 71 will be described with reference to FIG. The optical module described above can be used in a substance component analyzer such as a non-invasive measuring apparatus for saccharides by near-infrared spectroscopy and a non-invasive measuring apparatus for information on food, living bodies, minerals, and the like. A food analyzer is one type of substance component analyzer. In addition, description is abbreviate | omitted about the same point as said embodiment.

  FIG. 17 is a block diagram showing the configuration of the food analyzer. As shown in FIG. 17, the food analyzer 123 as an electronic device includes a detector 124, a control unit 125, and a display unit 126. The detector 124 includes a light source 127 that emits light, an imaging lens 128 into which light from the measurement target is introduced, and an optical filter 129 as an optical module that splits the light introduced from the imaging lens 128. The optical module 129 is the optical module 1 or the optical module 71 described above.

  Furthermore, the detector 124 includes an imaging unit 130 (detection unit) that detects the dispersed light. In addition, the control unit 125 includes a light source control unit 131 that performs on / off control of the light source 127 and brightness control at the time of lighting, and a wavelength control unit 132 as a control unit that controls the optical filter 129. The wavelength control unit 132 has the function of the voltage control unit 21 in the first embodiment. Furthermore, the control unit 125 includes a detection control unit 133 that controls the imaging unit 130 to acquire a spectral image captured by the imaging unit 130, a signal processing unit 134, and a storage unit 135.

  When the food analyzer 123 is driven, the light source 127 is controlled by the light source control unit 131 so that the measurement object 136 is irradiated with light from the light source 127. Then, the light reflected by the measurement object 136 passes through the imaging lens 128 and enters the optical filter 129. The optical filter 129 is driven under the control of the wavelength controller 132. Thereby, the light of the target wavelength can be extracted from the optical filter 129 with high accuracy. Then, the extracted light is imaged by the imaging unit 130 configured by, for example, a CCD camera or the like. The captured light is accumulated in the storage unit 135 as a spectral image. Further, the signal processing unit 134 controls the wavelength control unit 132 to change the voltage value applied to the optical filter 129, and acquires a spectral image for each wavelength.

  Then, the signal processing unit 134 performs arithmetic processing on the data of each pixel in each image accumulated in the storage unit 135 and obtains a spectrum at each pixel. In addition, the storage unit 135 stores information related to food components with respect to the spectrum. Based on the information on food stored in the storage unit 135, the signal processing unit 134 analyzes the obtained spectrum data. And the signal processing part 134 calculates | requires the food component contained in the measuring object 136 and each food component content. Further, the signal processing unit 134 can also calculate food calories and freshness from the obtained food components and content. Furthermore, by analyzing the spectral distribution in the image, the signal processing unit 134 can also extract a portion of the food to be inspected where the freshness is reduced. Furthermore, the signal processing unit 134 can also detect foreign substances contained in food. Then, the signal processing unit 134 performs processing for causing the display unit 126 to display information such as the component and content of the food to be examined, the calories, and the freshness obtained as described above.

  The optical module 129 is the optical module 1 or the optical module 71 described above. In the optical filter 129, the substrate 57 is cut without touching the movable reflective film 33 and the fixed reflective film 35 with liquid. Therefore, the movable reflective film 33 and the fixed reflective film 35 are films having high reflectivity, and the optical filter 129 can efficiently split the light 28. The food analyzer 123 can be an electronic device including an optical filter 129 that can efficiently split the wavelength of light to be measured.

  In addition to the food analysis device 123, it can also be used as a non-invasive measurement device for other information as described above with a substantially similar configuration. For example, it can be used as a biological analyzer for analyzing biological components such as measurement and analysis of body fluid components such as blood. As such a biological analyzer, for example, the food analyzer 123 can be used as an apparatus for measuring body fluid components such as blood. In addition, if it is set as the apparatus which detects ethyl alcohol, the food analyzer 123 can be used for the drunk driving prevention apparatus which detects a driver | operator's drinking state. Further, it can also be used as an electronic endoscope system provided with such a biological analyzer. Furthermore, it can also be used as a mineral analyzer for performing component analysis of minerals.

  Furthermore, the electronic apparatus using the optical module 1 or the optical module 71 can be applied to the following devices. For example, it is possible to transmit data with light of each wavelength by changing the intensity of light of each wavelength over time. In this case, light of a specific wavelength is transmitted by the optical module 1 or the optical module 71 described above. Spectroscopy. By receiving light at the light receiving unit, data transmitted by light of a specific wavelength can be extracted, and light of each wavelength can be extracted by the electronic device that extracts data by the optical module 1 or the optical module 71 as described above. By processing this data, optical communication with a plurality of wavelengths can be performed.

(Seventh embodiment)
Next, an embodiment of a spectroscopic camera including the optical module 1 or the optical module 71 will be described with reference to FIG. The optical module 1 or the optical module 71 described above can be used in a spectroscopic camera, a spectroscopic analyzer, or the like that separates light and captures a spectroscopic image. An example of such a spectroscopic camera is an infrared camera incorporating the optical module 1 or the optical module 71 described above. In addition, description is abbreviate | omitted about the same point as said embodiment.

  FIG. 18 is a schematic perspective view showing the configuration of the spectroscopic camera. As shown in FIG. 18, a spectroscopic camera 139 as an electronic device includes a camera body 140, an imaging lens unit 141, and an imaging unit 142. The camera body 140 is a part that is gripped and operated by an operator.

  The imaging lens unit 141 is connected to the camera body 140 and guides incident image light to the imaging unit 142. The imaging lens unit 141 includes an objective lens 143, an imaging lens 144, and an optical filter 145 as an optical module provided between these lenses. The optical module 1 or the optical module 71 is used for the optical filter 145. Further, the camera body 140 is provided with a wavelength control unit 146 as a control unit that controls the wavelength of light that is split by the optical filter 145. The wavelength controller 146 has the function of the voltage controller 21 in the first embodiment.

  The imaging unit 142 includes a light receiving element, and images the image light guided by the imaging lens unit 141. In the spectroscopic camera 139, the optical filter 145 transmits light having a wavelength to be imaged, and the imaging unit 142 captures a spectral image of light having a desired wavelength.

  The optical module 1 or the optical module 71 is used for the optical filter 145. In the optical filter 145, the substrate 57 is cut without touching the movable reflective film 33 and the fixed reflective film 35 with liquid. Therefore, the movable reflective film 33 and the fixed reflective film 35 are films having high reflectivity, and the optical filter 145 can efficiently split the light 28. The spectroscopic camera 139 can be an electronic device including an optical filter 145 that can efficiently split the wavelength of light to be measured.

  Furthermore, an optical module in which the optical filter 145 is combined may be used as a bandpass filter. For example, it can also be used as an optical laser device that splits and transmits only narrow-band light centered on a predetermined wavelength out of light in a predetermined wavelength range emitted from the light emitting element. In addition, the optical module may be used as a biometric authentication device, and for example, can be applied to authentication devices such as blood vessels, fingerprints, retinas and irises using light in the near infrared region and visible region. Furthermore, an optical module can be used for the concentration detection apparatus. In this case, the infrared energy (infrared light) emitted from the substance by the optical module 1 or the optical module 71 is spectrally analyzed and the analyte concentration in the sample is measured.

  As described above, the optical module 1 or the optical module 71 can be applied to any device that splits predetermined light from incident light. The optical module 1 or the optical module 71 can efficiently split a plurality of wavelengths as described above. For this reason, the measurement of the spectrum of a some wavelength and the detection with respect to a some component can be implemented efficiently. Therefore, compared with the conventional apparatus which takes out a desired wavelength with a plurality of optical modules for splitting a single wavelength, it is possible to promote downsizing of an electronic device, and for example, it can be suitably used as a portable or in-vehicle optical device. it can. Also at this time, since the optical module 1 or the optical module 71 can efficiently split the light 28, an electronic device using these optical modules efficiently takes out and uses the light 28 having a plurality of wavelengths. be able to.

Note that the present embodiment is not limited to the above-described embodiment, and various changes and improvements can be added by those having ordinary knowledge in the art within the technical idea of the present invention. A modification will be described below.
(Modification 1)
In the said 1st Embodiment, the 1st groove part 54 and the 2nd groove part 56 were installed using the dicer type cutting machine. The first groove portion 54 may be installed by etching in the step of installing the annular groove 13a. And the 2nd groove part 56 may be installed by the etching at the process of installing the electrode installation groove | channel 14b. Since the number of processes is reduced, the interference filter 12 can be manufactured with high productivity.

(Modification 2)
In the first embodiment, the gap 42 between the reflection films is controlled by the electrostatic actuator 43. The reflection film gap 42 may use electromagnetic force in addition to electrostatic attraction. Since the attractive force and the repulsive force can be applied, the range for controlling the inter-reflective film gap 42 can be widened. The contents of Modification 1 and Modification 2 may be applied to the second embodiment.

(Modification 3)
In the first embodiment, the crack 61 is formed on both the first substrate 53 and the second substrate 55 and cut. A crack 61 may be formed on one of the first substrate 53 and the second substrate 55 and cut, and the other may be irradiated with a laser beam 64 to form a modified portion 65 or a dissolved portion 67 and cut. Also at this time, the first substrate 53 and the second substrate 55 can be cut by a dry method. And the freedom degree of a manufacturing apparatus can be raised.

  DESCRIPTION OF SYMBOLS 1 ... Optical module, 2 ... Housing | casing, 9 ... 2nd cover body as a cover part, 12 ... Interference filter, 13 ... Movable board as 1st board | substrate, 13b ... Movable part as 1st structure, 13d, 14d A side groove as a third groove, 13f: a first bonding surface as a bonding surface, 14: a fixed substrate as a second substrate, 14a: a reflective film installation portion as a second structure, 14f: a first as a bonding surface 2 bonding surfaces, 21... Voltage control unit as a control unit, 31... Bonding substrate as a substrate, 33... Movable reflection film as a first reflection film, 35... Fixed reflection film as a second reflection film, 43. Electrostatic actuator as a portion, 53... First substrate, 53 a... First surface as a surface opposite to the first surface, 53 b... First joint surface as a first surface, 54. 2 substrates, 55a ... as the surface opposite to the second surface Surface: 55b ... Second joint surface as second surface, 56 ... Second groove, 61 ... Crack, 64 ... Laser light, 75 ... Color measuring device as electronic device, 90 ... Gas detection device as electronic device, 123 ... Food analyzer as electronic equipment, 139 ... Spectroscopic camera as electronic equipment.

Claims (7)

A structure manufacturing method comprising:
Surrounding the first structure installed on the first substrate, a first groove is installed on the first surface,
Surrounding the second structure installed on the second substrate, a second groove is installed on the second surface,
Bonding the first surface and the second surface;
Cutting the first substrate along the first groove,
A method for manufacturing a structure, comprising cutting the second substrate along the second groove. It is a manufacturing method of the structure according to claim 1,
The depth of the first groove is 50% to 95% of the thickness of the first substrate,
The depth of the second groove is 50% to 95% of the thickness of the second substrate. It is a manufacturing method of the structure according to claim 1 or 2,
When cutting the first substrate, forming a crack along the first groove on the surface of the first substrate opposite to the first surface, and cutting the first substrate along the crack. A method for producing a characteristic structure. It is a manufacturing method of the structure according to claim 1 or 2,
When cutting the first substrate, the first substrate is irradiated with laser light from the surface opposite to the first surface along the first groove, and stress is applied along the first groove. A method for manufacturing a structure, comprising cutting the first substrate. A first substrate provided with a first reflective film;
A second substrate in which a second reflective film facing the first reflective film is installed and bonded to the first substrate;
An interval controller that controls an interval between the first reflective film and the second reflective film;
An interference filter, wherein a third groove is provided along a side surface of a substrate where a bonding surface where the first substrate and the second substrate are bonded is located. An interference filter,
A housing having an internal space and housing the interference filter in the internal space;
A lid that is connected to the housing and seals the internal space,
The interference filter is
A first substrate provided with a first reflective film;
A second substrate in which a second reflective film facing the first reflective film is installed and bonded to the first substrate;
An interval controller that controls an interval between the first reflective film and the second reflective film;
An optical module, wherein a third groove portion is provided along a side surface of the substrate where a bonding surface where the first substrate and the second substrate are bonded is located. An optical module;
A control unit for controlling the optical module,
The optical module includes an interference filter;
A housing having an internal space and housing the interference filter in the internal space;
A lid that is connected to the housing and seals the internal space,
The interference filter is
A first substrate provided with a first reflective film;
A second substrate in which a second reflective film facing the first reflective film is installed and bonded to the first substrate;
An interval controller that controls an interval between the first reflective film and the second reflective film;
An electronic apparatus, wherein a third groove is provided along a side surface of a substrate where a bonding surface where the first substrate and the second substrate are bonded is located.

Images