JP2016092878A - Electric power conversion system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion system which enables simplification of a structure to reduce costs and achieves improvement of the cooling efficiency.SOLUTION: An electric power conversion system includes: power modules PM1 to 3, each of which has power semiconductor devices IGBT1 to 4; a cooler (a water-cooling apparatus 11) disposed on one surface side of each power module and configured to cool the power modules; and air cooling means 20 having a sealing passage R circulating on the one surface side of the cooler and the side of each power module which is opposite to the side on which the cooler is disposed, the air cooling means circulating air in the sealing passage by blower means (a blower 21).SELECTED DRAWING: Figure 3

Description

  The present invention relates to a power conversion device.

  The power conversion device performs a switching operation of a power semiconductor module (power module) composed of an IGBT (Insulated Gate Bipolar Transistor) built in the power conversion device, and between DC power and AC power, It is a device that performs power conversion between low-voltage DC power and high-voltage DC power. Such power conversion devices are widely used in hybrid vehicles, electric vehicles, and the like.

  By the way, when the power converter is operated, the power module generates heat and the conversion efficiency is lowered, or the module itself is damaged by heat. For this reason, it is necessary to cool the power module so as to keep it at a heat resistant temperature or lower.

  Various techniques relating to cooling of the power converter have been proposed (for example, Patent Document 1).

  Patent Document 1 discloses a technique for cooling the bottom surface (surface on which a semiconductor chip is mounted) of a power module by a water cooling method and cooling the top surface of the power module by an air cooling method.

JP 2009-27901 A

  By the way, in the technique according to Patent Document 1, outside air is introduced as air used for air cooling.

  For this reason, for example, when the power conversion device is mounted on the vehicle, it is necessary to draw outside air to the vicinity of the power module through a ventilation path or the like, and there is a problem that the structure becomes complicated and the manufacturing cost increases.

  In addition, since the outside air contains dust, moisture, and the like, if the outside air is directly introduced into the circuit board of the power module, there is a risk of causing problems such as short circuit or corrosion between elements such as power semiconductors. Therefore, in the case of outside air, there is a problem that cooling can be performed only from the outside of the case housing the power module, and cooling efficiency is low.

  This invention is made | formed in view of the said subject, and it aims at providing the power converter device which can simplify a structure, reduce cost, and can improve cooling efficiency.

  In order to achieve the above object, a first aspect of a power conversion device according to the present invention includes a power module having a power semiconductor element, a cooler that is disposed on one side of the power module and cools the power module, The gist includes an air-cooling means that has a sealed passage that circulates on one side of the cooler and the opposite side of the power module where the cooler is disposed, and that circulates air in the sealed passage by a blowing means. To do.

  According to a second aspect of the present invention, in the power conversion device according to the first aspect, the power semiconductor element includes a beam lead that is electrically connected to an electric element, and the beam lead is supplied from the blowing unit. The gist of the present invention is to have an exposed portion that is air-cooled in contact with the air flow formed by the air flow.

  The third aspect of the present invention is summarized in that the power conversion device according to the first aspect or the second aspect includes a protective layer for protecting the power semiconductor element.

  A fourth aspect of the present invention is summarized in that, in the power conversion device according to the third aspect, the protective layer is made of a silicon-based gel.

  According to a fifth aspect of the present invention, in the power conversion device according to the second to fourth aspects, a plurality of the beam leads are provided, and a partition wall is formed between the beam leads. The gist.

  According to a sixth aspect of the present invention, in the power conversion device according to the second to fifth aspects, the beam lead includes a flow path for circulating the air fed by the blowing means. Is the gist.

  According to the power converter concerning the 1st mode, since it can cool from both the surface side and back side of a power module, it can improve cooling efficiency. Further, since the air in the apparatus cooled by the air cooling means is circulated and used, it is not necessary to guide the outside air for air cooling to the power module, and the entire apparatus can be simplified and miniaturized to reduce the cost. . In addition, since outside air is not introduced, it can be cooled using clean air that does not contain dust, etc., and there is no risk of short circuits or corrosion between elements. Can be improved.

  According to the power conversion device according to the second aspect, the power semiconductor element can be efficiently cooled because it includes the beam lead having the exposed portion that is air-cooled in contact with the airflow of the blowing unit. .

  According to the power conversion device according to the third aspect, the protective layer for protecting the power semiconductor element is included, so that the influence of oxidation of the power semiconductor element and terminals due to air is suppressed while ensuring the cooling performance. can do.

  According to the power conversion device of the fourth aspect, since the protective layer is made of a silicon-based gel, the stress applied to the wiring or the like can be reduced.

  According to the power conversion device of the fifth aspect, since the partition wall is formed between the beam leads, it is possible to prevent the occurrence of a short circuit between the beam leads.

  According to the power conversion device of the sixth aspect, the beam lead includes the flow path for circulating the air introduced by the air blowing means, so that the cooling efficiency can be further improved.

It is a perspective view which shows the internal structure of the upper surface side of the power converter device which concerns on 1st Embodiment. It is a perspective view which shows the structure of the lower surface side of the power converter device which concerns on 1st Embodiment. It is a side sectional view of the power converter concerning a 1st embodiment. It is a circuit diagram of the IGBT apparatus applied to the power converter device which concerns on 1st Embodiment. It is a perspective view which shows a part of internal structure by the side of the upper surface of the power converter device which concerns on 2nd Embodiment. It is explanatory drawing which shows the structural example of the principal part of the power converter device which concerns on 2nd Embodiment. It is an end view which shows a part of internal structure by the side of the upper surface of the power converter device which concerns on 3rd Embodiment. It is a perspective view which shows the internal structure of the upper surface side of the power converter device which concerns on 4th Embodiment. It is an AA line end elevation of the power converter concerning a 4th embodiment.

  Hereinafter, an embodiment as an example of the present invention will be described in detail with reference to the drawings. Here, in the accompanying drawings, the same reference numerals are given to the same members, and duplicate descriptions are omitted. In addition, since description here is the best form by which this invention is implemented, this invention is not limited to the said form.

[Power Conversion Device According to First Embodiment]
A configuration example of the power conversion device 1A according to the first embodiment will be described with reference to FIGS.

  1 is a perspective view showing the internal configuration of the upper surface side of the power conversion device 1A according to the first embodiment, FIG. 2 is a perspective view showing the configuration of the lower surface side of the power conversion device 1A, and FIG. FIG. 4 is a circuit diagram of an IGBT device (power module) PM1 (PM2, PM3) applied to the power conversion device 1A.

  Power conversion device 1A according to the present embodiment is used as, for example, an inverter device for driving a vehicle mounted on an electric vehicle. That is, power conversion necessary for driving the three-phase AC motor is performed by the power modules PM1 to PM3. More specifically, DC power supplied from a battery constituting the in-vehicle power source is converted into predetermined AC power, and the obtained AC power is supplied to a three-phase AC motor or the like.

  As shown in FIGS. 1 to 3, a power conversion device 1 </ b> A according to the present embodiment includes power modules PM <b> 1 to PM <b> 3 having a power semiconductor element 10 composed of an IGBT (Insulated Gate Bipolar Transistor). And a water cooling device 11 as a cooler that is disposed on the back surface side, which is one surface side of the power modules PM1 to PM3, and in contact with the power modules PM1 to PM3 in the water cooling device 11 In a sealed passage R (see FIG. 3) that is provided in a surface opposite to the surface (in this embodiment, the back surface side) and is formed in a device sealed by a resin casing C (see FIG. 3). Air cooling means 20 for circulating air with a blower 21 as air blowing means is provided.

  The blower 21 includes a blower circuit connector 30 that is connected to a blower circuit that performs drive control (see FIG. 2).

  More specifically, the water-cooling device 11 is formed of a metal such as aluminum and has a water-cooling jacket 12 having a coolant channel made of cooling water or the like inside, and a supply for supplying coolant such as cooling water to the water-cooling jacket 12 A port 13 and a discharge port 14 that discharges the refrigerant that has flowed in the longitudinal direction (arrow W1 and arrow W2 directions) through the flow path inside the water cooling jacket 12 are provided. The cross-sectional shape of the water-cooled jacket 12 is, for example, a shape in which a large number of refrigerant circulation pores 12a having a strip-shaped cross section as shown in FIG.

  Further, a part of the air cooling means 20 is formed of a metal such as aluminum and is configured as a heat sink having an air flow path therein. The cross-sectional shape of the heat sink that constitutes a part of the air-cooling means 20 is, for example, a shape in which a large number of air circulation pores 20a having a rectangular cross-section as shown in FIG.

  In FIG. 1, substrates 102 </ b> A to 102 </ b> C on which the power modules PM <b> 1 to PM <b> 3 are mounted are placed on the upper surface side of the water cooling jacket 12 (that is, the back surface side of the power modules PM <b> 1 to PM <b> 3).

  The power modules PM1 to PM3 mounted on the substrates 102A to 102C have a circuit configuration as shown in FIG. 4, for example.

  As shown in FIG. 4, the IGBT device as the power module PM1 (PM2, PM3) is connected in parallel via a pair of IGBT1 and IGBT2 connected in parallel via nodes n1 and n2, and via nodes n1 to n4. A pair of flywheel diodes FWD1 and FWD2 are provided.

  The IGBT device further includes a pair of IGBT3 and IGBT4 connected in parallel via nodes n6 and n8, and a pair of flywheel diodes FWD3 and FWD4 connected in parallel via nodes n6 to n9.

  The emitter terminals of IGBT1 and IGBT2 and the collector terminals of IGBT3 and IGBT4 are connected via a node n5 and connected to an output terminal O.

  The collector terminals of the IGBT1 and IGBT2 are connected to the plus terminal P through the node n1. The emitter terminals of the IGBT3 and IGBT4 are connected to the minus terminal N via the node n8.

  As shown in FIG. 1, an IGBT as a power semiconductor element includes beam leads 201A and 201B that are electrically connected to an electrical element.

  Each of the beam leads 201A and 201B is formed by bending a long metal plate made of copper, aluminum or the like. More specifically, chip-side joints and circuit-side joints are provided at both ends in the longitudinal direction of the beam leads 201A and 201B, and these chip-side joints and circuit-side joints are connected to each other via a rising part and a crossing part H. Connected together. The chip-side bonding portion is bonded to a semiconductor chip constituting the IGBT, and the circuit-side bonding portion is bonded to a circuit layer formed on the substrate via solder.

  At least a part of each of the beam leads 201A and 201B (for example, the crossing portion H) functions as a heat sink that is exposed to the airflows 500a to 500d formed by the blower 21 and is air-cooled.

  Here, with reference to FIGS. 1 to 3, the flow of air (air blowing) in power conversion device 1 </ b> A according to the present embodiment will be described.

  First, air blown from the blower 21 is sent to the surface on which the power modules PM1 to PM3 are provided via the air duct 25 (see arrow 500a). The blower pipe 25 is connected to the blow-out portion of the blower 21 via a rubber bellows member 27.

  Next, the air supplied from the blowout part 25a of the blower pipe 25 to the surface where the power modules PM1 to PM3 are provided flows as airflows 500b and 500c toward the exhaust part 26a of the exhaust pipe 26 having a negative pressure. To do.

  As a result, the transition portions H of the beam leads 201A and 201B exposed to the airflows 500b and 500c are air-cooled, and as a result, cooling of the IGBT1 to IGBT4 mounted on the power modules PM1 to PM3 is promoted.

  The air flow 500d that has flowed into the exhaust portion 26a is recirculated to the air cooling means 20 side through the exhaust pipe 26 and the like, and has a strip-shaped fine hole (not shown) formed in the air cooling means 20 in the longitudinal direction. ) To the blower 21 as an air flow 500e.

  Accordingly, the blower 21 → the blower pipe 25 (air flow 500a) → the surface provided with the power modules PM1 to PM3 (air flow 500b, 500c) → the exhaust pipe 26 (air flow 500d) → the air cooling means 20 (air flow 500e). → An air circulation cycle called the blower 21 is formed.

  By this air circulation cycle, an air cooling system is realized in which the air cooled by the air cooling means 20 cools the power modules PM1 to PM3, and the air warmed by heat exchange is cooled again by the air cooling means 20. In combination with the liquid cooling system, the cooling efficiency of the IGBT1 to IGBT4 is further improved.

  In addition, in the present embodiment, since air is circulated through the sealed passage R formed in the casing C, it is not necessary to guide the outside air for cooling to the power modules PM1 to PM3, and the entire apparatus is simplified and reduced in size. And cost can be reduced.

  In addition, since outside air is not introduced, it can be cooled using clean air that does not contain dust or moisture, and there is no risk of short circuit or corrosion between IGBT1 and IGBT4, so the surface of the power module can be cooled directly. Thus, the cooling efficiency can be further improved.

  In addition, you may make it provide the radiation fins 302 and 303 as shown in the below-mentioned FIG. 6 on the surface of beam lead 201A, 201B. Thereby, cooling efficiency can be improved more.

  Further, in the present embodiment, the case where the water cooling device 11 and the air cooling means 20 are arranged on the back side of the power modules PM1 to PM3 has been described, but the present invention is not limited to this, and the water cooling device 11 and the air cooling means 20 and the like are arranged. You may make it arrange | position on the surface side of power module PM1-PM3.

(Protective layer)
In the power conversion device 1A according to the first embodiment, a protective layer may be provided to protect the IGBTs 1 to 4 as power semiconductor elements. The protective layer can be made of a resin or silicon gel.

  More specifically, in FIG. 1, a post-treatment such as heating is performed by flowing a resin or silicon-based gel with a predetermined thickness on the substrates 102A to 102C on which the power modules PM1 to PM3 are mounted. Then, a protective layer is formed.

  Note that the thickness of the protective layer is adjusted so that at least a part of each of the beam leads 201A and 201B (for example, the crossover portion H) is exposed so as not to impair the cooling effect by the air flow.

  In the case of providing this protective layer, it is possible to suppress the effects of oxidation of the IGBTs 1 to 4 and the terminals due to air while ensuring the cooling performance.

  In particular, when the protective layer is made of a silicon-based gel, the stress applied to the wiring or the like can be reduced.

[Power Conversion Device According to Second Embodiment]
Next, with reference to FIG. 5 and FIG. 6, the power converter device 1B which concerns on 2nd Embodiment is demonstrated.

  FIG. 5 is a perspective view illustrating a part of the internal configuration on the upper surface side of the power conversion device 1B according to the second embodiment, and FIG. 6 is an explanatory diagram illustrating a configuration example of a main part of the power conversion device 1B. .

  The basic configuration of the power conversion device 1B according to the second embodiment is the same as that of the power conversion device 1A according to the first embodiment.

  The power conversion device 1B according to the second embodiment is different from the power conversion device 1A according to the first embodiment in that instead of the beam leads 201A and 201B, the heat sinks 301A and 301B that also serve as beam leads as a whole. It is a point provided with.

  As shown in FIGS. 5 and 6, the heat sinks 301 </ b> A and 301 </ b> B are formed in an ingot shape from a metal such as aluminum or copper.

  The heat sinks 301A and 301B are soldered to semiconductor chips and the like constituting the IGBTs 1 to 4 with the ingot-shaped trapezoidal surface 304 as a contact surface. Thereby, electrical conduction with IGBT1-IGBT4 and a terminal is achieved.

  In addition, since the heat sinks 301A and 301B formed in an ingot shape have a larger heat capacity than the beam leads 201A and 201B made of sheet metal, the heat efficiency from the IGBTs 1 to 4 is more efficiently absorbed. Can be improved.

  Moreover, since the heat sinks 301A and 301B have a relatively large area in contact with the airflows 500b and 500c shown in FIG. 1, the air can be cooled more efficiently.

  In particular, as shown in FIG. 6, when a plurality of radiating fins 302 and 303 along the flow direction of the airflows 500b and 500c are provided on the upper surfaces of the heat sinks 301A and 301B, they come into contact with the airflow and airflows 500b and 500c. The area can be increased, and the cooling efficiency can be further improved.

  In the case of providing a protective layer made of silicon-based gel or the like, when providing the upper portions of the heat sinks 301A and 301B or the radiating fins 302 and 303, all or part of the radiating fins 302 and 303 are exposed from the protective layer. Like that. Thereby, influences, such as oxidation of IGBT1-IGBT4, a terminal, etc. by air, can be controlled, ensuring cooling performance.

[Power Conversion Device According to Third Embodiment]
Next, with reference to FIG. 7, 1 C of power converter devices which concern on 3rd Embodiment are demonstrated.

  FIG. 7 is an end view showing a part of the internal configuration on the upper surface side of the power conversion device 1C according to the third embodiment.

  The basic configuration of the power conversion device 1C according to the third embodiment is the same as that of the power conversion device 1A according to the first embodiment.

  The power converter 1C according to the third embodiment is different from the power converter 1A according to the first embodiment in that a partition wall 300 is formed between the beam leads 201A and 201B. .

  In the embodiment shown in FIG. 7, a partition wall 310 is also formed between the beam lead 201A and the side wall and between the beam lead 201B and the side wall. The partition walls 300 and 310 are preferably made of an insulating resin.

  By providing the partition wall 300 between the beam leads 201A and 201B, it is possible to prevent the occurrence of a short circuit between the beam leads 201A and 201B.

  Moreover, by providing the partition wall 310, the cross-sectional area of the flow path through which air flows can be made relatively small, the air flow rate can be increased, and the cooling efficiency can be improved.

[Power Converter According to Fourth Embodiment]
Next, with reference to FIG. 8 and FIG. 9, the power converter device 1D which concerns on 4th Embodiment is demonstrated.

  FIG. 8 is a perspective view showing the internal configuration of the upper surface side of the power conversion device 1D according to the fourth embodiment, and FIG. 9 is an end view taken along line AA of the power conversion device 1D.

  The basic configuration of the power conversion device 1D according to the fourth embodiment is the same as that of the power conversion device 1A according to the first embodiment.

  The power conversion device 1C according to the fourth embodiment is different from the power conversion device 1A according to the first embodiment in that the air supplied by the blower is distributed instead of the beam leads 201A and 201B. It is a point using the hollow pipe members 50 and 51 provided with the flow paths 50a and 51a to be made.

  As shown in FIG. 8, the pipe member 50 is formed as a single pipe, and is made of a metal such as copper or aluminum in order to achieve electrical continuity between electrical elements such as IGBTs.

  On the other hand, a plurality (three in FIG. 8) of pipe members 51 are made of a metal such as copper or aluminum in order to achieve electrical continuity between electrical elements such as IGBTs, and between the pipe members 51. Are connected via a hollow connection member 52 formed of a flexible material such as rubber. Thereby, air can be circulated through the hollow portions of the pipe members 51 and the connection members 52 to cool the IGBTs and the like, and the expansion and contraction due to the heat of the electrical elements such as the pipe members 51 and the IGBTs. The connection member 52 can absorb the stress caused by the above.

  In place of the connection member 52, a bellows portion may be formed in the middle of one pipe material to absorb the stress.

  Although the invention made by the present inventor has been specifically described based on the embodiments, the embodiments disclosed herein are illustrative in all respects and are not limited to the disclosed technology. Should not be considered. That is, the technical scope of the present invention should not be construed restrictively based on the description in the above embodiment, but should be construed according to the description of the scope of claims. All the modifications within the scope of the claims and the equivalent technique to the described technique are included.

  For example, you may make it arrange | position a dehumidifying agent inside the housing | casing C in power converter device 1A-1D which concerns on the said embodiment. Thereby, the humidity of the air enclosed in the housing | casing C can be removed, and corrosion etc. of electrical elements, such as IGBT, can be suppressed further.

  Moreover, although the said embodiment demonstrated the case where the water-cooling apparatus 11 as a cooler was provided in the back surface side which is the one surface side of power modules PM1-PM3, it is not limited to this and should be provided in a front side or a side surface side. May be.

  Moreover, although the said embodiment demonstrated the case where a part of sealed passage R was provided in the back surface side which is the one surface side of the water cooling apparatus 11 as a cooler, it is not limited to this, The one surface side of the water cooling apparatus 11 A part of the sealed passage R may be provided on the side surface.

DESCRIPTION OF SYMBOLS 1A-1D ... Power converter 10 ... Power semiconductor element 11 ... Water cooling apparatus (cooler)
DESCRIPTION OF SYMBOLS 12 ... Water cooling jacket 12a ... Fine hole 13 ... Supply port 14 ... Discharge port 20 ... Air cooling means 20a ... Fine pore 21 ... Blower (blower means)
25 ... Air blow pipe 26 ... Exhaust pipe 27 ... Bellows member 30 ... Blower circuit connection connector 50, 51 ... Pipe member 50a, 51a ... Flow path 52 ... Connection member 101 ... Insulation member 102A-102C ... Substrate 201A, 201B ... Beam lead 300 310 ... Partition walls 301A, 301B ... Heat sinks 302, 303 ... Radiating fins 500a to 500e ... Air flow C ... Housing H ... Crossover part PM1-PM3 ... Power module R ... Sealed passage

Claims (6)

Power modules (PM1 to 3) having power semiconductor elements (IGBT1 to IGBT4);
A cooler (water cooling device 11) that is disposed on one side of the power module and cools the power module;
An air cooling means having a sealed passage (R) that circulates on one side of the cooler and the opposite side of the power module where the cooler is disposed, and that circulates air in the sealed passage by a blower means (blower 21). (20) A power conversion device comprising: The power semiconductor element includes a beam lead (201A, 201B) that makes electrical connection with an electrical element,
2. The power conversion device according to claim 1, wherein the beam lead has an exposed portion that is air-cooled in contact with an air flow (500 b, 500 c) formed by blowing from the blowing unit.   The power converter according to claim 1, further comprising a protective layer that protects the power semiconductor element.   The power converter according to claim 3, wherein the protective layer is made of a silicon-based gel.   The power converter according to any one of claims 2 to 4, wherein a plurality of the beam leads are provided, and a partition wall (300) is formed between the beam leads.   6. The power conversion according to claim 2, wherein the beam lead includes a flow path (50 a, 51 a) through which air supplied by the air blowing means is circulated. apparatus.

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