JP2016089045A5 - - Google Patents
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- JP2016089045A5 JP2016089045A5 JP2014225397A JP2014225397A JP2016089045A5 JP 2016089045 A5 JP2016089045 A5 JP 2016089045A5 JP 2014225397 A JP2014225397 A JP 2014225397A JP 2014225397 A JP2014225397 A JP 2014225397A JP 2016089045 A5 JP2016089045 A5 JP 2016089045A5
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Description
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014225397A JP6606325B2 (en) | 2014-11-05 | 2014-11-05 | Adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014225397A JP6606325B2 (en) | 2014-11-05 | 2014-11-05 | Adhesive tape |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016089045A JP2016089045A (en) | 2016-05-23 |
| JP2016089045A5 true JP2016089045A5 (en) | 2017-11-30 |
| JP6606325B2 JP6606325B2 (en) | 2019-11-13 |
Family
ID=56016336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014225397A Active JP6606325B2 (en) | 2014-11-05 | 2014-11-05 | Adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6606325B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017125093A (en) * | 2016-01-12 | 2017-07-20 | 積水化学工業株式会社 | Processing method of semiconductor protective tape and wafer |
| JP6793022B2 (en) * | 2016-12-02 | 2020-12-02 | 日東電工株式会社 | Adhesive tape for masking |
| JP7220633B2 (en) * | 2019-07-19 | 2023-02-10 | 株式会社日本触媒 | Adhesive composition and its use |
| JP7495383B2 (en) * | 2021-09-30 | 2024-06-04 | 古河電気工業株式会社 | Tape for semiconductor processing and semiconductor processing method using same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3775760B2 (en) * | 1995-04-28 | 2006-05-17 | 日本化薬株式会社 | UV curable adhesive composition, cured product, article and bonding method |
| JPH1161049A (en) * | 1997-08-19 | 1999-03-05 | Sekisui Chem Co Ltd | Photo-peeling type adhesive composition and photo peeling type adhesive tape |
| JPH11116910A (en) * | 1997-10-15 | 1999-04-27 | Sekisui Chem Co Ltd | Adhesive sheet |
| JP4812963B2 (en) * | 2001-05-18 | 2011-11-09 | リンテック株式会社 | Adhesive sheet for processing semiconductor wafer and method for processing semiconductor wafer |
| JP4854059B2 (en) * | 2004-07-27 | 2012-01-11 | 日東電工株式会社 | Manufacturing method of laser processed product using protective sheet for laser processing |
| JP2007000794A (en) * | 2005-06-24 | 2007-01-11 | Nippon Oil Corp | Curing method for UV curable adhesive |
| JP2010262098A (en) * | 2009-05-01 | 2010-11-18 | Fujifilm Corp | Optical compensation film, optical compensation film manufacturing method, polarizing plate, and liquid crystal display device |
| CN102725689B (en) * | 2010-01-22 | 2014-10-08 | 帝斯曼知识产权资产管理有限公司 | Liquid radiation curable resins capable of curing into layers with selective visual effects and methods for the use thereof |
| JP5307069B2 (en) * | 2010-03-31 | 2013-10-02 | 古河電気工業株式会社 | Radiation curable semiconductor wafer surface protection adhesive tape |
| JP2011249608A (en) * | 2010-05-27 | 2011-12-08 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer surface protection |
| JP5351913B2 (en) * | 2011-02-10 | 2013-11-27 | 株式会社日立ハイテクノロジーズ | Fine structure transfer apparatus and fine structure transfer method |
| JP2013237732A (en) * | 2012-05-11 | 2013-11-28 | Dainippon Printing Co Ltd | Energy ray-peelable adhesive composition, and adhesive tape |
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2014
- 2014-11-05 JP JP2014225397A patent/JP6606325B2/en active Active