JP2016069548A - Epoxy resin composition and cured article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent performance in low dielectric property, high thermostability and low hygroscopicity and useful for applications such as lamination, molding, casting and adhesion, and a cured article thereof.SOLUTION: There are provided an epoxy resin composition containing an epoxy resin having a structure obtained by reaction of a compound represented by the formula (1) and epihalohydrin and a curing agent as essential components, and a cured article thereof, where n is a repeating number and its average is a value of 0<n≤10, A is each independently a bivalent group having an aliphatic ring structure, B is each independently a bivalent hydrocarbon group, Ris each independently H, a halogen atom, or a C1 to 10 hydrocarbon group.SELECTED DRAWING: None

Description

The present invention relates to an epoxy resin composition that provides a cured product excellent in low dielectric properties, high heat resistance, and low moisture absorption, and a cured product thereof.

In recent years, the signal band of information communication devices such as mobile phones and the CPU clock time of computers have reached the GHz band, and the frequency has been increasing.

The dielectric loss of an electrical signal is proportional to the product of the square root of the dielectric constant of the insulator forming the circuit, the dielectric loss tangent and the frequency of the signal used. Therefore, the higher the frequency of the signal used, the greater the dielectric loss.

Dielectric loss attenuates the electrical signal and impairs the reliability of the signal. Therefore, in order to suppress this, it is necessary to select a material having a small dielectric constant and dielectric loss tangent for the insulator (Patent Document 1).

A material for providing a thermosetting resin composition having such characteristics and a technique using an active ester compound obtained by arylesterifying a phenolic hydroxy group in a phenol novolac resin as a curing agent for an epoxy resin are known. The heat resistance was not sufficient (Patent Documents 2 and 3). In Patent Document 4, improvement in moisture resistance and electrical characteristics was presented by a resin composition containing a bifunctional epoxy resin having a phenylalkyl ether skeleton. However, although the effect of lowering the dielectric loss tangent was recognized, the effect of lowering the dielectric constant was insufficient and the heat resistance was not satisfactory.

JP 2012-221968 A JP-A-11-130939 JP 7-82348 A Japanese Patent No. 4529234

Therefore, the problem to be solved by the present invention is an epoxy resin composition having superior performance in moisture resistance, low dielectric property and high heat resistance, and useful for applications such as lamination, molding, casting and adhesion. And a cured product thereof.

That is, the present invention provides the following general formula (1)

(In the formula, n is the number of repetitions and the average value is 0 <n ≦ 10, A represents a divalent group having an aliphatic ring structure, and B is independently a divalent carbonization. An epoxy resin having a structure obtained by reacting a compound represented by a hydrogen group, and R ₁ independently represents a hydrogen atom, a halogen atom or a hydrocarbon group having 1 to 10 carbon atoms) and an epihalohydrin; An epoxy resin composition containing a curing agent as an essential component.

In the general formula (1), A represents the general formula (2).

(In the formula, each R ₂ independently represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, and two R ₂ may be bonded to each other to form a ring. K represents an integer of 3 to 12, p represents 0 or 1),

General formula (3)

(Wherein p represents 0 or 1, s represents 0 or 1, and t represents 0 or 1),

Or general formula (4)

(Wherein p represents 0 or 1),

And B in the general formula (1) is preferably a methylene group.

And the epoxy equivalent of the said epoxy resin is 250-1000 g / eq. The active hydrogen group of the curing agent is preferably in the range of 0.4 to 1.2 mol with respect to 1 mol of the epoxy group of the epoxy resin.

Moreover, this invention is a prepreg using the said epoxy resin composition, an adhesive sheet, an epoxy resin laminated board, an epoxy resin sealing material, or an epoxy resin sealing material, and the hardened | cured material obtained by hardening | curing the said epoxy resin composition It is.

The epoxy resin composition of the present invention provides a cured product excellent in low dielectric property, high heat resistance and moisture resistance, and can be suitably used for applications such as lamination, molding, casting and adhesion.

The present invention is an epoxy resin composition comprising an epoxy resin having a structure obtained by reacting the compound represented by the general formula (1) and epihalohydrin, and a curing agent as essential components.

In the compound represented by the general formula (1), n is the number of repetitions, and the average value is 0 <n ≦ 10, preferably 0.01 <n <8, more preferably 0.05 <. n <5, and more preferably 0.1 <n <3. When n is 0, the amount of hydroxy groups is not sufficiently reduced, and there is no effect on low dielectric properties. When n exceeds 10, there is a risk of high viscosity. Here, the average value is a number average.

Moreover, the general formula (1) R ₁ in each independently, a hydrogen atom, is either a halogen atom or a hydrocarbon group having 1 to 10 carbon atoms. Specific examples of the hydrocarbon group having 1 to 10 carbon atoms include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n -A linear or branched alkyl group having 1 to 10 carbon atoms such as a pentyl group or an n-hexyl group, a cyclic alkyl group having 4 to 10 carbon atoms such as a cyclohexyl group, a phenyl group, a naphthyl group, a tolyl group, or a xylyl group. An aryl group optionally having a substituent having 6 to 10 carbon atoms such as an indanyl group, a benzyl group, a phenethyl group, a 2-methylbenzyl group, a 3-methylbenzyl group, a 4-methylbenzyl group, 2, And substituents such as an aralkyl group which may have a substituent having 7 to 10 carbon atoms such as a 6-dimethylbenzyl group, a 3,5-dimethylbenzyl group, and an α-methylbenzyl group. , Preferred substituents are methyl, ethyl, tert- butyl group, a cyclohexyl group, a phenyl group, a α- methylbenzyl group.

A in the general formula (1) is independently a divalent group having an aliphatic ring structure, and a cyclohexane ring, a decalin structure, a spiro ring structure represented by the general formula (2) or A group having a bicyclohexyl structure, a norbornane structure represented by the general formula (3), a group having a tetrahydrodicyclopentadiene structure or a tetrahydrotricyclopentadiene structure, or an adamantane structure represented by the general formula (4) Groups are preferred.

Examples of the divalent group having an aliphatic ring structure represented by the general formula (2) include the following structural formula groups (A1) to (A28).

However, it is not limited to these.
The divalent group having an aliphatic ring structure represented by the general formula (3) or (4) is, for example, the following structural formula groups (A29) to (A49).

However, it is not limited to these.
In addition, examples of A in the general formula (1) include, for example, the following structural formula groups (A50) to (A59):

However, it is not limited to these, and these may be used alone or in combination of two or more. Among these, (A1), (A2), (A3), (A4), (A6), (A7), (A8), (A9), (A10), (A11), (A13), ( A14), (A17), (A18), (A19), (A20), (A21), (A25), (A26), (A27), (A28), (A29), (A31), (A34) , (A35), (A36), (A37), (A40), (A41), (A42), (A43), (A44), (A45), (A46), (A47), (A48), ( A49), (A51), (A52), (A53), (A54), (A55), (A56) or (A59) is preferable, and (A1), (A2), (A3), (A A7), (A9), (A11), (A13), (A14), (A17), (A18) (A21), (A28), (A29), (A31), (A34), (A35), (A36), (A37), (A40), (A41), (A42), (A43), (A44) ), (A45), (A46), (A47), (A48), (A49) or (A53) is more preferred, and (A1), (A2), (A3), (A9), (A A11), (A13), (A14), (A17), (A18), (A29), (A31), (A34), (A35), (A36), (A37), (A40), (A41) , (A42), (A44), (A46) or (A48) is more preferred.

An epoxy resin composition comprising an epoxy resin having a structure obtained by reacting the compound represented by the general formula (1), which is not a divalent group having an aliphatic ring structure, and an epihalohydrin, and a curing agent. Then, a low dielectric constant tangent is obtained, but a cured product having a low dielectric constant cannot be obtained.

The compound represented by the general formula (1) is, for example, the following general formula (5).

(Wherein, A and _{R 1} are the same meanings as A and _{R 1} in the general formula (1).)

A dihydroxy compound (a) having an aliphatic ring structure represented by the following general formula (6)

(Wherein, B and R ₁ have the same meanings as B and R ₁ in the general formula (1), X represents chlorine, bromine, a halogen atom selected from iodine.)

It can obtain by carrying out the dehydrohalogenation condensation reaction with the halogenated alkyl group containing compound (b) represented by these. Note that n in the general formula (1) can be roughly calculated from the molar ratio of the dihydroxy compound (a) and the halogenated alkyl group-containing compound (b). Become.

The halogenated alkyl group-containing compound (b) is, for example, the following general formula (7)

(In the formula, _{R 1} and _{R 1} in the general formula (1), X are each as X in the general formula (6) interchangeably.)
Is preferred.

Moreover, as a dihydroxy compound (a) which has an aliphatic ring structure represented by the said General formula (5) which can be used, following General formula (8)

(Wherein, _{R 1} and _{R 1} in the general formula _{(1), R} 2, k and p are respectively _R 2, k and p in the general formula (2) interchangeably.),

A dihydroxy compound having a cyclohexane ring, a decalin structure, a spiro ring structure or a bicyclohexyl structure represented by:
The following general formula (9)

(Wherein, _{R 1} and _{R 1} in the general formula (1), p, s and t is p, respectively s and t synonymous in the general formula (3).),

A dihydroxy compound having a norbornane structure, a tetrahydrodicyclopentadiene structure or a tetrahydrotricyclopentadiene structure represented by:
Or the following general formula (10)

(Wherein, _{R 1} and _{R 1} in the general formula (1), p are each a p in the general formula (5) interchangeably.),

Although the dihydroxy compound etc. which have adamantane structure represented by these are mentioned, it is not limited to these, These may be used individually or may use 2 or more types together.

Examples of the dihydroxy compound having a cyclohexane ring, a decalin structure, a spiro ring structure, or a bicyclohexyl structure represented by the general formula (8) include the following structural formula groups (B1) to (B9).

However, it is not limited to these, and may have the substituents exemplified for R ₁ in the general formula (1).
In addition, as a dihydroxy compound having a norbornane structure, a tetrahydrodicyclopentadiene structure or a tetrahydrotricyclopentadiene structure represented by the general formula (9), or a dihydroxy compound having an adamantane structure represented by the general formula (10), For example, the following structural formula groups (B10) to (B21)

However, it is not limited to these, and may have the substituents exemplified for R ₁ in the general formula (1).
In addition, examples of the dihydroxy compound having an aliphatic ring structure represented by the general formula (5) include the following structural formula groups (B22) to (B25).

However, it is not limited to these, and may have the substituents exemplified for R ₁ in the general formula (1).

In order to obtain the compound represented by the general formula (1) suitable for the epoxy resin of the present invention, the dihydroxy compound (a) exemplified above and the halogenated alkyl group-containing compound (b) exemplified above are used. Any combination may be used, but a more preferable combination of the dihydroxy compound (a) and the halogenated alkyl group-containing compound (b) is represented by the general formula (7) and the general formula (8). Examples thereof include compounds, compounds represented by the general formula (7) and the general formula (9), compounds represented by the general formula (7) and the general formula (10), and the like. Among these, as a more preferable combination, bischloromethylbiphenyl and the compound represented by the general formula (8) from the viewpoint of adhesiveness, bischloromethylbiphenyl and the compound represented by the general formula (9) are heat resistant. From this point, bischloromethylbiphenyl and the compound represented by the general formula (9), bischloromethylbiphenyl and the compound represented by the general formula (10) can be mentioned.

In addition, in order to obtain the compound represented by the general formula (1) suitable for the epoxy resin, the halogenated alkyl group-containing compound (b) is reduced to 0 with respect to 1.0 mol of the dihydroxy compound (a). It is necessary to make it react in the range of 0.001 to 1.0 mol, a preferable range is 0.01 to 0.9 mol, a more preferable range is 0.05 to 0.8 mol, and a further preferable range. Is 0.1 to 0.7 mol. When the halogenated alkyl group-containing compound (b) exceeds 1 mol, the terminal group of the compound represented by the general formula (1) becomes a halogen, so that the epoxy resin of the present invention cannot be obtained.

It is preferable that a dehydrohalogenating agent is present in the reaction between the dihydroxy compound (a) and the halogenated alkyl group-containing compound (b). Examples of the dehydrohalogenating agent include sodium hydroxide and potassium hydroxide. Alkali metal hydroxides such as lithium hydroxide and tertiary amines such as triethylamine can be used, but sodium hydroxide and potassium hydroxide are preferred from the viewpoint of reaction rate. Although the usage-amount of these dehydrohalogenating agents is not specifically limited, 1.8-2.5 mol is preferable with respect to 1 mol of said dihydroxy compounds (a), and 2.0-2.2 mol is more. preferable. In this case, the reaction rate can be increased by using a phase transfer catalyst such as a quaternary ammonium salt or crown ether.

The reaction is preferably performed in the presence of a solvent. Specific examples in the case of using a solvent include methanol, ethanol, isopropyl alcohol, methyl cellosolve, ethyl cellosolve, toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, etc., but are not limited thereto, and these may be used alone. You may use by mixing 2 or more types. The usage-amount of a solvent is 50-300 mass parts normally with respect to 100 mass parts of total amounts of the raw material prepared, Preferably it is 70-250 mass parts.

Moreover, reaction temperature is 20-120 degreeC normally, Preferably it is 30-100 degreeC, More preferably, it is 40-80 degreeC, More preferably, it is 50-60 degreeC. The reaction does not proceed at 20 ° C. or lower, and an electrophilic substitution reaction may occur as a side reaction at 100 ° C. or higher. Moreover, reaction time is 1 to 10 hours normally, Preferably it is 2 to 5 hours.

In addition, these reactions are carried out, for example, by dissolving the dihydroxy compound (a) and the halogenated alkyl group-containing compound (b) in a suitable organic solvent, and adding a dehydrohalogenating agent dropwise thereto, and stirring until the reaction is completed. You can continue. After completion of the reaction, an acidic compound such as sodium phosphate is added to neutralize the system so that the pH value of the water washing liquid of the reaction mixture is 3-7. Thereafter, after washing with water and removing the inorganic salt from the system, the organic solvent can be recovered by distillation to obtain the compound represented by the general formula (1) that becomes an intermediate of the target epoxy resin. .

The epoxy resin essential for the epoxy resin composition of the present invention is obtained by first reacting the dihydroxy compound (a) with the halogenated alkyl group-containing compound (b) to obtain a compound represented by the general formula (1). Then, the compound and epihalohydrin are reacted to convert the hydroxy group to glycidyl ether, and the following general formula (11)

_{(Wherein, A, B, R 1,} n is, A in the general formula (1), _B, are each and _R 1, n synonymous, m has an average value in the number of repetitions at 0 ≦ m <10 And G is a glycidyl group.)

It is a compound represented by these. In the reaction, a small amount of a component having a structure in which an epoxy group is opened and polymerized or a component having a hydroxyl group as a terminal group may be mixed, but such a component may be mixed.

In the general formula (11), m is the number of repetitions, and the average value is 0 ≦ m <10, preferably 0 ≦ n <5, more preferably 0 ≦ m <4, and further 0 ≦ m <3. preferable. If m is 10 or more, there is a risk of high viscosity. The epoxy equivalent is not particularly specified, but is 2000 g / eq. The following is preferable, and 1000 g / eq. The following is more preferable. Epoxy equivalent is 2000 g / eq. If it is larger, the molecular weight becomes large, so that there is a risk of high viscosity.

As a method for obtaining the epoxy resin of the present invention from the compound represented by the general formula (1) obtained by reacting the dihydroxy compound (a) and the halogenated alkyl group-containing compound (b), for example, it is known per se. This method can be adopted. For example, an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide is added to a dissolved mixture of the compound represented by the general formula (1) obtained above and an epihalohydrin such as epichlorohydrin or epibromohydrin, or The epoxy resin used in the present invention can be obtained by reacting in the range of 20 to 120 ° C., preferably 30 to 80 ° C. for 1 to 10 hours while being added.

The amount of epihalohydrin used is usually 0.3 to 20 mol, preferably 1.5 to 15 mol, more preferably 2 with respect to 1 mol of the hydroxy group in the compound represented by the general formula (1) of the raw material. A range of -10 mol is used. When the epihalohydrin is less than 2.5 moles, the epoxy group and the unreacted hydroxyl group are likely to react with each other. Therefore, a group formed by addition reaction of the epoxy group and the unreacted hydroxyl group (—CH ₂ CR (OH) CH ₂ —, A high molecular weight product containing R: a hydrogen atom or an alkyl group is obtained. On the other hand, when the amount is more than 2.5 mol, the content of the theoretical structure becomes high. The amount of epihalohydrin may be appropriately adjusted according to desired characteristics.

The amount of the alkali metal hydroxide used is 0.8 to 2.5 mol, preferably 0.85 to 2.0 mol, relative to 1 mol of the hydroxy group of the compound represented by the general formula (1). More preferably, it is the range of 0.9-1.5 mol.

In the reaction for obtaining an epoxy resin essential for the epoxy resin composition of the present invention, the alkali metal hydroxide may be used as an aqueous solution, and in that case, the aqueous solution of the alkali metal hydroxide is continuously added to the reaction system. And water and epihalohydrin may be continuously distilled off under reduced pressure or normal pressure, followed by liquid separation to remove water and epihalohydrin to be continuously returned to the reaction system.

Further, a quaternary ammonium salt such as tetramethylammonium chloride, tetramethylammonium bromide or trimethylbenzylammonium chloride is added to a dissolved mixture of the compound represented by the general formula (1) and epihalohydrin as a catalyst, and the mixture is 1 at 50 to 150 ° C. To the halohydrin etherified product of the compound of the general formula (1) obtained by reacting for ~ 5 hours, an alkali metal hydroxide solid or an aqueous solution is added and reacted again at 20 to 120 ° C for 1 to 10 hours. A method of dehydrohalogenation (ring closure) may be used. In addition, alcohols such as methanol, ethanol, isopropyl alcohol and butanol, ketones such as acetone and methyl ethyl ketone, ethers such as dioxane, aprotic polar solvents such as dimethyl sulfone and dimethyl sulfoxide, etc. are used to facilitate the reaction. It is preferable to carry out the reaction by adding. The amount of the solvent used is usually 5 to 50 parts by mass, preferably 10 to 30 parts by mass with respect to 100 parts by mass of epihalohydrin. Moreover, when using an aprotic polar solvent, it is 5-100 mass parts normally with respect to 100 mass parts of epihalohydrins, Preferably it is 10-60 mass parts.

The reaction product of these epoxidation reactions is removed from epihalohydrin and other added solvents at 110-250 ° C. and a pressure of 0.00133 MPa (10 mmHg) or less under reduced pressure by heating after washing with water or without washing. Furthermore, in order to obtain an epoxy resin with less hydrolyzable halogen, the crude epoxy resin obtained after recovering epihalohydrin and the like is dissolved again in a solvent such as toluene and methyl isobutyl ketone, and an alkali such as sodium hydroxide and potassium hydroxide is then obtained. An aqueous solution of a metal hydroxide can be added to further react to ensure ring closure. In this case, the amount of alkali metal hydroxide used is usually 0.5 to 10 mol, preferably 1.2 to 5 mol, per 1 mol of hydrolyzable halogen remaining in the crude epoxy resin. The reaction temperature is usually 50 to 120 ° C., and the reaction time is usually 0.5 to 3 hours. For the purpose of improving the reaction rate, a phase transfer catalyst such as a quaternary ammonium salt or crown ether may be present. When the phase transfer catalyst is used, the amount used is preferably in the range of 0.1 to 3 parts by mass relative to 100 parts by mass of the crude epoxy resin.

After completion of the reaction, the produced salt is removed by filtration, washing with water, etc., and further, an epoxy resin essential for the epoxy resin composition of the present invention is obtained by distilling off a solvent such as toluene and methyl isobutyl ketone under heating and reduced pressure. .

In addition, as a more preferable method for obtaining an epoxy resin essential for the epoxy resin composition of the present invention, a neutralization step is performed after reacting the dihydroxy compound (a) and the halogenated alkyl group-containing compound (b). A method of reacting with an epihalohydrin immediately without performing an operation of taking it out of the reaction system as the compound represented by the general formula (1) is mentioned. In this method, an alkali metal hydroxide is used as a dehydrohalogenating agent in the reaction between the dihydroxy compound (a) and the halogenated alkyl group-containing compound (b), and the remaining alkali metal hydroxide is also epoxidized. It adds and considers as an alkali metal hydroxide used for reaction.

As said hardening | curing agent used for the epoxy resin composition of this invention, it is using the hardening | curing agent for epoxy resins normally used, such as various phenol resins, acid anhydrides, amines, hydrazides, and active esters. These curing agents may be used alone or in combination of two or more. In order to reduce the dielectric loss tangent, a curing agent having a lower functional group concentration after curing is preferable, and a high hydroxy group equivalent phenol resin and active esters are preferable.

Specific examples of the phenol resins include tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol novolac, o-cresol novolak, naphthol novolak, Trivalent or higher valent phenolic compounds represented by dicyclopentadiene type phenol resin, phenol aralkyl resin and the like, and further phenols, naphthols, bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4,4′-biphenol, Divalent phenols such as 2,2′-biphenol, hydroquinone, resorcin, catechol, naphthalene diol, and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, p-xy Polyhydric phenol compounds synthesized by reaction with crosslinkers such as lenglycol, p-xylylene glycol dimethyl ether, divinylbenzene, diisopropenylbenzene, dimethoxymethylbiphenyls, divinylbiphenyl, diisopropenylbiphenyls, and phenols Examples thereof include biphenyl aralkyl type phenol resins obtained from bischloromethylbiphenyl and the like, and naphthol aralkyl resins synthesized from naphthols and paraxylylene dichloride.

Specific examples of the acid anhydrides include methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, methylnadic acid anhydride, benzophenonetetracarboxylic dianhydride Products, biphenyltetracarboxylic dianhydride and the like.

Specific examples of the amines include condensates of acids such as diethylenetriamine, triethylenetetramine, metaxylenediamine, isophoronediamine, diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiphenyl ether, dicyandiamide and dimer acid and polyamines. Examples thereof include amine compounds such as polyamide amine.

Specific examples of the hydrazides include adipic hydrazide, sepatin hydrazide, isophthalic hydrazide, and the like.

Specific examples of the active esters include EPICLON HPC-8000-65T (manufactured by DIC Corporation).

In the epoxy resin composition of the present invention, the active hydrogen group of the curing agent is preferably in the range of 0.4 to 1.2 mol, preferably 0.5 to 1.1 mol, with respect to 1 mol of the epoxy group of the epoxy resin. Is more preferable, and 0.7 to 1.0 mol is more preferable.

A curing accelerator can be used in the epoxy resin composition of the present invention as necessary. Specific examples of curing accelerators that can be used include imidazoles such as 2-methylimidazole, 2-ethylimidazole, and 2-ethyl-4-methylimidazole, 2- (dimethylaminomethyl) phenol, and 1,8-diaza. -Tertiary amines such as bicyclo (5,4,0) undecene-7, phosphines such as triphenylphosphine, tricyclohexylphosphine and triphenylphosphinetriphenylborane, and metal compounds such as tin octylate. These curing accelerators may be used alone or in combination of two or more. As for these hardening accelerators, 0.02-5.0 mass parts is used as needed with respect to 100 mass parts of said epoxy resins in the epoxy resin composition of this invention. By using these curing accelerators, the curing temperature can be lowered or the curing time can be shortened.

The epoxy resin composition of the present invention uses the epoxy resin obtained from the compound represented by the above general formula (1) and epihalohydrin as an epoxy resin component as an essential epoxy resin, but does not impair the purpose of the present invention. Other epoxy resins can be used in combination.

Specific examples of other epoxy resins that can be used in combination include bisphenol A, bisphenol F, bisphenol S, bisphenol fluorene, 4,4′-biphenol, 3,3 ′, 5,5′-tetramethyl-4,4 ′. -Epoxidized dihydric phenols such as dihydroxybiphenyl, resorcin, naphthalenediols, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol novolac, Epoxides of tri- or higher valent phenols such as o-cresol novolac, epoxidized products of co-condensation resins obtained from dicyclopentadiene and phenols, epoxides of co-condensation resins obtained from cresols, formaldehyde and alkoxy-substituted naphthalenes , Phenols Epoxy products of phenol aralkyl resins obtained from paraxylylene dichloride, epoxides of biphenyl aralkyl type phenol resins obtained from phenols and bischloromethylbiphenyl, naphthol aralkyl resins synthesized from naphthols and paraxylylene dichloride, etc. Epoxidized products and the like. These epoxy resins may be used alone or in combination of two or more. These blending amounts may be in a range that does not impair the object of the present invention, but are preferably less than 50% by mass, more preferably 40%, based on the total of the epoxy resin of the present invention and other epoxy resins. It is less than mass%, more preferably less than 25 mass%.

In the epoxy resin composition of the present invention, a solvent can also be used for viscosity adjustment. Specific examples of solvents that can be used include amides such as N, N-dimethylformamide, ethers such as ethylene glycol monomethyl ether, ketones such as acetone and methyl ethyl ketone, alcohols such as methanol and ethanol, benzene And aromatic hydrocarbons such as toluene. These solvents may be used alone or in combination of two or more.

The epoxy resin composition of the present invention may be blended with a curable resin or a thermoplastic resin other than the epoxy resin as long as the characteristics are not impaired. Specifically, phenol resin, acrylic resin, petroleum resin, indene resin, indene coumarone resin, phenoxy resin, cyanate resin, epoxy acrylate resin, vinyl compound, polyurethane, polyester, polyamide, polyimide, polyamideimide, polyether Examples thereof include, but are not limited to, imide, bismaleimide triazine resin, polyethersulfone, polysulfone, polyetheretherketone, polyphenylene sulfide, and polyvinyl formal.

A filler can be used for the epoxy resin composition of this invention as needed. Specific examples include inorganic fillers such as aluminum hydroxide, magnesium hydroxide, talc, calcined talc, clay, kaolin, titanium hydroxide, glass powder, silica balloon, etc., but organic or inorganic moisture-resistant pigments In addition, pigments such as scaly pigments may be blended. The reason for using a general inorganic filler is an improvement in impact resistance. Moreover, fibrous fillers, such as glass fiber, a pulp fiber, a synthetic fiber, a ceramic fiber, organic fillers, such as fine particle rubber and a thermoplastic elastomer, etc. can be mix | blended.

Moreover, you may mix | blend additives, such as a flame retardant, a thixotropic agent, and a fluidity improver, in the epoxy resin composition of this invention as needed. Examples of the thixotropic agent include silicon, castor oil, aliphatic amide wax, oxidized polyethylene wax, and organic bentonite. Further, if necessary, the resin composition of the present invention includes a release agent such as carnauba wax and OP wax, a colorant such as carbon black, a flame retardant such as antimony trioxide, a low stress agent such as silicone oil, A lubricant such as calcium stearate can be blended.

Next, the prepreg obtained by using the epoxy resin composition of the present invention will be described. As the sheet-like base material, inorganic fibers such as glass, and woven or non-woven fabrics of organic fibers such as polyamine, polyacryl, polyimide, and aromatic polyamide such as polyester can be used. Absent. The method for producing the prepreg from the epoxy resin composition and the substrate of the present invention is not particularly limited. For example, the sheet-like substrate is immersed in a resin varnish whose viscosity is adjusted with a solvent of the epoxy resin composition. After impregnation, the resin component is obtained by drying by heating and semi-curing (B-stage). For example, it can be dried by heating at 100 to 200 ° C. for 1 to 40 minutes. Here, the amount of resin in the prepreg is preferably 30 to 80% by mass.

Next, an adhesive sheet obtained using the epoxy resin composition of the present invention will be described. Although it does not specifically limit as a method to manufacture an adhesive sheet, For example, on the carrier film which does not melt | dissolve in epoxy resin compositions, such as a polyester film and a polyimide film, Preferably the epoxy resin composition of this invention is 5-100 micrometers. After being applied to the thickness of the film, it is dried by heating at 100 to 200 ° C. for 1 to 40 minutes to form a sheet. A resin sheet is generally formed by a method called a casting method. At this time, if the sheet to which the epoxy resin composition is applied is previously surface-treated with a release agent, the molded adhesive sheet can be easily peeled off. Here, the thickness of the adhesive sheet is preferably 5 to 80 μm. The adhesive sheet thus obtained usually becomes an insulating adhesive sheet having insulation, but the conductive adhesive sheet is obtained by mixing conductive metal or metal-coated fine particles with the epoxy resin composition. Can be obtained.

Next, a method for producing a laminate using the prepreg or insulating adhesive sheet of the present invention will be described. When forming a laminated board using prepreg, one or more prepregs are laminated, a metal foil is placed on one or both sides to form a laminate, and this laminate is heated and pressed to integrate the laminate. To do. Here, as the metal foil, a single, alloy, or composite metal foil of copper, aluminum, brass, nickel or the like can be used. Conditions for heating and pressurizing the laminate may be adjusted as appropriate under the conditions for curing the epoxy resin composition, but heating and pressurizing may be performed. However, if the pressure of the pressurization is too low, bubbles remain in the resulting laminate. However, since the electrical characteristics may deteriorate, it is desirable to apply pressure under conditions that satisfy the moldability. For example, the temperature can be set to 160 to 220 ° C., the pressure can be set to 0.49 to 4.9 MPa (5 to 50 kgf / cm ² ), and the heating time can be set to 40 to 240 minutes. Furthermore, a multilayer board can be produced using the single-layer laminated board thus obtained as an inner layer material. In this case, first, a circuit is formed on the laminate by an additive method, a subtractive method, or the like, and the formed circuit surface is treated with an acid solution to be blackened to obtain an inner layer material. An insulating layer is formed by prepreg or an insulating adhesive sheet on one or both sides of the circuit forming surface of the inner layer material, and a conductor layer is formed on the surface of the insulating layer to form a multilayer board. When forming an insulating layer with an insulating adhesive sheet, an insulating adhesive sheet is arrange | positioned on the circuit formation surface of several inner-layer material, and a laminated body is formed. Alternatively, an insulating adhesive sheet is disposed between the circuit forming surface of the inner layer material and the metal foil to form a laminate. Then, the laminate is heated and pressed to be integrally molded, thereby forming a cured product of the insulating adhesive sheet as an insulating layer, and forming a multilayered inner layer material. Alternatively, the inner layer material and the metal foil as the conductor layer are formed by using the cured product of the insulating adhesive sheet as the insulating layer. Here, as a metal foil, the thing similar to what was used for the laminated board used as an inner layer material can be used. Further, the heat and pressure molding can be performed under the same conditions as the molding of the inner layer material. When an insulating layer is formed by applying an epoxy resin composition to a laminate, the outermost circuit-forming surface resin of the inner layer material is preferably applied to the epoxy resin composition to a thickness of 5 to 100 μm, and then 100 to 100- It is heated and dried at 200 ° C. for 1 to 90 minutes to form a sheet. It is generally formed by a method called a casting method. The thickness after drying is preferably 5 to 80 μm. A printed wiring board can be formed by performing via hole formation and circuit formation on the surface of the multilayer laminate formed as described above by an additive method or a subtractive method. Further, by repeating the above method using this printed wiring board as an inner layer material, a multilayer laminate can be formed. When an insulating layer is formed with a prepreg, a laminate is formed by placing one or a plurality of laminated prepregs on the circuit forming surface of the inner layer material, and further placing a metal foil on the outside thereof. . Then, this laminate is heated and pressed to be integrally formed, whereby a cured product of the prepreg is formed as an insulating layer, and the outer metal foil is formed as a conductor layer. Here, as a metal foil, the thing similar to what was used for the laminated board used as an inner layer board can also be used. Further, the heat and pressure molding can be performed under the same conditions as the molding of the inner layer material. A printed wiring board can be molded by further forming via holes or circuits by the additive method or subtractive method on the surface of the multilayer laminate thus formed. Further, by repeating the above method using the printed wiring board as an inner layer material, a multilayer board can be formed.

Moreover, if the epoxy resin composition of the present invention is heat-cured, it can be made into a cured epoxy resin, and this cured product is excellent in terms of low dielectric properties, heat resistance, low hygroscopicity, and the like. Moreover, this hardened | cured material can be obtained by shape | molding an epoxy resin composition by methods, such as casting, compression formation, and transfer formation. The temperature at this time is usually in the range of 120 to 250 ° C.

The epoxy resin composition of the present invention and the prepreg, adhesive sheet, laminate, sealant, cast product, and cured product obtained using the composition have excellent low dielectric properties, heat resistance, and low hygroscopicity. In addition, the material exhibited excellent adhesive properties.

EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example, this invention is not limited to this. In Examples, unless otherwise specified, “part” represents part by mass, and “%” represents mass%. In the present invention, the following test method was used.

(1) Measurement of epoxy equivalent The epoxy equivalent was measured according to JIS K 7236 standard. Specifically, a potentiometric titrator was used, methyl ethyl ketone was used as a solvent, a brominated tetraethylammonium acetic acid solution was added, and a 0.1 mol / L perchloric acid-acetic acid solution was used.

(2) Measurement of softening point Measured in accordance with JIS K 7234 standard and ring and ball method. Specifically, an automatic softening point apparatus (manufactured by Meitec Co., Ltd., ASP-MG4) was used.

(3) Measurement of glass transition temperature It measured based on JISK7121 and differential scanning calorimetry. Using an EXTER DSC6200 manufactured by SII, the temperature was measured at a rate of temperature increase from 20 ° C. to 10 ° C./min, and obtained from the extrapolated glass transition start temperature (Tig) of the DSC chart obtained in the second cycle.

(4) Measurement of relative permittivity and dielectric loss tangent By cavity resonance method (vector network analyzer (VNA) E8363B (manufactured by Agilent Technologies), cavity resonator perturbation method dielectric constant measurement device (manufactured by Kanto Electronics Application Development)) The value was measured.

(5) Measurement of adhesive strength In accordance with JIS K 6854-1, an autograph manufactured by Shimadzu Corporation under an atmosphere of 25 ° C. and 50 mm / min. It was measured by.

(6) Measurement of water resistance Solder heat resistance after PCT was measured as an index of water resistance. A test piece prepared according to JIS C 6481 was treated in an autoclave at 121 ° C. and 0.2 MPa for 3 hours, then placed in a 260 ° C. solder bath, and no swelling or peeling occurred for 20 minutes or more. The case where swelling or peeling occurred within 10 minutes was evaluated as x, and the others were evaluated as Δ.

(7) Tensile strength According to JIS K 7113.

(8) Measurement of water absorption rate compliant with JIS K 7209, Method A. Using a 50 mm square, 1 mm thick test piece, a measurement value immersed in water at 23 ° C. for 24 hours was defined as a water absorption rate.

Synthesis example 1
Into a four-necked glass separable flask equipped with a stirrer, thermometer, nitrogen gas introducing device, cooling pipe and dropping device, was charged 1220 parts of 2,6-xylenol and 14.2 parts of 47% BF ₃ ether complex. The temperature was raised to 115 ° C. with stirring. While maintaining the same temperature, 132 parts of dicyclopentadiene was added dropwise over 6 hours. Further, the reaction was continued at a temperature of 120 to 130 ° C. for 4 hours. Then, after adding 2 parts of calcium hydroxide and neutralizing by adding 4 parts of a 10% aqueous oxalic acid solution, 870 parts of methyl isobutyl ketone was added. Washing with 300 parts of hot water at about 80 ° C., repeating the liquid separation three times, raising the temperature to 160 ° C. to dehydrate, then evaporating and removing methyl isobutyl ketone and unreacted 2,6-xylenol under reduced pressure. The following general formula (12)

362 parts of a dihydroxy compound (a1) having a tan solid tetrahydrodicyclopentadiene structure represented by the formula:

Into a four-necked glass separable flask equipped with a stirrer, a thermometer, a nitrogen gas introducing device, a cooling pipe and an oil / water separator, 330 parts of methanol and 57 parts of potassium hydroxide were charged and stirred while stirring the dihydroxy compound ( a1) 188 parts were added to obtain an alkali metal salt. Thereafter, 20 parts of 4,4′-bischloromethylbiphenyl (hereinafter abbreviated as BCMB) and 200 parts of bis (2-methoxyethyl) ether (hereinafter abbreviated as DEDM) were added, and the temperature was raised to 75 ° C. while stirring. And reacted at the same temperature for 2 hours. After completion of the reaction, the temperature was raised to 100 ° C. under a reduced pressure of 0.0067 MPa (50 mmHg), and after distilling out the total amount of methanol, 450 parts of epichlorohydrin was charged and dissolved by stirring. After being uniformly dissolved, maintained at 75 ° C. under a reduced pressure of 0.024 MPa (180 mmHg), 35 parts of a 48% sodium hydroxide aqueous solution was added dropwise over 2 hours, and water and epichlorohydrin refluxed during the addition were separated in a separation layer. After separation, epichlorohydrin was returned to the reaction vessel, and water was removed from the system to react. After completion of the dropwise addition, the reaction was continued for an additional hour under the same conditions. After completion of the reaction, the salt produced by filtration was removed, and after further washing with water, epichlorohydrin and DEDM were distilled off under reduced pressure to obtain 215 parts of an epoxy resin (e1). The epoxy equivalent of the obtained epoxy resin (e1) is 300 g / eq. was.

Synthesis example 2
4,4'-cyclohexylidenebisphenol (manufactured by Honshu Chemical Industry Co., Ltd.) was added to a four-necked glass separable flask equipped with a stirrer, thermometer, nitrogen gas introducing device, cooling pipe, oil / water separator and dropping device. Bisphenol Z, hydroxyl group equivalent = 134 g / eq.) 134 parts, 67 parts of DEDM and 0.21 part of p-toluenesulfonic acid were added, the temperature was raised to 135 ° C. with stirring, and 52 parts of styrene was maintained while maintaining the same temperature. The solution was added dropwise over 3 hours. After completion of the dropwise addition, the reaction was further continued for 7 hours at the same temperature. Thereafter, 6 parts of pure water and 133 parts of DEDM were added, 59 parts of potassium hydroxide was added little by little with stirring to obtain an alkali metal salt, 10 parts of BCMB was added, and the temperature was raised to 75 ° C. while stirring. For 2 hours. After completion of the reaction, 550 parts of epichlorohydrin was charged and dissolved by stirring. After uniformly dissolving, maintaining at 75 ° C. under a reduced pressure of 0.024 MPa, 41 parts of a 48% aqueous sodium hydroxide solution was added dropwise over 2 hours, and water and epichlorohydrin distilled under reflux were separated in this dropping and separated into epichlorohydrin. Was returned to the reaction vessel, and water was removed from the system to react. After completion of the dropwise addition, the reaction was continued for an additional hour under the same conditions. After completion of the reaction, epichlorohydrin and DEDM were distilled off under reduced pressure, dissolved in 600 parts of toluene, and then the salt produced by washing with water was removed. Thereafter, toluene as a solvent was distilled off under reduced pressure to obtain 210 parts of an epoxy resin (e2). The epoxy equivalent of the obtained epoxy resin (e2) is 270 g / eq. was.

Synthesis example 3
A four-necked glass separable flask equipped with a stirrer, thermometer, nitrogen gas introducing device, cooling pipe, oil / water separator and dropping device was charged with 350 parts of methanol and 58 parts of potassium hydroxide while stirring. , 4 ′-(3,3,5-trimethylcyclohexylidene) bisphenol (BisP-TMC, hydroxyl equivalent = 155 g / eq., Manufactured by Honshu Chemical Industry Co., Ltd.) was added to prepare an alkali metal salt. Thereafter, 62 parts of BCMB and 200 parts of DEDM were added, the temperature was raised to 75 ° C. with stirring, and the reaction was performed at the same temperature for 2 hours. After completion of the reaction, the temperature was raised to 100 ° C. under a reduced pressure of 0.0067 MPa, and all the methanol was distilled off. Then, 300 parts of epichlorohydrin was charged and dissolved by stirring. After uniformly dissolving, maintaining at 75 ° C. under a reduced pressure of 0.024 MPa, 20 parts of a 48% aqueous sodium hydroxide solution was added dropwise over 2 hours, and water and epichlorohydrin distilled off during the addition were separated in a separation layer, and epichlorohydrin was separated. Was returned to the reaction vessel, and water was removed from the system to react. After completion of the dropwise addition, the reaction was continued for an additional hour under the same conditions. After completion of the reaction, epichlorohydrin and DEDM were distilled off under reduced pressure, dissolved in 600 parts of toluene, and then the salt produced by washing with water was removed. Thereafter, toluene as a solvent was distilled off under reduced pressure to obtain 200 parts of a yellow solid epoxy resin (e3). The epoxy equivalent of the obtained epoxy resin (e3) is 455 g / eq. was.

Synthesis example 4
A four-necked glass separable flask equipped with a stirrer, thermometer, nitrogen gas introduction device, cooling tube, oil / water separator and dropping device was charged with 350 parts of methanol and 60 parts of potassium hydroxide while stirring. 188 parts of the dihydroxy compound (a1) obtained in Example 1 was charged to obtain an alkali metal salt. Thereafter, 38 parts of BCMB and 200 parts of DEDM were charged, the temperature was raised to 75 ° C. with stirring, and the reaction was performed at the same temperature for 2 hours. After completion of the reaction, the temperature was raised to 100 ° C. under a reduced pressure of 0.0067 MPa, and after all the methanol was distilled off, 420 parts of epichlorohydrin was charged and dissolved by stirring. After uniformly dissolving, maintaining at 75 ° C. under a reduced pressure of 0.024 MPa, 27 parts of a 48% aqueous sodium hydroxide solution was added dropwise over 2 hours, and water and epichlorohydrin distilled under reflux were separated in this dropping and separated by a separated layer. Was returned to the reaction vessel, and water was removed from the system to react. After completion of the dropwise addition, the reaction was continued for an additional hour under the same conditions. After completion of the reaction, the salt produced by filtration was removed, and after further washing with water, epichlorohydrin and DEDM were distilled off to obtain 220 parts of an epoxy resin (e4). The epoxy equivalent of the obtained epoxy resin (e4) was 365 g / eq. was.

Synthesis example 5
A four-necked glass separable flask equipped with a stirrer, thermometer, nitrogen gas introduction device, cooling tube, oil / water separator and dropping device was charged with 350 parts of methanol and 57 parts of potassium hydroxide while stirring. 188 parts of the dihydroxy compound (a1) obtained in Example 1 was charged to obtain an alkali metal salt. Thereafter, 75 parts of BCMB and 200 parts of DEDM were charged, the temperature was raised to 75 ° C. with stirring, and the reaction was performed at the same temperature for 2 hours. After completion of the reaction, the temperature was raised to 100 ° C. under a reduced pressure of 0.0067 MPa, and after all the methanol was distilled off, 300 parts of epichlorohydrin was charged and dissolved by stirring. After uniformly dissolving, maintaining at 75 ° C. under a reduced pressure of 0.024 MPa, 17 parts of a 48% aqueous sodium hydroxide solution was added dropwise over 2 hours, and water and epichlorohydrin refluxed during the addition were separated in a separation layer, and epichlorohydrin was separated. Was returned to the reaction vessel, and water was removed from the system to react. After completion of the dropwise addition, the reaction was continued for an additional hour under the same conditions. After completion of the reaction, the salt produced by filtration was removed, and after further washing with water, epichlorohydrin and DEDM were distilled off to obtain 230 parts of an epoxy resin (e5). The epoxy equivalent of the obtained epoxy resin (e5) is 660 g / eq. was.

Comparative Synthesis Example 1
188 parts of the dihydroxy compound (a1) obtained in Synthesis Example 1 in a four-necked glass separable flask equipped with a stirrer, a thermometer, a nitrogen gas introducing device, a cooling tube, an oil / water separator and a dropping device. Then, 600 parts of epichlorohydrin and 200 parts of DEDM were added and dissolved by stirring. After being uniformly dissolved, maintained at 75 ° C. under a reduced pressure of 0.024 MPa, 125 parts of a 48% aqueous sodium hydroxide solution was added dropwise over 3 hours, and the water and epichlorohydrin distilled under reflux were separated in a separation layer, and epichlorohydrin was separated. Was returned to the reaction vessel, and water was removed from the system to react. After completion of the dropwise addition, the reaction was continued for an additional hour under the same conditions. After completion of the reaction, the salt produced by filtration was removed, and after further washing with water, epichlorohydrin and DEDM were distilled off under reduced pressure to obtain 205 parts of an epoxy resin (e6). The epoxy equivalent of the obtained epoxy resin (e6) is 250 g / eq. was.

Comparative Synthesis Example 2
A four-necked glass separable flask equipped with a stirrer, thermometer, nitrogen gas introduction device, cooling pipe, oil / water separator and dropping device was charged with 320 parts of methanol and 58 parts of potassium hydroxide while stirring. 153 parts of (4-hydroxy-3,5-dimethylphenyl) sulfone was charged to obtain an alkali metal salt. Thereafter, 37 parts of BCMB and 200 parts of DEDM were charged, the temperature was raised to 75 ° C. with stirring, and the reaction was performed at the same temperature for 2 hours. After completion of the reaction, the temperature was raised to 100 ° C. under a reduced pressure of 0.0067 MPa, and after all the methanol was distilled off, 450 parts of epichlorohydrin was charged and dissolved by stirring. After uniformly dissolving, 30 parts of a 48% aqueous sodium hydroxide solution was added dropwise over 2 hours while maintaining at 75 ° C. under a reduced pressure of 0.024 MPa, and the refluxed water and epichlorohydrin were separated in a separation layer to separate epichlorohydrin. Was returned to the reaction vessel, and water was removed from the system to react. After completion of the dropwise addition, the reaction was continued for an additional hour under the same conditions. After completion of the reaction, the salt produced by filtration was removed, and after further washing with water, epichlorohydrin and DEDM were distilled off to obtain 185 parts of an epoxy resin (e7). The epoxy equivalent of the obtained epoxy resin (e7) was 313 g / eq. was.

Comparative Synthesis Example 3
A four-necked glass separable flask equipped with a stirrer, thermometer, nitrogen gas introduction device, cooling tube, oil / water separator and dropping device was charged with 350 parts of methanol and 60 parts of potassium hydroxide while stirring. 188 parts of the dihydroxy compound (a1) obtained in Example 1 was charged to obtain an alkali metal salt. Thereafter, 26 parts of α, α′-paraxylene dichloride and 200 parts of DEDM were charged, the temperature was raised to 75 ° C. with stirring, and the reaction was carried out at the same temperature for 2 hours. After completion of the reaction, the temperature was raised to 100 ° C. under a reduced pressure of 0.0067 MPa, and after all the methanol was distilled off, 480 parts of epichlorohydrin were charged and dissolved by stirring. After uniformly dissolving, maintaining at 75 ° C. under a reduced pressure of 0.024 MPa, 31 parts of 48% aqueous sodium hydroxide solution was added dropwise over 2 hours, and water and epichlorohydrin distilled under reflux were separated in the dropping layer in a separation layer, and epichlorohydrin was separated. Was returned to the reaction vessel, and water was removed from the system to react. After completion of the dropwise addition, the reaction was continued for an additional hour under the same conditions. After completion of the reaction, epichlorohydrin and DEDM were distilled off under reduced pressure, dissolved in 600 parts of toluene, and then the salt produced by washing with water was removed. After further washing with water, toluene as a solvent was distilled off under reduced pressure to obtain 220 parts of an epoxy resin (e8). The epoxy equivalent of the obtained epoxy resin (e8) was 318 g / eq. was.

Examples 1-5 and Comparative Examples 1-3
An epoxy resin, a curing agent, a curing accelerator and a solvent were blended according to the formulation shown in Table 1, and an epoxy resin composition varnish having a nonvolatile content of 50% was obtained. The epoxy resin, the curing agent, and the curing accelerator were used by dissolving in advance in methyl ethyl ketone (hereinafter abbreviated as MEK). After impregnating the obtained epoxy resin composition varnish into a glass cloth (Nittobo Co., Ltd., IPC standard 2116), the impregnated cloth was dried in a hot air circulating oven at 150 ° C. for 8 minutes, and B stage A prepreg was obtained. Furthermore, 4 sheets of the obtained prepreg and copper foil (Mitsui Metal Mining Co., Ltd., 3EC-III, thickness 35 μm) are stacked, and a vacuum press of 2 MPa is performed at a temperature condition of 130 ° C. × 15 minutes + 190 ° C. × 80 minutes, A double-sided copper-clad laminate with a thickness of 0.5 mm was obtained. Using the obtained double-sided copper-clad laminate, glass transition temperature, adhesive strength and water resistance were evaluated. Also, the B-stage resin composition is separated from the glass cloth of the B-stage prepreg and vacuum-pressed at 2 MPa under a temperature condition of 190 ° C. × 80 minutes to obtain a cured product for evaluation of relative dielectric constant and dielectric loss tangent. Obtained. The evaluation results are shown in Table 2.

In Table 1, YD-903N is a bisphenol A type solid epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., Epototo YD-903N, epoxy equivalent = 812 g / eq., Softening point = 96 ° C.), and PN is a phenol novolac resin. (Showa Denko Co., Ltd., Shounol BRG-557, phenolic hydroxy group equivalent = 105 g / eq., Softening point = 86 ° C.), 2E4MZ is 2-ethyl-4-methylimidazole (manufactured by Shikoku Kasei Co., Ltd.) Represent each.

From the results shown in Table 2, Comparative Example 1 has an aliphatic ring structure but is not a compound represented by the general formula (1). Therefore, the water resistance is good, but the adhesive strength is weak and the dielectric properties are poor. Comparative Example 2 is similar to the compound represented by the general formula (1) obtained from the dihydroxy compound and the halogenated alkyl group-containing compound, but has no aliphatic ring structure, so the dielectric loss tangent is low. The relative dielectric constant is not sufficiently lowered. Comparative Example 3 is an example of a general medium molecular epoxy resin, which has good adhesion but is inferior in water resistance and dielectric properties. In contrast, the examples are excellent in adhesive strength, water resistance, and dielectric properties.

Examples 6-8 and Comparative Examples 4-5
An epoxy resin, a curing agent and a curing accelerator were blended according to the blending formulation shown in Table 3, and the mixture was heated and mixed in a heating kneader to obtain a resin composition. Next, after aligning high-strength carbon fibers (Toray Industries, Inc., T700, tensile strength 4.8 GPa, tensile modulus 235 GPa) in one direction, the obtained resin composition is heated and melted, and pressure is applied. Impregnation was performed to obtain a unidirectional carbon fiber prepreg having a resin content of 35%. The obtained prepreg was cut into a length of 30 cm and a width of 30 cm to form a laminate by laminating 17 sheets so that the fiber directions are the same, and after stacking release cloths, stacking bleeder cloths, and further bleeder cloths And wrapped with a nylon pack to form a molding stack. This forming stack was autoclaved at 130 ° C. for 1 hour to obtain a carbon fiber composite material having a fiber volume content of 60%. Evaluation of glass transition temperature, bending strength, and bending elastic modulus was performed using the obtained carbon fiber composite material. In addition, the measurement method of the resin content rate in a prepreg was measured according to JISK7071, and the fiber volume content rate was measured according to JISH7401. Further, the resin composition that was heated and mixed in a heating kneader was vacuum-pressed at 2 MPa under a temperature condition of 190 ° C. × 80 minutes to obtain a cured product for evaluation of relative dielectric constant and dielectric loss tangent. The evaluation results are shown in Table 4.

In Table 3, YD-011 is a bisphenol A type solid epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., Epototo YD-011, epoxy equivalent = 475 g / eq., Softening point = 68 ° C.), and DICY is dicyandiamide (active Hydrogen equivalent = 21 g / eq.), DCMU represents 3,4-dichlorophenyl-1,1-dimethylurea (manufactured by Hodogaya Chemical Co., Ltd.).

From the results shown in Table 4, the dielectric properties are inferior in the comparative example, whereas in the examples, there is no significant difference in strength and the dielectric properties are improved.

Examples 9-11 and Comparative Examples 6-8
An epoxy resin, a curing agent and a curing accelerator were blended according to the blending formulation shown in Table 5, and the mixture was stirred and homogenized while heating to 120 ° C. to obtain an epoxy resin composition. The obtained epoxy resin composition was degassed under reduced pressure, then poured into a mold, and cured in a hot air circulating oven at 150 ° C. for 2 hours and then at 180 ° C. for 3 hours, to obtain a cast cured product. Got. Using the obtained cast cured product, glass transition temperature, relative dielectric constant, dielectric loss tangent, and water absorption were evaluated. The evaluation results are shown in Table 6.

2E4MZ in Table 5 is synonymous with 2E4MZ in Table 1. Further, MH in the table represents a mixture of 4-methylhexahydrophthalic anhydride and hexahydrophthalic anhydride (manufactured by Shin Nippon Rika Co., Ltd., Ricacid MH-700, active hydrogen equivalent = 164 g / eq.).

From the results shown in Table 6, Comparative Example 6 has an aliphatic ring structure but is not a compound represented by the general formula (1), and thus has a low water absorption but is inferior in dielectric properties. Comparative Example 7 is similar to the compound represented by the general formula (1) obtained from the dihydroxy compound and the halogenated alkyl group-containing compound, but the halogenated alkyl group-containing compound does not have a biphenyl structure. Low transition temperature and poor heat resistance. On the other hand, in the embodiment, the dielectric characteristics are improved. Moreover, since the water absorption is low, it is excellent in water resistance.

Claims (11)

The following general formula (1)

(In the formula, n is the number of repetitions and the average value is 0 <n ≦ 10, A represents a divalent group having an aliphatic ring structure, and B is independently a divalent carbonization. An epoxy resin having a structure obtained by reacting a compound represented by a hydrogen group, and R ₁ independently represents a hydrogen atom, a halogen atom or a hydrocarbon group having 1 to 10 carbon atoms) and an epihalohydrin; An epoxy resin composition containing a curing agent as an essential component. A in general formula (1) is general formula (2)

(In the formula, each R ₂ independently represents a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms, and two R ₂ may be bonded to each other to form a ring. K represents an integer of 3 to 12, p represents 0 or 1),
General formula (3)

(Wherein p represents 0 or 1, s represents 0 or 1, and t represents 0 or 1),
Or general formula (4)

(In the formula, p represents 0 or 1.)
The epoxy resin composition according to claim 1, wherein the skeleton is represented by the following formula. The epoxy resin composition according to claim 1 or 2, wherein B in the general formula (1) is a methylene group. The epoxy equivalent of the epoxy resin is 250 to 1000 g / eq. The epoxy resin composition according to any one of claims 1 to 3, which is in a range of The epoxy resin composition according to any one of claims 1 to 4, wherein an active hydrogen group of the curing agent is in a range of 0.4 to 1.2 mol with respect to 1 mol of an epoxy group of the epoxy resin. A prepreg using the epoxy resin composition according to any one of claims 1 to 5. An adhesive sheet using the epoxy resin composition according to any one of claims 1 to 5. The epoxy resin laminated board using the epoxy resin composition of any one of Claims 1-5. An epoxy resin sealing material using the epoxy resin composition according to claim 1. An epoxy resin casting material using the epoxy resin composition according to any one of claims 1 to 5. Hardened | cured material which hardened the epoxy resin composition of any one of Claims 1-5.