JP2016056259A - Epoxy resin-based adhesive composition - Google Patents
Epoxy resin-based adhesive composition Download PDFInfo
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- JP2016056259A JP2016056259A JP2014182858A JP2014182858A JP2016056259A JP 2016056259 A JP2016056259 A JP 2016056259A JP 2014182858 A JP2014182858 A JP 2014182858A JP 2014182858 A JP2014182858 A JP 2014182858A JP 2016056259 A JP2016056259 A JP 2016056259A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 60
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 60
- 239000000853 adhesive Substances 0.000 title claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 42
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 239000006229 carbon black Substances 0.000 claims abstract description 15
- 239000003349 gelling agent Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 239000011258 core-shell material Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract description 2
- 238000002386 leaching Methods 0.000 abstract description 2
- 238000005406 washing Methods 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 238000007665 sagging Methods 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 238000010998 test method Methods 0.000 description 5
- 239000003085 diluting agent Substances 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical class NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 238000010422 painting Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 241000282320 Panthera leo Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003273 ketjen black Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- OWEYKIWAZBBXJK-UHFFFAOYSA-N 1,1-Dichloro-2,2-bis(4-hydroxyphenyl)ethylene Chemical compound C1=CC(O)=CC=C1C(=C(Cl)Cl)C1=CC=C(O)C=C1 OWEYKIWAZBBXJK-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- HJEORQYOUWYAMR-UHFFFAOYSA-N 2-[(2-butylphenoxy)methyl]oxirane Chemical compound CCCCC1=CC=CC=C1OCC1OC1 HJEORQYOUWYAMR-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 1
- IJWIRZQYWANBMP-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-propan-2-ylphenyl)propan-2-yl]-2-propan-2-ylphenol Chemical compound C1=C(O)C(C(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)C)=C1 IJWIRZQYWANBMP-UHFFFAOYSA-N 0.000 description 1
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- HAMNKKUPIHEESI-UHFFFAOYSA-N aminoguanidine Chemical class NNC(N)=N HAMNKKUPIHEESI-UHFFFAOYSA-N 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- -1 boron trifluoride amine Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000004849 latent hardener Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002557 mineral fiber Substances 0.000 description 1
- 229910021382 natural graphite Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、スチール製の家具の筐体加工や車両等の車体パネル等の構造接着に使用されるエポキシ樹脂系接着剤組成物に関する。 The present invention relates to an epoxy resin-based adhesive composition used for housing processing of steel furniture and structural bonding of body panels of vehicles and the like.
従来、スチール製の家具の筐体加工においては、その筐体の所要の面板部に対して面強度を補う補強部材を、当該面板部と補強部材との接触面の少なくとも一部に所定方向ほぼ全域に亘り熱硬化性の接着剤を塗布した上で添設し、当該補強部材を溶接等によるポイント接着によって面板に仮固定した後、熱により接着剤を硬化させて面板部と補強部材とを面接着する方法が採用されている(特許文献1)。また、車両等の構造接着で接着剤とスポット溶接を併用したウェルドボンド工法において、接着剤の塗布時には作業性に優れ、電着塗装工程あるいはその後の洗浄工程においては高粘度となって飛散・流出を防止でき、しかも加温設備やプレヒート設備を不要とし既存の設備で施工可能な、構造用接着剤組成物が提案されている。当該構造用接着剤組成物は、ビスフェノールを原料として合成された20℃で液状の主エポキシ樹脂と、NBR及びSBRから選ばれる少なくとも一種からなり主エポキシ樹脂と反応しない固形ゴム成分と、加熱により活性化されるエポキシ樹脂用潜在性硬化剤と、を含むことが示されている。(特許文献2)。いずれも常温で塗布可能で、スポット溶接後では未硬化状態であり、塗装・焼付時に接着剤が硬化するものである。 Conventionally, in the processing of a housing made of steel furniture, a reinforcing member that supplements the surface strength of a required face plate portion of the housing is provided on at least a part of the contact surface between the face plate portion and the reinforcing member in a predetermined direction. After applying a thermosetting adhesive over the entire area, the reinforcing member is temporarily fixed to the face plate by point bonding by welding or the like, and then the adhesive is cured by heat to bond the face plate portion and the reinforcing member. A surface bonding method is employed (Patent Document 1). Also, in the weld bond method that uses both adhesive and spot welding for structural adhesion of vehicles, etc., it is excellent in workability when applying adhesive, and it becomes highly viscous in the electrodeposition coating process or the subsequent cleaning process, causing scattering and outflow. There has been proposed a structural adhesive composition that can prevent the above-described problem and that can be applied with existing equipment without requiring heating equipment or preheating equipment. The structural adhesive composition is composed of a main epoxy resin that is liquid at 20 ° C. synthesized from bisphenol as a raw material, a solid rubber component that does not react with the main epoxy resin, and is activated by heating, at least one selected from NBR and SBR And a latent curing agent for epoxy resin to be converted. (Patent Document 2). Both can be applied at room temperature, are uncured after spot welding, and the adhesive is cured during painting and baking.
上記の特許文献1のエポキシ樹脂系接着剤組成物は、この種の筐体の板材には通常、亜鉛めっき鋼板などが用いられることが多い点を考慮して、油面接着性があるもの、すなわち脱脂をせずに接着できるものを選定するが、アクリル系やエポキシ系の接着剤では固まってしまうので、硫黄系硬化剤であるポリブタジエンゴム等を用いることが好ましいとされているエポキシ樹脂系接着剤である。また、特許文献2は、塗布時には作業性に優れるとともに、電着塗装工程及びその後の洗浄工程においては高粘度となって飛散・流出を防止するために、エポキシ樹脂と反応しないNBR及びSBRから選ばれる少なくとも一種からなる固形ゴム成分を含んでなるエポキシ樹脂系接着剤組成物である。いずれも塗布時の作業性を確保するために、エポキシ樹脂と反応しないゴム系成分を含むものである。 The epoxy resin-based adhesive composition of the above-mentioned Patent Document 1 has oil surface adhesiveness in consideration of the fact that a galvanized steel sheet or the like is usually used for the plate material of this type of housing. In other words, an adhesive that can be bonded without degreasing is selected. However, since it is hardened by an acrylic or epoxy adhesive, it is preferable to use a polybutadiene rubber or the like that is a sulfur curing agent. It is an agent. Patent Document 2 is selected from NBR and SBR that do not react with an epoxy resin in order to prevent splatter and spillage in the electrodeposition coating process and the subsequent cleaning process, because it is excellent in workability at the time of application and is prevented from scattering and flowing out. An epoxy resin-based adhesive composition comprising at least one solid rubber component. All of them contain a rubber component that does not react with the epoxy resin in order to ensure workability during application.
本発明は、接着剤にエポキシ樹脂と反応しないゴム系成分を含むことなく、常温ではタレることもなく塗布可能であり、スポット溶接後であっても未硬化状態で、溶接後の洗浄・乾燥工程でもタレや浸み出しがなく、塗装・焼付工程で硬化するエポキシ樹脂接着剤組成物を提供することを課題とする。 The present invention does not contain a rubber-based component that does not react with the epoxy resin in the adhesive, can be applied without sagging at room temperature, and is uncured even after spot welding. It is an object of the present invention to provide an epoxy resin adhesive composition that is free from sagging and leaching even in the process and hardens in the painting and baking process.
上記課題を解決するため、本発明のエポキシ樹脂接着剤組成物は、常温で液状のエポキシ樹脂と、加熱により活性化されるエポキシ樹脂用潜在性硬化剤と、ゲル化剤と、カーボンブラックと、を含むエポキシ樹脂系接着剤組成物であって、前記ゲル化剤が、前記エポキシ樹脂と潜在性硬化剤との合計100質量部に対して5〜30質量部配合され、前記カーボンブラックが、前記エポキシ樹脂と潜在性硬化剤との合計100質量部に対して1.5〜4質量部配合されていることを特徴とする。さらに、前記ゲル化剤が、コアシェル型アクリル樹脂粉末であり、前記カーボンブラックが、中空シェル状の導電性カーボンブラックであることを特徴とする。 In order to solve the above problems, the epoxy resin adhesive composition of the present invention includes an epoxy resin that is liquid at room temperature, a latent curing agent for epoxy resin that is activated by heating, a gelling agent, carbon black, An epoxy resin-based adhesive composition containing 5 to 30 parts by mass of the gelling agent with respect to a total of 100 parts by mass of the epoxy resin and the latent curing agent, and the carbon black, 1.5-4 mass parts is mix | blended with respect to a total of 100 mass parts of an epoxy resin and a latent hardener, It is characterized by the above-mentioned. Further, the gelling agent is a core-shell type acrylic resin powder, and the carbon black is a hollow shell conductive carbon black.
常温で液状のエポキシ樹脂と、加熱により活性化されるエポキシ樹脂用潜在性硬化剤と、ゲル化剤と、カーボンブラックと、を含むことにより、本発明のエポキシ樹脂接着剤組成物は、常温ではタレることもなく塗布可能であり、スポット溶接後であっても未硬化状態で、しかも溶接後の洗浄・乾燥工程でもタレや浸み出しがなく、塗装・焼付工程で硬化する接着剤組成物となり、スチール製の筐体や車両等の構造接着に適したものとなる。 The epoxy resin adhesive composition of the present invention includes an epoxy resin that is liquid at room temperature, a latent curing agent for epoxy resin that is activated by heating, a gelling agent, and carbon black. Adhesive composition that can be applied without sagging, is uncured even after spot welding, and does not sag or ooze even after cleaning and drying processes after welding, and cures during painting and baking processes Thus, it is suitable for structural bonding of steel casings and vehicles.
本発明のエポキシ樹脂接着剤組成物は、常温で液状のエポキシ樹脂と、加熱により活性化されるエポキシ樹脂用潜在性硬化剤と、ゲル化剤と、カーボンブラックと、を含むものである。 The epoxy resin adhesive composition of the present invention comprises an epoxy resin that is liquid at normal temperature, a latent curing agent for epoxy resin that is activated by heating, a gelling agent, and carbon black.
常温で液状のエポキシ樹脂としては、ビスフェノールを原料として合成された常温で液状のエポキシ樹脂を用いる。ビスフェノールとしては、ビスフェノールA、ビスフェノールE、ビスフェノールF、ビスフェノールS、ビスフェノールAP、ビスフェノールAF、ビスフェノールB、ビスフェノールBP、ビスフェノールC、ビスフェノールG、ビスフェノールM、ビスフェノールPなどがあり、これらから選ばれる少なくとも一種を原料として合成されたエポキシ樹脂を用いることができる。中でも高粘度のビスフェノールA型エポキシ樹脂が好ましい。 As an epoxy resin that is liquid at room temperature, an epoxy resin that is liquid at room temperature and synthesized from bisphenol is used. Examples of bisphenol include bisphenol A, bisphenol E, bisphenol F, bisphenol S, bisphenol AP, bisphenol AF, bisphenol B, bisphenol BP, bisphenol C, bisphenol G, bisphenol M, and bisphenol P, and at least one selected from these An epoxy resin synthesized as a raw material can be used. Among them, a high viscosity bisphenol A type epoxy resin is preferable.
加熱により活性化されるエポキシ樹脂用潜在性硬化剤としては、グアナミン類、グアニジン類、アミノグアニジン類、ウレア類、イミダゾール類、変性ポリアミン及びこれらの誘導体、ジシアンジアミド、三フッ化ホウ素アミン錯体、有機酸ヒドラジッド、メラミンなどの群から選択して用いることができる。中でも広く用いられているジシアンジアミドが好ましい。なお潜在性硬化剤の添加量は、マトリクスのエポキシ当量に応じて決定される。 Latent curing agents for epoxy resins activated by heating include guanamines, guanidines, aminoguanidines, ureas, imidazoles, modified polyamines and their derivatives, dicyandiamide, boron trifluoride amine complexes, organic acids It can be selected from the group such as hydrazide and melamine. Of these, dicyandiamide, which is widely used, is preferable. The addition amount of the latent curing agent is determined according to the epoxy equivalent of the matrix.
ゲル化剤としては、シランカップリング剤等により表面処理したシリカ粉末、セピオライトなどの鉱物繊維、アクリル樹脂系コアシェル型微粉末などがあり、中でもエポキシ樹脂の補強剤としても使用されるアクリル樹脂系コアシェル型微粉末が好ましく、市販品としてゼフィアックF351(商品名、アイカ工業社製)がある。当該アクリル樹脂系コアシェル型微粉末は、エポキシ樹脂に対して容易に分散でき、プレゲル性とエポキシ樹脂が完全硬化したときにシェル層が熔解して高い接着強度と応力緩和性を有するものである。前記ゲル化剤は、前記エポキシ樹脂と潜在性硬化剤との合計100質量部に対して5〜30質量部配合され、5質量部未満ではスポット溶接後の洗浄・乾燥したときにタレが生じ、30質量部超では、タレは生じないものの塗布できなくなる。好ましくは、8〜25質量部である。 Examples of gelling agents include silica powder surface-treated with a silane coupling agent, mineral fibers such as sepiolite, and acrylic resin-based core-shell fine powder. Among them, acrylic resin-based core shells that are also used as epoxy resin reinforcing agents Type fine powder is preferable, and Zefiac F351 (trade name, manufactured by Aika Kogyo Co., Ltd.) is a commercially available product. The acrylic resin-based core-shell fine powder can be easily dispersed with respect to the epoxy resin, and has a pre-gel property and a high adhesive strength and stress relaxation property by melting the shell layer when the epoxy resin is completely cured. The gelling agent is blended in an amount of 5 to 30 parts by mass with respect to a total of 100 parts by mass of the epoxy resin and the latent curing agent, and when less than 5 parts by mass, sagging occurs when washed and dried after spot welding, If it exceeds 30 parts by mass, no sagging occurs, but application is impossible. Preferably, it is 8-25 mass parts.
カーボンブラックは、タレ防止剤としても働くが、カーボンブラックを添加することにより、当該エポキシ樹脂接着剤組成物は導電性を持つ接着剤組成物となる。そのため、スポット溶接時において、分流する電流は少なく、溶接電流は電極間を直線的に流れる状態となり、被着体間の電流密度を増加させることができ、板隙の有無にかかわらず被着体間にナゲットを形成することができる。前記カーボンブラックとしては、人造黒鉛粉末、天然黒鉛粉末等が用いられ、中でも導電性に優れる中空シェル状のカーボンブラックが好ましく、市販品としてケッチェンブラック(商品名、ライオン社製)がある。前記カーボンブラックは、前記エポキシ樹脂と潜在性硬化剤との合計100質量部に対して1.5〜4質量部配合され、1.5質量部未満ではスポット溶接後の洗浄・乾燥したときにタレが生じ、4質量部超ではタレは生じないものの作業性に劣る。好ましくは、2〜3.5質量部である。 Carbon black also acts as a sagging inhibitor, but by adding carbon black, the epoxy resin adhesive composition becomes an adhesive composition having conductivity. Therefore, during spot welding, there is little current to be shunted, and the welding current flows in a straight line between the electrodes, and the current density between the adherends can be increased. A nugget can be formed between them. As the carbon black, artificial graphite powder, natural graphite powder, or the like is used. Among them, hollow shell-shaped carbon black having excellent conductivity is preferable, and a commercially available product is Ketjen Black (trade name, manufactured by Lion Corporation). The carbon black is blended in an amount of 1.5 to 4 parts by mass with respect to a total of 100 parts by mass of the epoxy resin and the latent curing agent. When the amount exceeds 4 parts by mass, sagging does not occur, but the workability is poor. Preferably, it is 2-3.5 mass parts.
上記の成分に加えて、DBU、DBN、トリス(ジメチルアミノメチル)フェノール、
1−シアノエチル−2−エチル−4−メチルイミダゾール、2−エチル−4−メチルイミダゾール、トリフェニルホスフィン、テトラフェニルホスホニウム、3−フェニル−1,1−ジメチルウレア、DCMUなどの硬化促進剤(触媒)を添加することができる。
In addition to the above components, DBU, DBN, tris (dimethylaminomethyl) phenol,
Curing accelerators (catalysts) such as 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazole, triphenylphosphine, tetraphenylphosphonium, 3-phenyl-1,1-dimethylurea, DCMU Can be added.
また、n−ブタノールグリシジルエーテル、高級アルコールグリシジルエーテル、ブチルフェニルグリシジルエーテル、メタクリル酸グリシジルエステル等の一官能型反応性希釈剤、あるいは1,4−ブタンジオールジグリシジルエーテル、1,6−ヘキサンジオールグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、ポリエチレングリコールジグリシジルエーテルなどの多官能型の反応性希釈剤を添加することもできる。 Also, monofunctional reactive diluents such as n-butanol glycidyl ether, higher alcohol glycidyl ether, butylphenyl glycidyl ether, glycidyl methacrylate, or 1,4-butanediol diglycidyl ether, 1,6-hexanediol glycidyl Polyfunctional reactive diluents such as ether, trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, and the like can also be added.
さらに、必要に応じて炭酸カルシウム、硫酸バリウム、タルクなどの体質顔料(充填材)、酸化チタン、酸化鉄などの着色顔料を添加することができる。 Furthermore, extender pigments (fillers) such as calcium carbonate, barium sulfate, and talc, and color pigments such as titanium oxide and iron oxide can be added as necessary.
以下、本発明のエポキシ樹脂接着剤組成物について、実施例、比較例に基づき説明する。なお、本発明のエポキシ樹脂接着剤組成物は、以下の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において、当業者が行い得る変更、改良等を施した種々の形態にて実施することができる。 Hereinafter, the epoxy resin adhesive composition of this invention is demonstrated based on an Example and a comparative example. Note that the epoxy resin adhesive composition of the present invention is not limited to the following forms, and can be variously modified and improved by those skilled in the art without departing from the gist of the present invention. Can be implemented.
常温で液状のエポキシ樹脂としてビスフェノールA型エポキシ樹脂jER828(商品名、三菱化学社製)95質量部、ビスフェノールA型エポキシ樹脂jER828と潜在性硬化剤であるジシアンジアミドを6:4の重量比で混練したJDY−7DISYJ(アイカ工業社製)30質量部、ゲル化剤としてコアシェル型アクリル樹脂粉末であるゼフィアックF351(商品名、アイカ工業社製)10質量部、カーボンブラックとしてケッチェンブラックEC300J(商品名、ライオン社製)3重量部、触媒としてDCMU−99(商品名、保土谷化学工業社製)6質量部、反応性希釈剤として2官能型反応性希釈剤であるED−503(商品名、ADEKA社製)30質量部を攪拌混合し、実施例1のエポキシ樹脂接着剤組成物を得た。 95 parts by mass of bisphenol A type epoxy resin jER828 (trade name, manufactured by Mitsubishi Chemical Corporation) as a liquid epoxy resin at normal temperature, bisphenol A type epoxy resin jER828 and dicyandiamide as a latent curing agent were kneaded at a weight ratio of 6: 4. 30 parts by mass of JDY-7DISYJ (manufactured by Aika Industry Co., Ltd.), 10 parts by mass of Zefiac F351 (trade name, manufactured by Aika Industry Co., Ltd.) which is a core-shell type acrylic resin powder as a gelling agent, and Ketjen Black EC300J (product name, 3 parts by weight of Lion), 6 parts by mass of DCMU-99 (trade name, manufactured by Hodogaya Chemical Co., Ltd.) as a catalyst, and ED-503 (trade name, ADEKA) which is a bifunctional reactive diluent as a reactive diluent 30 parts by mass) were mixed with stirring to obtain an epoxy resin adhesive composition of Example 1.
以下同様にして、表1に示す配合にて実施例2〜4、および比較例1〜2のエポキシ樹脂接着剤組成物を得た。 In the same manner, epoxy resin adhesive compositions of Examples 2 to 4 and Comparative Examples 1 to 2 were obtained with the formulations shown in Table 1.
<接着剤の評価>
実施例および比較例の各エポキシ樹脂接着剤組成物の粘度、タレ性、および接着強さを以下の試験方法により評価した。
<Evaluation of adhesive>
The viscosity, sagging property, and adhesive strength of the epoxy resin adhesive compositions of Examples and Comparative Examples were evaluated by the following test methods.
[試験方法/粘度]
B型粘度計(型式BH2)を用い、ローター7、回転速度2rpm、液温23℃にて各エポキシ樹脂接着剤組成物の粘度を測定した。
[Test method / viscosity]
Using a B-type viscometer (model BH2), the viscosity of each epoxy resin adhesive composition was measured at a rotor 7, a rotational speed of 2 rpm, and a liquid temperature of 23 ° C.
[試験方法/タレ性]
圧延鋼板SPCC−SDに各エポキシ樹脂接着剤組成物を厚さ2mmとなるように塗布した試験体を140℃の恒温槽中に垂直に立て、10分後に目視にてタレの度合いを評価した。垂れないものを○、わずかに垂れるが使用可能であるものを△、垂れたものを×とした。
[Test method / sag]
The test body which apply | coated each epoxy resin adhesive composition to the rolled steel plate SPCC-SD so that it might become thickness 2mm was set up vertically in a 140 degreeC thermostat, and the degree of sagging was evaluated visually 10 minutes afterward. Those that did not sag were rated as ◯, those that sag slightly but could be used were marked as △, and those that sagged were marked as x.
[試験方法/接着強さ:スポット溶接後のT剥離強さ]
厚さ1.6mm、巾25mm、長さ100mmの圧延鋼板SPCC−SDを平坦部が50mmとなるようにL字状に曲げ、前記平坦部に厚さ0.5mmとなるように各エポキシ樹脂接着剤組成物を塗布した被着体の塗布面同士を重ねた。重ねた鋼板の平坦部に交流式スポット溶接機にて均等間隔で3点仮固定し、各試験体を得た。試験体の非塗布面端部をつかみ、インストロン社製万能試験機を用い、18℃の雰囲気下で100mm/分にてT字型に剥離し、その強さを測定した。
[Test method / Adhesion strength: T peel strength after spot welding]
A rolled steel plate SPCC-SD having a thickness of 1.6 mm, a width of 25 mm, and a length of 100 mm is bent in an L shape so that the flat portion is 50 mm, and each epoxy resin is bonded to the flat portion so that the thickness is 0.5 mm. The coated surfaces of the adherends coated with the agent composition were overlapped. Three points were temporarily fixed to the flat portion of the stacked steel plates with an AC spot welder at equal intervals to obtain each specimen. The end of the non-coated surface of the test specimen was grasped and peeled into a T-shape at 100 mm / min in an atmosphere of 18 ° C. using an Instron universal testing machine, and the strength was measured.
[試験方法/接着強さ:T剥離強さ]
厚さ1.6mm、巾25mm、長さ100mmの圧延鋼板SPCC−SDを平坦部が50mmとなるようにL字状に曲げ、前記平坦部に厚さ0.5mmとなるように各エポキシ樹脂接着剤組成物を塗布した被着体の塗布面同士を重ね、クリップ留めした。次いで、クリップ留めした状態で140℃−15分加熱した後、更に190℃−15分加熱し、エポキシ樹脂を硬化させ、各試験体を得た。試験体の非塗布面端部をつかみ、インストロン社製万能試験機を用い、23℃の雰囲気下で100mm/分にてT字型に剥離し、その強さを測定した。
[Test method / Adhesion strength: T peel strength]
A rolled steel plate SPCC-SD having a thickness of 1.6 mm, a width of 25 mm, and a length of 100 mm is bent in an L shape so that the flat portion is 50 mm, and each epoxy resin is bonded to the flat portion so that the thickness is 0.5 mm. The coated surfaces of the adherends coated with the agent composition were overlapped and clipped. Next, after heating at 140 ° C. for 15 minutes in a clipped state, the coating was further heated at 190 ° C. for 15 minutes to cure the epoxy resin, thereby obtaining each specimen. The end of the non-coated surface of the test specimen was grasped and peeled into a T shape at 100 mm / min in an atmosphere of 23 ° C. using an Instron universal testing machine, and the strength was measured.
[試験結果]
表2に、各エポキシ樹脂接着剤組成物の性能評価結果を示す。
[Test results]
In Table 2, the performance evaluation result of each epoxy resin adhesive composition is shown.
上記の結果から、ゲル化剤はエポキシ樹脂接着剤組成物の塗布作業性と硬化後の接着強さに作用する一方で、カーボンブラックは前記エポキシ樹脂接着剤組成物の粘性だけではなく、溶接精度を作用する。 From the above results, while the gelling agent affects the workability of the epoxy resin adhesive composition and the adhesive strength after curing, carbon black is not only the viscosity of the epoxy resin adhesive composition but also the welding accuracy. Act.
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CN109554140A (en) * | 2018-12-05 | 2019-04-02 | 芜湖海程橡塑有限公司 | A kind of sealant for spot welding and preparation method thereof suitable for plates a variety of on automobile |
CN109554140B (en) * | 2018-12-05 | 2020-09-11 | 海程新材料(芜湖)有限公司 | Spot welding sealant suitable for various plates on automobile and preparation method thereof |
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