JP2016025220A - Mounting structure of insertion component, circuit board, and manufacturing method of electronic circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high quality printed circuit board.SOLUTION: According to one example of the invention, in a mounting structure of an insertion component, a circuit board having a through hole is joined to the insertion component inserted into the through hole by soldering. A clearance formation part, which forms a clearance on a surface where the circuit board and a bottom surface of the insertion component face each other, is formed at an outer periphery part of the bottom surface.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mounting structure for an insertion part, a circuit board, and an electronic circuit device manufacturing method.

For joining electronic components and circuit boards, Sn-37Pb (unit: mass%), which can be soldered at around 220 ° C, and lead-free solder alloy Sn-3Ag-0.5Cu (unit: mass%) that does not use lead ) Is used.
As a method for joining the circuit board and the electronic component, there are mainly “reflow method” and “flow method”.
Generally in this field, when joining circuit boards and electronic components, the solder ball generation rate is low, the solder filling amount can be secured by solder paste printing, and the mounting position of the components is designed. It is said that a high-quality circuit board is close to the expected state. Under such circumstances, a circuit board having high reliability for solder bonding is desired.

  The “reflow method” is a solder joint method mainly used for joining surface mount components. Solder paste is printed on the electrodes formed on the substrate for bonding surface-mounted components using a solder paste printing mask with openings in any shape. It is a process of melting and solidifying and joining.

  On the other hand, the “flow method” used for joining insert components inserts the lead of the insert component into a through-hole having a land formed for inserting the lead of the insert component on the board, In this process, molten solder is supplied from the lower surface to fill the through holes with solder and to join the lands and the leads of the insertion component.

In addition to these processes, there is a “insert part reflow method” joining process in which the insert parts are soldered together with the surface mount parts.
In surface mounting, an electrode is formed on a substrate facing a component to be surface mounted, a solder paste is printed on the electrode on the substrate using a printing mask having an arbitrary opening shape on the electrode, and then the surface mounting component is mounted. Install and melt and solidify the solder paste in a reflow oven. In the reflow bonding process for insert parts, an opening is also formed for the insert part electrodes in the printing mask, the solder paste is applied onto the electrodes of the insert part during solder paste printing, and the insert part is inserted into the through-hole in the reflow furnace. This is a process for completing the joining.

  Patent Document 1 states that “an electronic component having a printed wiring board having a plurality of through-hole portions, and a plurality of lead members protruding from the component main body and inserted into the through-hole portions and solder-connected. And a spacer member provided between the component main body and the printed wiring board, and at least a part of the spacer member is provided between the one lead member and the other lead member. Printed circuit board (refer to claim 1) ".

JP 2008-140869 A

In the insert component reflow bonding process, securing the solder filling amount in the through hole after the reflow bonding is a problem. A printed board is widely used with a thickness of about 0.8 mm to 2.4 mm, but a board with a thickness of about 5 mm is also used for industrial equipment and information equipment. Moreover, although the diameter of the through hole of the substrate depends on the lead thickness of the component, there are many ones of about 0.6 mm to 1.2 mm. On the other hand, the thickness of the solder paste printing mask for supplying the solder paste depends on the electrode size of the surface mount component.
For example, the thickness of a solder paste printing mask for fine chip parts such as 0603 is 0.08 to 0.15 mm. When the solder paste printing mask becomes thicker, the ability of the solder paste to be removed from the printing hole after printing is reduced, the solder paste remains in the opening of the solder paste printing mask, and a certain amount of solder paste is formed on the substrate electrode. It becomes difficult. For this reason, there is a limit to the thickness of the solder paste printing mask, and there are many masks having a thickness of 0.2 to 0.3 mm or less for mounting a normal surface-mounted component.
Also, the solder paste printing mask can partially change the mask thickness by etching, etc., but if the local mask thickness is greatly different, the squeegee that pushes the solder paste during paste printing will cause the plate to separate from the printing mask, There is a possibility of causing uneven printing and insufficient solder paste. Specifically, the difference between the maximum thickness and the minimum thickness in the solder paste printing mask is said to be approximately 0.1 mm to 0.2 mm.

  Furthermore, the solder paste is a material in which solder grains and flux are mixed, and the remaining solder volume after heating is approximately 50% to 60% of the solder paste volume in many cases. For this reason, in order to secure the solder filling ratio after melting only by solder paste printing, the solder paste printing mask opening diameter should be larger than the land diameter of the inserted component electrode to ensure the amount of solder on the board surface. At least one of filling the solder paste into the through hole during printing and securing the amount of solder and supplying the solder paste by a separate process is required.

  As described above, it is necessary to determine the metal mask thickness in order to secure the solder filling amount, but there are various types of inserted parts such as connectors, aluminum electrolytic capacitors, DC-DC converters, etc. There is also a component in which the distance between the bottom surface portion of the inserted component and the substrate cannot be maintained more than the metal mask thickness after the component is inserted. Further, as the through-hole diameter increases, it becomes important to secure a necessary amount of solder paste, so that the opening of the metal mask needs to be larger than the outer periphery of the component.

In Patent Document 1, a configuration is adopted in which a spacer member is installed between leads of components. When this configuration is adopted, the case where a narrow pitch connector having a pitch of 2.0 mm or less is used is not considered, and it is difficult to install a spacer on the bottom surface of such a narrow pitch connector.
Further, an adhesive is required to fix the spacer, and there is a possibility that poor connection is caused by contact not only on and around the electrodes provided on the printed circuit board but also in the through holes.
In addition, since the spacer is formed on the inner side of the part than the lead, if the lead position of the part is biased, the part will be tilted, and the solder ball will be removed by a reflow process with the solder paste and the inserted part in contact with each other. It is likely to be generated.
The generation of the solder balls causes contact failure and cracks because the amount of solder to be connected cannot be secured. In addition, there is a possibility of causing a short circuit by touching the electrodes and components of the substrate with the solder balls.

That is, regarding joining by the reflow process of an insertion component, it is desired to reduce generation | occurrence | production of a solder ball and to ensure a fixed amount of solder filling by solder paste printing.
There is also a need to improve the reliability of solder joints.
Also, in the process of surface mounting an insert component using a solder paste, it is desired that the through hole be filled with solder before the component is inserted.

  In view of the above problems, an object of the present invention is to provide a structure of a high-quality insertion component circuit board.

  According to an embodiment of the present invention, there is provided a mounting structure for an insertion component, in which the circuit board having a through hole and the insertion component inserted into the through hole are joined by soldering. And a gap forming portion that forms a gap on a surface facing the bottom surface of the insertion part is formed on the outer peripheral portion of the bottom surface.

  According to an example of the present invention, in a circuit board that has a through hole and is joined to an insertion part inserted into the through hole by soldering, the circuit board faces the bottom surface of the insertion part. A gap forming portion forming a gap on the surface is formed on the outer peripheral portion of the bottom surface.

  According to an example of the present invention, there is provided a method of manufacturing an electronic circuit device having a circuit board in which an insertion part and a circuit board having a through hole are joined by soldering, and soldering is performed on a surface on which the insertion part of the circuit board is mounted. A step of installing a metal mask for paste printing and applying a solder paste, a step of inserting an insertion pin of an insertion part into the through hole from the upper surface of the applied solder paste, and a reflow process from the surface side of the circuit board A step of melting the applied solder paste and moving and solidifying it between the through hole and the insertion pin, and forming a gap constituting the gap on the surface where the circuit board and the bottom surface of the insertion component face each other. It is formed in the part.

  According to the present invention, the reliability of solder joint can be improved.

It is sectional drawing which passes along the axial center of the insertion pin of the insertion component inserted in the through hole formed in the printed circuit board in the solder joint part of the insertion component and printed circuit board in 1st embodiment of this invention. It is sectional drawing which shows the flow of the process of the reflow joining of the insertion component which is 1st embodiment of this invention. It is drawing which permeate | transmitted the component from the component upper surface in the solder joint part of the insertion component which is 1st embodiment of this invention, and the printed circuit board after the component insertion. It is sectional drawing which passes along the axial center of the insertion pin of the insertion component inserted in the through hole formed in the printed circuit board in the solder joint part of the insertion component and printed circuit board in 2nd embodiment of this invention. It is sectional drawing which passes along the axial center of the insertion pin of the insertion component inserted in the through hole formed in the printed circuit board in the solder joint part of the insertion component and printed circuit board in 3rd embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross section passing through the axis of an insertion pin 22 of an insertion component 20 inserted into a through hole formed in a printed circuit board 10 at a solder joint between the insertion component and a circuit board in the first embodiment of the present invention. FIG.

In FIG. 1, 10 is a printed circuit board (circuit board), 11 is a gap forming projection, 12 is a land electrode, 13 is a resist, 14 is solder, 20 is an insertion component, and 21 is an insertion component side projection.
There are various types of mounting boards (circuit boards) for insertion parts, such as printed boards, ceramic boards, flexible boards, and metal core boards. In this embodiment, the mounting boards (circuit boards) are collectively referred to as “printed boards”. To do.

As shown in FIG. 1, the insertion component 20 has an insertion component-side projection 21 for providing a gap between the insertion component 20 and the printed circuit board 10 on the outer peripheral portion. Further, a gap forming projection 11 is formed on the printed circuit board 10 facing the insertion component side projection 21.
The land electrode 12 and the insertion pin 22 are joined by the solder 14. Moreover, although the SMD (Solder Mask Defined) shape in which the resist 13 is formed on the land electrode 12 is shown, it may be formed by NSMD (Non Solder Mask Defined).

  The insertion component side protrusion 21 and the gap forming protrusion 11 employed in this embodiment will be described below with reference to FIG.

Since a general solder paste has a solder content of 50% to 60%, the volume of the solder after reflow is reduced by 40% to 50% compared to the solder paste. Therefore, in the solder paste printing step, it is necessary to supply the solder paste 15 in an amount that can fill the through hole with the solder after the reflow process.
In a normal printing process, the solder paste 15 is filled into the through hole by pressing with the squeegee 30.
However, when the pressure applied by the squeegee 30 and the frictional force generated on the solder paste 15 from the inner wall surface of the through hole are substantially equal, the filling limit of the solder paste 15 is reached, so that an appropriate amount of the solder paste 15 can be obtained. Supply may not be possible.

On the other hand, as a method for increasing the amount of solder paste other than filling the through hole, increasing the opening size of the metal mask 31 for paste printing can be mentioned.
The required solder amount can be ensured by increasing the opening size of the paste printing metal mask 31. However, when the printed board 10 is thick, the through-hole diameter is large, or the insertion pin 22 is thin. It is necessary to increase the opening size of the metal mask 31 for paste printing.

When it is necessary to print the solder paste 15 outside the outer size of the insertion part 20 by increasing the opening size, the outer peripheral protrusion of the insertion part 20 contacts the solder paste 15 in the insertion part 20 having the protrusion on the outer periphery. There is a high possibility of dividing the solder paste 15 printing area.
The solder paste 15 in the divided area cannot be agglomerated in the through holes by self-alignment when the solder is melted, and remains on the surface of the printed circuit board 10 as solder balls.
Since this solder ball causes a short circuit defect, it is necessary to reduce the occurrence.
Even when the printed region of the solder paste 15 does not protrude from the outer periphery of the insertion component 20, the gap between the bottom surface of the insertion component 20 and the surface of the printed circuit board 10 is greater than the thickness of the paste printing metal mask 31. If the gap is not ensured, the solder paste 15 may be crushed by the insertion part 20 when the insertion part 20 is inserted and spread to adjacent lands or may be pushed out, which may cause a short circuit or generation of solder balls. Is expensive.

  Thus, in order to fill the through hole with solder by supplying the solder paste from the component insertion surface side, a gap larger than the thickness of the paste printing metal mask 31 is secured between the insertion component 20 and the printed board 10. It becomes a problem to do.

Therefore, there is a need for a method that secures a gap larger than the thickness of the paste printing metal mask 31 between the insertion component 20 and the printed circuit board 10 and realizes solder filling into the through hole by self-alignment when the solder paste 15 melts. It becomes.
If a spacer is bonded between the insertion pins as shown in Patent Document 1 to secure a gap, the spacer occupies an area where the solder paste can be printed, so that solder is secured in the through hole adjacent to the spacer. It becomes difficult. In addition, since there is no support on the outer periphery of the component, the surface of the printed circuit board and the component surface are not parallel when the component is inserted, and inclination tends to occur. Furthermore, since a process for bonding the spacer with an adhesive is required, the manufacturing process becomes complicated.

As a method for solving the problem, a first embodiment of the present invention will be described. FIGS. 2A, 2B, and 2C are cross-sectional views showing the flow of the reflow bonding process of the insertion part according to the first embodiment of the present invention.
In FIG. 2, 30 is a squeegee and 31 is a metal mask for paste printing. Other configurations are the same as those in FIG. The material for the mask for solder paste printing is also various, such as metal or resin, but in this embodiment, it will be described as a metal mask.

In this embodiment, as shown in FIG. 2A, the solder paste 15 is printed in the opening of the paste printing metal mask 31. Although FIG. 2A shows that the solder paste 15 is printed also on the gap forming protrusions 11 formed on the printed board 10, the solder paste 15 may not be printed. When the solder paste 15 is printed on the gap forming projections 11, it becomes easy to secure the amount of solder.
Through this process, the solder paste 15 is also pushed into the through hole formed in the printed circuit board 10 to fill the through hole. It is desirable to perform this process in the same process as the solder paste printing process for other surface mount components mounted on the same surface. However, paste printing for surface mount components and paste printing for through-hole electrodes for insert components is required. It may be performed separately. In addition, it is desirable to form the gap forming protrusions 11 simultaneously in the process of forming the land electrodes 21, but this is not restrictive.
The gap forming protrusion 11 may be made of the same material as the printed board 10. In this case, it is possible to make a printed circuit board at the time of creation.
Moreover, it may be a separate body from the printed circuit board 10, and in that case, it can be attached by applying an adhesive or pressure. Even when it is attached using an adhesive, since there is no adhesive between the pins of the electronic component, there is no effect on the land between the pins and the solder paste, and the solder ball generation rate is reduced. Alternatively, the resist 13 can be formed by thick coating or multiple coatings. In this case, since the gap forming protrusion 11 is constituted by the resist 13, it is not necessary to process the substrate itself.

Next, as shown in FIG. 2B, the metal mask 31 for paste printing is removed. Further, the insertion pin 22 of the insertion component 20 is inserted into the through hole of the printed board 10. At this time, a part of the solder paste 15 filled in the through hole is pushed out by the insertion pin 22 and adheres to the tip of the insertion pin 22. Further, the insertion component side protrusion 21 formed on the insertion component 20 is supported by the gap forming protrusion 11, whereby a gap can be formed between the insertion component 20 and the printed board 10.
The gap interval d (in FIG. 1) is made larger than the thickness of the paste printing metal mask 31. For example, when the thickness of the paste printing metal mask 31 is 0.2 mm, the protrusions may be formed so that the distance d is larger than 0.2 mm.

In the present embodiment, the insertion component side projection 21 and the gap formation projection 11 are formed on the component side and the substrate side, respectively, but may be formed on at least one of them. By forming the gap forming protrusions 11 between a plurality of insertion pins 22 formed on the insertion component 20 and the outer periphery of the insertion component 20, a region for forming the solder paste 15 between the insertion pins 22 can be secured.
Furthermore, the inclination of the insertion component 20 is suppressed by forming a plurality of, for example, three or more points, between the insertion pin 22 formed with a plurality of gap forming projections 11 on the insertion component 20 and the outer periphery of the insertion component 20. be able to.

  The solder paste 15 is melted by heating in a reflow furnace in the state of FIG. At this time, the solder paste 15 attached to the tip of the insertion pin 22 moves into the through hole by getting wet with the insertion pin 22, or the solder paste 15 printed on the printed circuit board 10 other than on the land electrode 12 is By agglomerating onto the land electrode 12 and moving into the through hole, the solder 14 is formed in the through hole as shown in FIG.

FIG. 3 is a view showing the state after the component is inserted from the upper surface of the component in the solder joint between the inserted component and the printed circuit board according to the first embodiment. In FIG. 3, the description of the already described numbers is omitted.
When the through-hole diameter is large, the substrate is thick, the insertion pin is thin, or the metal mask is thin, the amount of solder that needs to be filled in the through-hole increases. As shown, a suitable solder amount can be filled by increasing the metal mask opening diameter.

As shown in FIG. 3, when the metal mask opening region protrudes from the outer shape of the insertion component 20, there is a high possibility that a solder ball will be generated.
Therefore, the gap between the printed circuit board 10 and the insertion component 20 is secured by forming the insertion component side projection 21 and the gap forming projection 11 on the outer periphery of the insertion component 20. In FIG. 3, protrusions are illustrated at four places on the outer peripheral corner portion of the insertion component 20.

In addition, it is possible to form a gap by supporting (holding) at least one place, but there is a possibility that a component may be inclined. Therefore, the inclination on the diagonal line can be suppressed by supporting (holding) the two diagonal lines.
Here, the outer peripheral portion refers to a region from the outer side to the end face of the component from the outermost insertion pin provided on the component. The inner periphery refers to a region different from the outer periphery. That is, the area that connects the insertion pins and that is on the center side of the component is the inner periphery.
In the case of supporting three locations in the vicinity of the outer periphery (preferably about 5 to 10% from the size of the entire part), a triangular plane connecting the three supported (held) locations is constructed, so that the inclination Is less likely to occur and the parts are stable.

These supports (holdings) can be configured by reflow to form the gap from the pin of the through hole and the member constituting the gap if a suitable gap is configured between the component and the printed circuit board at the time of reflow. If there are at least one member constituting the gap (such as the gap-forming protrusions 11), the present invention can be implemented.
The shape of the gap forming projection 11 and the insertion component side projection 21 may be any shape as long as it can be supported, such as a cylinder, an elliptical column, a rectangular parallelepiped, a cube, a polygonal column, or a cone. It may have a structure that has a concave shape and a convex shape, and helps to fix the parts by fitting the concave and convex portions. In this case, it becomes possible to arrange components accurately with respect to the printed circuit board.

In addition, when a cone or a pyramid is used for the insertion component side protrusion 21 on the bottom surface of the electronic component, a suitable gap is formed by inserting a cone or a pyramid by providing a hole such as a through hole on the printed circuit board side. It becomes possible to do. In this case, it is only necessary to provide a hole on the printed circuit board side, and the pattern can be made conductive as a through hole, which can be used effectively in circuit design. In addition, the gap can be freely changed by changing the size of the hole with respect to the cone or pyramid of the electronic component. This configuration can also be adopted in other embodiments. In particular, the gap structure is separated. Also, as described above, since the volume of solder after reflow is reduced by 40% to 50% compared to the solder paste, the height to support (hold) is the height of solder after reflow. It is desirable to have a height that is approximately twice the height.

Here, in the present specification, the gap forming member 16, the gap forming projection 11, and the insertion component side projection 21 are collectively referred to as a gap forming portion or a gap constituting portion.
By forming such protrusions, the solder paste that is printed out of the outer shape of the component can move into the through hole due to self-aggregation when the solder is melted, and the generation of solder balls can be suppressed.

  According to this embodiment, with respect to the soldering in the surface mounting process of the insertion part which has conventionally generated the solder ball, a gap more than the thickness of the metal mask for paste printing is secured between the insertion part and the printed board. Thus, it is possible to realize solder filling into the through hole by self-alignment when the solder paste is melted. Furthermore, by ensuring a sufficient amount of solder in the through hole, it is possible to improve the solder joint reliability at the time of thermal fatigue load. In addition, since it is not necessary to add a new process, the number of man-hours does not increase and the tilt of the inserted part can be prevented.

  FIG. 4 is a cross-sectional view passing through the axis of the insertion pin of the insertion component inserted into the through hole formed in the printed circuit board in the solder joint between the insertion component and the printed circuit board in the second embodiment of the present invention. In FIG. 4, description of the numbers already given is omitted.

  In the present embodiment, the gap forming protrusion 11 on the printed circuit board 10 is configured to be higher than the height of the metal mask 31, and the insertion component side protrusion 21 described in the first embodiment is not used. Thereby, in addition to the effect of the first embodiment, there is no restriction on the shape of the insertion part 20, that is, the part selection range is widened because the insertion part does not require processing. That is, the present invention can be carried out even if general components are used. Further, the height can be adjusted only on the substrate side. In the present embodiment, the cross-sectional shape of the gap forming projection 11 is shown as a square, but the shape is not limited to a square such as a polygon, an ellipse, or a star that can ensure the above effect.

  FIG. 5 is a cross-sectional view passing through the axis of the insertion pin of the insertion component inserted into the through hole formed in the printed circuit board in the solder joint between the insertion component and the printed circuit board in the third embodiment of the present invention. In FIG. 5, the description of the already described numbers is omitted.

In this embodiment, the gap forming member 16 secures a gap between the printed circuit board 10 and the insertion component 20. Thereby, in addition to the effect of the first embodiment, the layout of the gap forming member 16 can be performed after the printed circuit board 10 is completed, so that the degree of freedom of the protrusion forming position is increased.
In addition, since it is not necessary to change the design or production method of the printed circuit board 10 itself, the present invention can be applied even if an existing printed circuit board is to be reflowed.
In addition, by changing the height or material of the gap forming member 16, it is possible to form a protrusion that follows the shape of the insertion component 20. This following protrusion increases the stability of the inserted part. It is preferable that the contact surface between the bottom surface of the gap forming member 16 and the printed circuit board 10 and the contact surface between the ceiling surface of the gap forming member 16 and the bottom surface of the insertion component be substantially parallel. That is, when the bottom surface of the inserted component and the component-side surface of the printed circuit board 10 are substantially parallel, the sense of stability increases and the inclination of the component decreases. The material of the gap forming member 16 may be a metal such as copper, aluminum or iron, or may be a resin such as epoxy or an elastic body such as rubber. Further, it can be attached by applying an adhesive or pressure. Even if it is attached using an adhesive, there is no effect on the land between the pins and the solder paste because no adhesive is formed between the inner periphery and the pins of the electronic component. The incidence of solder balls is reduced.
Further, like the first embodiment, the gap forming member 16 may be configured at least at three locations on the outer peripheral portion. This is because a triangular plane is formed and is stable.

  In the present embodiment, the cross-sectional shape of the gap forming member 16 is shown as a square. However, the shape is not limited to a square such as a polygon, an ellipse, or a star that can ensure the above effect.

DESCRIPTION OF SYMBOLS 10 Printed board 11 Gap formation protrusion 12 Land electrode 13 Resist 14 Solder 15 Solder paste 16 Gap formation member 20 Insertion part 21 Insertion part side protrusion 22 Insertion pin 30 Squeegee 31 Metal mask for paste printing

Claims (15)

In a mounting structure of an insertion part in which a circuit board having a through hole and an insertion part inserted into the through hole are joined by soldering,
A mounting structure for an insertion part, wherein a gap constituting part that forms a gap is formed on a surface of the circuit board and a bottom surface of the insertion part facing each other on an outer peripheral part of the bottom surface. In the mounting structure of the insertion part according to claim 1,
The gap component is configured by having a convex shape on the bottom surface,
The insertion component mounting structure is characterized in that the insertion component is held by a surface of the circuit board facing the convex shape that contacts the convex shape. In the mounting structure of the insertion part according to claim 1,
The gap component is configured by having a convex shape on the circuit board,
The mounting structure for an insertion part, wherein the insertion part is held by a surface in contact with the convex shape among the bottom surfaces facing the convex shape. In the mounting structure of the insertion part according to claim 1,
The gap component is sandwiched between the circuit board and the bottom surface,
The insertion component mounting structure, wherein the inserted gap component is held by contacting the bottom surface and further contacting the circuit board. In the mounting structure of the insertion component according to claim 1,
The mounting structure is characterized in that at least one gap component is formed on the outer peripheral portion. In the mounting structure of the insertion part according to claim 3,
The mounting structure for an insertion part, wherein the gap component is made of the same material as the wiring material, resist, or substrate of the circuit board. In the mounting structure of the insertion part as described in any one of Claim 2 or 3,
The mounting structure for an insertion part, wherein the gap constituting portion is a cone, a cylinder, a quadrangular column, a polygonal column, a sphere, an elliptical sphere, an L shape, a U shape, or a star shape. In a circuit board having a through hole and joining the insertion part inserted into the through hole by soldering,
A circuit board, wherein a gap constituting part forming a gap is formed on an outer peripheral part of the bottom surface on a surface where the circuit board and a bottom surface of the insertion part face each other. The circuit board according to claim 8,
The gap component is configured by having a convex shape on the bottom surface,
The circuit board, wherein the insertion component is held by a surface of the circuit board that faces the convex shape and that contacts the convex shape. The circuit board according to claim 8,
The gap component is configured by having a convex shape on the circuit board,
The circuit board for an insertion component, wherein the insertion component is held by a surface that contacts the convex shape among the bottom surfaces facing the convex shape. The circuit board according to claim 8,
The gap component is sandwiched between the circuit board and the bottom surface,
The circuit board according to claim 1, wherein the inserted gap component is held in contact with the bottom surface and further in contact with the circuit board. The circuit board according to claim 8, wherein
The circuit board according to claim 1, wherein at least one gap constituting member is formed on the outer peripheral portion. The circuit board according to claim 10, wherein
The said circuit board | substrate body consists of the same material as the wiring material of the said circuit board, a resist, or a board | substrate. The circuit board according to any one of claims 9 and 10,
2. The circuit board according to claim 1, wherein the gap forming portion is a cone, a cylinder, a quadrangular column, a polygonal column, a sphere, an elliptical sphere, an L shape, a U shape, or a star shape. A method of manufacturing an electronic circuit device having a circuit board in which an insertion part and a circuit board having a through hole are joined by soldering,
Installing a solder paste printing metal mask on a surface of the circuit board on which the insertion component is mounted, and applying a solder paste;
Inserting the insertion pin of the insertion part into the through hole from the upper surface of the applied solder paste;
Furthermore, the step of melting the solder paste applied from the surface side of the circuit board by a reflow step and moving and solidifying between the through hole and the insertion pin,
A manufacturing method of an electronic circuit device, wherein a gap constituting portion forming a gap is formed on a peripheral surface of the bottom surface on a surface where the circuit board and a bottom surface of the insertion component are opposed to each other.

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