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JP2016018232A - Temperature regulator of housed object - Google Patents

Temperature regulator of housed object Download PDF

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Publication number
JP2016018232A
JP2016018232A JP2014138371A JP2014138371A JP2016018232A JP 2016018232 A JP2016018232 A JP 2016018232A JP 2014138371 A JP2014138371 A JP 2014138371A JP 2014138371 A JP2014138371 A JP 2014138371A JP 2016018232 A JP2016018232 A JP 2016018232A
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heat
heat source
accommodating
temperature
conductor
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祐也 渡部
Yuya Watabe
祐也 渡部
幹夫 岡本
Mikio Okamoto
幹夫 岡本
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Asahi Kasei Homes Corp
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Asahi Kasei Homes Corp
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  • Hydroponics (AREA)
  • Control Of Temperature (AREA)

Abstract

【課題】複数の被収容物を収容しつつ、これらの被収容物の温度を効率よく調節する。【解決手段】栽培容器5の温度調節装置4であって、本体部11には、栽培容器5の外形を囲むように熱伝導体14に向かって凹状に窪む形状に形成される収容部11a〜11cと、熱伝導体14に向かって凹状に窪む形状に形成されるとともに第一熱源15を収容可能な第一熱源用収容部11dとが設けられている。熱伝導体14は、第一熱源用収容部11d内の第一熱源用収容空間Rdに露出している。熱伝導体14の第一熱源用収容空間Rdに露出する部位は、第一熱源15に接続されている。【選択図】図3An object of the present invention is to efficiently adjust the temperature of the objects to be accommodated while accommodating a plurality of objects to be accommodated. A temperature control device 4 for a cultivation container 5 in which a main body 11 has a housing portion 11a formed in a concave shape toward a heat conductor 14 so as to surround an outer shape of the cultivation container 5. -11c and a first heat source housing portion 11d that is formed in a concave shape toward the heat conductor 14 and can accommodate the first heat source 15 is provided. The heat conductor 14 is exposed to the first heat source housing space Rd in the first heat source housing portion 11d. A portion of the heat conductor 14 exposed to the first heat source accommodation space Rd is connected to the first heat source 15. [Selection] Figure 3

Description

本発明の一側面は、被収容物の温度調節装置に関する。   One aspect of the present invention relates to a temperature control device for an object.

被収容物の温度を調節する温度調節装置として、例えば特許文献1に記載された装置がある。特許文献1に記載された温度調節装置は、水耕栽培に用いる栽培容器を被収容物として収容し、栽培容器内に満たされた水の温度を調節している。この温度調節装置は、栽培容器を一つ収容している。栽培容器は、断熱材によって囲まれている。   As a temperature control device that adjusts the temperature of an object to be stored, for example, there is a device described in Patent Document 1. The temperature control apparatus described in Patent Literature 1 accommodates a cultivation container used for hydroponics as an object to be accommodated, and regulates the temperature of water filled in the cultivation container. This temperature control apparatus accommodates one cultivation container. The cultivation container is surrounded by a heat insulating material.

特開2007−6862号公報JP 2007-6862 A

ここで、複数の被収容物を収容しつつ、これらの被収容物の温度を効率よく調節したいという要望がある。特許文献1に記載された温度調節装置は、一つの栽培容器を温度調節の対象としている。このように、特許文献1には、複数の栽培容器の温度を調節する構成、及び、断熱材で栽培容器を覆う構成について開示が無い。   Here, there is a demand for efficiently adjusting the temperatures of these objects while accommodating a plurality of objects. The temperature control apparatus described in Patent Document 1 uses one cultivation container as a target for temperature control. Thus, Patent Document 1 does not disclose a configuration for adjusting the temperature of a plurality of cultivation containers and a configuration for covering the cultivation containers with a heat insulating material.

そこで、本発明の一側面は、複数の被収容物を収容しつつ、これらの被収容物の温度を効率よく調節可能な被収容物の温度調節装置を提供することを目的とする。   SUMMARY OF THE INVENTION An object of one aspect of the present invention is to provide a temperature control device for an object to be stored that can efficiently adjust the temperature of the object to be stored while storing a plurality of objects.

本発明の一側面に係る被収容物の温度調節装置は、熱伝導体と、熱伝導体を内包する断熱材と、を備え、断熱材には、被収容物の外形を囲むように熱伝導体に向かって凹状に窪む形状に形成されるとともに被収容物を収容可能な複数の収容部と、熱伝導体に向かって凹状に窪む形状に形成されるとともに熱源を収容可能な熱源用収容部とが設けられ、熱伝導体は、熱源用収容部内の熱源用収容空間に露出し、熱伝導体の熱源用収容空間に露出する部位は、熱源に接続される。   The temperature control device for an object to be contained according to one aspect of the present invention includes a heat conductor and a heat insulating material that encloses the heat conductor, and the heat insulating material has heat conduction so as to surround an outer shape of the object to be stored. For a heat source that is formed in a concave shape toward the body and can accommodate an object, and a heat source that is formed in a concave shape toward the heat conductor and can accommodate a heat source The heat conductor is exposed to the heat source housing space in the heat source housing portion, and the portion of the heat conductor exposed to the heat source housing space is connected to the heat source.

この被収容物の温度調節装置では、熱源用収容部に熱源を収容することにより、複数の収容部に収容されたそれぞれの被収容物に対して、熱源で生じる熱を熱伝導体を介して伝達(熱の授受)することができる。また、収容部は、被収容物の外形を囲むように熱伝導体に向かって凹状に窪む形状を有している。このため、収容部に収容された被収容物を断熱材によって被収容物の外形を囲むように覆いつつ、熱伝導体から複数の被収容物へ熱を伝達できる。これにより、複数の被収容物を収容しつつ、これらの被収容物の温度を効率よく調節することができる。   In this temperature control apparatus of a to-be-contained object, by accommodating a heat source in the heat-source accommodating part, the heat generated in the heat source is passed through the heat conductor to each of the to-be-contained objects accommodated in the plurality of accommodating parts. Can transmit (transfer heat). Moreover, the accommodating part has a shape recessed in a concave shape toward the heat conductor so as to surround the outer shape of the object to be accommodated. For this reason, heat can be transmitted from the heat conductor to the plurality of objects while covering the object to be accommodated in the accommodating part so as to surround the outer shape of the object to be accommodated by the heat insulating material. Thereby, the temperature of these to-be-contained objects can be adjusted efficiently, accommodating a plurality of to-be-contained objects.

熱伝導体は、複数の収容部内のそれぞれの収容空間のうち、少なくともいずれか一つ以上の収容空間に露出していてもよい。この場合には、熱伝導体のうち収容部内の収容空間に露出する部位から断熱材を介することなく被収容物に効率よく熱を伝達することができる。
すなわち、被収容物の温度調節装置は、複数の収容部を有し、複数の収容部のうち、収容空間内に熱伝導体が露出する収容部と、収容空間内に熱伝導体が露出しない収容部とが設けられている。これにより、複数の収容部間において、加温又は冷却の性能を異ならせることができる。
The heat conductor may be exposed to at least one of the accommodation spaces among the accommodation spaces in the plurality of accommodation units. In this case, heat can be efficiently transferred from the portion of the heat conductor exposed to the housing space in the housing portion to the object to be stored without passing through the heat insulating material.
That is, the temperature control device for an object to be stored has a plurality of storage portions, and among the plurality of storage portions, the storage portion in which the heat conductor is exposed in the storage space, and the heat conductor is not exposed in the storage space. And a receiving portion. Thereby, the performance of heating or cooling can be varied among the plurality of accommodating portions.

被収容物の温度調節装置は、熱伝導体のうち収容空間に露出する部位と収容部に収容される被収容物との間に配置される遮蔽材を更に備えていてもよい。遮蔽材を設置することで、熱伝導体から被収容物に伝達される熱量を抑制することができる。これにより、遮蔽材の設置によって、加温又は冷却の性能を変化させることができる(被収容物に応じて加温又は冷却の程度を調節することができる)。   The temperature control device for an object to be stored may further include a shielding material disposed between a portion of the heat conductor exposed to the storage space and the object to be stored in the storage portion. By installing the shielding material, the amount of heat transferred from the heat conductor to the object to be accommodated can be suppressed. Thereby, the performance of heating or cooling can be changed by installing the shielding material (the degree of heating or cooling can be adjusted according to the object to be accommodated).

被収容物の温度調節装置は、収容部内に設けられ、被収容物と熱伝導体のうち収容空間に露出する部位との距離を離間させるスペーサ部材を更に備えていてもよい。スペーサ部材を設置することで、被収容物と熱伝導体とを離すことができ、熱伝導体から被収容物に伝達される熱量を抑制することができる。これにより、スペーサ部材の設置によって、加温又は冷却の性能を変化させることができる(被収容物に応じて加温又は冷却の程度を調節することができる)。   The temperature adjusting device for an object to be stored may further include a spacer member that is provided in the storage part and separates the distance between the object to be stored and a portion exposed to the storage space in the heat conductor. By installing the spacer member, the object to be stored and the heat conductor can be separated, and the amount of heat transferred from the heat conductor to the object to be stored can be suppressed. Thereby, the performance of heating or cooling can be changed by installing the spacer member (the degree of heating or cooling can be adjusted according to the object to be accommodated).

被収容物の温度調節装置は、収容部の開口部を覆う被収容物用カバーを更に備えていてもよい。この場合には、収容部に収容された被収容物が、外気の温度の影響を受けることを抑制できる。被収容物カバーは、断熱材で構成されていればより好ましい。   The temperature control device for the object to be stored may further include a cover for the object to be covered that covers the opening of the storage part. In this case, it can suppress that the to-be-contained object accommodated in the accommodating part receives the influence of the temperature of external air. The to-be-contained object cover is more preferable if it is comprised with the heat insulating material.

被収容物の温度調節装置は、第一熱源用収容部の開口部を覆う第一熱源用カバーを更に備えていてもよい。この場合には、第一熱源用収容部に収容された第一熱源が、外気の温度の影響を受けることを抑制できる。   The temperature adjusting device for an object to be stored may further include a first heat source cover that covers the opening of the first heat source housing. In this case, it can suppress that the 1st heat source accommodated in the accommodating part for 1st heat sources receives to the influence of the temperature of external air.

被収容物の温度調節装置は、第一熱源を更に備えていてもよい。この場合には、第一熱源を用いて、被収容物の加温又は冷却を行うことができる。   The temperature adjusting device for the object to be stored may further include a first heat source. In this case, the object can be heated or cooled using the first heat source.

第一熱源は、加温及び冷却の少なくともいずれか一方が可能なペルチェ素子を含んでいてもよい。この場合には、第一熱源に電力を供給するだけで、被収容物の加温又は冷却を容易に行うことができる。   The first heat source may include a Peltier element capable of at least one of heating and cooling. In this case, the object to be stored can be easily heated or cooled only by supplying electric power to the first heat source.

断熱材には、熱伝導体に向かって凹状に窪む形状に形成されるとともに他の熱源を収容可能な他の熱源用収容部が更に設けられ、熱伝導体は、他の熱源用収容部内の他の熱源用収容空間に露出していてもよい。この場合には、2つの熱源を併用して、被収容物の加温又は冷却を行うことができる。   The heat insulating material is further provided with another heat source accommodating portion that is formed in a concave shape toward the heat conductor and can accommodate another heat source, and the heat conductor is disposed in the other heat source accommodating portion. You may expose to the other storage space for heat sources. In this case, it is possible to heat or cool the object to be stored by using two heat sources in combination.

他の熱源用収容部は、被収容物を収容可能であってもよい。これにより、他の熱源を用いない場合には、他の熱源用収容部に被収容物を収容することができる。   The other heat source accommodating portion may be capable of accommodating an object to be accommodated. Thereby, when not using another heat source, a to-be-contained object can be accommodated in the other heat source accommodating part.

断熱材は、フェノール樹脂、ポリスチレン樹脂、フェノール樹脂発泡体又はポリスチレン樹脂発泡体によって構成されていてもよい。この場合には、断熱材を容易に形成することができる。また、断熱性能を向上させることができる。   The heat insulating material may be composed of a phenol resin, a polystyrene resin, a phenol resin foam, or a polystyrene resin foam. In this case, the heat insulating material can be easily formed. Moreover, heat insulation performance can be improved.

被収容物は、液体を収容する水耕栽培用の栽培容器であってもよい。これにより、被収容物の温度調節装置によって、栽培容器内の水の温度を調節することができる。   The object to be accommodated may be a cultivation container for hydroponics that accommodates the liquid. Thereby, the temperature of the water in a cultivation container can be adjusted with the temperature control apparatus of a to-be-contained object.

本発明の一側面によれば、複数の被収容物を収容しつつ、これらの被収容物の温度を効率よく調節することができる。   According to one aspect of the present invention, it is possible to efficiently adjust the temperatures of the objects to be stored while storing the objects to be stored.

実施形態に係る温度調節装置を適用した水耕栽培ユニットの概略構成を示す斜視図である。It is a perspective view which shows schematic structure of the hydroponic cultivation unit to which the temperature control apparatus which concerns on embodiment is applied. 温度調節装置を示す斜視図である。It is a perspective view which shows a temperature control apparatus. 温度調節装置を収容部の並び方向に沿って切った場合の断面図である。It is sectional drawing at the time of cutting a temperature control apparatus along the row direction of an accommodating part. 収容部に栽培容器を収容する際のバリエーションを示す図である。It is a figure which shows the variation at the time of accommodating a cultivation container in an accommodating part. 栽培容器内の水の温度を測定した場合の実施例を説明する温度調節装置の断面図である。It is sectional drawing of the temperature control apparatus explaining the Example at the time of measuring the temperature of the water in a cultivation container. 収容部に第一熱源以外の熱源を設置した様子を示す断面図である。It is sectional drawing which shows a mode that heat sources other than the 1st heat source were installed in the accommodating part. 温度調節装置の変形例を示す断面図である。It is sectional drawing which shows the modification of a temperature control apparatus. 温度調節装置の変形例を示す断面図である。It is sectional drawing which shows the modification of a temperature control apparatus.

以下、本発明の一つの実施形態として、本発明を水耕栽培ユニットに用いられる温度調節装置に適用した場合の例を図面を参照しながら説明する。なお、図面の説明において同一の要素には同一の符号を付し、重複する説明を省略する。   Hereinafter, as one embodiment of the present invention, an example in which the present invention is applied to a temperature control device used in a hydroponics unit will be described with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

図1に示すように、水耕栽培ユニット1は、棚(家具)2、照明装置3、温度調節装置4、及び、栽培容器5を含んで構成されている。温度調節装置4は、棚2の棚板2a上に載置されている。温度調節装置4は、本実施形態においては3つの栽培容器5を収容している。温度調節装置4は、栽培容器5を加温又は冷却する。栽培容器5は、水耕栽培用の水(養分を含んだ液体)を収容している。栽培容器5には、植物Sを育てるための培地が設置されている。照明装置3は、棚2の天板2bの下面側に設置されている。植物Sは、照明装置3から照射された光を浴びて成長する。なお、棚2の形状は、図1に示す形状に限定されず、栽培容器5を収容する温度調節装置4の上方に照明装置3を取り付けることができれば他の形状であってもよい。   As shown in FIG. 1, the hydroponics unit 1 includes a shelf (furniture) 2, a lighting device 3, a temperature control device 4, and a cultivation container 5. The temperature adjustment device 4 is placed on the shelf 2 a of the shelf 2. The temperature control device 4 accommodates three cultivation containers 5 in this embodiment. The temperature control device 4 heats or cools the cultivation container 5. The cultivation container 5 accommodates water for hydroponics (a liquid containing nutrients). The cultivation container 5 is provided with a culture medium for growing the plant S. The lighting device 3 is installed on the lower surface side of the top plate 2 b of the shelf 2. The plant S grows by receiving light irradiated from the lighting device 3. In addition, the shape of the shelf 2 is not limited to the shape shown in FIG. 1, and may be another shape as long as the lighting device 3 can be attached above the temperature control device 4 that accommodates the cultivation container 5.

以下、温度調節装置4について詳細に説明する。図2及び図3に示すように温度調節装置4は、本体部11、底部12、蓋部13、熱伝導体14、及び、第一熱源15を含んで構成されている。本体部11、底部12及び蓋部13は、断熱材である。本体部11、底部12及び蓋部13は、一例として、フェノール樹脂、ポリスチレン樹脂、フェノール樹脂発泡体又はポリスチレン樹脂発泡体などによって構成されている。   Hereinafter, the temperature control device 4 will be described in detail. As shown in FIGS. 2 and 3, the temperature adjustment device 4 includes a main body portion 11, a bottom portion 12, a lid portion 13, a heat conductor 14, and a first heat source 15. The main body 11, the bottom 12, and the lid 13 are heat insulating materials. The main body part 11, the bottom part 12 and the lid part 13 are constituted by, for example, a phenol resin, a polystyrene resin, a phenol resin foam or a polystyrene resin foam.

熱伝導体14は、熱を伝達する部材である。熱伝導体14は、熱伝導性の高い部材からなり、一例として、アルミ又は銅などの金属によって構成されている。熱伝導体14は、例えば、板状、棒状、または、パイプ状に形成されている。熱伝導体14は、金属以外にも、冷媒配管を施し、エチレングリコール又は水などの冷媒を用いて熱を伝達してもよい。底部12は、本体部11の下面側に配置されている。熱伝導体14は、本体部11と底部12との間に挟み込まれている。すなわち、熱伝導体14は、断熱材である本体部11及び底部12に内包されている。   The heat conductor 14 is a member that transfers heat. The heat conductor 14 is made of a member having high heat conductivity, and is made of a metal such as aluminum or copper as an example. The heat conductor 14 is formed in a plate shape, a rod shape, or a pipe shape, for example. In addition to the metal, the heat conductor 14 may be provided with a refrigerant pipe to transmit heat using a refrigerant such as ethylene glycol or water. The bottom portion 12 is disposed on the lower surface side of the main body portion 11. The heat conductor 14 is sandwiched between the main body portion 11 and the bottom portion 12. That is, the heat conductor 14 is included in the main body 11 and the bottom 12 which are heat insulating materials.

本体部11の上面には、栽培容器5の外形を囲むように熱伝導体14に向かって凹状に窪む形状に形成された3つの収容部11a、11b及び11cが設けられている。本実施形態において、収容部11a〜11cは、栽培容器5の外形に沿う形状に形成されている。収容部11a内の収容空間Ra、収容部11b内の収容空間Rb、及び、収容部11c内の収容空間Rcには熱伝導体14の上面が露出している。収容部11a〜11cは、断面視、栽培容器5の側壁の形状に沿って包み込むように、上方に進むにしたがって径が大きくなっている。収容部11a〜11cの深さ(本体部11の上下方向の厚さ)は、栽培容器5の高さと略同じとなっている。収容部11a〜11cは、それぞれ栽培容器5を収容可能となっている。これにより、それぞれの栽培容器5が収容部11a〜11cに収容されたときに、各栽培容器5の底面が、露出した熱伝導体14の上面に載置され接触した状態になる。   On the upper surface of the main body portion 11, three accommodating portions 11 a, 11 b, and 11 c that are formed in a concave shape toward the heat conductor 14 so as to surround the outer shape of the cultivation container 5 are provided. In this embodiment, the accommodating parts 11a-11c are formed in the shape in alignment with the external shape of the cultivation container 5. As shown in FIG. The upper surface of the heat conductor 14 is exposed in the accommodation space Ra in the accommodation part 11a, the accommodation space Rb in the accommodation part 11b, and the accommodation space Rc in the accommodation part 11c. The accommodating portions 11a to 11c have larger diameters as they proceed upward so as to wrap along the shape of the side wall of the cultivation container 5 in a sectional view. The depth of the accommodating portions 11 a to 11 c (the thickness in the vertical direction of the main body portion 11) is substantially the same as the height of the cultivation container 5. The accommodating parts 11a-11c can accommodate the cultivation container 5, respectively. Thereby, when each cultivation container 5 is accommodated in accommodating part 11a-11c, the bottom face of each cultivation container 5 will be in the state which was mounted on the upper surface of the exposed heat conductor 14, and contacted.

さらに、本体部11の上面には、熱伝導体14に向かって凹状に窪む形状に形成された第一熱源用収容部11dが設けられている。第一熱源用収容部11d内の第一熱源用収容空間Rdには、熱伝導体14の上面が露出している。第一熱源用収容部11dには、第一熱源15が収容されている。収容部11a〜11c及び第一熱源用収容部11dは、収容部11a〜11c及び第一熱源用収容部11dの順で水平方向に沿って並べて設けられている。熱伝導体14は、収容部11aから第一熱源用収容部11dに亘って延在している。   Furthermore, a first heat source housing portion 11 d formed in a shape that is recessed toward the heat conductor 14 is provided on the upper surface of the main body portion 11. The upper surface of the heat conductor 14 is exposed in the first heat source housing space Rd in the first heat source housing 11d. The first heat source 15 is accommodated in the first heat source accommodating portion 11d. The accommodating portions 11a to 11c and the first heat source accommodating portion 11d are provided side by side along the horizontal direction in the order of the accommodating portions 11a to 11c and the first heat source accommodating portion 11d. The heat conductor 14 extends from the housing portion 11a to the first heat source housing portion 11d.

第一熱源15は、加温及び冷却が可能なペルチェ素子15aを有している。第一熱源15は、ペルチェ素子15a以外にも、ペルチェ素子15aを作動させるために用いるラジエター及びファンなどを備えている。ペルチェ素子15aは、熱伝導体14の上面のうち、第一熱源用収容空間Rdに露出する部位に接触し、熱的に接続されている。ペルチェ素子15aを作動させることにより、熱伝導体14の加温及び冷却を行うことができる。それぞれの栽培容器5が収容部11a〜11cに収容されたときに、各栽培容器5の底面が、露出した熱伝導体14の上面に載置され接触した状態になるので、熱伝導体14は、第一熱源15が発生させた熱を栽培容器5へ伝達する。なお、熱伝導体14が熱を伝達することとは、第一熱源15が発生させた高い熱を栽培容器5へ伝達すること、及び、第一熱源15が発生させた低い熱を栽培容器5へ伝達することを含む。   The first heat source 15 includes a Peltier element 15a that can be heated and cooled. In addition to the Peltier element 15a, the first heat source 15 includes a radiator and a fan used to operate the Peltier element 15a. The Peltier element 15a contacts and is thermally connected to a portion of the upper surface of the heat conductor 14 exposed to the first heat source accommodation space Rd. By operating the Peltier element 15a, the heat conductor 14 can be heated and cooled. When each cultivation container 5 is accommodated in the accommodating portions 11a to 11c, the bottom surface of each cultivation container 5 is placed on and in contact with the exposed upper surface of the heat conductor 14, so that the heat conductor 14 is The heat generated by the first heat source 15 is transmitted to the cultivation container 5. In addition, the heat conductor 14 transferring heat means transferring high heat generated by the first heat source 15 to the cultivation container 5 and low heat generated by the first heat source 15. Including communicating to.

蓋部13は、第一熱源用収容空間Rdの上側の開口部を覆っている。なお、第一熱源用収容空間Rdは閉じられた空間であることに限定されず、本体部11の側面などに排気口などが設けられていてもよい。この排気口を介して、ペルチェ素子15aを作動させたときの熱などを第一熱源用収容空間Rd内から排出してもよい。蓋部13を設けずに、第一熱源用収容空間Rdは、上部が開放された空間であってもよい。また、蓋部13を断熱材にすることで被収容物の温度調整の効率を高めることもできる。   The lid portion 13 covers the upper opening of the first heat source accommodation space Rd. The first heat source accommodation space Rd is not limited to a closed space, and an exhaust port or the like may be provided on the side surface of the main body 11 or the like. Heat or the like when the Peltier element 15a is operated may be discharged from the first heat source accommodation space Rd through the exhaust port. Without providing the lid portion 13, the first heat source accommodation space Rd may be a space having an open top. Moreover, the efficiency of the temperature adjustment of a to-be-contained object can also be improved by making the cover part 13 into a heat insulating material.

次に、温度調節装置4を用いた栽培容器5の加温又は冷却について説明する。温度調節装置4は、収容部11a〜11c内に栽培容器5をそのまま直接収容する以外にも、収容部11a〜11c内にスペーサ部材21又は遮蔽材22を設置し、収容部11a〜11cと栽培容器5との間にスペーサ部材21又は遮蔽材22を介在させた状態で栽培容器5を収容することができる。これにより、熱伝導体14による栽培容器5内の水の加温又は冷却の程度を調節することができる。具体的には、図4に示すように、例えば、収容部11aには、栽培容器5が直接収容される。栽培容器5の底面は、本体部11の収容空間Raに露出する熱伝導体14に当接する。これにより、栽培容器5内の水が、熱伝導体14によって加温又は冷却される。   Next, heating or cooling of the cultivation container 5 using the temperature control device 4 will be described. The temperature control device 4 installs the spacer member 21 or the shielding material 22 in the accommodating portions 11a to 11c, and directly cultivates the accommodating portions 11a to 11c, in addition to directly accommodating the cultivation container 5 in the accommodating portions 11a to 11c. The cultivation container 5 can be accommodated with the spacer member 21 or the shielding material 22 interposed between the container 5 and the container 5. Thereby, the degree of the heating or cooling of the water in the cultivation container 5 by the heat conductor 14 can be adjusted. Specifically, as shown in FIG. 4, for example, the cultivation container 5 is directly accommodated in the accommodation portion 11 a. The bottom surface of the cultivation container 5 contacts the heat conductor 14 exposed in the accommodation space Ra of the main body 11. Thereby, the water in the cultivation container 5 is heated or cooled by the heat conductor 14.

例えば、収容部11bには、スペーサ部材21が収容部11b内の斜めに立ち上がる側面に設置された状態で、栽培容器5が収容される。スペーサ部材21は、収容部11bの側面形状に沿って筒状に形成され、栽培容器5が収容部11bに収容されたとき、スペーサ部材21は、収容部11bの側面と栽培容器5の側壁との間に挟まれた状態となる。スペーサ部材21を設置することにより、栽培容器5が収容部11bの底部まで完全に沈み込むことなく浮いた状態になるので、熱伝導体14の上面のうち収容部11b内の収容空間Rbに露出する部位と、栽培容器5の底面との距離を離間させることができる。これにより、熱伝導体14による栽培容器5内の水の加温又は冷却温度の程度を調節することができる。スペーサ部材21の厚さを変えることにより、熱伝導体14の上面のうち収容空間Rbに露出する部位と栽培容器5の底面との距離を変化させることができる。すなわち、スペーサ部材21の厚さを変えることにより、栽培容器5内の水の加温又は冷却の程度を調節することができる。スペーサ部材21は、一例として、ポリプロピレン樹脂など、種々の樹脂によって形成することができる。スペーサ部材21の形状は、栽培容器5の底面と熱伝導体14との距離を離間させることができれば筒状に限定されず、カップ形状であってもよく、これら以外の形状であっても、収容部11a〜11cに合わせて適宜設ければよい。   For example, the cultivation container 5 is accommodated in the accommodating portion 11b in a state where the spacer member 21 is installed on the side surface rising obliquely in the accommodating portion 11b. The spacer member 21 is formed in a cylindrical shape along the side surface shape of the housing portion 11b, and when the cultivation container 5 is housed in the housing portion 11b, the spacer member 21 includes the side surface of the housing portion 11b and the side wall of the cultivation container 5. It is in a state of being sandwiched between. By installing the spacer member 21, the cultivation container 5 is in a floating state without completely sinking to the bottom of the housing portion 11 b, so that it is exposed to the housing space Rb in the housing portion 11 b of the upper surface of the heat conductor 14. The distance between the part to be performed and the bottom surface of the cultivation container 5 can be separated. Thereby, the grade of the heating or cooling temperature of the water in the cultivation container 5 by the heat conductor 14 can be adjusted. By changing the thickness of the spacer member 21, the distance between the portion exposed to the accommodation space Rb in the upper surface of the heat conductor 14 and the bottom surface of the cultivation container 5 can be changed. That is, by changing the thickness of the spacer member 21, the degree of water heating or cooling in the cultivation container 5 can be adjusted. As an example, the spacer member 21 can be formed of various resins such as polypropylene resin. The shape of the spacer member 21 is not limited to a cylindrical shape as long as the distance between the bottom surface of the cultivation container 5 and the heat conductor 14 can be separated, may be a cup shape, or may be a shape other than these, What is necessary is just to provide suitably according to the accommodating parts 11a-11c.

例えば、収容部11cには、遮蔽材22が収容部11c内に設置された状態で、栽培容器5が収容される。遮蔽材22は、板状の部材であり、熱伝導体14の上面のうち収容部11c内の収容空間Rcに露出する部位に載置される。遮蔽材22は、熱伝導体14から栽培容器5へ伝達される熱を遮蔽する。遮蔽材22は、一例として、発泡スチロールによって形成することができる。遮蔽材22を設置することにより、熱伝導体14の上面のうち収容部11c内の収容空間Rcに露出する部位と、栽培容器5の底面との距離を離間させることができる。これにより、熱伝導体14による栽培容器5内の水の加温又は冷却の程度を調節することができる。遮蔽材22の厚さを変えることにより、熱伝導体14の上面のうち収容部11c内の収容空間Rcに露出する部位と、栽培容器5の底面との距離を変化させることができる。すなわち、遮蔽材22の厚さを変えることにより、栽培容器5内の水の加温又は冷却の程度を調節することができる。   For example, the cultivation container 5 is accommodated in the accommodating part 11c in a state where the shielding member 22 is installed in the accommodating part 11c. The shielding material 22 is a plate-like member, and is placed on a portion of the upper surface of the heat conductor 14 that is exposed to the accommodation space Rc in the accommodation portion 11c. The shielding material 22 shields the heat transmitted from the heat conductor 14 to the cultivation container 5. The shielding material 22 can be formed of foamed polystyrene as an example. By installing the shielding material 22, the distance between the portion of the upper surface of the heat conductor 14 exposed to the housing space Rc in the housing portion 11 c and the bottom surface of the cultivation container 5 can be separated. Thereby, the degree of the heating or cooling of the water in the cultivation container 5 by the heat conductor 14 can be adjusted. By changing the thickness of the shielding material 22, the distance between the portion of the top surface of the heat conductor 14 exposed to the housing space Rc in the housing portion 11 c and the bottom surface of the cultivation container 5 can be changed. That is, by changing the thickness of the shielding material 22, the degree of heating or cooling of the water in the cultivation container 5 can be adjusted.

なお、本実施形態において、収容部11aは栽培容器5をそのまま直接収容し、収容部11bはスペーサ部材21が設置された状態で栽培容器5を収容し、及び、収容部11cは遮蔽材22が設置された状態で栽培容器5を収容したが、スペーサ部材21及び遮蔽材22の設置場所は、限定されない。すなわち、収容部11aにスペーサ部材21又は遮蔽材22を設置してもよく、収容部11bに遮蔽材22を設置してもよく、収容部11cにスペーサ部材21を設置してもよい。また、収容部11b及び11cに、栽培容器5を直接収容してもよい。また、例えば、収容部11a〜11cは、スペーサ部材21及び遮蔽材22の両方が設置された状態で栽培容器5を収容してもよい。   In addition, in this embodiment, the accommodating part 11a accommodates the cultivation container 5 directly as it is, the accommodating part 11b accommodates the cultivation container 5 in the state in which the spacer member 21 is installed, and the accommodating part 11c includes the shielding material 22. Although the cultivation container 5 was accommodated in the installed state, the installation location of the spacer member 21 and the shielding material 22 is not limited. That is, the spacer member 21 or the shielding material 22 may be installed in the housing portion 11a, the shielding material 22 may be installed in the housing portion 11b, or the spacer member 21 may be installed in the housing portion 11c. Moreover, you may accommodate the cultivation container 5 directly in the accommodating parts 11b and 11c. Moreover, for example, the accommodating portions 11 a to 11 c may accommodate the cultivation container 5 in a state where both the spacer member 21 and the shielding material 22 are installed.

次に、ペルチェ素子15aを作動させて栽培容器5内の水の温度を測定した場合の実施例について説明する。ここでは、図5に示すように、収容部11aには、栽培容器5を直接収容させた。収容部11bには、スペーサ部材21を設置した状態で栽培容器5を収容させた。スペーサ部材21として、厚さが5mmのポリプロピレン樹脂からなる部材を用いた。収容部11cには、スペーサ部材21及び遮蔽材22を設置した状態で栽培容器5を収容させた。スペーサ部材21として、厚さが5mmのポリプロピレン樹脂からなる部材を用い、遮蔽材22として、厚さが5mmの発泡スチロールの板材を用いた。各栽培容器5内には、それぞれ1.5リットルの水を入れた。また、熱伝導体14の温度が予め定められた温度で維持されるように第一熱源15のペルチェ素子15aを作動させた。第一熱源15は、例えば、熱伝導体14の温度を測定し、フィードバック制御を行うことなどによって、熱伝導体14の温度を一定に保つことができる。   Next, the Example at the time of operating the Peltier device 15a and measuring the temperature of the water in the cultivation container 5 is described. Here, as shown in FIG. 5, the cultivation container 5 was directly accommodated in the accommodation part 11a. The cultivation container 5 was accommodated in the accommodation part 11b in a state where the spacer member 21 was installed. As the spacer member 21, a member made of polypropylene resin having a thickness of 5 mm was used. The cultivation container 5 was accommodated in the accommodation part 11c in a state where the spacer member 21 and the shielding material 22 were installed. As the spacer member 21, a member made of polypropylene resin having a thickness of 5 mm was used, and as the shielding material 22, a foamed polystyrene plate material having a thickness of 5 mm was used. Each cultivation container 5 was filled with 1.5 liters of water. Further, the Peltier element 15a of the first heat source 15 was operated so that the temperature of the heat conductor 14 was maintained at a predetermined temperature. The first heat source 15 can keep the temperature of the heat conductor 14 constant, for example, by measuring the temperature of the heat conductor 14 and performing feedback control.

ペルチェ素子15aを作動させて熱伝導体14の温度が安定した時、収容部11aに設置した栽培容器5内の水の温度(スペーサ部材21及び遮蔽材22:無し)は、18.5℃であった。収容部11bに設置した栽培容器5内の水の温度(スペーサ部材21:有り)は20.0℃であった。収容部11cに設置した栽培容器5内の水の温度(スペーサ部材21及び遮蔽材22:有り)は20.0度であった。このときの外気温は26.0度であった。   When the temperature of the heat conductor 14 is stabilized by operating the Peltier element 15a, the temperature of the water in the cultivation container 5 installed in the accommodating portion 11a (the spacer member 21 and the shielding material 22: none) is 18.5 ° C. there were. The temperature of the water in the cultivation container 5 installed in the accommodating portion 11b (spacer member 21: present) was 20.0 ° C. The temperature of the water in the cultivation container 5 installed in the accommodating part 11c (spacer member 21 and shielding material 22: present) was 20.0 degrees. The outside temperature at this time was 26.0 degrees.

このように、スペーサ部材21を用いる、或いは、スペーサ部材21及び遮蔽材22を用いることで、スペーサ部材21及び遮蔽材22を設置しない場合に比べて、栽培容器5内の水の温度は高くなった。   Thus, the temperature of the water in the cultivation container 5 becomes high compared with the case where the spacer member 21 and the shielding material 22 are not installed by using the spacer member 21 or using the spacer member 21 and the shielding material 22. It was.

熱伝導体14の温度が安定してから7時間が経過した時、収容部11aに設置した栽培容器5内の水の温度(スペーサ部材21及び遮蔽材22:無し)は、18.5℃であった。収容部11bに設置した栽培容器5内の水の温度(スペーサ部材21:有り)は19.5℃であった。収容部11cに設置した栽培容器5内の水の温度(スペーサ部材21及び遮蔽材22:有り)は20.1度であった。このときの外気温は24.6度であった。   When 7 hours have passed since the temperature of the heat conductor 14 is stabilized, the temperature of the water in the cultivation container 5 installed in the accommodating portion 11a (the spacer member 21 and the shielding material 22: none) is 18.5 ° C. there were. The temperature of the water in the cultivation container 5 installed in the accommodating portion 11b (spacer member 21: present) was 19.5 ° C. The temperature of the water in the cultivation container 5 installed in the accommodating part 11c (spacer member 21 and shielding material 22: present) was 20.1 degrees. The outside temperature at this time was 24.6 degrees.

このように、時間が経過しても、栽培容器5内の水の温度はほとんど変化しなかった。また、外気温が変化しても、収容部11aに設置した栽培容器5内の水の温度(スペーサ部材21及び遮蔽材22:無し)は変化しないことから、栽培容器5内の水の温度は外気の温度変化の影響を受けないことが分かった。スペーサ部材21を用いる、或いは、スペーサ部材21及び遮蔽材22を用いることで、これらを用いない場合に比べて栽培容器5内の水の冷却性能を変化させることができることが分かった。   Thus, even if time passed, the temperature of the water in the cultivation container 5 hardly changed. Moreover, since the temperature of the water in the cultivation container 5 installed in the accommodating part 11a (the spacer member 21 and the shielding material 22: none) does not change even if the outside air temperature changes, the temperature of the water in the cultivation container 5 is It was found that it was not affected by outside air temperature changes. It turned out that the cooling performance of the water in the cultivation container 5 can be changed by using the spacer member 21 or using the spacer member 21 and the shielding material 22 compared with the case where these are not used.

本実施形態は以上のように構成され、この温度調節装置4では、第一熱源用収容部11dに第一熱源15を収容することにより、複数の収容部11a〜11cに収容されたそれぞれの栽培容器5に対して、第一熱源15で生じる熱を熱伝導体14を介して伝達することができる。また、収容部11a〜11cは、栽培容器5の外形に沿うように熱伝導体14に向かって本体部11を凹状に窪む形状を有している。このため、収容部11a〜11cに収容された栽培容器5を断熱材である本体部11によって、その栽培容器5の外形に適応するように覆いつつ、熱伝導体14から複数の栽培容器5へ熱を伝達できる。断熱材である本体部11によって栽培容器5の外形に沿う(栽培容器5の外面全体が断熱材の凹状に窪む形状にぴったりフィットした状態になる)ように栽培容器5を囲むことで、収容部11a〜11cの上部が開口している(開口部がカバー等で覆われていない)場合であっても、栽培容器5内の水が、外気の温度変化の影響を受けることを抑制できる。これにより、複数の栽培容器5を収容しつつ、これらの栽培容器5の温度を効率よく調節することができる。   This embodiment is configured as described above, and in this temperature control device 4, the first heat source 15 is accommodated in the first heat source accommodating portion 11 d, thereby cultivating the respective cultivations accommodated in the plurality of accommodating portions 11 a to 11 c. Heat generated by the first heat source 15 can be transferred to the container 5 via the heat conductor 14. Moreover, accommodating part 11a-11c has the shape which dents the main-body part 11 concavely toward the heat conductor 14 so that the external shape of the cultivation container 5 may be followed. For this reason, while covering the cultivation container 5 accommodated in accommodation part 11a-11c with the main-body part 11 which is a heat insulating material so that it may adapt to the external shape of the cultivation container 5, it is from the heat conductor 14 to several cultivation containers 5. Can transfer heat. It is accommodated by surrounding the cultivation container 5 so as to follow the outer shape of the cultivation container 5 by the main body part 11 which is a heat insulating material (the entire outer surface of the cultivation container 5 is in a state of being closely fitted to the concave shape of the heat insulation material). Even if it is a case where the upper part of the parts 11a-11c is opening (the opening part is not covered with a cover etc.), it can suppress that the water in the cultivation container 5 receives the influence of the temperature change of external air. Thereby, the temperature of these cultivation containers 5 can be adjusted efficiently, accommodating a plurality of cultivation containers 5.

熱伝導体14の上面は、収容空間Ra〜Rcに露出している。この場合には、例えば図4に示す収容部11aに収容された栽培容器5のように、熱伝導体14から栽培容器5に効率よく熱を伝達することができる。   The upper surface of the heat conductor 14 is exposed in the accommodation spaces Ra to Rc. In this case, for example, heat can be efficiently transferred from the heat conductor 14 to the cultivation container 5 like the cultivation container 5 accommodated in the accommodation portion 11a shown in FIG.

例えば、図4に示す収容部11cのように、収容部11c内に遮蔽材22を配置することで、熱伝導体14から栽培容器5に伝達される熱量を抑制することができる。これにより、遮蔽材22の設置によって、加温又は冷却の性能を変化させることができる。   For example, like the accommodating part 11c shown in FIG. 4, the heat quantity transmitted from the heat conductor 14 to the cultivation container 5 can be suppressed by arrange | positioning the shielding material 22 in the accommodating part 11c. Thereby, the performance of heating or cooling can be changed by installing the shielding member 22.

例えば、図4に示す収容部11bのように、収容部11b内にスペーサ部材21を配置することで、栽培容器5と熱伝導体14とを離すことができる。これにより、熱伝導体14から栽培容器5に伝達される熱量を抑制することができる。従って、スペーサ部材21の設置によって、加温又は冷却の性能を変化させることができる。   For example, like the accommodating part 11b shown in FIG. 4, the cultivation container 5 and the heat conductor 14 can be separated by arrange | positioning the spacer member 21 in the accommodating part 11b. Thereby, the calorie | heat amount transmitted to the cultivation container 5 from the heat conductor 14 can be suppressed. Therefore, the performance of heating or cooling can be changed by installing the spacer member 21.

第一熱源15は、ペルチェ素子15aを作動させることによって、加温及び冷却を行う。この場合には、ペルチェ素子15aに電力を供給するだけで、栽培容器5の加温又は冷却を容易に行うことができる。   The first heat source 15 performs heating and cooling by operating the Peltier element 15a. In this case, the cultivation container 5 can be easily heated or cooled only by supplying electric power to the Peltier element 15a.

本体部11、底部12及び蓋部13として、フェノール樹脂、ポリスチレン樹脂、フェノール樹脂発泡体又はポリスチレン樹脂発泡体などを用いることで、本体部11等を容易に形成することができる。また、本体部11、底部12及び蓋部13の断熱性能を向上させることができる。   By using a phenol resin, a polystyrene resin, a phenol resin foam, a polystyrene resin foam, or the like as the main body 11, the bottom 12, and the lid 13, the main body 11 or the like can be easily formed. Moreover, the heat insulation performance of the main body part 11, the bottom part 12, and the cover part 13 can be improved.

以上、本発明の一実施形態について説明したが、本発明は、上記実施形態に限定されるものではない。例えば、図2及び図3に示す温度調節装置4は、本体部11、底部12、蓋部13、熱伝導体14、及び、第一熱源15を含んで構成されているが、本発明の他の実施形態では、図示はしていないが、温度調節装置4は第一熱源15を持たず、外部接続方式とすることができる。すなわち、第一熱源15は、温度調節装置4に設けられた接続部から熱伝導体14に接続されるように構成することができる。
また、本発明の他の実施形態では、図示はしていないが、本体部11に設けられる複数の収容部11a〜11c、及び第一熱源用収容部11dは、本体部11が熱伝導体14に向かって凹状に窪む形状、熱伝導体14の上面が収容空間Ra〜Rdに露出した状態を全く共通の形態としてもよく、収容部11a〜11cと共通の形態とした第一熱源用収容部11dに、第一熱源15を備えることも可能である。
また、本発明の他の実施形態では、図示はしていないが、第一熱源用収容部11dに備えた第一熱源15は、ペルチェ素子15aを作動させることによって加温又は冷却を行ったが、加温又は冷却が可能であれば、例えば、ペルチェ素子15aの代わりに氷水、お湯、又は、冷媒など、他の熱源を第一熱源15として第一熱源用収容部11dに備えてもよい。
また、上記何れの実施形態において、熱源(第一熱源15)が配置される収容部が第一熱源用収容部11dであるとして説明しているが、これに限られるものではなく、本体部11に設けられる複数の収容部(11a〜11d)のうち何れかの収容部に熱源(第一熱源15)を配置してもよい。
Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment. For example, the temperature control device 4 shown in FIGS. 2 and 3 is configured to include a main body 11, a bottom 12, a lid 13, a heat conductor 14, and a first heat source 15. Although not shown in the embodiment, the temperature control device 4 does not have the first heat source 15 and can be an external connection method. That is, the first heat source 15 can be configured to be connected to the heat conductor 14 from a connection portion provided in the temperature adjustment device 4.
Moreover, in other embodiment of this invention, although not shown in figure, as for the some accommodating parts 11a-11c provided in the main-body part 11, and the accommodating part 11d for 1st heat sources, the main-body part 11 is the heat conductor 14. The first heat source housing may have a shape that is recessed in a concave shape, and a state in which the upper surface of the heat conductor 14 is exposed to the housing spaces Ra to Rd, and a shape that is common to the housing portions 11a to 11c. It is also possible to provide the first heat source 15 in the part 11d.
Although not shown in the other embodiment of the present invention, the first heat source 15 provided in the first heat source housing portion 11d is heated or cooled by operating the Peltier element 15a. If heating or cooling is possible, for example, another heat source such as ice water, hot water, or a refrigerant may be provided in the first heat source housing 11d as the first heat source 15 instead of the Peltier element 15a.
In any of the above-described embodiments, the housing part in which the heat source (first heat source 15) is disposed is described as the first heat source housing part 11d. However, the present invention is not limited to this. A heat source (first heat source 15) may be arranged in any of the plurality of housing portions (11a to 11d) provided in the housing.

さらに、熱源は、第一熱源15一個に限られず複数の熱源をそれぞれ別々の収容部に配置してもよい。例えば、本発明の他の実施形態では、第一熱源15のみによって熱伝導体14を加温又は冷却する以外にも、収容部11a〜11c内に他の熱源を設置してもよい。図6に、収容部11b(他の熱源用収容部)内に第二の熱源として氷水(他の熱源)Xを収容した容器30を設置した場合を示す。図6に示すように、容器30内には氷水Xが収容されている。容器30は、熱伝導体14の上面のうち収容部11b内の収容空間(他の熱源用収容空間)Rbに露出する部位に載置されている。これにより、第一熱源15による熱伝導体14の冷却に加えて、容器30内の氷水Xによって熱伝導体14を効率よく冷却することができる。   Furthermore, the heat source is not limited to one first heat source 15, and a plurality of heat sources may be arranged in separate accommodating portions. For example, in other embodiment of this invention, you may install another heat source in accommodating part 11a-11c besides heating or cooling the heat conductor 14 only with the 1st heat source 15. FIG. FIG. 6 shows a case where a container 30 containing ice water (another heat source) X as a second heat source is installed in the accommodation part 11b (another heat source accommodation part). As shown in FIG. 6, ice water X is accommodated in the container 30. The container 30 is placed on a portion of the upper surface of the heat conductor 14 that is exposed to the accommodation space (other heat source accommodation space) Rb in the accommodation portion 11b. Thereby, in addition to the cooling of the heat conductor 14 by the first heat source 15, the heat conductor 14 can be efficiently cooled by the ice water X in the container 30.

なお、氷水Xが収容された容器30に代えて、お湯(他の熱源)が収容された容器30を収容部11b内に配置してもよい。この場合、第一熱源15による熱伝導体14の加温に加えて、容器30内のお湯によって熱伝導体14を効率よく加温することができる。また、氷水X等が収容された容器30を収容部11bに設置する場合、第一熱源15を停止状態としてもよい。この場合には、第一熱源15を用いることなく、氷水X又はお湯等を熱源として、栽培容器5内の水を加温又は冷却することができる。   Instead of the container 30 in which the ice water X is accommodated, the container 30 in which hot water (other heat source) is accommodated may be disposed in the accommodating portion 11b. In this case, in addition to the heating of the heat conductor 14 by the first heat source 15, the heat conductor 14 can be efficiently heated by the hot water in the container 30. Moreover, when installing the container 30 in which the ice water X etc. were accommodated in the accommodating part 11b, it is good also considering the 1st heat source 15 as a halt condition. In this case, the water in the cultivation container 5 can be heated or cooled using the ice water X or hot water as a heat source without using the first heat source 15.

図6では、収容部11b内に容器30を設置したが、容器30を設置する場所は収容部11bに限定されない。図6では、栽培容器5を収容可能な収容部11bに容器30を設置したが、容器30を設置するため専用の他の熱源用収容部を設けてもよい。この他の熱源用収容部は、収容部11b等と同様に、本体部11を熱伝導体14に向かって凹状に窪む形状に形成し、熱伝導体14の上面を露出させることによって形成することができる。   In FIG. 6, although the container 30 was installed in the accommodating part 11b, the place which installs the container 30 is not limited to the accommodating part 11b. In FIG. 6, the container 30 is installed in the storage unit 11 b that can store the cultivation container 5, but another dedicated heat source storage unit may be provided to install the container 30. The other heat source housing portion is formed by forming the main body portion 11 in a concave shape toward the heat conductor 14 and exposing the upper surface of the heat conductor 14 in the same manner as the housing portion 11b and the like. be able to.

ここで、図6に示すように収容部11b内に氷水Xを収容した容器30を設置した場合における、栽培容器5内の水の温度変化について説明する。ここでは、収容部11a及び11c内に栽培容器5をそれぞれ直接(スペーサ部材21及び遮蔽材22を介在させずにそのまま)収容させた。各栽培容器5内には、それぞれ1.5リットルの水を入れた。また、第一熱源15は停止状態とした。容器30を収容部11b内の熱伝導体14の上面に載置した時、収容部11aに設置した栽培容器5内の水の温度は、24.1℃であった。収容部11cに設置した栽培容器5内の水の温度は25.0度であった。熱伝導体14の上面のうち収容部11b内の収容空間Rbに露出する部位の温度は、11.2℃であった。このときの外気温は20.0度であった。   Here, the temperature change of the water in the cultivation container 5 at the time of installing the container 30 which accommodated the ice water X in the accommodating part 11b as shown in FIG. 6 is demonstrated. Here, the cultivation containers 5 were directly accommodated in the accommodating portions 11a and 11c (as they were, without interposing the spacer member 21 and the shielding material 22). Each cultivation container 5 was filled with 1.5 liters of water. Moreover, the 1st heat source 15 was made into the stop state. When the container 30 was placed on the upper surface of the heat conductor 14 in the housing part 11b, the temperature of the water in the cultivation container 5 installed in the housing part 11a was 24.1 ° C. The temperature of the water in the cultivation container 5 installed in the accommodating part 11c was 25.0 degree | times. Of the upper surface of the heat conductor 14, the temperature of the portion exposed to the housing space Rb in the housing portion 11b was 11.2 ° C. The outside temperature at this time was 20.0 degrees.

容器30を収容部11b内に設置してから30分が経過した時、収容部11aに設置した栽培容器5内の水の温度は、23.0℃であった。収容部11cに設置した栽培容器5内の水の温度は24.0度であった。熱伝導体14の上面のうち収容部11b内の収容空間Rbに露出する部位の温度は、12.7℃であった。このときの外気温は20.0度であった。   When 30 minutes passed after installing the container 30 in the accommodating part 11b, the temperature of the water in the cultivation container 5 installed in the accommodating part 11a was 23.0 degreeC. The temperature of the water in the cultivation container 5 installed in the accommodating part 11c was 24.0 degree | times. The temperature of the part exposed to the accommodation space Rb in the accommodation part 11b in the upper surface of the heat conductor 14 was 12.7 ° C. The outside temperature at this time was 20.0 degrees.

このように、収容部11b内に氷水Xが収容された容器30を設置してから30分が経過した時に、収容部11a及び11cに収容された栽培容器5内の水の温度は約1℃低くなった。容器30が載置された熱伝導体14の温度は1.5℃上昇した。このように、収容部11b内に氷水Xが収容された容器30を設置することで、他の収容部11a及び11c内に収容された栽培容器5内の水から熱を奪い、熱を伝達(吸熱)することができた。従って、第一熱源15を用いる以外にも、収容部11bに氷水等を設置することで、収容部11a及び11cに収容された栽培容器5内の水を冷却することができる。   Thus, when 30 minutes have passed since the container 30 in which the ice water X is accommodated in the accommodating part 11b, the temperature of the water in the cultivation container 5 accommodated in the accommodating parts 11a and 11c is about 1 ° C. It became low. The temperature of the heat conductor 14 on which the container 30 was placed rose by 1.5 ° C. Thus, by installing the container 30 in which the ice water X is accommodated in the accommodating part 11b, heat is taken from the water in the cultivation container 5 accommodated in the other accommodating parts 11a and 11c, and the heat is transmitted ( Endothermic). Therefore, in addition to using the first heat source 15, the water in the cultivation container 5 accommodated in the accommodating portions 11a and 11c can be cooled by installing ice water or the like in the accommodating portion 11b.

また、本発明の他の実施形態では、図7に示す温度調節装置4Aの本体部11Aに設けられた収容部11e及び11fのように、収容部11e内の収容空間Re及び収容部11f内の収容空間Rfに熱伝導体14の上面が露出していなくてもよい。収容部11e及び11fの底部と熱伝導体14との距離によって、加温又は冷却の性能を変化させることができる。図7に示す例では、収容部11eの底部と熱伝導体14との距離は、収容部11fの底部と熱伝導体14との距離よりも短い。これにより、収容部11eに収容される栽培容器5よりも、収容部11fに収容される栽培容器5の方が、熱伝導体14の熱の影響を受け難い。   Moreover, in other embodiment of this invention, like the accommodating parts 11e and 11f provided in the main-body part 11A of the temperature control apparatus 4A shown in FIG. 7, the accommodation space Re in the accommodating part 11e and the accommodating part 11f The upper surface of the heat conductor 14 may not be exposed in the accommodation space Rf. The performance of heating or cooling can be changed depending on the distance between the bottoms of the accommodating portions 11e and 11f and the heat conductor 14. In the example illustrated in FIG. 7, the distance between the bottom portion of the housing portion 11 e and the heat conductor 14 is shorter than the distance between the bottom portion of the housing portion 11 f and the heat conductor 14. Thereby, the direction of the cultivation container 5 accommodated in the accommodating part 11f is hard to receive the influence of the heat | fever of the heat conductor 14 rather than the cultivation container 5 accommodated in the accommodating part 11e.

本発明の他の実施形態では、被収容物として植物の栽培容器5を収容部11a〜11cに収容したが、栽培容器5以外の被収容物を収容してもよい。例えば、被収容物として、飲料ボトル、食品及び水槽などを収容してもよい。この場合にも、収容する被収容物の外形に沿うように、熱伝導体14に向かって凹状に窪む形状を有する収容部を本体部11に形成する。   In other embodiment of this invention, although the plant cultivation container 5 was accommodated in accommodating part 11a-11c as a to-be-contained object, to-be-contained objects other than the cultivation container 5 may be accommodated. For example, you may accommodate a drink bottle, a foodstuff, a water tank, etc. as a to-be-contained object. Also in this case, the main body portion 11 is formed with a housing portion having a shape that is recessed toward the heat conductor 14 along the outer shape of the object to be housed.

また、本発明の他の実施形態では、図8に示す温度調節装置4Bのように、本体部11Bに形成された収容部11g及び11hの開口部、及び、第一熱源用収容部11dの開口部を覆うカバー(被収容物用カバー・第一熱源用カバー)16を設けてもよい。この場合には、収容部11g及び11h内に収容された被収容物(例えば、冷却を要する食品等)が、外気の温度の影響を受けることを抑制できる。
また、この場合には、第一熱源用収容部11dの開口部を覆うカバー16を備えているため、被収容物が収容部11g及び11hに収容されたときに被収容物の外面全体が断熱材の凹状に窪む形状にぴったりフィットしていなくても(断熱材と隙間が存在していても)、被収容物の温度調整をすることができる。
また、第一熱源15に代えてお湯又は氷水等が収容された容器を第一熱源用収容部11dに設置する場合、カバー16を設けることで、容器内に収容されたお湯又は氷水等が外気の温度変化の影響を受けることを抑制できる。これにより、長時間、収容部11g及び11h内に収容された被収容物を加温又は冷却することができる。なお、被収容物を収容する収容部11g及び11hの開口部を覆うカバー(被収容物用カバー)と、第一熱源用収容部11dの開口部を覆うカバー(第一熱源用カバー)とを個別に形成してもよい。
Moreover, in other embodiment of this invention, like the temperature control apparatus 4B shown in FIG. 8, the opening part of the accommodating parts 11g and 11h formed in the main-body part 11B, and the opening of 11 d of accommodation parts for 1st heat sources. You may provide the cover (cover for to-be-contained objects / cover for 1st heat sources) 16 which covers a part. In this case, it is possible to suppress the objects to be accommodated (for example, foods that require cooling) accommodated in the accommodating portions 11g and 11h from being affected by the temperature of the outside air.
In this case, since the cover 16 that covers the opening of the first heat source accommodating portion 11d is provided, the entire outer surface of the accommodated object is thermally insulated when the accommodated object is accommodated in the accommodating portions 11g and 11h. Even if the shape of the material is not exactly fitted into the concave shape (even if there is a gap between the heat insulating material), the temperature of the object can be adjusted.
Further, when a container in which hot water or ice water is accommodated instead of the first heat source 15 is installed in the first heat source accommodating portion 11d, the cover 16 is provided so that the hot water or ice water or the like accommodated in the container is outside air. It is possible to suppress the influence of the temperature change. Thereby, the to-be-contained object accommodated in the accommodating parts 11g and 11h can be heated or cooled for a long time. In addition, a cover (cover for the object to be stored) that covers the openings of the storage parts 11g and 11h that store the objects to be stored, and a cover (a cover for the first heat source) that covers the opening of the storage part 11d for the first heat source. You may form separately.

本体部11と底部12とによって熱伝導体14を挟み込む構成としたが、熱伝導体14が断熱材内に内包でき、且つ、熱伝導体14に向かって凹状に窪む形状を有する収容部11a等が形成可能であれば、本体部11等の断熱材は他の構成であってもよい。例えば、本体部11と底部12とが一体であってもよい。また、本体部11等の上に、本体部11の外形に沿った形状を有するカバーが設けられていてもよい。   Although the heat conductor 14 is sandwiched between the main body portion 11 and the bottom portion 12, the heat conductor 14 can be included in the heat insulating material and has a shape that is recessed toward the heat conductor 14. As long as it can be formed, the heat insulating material such as the main body 11 may have another configuration. For example, the main body 11 and the bottom 12 may be integrated. Further, a cover having a shape along the outer shape of the main body 11 may be provided on the main body 11 or the like.

ペルチェ素子15aを熱伝導体14の上面に熱的に接続したが、ペルチェ素子15aを熱伝導体14に接続する位置は上面に限定されない。   Although the Peltier element 15a is thermally connected to the upper surface of the heat conductor 14, the position where the Peltier element 15a is connected to the heat conductor 14 is not limited to the upper surface.

1…水耕栽培ユニット、4…温度調節装置、5…栽培容器(被収容物)、11,11A…本体部(断熱材)、12…底部(断熱材)、13…蓋部(断熱材)、14…熱伝導体、15…第一熱源(熱源)、15a…ペルチェ素子、16…カバー(被収容物用カバー、第一熱源用カバー)、11a,11c,11e〜11h…収容部、11b…収容部(他の熱源用収容部)、11d…第一熱源用収容部、21…スペーサ部材、22…遮蔽材、Ra,Rc,Re,Rf…収容空間、Rb…収容空間(他の熱源用収容空間)、Rd…第一熱源用収容空間、X…氷水(他の熱源)。   DESCRIPTION OF SYMBOLS 1 ... Hydroponic cultivation unit, 4 ... Temperature control apparatus, 5 ... Cultivation container (contained object), 11, 11A ... Main-body part (heat insulation material), 12 ... Bottom part (heat insulation material), 13 ... Cover part (heat insulation material) , 14 ... heat conductor, 15 ... first heat source (heat source), 15a ... Peltier element, 16 ... cover (cover for object, cover for first heat source), 11a, 11c, 11e-11h ... housing part, 11b ... storage part (other heat source storage part), 11d ... first heat source storage part, 21 ... spacer member, 22 ... shielding material, Ra, Rc, Re, Rf ... storage space, Rb ... storage space (other heat source) Storage space), Rd ... first heat source storage space, X ... ice water (other heat sources).

Claims (12)

熱伝導体と、
前記熱伝導体を内包する断熱材と、
を備え、
前記断熱材には、被収容物の外形を囲むように前記熱伝導体に向かって凹状に窪む形状に形成されるとともに前記被収容物を収容可能な複数の収容部と、前記熱伝導体に向かって凹状に窪む形状に形成されるとともに熱源を収容可能な熱源用収容部とが設けられ、
前記熱伝導体は、前記熱源用収容部内の熱源用収容空間に露出し、
前記熱伝導体の前記熱源用収容空間に露出する部位は、前記熱源に接続される、被収容物の温度調節装置。
A thermal conductor;
A heat insulating material containing the heat conductor;
With
The heat insulating material is formed in a concave shape toward the heat conductor so as to surround the outer shape of the object to be accommodated, and has a plurality of accommodating parts capable of accommodating the object to be accommodated, and the heat conductor And a heat source accommodating portion capable of accommodating a heat source and being formed in a shape recessed in a concave shape toward the
The heat conductor is exposed to a heat source housing space in the heat source housing section,
The part exposed to the said heat source accommodation space of the said heat conductor is a temperature control apparatus of the to-be-contained object connected to the said heat source.
前記熱伝導体は、前記複数の収容部内のそれぞれの収容空間のうち、少なくともいずれか一つ以上の前記収容空間に露出する、請求項1に記載の被収容物の温度調節装置。   The said temperature conductor is a to-be-contained object temperature control apparatus of Claim 1 exposed to at least any one or more of said accommodation space among each accommodation space in these accommodating parts. 前記熱伝導体のうち前記収容空間に露出する部位と前記収容部に収容される前記被収容物との間に配置される遮蔽材を更に備える、請求項2に記載の被収容物の温度調節装置。   The temperature adjustment of the to-be-contained object of Claim 2 further provided with the shielding material arrange | positioned between the site | part exposed to the said accommodation space among the said heat conductors, and the said to-be-contained object accommodated in the said accommodating part. apparatus. 前記収容部内に設けられ、前記被収容物と前記熱伝導体のうち前記収容空間に露出する部位との距離を離間させるスペーサ部材を更に備える、請求項2又は3に記載の被収容物の温度調節装置。   The temperature of the to-be-contained object of Claim 2 or 3 further provided with the spacer member which spaces apart the distance of the part exposed to the said accommodating space among the said to-be-contained object and the said heat conductor provided in the said accommodating part. Adjusting device. 前記収容部の開口部を覆う被収容物用カバーを更に備える、請求項1から4のいずれか一項に記載の被収容物の温度調節装置。   The device for adjusting temperature of an object to be stored according to any one of claims 1 to 4, further comprising a cover for the object to be covered that covers the opening of the storage portion. 前記熱源用収容部の開口部を覆う熱源用カバーを更に備える、請求項1から5のいずれか一項に記載の被収容物の温度調節装置。   The temperature adjusting device for an object to be stored according to any one of claims 1 to 5, further comprising a heat source cover that covers an opening of the heat source storage portion. 前記熱源を更に備える、請求項1から6のいずれか一項に記載の被収容物の温度調節装置。   The temperature adjusting device for an object according to any one of claims 1 to 6, further comprising the heat source. 前記熱源は、加温及び冷却の少なくともいずれか一方が可能なペルチェ素子を含む、請求項7に記載の被収容物の温度調節装置。   The said heat source is a temperature control apparatus of the to-be-contained object of Claim 7 containing the Peltier device in which at least any one of a heating and cooling is possible. 前記断熱材には、前記熱伝導体に向かって凹状に窪む形状に形成されるとともに他の熱源を収容可能な他の熱源用収容部が更に設けられ、
前記熱伝導体は、前記他の熱源用収容部内の他の熱源用収容空間に露出する、請求項1から8のいずれか一項に記載の被収容物の温度調節装置。
The heat insulating material is further provided with another heat source accommodating portion that is formed in a concave shape toward the heat conductor and can accommodate another heat source,
The said heat conductor is a to-be-contained object temperature control apparatus as described in any one of Claim 1 to 8 exposed to the other heat source accommodating space in the said other heat source accommodating part.
前記他の熱源用収容部は、前記被収容物を収容可能である、請求項9に記載の被収容物の温度調節装置。   The said other heat source accommodating part is a temperature control apparatus of the to-be-contained object of Claim 9 which can accommodate the said to-be-contained object. 前記断熱材は、フェノール樹脂、ポリスチレン樹脂、フェノール樹脂発泡体又はポリスチレン樹脂発泡体からなる、請求項1から10のいずれか一項に記載の被収容物の温度調節装置。   The said heat insulating material is a temperature control apparatus of the to-be-contained object as described in any one of Claim 1 to 10 which consists of a phenol resin, a polystyrene resin, a phenol resin foam, or a polystyrene resin foam. 前記被収容物は、液体を収容する水耕栽培用の栽培容器である、請求項1から11のいずれか一項に記載の被収容物の温度調節装置。   The said accommodation thing is a cultivation container for hydroponics which accommodates a liquid, The temperature control apparatus of the accommodation thing as described in any one of Claim 1 to 11.
JP2014138371A 2014-07-04 2014-07-04 Temperature regulator of housed object Pending JP2016018232A (en)

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