JP2016004879A - Housing structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a housing structure capable of reducing distortion caused by a temperature change when using a bottom plate and a frame body composed of materials having different thermal expansion coefficients, and accurately positioning the bottom plate at the frame body.SOLUTION: A laser module 100 as a housing structure includes a frame body 10 and a bottom plate 20 having different thermal expansion coefficients. The frame body 10 comprises a first side wall 11 including a first inside facing surface 11A, and a second side wall 12 facing the first side wall 11 and including a second inside facing surface 12A. The bottom plate 20 comprises a first side surface 21 in contact with the first inside facing surface 11A of the frame body 10, and a second side surface 22 facing the second inside facing surface 12A of the frame body 10 in a state in which a gap 15 is formed between a first side wall 21 contacting with the first inside facing surface 11A of the frame body 10 and the second inside facing surface 12A of the frame body 10.

Description

  The present invention relates to a housing structure, and more particularly to a housing structure composed of a frame body and a bottom plate having different thermal expansion coefficients.

  As an example of a housing structure composed of a frame body and a bottom plate having different thermal expansion coefficients, there is a laser module. As a structure of such a laser module, a structure in which a frame is attached to the upper surface of a bottom plate is known (for example, see Patent Document 1).

  In such a housing structure, since the thermal expansion coefficients of the bottom plate and the frame are different, when the housing structure is heated in a heat cycle test or the like, the difference between the thermal expansion coefficient of the bottom plate and the frame causes the bottom plate and the frame. There arises a problem that stress is generated in the joint portion of the metal plate and the bottom plate is deformed (warped). In particular, in the structure of Patent Document 1, since the bottom plate is larger than the region surrounded by the side wall of the frame body, there is a problem that distortion generated in the bottom plate is increased.

  Further, since it is necessary to mount a mounting member such as a semiconductor laser diode or an optical fiber with high accuracy on the bottom plate, it is necessary to fix the bottom plate to the frame body with high accuracy. However, since the structure of Patent Document 1 is a structure in which a frame is attached to the upper surface of the bottom plate, there is a problem that it is difficult to accurately position the bottom plate with respect to the frame.

JP 2013-183074 A

  The present invention has been made in view of such problems of the prior art, and reduces distortion caused by thermal expansion when a bottom plate and a frame made of materials having different thermal expansion coefficients are used. It is a first object to provide a housing structure that can accurately position the bottom plate with respect to the housing.

  In addition, the present invention provides a housing structure that includes a bottom plate and a frame made of materials having different thermal expansion coefficients, and that can reduce distortion due to thermal expansion and can accurately position the bottom plate with respect to the frame. It is a second object to provide a method for manufacturing a structure.

  According to the first aspect of the present invention, when a bottom plate and a frame body made of materials having different thermal expansion coefficients are used, distortion caused by thermal expansion is reduced, and the bottom plate is accurately positioned with respect to the frame body. A housing structure is provided. The housing structure includes a frame body having a first thermal expansion coefficient and a bottom plate having a second thermal expansion coefficient different from the first thermal expansion coefficient. The frame includes a first side wall having a first inner facing surface and a second side wall facing the first side wall. The second side wall has a second inner facing surface. The bottom plate has a second gap between the first side surface in contact with the first inner facing surface of the frame body and a second inner facing surface of the frame body. And a second side surface facing the inner facing surface.

  According to such a configuration, since the bottom plate is disposed inside the first side wall and the second side wall of the frame body, the bottom plate is made smaller than a region sandwiched between the first side wall and the second side wall. Can do. Therefore, the amount of thermal expansion of the bottom plate accompanying a temperature change can be reduced, and deformation of the bottom plate can be suppressed. In addition, since a gap is formed between the second side surface of the bottom plate and the second inner facing surface of the frame body, even if the bottom plate extends due to thermal expansion, the influence can be mitigated by this gap. . Further, since the first side surface of the bottom plate is in contact with the first inner facing surface of the frame body, the bottom plate can be accurately positioned in at least one direction with reference to the first inner facing surface of the frame body. .

  The housing structure may further include a mounting member fixed to both the bottom plate and the first side wall of the frame. According to such a configuration, the tensile stress generated in the mounting member due to the thermal expansion of the frame body and the bottom plate accompanying the temperature change can be reduced, and the mounting member can be prevented from being broken. In this case, for example, the housing structure may be a laser module having a semiconductor laser diode fixed to the bottom plate and an optical fiber as the mounting member.

  The first linear expansion coefficient may be larger than the second linear expansion coefficient. The frame may further include a third side wall extending between the first side wall and the second side wall. The third side wall has a third inner facing surface. The bottom plate may further include a third side surface in contact with the third inner facing surface of the frame. According to such a configuration, since the third side surface of the bottom plate is in contact with the third inner facing surface of the frame, not only the first inner facing surface of the frame but also the third inner facing surface is provided. As a reference, the bottom plate can be accurately positioned in two directions.

  The bottom plate may further have a contact surface perpendicular to the first side surface and the third side surface, and the frame body has a locking surface for locking the contact surface of the bottom plate. You may have. According to such a configuration, since the contact surface of the bottom plate is locked to the locking surface of the frame body, not only the first inner facing surface and the third inner facing surface of the frame body but also the frame The bottom plate can be accurately positioned in three directions with reference to the locking surface of the body. In this case, the frame body may have a convex portion protruding inward, and the convex portion may have the locking surface described above.

  According to the second aspect of the present invention, in a housing structure including a bottom plate and a frame body made of materials having different thermal expansion coefficients, distortion due to thermal expansion is reduced, and the bottom plate is accurately positioned with respect to the frame body. A method for manufacturing a housing structure is provided. In this method, a frame body having a first thermal expansion coefficient and a bottom plate having a second thermal expansion coefficient different from the first thermal expansion coefficient are prepared. The frame includes a first side wall having a first inner facing surface and a second side wall facing the first side wall. The second side wall has a second inner facing surface. The bottom plate has a first side surface and a second side surface. A state in which the first side surface of the bottom plate is in contact with the first inner facing surface of the frame body and a gap is formed between the second side surface of the bottom plate and the second inner facing surface of the frame body Then, the bottom plate is fixed to the frame body so that the second side surface of the bottom plate faces the second inner facing surface of the frame body.

  Furthermore, the mounting member may be fixed to both the bottom plate and the first side wall of the frame. For example, the housing structure may be a laser module having a semiconductor laser diode fixed to the bottom plate and an optical fiber as the mounting member.

  The first linear expansion coefficient may be larger than the second linear expansion coefficient. The frame may be a third side wall extending between the first side wall and the second side wall, and may further include a third side wall having a third inner facing surface. In this case, when the bottom plate is fixed to the frame body, the bottom plate is fixed to the frame body so that the third side surface of the bottom plate is in contact with the third inner facing surface of the frame body. May be.

  Further, when the bottom plate is fixed to the frame body, the contact surfaces perpendicular to the first side surface and the third side surface of the bottom plate may be locked by the locking surface formed on the frame body. Good. In this case, the contact surface of the bottom plate may be locked by a locking surface of a convex portion protruding inward from the frame body.

  According to the present invention, since the bottom plate is disposed inside the first side wall and the second side wall of the frame body, the bottom plate can be made smaller than a region sandwiched between the first side wall and the second side wall. . Therefore, the amount of thermal expansion of the bottom plate accompanying a temperature change can be reduced, and deformation of the bottom plate can be suppressed. In addition, since a gap is formed between the second side surface of the bottom plate and the second inner facing surface of the frame body, even if the bottom plate extends due to thermal expansion, the influence can be mitigated by this gap. . Further, since the first side surface of the bottom plate is in contact with the first inner facing surface of the frame body, the bottom plate can be accurately positioned in at least one direction with reference to the first inner facing surface of the frame body. .

It is a top view which shows typically the laser module in the 1st Embodiment of this invention. FIG. 2 is a bottom view schematically showing the laser module in FIG. 1. It is the III-III sectional view taken on the line of FIG. It is the IV-IV sectional view taken on the line of FIG. It is sectional drawing at the time of arrange | positioning a baseplate by the method different from the 1st Embodiment of this invention. It is sectional drawing which shows typically the method to manufacture the laser module in the 1st Embodiment of this invention. It is sectional drawing which shows typically the method to manufacture the laser module in the 1st Embodiment of this invention. It is sectional drawing which shows typically the method to manufacture the laser module in the 1st Embodiment of this invention. It is sectional drawing which shows typically the laser module in the 2nd Embodiment of this invention. It is sectional drawing which shows typically the laser module in the 3rd Embodiment of this invention.

  Hereinafter, embodiments of a housing structure according to the present invention will be described in detail with reference to FIGS. 1 to 9. In FIG. 1 to FIG. 9, the same or corresponding components are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is a plan view schematically showing a laser module 100 according to the first embodiment of the present invention, and FIG. 2 is a bottom view. As shown in FIGS. 1 and 2, the laser module 100 includes a frame 10 having four side walls, a flat bottom plate 20, a submount 30 mounted on the bottom plate 20, and a submount 30. A laser mount 40 placed, a semiconductor laser diode 50 placed on the laser mount 40, and a fiber mount 60 placed on the submount 30 are provided. Here, the frame body 10 and the bottom plate 20 are formed of materials having different linear expansion coefficients, and the linear expansion coefficient of the frame body 10 is larger than the linear expansion coefficient of the bottom plate 20.

  A fiber hole (not shown) for inserting an optical fiber 70 extending in the X direction is formed in the frame body 10, and an end of the optical fiber 70 inserted through the fiber hole is soldered on the fiber mount 60, for example. 62 is fixed. At this time, the optical fiber 70 is arranged so that the laser light emitted from the semiconductor laser diode 50 is coupled to the tip portion 70A of the optical fiber 70, and the laser light emitted from the semiconductor laser diode 50 is The light enters the front end portion 70A and propagates through the optical fiber 70.

  As shown in FIG. 1, the frame 10 includes a first side wall 11 extending along the Y direction, a second side wall 12 extending along the Y direction so as to face the first side wall 11, and a first side wall 11. A third side wall 13 extending along the X direction between the side wall 11 and the second side wall 12 and a fourth side wall 14 extending along the X direction opposite to the third side wall 13 are included. . As shown in FIG. 2, the first side wall 11 has an inner facing surface 11 </ b> A that faces a space surrounded by the four side walls 11 to 14. Similarly, the second side wall 12 has an inner facing surface 12A, the third side wall 13 has an inner facing surface 13A, and the fourth side wall 14 has an inner facing surface 14A. The bottom plate 20 includes a first side surface 21 that faces the inner facing surface 11 </ b> A of the first side wall 11, a second side surface 22 that faces the inner facing surface 12 </ b> A of the second side wall 12, and the third side wall 13. A third side surface 23 facing the inner facing surface 13A and a fourth side surface 24 facing the inner facing surface 14A of the fourth side wall 14 are included.

  As shown in FIG. 2, among the four side surfaces of the bottom plate 20, the first side surface 21 and the third side surface 23 are the inner facing surface 11 </ b> A of the first side wall 11 of the frame 10 and the inner side of the third side wall 13, respectively. It is in contact with the facing surface 13A. The second side surface 22 and the fourth side surface 24 of the bottom plate 20 are not in contact with the frame body 10, and are between the second side surface 22 of the bottom plate 20 and the inner facing surface 12 </ b> A of the second side wall 12 of the frame body 10. A gap 15 is formed between the fourth side surface 24 of the bottom plate 20 and the inner facing surface 14 </ b> A of the fourth side wall 14 of the frame body 10.

  3 is a cross-sectional view taken along line III-III in FIG. 1, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. As shown in FIG. 3, the first side wall 11 and the second side wall 12 of the frame body 10 are respectively formed with convex portions 81 and 82 that project inside the frame body 10. The lower surface 81A of the convex portion 81 extends perpendicularly from the inner facing surface 11A of the first side wall 11 toward the inside of the frame body 10, and is engaged with the peripheral edge portion 25 (contact surface) of the upper surface of the bottom plate 20. Configure the surface. Similarly, the lower surface 82 </ b> A of the convex portion 82 extends vertically from the inner facing surface 12 </ b> A of the second side wall 12 toward the inside of the frame body 10, and the peripheral edge 25 (contact surface) on the upper surface of the bottom plate 20. A contact surface is formed. Further, as shown in FIG. 4, the third side wall 13 and the fourth side wall 14 of the frame body 10 are also formed with protrusions 83 and 84 that protrude inward of the frame body 10. The lower surface 83A of the convex portion 83 extends perpendicularly from the inner facing surface 13A of the third side wall 13 toward the inside of the frame body 10, and is engaged with the peripheral edge portion 25 (contact surface) of the upper surface of the bottom plate 20. Configure the surface. Similarly, the lower surface 84 </ b> A of the convex portion 84 extends perpendicularly from the inner facing surface 14 </ b> A of the fourth side wall 14 toward the inner side of the frame body 10, and the peripheral edge 25 (contact surface) of the upper surface of the bottom plate 20. A contact surface is formed.

  Here, the lengths of the protrusions 81 and 82 extending in the X direction are preferably larger than the width of the gap 15 in the X direction, and the lengths of the protrusions 83 and 84 extending in the Y direction are the lengths of the gap 16. It is preferably larger than the width in the Y direction. Since the bottom plate 20 is easily engaged with the convex portions 81 to 84 when the bottom plate 20 is attached to the frame body 10 by using the convex portions 81 to 84 having such a length, the bottom plate 20 is attached to the frame body 10. Mounting can be facilitated.

  As described above, the bottom plate 20 in the present embodiment is disposed inside the side walls 11 to 14 of the frame body 10 and is formed smaller than a region surrounded by the side walls 11 to 14. Therefore, compared with the case where the same frame 10 is used for the laser module described in Patent Document 1, the amount of thermal expansion of the bottom plate 20 due to temperature change can be reduced, and deformation of the bottom plate 20 can be suppressed. Further, between the second side surface 22 of the bottom plate 20 and the inner facing surface 12A of the second side wall 12 of the frame body 10, and the inner side facing of the fourth side surface 24 of the bottom plate 20 and the fourth side wall 14 of the frame body 10. Since the gaps 15 and 16 are formed between the surface 14A, even if the bottom plate 20 extends due to thermal expansion, the influence can be mitigated by the gaps 15 and 16.

  On the other hand, since the first side surface 21 of the bottom plate 20 is in contact with the inner facing surface 11A of the first side wall 11 of the frame body 10, the X direction is set with reference to the inner facing surface 11A of the first side wall 11 of the frame body 10. It is possible to position the bottom plate 20 accurately. Similarly, since the third side surface 23 of the bottom plate 20 is in contact with the inner facing surface 13A of the third side wall 13 of the frame body 10, the inner facing surface 13A of the third side wall 13 of the frame body 10 is used as a reference. It is possible to accurately position the bottom plate 20 in the direction. In other words, the bottom plate 20 can be accurately positioned in the XY direction with reference to the point P (see FIG. 2) where the first side wall 11 and the third side wall 13 of the frame 10 intersect.

  Furthermore, in this embodiment, since the contact surface 25 at the peripheral edge of the upper surface of the bottom plate 20 comes into contact with the locking surface 18 that is the lower surface of the convex portions 81 to 84 of the frame body 10, the frame body 10. The bottom plate 20 can be accurately positioned in the Z direction with reference to the lower surfaces of the convex portions 81 to 84.

  Here, it is conceivable that tensile stress is generated in the optical fiber 70 fixed to the frame 10 and the bottom plate 20 due to thermal expansion of the frame 10 and the bottom plate 20 due to temperature change. In the present embodiment, as shown in FIG. 3, the side surface (first side surface 21) of the bottom plate 20 is in contact with the inner surface (inner facing surface 11 </ b> A) of the side wall of the frame 10 to which the optical fiber 70 is fixed. Therefore, the tensile stress generated in the optical fiber 70 can be reduced. That is, as shown in FIG. 3, the first side surface 21 of the bottom plate 20 is in contact with the inner facing surface 11 </ b> A of the first side wall 11 of the frame body 10, but the second side surface 22 of the bottom plate 20 and the frame body 10. A gap 15 is formed between the second side wall 12 and the inner facing surface 12A. With such a configuration, the tensile stress of the optical fiber 70 accompanying the temperature change of the laser module 100 is reduced. Hereinafter, this point will be described.

When the thermal expansion coefficient of the bottom plate 20 at a certain temperature is α, the thermal expansion coefficient of the frame body 10 is β, and the temperature change is ΔT, the center of the first side wall 11 of the frame body 10 shown in FIG. The amount of change ΔL of the length L of the optical fiber 70 up to the solder 62 is obtained by the following equation (1).
ΔL = (L _A1 α + L _B β) ΔT (1)

Here, as shown in FIG. 5, the first side surface 21 of the bottom plate 20 is not in contact with the inner facing surface 11 </ b> A of the first side wall 11 of the frame body 10, and the second side surface 22 of the bottom plate 20 is the frame body 10. Consider a case where the second side wall 12 contacts the inner facing surface 12A. At this time, a change amount ΔL ′ of the length L of the optical fiber 70 from the center in the X direction of the first side wall 11 of the frame body 10 to the solder 62 on the fiber mount 60 is obtained by the following equation (2).
ΔL ′ = ((L _B + L _A1 + L _A2 + d) β− (L _A2 + d) α) ΔT
= ((L _B + L _A1 ) β + (L _A2 + d) (β−α)) ΔT (2)

Here, since the thermal expansion coefficient β of the frame 10 is larger than the thermal expansion coefficient α of the bottom plate 20 (β> α), the following formula (3) is derived from the formula (1).
ΔL = (L _A1 α + L _B β) ΔT <(L _A1 + L _B ) βΔT (3)
Further, the following equation (4) is derived from the equation (2).
ΔL ′ = ((L _B + L _A1 ) β + (L _A2 + d) (β−α)) ΔT> (L _A1 + L _B ) βΔT
... (4)
From these equations (3) and (4), the following equation (5) is established.
ΔL <(L _A1 + L _B ) βΔT <ΔL ′ (5)

  In this way, ΔL <ΔL ′ and the second side surface 22 of the bottom plate 20 is when the first side surface 21 of the bottom plate 20 is in contact with the inner facing surface 11A of the first side wall 11 of the frame body 10. It can be seen that the amount of change ΔL of the length L of the optical fiber 70 can be made smaller than when contacting the inner facing surface 12A of the second side wall 12 of the frame 10. That is, the first side surface 21 of the bottom plate 20 is in contact with the inner facing surface 11A of the first side wall 11 of the frame body 10, and the second side surface 22 of the bottom plate 20 and the inner side surface of the second side wall 12 of the frame body 10 are opposed to each other. When the gap 15 is formed with the surface 12A, it is possible to reduce the tensile stress generated in the optical fiber 70 due to the thermal expansion of the frame 10 and the bottom plate 20 due to the temperature change. Therefore, it is possible to prevent the optical fiber 70 from being broken due to thermal expansion accompanying temperature change.

  The bottom plate 20 is fixed to the frame 10 with an adhesive or solder, but these adhesive and solder are not shown. Since the adhesive can absorb the deformation of the bottom plate 20 and the frame body 10 due to temperature changes to some extent, it is preferable to fix the bottom plate 20 to the frame body 10 using an adhesive material. For example, between the first side surface 21 of the bottom plate 20 and the inner facing surface 11 </ b> A of the first side wall 11 of the frame body 10, the inner side facing of the third side surface 23 of the bottom plate 20 and the third side wall 13 of the frame body 10. Between the surface 13A, between the second side surface 22 of the bottom plate 20 and the inner facing surface 12A of the second side wall 12 of the frame 10, and between the fourth side surface 24 of the bottom plate 20 and the fourth side wall of the frame 10. 14 between the inner facing surface 14A and the peripheral portion 25 on the upper surface of the bottom plate 20 and the lower surfaces 81A, 82A, 83A, and 84A of the convex portions 81 to 84 of the frame body 10. It is preferable to make it. In particular, as shown in FIG. 2, it is preferable to interpose an adhesive at a point P where the first side wall 11 and the third side wall 13 of the frame 10 intersect. Thus, in this specification, “contact” or “contact” includes not only the case where members directly contact each other but also the case where an adhesive is interposed between the members.

  In the present embodiment, as shown in FIG. 3, the bottom plate 20 protrudes downward from the lower end of the frame body 10. Accordingly, when the laser module 100 is attached to a heat sink (not shown) or the like, the entire lower surface of the bottom plate 20 comes into contact with the heat sink, so that the bottom plate 20 is reliably brought into contact with the heat sink to effectively cool the laser module 100. It can be carried out.

  Next, a method for manufacturing the laser module of this embodiment will be described with reference to FIGS. When manufacturing the laser module of this embodiment, first, the submount 30, the laser mount 40, the semiconductor laser diode 50, and the fiber mount 60 are fixed and mounted on the bottom plate 20 (FIG. 6).

  Then, the frame body 10 is turned upside down and an adhesive (see FIG. 8) is attached to at least a part of the lower surfaces 81A, 82A, 83A, 84A of the convex portions 81-84 or the inner facing surfaces 11A, 12A, 13A, 14A of the frame body 10 in the vicinity. (Not shown) is applied (FIG. 7). By using a UV curable resin that does not need to be heated as the adhesive at this time, the occurrence of thermal expansion may be prevented.

  Thereafter, the bottom plate 20 on which the mounting member such as the semiconductor laser diode 50 is mounted is turned over, and the bottom plate 20 is inserted into the accommodating portion 17 defined by the side walls 11 to 14 and the convex portions 81 to 84 of the frame body 10, The bottom plate 20 is placed on the convex portions 81 to 84 (FIG. 8). At this time, the first side surface 21 of the bottom plate 20 is in contact with the inner facing surface 11A of the first side wall 11 of the frame body 10, and the third side surface 23 of the bottom plate 20 is the third side wall 13 of the frame body 10. The bottom plate 20 is inserted so as to contact the inner facing surface 13A. Accordingly, the bottom plate 20 can be fixed to the frame body 10 in a state where the bottom plate 20 is accurately positioned in the two directions XY. Further, since the contact surface 25 (the lower surface in FIG. 8) of the bottom plate 20 is locked to the locking surfaces 81A, 82A, 83A, 84A (the upper surface in FIG. 8) of the convex portions 81 to 84 of the frame body 10, The bottom plate 20 can be fixed to the frame body 10 in a state where the bottom plate 20 is also accurately positioned in the Z direction.

  Finally, the optical fiber 70 is inserted into the fiber hole formed in the side wall 11 of the frame 10 and the optical fiber 70 is positioned at an appropriate position. Fix it. Thereby, the laser module 100 as shown in FIG. 3 is completed.

  As described above, according to the present embodiment, the inner facing surfaces 11A, 12A, 13A, and 14A of the side walls 11 to 14 of the frame 10 and the locking surfaces 81A, 82A, 83A, and 84A of the convex portions 81 to 84 are defined. By inserting the bottom plate 20 into the accommodating portion 17, the bottom plate 20 can be fixed to the frame body 10 with the bottom plate 20 positioned relative to the frame body 10. Therefore, the assembly of the laser module 100 becomes extremely easy.

  FIG. 9 is a cross-sectional view schematically showing a laser module according to the second embodiment of the present invention. As shown in FIG. 9, in the present embodiment, the bottom plate 20 is disposed above the convex portions 81 to 84 (the convex portions 83 and 84 are not shown) of the frame body 10. Other configurations are the same as those in the first embodiment described above. In the present embodiment, the peripheral edge portion of the bottom surface of the bottom plate 20 constitutes a contact surface 125 that faces the convex portions 81 to 84, and this contact surface 125 is the upper surface 81B, 82B, 83B, 84B of the convex portions 81 to 84. (The upper surfaces 83B and 84B are not shown). Therefore, in this embodiment, the upper surfaces 81B, 82B, 83B, and 84B of the convex portions 81 to 84 constitute a locking surface.

  FIG. 10 is a cross-sectional view schematically showing a laser module according to the third embodiment of the present invention. In embodiment mentioned above, although the baseplate 20 was attached using the convex parts 81-84 formed in the frame 10, as shown in FIG. 10, the side walls 11-11 of a frame are not provided without providing the convex parts 81-84. 14, inner facing surfaces 11 </ b> A, 12 </ b> A, 13 </ b> A, 14 </ b> A (only the inner facing surfaces 11 </ b> A, 12 </ b> A are shown in FIG. 10) and locking surfaces 11 </ b> B, 12 </ b> B, 13 </ b> B, 14 </ b> B ( In FIG. 10, only the locking surfaces 11B and 12B are shown).

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and it goes without saying that the present invention may be implemented in various forms within the scope of the technical idea. For example, in the above-described embodiment, the convex portions 81 to 84 projecting inward from the respective side walls 11 to 14 of the frame body 10 are formed, but such convex portions are formed on all the side walls 11 of the frame body 10. It is not necessary to form in -14, What is necessary is just to form a convex part in at least 1 of the side walls 11-14.

  It should be noted that the terms “upper surface”, “lower surface”, “bottom surface”, “lower”, “upper” and other positional relationships used in this specification are used in the context of the illustrated embodiment. Therefore, it can be understood that it changes depending on the relative positional relationship of the components in the laser module 100.

  Further, in the above-described embodiment, the laser module has been described as an example of the housing structure. However, the present invention is not limited to the laser module as long as it includes a frame body and a bottom plate having different thermal expansion coefficients. It can be applied to a housing structure.

DESCRIPTION OF SYMBOLS 10 Frame 11 1st side wall 11A Inner facing surface 12 2nd side wall 12A Inner facing surface 13 3rd side wall 13A Inner facing surface 14 4th side wall 14A Inner facing surface 15, 16 Gap 17 Storage part 20 Bottom plate 21 First 1 side surface 22 second side surface 23 third side surface 24 fourth side surface 25 contact surface 30 submount 40 laser mount 50 semiconductor laser diode 60 fiber mount 62 solder 70 optical fiber 81 convex portion 81A locking surface 82 convex portion 82A Locking surface 83 Projection 83A Locking surface 84 Projection 84A Locking surface 100 Laser module 125 Contact surface 210 Notch

Claims (14)

A housing structure having a frame having a first thermal expansion coefficient and a bottom plate having a second thermal expansion coefficient different from the first thermal expansion coefficient,
The frame is
A first sidewall having a first inner facing surface;
A second side wall facing the first side wall, the second side wall having a second inner facing surface;
Have
The bottom plate is
A first side surface in contact with a first inner facing surface of the frame body;
A second side surface facing the second inner facing surface of the frame body with a gap formed between the second inner facing surface of the frame body;
A housing structure characterized by comprising:   The housing structure according to claim 1, further comprising a mounting member fixed to both the bottom plate and the first side wall of the frame.   The housing structure according to claim 2, wherein the housing structure is a laser module having a semiconductor laser diode fixed to the bottom plate and an optical fiber as the mounting member.   4. The housing structure according to claim 1, wherein the first linear expansion coefficient is larger than the second linear expansion coefficient. 5. The frame body further includes a third side wall extending between the first side wall and the second side wall, the third side wall having a third inner facing surface,
5. The housing structure according to claim 1, wherein the bottom plate further has a third side surface in contact with a third inner facing surface of the frame body. The bottom plate further has a contact surface perpendicular to the first side surface and the third side surface,
The housing structure according to claim 5, wherein the frame body has a locking surface that locks a contact surface of the bottom plate.   The casing structure according to claim 6, wherein the frame body includes a convex portion protruding inward and having the locking surface. A frame having a first thermal expansion coefficient, a first side wall having a first inner facing surface, and a second side wall facing the first side wall, the second inner facing surface Preparing a frame having a second side wall having
A bottom plate having a second thermal expansion coefficient different from the first thermal expansion coefficient, the base plate having a first side surface and a second side surface;
A state in which the first side surface of the bottom plate is in contact with the first inner facing surface of the frame body, and a gap is formed between the second side surface of the bottom plate and the second inner facing surface of the frame body The method of manufacturing a housing structure, wherein the bottom plate is fixed to the frame body so that the second side surface of the bottom plate faces the second inner facing surface of the frame body.   Furthermore, the mounting member is fixed to both the bottom plate and the first side wall of the frame body.   10. The method of manufacturing a housing structure according to claim 9, wherein the housing structure is a laser module having a semiconductor laser diode fixed to the bottom plate and an optical fiber as the mounting member.   The method for manufacturing a housing structure according to any one of claims 8 to 10, wherein the first linear expansion coefficient is larger than the second linear expansion coefficient. The frame further includes a third side wall extending between the first side wall and the second side wall, the third side wall having a third inner facing surface;
When fixing the bottom plate to the frame, the bottom plate is further fixed to the frame so that a third side surface of the bottom plate is in contact with the third inner facing surface of the frame. The method for manufacturing a housing structure according to any one of claims 8 to 11, wherein:   When the bottom plate is fixed to the frame body, the contact surfaces perpendicular to the first side surface and the third side surface of the bottom plate are further locked by a locking surface formed on the frame body. The method for manufacturing a housing structure according to claim 12, characterized in that:   The method for manufacturing a housing structure according to claim 13, wherein the contact surface of the bottom plate is locked by a locking surface of a convex portion protruding inward from the frame body.

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