JP2015231002A - Manufacturing method of package for electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a package for an electronic device capable of thickening a terminal and accurately forming the terminal.SOLUTION: A method for manufacturing a package for an electronic device includes the steps of: preparing an insulating substrate and a metal plate; sticking the insulating substrate and the metal plate; and forming a terminal by removing a part of the metal plate. The terminal forming step preferably removes the metal plate by etching. In the preparing step, a constituent material of the insulating substrate preferably includes glass. The thickness of the terminal is preferably not less than 50 μm.

Description

  The present invention relates to a method for manufacturing an electronic device package.

  For example, Patent Document 1 describes a crystal resonator in which a crystal piece is accommodated in a package (electronic device package) having a cap member and a base member.

  The surface of the base member opposite to the cap member is provided with a terminal that is used when the crystal resonator is mounted on a circuit board (mounting board) and is connected to the circuit board with solder or the like. This terminal is formed by applying a conductive paste and baking.

  However, in the conventional terminal forming method (electronic device package manufacturing method), it is difficult to form a thick terminal. That is, the thickness of the metal layer formed by performing the process of applying and baking the conductive paste once is thin. Therefore, in order to provide a thick terminal, the process needs to be performed a plurality of times. Since a shift occurs between the metal layers formed in the steps, and the metal layer contracts during firing, a thick terminal cannot be formed with high accuracy.

  When the terminal is thin, when the crystal unit is mounted on the circuit board, stress is generated in the package due to the difference in thermal expansion coefficient between the package and the circuit board. The frequency characteristics will fluctuate.

JP-A-6-279103

  An object of the present invention is to provide a method of manufacturing a package for an electronic device that can form a terminal with a high thickness and high accuracy.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The method for manufacturing an electronic device package of the present invention includes a step of preparing an insulating substrate and a metal plate,
Bonding the insulating substrate and the metal plate;
And a step of removing a part of the metal plate to form a terminal.

Thereby, the terminal can be formed thick and with high accuracy.
By providing a thick terminal, an electronic device package having excellent stress relaxation characteristics can be provided. In other words, in a state where the electronic device package containing the electronic device is mounted on the circuit board (mounting board), the terminal functions as a buffer member, and thereby the electronic device is expanded and contracted by heat or the like. The stress generated in the device package can be absorbed and relaxed. Thereby, it can suppress that the said stress is transmitted to an electronic device and the characteristic of an electronic device fluctuates.

[Application Example 2]
In the manufacturing method of the package for electronic devices of this invention, it is preferable to remove a metal plate by an etching in the process of forming the said terminal.
Thereby, a terminal can be formed easily and with excellent dimensional accuracy.

[Application Example 3]
In the method for manufacturing an electronic device package according to the present invention, in the step of preparing, the constituent material of the insulating substrate preferably includes glass.
Thereby, an insulating substrate can be processed easily.

[Application Example 4]
The method for manufacturing an electronic device package according to the present invention preferably includes a step of removing a part of the insulating substrate and forming a first recess opening on a surface of the insulating substrate opposite to the metal plate. .
Thereby, a recessed part can be used as a space which accommodates an electronic device.

[Application Example 5]
The method for manufacturing an electronic device package of the present invention preferably includes a step of removing a part of the insulating substrate and forming a second recess opening in the surface of the insulating substrate on the metal plate side.

  Thereby, the flexibility of the package for electronic devices increases, and the package for electronic devices which has the outstanding stress relaxation characteristic can be provided. Further, for example, heat generated when mounting using solder or the like can be released from the second recess.

[Application Example 6]
In the manufacturing method of the package for electronic devices of this invention, it is preferable to include the process of bending the said metal plate.

  Thereby, a bent terminal is formed, and when mounted using, for example, solder, it is difficult to peel off due to the anchor effect.

[Application Example 7]
In the manufacturing method of the package for electronic devices of this invention, it is preferable to include the process of forming the site | part from which thickness differs in the said metal plate.

  As a result, a terminal having a portion having a different thickness is formed. When the terminal is mounted using, for example, solder, it is difficult to peel off due to the anchor effect.

[Application Example 8]
In the manufacturing method of the package for electronic devices of this invention, it is preferable that the said metal plate is a laminated body in the process of forming the said terminal.
Thereby, the terminal of various shapes can be formed easily.

[Application Example 9]
In the method for manufacturing an electronic device package according to the present invention, the constituent materials of at least two layers constituting the laminate are preferably different metal materials.
Thereby, the terminal of various shapes can be formed easily.

[Application Example 10]
In the manufacturing method of the package for electronic devices of this invention, it is preferable to include the process of forming the site | part which protruded in the said metal plate.

  As a result, a terminal having a protruding portion is formed, and when mounted using, for example, solder, it is difficult to peel off due to the anchor effect.

[Application Example 11]
In the method for manufacturing an electronic device package of the present invention, the thickness of the terminal is preferably 50 μm or more.

  Thereby, the package for electronic devices which has the outstanding stress relaxation characteristic can be provided.

It is a top view which shows the vibrator | oscillator using the package for electronic devices manufactured by the manufacturing method of the package for electronic devices which concerns on 1st Embodiment of this invention. It is the sectional view on the AA line in FIG. FIG. 2 is a plan view illustrating a vibration element included in the vibrator illustrated in FIG. 1. FIG. 2 is a cross-sectional view illustrating a state where the vibrator illustrated in FIG. 1 is mounted on a circuit board. FIG. 8 is a cross-sectional view for explaining the method for manufacturing the vibrator shown in FIG. 1. FIG. 8 is a cross-sectional view for explaining the method for manufacturing the vibrator shown in FIG. 1. FIG. 8 is a cross-sectional view for explaining the method for manufacturing the vibrator shown in FIG. 1. FIG. 8 is a cross-sectional view for explaining the method for manufacturing the vibrator shown in FIG. 1. 3 is a graph showing the relationship between the thickness of an external connection terminal of the vibrator shown in FIG. 1 and the maximum stress generated in a base substrate. It is sectional drawing which shows the vibrator | oscillator using the package for electronic devices manufactured by the manufacturing method of the package for electronic devices which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows the vibrator | oscillator using the package for electronic devices manufactured by the manufacturing method of the package for electronic devices which concerns on 3rd Embodiment of this invention. It is sectional drawing which shows the vibrator | oscillator using the package for electronic devices manufactured by the manufacturing method of the package for electronic devices which concerns on 4th Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the package for electronic devices shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the package for electronic devices shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the package for electronic devices shown in FIG. It is sectional drawing which shows the vibrator | oscillator using the package for electronic devices manufactured by the manufacturing method of the package for electronic devices which concerns on 5th Embodiment of this invention. It is sectional drawing which shows the vibrator | oscillator using the package for electronic devices manufactured by the manufacturing method of the package for electronic devices which concerns on 6th Embodiment of this invention. It is a perspective view which shows the structure of the mobile type (or notebook type) personal computer provided with a vibrator. It is a perspective view which shows the structure of a mobile telephone (A PHS is also included) provided with a vibrator. It is a perspective view which shows the structure of a digital still camera provided with a vibrator. It is a perspective view which shows a moving body provided with a vibrator.

  Hereinafter, the manufacturing method of the package for electronic devices of this invention is demonstrated in detail based on embodiment shown to an accompanying drawing.

<First Embodiment>
FIG. 1 is a plan view showing a vibrator using an electronic device package manufactured by the electronic device package manufacturing method according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a plan view showing a vibration element included in the vibrator shown in FIG. FIG. 4 is a cross-sectional view showing a state in which the vibrator shown in FIG. 1 is mounted on a circuit board. 5 to 8 are cross-sectional views for explaining a method of manufacturing the vibrator shown in FIG. FIG. 9 is a graph showing the relationship between the thickness of the external connection terminal of the vibrator shown in FIG. 1 and the maximum stress generated in the base substrate 3. In the following description, the front side in FIG. 1 and the upper side in FIG. 2 are referred to as “up”, and the back side in FIG. 1 and the lower side in FIG. The figure corresponding to FIG. 2 of the embodiment is also the same).

≪Oscillator≫
First, a vibrator using an electronic device package will be described.

  As illustrated in FIGS. 1 and 2, the vibrator 1 includes a package (electronic device package) 2 and a vibration element (electronic component) 5 accommodated in the package 2. The package 2 includes a cavity-shaped base substrate 3 having a recess 3a, and a lid (lid body) 4 joined to the base substrate 3 so as to close the opening of the recess 3a.

-Vibration element-
As shown in FIGS. 3A and 3B, the vibration element 5 includes a quartz crystal substrate 51 having a rectangular plate shape in plan view, and a pair of crystals formed on the surface of the quartz crystal substrate 51. Conductor layers 52 and 53. 3A is a plan view of the vibration element 5 as viewed from above, and FIG. 3B is a transparent view of the vibration element 5 as viewed from above.

  The quartz substrate 51 is a quartz substrate cut out at a cut angle called AT cut. The conductor layer 52 includes an excitation electrode 52a formed on the upper surface of the quartz substrate 51, a bonding pad 52b formed on the lower surface of the quartz substrate 51, and a wiring that electrically connects the excitation electrode 52a and the bonding pad 52b. 52c. Similarly, the conductor layer 53 includes an excitation electrode 53a formed on the lower surface of the quartz substrate 51, a bonding pad 53b formed on the lower surface of the quartz substrate 51, and a wiring that electrically connects the excitation electrode 53a and the bonding pad 53b. 53c. In the vibration element 5 having such a configuration, when an alternating voltage is applied between the excitation electrodes 52a and 53a, a vibration region sandwiched between the excitation electrodes 52a and 53a vibrates in thickness.

The vibration element 5 has been described above. However, the configuration of the vibration element 5 is not limited to the above configuration, and may be, for example, a mesa-type AT-cut quartz crystal vibration element having a thick vibration region. On the contrary, an inverted mesa type AT-cut crystal resonator element having a thin vibration region may be used. Further, a BT cut crystal substrate 51 may be used instead of the AT cut. Further, a tuning fork type vibration element in which a pair of vibrating arms bend and vibrate may be used. Further, instead of the quartz substrate 51, for example, aluminum nitride (AlN), lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), lead zirconate titanate (PZT), lithium tetraborate (Li _2). B ₄ O ₇ ), langasite (La ₃ Ga ₅ SiO ₁₄ ) and other oxide substrates, and glass substrates are laminated with piezoelectric materials such as aluminum nitride and tantalum pentoxide (Ta ₂ O ₅ ). Alternatively, a laminated piezoelectric substrate or a piezoelectric ceramic substrate may be used. Alternatively, a non-piezoelectric vibration element that is excited by arranging a piezoelectric element on a silicon substrate and expanding and contracting the piezoelectric element by energization may be used.

−Package−
As shown in FIGS. 1 and 2, the package 2 has a base substrate 3 having a recess (first recess) 3 a that opens on the upper surface thereof, a lid 4 that closes the opening of the recess 3 a, and a lower surface of the base substrate 3. The wiring layer 32 is disposed, and the wiring layer 34 is disposed in the recess 3 a of the base substrate 3. In such a package 2, the inside of the recess 3 a closed by the lid 4 functions as a housing space S that houses the above-described vibration element 5.

  The base substrate 3 is a glass substrate made of an insulating material, for example, a glass material, and is obtained by processing the insulating substrate 30 (see FIG. 5A) as described in the manufacturing method described later. is there.

  It does not specifically limit as a glass material of the base substrate 3, For example, borosilicate glass, quartz glass, soda glass (soda lime glass), potassium glass, an alkali free glass etc. can be used. The constituent material of the base substrate 3 only needs to contain glass.

  Further, a conductive wiring layer 32 is disposed on the lower surface of the base substrate 3, and the wiring layer 32 has a pair of external connection terminals 321 and 322. A conductive wiring layer 34 is disposed in the recess 3 a of the base substrate 3, and the wiring layer 34 has a pair of internal connection terminals 341 and 342. Among these connection terminals, the external connection terminal 321 and the internal connection terminal 341 are electrically connected via a via (through electrode) 351 penetrating the base substrate 3, and the external connection terminal 322 and the internal connection terminal are connected. 342 is electrically connected through a via 352 that penetrates the base substrate 3. The constituent materials of the external connection terminals 321 and 322, the internal connection terminals 341 and 342, and the vias 351 and 352 are not particularly limited as long as they have conductivity. For example, gold (Au), silver (Ag) Metal materials such as copper (Cu), platinum (Pt), aluminum (Al), chromium (Cr), nickel (Ni), molybdenum (Mo), and tungsten (W) can be used. However, the external connection terminals 321 and 322 are preferably made of a soft metal material. Thereby, the package 2 which has the outstanding stress relaxation characteristic mentioned later can be provided. Further, the external connection terminals 321 and 322 and the internal connection terminals 341 and 342 may be a single layer or a stacked body in which a plurality of layers are stacked.

  The external connection terminals 321 and 322 are obtained by processing a metal plate 320 (see FIG. 5C), as will be described in a manufacturing method described later. For this reason, the thickness t (see FIG. 2) of the external connection terminals 321 and 322 can be easily formed thick and accurately. By providing the thick external connection terminals 321 and 322, the package 2 having excellent stress relaxation characteristics can be provided. That is, in a state where the vibrator 1 is mounted on the circuit board, the external connection terminals 321 and 322 function as a buffer member, thereby absorbing the stress generated in the package 2 due to expansion and contraction of the circuit board or the package 2 due to heat or the like. Can be relaxed. Thereby, it is possible to suppress the stress from being transmitted to the vibration element 5 and the vibration characteristic (frequency characteristic) of the vibration element 5 from fluctuating.

  The dimensions of the external connection terminals 321 and 322, the internal connection terminals 341 and 342, and the vias 351 and 352 are not particularly limited, and are appropriately set according to various conditions. The thickness t (see FIG. 2) of 322 is preferably 50 μm or more, more preferably 50 μm or more and 200 μm or less, and further preferably 100 μm or more and 200 μm or less.

  If the thickness t of the external connection terminals 321 and 322 is smaller than the lower limit value, the stress relaxation characteristics deteriorate depending on other conditions.

  Further, even if the thickness t of the external connection terminals 321 and 322 is larger than the upper limit value, the improvement of the stress relaxation characteristics cannot be expected.

  In the present embodiment, the thickness t of the external connection terminals 321 and 322 is constant, but may not be constant.

In addition, the base substrate 3 is provided with a recess 3a that opens on the upper surface (the surface opposite to the external connection terminals 321 and 322 (metal plate)), and the vibration element 5 is accommodated in the recess 3a. . The internal connection terminals 341 and 342 are located in the recess 3a. In other words, the internal connection terminals 341 and 342 are exposed to the outside from the recess 3a in a state where the lid 4 is not provided. The vibration element 5 is fixed to the base substrate 3 by the conductive adhesives 61 and 62, and the internal connection terminals 341 and 342 and the bonding pads 52b and 53b are electrically connected by the conductive adhesives 61 and 62. ing.
The base substrate 3 has been described above.

  The lid 4 has a flat plate shape and is joined to the upper surface of the base substrate 3 so as to close the opening of the recess 3a. Thereby, an airtight accommodation space S is defined inside the base substrate 3, and the vibration element 5 is accommodated in the accommodation space S. The environment of the accommodation space S varies depending on the configuration of the vibration element 5, but may be, for example, in a reduced pressure state (preferably in a vacuum state), or an inert gas such as nitrogen, helium, argon, or the like. It may be enclosed. The constituent material of the lid 4 is not particularly limited, and for example, various ceramics, various metals, various glasses, crystal, silicon, and the like can be used. Further, the bonding method of the lid 4 and the base substrate 3 differs depending on the constituent material of the lid 4. For example, the lid 4 and the base substrate 3 may be bonded via a bonding layer such as an adhesive, a low melting point glass, a metal layer, or anodic bonding. Alternatively, bonding may be performed by surface activated bonding or the like.

  The vibrator 1 has been described above. Such a vibrator 1 can exhibit an excellent stress relaxation (absorption) function. Specifically, as shown in FIG. 4, when the vibrator 1 is mounted on the circuit board (printed wiring board) 9 using the solders H1 and H2, the difference in thermal expansion coefficient between the circuit board 9 and the package 2 is caused. Although the thermal stress is applied to the base substrate 3, as described above, by increasing the thickness t of the external connection terminals 321 and 322, the thermal stress can be relaxed and absorbed in the external connection terminals 321 and 322. it can. Therefore, transmission of the thermal stress to the vibration element 5 via the base substrate 3 is suppressed, and fluctuations in vibration characteristics (frequency characteristics) of the vibration element 5 can be prevented or reduced.

  Further, the vibrator 1 has excellent workability. Specifically, the recess 3a is formed in the base substrate 3, but the base substrate 3 is made of glass and has good compatibility with, for example, a patterning process using a photolithography technique and an etching technique. Therefore, the recess 3a can be easily formed.

  In this embodiment, the base substrate 3 is made of glass, but the constituent material of the base substrate 3 is silicon (single crystal silicon, polycrystalline silicon, amorphous silicon), quartz, ceramic, instead of glass. Etc. may be used. In this case, even if the base substrate 3 is made of silicon or quartz, the same effect (that is, excellent dimensional accuracy) as when it is made of glass can be exhibited. Therefore, glass, silicon or quartz is preferred. The base substrate 3 may have a configuration in which two or more predetermined layers are stacked.

  In the present embodiment, the external connection terminals 321 and 322 and the internal connection terminals 341 and 342 are electrically connected by vias 351 and 352. However, the present invention is not limited to this. For example, the external connection terminals 321, 322 and the internal connection terminals 341 and 342 may be electrically connected by wiring that passes outside the package 2.

<< Manufacturing method of vibrator (package) >>
Next, a method for manufacturing the vibrator 1 (base substrate 3) will be described.

  The method for manufacturing the vibrator 1 (package 2) includes a step of preparing (preparing) an insulating substrate 30 having a plurality of individualized regions S1 and a metal plate 320, and bonding the insulating substrate 30 and the metal plate 320 together. A bonding step for bonding, a wiring layer forming step for forming a wiring layer 32 including external connection terminals 321 and 322 on a lower surface of the insulating substrate 30 by removing a part of the metal plate 320, and a part of the insulating substrate 30 A recess forming step for removing and forming a recess 3a opening on the upper surface of the insulating substrate 30 (a surface opposite to the metal plate 320 of the insulating substrate 30), and a wiring layer including internal connection terminals 341 and 342 in the recess 3a A wiring layer forming step for forming 34, a vibration element mounting step for mounting the vibration element 5 in the recess 3 a, a lid bonding step for bonding the lid 4, and a plurality of vibrations separated into pieces for each individual region S 1. A singulation process for obtaining a child 1 and Including the.

[Wiring layer forming process]
First, as shown in FIG. 5A, an insulating substrate 30 made of a glass material and having a plurality of singulated regions S1 in a matrix is prepared, and a metal plate 320 is prepared (FIG. 5C). ). Then, through holes 311 and 312 for vias 351 and 352 are formed in the insulating substrate 30.

  Next, as shown in FIG. 5B, vias 351 and 352 are formed in the through holes 311 and 312 of the insulating substrate 30.

  Next, as shown in FIG. 5C, the insulating substrate 30 and the metal plate 320 are bonded together. The method for bonding the insulating substrate 30 and the metal plate 320 is not particularly limited. For example, the insulating substrate 30 and the metal plate 320 may be bonded via a bonding layer such as an adhesive, low-melting glass, or a metal layer, or anodic bonding or surface active They may be bonded together by chemical bonding or the like.

  Next, as illustrated in FIG. 6A, a mask M <b> 1 having a shape corresponding to the wiring layer 32 including the external connection terminals 321 and 322 is formed on the lower surface of the metal plate 320.

  Next, as shown in FIG. 6B, the wiring layer 32 including the external connection terminals 321 and 322 is formed by dry etching from the lower surface side of the metal plate 320 through the mask M1. As described above, by using the etching process, the external connection terminals 321 and 322 having desired dimensions can be easily and accurately formed. Note that the etching method is not limited to dry etching, and wet etching may be used.

Next, as shown in FIG. 6C, the mask M1 is removed.
[Recess formation step]
Next, the concave portion 3a is formed for each singulated region S1. Specifically, first, as shown in FIG. 7A, a mask M2 having an opening corresponding to the recess 3a is formed on the upper surface of the insulating substrate.

  Next, as shown in FIG. 7B, the recess 3a is formed by wet etching from the upper surface side of the insulating substrate 30 through the mask M2. As described above, by using the etching process, the concave portion 3a having a desired dimension can be easily and accurately formed. Note that the etching method is not limited to wet etching, and dry etching may be used.

Next, the mask M2 is removed (see FIG. 7C).
[Wiring layer forming process]
Next, as shown in FIG. 7C, internal connection terminals 341 and 342 (wiring layer 34) are formed on the bottom surface of the recess 3a. The method of forming the internal connection terminals 341 and 342 is not particularly limited. For example, the internal connection terminals 341 and 342 are formed by forming a metal layer on the bottom surface of the recess 3a and patterning the metal layer using a photolithography technique and an etching technique. Can do.

[Vibration element mounting process / lid bonding process]
Next, as shown in FIG. 8A, the vibration element 5 is mounted in each recess 3 a using conductive adhesives 61 and 62 (the conductive adhesive 61 is not shown), and then the insulating substrate 30. The lid 40 is joined to the upper surface of the first and the opening of the recess 3a is closed. Although not shown, the insulating substrate 30 is formed with a sealing hole that communicates the inside and outside of the housing space S. After the lid 40 is joined to the insulating substrate 30, the housing space S is interposed via the sealing hole. The inside of the accommodation space S can be maintained in a reduced pressure state by reducing the pressure inside and sealing the sealing hole with an Au—Ge alloy or the like.

[Individualization process]
Finally, using a dicing saw or the like, the insulating substrate 30 is separated into pieces for each pieced region S1, and a plurality of vibrators 1 (packages 2) are obtained as shown in FIG. 8B. . As described above, the plurality of vibrators 1 (package 2) are integrally formed and then separated into individual pieces, whereby the manufacturing efficiency of the vibrator 1 (package 2) is improved. However, the order of the singulation process is not limited to the order described above, and may be performed, for example, prior to any of the internal wiring layer forming process, the vibration element mounting process, and the lid bonding process.
The method for manufacturing the vibrator 1 has been described above.

  Next, in the vibrator 1 described above, the external connection terminals 321 and 322 having thicknesses of 10 μm, 50 μm, 70 μm, 100 μm, 150 μm, 200 μm, 300 μm, 500 μm, 700 μm, and 1000 μm are manufactured by the manufacturing method described above. Each was mounted on a circuit board, and the maximum stress generated in the base board 3 was determined. The result is as shown in FIG.

  As shown in FIG. 9, it can be seen that the maximum stress generated in the base substrate 3 is remarkably reduced when the thickness of the external connection terminals 321 and 322 is 50 μm or more.

Second Embodiment
FIG. 10 is a cross-sectional view showing a vibrator using the electronic device package manufactured by the electronic device package manufacturing method according to the second embodiment of the present invention.

  Hereinafter, although the second embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 10, in the second embodiment, the base substrate 3 of the package 2 has a recess (second recess) 3b that opens to the bottom surface (surface on the side of the external connection terminals 321 and 322 (metal plate)). Have.

  Thereby, the flexibility of the base substrate 3 is increased, and the package 2 having excellent stress relaxation characteristics can be provided. Further, the heat generated when the vibrator 1 is mounted on the circuit board using solder or the like can be released from the recess 3b.

  In addition, the external connection terminals 321 and 322 are bent downward on the recess 3b side due to plastic deformation. It may be elastically deformed.

  Thereby, when the vibrator 1 is mounted on the circuit board using solder or the like, it is difficult to peel off due to the anchor effect.

  In this vibrator 1, the maximum value (maximum thickness) tmax of the thickness t of the external connection terminals 321 and 322 is within the preferable range of the thickness t of the external connection terminals 321 and 322 described in the first embodiment. It is preferable that it is set to.

Next, a method for manufacturing the vibrator 1 (package 2) will be described.
The method for manufacturing the vibrator 1 (base substrate 3) further includes the step of forming a recess 3b in the insulating substrate 30 that opens to the lower surface (the surface of the insulating substrate 30 on the metal plate 320 side), and the metal plate 320. And forming external connection terminals 321 and 322 by bending. The formation of the recess 3b is performed in the same manner as the formation of the recess 3a, for example.

  In addition, the step of bending the metal plate 320 to form the external connection terminals 321 and 322 is, in other words, the step of forming a portion having a different thickness on the metal plate 320 or the portion protruding from the metal plate 320. It can also be said to be a process of performing.

  According to the second embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

<Third Embodiment>
FIG. 11 is a cross-sectional view showing a vibrator using an electronic device package manufactured by the electronic device package manufacturing method according to the third embodiment of the present invention.

  In the following, the third embodiment will be described. The description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 11, in the third embodiment, the external connection terminal 321 has convex portions 3211 and 3212 projecting downward at both ends thereof, and the external connection terminal 322 is provided at both ends thereof. , Convex portions 3221 and 3222 that protrude downward.

  Thereby, when the vibrator 1 is mounted on the circuit board using solder or the like, it is difficult to peel off due to the anchor effect.

  In this vibrator 1, the maximum value (maximum thickness) tmax of the thickness t of the external connection terminals 321 and 322 is within the preferable range of the thickness t of the external connection terminals 321 and 322 described in the first embodiment. It is preferable that it is set to.

Next, a method for manufacturing the vibrator 1 (package 2) will be described.
The method for manufacturing the vibrator 1 (base substrate 3) further includes a step of forming convex portions (protruding portions) 3211, 3212, 3221, 3222 protruding downward on the metal plate 320. . The protrusions 3211, 3212, 3221, 3222 are formed by, for example, forming a mask having a shape corresponding to the protrusions 3211, 3212, 3221, 3222 on the lower surface of the metal plate 320, and then forming the mask from the lower surface side of the metal plate 320. To dry-etch. Note that the etching method is not limited to dry etching, and wet etching may be used.

  In addition, the process of forming the said convex part 3211, 3212, 3221, 3222 can be said to be a process of forming the site | part from which thickness differs in the metal plate 320 in other words.

  According to the third embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
FIG. 12 is a cross-sectional view showing a vibrator using an electronic device package manufactured by the electronic device package manufacturing method according to the fourth embodiment of the present invention. 13 to 15 are cross-sectional views for explaining a method of manufacturing the electronic device package shown in FIG.

  Hereinafter, although the fourth embodiment will be described, the description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  In the present embodiment, in the description of the manufacturing method, only one of the plurality of singulated regions is illustrated and described.

  As shown in FIG. 12, in the fourth embodiment, the external connection terminal 321 is configured by a stacked body in which the second layers 321b and 321c are stacked below the first layer 321a. The second layer 322b and 322c are stacked on the lower side of the first layer 322a.

  The first layer 321a has convex portions 3211 and 3212 projecting downward at both ends thereof, the second layer 321b is joined to the lower surface of the convex portion 3211, and the lower surface of the convex portion 3212 is The two layers 321c are joined.

  Similarly, the first layer 322 a has convex portions 3221 and 3222 that protrude downward at both ends thereof, and the second layer 322 b is joined to the lower surface of the convex portion 3221, and the lower surface of the convex portion 3222. In addition, the second layer 322c is bonded.

  Thereby, when the vibrator 1 is mounted on the circuit board using solder or the like, it is difficult to peel off due to the anchor effect.

  The constituent materials of the first layer 321a and the second layers 321b and 321c are different metal materials. Similarly, the constituent materials of the first layer 322a and the second layers 322b and 322c are different metal materials.

  Accordingly, when forming the external connection terminals 321 and 322 by etching, the external connection terminals 321 and 322 having various shapes can be easily formed by selecting a metal material, an etching process gas, a processing solution, or the like. it can.

  In this vibrator 1, the maximum value (maximum thickness) tmax of the thickness t of the external connection terminals 321 and 322 is within the preferable range of the thickness t of the external connection terminals 321 and 322 described in the first embodiment. It is preferable that it is set to.

Next, a method for manufacturing the vibrator 1 (package 2) will be described.
In the method for manufacturing the vibrator 1 (base substrate 3), a laminated body formed by laminating a first layer (first substrate) 320a and a second layer (second substrate) 320b is used as the metal plate 320. The constituent materials of the first layer 320a and the second layer 320b are different metal materials. The method for manufacturing the vibrator 1 (base substrate 3) further includes a step of forming a projecting portion on the metal plate 320.

First, as shown in FIG. 13A, the insulating substrate 30 and the metal plate 320 are bonded together.
Next, as shown in FIG. 13B, a mask M3 having a shape corresponding to the second layers 321b, 321c, 322b, and 322c is formed on the lower surface of the metal plate 320.

  Next, as shown in FIG. 13C, the second layers 321b, 321c, 322b, and 322c are formed by dry etching from the lower surface side of the metal plate 320 through the mask M1. Next, the mask M3 is removed.

Next, as shown in FIG. 14A, a mask M4 having an opening only at the center is formed.
Next, as shown in FIG. 14B, wet etching is performed from the lower surface side through the mask M4. Next, the mask M4 is removed.

Next, as shown in FIG. 15A, a mask M5 is formed.
Next, as shown in FIG. 15B, wet etching is performed from the lower surface side through this mask M5. Next, the mask M5 is removed.
Thus, the external connection terminals 321 and 322 are formed.

  According to the fourth embodiment as described above, the same effects as those of the first embodiment described above can be exhibited.

  The constituent material of the first layer 320a and the second layer 320b may be the same metal material. That is, the constituent materials of the first layer 321a and the second layers 321b and 321c may be the same metal material, and the constituent materials of the first layer 322a and the second layers 322b and 322c are the same metal material. Also good.

<Fifth Embodiment>
FIG. 16: is sectional drawing which shows the vibrator | oscillator using the electronic device package manufactured by the manufacturing method of the electronic device package which concerns on 5th Embodiment of this invention.

  Hereinafter, the fifth embodiment will be described. The description will focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIG. 16, in the fifth embodiment, the external connection terminal 321 is configured by a stacked body in which the second layer 321b is stacked below the first layer 321a. The second layer 322b is laminated on the lower side of the first layer 322a.

  As the first layers 321a and 322a, for example, the same metal material as that of the external connection terminals 321 and 322 of the first embodiment is used.

The second layers 321b and 322b use, for example, solder (eutectic alloy). Further, as the second layers 321b and 322b, two or more metal layers that react to become solder (eutectic alloy) may be used.
As a result, it is possible to save the trouble of separately providing solder during mounting.

  In this vibrator 1, the maximum value (maximum thickness) tmax of the thickness t of the external connection terminals 321 and 322 is within the preferable range of the thickness t of the external connection terminals 321 and 322 described in the first embodiment. It is preferable that it is set to.

  According to the fifth embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

<Sixth Embodiment>
FIG. 17 is a cross-sectional view showing a vibrator using an electronic device package manufactured by the electronic device package manufacturing method according to the sixth embodiment of the present invention.

  Hereinafter, although the sixth embodiment will be described, the description will focus on the differences from the first embodiment described above, and description of similar matters will be omitted.

  As shown in FIG. 17, in 6th Embodiment, the lid 4 has the recessed part 4a. In the package 2, the inside of the recess 4 a closed by the base substrate 3 functions as a housing space S for housing the vibration element 5.

  According to the sixth embodiment as described above, the same effect as that of the first embodiment described above can be exhibited.

Next, an electronic device including the vibrator 1 will be described.
FIG. 18 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer including a vibrator. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates the vibrator 1 as an oscillator.

  FIG. 19 is a perspective view illustrating a configuration of a mobile phone (including PHS) including a vibrator. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates the vibrator 1 as an oscillator.

  FIG. 20 is a perspective view illustrating a configuration of a digital still camera including a vibrator. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit displays a subject as an electronic image. Function as. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates the vibrator 1 as an oscillator.

  In addition to the personal computer (mobile personal computer) in FIG. 18, the mobile phone in FIG. 19, and the digital still camera in FIG. 20, the electronic device including the vibrator is, for example, an ink jet type ejection device (for example, an ink jet printer). , Laptop personal computers, TVs, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical devices (eg, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), fish detectors, various measuring devices, instruments (eg, , Vehicle, aircraft, ship total S), it can be applied to a flight simulator or the like.

Next, the moving body provided with the vibrator 1 will be described.
FIG. 21 is a perspective view showing a moving body including a vibrator. A vibrator (1) is mounted on an automobile (moving body) 1500. The vibrator 1 includes, for example, a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an antilock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS), an engine control, and a hybrid. The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for automobiles and electric vehicles, and vehicle body attitude control systems.

  As mentioned above, although the manufacturing method of the package for electronic devices of this invention was demonstrated based on embodiment of illustration, this invention is not limited to this, Each part is the thing of arbitrary structures which have the same function. Can be substituted. Moreover, other arbitrary structures and processes may be added.

  In the above-described embodiment, the package (electronic device package) includes the base substrate and the lid (lid body). However, the present invention is not limited to this. For example, the lid may be omitted.

  In the above-described embodiment, the vibration element is housed as an electronic component. However, the electronic component is not limited to the vibration element, and may be various circuits (circuit boards) such as an IC.

DESCRIPTION OF SYMBOLS 1 ... Vibrator 2 ... Package 3 ... Base substrate 3a, 3b ... Recessed part 30 ... Insulating substrate 311, 312 ... Through-hole 32 ... Wiring layer 320 ... Metal plate 320a ... First layer 320b ... ... 2nd layer 321, 322 ... External connection terminals 3211, 3212, 3221, 3222 ... Projections 321a, 322a ... 1st layer 321b, 321c, 322b, 322c ... 2nd layer 34 ... Wiring layer 341, 342... Internal connection terminals 351 and 352... Via 4... Lid 4a... Recess 40... Lid 5... Vibrating element 51... Crystal substrate 52 and 53 ... Conductive layers 52a and 53a. 53b: Bonding pads 52c, 53c ... Wiring 61, 62 ... Conductive adhesive 9 ... Circuit board 1100 ... Personal computer 1102 ... -Board 1104 …… Main body 1106 …… Display unit 1108 …… Display unit 1200 …… Mobile phone 1202 …… Operating buttons 1204 …… Earpiece 1206 …… Speaker 1208 …… Display 1300 …… Digital still camera 1302… ... Case 1304 …… Light receiving unit 1306 …… Shutter button 1308 …… Memory 1310 …… Display unit 1312 …… Video signal output terminal 1314 …… Input / output terminal 1430 …… TV monitor 1440 …… Personal computer 1500 …… Automobile H1, H2: Solder M1, M2, M3, M4, M5 ... Mask S ... Accommodating space S1 ... Individualized area

Claims (11)

A step of preparing an insulating substrate and a metal plate;
Bonding the insulating substrate and the metal plate;
Removing a part of the metal plate to form a terminal;
The manufacturing method of the package for electronic devices characterized by the above-mentioned.   The method for manufacturing an electronic device package according to claim 1, wherein in the step of forming the terminal, the metal plate is removed by etching.   3. The method of manufacturing an electronic device package according to claim 1, wherein in the step of preparing, the constituent material of the insulating substrate includes glass.   4. The electronic device according to claim 1, further comprising a step of removing a part of the insulating substrate and forming a first recess opening on a surface of the insulating substrate opposite to the metal plate. Package manufacturing method.   5. The electronic device package according to claim 1, further comprising a step of removing a part of the insulating substrate and forming a second recess opening in the surface of the insulating substrate on the metal plate side. Manufacturing method.   The manufacturing method of the package for electronic devices of Claim 5 including the process of bending the said metal plate.   The manufacturing method of the package for electronic devices of any one of Claim 1 thru | or 4 including the process of forming the site | part from which thickness differs in the said metal plate.   5. The method of manufacturing an electronic device package according to claim 1, wherein in the step of forming the terminal, the metal plate is a laminated body.   The method for manufacturing an electronic device package according to claim 8, wherein the constituent materials of at least two layers constituting the laminate are metal materials different from each other.   The manufacturing method of the package for electronic devices of any one of Claim 1 thru | or 4 including the process of forming the site | part which protruded in the said metal plate.   11. The method of manufacturing a package for an electronic device according to claim 1, wherein the terminal has a thickness of 50 μm or more.

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