JP2015230723A - Touch screen device and production method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a touch screen device and a production method thereof.SOLUTION: A touch screen device comprises: a touch panel comprising a substrate, a pattern layer provided to one face of the substrate, and a protective layer to protect the pattern layer; and a printed circuit board joined to the touch panel across an adhesive layer. The protective layer and the adhesive layer can be formed to be mixed in a partial area on the pattern layer.

Description

  The present invention relates to a touch screen device and a manufacturing method thereof.

  A touch screen device is an input device that can be attached to a display device to provide an intuitive input method to a user. Recently, various types of electronic devices such as a mobile phone, a PDA (Personal Digital Assistant), and a navigation device are used. Widely applied to equipment. In particular, as the demand for smartphones increases, the adoption rate of touch screens that can provide various input methods in a limited form factor continues to increase.

  The touch screen device includes a touch panel to which a user's touch input is applied, and an integrated circuit for applying a driving signal to the touch panel and analyzing a sensing signal generated by a change in capacitance generated in the touch panel. It is mounted on a flexible printed circuit board and electrically connected to the touch panel.

  Generally, when bonding a touch panel and a flexible circuit board, a bonding pad of the touch panel and a connection pad of the flexible printed circuit board are bonded with an anisotropic conductive film. At this time, in order to provide a region where the anisotropic conductive film is formed, a part of the protective film for protecting the touch panel, that is, the protective film formed on the bonding pad of the touch panel is removed. In this process, foreign matter remains and a process error occurs, and the portion where the protective film is removed is not sufficiently filled with the anisotropic conductive film, which may cause a problem that the corrosion resistance deteriorates. There is sex.

Korean Registered Patent No. 1360390

  The subject of this invention is providing the touch panel which can join a touch panel and a flexible printed circuit board, and its manufacturing method, without removing the protective film which protects a touch panel.

  A touch screen device according to an embodiment of the present invention includes a substrate, a touch panel including a pattern layer provided on one surface of the substrate, and a protective layer protecting the pattern layer, and a printed circuit bonded through the touch panel and the adhesive layer. And the protective layer and the adhesive layer may be mixedly formed in a partial region on the pattern layer.

  The partial region may correspond to a region where the bonding pad of the pattern layer is formed.

  The touch panel and the printed circuit board may be bonded before the protective layer is cured.

  The protective layer and the adhesive layer may be mixed and formed between the bonding pad of the pattern layer and the connection pad of the printed circuit board.

  The protective layer may include at least one of a photosensitive film and a thermosetting film.

  The adhesive layer may include an anisotropic conductive film including an adhesive resin and conductive particles distributed in the adhesive resin.

  The adhesive resin forms two layer structures with the protective layer, and the conductive particles can be distributed between the two layer structures.

  The adhesive resin and the protective layer may be fused together to form one fused material, and the conductive particles may be distributed in the fused material.

  According to an aspect of the present invention, there is provided a method for manufacturing a touch screen device, comprising: laminating a pattern layer and a protective layer on a substrate; and forming an adhesive layer on a region of the protective layer corresponding to a region where the bonding pad of the pattern layer is provided. Forming and bonding the substrate and the printed circuit board through the adhesive layer before the protective layer is cured.

  When the substrate and the printed circuit board are bonded, the protective layer and the adhesive layer may be mixedly formed between the bonding pad of the pattern layer and the connection pad of the printed circuit board.

  The step of bonding the substrate and the printed circuit board may be performed by bonding the substrate and the printed circuit board using a bonding chip.

  The method may further include curing the protective layer.

  The step of curing the protective layer may cure the protective layer using at least one of heat and ultraviolet rays.

  The protective layer may include at least one of a photosensitive film and a thermosetting film.

  The adhesive layer may include an anisotropic conductive film including an adhesive resin and conductive particles distributed in the adhesive resin.

  The adhesive resin forms two layer structures with the protective layer, and the conductive particles can be distributed between the two layer structures.

  The adhesive resin and the protective layer may be fused together to form one fused material, and the conductive particles may be distributed in the fused material.

  According to one embodiment of the present invention, a manufacturing process can be simplified, and a defect rate and a process error rate can be reduced.

  In addition, moisture resistance to the bonding pad of the touch panel can be prevented and corrosion resistance can be enhanced.

1 is an exploded perspective view of a touch panel according to an embodiment of the present invention. 1 is an exploded perspective view of a touch panel according to an embodiment of the present invention. 1 is a view illustrating a printed circuit board according to an exemplary embodiment of the present invention. 1 is a partial cross-sectional view of a touch screen device according to an embodiment of the present invention. FIG. 6 is a manufacturing process diagram of a touch screen device according to an exemplary embodiment of the present invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description.

  1 and 2 are exploded perspective views of a touch panel according to an embodiment of the present invention.

  Referring to FIG. 1, the touch panel 100 according to the present embodiment may include a substrate 110, pattern layers 120 and 130 provided on the substrate 110, and protective layers 140 and 150 provided on the pattern layers 120 and 130.

  The substrate 110 is made of PET (Polyethylene terephthalate), PC (Polycarbonate), PES (Polyethersulfone), PI (Polyimide), PMMA (Polymethyla acrylate), COP (Cyclo-Olysine Poly reinforced glass, etc.) It may be formed of a material such as glass (tempered glass) and have high light transmittance.

  The pattern layers 120 and 130 may include a first pattern layer 120 and a second pattern layer 130. As shown in FIG. 1, the first pattern layer 120 and the second pattern layer 130 are disposed on both sides of the substrate. Can be provided. In contrast, the first pattern layer 120 and the second pattern layer 130 may be provided on one surface of the substrate 110. In this case, a predetermined insulating layer may be formed between the first pattern layer 120 and the second pattern layer 130.

  The first pattern layer 120 may include a first electrode 121, a first wiring pattern 123, and a first bonding pad 125. The second pattern layer 130 may include a second electrode 131, a second wiring pattern 133, and a first bonding pattern 125. Two bonding pads 135 may be included.

  As shown in FIG. 1, the first electrode 121 and the second electrode 131 can be formed of mesh-shaped conductor wires. At this time, the conductor wire is made of any one metal or at least two alloys of silver (Ag), aluminum (Al), chromium (Cr), nickel (Ni), molybdenum (Mo), and copper (Cu). Can be done. In contrast to this, as shown in FIG. 2, ITO (Indium-Tin Oxide), IZO (Indium Zinc Oxide), ZnO (Zinc Oxide), carbon nanotubes (CNT, Carbon Nano) having electrical conductivity. Tube), or a material such as graphene.

  Protective layers 140 and 150 may be formed on the pattern layers 120 and 130 to prevent moisture transmission to the pattern layers 120 and 130. A first protective layer 140 may be formed on the first pattern layer 120, and a second protective layer 150 may be formed on the second pattern layer 120. As an example, the first protective layer 140 and the second protective layer 150 may be formed of a photosensitive film or a thermosetting film.

  Adhesive layers 160 and 170 may be formed in some areas on the protective layers 140 and 150. The first adhesive layer 160 is formed on the first protective layer 140, but may be formed to correspond to a region of the first pattern layer 120 where the first bonding pad 125 is formed. In addition, the second adhesive layer 170 is formed on the second protective layer 150, but may be formed to correspond to a region where the second bonding pad 135 of the second pattern layer 130 is formed. As an example, the first adhesive layer 160 and the second adhesive layer 170 may be formed of an anisotropic conductive film (ACF).

  FIG. 3 is a view illustrating a printed circuit board according to an exemplary embodiment of the present invention.

  The printed circuit board 200 according to the present embodiment may include a substrate body 210, connection pads 230, and an integrated circuit (IC, 250). As an example, the printed circuit board 200 may be a flexible printed circuit board.

  When the substrate body 210 is bonded to the substrate 110 of the touch panel 100, the connection pad 230 is electrically connected to the first bonding pad 125 and the second bonding pad 135 through the first adhesive layer 160 and the second adhesive layer 170. Can be done.

  In the integrated circuit (IC, 250) mounted on the substrate body 210, a driving signal is applied to the second bonding pad 135 through the connection pad 230 of the printed circuit board 200, and a sensing signal obtained by the first bonding pad 125 is applied. By using it, the coordinates of the touch input applied to the touch panel 100, the number, the gesture, and the like can be determined.

  Specifically, the integrated circuit 250 includes a drive circuit for applying a drive signal to the second electrode 131, a capacitance sensing circuit for detecting a change in the capacitance generated at the first electrode 121, an electrostatic circuit. An analog-digital conversion circuit that converts an output signal of the capacitance sensing circuit into a digital value, an arithmetic circuit that determines touch input using the data converted into the digital value, and the like can be included.

  FIG. 4 is a partial cross-sectional view of a touch screen device according to an embodiment of the present invention.

  The touch screen device 10 according to an embodiment may include a touch panel 100 and a printed circuit board 200. Referring to FIG. 4, the bonding pads 125 and 135 of the touch panel 100 of FIG. 1 and the connection pads 230 of the printed circuit board 200 of FIG. 3 can be electrically connected. More specifically, the bonding pads 125 and 135 of the touch panel 100 and the connection pads 230 of the printed circuit board 200 of FIG. 4 can be connected to each other through the adhesive layers 160 and 170.

  4 shows that the pattern layers 120 and 130 and the protective layers 140 and 150 are formed on one surface of the substrate 110 of the touch panel 100. However, the pattern layers 120 and 130 are formed on both surfaces of the substrate 100 as shown in FIGS. You can also.

  FIG. 5 is a manufacturing process diagram of a touch screen device according to an embodiment of the present invention. Hereinafter, a manufacturing process of the touch screen device according to the present embodiment will be described with reference to FIG.

  Pattern layers 120 and 130 and protective layers 140 and 150 are sequentially formed on the substrate 110 (see FIG. 5A). The protective layers 140 and 150 may be formed on the pattern layers 120 and 130. For example, the protective layers 140 and 150 may include a photosensitive film or a thermosetting film. At this time, the photosensitive film or the thermosetting film may not be cured after being bonded to the pattern layers 120 and 130.

  Thereafter, adhesive layers 160 and 170 may be formed in a partial region of the protective layers 140 and 150 (see FIG. 5B). The adhesive layers 160 and 170 may be formed so as to correspond to regions where bonding pads (not shown) of the pattern layers 120 and 130 are formed. For example, the adhesive layers 160 and 170 may be formed of an anisotropic conductive film. The adhesive layers 160 and 170 may include an adhesive resin and conductive particles distributed in the adhesive resin.

  Subsequently, the bonding chip 300 presses the substrate body 210 of the printed circuit board 200 toward the substrate 110 so that the connection pads 230 of the printed circuit board 200 are in contact with the adhesive layers 160 and 170 (FIG. 5C). See). At this time, the substrate body 210 is bonded by the bonding chip 300 so as to be bonded to the substrate 110. A silicon rubber 310 may be attached to the pressing surface of the bonding chip 300 to prevent damage to the substrate body 210 during the pressing process.

  Since the protective layers 140 and 150 are not cured when the substrate main body 210 is pressure-bonded to the substrate 110 by the bonding chip 300, the protective layers 140 and 150 and the adhesive layer formed in the region corresponding to the adhesive layers 160 and 170. 160 and 170 can be mixed.

  Since the protective layers 140 and 150 are not cured, the protective layers 140 and 150 and the adhesive layers 160 and 170 are mixed in the space between the pattern layers 120 and 130 and the connection pads 230 by pressure bonding with the bonding chip 300. (See FIG. 5 (d)).

  As described above, the adhesive layers 160 and 170 may include an anisotropic conductive film. When the adhesive layers 160 and 170 are formed of an anisotropic conductive film, the adhesive resin and the protective layers 140 and 150 of the anisotropic conductive film exist as a two-layer structure by pressure bonding, or are fused together to form a single layer. It can exist as a fusion material.

  When present as a two-layer structure, the conductive particles of the anisotropic conductive film can penetrate into the protective layers 140 and 150. As a result, conductive particles exist between the two layer structures, and the pattern layers 120 and 130 and the connection pads 230 can be electrically connected.

  In addition, when the adhesive resin of the anisotropic conductive film and the protective layers 140 and 150 are fused together and exist as one fusion material, the conductive particles are distributed in the fusion material and the pattern layers 120 and 130 and the connection pads 230 are connected. It can be electrically connected.

  After the protective layers 140 and 150 formed in the region corresponding to the adhesive layers 160 and 170 and the adhesive layers 160 and 170 are pressure-bonded, a curing process for further strengthening the pressure-bonding can be performed. The curing process can include a heat curing process or an ultraviolet curing process.

  According to the present embodiment, the partial regions of the protective layers 140 and 150 are not removed, and the partial regions of the protective layers 140 and 150 and the adhesive layers 160 and 170 are pressure-bonded before the protective layers 140 and 150 are cured. Exposure, development, and a peeling process for removing a partial region of the protective layers 140 and 150 can be omitted. As a result, the manufacturing process can be simplified and the defect rate can be reduced.

  In addition, the bonding pads 125 and 135 of the pattern layers 120 and 130 formed on the substrate 110 may form the adhesive layers 160 and 170 or the fusion material of the protective layers 140 and 150 and the adhesive layers 160 and 170 without forming an opening region. It can be protected by corrosion resistance.

  Although the embodiment of the present invention has been described in detail above, the scope of the right of the present invention is not limited to this, and various modifications and modifications can be made without departing from the technical idea of the present invention described in the claims. It will be apparent to those of ordinary skill in the art that variations are possible.

DESCRIPTION OF SYMBOLS 10 Touch screen apparatus 100 Touch panel 110 Board | substrate 120 1st pattern layer 121 1st electrode 123 1st wiring pattern 125 1st bonding pad 130 2nd pattern layer 131 2nd electrode 133 2nd wiring pattern 135 2nd bonding pad 140 1st protection Layer 150 second protective layer 160 first adhesive layer 170 second adhesive layer 200 printed circuit board 210 substrate body 230 connection pad 250 integrated circuit

Claims (17)

A touch panel including a substrate, a pattern layer provided on one surface of the substrate, and a protective layer protecting the pattern layer;
A printed circuit board bonded via the touch panel and an adhesive layer,
The touch screen device, wherein the protective layer and the adhesive layer are mixedly formed in a partial region on the pattern layer.   The touch screen device according to claim 1, wherein the partial region corresponds to a region where a bonding pad of the pattern layer is formed.   The touch screen device according to claim 1, wherein the touch panel and the printed circuit board are joined before the protective layer is cured.   The touch screen device according to claim 1, wherein the protective layer and the adhesive layer are mixedly formed between the bonding pad of the pattern layer and the connection pad of the printed circuit board.   The touch screen device according to claim 1, wherein the protective layer includes at least one of a photosensitive film and a thermosetting film.   The touch screen device according to claim 1, wherein the adhesive layer includes an anisotropic conductive film including an adhesive resin and conductive particles distributed in the adhesive resin.   The touch screen device according to claim 6, wherein the adhesive resin forms two layer structures with the protective layer, and the conductive particles are distributed between the two layer structures.   The touch screen device according to claim 6, wherein the adhesive resin and the protective layer are fused together to form one fusion material, and the conductive particles are distributed in the fusion material. Laminating a pattern layer and a protective layer on a substrate;
Forming an adhesive layer on a region of the protective layer corresponding to a region where the bonding pad of the pattern layer is provided;
Bonding the substrate and the printed circuit board through the adhesive layer before the protective layer is cured.   10. The protective layer and the adhesive layer are formed in a mixed manner between the bonding pad of the pattern layer and the connection pad of the printed circuit board when the substrate and the printed circuit board are bonded. The manufacturing method of the touch screen apparatus as described.   The method of manufacturing a touch screen device according to claim 9, wherein the step of bonding the substrate and the printed circuit board includes bonding the substrate and the printed circuit board using a bonding chip.   The method of manufacturing a touch screen device according to claim 9, further comprising a step of curing the protective layer.   The method of manufacturing a touch screen device according to claim 12, wherein the step of curing the protective layer cures the protective layer using at least one of heat and ultraviolet rays.   The method for manufacturing a touch screen device according to claim 9, wherein the protective layer includes at least one of a photosensitive film and a thermosetting film.   The method for manufacturing a touch screen device according to claim 9, wherein the adhesive layer includes an anisotropic conductive film including an adhesive resin and conductive particles distributed in the adhesive resin.   The method of claim 15, wherein the adhesive resin forms two layer structures with the protective layer, and the conductive particles are distributed between the two layer structures.   The method of claim 16, wherein the adhesive resin and the protective layer are fused together to form one fused material, and the conductive particles are distributed in the fused material.

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