JP2015229270A - Repair system, repair data providing device, and repair data generation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a repair system using a solid repair device, capable of repairing a repair object excellently regardless of the state of a defective surface.SOLUTION: A repair system includes a repair data providing device and a solid repair device. The repair data providing device has: a defective spot specification part 12 for specifying a defective spot of a repair object by comparing solid data of the repair object acquired by a scanner with original solid data of the repair object; a mode selection part 14 for selecting a first repair mode for repairing only the defective spot of the repair object or a second repair mode for repairing a wider range than the defective spot including the defective spot of the repair object, corresponding to the state of the defective surface of the repair object; and a repair data generation part 16 for generating solid repair data corresponding to the repair mode selected by the mode selection part.

Description

  The present disclosure relates to a repair system using a three-dimensional repair device, a repair data providing device, and a repair data generation method.

In recent years, three-dimensional modeling apparatuses that perform three-dimensional modeling by stacking modeling materials have attracted attention. Patent Document 1 describes a product manufacturing support method for the purpose of making it not necessary to depend on the geographical position of a product seller for receiving a product as well as ordering a product by a customer.
In the product manufacturing support method described in Patent Document 1, a client computer of a customer, a manufacturing computer that controls a manufacturing device that manufactures a product based on manufacturing data, and a product that manufactures and sells a product using the manufacturing device In a communication system in which a seller's server computer is connected to each other, the server computer transmits manufacturing data for manufacturing a product according to a customer's order from the client computer to the manufacturing computer. The manufacturing computer is installed in a place familiar to the customer, for example, at home, together with a product manufacturing apparatus and a client computer. The manufacturing computer that has received the manufacturing data causes the manufacturing apparatus to manufacture a product according to the order from the customer.

Japanese Patent No. 4617573

By the way, as a utilization form of a three-dimensional modeling apparatus, the form which repairs the defect | deletion location of a repair target object can be considered besides the form which manufactures the whole goods newly. When repairing a defective portion of a repair target using a three-dimensional repair device, the amount of modeling material used can be saved as compared with the case of newly manufacturing the entire repair target. However, since there are still a few distortions and cracks around the defect, depending on the condition of the defect surface of the repair object, it may not be possible to repair the repair object satisfactorily by repairing only the defect part. there were.
In this regard, in the product manufacturing support method described in Patent Document 1, a form in which the entire product is newly manufactured is assumed, and no mention is made of such a problem in the form in which the repair target is repaired. .
An object according to at least one embodiment of the present invention is to provide a repair system, a repair data providing apparatus, and a repair data generation method that enable a repair target to be satisfactorily repaired regardless of the state of a defect surface. .

  (1) A repair system according to some embodiments of the present invention includes a three-dimensional repair device that repairs a defect portion of a repair target object by stacking modeling materials, and a three-dimensional object for repairing the defect portion of the repair target object. A repair data providing device for providing repair data to the three-dimensional repair device, and a repair system including the three-dimensional repair device, wherein the three-dimensional repair device performs a three-dimensional scan of the repair target and acquires the three-dimensional data of the repair target The repair data providing device compares the three-dimensional data of the repair target acquired by the scanner with the original three-dimensional data of the repair target, and identifies the defect portion of the repair target. A defect location identifying section; a first repair mode for repairing only a defect location of the repair target according to a state of a defect surface of the repair target; and a defect location including the defect location of the repair target. A mode selection unit that selects one of the second repair modes for repairing a wider range than the location, and a repair data generation unit that generates the three-dimensional repair data corresponding to the repair mode selected by the mode selection unit; It is characterized by having.

  According to the repair system described in the above (1), it is possible to repair the defect portion of the repair object well regardless of the state of the defect surface of the repair object.

(2) In some embodiments, in the repair system according to the above (1), the three-dimensional repair device further includes a dissolving means for dissolving the periphery of the defect portion in the repair object,
When the second repair mode is selected by the mode selection unit, the melting means melts the periphery of the defect portion in the repair target.

  According to the repair system described in (2) above, even if there is distortion or cracks associated with the defect around the defect in the repair target, the defect in the repair target is satisfactorily repaired. It becomes possible.

(3) In some embodiments, in the repair system according to (2) above,
In the second repair mode, the melting means adjusts the depth or range of melting around the defect portion according to the state of the defect surface of the repair object.

  According to the repair system described in the above (3), even if there are distortions, cracks, or the like associated with the defect around the defect part in the repair object, the defect part can be repaired even better. .

  (4) In some embodiments, in the repair system according to any one of the above (1) to (3), the three-dimensional repair device is a cutting that cuts the periphery of the defect portion in the repair object. In the second repair mode, the cutting means cuts the periphery of the defect portion of the repair object before the modeling material is stacked.

  According to the repair system described in (4) above, even if there are distortions or cracks associated with the defect around the defect part in the repair object, the defect part of the repair object is repaired satisfactorily. It becomes possible.

  (5) In some embodiments, in the repair system according to the above (4), the cutting means may be arranged around the defect portion according to the state of the defect surface of the repair target object in the second repair mode. The depth or range of cutting is adjusted.

  According to the repair system described in (5) above, even if there is distortion or cracks associated with the defect around the defect part in the repair object, the defect part can be repaired even better. .

  (6) In some embodiments, in the repair system according to (2) or (3), the three-dimensional repair device further includes a cutting unit that cuts the periphery of the defect portion in the repair object, The scanner performs a three-dimensional scan again on the repair object after the periphery of the defect portion is melted by the melting means, and the cutting means is based on the three-dimensional data of the repair target after melting obtained by the scanner. It is characterized by cutting.

  According to the repair system described in the above (6), it is possible to perform cutting with high accuracy by cutting the periphery of the defect portion with the dissolving means and then performing the cutting with the cutting means, thereby further improving the defect portion. Can be repaired.

  (7) In some embodiments, in the repair system according to any one of (2) to (6), the three-dimensional repair device is configured to remove the modeling material removed by the melting unit or the cutting unit. It further has a storage tank to store, and the modeling material stored in the storage tank is used for repair of the repair object.

  According to the repair system as described in said (7), it becomes possible to reuse the modeling material removed by melt | dissolution or cutting, and can reduce the usage-amount of the modeling material used for repair of a repair target object.

  (8) In some embodiments, in the repair system according to any one of (2) to (7), the three-dimensional repair device or the repair data providing device is a repair target portion of the repair target object. A repair target location designating part that can be manually designated (manually), and the defect location specifying part is within the range of the repair target location designated by the repair target location designating unit. It is characterized by specifying.

  According to the repair system as described in said (8), after designating the desired repair object location in a repair target object, a defect location can be repaired within the designated range.

  (9) A repair data providing apparatus according to some embodiments of the present invention is a repair data providing apparatus that provides a three-dimensional repair data for repairing a defective portion of an object to be repaired. A comparison between the three-dimensional data acquired by performing a three-dimensional scan of the target object and the original three-dimensional data of the repair target object, and a defective part specifying unit for specifying the defective part of the repair target object, and the repair target object A first repair mode for repairing only a defective portion of the repair target according to a state of the defective surface, and a second repair mode for repairing a range wider than the defective portion including the defective portion of the repair target. And a repair data generation unit that generates the three-dimensional repair data corresponding to the repair mode selected by the mode selection unit.

  According to the apparatus for providing repair data described in (9) above, providing three-dimensional repair data capable of repairing a defective portion of a repair target satisfactorily regardless of the state of the defective surface of the repair target. Can do.

  (10) A repair data generation method according to some embodiments of the present invention is a repair data generation method for generating three-dimensional repair data for repairing a defective portion of a repair target object. Comparing the three-dimensional data acquired by scanning with the original three-dimensional data of the repair object, a defect location identifying step for identifying the defect location of the repair object, and the state of the defect surface of the repair object Depending on the condition, either the first repair mode for repairing only the defect portion of the repair target object or the second repair mode for repairing the repair object in a wider range including the defect portion of the repair target object. A selection step of selecting, and a generation step of generating the three-dimensional repair data corresponding to the repair mode selected in the selection step.

  According to the repair data generation method described in (10) above, generating the three-dimensional repair data that can satisfactorily repair the defect portion of the repair object regardless of the state of the defect surface of the repair object. Can do.

  According to at least one embodiment of the present invention, a repair system, a repair data providing apparatus, and a repair data generation method that can repair a repair target satisfactorily regardless of the state of a defective surface of the repair target are provided. can do.

It is a whole schematic diagram showing a repair system concerning some embodiments. (A) is a figure which shows the comparison with the solid data of the repair target acquired with the scanner, and the original three-dimensional data of the repair target, (b) explains the state which specified the missing part of the repair target. FIG. It is a figure for demonstrating the selection method of the repair mode by a mode selection part, (a) is a figure which shows the example in the case of selecting 1st repair mode, (b) is the case where 2nd repair mode is selected It is a figure which shows the example of. It is a figure which shows the circumference | surroundings of the defect | deletion location in a repair target object, (a) is a perspective view of a repair target object, (b) is AA sectional drawing of a repair target object. It is a whole schematic diagram showing a repair system concerning some embodiments. It is a whole schematic diagram showing a repair system concerning some embodiments. It is a block diagram which shows the structure of the repair data provision apparatus side communication part and solid repair apparatus side communication part which concern on some embodiment. It is a figure which shows an example of the operation | movement sequence of a solid repair apparatus and a repair data provision apparatus after solid repair data production | generation. It is a figure for demonstrating the division | segmentation method of the three-dimensional repair data which concerns on some embodiment.

  Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in this embodiment are not intended to limit the scope of the present invention to that unless otherwise specified.

  FIG. 1 is an overall schematic diagram illustrating a repair system 1 according to some embodiments. The repair system 1 provides a three-dimensional repair device 2 that repairs a defective portion of a repair target object by stacking modeling materials and a three-dimensional repair data for repairing the defective portion of the repair target object to the three-dimensional repair device 2. A three-dimensional repair device 2 and a repair data providing device 4 are configured to be communicable via a network 6.

The three-dimensional repair device 2 includes at least a scanner 8 for three-dimensionally scanning a repair target and acquiring three-dimensional data of the repair target, and a modeling unit 10 that performs modeling processing by a so-called layered modeling method of stacking modeling materials. ing. The additive manufacturing method will be described in more detail. An ink jet method in which a liquefied synthetic resin or the like is jetted and laminated, a photo modeling method in which a photocurable resin is cured by ultraviolet rays or the like, and a thermoplastic such as an ABS resin or a PLA resin. It is preferable to use a heat melting lamination method in which a resin is melted and laminated at a high temperature, a powder sintering lamination method in which raw material powder is spread in layers and sintered with a high-power laser beam, a sheet lamination method in which sheets are laminated, and the like. it can. In addition, in one Embodiment, the modeling means 10 may be provided with the three-dimensional modeling function which performs the new modeling which is not repair other than the modeling process for repair.
The repair data providing apparatus 4 includes a defect location identifying unit 12 that identifies a defect location of the repair target, a mode selection unit 14 that selects a repair mode according to the state of the defect surface of the repair target, and a mode selection unit 14. And a repair data generation unit 16 that generates solid repair data corresponding to the selected repair mode.

  As shown in FIG. 2A, the defect portion specifying unit 12 compares the three-dimensional data of the repair object acquired by the scanner 8 with the original three-dimensional data of the repair object, and the result shown in FIG. As shown, the defect portion of the repair object is specified (three-dimensional data indicating the defect portion is calculated). The storage location of the original three-dimensional data of the object to be repaired may be the storage unit 18 provided in the repair data providing device 4 or a storage unit (not shown) provided outside the repair data providing device 4. May be. That is, it is only necessary to store the defect in the readable location when the defect location identifying unit 12 identifies the defect location of the object to be repaired.

  The mode selection unit 14 includes a first repair mode for repairing only a defective part of the repair target according to the state of the defective surface corresponding to the defective part specified by the defective part specifying unit 12, and a defect of the repair target. It is configured to select any one of the second repair mode in which repair is performed in a wider range than the missing part including the part. Hereinafter, a specific example of the repair mode selection method by the mode selection unit 14 will be described with reference to FIG.

  FIG. 3 is a diagram for explaining an example of a repair mode selection method by the mode selection unit 14 according to some embodiments. In some embodiments, as shown in FIG. 3A, the mode selection unit 14 selects the first repair mode when the state of the defect surface of the repair target is smoother than a predetermined level. However, as shown in FIG. 3B, when the state is not smoother than a predetermined level, the second repair mode may be selected. Here, the “predetermined level” may be defined by, for example, surface roughness (ten-point average roughness, arithmetic average roughness, etc.). That is, the first repair mode may be selected when the surface roughness of the defective surface is less than a predetermined value, and the second repair mode may be selected when the surface roughness of the defective surface is greater than or equal to a predetermined value. Further, the “predetermined level” may be determined in consideration of, for example, the size (at least one of length, width, and depth) of individual cracks or the like generated on the defect surface.

  The repair data generation unit 16 is configured to generate solid repair data corresponding to the repair mode selected by the mode selection unit 14. For example, if the first repair mode is selected by the mode selection unit 14, solid repair data for repairing only a defective portion of the repair target is generated, and the second repair mode is selected by the mode selection unit 14. For example, three-dimensional repair data for repairing a range wider than the defect portion including the defect portion of the repair object is generated. That is, the three-dimensional repair data corresponding to the first repair mode includes at least three-dimensional data indicating a defect portion of the repair target object, and the three-dimensional repair data corresponding to the second repair mode includes a defect portion of the repair target object. It includes at least three-dimensional data indicating a repair range wider than the missing portion.

  The three-dimensional repair data generated by the repair data generating unit 16 is transmitted from the repair data providing device side communication unit 20 included in the repair data providing device 4 to the three-dimensional repair device side communication unit 22 included in the three-dimensional repair device 2, and the three-dimensional repair data. Based on the above, the defect repairing by the three-dimensional repair device 2 is performed.

  As described above, the mode selection unit 14 includes the first repair mode for repairing only the defect portion of the repair target according to the state of the defect surface of the repair target, and the defect including the defect portion of the repair target. It is configured to select one of the second repair modes for repairing a wider range than the location. Therefore, the defect portion can be repaired satisfactorily regardless of the state of the defect surface of the repair object.

  Note that the three-dimensional repair device 2 shown in FIG. 1 performs repairs in a wider range than the defect portion of the repair target, so that the periphery of the defect portion in the repair target (the defect surface and its surroundings; FIG. 4 (a) and (B) is further provided with a dissolving means 24 for dissolving. When the second repair mode is selected by the mode selection unit 14, the melting means 24 is configured to melt the periphery of the defect portion in the repair target. Thereby, even if it is a case where distortion, a crack, etc. accompanying a defect remain around a defect part in a repair object, a defect part can be repaired satisfactorily. As the melting means 24, a powder sintering laser in the case of the powder sintering lamination method or an infrared laser for melting metal powder may be used.

  Further, the melting means 24 melts the periphery of the defect portion (depth from the defect surface; FIGS. 4A and 4B) according to the state of the defect surface of the repair target in the second repair mode. See) or range. Thereby, even if it is a case where distortion, a crack, etc. accompanying a defect remain around a defective part in a repair object, a defective part can be repaired still more satisfactorily. In addition, when the periphery of the defect portion in the repair target is melted by the melting means 24, the repair data generation unit 16 generates solid repair data including solid data indicating a range to be melted in the repair target.

  Further, as shown in FIG. 5, instead of the melting means 24, a cutting means 26 that cuts the periphery of the defect portion in the repair target may be provided. The repair system 1 shown in FIG. 5 is the same as the repair system 1 shown in FIG. 1 except for the cutting means 26. In this case, in the second repair mode, the cutting means 26 scrapes the periphery of the defect portion in the repair target before stacking the modeling material. Thereby, even if it is a case where distortion, a crack, etc. accompanying a defect remain around a defect part in a repair object, a defect part can be repaired satisfactorily.

  Further, the cutting means may be configured to adjust the depth or range of cutting around the defect portion in accordance with the state of the defect surface of the repair object in the second repair mode. Thereby, even if it is a case where distortion, a crack, etc. accompanying a defect remain around a defective part in a repair object, a defective part can be repaired still more satisfactorily. In addition, when the periphery of the defect part in the repair target is cut by the cutting means 26, the repair data generation unit 16 generates three-dimensional repair data including three-dimensional data indicating a range to be cut in the repair target.

  The repair data providing device side communication unit 20 may be configured to collectively transmit the three-dimensional repair data for repairing the defective portion of the repair target object to the three-dimensional repair device side communication unit 22. From the viewpoint of enhancing the confidentiality of data, the repair data providing device side communication unit 20 and the three-dimensional repair device side communication unit 22 are preferably configured as follows.

  Further, as shown in FIG. 6, the three-dimensional repair device 2 of the repair system 1 according to some embodiments may include both a melting means 24 and a cutting means 26. In this case, in one embodiment, the scanner 8 melts the periphery of the defect portion by the melting means 24 and then three-dimensionally scans the repair target, and the cutting means 26 acquires the repair target after melting acquired by the scanner 8. You may comprise so that cutting may be performed based on solid data. In this way, by cutting the periphery of the defect portion with the melting means 24 and then performing the cutting with the cutting means 26, it becomes possible to perform cutting with high accuracy, and the defect portion can be repaired more satisfactorily.

  As shown in FIG. 6, the three-dimensional repair device 2 of the repair system 1 according to some embodiments includes a storage tank 29 that stores the modeling material removed by the melting means 24 and / or the cutting means 26. The modeling material stored in the storage tank 29 may be used for repairing the repair target. As a result, the modeling material removed by melting or cutting can be reused, and the amount of modeling material used for repairing the repair target can be reduced.

  In addition, as shown in FIG. 6, the three-dimensional repair device 2 of the repair system 1 according to some embodiments includes a repair target location designation unit configured to be able to manually designate a repair target location of a repair target object. 31 may be included. In this case, the missing part specifying unit 12 is configured to specify the missing part within the range of the repair target part specified by the repair target part specifying unit 31. Thereby, after designating the desired repair target location in the repair target, the missing location can be repaired within the specified range. In addition, although the case where the repair target location specifying unit 31 is provided in the three-dimensional repair device 2 is illustrated in FIG. 6, the repair target location specifying unit 31 may be provided in the repair data providing device 4.

  FIG. 7 is a block diagram illustrating configurations of the repair data providing device side communication unit 20 and the three-dimensional repair device side communication unit 22 according to some embodiments.

  The repair data providing device side communication unit 20 divides the three-dimensional repair data into n pieces (where n is a natural number equal to or greater than 2) of transmission data, and the n pieces of transmission data of the three-dimensional repair device side communication unit 22. Data transmitting means 28 for sequentially transmitting to the three-dimensional repair device side, and a deletion signal receiving means 30 for receiving a deletion signal described later from the three-dimensional repair device side communication unit 22.

  The three-dimensional repair device side communication unit 22 includes a data receiving unit 32 for receiving each transmission data transmitted from the data transmitting unit 28, and the modeling unit 10 (see FIG. 1) is used by the data receiving unit 32. A modeling process (a repair process for stacking modeling materials) is performed based on each of the received transmission data.

  The three-dimensional repair device side communication unit 22 further includes a data deletion unit 34 and a deletion signal transmission unit 36. The data deleting unit 34 is configured to delete each of the transmission data every time the modeling unit 10 (see FIG. 1) performs a modeling process based on each of the transmission data. The deletion signal transmission unit 36 is configured to transmit a deletion signal indicating that each of the transmission data has been deleted to the deletion signal reception unit 30 every time each of the transmission data is deleted by the data deletion unit 34.

  FIG. 8 is a diagram illustrating an example of an operation sequence of the three-dimensional repair device 2 and the repair data providing device 4 after the repair data providing device 4 illustrated in FIG. 1 generates the three-dimensional repair data.

  The three-dimensional repair device 2 and the repair data providing device 4 shown in FIG. 8 operate as follows. First, in S101, the dividing unit 27 divides the stereoscopic repair data generated by the repair data generation unit 16 into n pieces of transmission data. In S102, the data transmission unit 28 transmits the first transmission data among the n pieces of transmission data to the data reception unit 32 of the three-dimensional repair device 2. In S103, the modeling means 10 executes a modeling process (stacking of modeling materials) based on the first transmission data. In S103, before the modeling process by the modeling unit 10, the above-described melting by the melting unit 24 and / or cutting by the cutting unit 26 may be performed. In S104, the data deletion unit 34 deletes the first transmission data. In S <b> 105, the deletion signal transmitting unit 36 transmits a deletion signal indicating that the first transmission data has been deleted to the deletion signal receiving unit 30. In S106, the data transmission unit 28 confirms that the deletion signal reception unit 30 has received a deletion signal indicating that the first transmission data has been deleted. In S107, the data transmission unit 28 transmits the second transmission data to the data reception unit 32 on the condition that reception of the deletion signal is confirmed in S106. Thereafter, the same operation is repeated, and the deletion signal receiving means 30 confirms the deletion signal indicating that the nth transmission data has been deleted, and the repair operation in the repair system 1 is completed. Note that whether the melting by the melting unit 24 and / or the cutting by the cutting unit 26 is performed before the modeling process by the modeling unit 10 may be determined for each divided transmission data.

  As described above, the data transmission unit 28 deletes the deletion signal indicating that the i-th transmission data (i-th transmission data) of the n transmission data (where i is a natural number less than n) has been deleted. After confirming that the signal has been received by the signal receiving means 30, the (i + 1) th transmission data (i + 1th transmission data) of the n pieces of transmission data is transmitted to the data receiving means 32 of the three-dimensional repair device 2. . As a result, it is possible to avoid a state in which the three-dimensional repair device 2 simultaneously holds the entire three-dimensional repair data. Therefore, it is possible to suppress the entire three-dimensional repair data from being copied against the intention of the three-dimensional repair data transmission side.

Next, a method for dividing the three-dimensional repair data in the dividing unit 27 shown in FIG. 7 will be described with reference to FIG.
FIG. 9 is a diagram for explaining a method for dividing solid repair data according to some embodiments. As shown in FIG. 7, the dividing unit 27 according to some embodiments is configured to divide the three-dimensional repair data into one layer unit of the modeling material to be stacked. That is, the dividing unit 27 divides the three-dimensional repair data so that each of the n pieces of transmission data corresponds to each layer constituting the repair portion (so that the i-th transmission data corresponds to the i-th layer of the repair portion). . In this case, the data transmission unit 28 confirms that the deletion signal receiving unit 30 has received the deletion signal indicating that the i-th transmission data corresponding to the i-th layer of the repair portion has been deleted, and then the repair portion The (i + 1) th transmission data corresponding to the (i + 1) th layer is configured to be transmitted to the data receiving means 32 of the three-dimensional repair device 2. Thereby, it can suppress that the whole solid repair data is duplicated contrary to the meaning of the solid repair data transmission side. The dividing unit 27 may divide the three-dimensional repair data into a plurality of layers of the modeling material to be laminated, and in this case, the number of transmissions of transmission data is reduced as compared with the case of dividing into one layer unit. be able to.

DESCRIPTION OF SYMBOLS 1 Repair system 2 Solid repair apparatus 4 Repair data provision apparatus 6 Network 8 Scanner 10 Modeling means 12 Defect location identification part 14 Mode selection part 16 Repair data generation part 18 Memory | storage part 20 Repair data provision apparatus side communication part 22 Solid repair apparatus side communication Unit 24 Dissolving means 26 Cutting means 27 Dividing means 28 Data transmitting means 29 Storage tank 30 Deletion signal receiving means 31 Repair target location designating part 32 Data receiving means 34 Data deleting means 36 Delete signal transmitting means

Claims (10)

A three-dimensional repair device that repairs a defective portion of a repair target by stacking modeling materials, a repair data providing device that provides the three-dimensional repair data for repairing the defective portion of the repair target to the three-dimensional repair device, and Repair system,
The three-dimensional repair device has a scanner that acquires a three-dimensional data of the repair target by performing a three-dimensional scan of the repair target,
The repair data providing device includes:
A comparison between the three-dimensional data of the repair object acquired by the scanner and the original three-dimensional data of the repair object, and a defect location identifying unit that identifies the defect location of the repair object,
According to the state of the defect surface of the repair object, a first repair mode for repairing only the defect part of the repair object, and repairing a wider range including the defect part of the repair object including the defect part A mode selection unit for selecting one of the second repair modes to be performed;
A repair data generating unit that generates the three-dimensional repair data corresponding to the repair mode selected by the mode selection unit;
The repair system characterized by having. The three-dimensional repair device further comprises a dissolving means for dissolving the periphery of the defect portion in the repair object,
2. The repair system according to claim 1, wherein when the second repair mode is selected by the mode selection unit, the melting means melts the periphery of the defect portion in the repair target.   The said melt | dissolution means adjusts the depth or range which melt | dissolves the circumference | surroundings of the said defect | deletion location according to the state of the defect surface of the said repair target object in the said 2nd repair mode. Repair system. The three-dimensional repair device further comprises a cutting means for cutting around the defect portion in the repair object,
The said cutting means cuts the circumference | surroundings of the said defect | deletion location in the said repair target object in the said 2nd repair mode before lamination | stacking of the said modeling material, The one of Claims 1-3 characterized by the above-mentioned. Repair system.   The said cutting means adjusts the depth or range which cuts the circumference | surroundings of the said defect location according to the state of the defect surface of the said repair target object in the said 2nd repair mode. Repair system. The three-dimensional repair device further comprises a cutting means for cutting around the defect portion in the repair object,
The scanner scans the object to be repaired again three-dimensionally after melting the periphery of the defect by the melting means,
The repair system according to claim 2 or 3, wherein the cutting means performs cutting based on the three-dimensional data of the repair target after melting obtained by the scanner.   The three-dimensional repair device further includes a storage tank that stores the modeling material removed by the melting unit and / or the cutting unit, and uses the modeling material stored in the storage tank for repairing the repair target. The repair system according to any one of claims 2 to 6, wherein: The three-dimensional repair device or the repair data providing device further includes a repair target location designating unit configured to be able to manually specify a repair target location of the repair target,
The repair system according to any one of claims 2 to 7, wherein the missing part specifying unit specifies the missing part within a range of the repair target part specified by the repair target part specifying unit. . A repair data providing device for providing three-dimensional repair data for repairing a defective part of a repair object,
Compared with the three-dimensional data acquired by performing a three-dimensional scan of the repair target, the original three-dimensional data of the repair target, and a defective part specifying unit for specifying the defective part of the repair target,
A first repair mode for repairing only a defective part of the repair target according to a state of a defective surface of the repair target, and repairing a wider range including the defective part of the repair target. A mode selection unit for selecting one of the second repair modes;
A repair data generating unit that generates the three-dimensional repair data corresponding to the repair mode selected by the mode selection unit;
An apparatus for providing repair data, comprising: A repair data generation method for generating solid repair data for repairing a defective part of a repair target,
A deficient part specifying step for comparing the three-dimensional data acquired by performing a three-dimensional scan of the repair target object and the original three-dimensional data of the repair target object, and specifying a defective part of the repair target object,
A first repair mode for repairing only a defective part of the repair target according to a state of a defective surface of the repair target, and repairing a wider range including the defective part of the repair target. A selection process for selecting one of the second repair modes;
Generating step for generating the three-dimensional repair data corresponding to the repair mode selected by the selection step;
A repair data generation method characterized by comprising:

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