[go: up one dir, main page]

JP2015226002A - Light-emitting device - Google Patents

Light-emitting device Download PDF

Info

Publication number
JP2015226002A
JP2015226002A JP2014111158A JP2014111158A JP2015226002A JP 2015226002 A JP2015226002 A JP 2015226002A JP 2014111158 A JP2014111158 A JP 2014111158A JP 2014111158 A JP2014111158 A JP 2014111158A JP 2015226002 A JP2015226002 A JP 2015226002A
Authority
JP
Japan
Prior art keywords
wavelength conversion
light emitting
light
conversion member
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014111158A
Other languages
Japanese (ja)
Inventor
義和 松田
Yoshikazu Matsuda
義和 松田
大征 北岡
Hiromasa Kitaoka
大征 北岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2014111158A priority Critical patent/JP2015226002A/en
Publication of JP2015226002A publication Critical patent/JP2015226002A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of adjusting color tone of light emission while reducing color unevenness during color tone adjustment.SOLUTION: The light-emitting device includes: a light emitting element; a wavelength conversion member containing a wavelength conversion material that absorbs light emitted by the light emitting element and emits light having a different wavelength; a deformation member capable of deforming a shape of the wavelength conversion member; and a holding member for holding a surface shape of the wavelength conversion member during the time of deformation.

Description

本発明は発光素子と波長変換部材を備える発光装置に関わり、発光装置の発光ムラを抑制し色度を調整する技術に関わる。   The present invention relates to a light emitting device including a light emitting element and a wavelength conversion member, and relates to a technique for adjusting chromaticity by suppressing light emission unevenness of the light emitting device.

近年、発光素子チップ(発光素子)や、発光素子と発光素子からの光を吸収して異なる波長の光を発する蛍光体とを組み合わせて用いた発光装置が、各種の照明装置に用いられている。このような発光装置は、チップや蛍光体等にばらつきがあるために、同様に生産しても得られる発光装置は異なる色度を持つ。   In recent years, light-emitting devices using a combination of a light-emitting element chip (light-emitting element) and a phosphor that absorbs light from the light-emitting element and emits light of different wavelengths are used in various lighting devices. . Since such light emitting devices have variations in chips, phosphors, and the like, light emitting devices that are obtained in the same manner have different chromaticities.

この問題を解決するため、従来、発光装置の製造工程内で、ばらつきを抑制する工夫がなされてきたが、製造工程で厳格な色度の管理をするのではなく、製造後に色度を調整する技術も提案されている。   In order to solve this problem, in the past, contrivances have been made to suppress the variation in the manufacturing process of the light emitting device, but the chromaticity is adjusted after manufacturing instead of strictly managing the chromaticity in the manufacturing process. Technology has also been proposed.

例えば、特許文献1 に、発光素子を封止する波長変換部材の厚みを変化させることで、色度を調整する技術が提供されている。   For example, Patent Literature 1 provides a technique for adjusting chromaticity by changing the thickness of a wavelength conversion member that seals a light emitting element.

上記技術は、波長変換部材を押圧することで変形させて光照射方向の厚みを変化させることで、色度を可逆的に調整するというものである。
また、発光装置を製造した後、例えば発光装置を組み込んだ照明装置の使用中に発光の色調を調整したいという要望もある。
The above technique is to reversibly adjust the chromaticity by changing the thickness in the light irradiation direction by pressing the wavelength conversion member.
There is also a demand for adjusting the color tone of light emission after the light emitting device is manufactured, for example, during use of an illumination device incorporating the light emitting device.

特開2011-171358号公報JP 2011-171358 A

しかし、上記に示す色度調整方法では、波長変換部材の変形後の形状、特に波長変換部材の光出射面側の表面の形状を制御する機構がないため、意図せず発光色が異なる(色ムラが発生する)という問題がある。   However, in the chromaticity adjustment method shown above, since there is no mechanism for controlling the deformed shape of the wavelength conversion member, particularly the shape of the surface on the light emitting surface side of the wavelength conversion member, the emission color differs unintentionally (color There is a problem that unevenness occurs.

本発明は、上記課題に鑑みてなされたものであり、色調の調整時の色ムラを少なくしながら、発光の色調を調整することができる発光装置を提供することを目的とする。  The present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting device that can adjust the color tone of light emission while reducing color unevenness when adjusting the color tone.

本発明の一つの態様は、発光素子と、前記発光素子が発する光を吸収して異なる波長の光を発する波長変換材料を含む波長変換部材を備え、前記波長変換部材の形状を変形させることが可能な変形部材と、前記変形時に前記波長変換部材の表面形状を保つ保持部材を備えたことを特徴とする、発光装置である。   One aspect of the present invention includes a light-emitting element and a wavelength conversion member including a wavelength conversion material that emits light of different wavelengths by absorbing light emitted from the light-emitting element, and deforming the shape of the wavelength conversion member A light emitting device comprising a deformable member and a holding member that maintains a surface shape of the wavelength conversion member during the deformation.

これにより、色ムラを少なくしながら発光の色調を調整できる発光装置を提供できる。   Accordingly, it is possible to provide a light emitting device that can adjust the color tone of light emission while reducing color unevenness.

本発明の1つの実施形態について説明する側断面図である。It is a sectional side view explaining one embodiment of the present invention. 本発明の1つの実施形態に関して、波長変換部材を変形させた状態を説明する側断面図である。It is a sectional side view explaining the state which changed the wavelength conversion member regarding one embodiment of the present invention. 本発明の保持部材の一例を説明する側断面図である。It is a sectional side view explaining an example of the holding member of this invention. 本発明の保持部材と波長変換部材の一例を説明する側断面図である。It is a sectional side view explaining an example of the holding member and wavelength conversion member of this invention. 本発明の1つの実施形態について説明する側断面図である。It is a sectional side view explaining one embodiment of the present invention. 本発明の1つの実施形態に関して、波長変換部材を変形させた状態を説明する側断面図である。It is a sectional side view explaining the state which changed the wavelength conversion member regarding one embodiment of the present invention. 本発明の1つの実施形態について説明する側断面図である。It is a sectional side view explaining one embodiment of the present invention. 本発明の1つの実施形態に関して、波長変換部材を変形させた状態を説明する側断面図である。It is a sectional side view explaining the state which changed the wavelength conversion member regarding one embodiment of the present invention. 本発明の1つの実施形態について説明する側断面図である。It is a sectional side view explaining one embodiment of the present invention. 本発明の1つの実施形態に関して、波長変換部材を変形させた状態を説明する側断面図である。It is a sectional side view explaining the state which changed the wavelength conversion member regarding one embodiment of the present invention. 本発明の1つの実施形態に関して説明する上面図である。It is a top view explaining regarding one embodiment of the present invention. 本発明の1つの実施形態に関して、波長変換部材を変形させた状態を説明する上面図である。It is a top view explaining the state which changed the wavelength conversion member about one embodiment of the present invention.

本発明を実施するための形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具現化するための被覆部材付き発光素子及び発光装置を例示するものであって、以下に限定するものではない。また、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、単なる例示に過ぎない。尚、各図面が示す部材の大きさや位置関係等は、説明を明確にするために誇張していることがある。   A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the light emitting element with a covering member and the light emitting device for embodying the technical idea of the present invention, and is not limited to the following. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention only to specific examples unless otherwise specified. Only. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation.

(実施形態1)
本発明の第1実施形態における発光装置の構造を、図1を参照して説明する。図1は、本発明の発光装置の一実施形態を示す側断面図である。この発光装置は、導体パターンが形成された基板11上に実装されたLED チップ等の発光素子13を有している。
(Embodiment 1)
The structure of the light emitting device according to the first embodiment of the present invention will be described with reference to FIG . FIG. 1 is a side sectional view showing an embodiment of a light emitting device of the present invention. This light-emitting device has a light-emitting element 13 such as an LED chip mounted on a substrate 11 on which a conductor pattern is formed.

また、基板11上には、発光素子13(より詳細には、発光素子13の光出射面となる上面と、発光素子13の側面)を被覆する波長変換部材15と、波長変換部材15を変形させることが可能な変形部材19とが備えられている。本実施形態の変形部材19は、波長変換部材15の側面を囲い、波長変換部材の側面と密着するよう配置されている。波長変換部材15の光出射面側の面(上面)は略平坦である。   Further, on the substrate 11, the wavelength conversion member 15 that covers the light emitting element 13 (more specifically, the upper surface serving as the light emitting surface of the light emitting element 13 and the side surface of the light emitting element 13), and the wavelength converting member 15 are deformed. And a deformable member 19 that can be deformed. The deformation member 19 of the present embodiment surrounds the side surface of the wavelength conversion member 15 and is disposed so as to be in close contact with the side surface of the wavelength conversion member. The light emitting surface side surface (upper surface) of the wavelength conversion member 15 is substantially flat.

また、波長変換部材15の光照射方向の表面形状を保持するために、透光性の保持部材17が、波長変換部材15の上方に備えられている。本実施形態においては、波長変換部材15の上方に保持部材17を支持するため、変形部材19が保持部材17を支持する支持部を兼ねている。
図1に示すように、保持部材17の波長変換部材15と対向する面(接触面)は、略平坦である。また、波長変換部材15が変形していない状態では波長変換部材15と保持部材17は離間している。
In addition, a translucent holding member 17 is provided above the wavelength converting member 15 in order to hold the surface shape of the wavelength converting member 15 in the light irradiation direction. In the present embodiment, since the holding member 17 is supported above the wavelength conversion member 15, the deformable member 19 also serves as a support portion that supports the holding member 17.
As shown in FIG. 1, the surface (contact surface) facing the wavelength conversion member 15 of the holding member 17 is substantially flat. In addition, when the wavelength conversion member 15 is not deformed, the wavelength conversion member 15 and the holding member 17 are separated from each other.

図2に示すように、変形部材19を発光装置の中心方向に移動させることで、変形部材19により波長変換部材15を側面方向から押圧し、波長変換部材15を変形させる。この時、波長変換部材15の光照射方向の厚みが変化する。そして、この変形の際、保持部材17(より詳細には保持部材17の接触面)が波長変換部材15の上面と接触することで、波長変換部材の表面形状を保持部材との接触面と同形状に保持することができる。   As shown in FIG. 2, the wavelength conversion member 15 is pressed from the side surface direction by the deformation member 19 by moving the deformation member 19 toward the center of the light emitting device, and the wavelength conversion member 15 is deformed. At this time, the thickness of the wavelength conversion member 15 in the light irradiation direction changes. In this deformation, the holding member 17 (more specifically, the contact surface of the holding member 17) comes into contact with the upper surface of the wavelength conversion member 15, so that the surface shape of the wavelength conversion member is the same as the contact surface with the holding member. It can be held in shape.

上記により、波長変換部材の表面形状を保持したまま、発光の色調を調整することができる。   As described above, the color tone of light emission can be adjusted while maintaining the surface shape of the wavelength conversion member.

保持部材17の形状によって、波長変換部材15の表面形状は任意のものとすることができる。例えば、上記の実施形態では、保持部材17の接触面の形状は、波長変換部材15の変形前の表面形状と略同様の形状としたが、変形前の表面形状と異なる形状としてもよい。たとえば、図3Aに示すように、保持部材17の接触面を曲面とすることで、図3Bに示すように、波長変換部材15の変形時の表面形状を保持部材の曲面と対応した形状とすることができる。   Depending on the shape of the holding member 17, the surface shape of the wavelength conversion member 15 can be arbitrary. For example, in the above embodiment, the shape of the contact surface of the holding member 17 is substantially the same as the surface shape of the wavelength conversion member 15 before deformation, but may be different from the surface shape before deformation. For example, as shown in FIG. 3A, by making the contact surface of the holding member 17 a curved surface, as shown in FIG. 3B, the surface shape at the time of deformation of the wavelength conversion member 15 is made to correspond to the curved surface of the holding member. be able to.

(実施形態2)
本発明の第2実施形態における発光装置の構造を、図4を参照して説明する。この発光装置は、基板11上に、波長変換部材15を備え、さらに、波長変換部材15の表面形状を保持したまま光照射方向から押圧する保持部材17を備えている。この保持部材17は本実施形態において、変形部材を兼ねており、保持部材17は、波長変換部材15を押圧する透光性の押圧面18を備える。
保持部材17を支持するため、基板11に接続され、保持部材17を支持する支持部20を備える。
保持部材17の押圧面18は波長変換部材15の上方に、保持部材17を支持する支持部20は波長変換部材15の周囲に配置されている。図4では押圧面が波長変換部材15と接触しているが、離間した状態で配置されていてもよい。
(Embodiment 2)
The structure of the light emitting device according to the second embodiment of the present invention will be described with reference to FIG. This light-emitting device includes a wavelength conversion member 15 on a substrate 11 and further includes a holding member 17 that presses from the light irradiation direction while holding the surface shape of the wavelength conversion member 15. In this embodiment, the holding member 17 also serves as a deforming member, and the holding member 17 includes a translucent pressing surface 18 that presses the wavelength conversion member 15.
In order to support the holding member 17, a support unit 20 connected to the substrate 11 and supporting the holding member 17 is provided.
The pressing surface 18 of the holding member 17 is disposed above the wavelength conversion member 15, and the support portion 20 that supports the holding member 17 is disposed around the wavelength conversion member 15. In FIG. 4, the pressing surface is in contact with the wavelength conversion member 15, but may be arranged in a separated state.

図5に示すように、保持部材17の波長変換部材を押圧するための押圧面18が、支持部20に沿って発光装置の上面側から波長変換部材15側に移動し、波長変換部材15を押圧して変形させることで、光照射方向の波長変換部材15の厚みが変化する。この場合でも、波長変換部材15のうち、少なくとも一部の表面形状を保持部材17の接触面の形状に制限し、保持することができる。 As shown in FIG. 5, the pressing surface 18 for pressing the wavelength conversion member of the holding member 17 moves along the support portion 20 from the upper surface side of the light emitting device to the wavelength conversion member 15 side, and the wavelength conversion member 15 is moved. By pressing and deforming, the thickness of the wavelength conversion member 15 in the light irradiation direction changes. Even in this case, at least a part of the surface shape of the wavelength conversion member 15 can be limited to the shape of the contact surface of the holding member 17 and can be held.

変形部材を兼ねる保持部材17を移動させる方法の例として、モータと連動させて移動させる、空気で加圧するといった方法がある。   As an example of a method for moving the holding member 17 that also serves as a deformable member, there is a method in which the holding member 17 is moved in conjunction with a motor or pressurized with air.

(実施形態3)
図6に示すように、保持部材を兼ねた支持部20を波長変換部材15の側面に設け、波長変換部材15の形状に対応した形状とすることで、波長変換部材15の側面形状を維持したまま変形させることができる。またこの時、凹部12を基板11上に設けるとよい。
(Embodiment 3)
As shown in FIG. 6, the side surface shape of the wavelength conversion member 15 is maintained by providing the support portion 20 also serving as a holding member on the side surface of the wavelength conversion member 15 and making it a shape corresponding to the shape of the wavelength conversion member 15. It can be deformed as it is. At this time, the recess 12 may be provided on the substrate 11.

基板11上に凹部12を設けることで、波長変換部材15が上方から押圧面18に押圧されて変形した際、波長変換部材15の一部が凹部12に収容される。これにより、波長変換部材15の上面および側面の形状を保持した状態で、厚みを薄くすることができる。一方で波長変換部材15の光照射方向側は押圧面18に、側面は支持部を兼ねた20により表面形状を保持されることになる。
以上より、光照射方向だけでなく側面の形状も保持したまま、波長変換部材15を変形させ、色ムラを少なくしながら発光の色調を調整することができる。
By providing the recess 12 on the substrate 11, when the wavelength conversion member 15 is pressed and deformed from above by the pressing surface 18, a part of the wavelength conversion member 15 is accommodated in the recess 12. Thereby, thickness can be made thin in the state which hold | maintained the shape of the upper surface and side surface of the wavelength conversion member 15. FIG. On the other hand, the light irradiation direction side of the wavelength conversion member 15 is held by the pressing surface 18, and the side surface is held by the surface 20 that also serves as a support portion.
As described above, it is possible to adjust the color tone of light emission while reducing the color unevenness by deforming the wavelength conversion member 15 while maintaining not only the light irradiation direction but also the shape of the side surface.

本実施形態においては、波長変換部材の光出射面と側面の形状を保持しながら、発光の色調を調整することができる。   In the present embodiment, the color tone of light emission can be adjusted while maintaining the shape of the light emitting surface and the side surface of the wavelength conversion member.

(実施形態4)
本発明の第4実施形態における発光装置の構造を、図8から図10を参照して説明する。この発光装置は、波長変換部材15の上面に、変形部材を兼ねる保持部材17を有することに加え、波長変換部材15の側面に、保持部材を兼ねる支持部20を有している。
波長変換部材15は発光装置の上方に向かって広がる形状を有しており(つまり波長変換部材15の側面は基板11に対して傾斜している)、支持部20は、波長変換部材15の側面形状とほぼ一致する側面を有している。支持部の一部20´は、基板11上を横方向に移動することができる。
(Embodiment 4)
The structure of the light emitting device according to the fourth embodiment of the present invention will be described with reference to FIGS. This light emitting device has a support member 20 that also serves as a holding member on the side surface of the wavelength conversion member 15 in addition to the holding member 17 that also serves as a deforming member on the upper surface of the wavelength conversion member 15.
The wavelength conversion member 15 has a shape that widens toward the upper side of the light emitting device (that is, the side surface of the wavelength conversion member 15 is inclined with respect to the substrate 11), and the support portion 20 is the side surface of the wavelength conversion member 15. It has a side surface that substantially matches the shape. A part 20 ′ of the support part can move on the substrate 11 in the lateral direction.

図9に示すように、発光素子の上方から、保持部材17の押圧面18によって波長変換部材15の上面を押圧して変形させ、波長変換部材15の光照射方向の厚みを変化させる。この変形時、支持部の一部20´は、波長変換部材15の側面の角度を保持したまま、基板11上において、発光装置の中心から外側方向に向かって水平に移動する。   As shown in FIG. 9, the upper surface of the wavelength conversion member 15 is pressed and deformed from above the light emitting element by the pressing surface 18 of the holding member 17 to change the thickness of the wavelength conversion member 15 in the light irradiation direction. At the time of this deformation, a part 20 ′ of the support part moves horizontally from the center of the light emitting device toward the outer side on the substrate 11 while maintaining the angle of the side surface of the wavelength conversion member 15.

波長変換部材15と支持部20の位置関係に関しての例を、図10A、図10Bに示す。図10Aに波長変換部材15を押圧する前の、図10Bは波長変換部材15を押圧して変形させた後の上面図である。
支持部20は4つの部分に分離しており、上面視において該4つの部分をそれぞれ1辺とする矩形をなしており、矩形の波長変換部材15を取り囲んでいる。
波長変換部材15を押圧して変形させることで支持部20が押圧され、図10Bの20´で示す向かい合う2辺が移動することで、波長変換部材15の側面形状を保持したまま光照射方向の厚みを変化させることができる。
Examples regarding the positional relationship between the wavelength conversion member 15 and the support portion 20 are shown in FIGS. 10A and 10B. FIG. 10B is a top view after the wavelength conversion member 15 is pressed and deformed before the wavelength conversion member 15 is pressed in FIG. 10A.
The support part 20 is divided into four parts, has a rectangular shape with each of the four parts as one side in a top view, and surrounds the rectangular wavelength conversion member 15.
When the wavelength conversion member 15 is pressed and deformed, the support portion 20 is pressed, and the two opposite sides indicated by 20 ′ in FIG. 10B move, so that the side surface shape of the wavelength conversion member 15 is maintained and the light irradiation direction is maintained. The thickness can be changed.

以上の方法により、実施形態4においては、波長変換部材の表面および傾斜した側方の形状を保持したまま、発光の色調を調整することができる。   According to the above method, in Embodiment 4, the color tone of light emission can be adjusted while maintaining the surface of the wavelength conversion member and the inclined side shape.

次に、本発明の発光装置および各構成部材の構造について、以下に詳述する。 Next, the structure of the light emitting device and each component of the present invention will be described in detail below.

(発光装置)
本発明の発光装置は、正負のリード電極や反射部材等を備えたパッケージ内に発光素子を収容した表面実装型発光ダイオードや砲弾型発光ダイオード、発光素子の周囲に樹脂や蛍光体層等を形成したチップサイズパッケージ型発光ダイオードなどを用いることができる。
(Light emitting device)
The light emitting device of the present invention is a surface mount type light emitting diode or bullet type light emitting diode in which a light emitting element is accommodated in a package having positive and negative lead electrodes, a reflecting member, etc., and a resin or phosphor layer is formed around the light emitting element. A chip size package type light emitting diode or the like can be used.

なお、発光素子は、例えば、p型半導体層と、光を放出する活性層と、n型半導体層と、p型半導体層と電気的に接続されるp側電極と、n型半導体層と電気的に接続されるn側電極を有する。発光素子の電極は、ダイボンディングやワイヤボンディングやフリップチップボンディング等によって正負のリード電極に電気的に接続されている。また、発光素子の電極は、発光装置の外部に露出して、実装基板等と接合されるリード電極とされていてもよい。   Note that the light-emitting element includes, for example, a p-type semiconductor layer, an active layer that emits light, an n-type semiconductor layer, a p-side electrode electrically connected to the p-type semiconductor layer, an n-type semiconductor layer, and an electric N-side electrode connected to each other. The electrodes of the light emitting element are electrically connected to the positive and negative lead electrodes by die bonding, wire bonding, flip chip bonding, or the like. Further, the electrode of the light emitting element may be a lead electrode that is exposed to the outside of the light emitting device and bonded to a mounting substrate or the like.

発光素子が波長変換部材15や波長変換部材の変形に伴って変形する部材(例えば、波長変換部材の下方であって、発光素子の上に設けられた透光性層)に直接被覆されている場合には、発光素子はワイヤ等を用いないフリップチップボンディングで実装されることが好ましい。これにより、発光素子の断線等のおそれを低減することができる。   The light-emitting element is directly covered with the wavelength conversion member 15 or a member that deforms with the deformation of the wavelength conversion member (for example, a translucent layer provided below the wavelength conversion member and on the light-emitting element). In some cases, the light emitting element is preferably mounted by flip chip bonding without using a wire or the like. This can reduce the risk of disconnection of the light emitting element.

発光素子は、発光波長や材料は、例えば、青色や紫色の発光をする発光素子、例えば、サファイア基板上にGaN系半導体が積層された発光素子を用いることができる。これにより、後述する波長変換部材と組み合わせて、容易に白色の光の発光装置を製造することができる。   As the light emitting element, for example, a light emitting element that emits blue or violet light, for example, a light emitting element in which a GaN-based semiconductor is stacked on a sapphire substrate can be used. Thus, a white light emitting device can be easily manufactured in combination with a wavelength conversion member described later.

(波長変換部材)
発光装置は、発光素子からの発光だけでなく、その発光を吸収して異なる波長の発光を行う波長変換部材を有している。発光装置からの発光色(発光色調)は、これら発光素子からの発光と波長変換部材からの発光が合わさったものとなる。
(Wavelength conversion member)
The light emitting device includes not only light emitted from the light emitting element but also a wavelength conversion member that absorbs the emitted light and emits light of different wavelengths. The emission color (emission color tone) from the light emitting device is a combination of the emission from these light emitting elements and the emission from the wavelength conversion member.

波長変換部材は波長変換材料を含有している。波長変換材料としては、例えば蛍光体を用いることができる。蛍光体は種々の方法で発光装置に設けられる。例えば、発光素子を封止する透光性の封止部材に含有させることができる。   The wavelength conversion member contains a wavelength conversion material. As the wavelength conversion material, for example, a phosphor can be used. The phosphor is provided in the light emitting device by various methods. For example, it can be contained in a translucent sealing member that seals the light emitting element.

蛍光体としては、発光素子からの光を吸収して別の波長の光を発することのできる蛍光体であれば様々なものを用いることができる。例えば、ユーロピウム、セリウム等のランタノイド系元素で主に賦活される窒化物系蛍光体・酸窒化物系蛍光体、より具体的には、ユーロピウムで賦活されたα又はβサイアロン型蛍光体、各種アルカリ土類金属窒化シリケート蛍光体、ユーロピウム等のランタノイド系元素、マンガン等の遷移金属系元素により主に賦活されるアルカリ土類金属ハロゲンアパタイト蛍光体、アルカリ土類のハロシリケート蛍光体、アルカリ土類金属シリケート蛍光体、アルカリ土類金属ホウ酸ハロゲン蛍光体、アルカリ土類金属アルミン酸塩蛍光体、アルカリ土類金属ケイ酸塩、アルカリ土類金属硫化物、アルカリ土類金属チオガレート、アルカリ土類金属窒化ケイ素、ゲルマン酸塩、セリウム等のランタノイド系元素で主に賦活される希土類アルミン酸塩、希土類ケイ酸塩又はユーロピウム等のランタノイド系元素で主に賦活される有機物及び有機錯体等が挙げられる。特に、青色発光の発光素子と組み合わせる場合、黄色蛍光体であるYAG系蛍光体、赤色蛍光体であるSCASNやKSF、緑色蛍光体のβ−SiAlONやLAG系蛍光体等が好適に用いられる。これにより、白色ないし電球色の発光装置を製造することができる。   Various phosphors can be used as long as the phosphor can absorb light from the light emitting element and emit light of another wavelength. For example, nitride phosphors and oxynitride phosphors mainly activated by lanthanoid elements such as europium and cerium, more specifically, α or β sialon phosphors activated by europium, various alkalis Earth metal nitride silicate phosphors, lanthanoid elements such as europium, alkaline earth metal halogenapatite phosphors mainly activated by transition metal elements such as manganese, alkaline earth halosilicate phosphors, alkaline earth metals Silicate phosphor, alkaline earth metal halogen borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal silicate, alkaline earth metal sulfide, alkaline earth metal thiogallate, alkaline earth metal nitride Rare earth aluminate mainly activated by lanthanoid elements such as silicon, germanate, cerium, Examples thereof include organic substances and organic complexes mainly activated with lanthanoid elements such as rare earth silicates or europium. In particular, when combined with a blue light emitting element, a yellow phosphor YAG phosphor, a red phosphor SCASN or KSF, a green phosphor β-SiAlON, a LAG phosphor, or the like is preferably used. As a result, a light emitting device of white or light bulb color can be manufactured.

また、1つの発光装置に2種類以上の蛍光体を用いてもよい。2種類以上の蛍光体は。混合された状態で設けられてもよく、層状に設けられていてもよい。   Two or more kinds of phosphors may be used for one light emitting device. Two or more types of phosphors. It may be provided in a mixed state or may be provided in layers.

色度を任意に調節するために、波長変換部材の変形は可逆的であることが好ましい。そのため波長変換部材が固体である場合には、弾性ないし靱性を有することが好ましい。例えば透光性のゴム状の樹脂や封止部材として用いることができる。   In order to arbitrarily adjust the chromaticity, the deformation of the wavelength conversion member is preferably reversible. Therefore, when the wavelength conversion member is solid, it is preferable to have elasticity or toughness. For example, it can be used as a translucent rubber-like resin or a sealing member.

また波長変換部材15は、液状であってもよい。これにより、波長変換部材15が変形する際、波長変換部材15が破壊される懸念や、変形時に発光素子13に圧力がかかって破壊する懸念を少なくすることができる、色度を調整することができる。   Further, the wavelength conversion member 15 may be liquid. Thereby, when the wavelength conversion member 15 is deformed, the chromaticity can be adjusted, which can reduce the concern that the wavelength conversion member 15 is broken and the fear that the light-emitting element 13 is broken when it is deformed. it can.

封止部材は必要に応じて封止部材に、シリカや酸化チタン等のフィラーを備えていてよい。 The sealing member may include a filler such as silica or titanium oxide in the sealing member as necessary.

(変形部材)
変形部材は、波長変換部材を変形させることが可能な、変形させるための部材である。変形部材の材料や設ける位置は特に限定されず、変形させたい波長変換部材の形状や、発光装置の構造によって適宜選択される。
(Deformation member)
The deformation member is a member for deforming, which can deform the wavelength conversion member. The material and the position of the deformable member are not particularly limited, and are appropriately selected depending on the shape of the wavelength conversion member to be deformed and the structure of the light emitting device.

波長変換部材を変形させ色度を調整するためには、波長変換部材の変形量を任意に調節する必要がある。そのため変形部材は、加圧量を任意に調節できる必要がある。
このように変形部材を駆動する機構としては、例えば圧電素子を備えた圧電アクチュエータやモータ、加圧エアー等を用いることができる。
In order to adjust the chromaticity by deforming the wavelength conversion member, it is necessary to arbitrarily adjust the deformation amount of the wavelength conversion member. Therefore, the deformation member needs to be able to arbitrarily adjust the amount of pressurization.
As a mechanism for driving the deformable member in this manner, for example, a piezoelectric actuator provided with a piezoelectric element, a motor, pressurized air, or the like can be used.

(保持部材)
保持部材は、少なくとも波長変換部材の上方に設けられ、波長変換部材の表面形状を保持しながら、発光素子から発せられた光や、波長変換部材により発せられた光を透過させる部材であればよい。また波長変換部材を変形させるときに圧力がかかるため、保持部材が変形しないよう剛性の高い物質が好ましい。
(Holding member)
The holding member may be a member that is provided at least above the wavelength conversion member and transmits light emitted from the light emitting element or light emitted from the wavelength conversion member while holding the surface shape of the wavelength conversion member. . Moreover, since pressure is applied when the wavelength conversion member is deformed, a highly rigid substance is preferable so that the holding member does not deform.

保持部材として、例えば透光性のガラスや樹脂等が考えられる。   As the holding member, for example, translucent glass or resin can be considered.

保持部材は、波長変換部材を変形させる変形部材を兼ねてもよい。例えば、波長変換部材の上方に設けた保持部材の押圧部により波長変換部材を押圧して変形させてもよい。   The holding member may also serve as a deformation member that deforms the wavelength conversion member. For example, the wavelength conversion member may be pressed and deformed by a pressing portion of a holding member provided above the wavelength conversion member.

保持部材が変形部材を兼ねる場合、例えば押圧面をモーターと連動させて移動させる、あるいは押圧面の上面側(波長変換部材と接触していない側)を加圧雰囲気にして移動させることで、波長変換部材を押圧して変形させることができる。 When the holding member also serves as a deforming member, for example, the pressing surface is moved in conjunction with the motor, or the upper surface side (the side not in contact with the wavelength conversion member) of the pressing surface is moved in a pressurized atmosphere, thereby changing the wavelength. The conversion member can be pressed and deformed.

保持部材は、波長変換部材の上方だけでなく、側方にも設けられてもよい。この時、波長変換部材の上方の保持部材を支持する支持部が、保持部材を兼ねてもよい。   The holding member may be provided not only above the wavelength conversion member but also on the side. At this time, the support part which supports the holding member above the wavelength conversion member may also serve as the holding member.

その他、発光装置は、例えば、異なる色の発光をする複数の発光素子と蛍光体とを組み合わせたものであってもよい。具体的には、青色発光する発光素子と青色の発光を吸収して緑色発光する蛍光体を用いた発光装置から薄緑色(白色がかった緑色)の光を得て、赤色の発光素子もしくは赤色の発光素子を有する発光装置からの光を混色して白色領域の光を得るようにしてもよい。   In addition, the light emitting device may be, for example, a combination of a plurality of light emitting elements that emit light of different colors and a phosphor. Specifically, light green (whiteish green) light is obtained from a light-emitting device using a light-emitting element that emits blue light and a phosphor that absorbs blue light and emits green light. Light from a light emitting device having a light emitting element may be mixed to obtain white region light.

なお、発光装置の色度のばらつきは、種々の原因で起こる。例えば、蛍光体の量や分布、発光素子の発光波長、蛍光体の混合比、蛍光体を含有している樹脂等の粘度のばらつき、製造装置や測定装置などの各種装置の消耗やばらつきなどが原因で発生する。   Note that variation in chromaticity of the light emitting device occurs due to various causes. For example, the amount and distribution of the phosphor, the emission wavelength of the light emitting element, the mixing ratio of the phosphor, the viscosity variation of the resin containing the phosphor, the consumption and the variation of various devices such as the manufacturing device and the measuring device, etc. Caused by a cause.

以上、発光装置の色度調整方法について、本発明を実施するための形態について説明したが、本発明は上記実施形態に限定されるものではなく、これらの記載に基づいて種々変更、改変等したものも本発明の趣旨に含まれることはいうまでもない。   As mentioned above, although the form for implementing this invention was demonstrated about the chromaticity adjustment method of a light-emitting device, this invention is not limited to the said embodiment, Based on these description, various changes, a modification | change, etc. were carried out. Needless to say, these are also included in the spirit of the present invention.

また、本明細書の一つの実施形態の記載の構成は、特に困難な場合を除き、別の実施形態にも適用可能である。   In addition, the configuration described in one embodiment of the present specification can be applied to another embodiment unless particularly difficult.

11 基板
12 基板表面の凹部
13 発光素子
15 波長変換部材
17 保持部材
18 押圧面
19 変形部材
20、20´ 支持部
DESCRIPTION OF SYMBOLS 11 Substrate 12 Recess 13 on substrate surface Light emitting element 15 Wavelength conversion member 17 Holding member 18 Pressing surface 19 Deformation member 20, 20 '

Claims (8)

発光素子と、前記発光素子が発する光を吸収して異なる波長の光を発する波長変換材料を含む波長変換部材を備え、
前記波長変換部材の形状を変形させることが可能な変形部材と、前記波長変換部材の上面に、前記変形時に前記波長変換部材の表面形状を保つ保持部材とを備えたことを特徴とする、発光装置。
A wavelength conversion member including a light-emitting element and a wavelength conversion material that emits light of different wavelengths by absorbing light emitted from the light-emitting element;
A light emitting device comprising: a deformable member capable of deforming a shape of the wavelength converting member; and a holding member that maintains a surface shape of the wavelength converting member at the time of the deformation on an upper surface of the wavelength converting member. apparatus.
前記波長変換部材は、前記発光素子の光出射面側に設けられており、前記保持部材は、前記波長変換部材の表面形状と対応した形状を有する透光性の部材である、請求項1に記載の発光装置。 The wavelength conversion member is provided on a light emitting surface side of the light emitting element, and the holding member is a translucent member having a shape corresponding to a surface shape of the wavelength conversion member. The light emitting device described. 前記保持部材が前記変形部材を兼ねる、請求項1または2に記載の発光装置。 The light emitting device according to claim 1, wherein the holding member also serves as the deformation member. 前記保持部材を支持する支持部を有する、請求項3に記載の発光装置。 The light emitting device according to claim 3, further comprising a support portion that supports the holding member. 前記保持部材は、前記波長変換部材の側方にも設けられている、請求項1から3のいずれか1項に記載の発光 The light emission according to any one of claims 1 to 3, wherein the holding member is also provided on a side of the wavelength conversion member. 前記波長変換部材の側方に設けられた保持部材は、前記変形時に、発光装置の中心から外側方向に移動することを特徴とする、請求項5に記載の発光装置。 6. The light emitting device according to claim 5, wherein the holding member provided on a side of the wavelength conversion member moves outward from the center of the light emitting device during the deformation. 前記波長変換部材が、液状であることを特徴とする、請求項1から6のいずれか1項に記載の発光装置。 The light emitting device according to claim 1, wherein the wavelength conversion member is in a liquid state. 前記変形部材によって前記波長変換部材の形状を変化させることで、前記発光装置の発光色を変化させることが可能なことを特徴とする、請求項1から7のいずれか1項に記載の発光装置。 8. The light emitting device according to claim 1, wherein the light emission color of the light emitting device can be changed by changing the shape of the wavelength conversion member by the deformable member. 9. .
JP2014111158A 2014-05-29 2014-05-29 Light-emitting device Pending JP2015226002A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014111158A JP2015226002A (en) 2014-05-29 2014-05-29 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014111158A JP2015226002A (en) 2014-05-29 2014-05-29 Light-emitting device

Publications (1)

Publication Number Publication Date
JP2015226002A true JP2015226002A (en) 2015-12-14

Family

ID=54842548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014111158A Pending JP2015226002A (en) 2014-05-29 2014-05-29 Light-emitting device

Country Status (1)

Country Link
JP (1) JP2015226002A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019159441A1 (en) * 2018-02-14 2019-08-22 日本特殊陶業株式会社 Optical wavelength conversion device
CN117568035A (en) * 2023-12-04 2024-02-20 江门市蓬江区凯森电子厂 A high-performance multi-peak excitation phosphor composition and device for LEDs

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268431A (en) * 2004-03-17 2005-09-29 Nichia Chem Ind Ltd Light emitting device and method for manufacturing the same
JP2007173754A (en) * 2005-11-28 2007-07-05 Kyocera Corp Wavelength converter and light emitting device
US20090115313A1 (en) * 2007-11-07 2009-05-07 Industrial Technology Research Institute Light emitting device and fabricating method thereof
JP2009259868A (en) * 2008-04-11 2009-11-05 Sharp Corp Chromaticity adjusting method of light-emitting apparatus and manufacturing method
JP2011142254A (en) * 2010-01-08 2011-07-21 Citizen Holdings Co Ltd Method of adjusting chromaticity of led light source device
JP2011171358A (en) * 2010-02-16 2011-09-01 Stanley Electric Co Ltd Semiconductor light-emitting device
JP2011171585A (en) * 2010-02-19 2011-09-01 Panasonic Electric Works Co Ltd Light-emitting device
JP2011222544A (en) * 2010-04-02 2011-11-04 Stanley Electric Co Ltd Manufacturing method of semiconductor light-emitting device and chromaticity-adjusted semiconductor light-emitting device
KR101256929B1 (en) * 2011-12-26 2013-04-19 루미마이크로 주식회사 Light emitting device chip having wavelenth-converting layer and method of fabricating the same
JP2014096491A (en) * 2012-11-09 2014-05-22 Nitto Denko Corp Semiconductor element covered with phosphor layer and method for manufacturing the same, and semiconductor device and method for manufacturing the same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268431A (en) * 2004-03-17 2005-09-29 Nichia Chem Ind Ltd Light emitting device and method for manufacturing the same
JP2007173754A (en) * 2005-11-28 2007-07-05 Kyocera Corp Wavelength converter and light emitting device
US20090115313A1 (en) * 2007-11-07 2009-05-07 Industrial Technology Research Institute Light emitting device and fabricating method thereof
JP2009259868A (en) * 2008-04-11 2009-11-05 Sharp Corp Chromaticity adjusting method of light-emitting apparatus and manufacturing method
JP2011142254A (en) * 2010-01-08 2011-07-21 Citizen Holdings Co Ltd Method of adjusting chromaticity of led light source device
JP2011171358A (en) * 2010-02-16 2011-09-01 Stanley Electric Co Ltd Semiconductor light-emitting device
JP2011171585A (en) * 2010-02-19 2011-09-01 Panasonic Electric Works Co Ltd Light-emitting device
JP2011222544A (en) * 2010-04-02 2011-11-04 Stanley Electric Co Ltd Manufacturing method of semiconductor light-emitting device and chromaticity-adjusted semiconductor light-emitting device
KR101256929B1 (en) * 2011-12-26 2013-04-19 루미마이크로 주식회사 Light emitting device chip having wavelenth-converting layer and method of fabricating the same
JP2014096491A (en) * 2012-11-09 2014-05-22 Nitto Denko Corp Semiconductor element covered with phosphor layer and method for manufacturing the same, and semiconductor device and method for manufacturing the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019159441A1 (en) * 2018-02-14 2019-08-22 日本特殊陶業株式会社 Optical wavelength conversion device
JPWO2019159441A1 (en) * 2018-02-14 2021-01-07 日本特殊陶業株式会社 Optical wavelength converter
CN117568035A (en) * 2023-12-04 2024-02-20 江门市蓬江区凯森电子厂 A high-performance multi-peak excitation phosphor composition and device for LEDs
CN117568035B (en) * 2023-12-04 2024-04-16 江门市蓬江区凯森电子厂 High-performance fluorescent powder composition for multi-wave peak excitation LED and device

Similar Documents

Publication Publication Date Title
US10907789B2 (en) Light emitting device and vehicular lamp comprising same
JP6733646B2 (en) Light emitting device and manufacturing method thereof
JP4881358B2 (en) Light emitting device
JP6149487B2 (en) LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE
JP6331389B2 (en) Light emitting device
US9420642B2 (en) Light emitting apparatus and lighting apparatus
JPWO2013011628A1 (en) Light emitting device and manufacturing method thereof
CN104241510A (en) Semiconductor light emitting device
JP6693044B2 (en) Light emitting device and manufacturing method thereof
KR20150084312A (en) Semiconductor light emitting device
KR102407819B1 (en) Light emitting device
KR20160149846A (en) Light Emitting Diode package and Method of manufacturing the same
KR20210123242A (en) Light emitting device
JP2015226002A (en) Light-emitting device
US8952398B2 (en) LED lighting module
US10396261B2 (en) Light emitting device and method of manufacturing the light emitting device
KR102168701B1 (en) Multi-color phosphor plate, light emitting diode package including the multi-color phosphor plate and method of manufacturing the same
JP2011171358A (en) Semiconductor light-emitting device
JP6985622B2 (en) Light emitting device and integrated light emitting device
JP5320374B2 (en) Method for manufacturing light emitting device
KR20180074959A (en) Led module

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161122

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170927

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171003

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171128

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171226

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180219

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20180403