JP2015206074A - Copper tin alloy plating solution and method for plating copper tin alloy using the same - Google Patents
Copper tin alloy plating solution and method for plating copper tin alloy using the same Download PDFInfo
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Abstract
Description
本発明は、ニッケルめっきの代替となりうる銅錫合金めっき液およびこれを用いた銅錫合金のめっき方法に関する。 The present invention relates to a copper tin alloy plating solution that can be used as an alternative to nickel plating and a copper tin alloy plating method using the same.
ニッケルめっきは優れた色調と耐蝕性とを有し、装飾めっきの下地めっきとして使用されているが、そのような装飾めっきを施した装飾品の装着によりアレルギーが生じることも知られている。 Nickel plating has excellent color tone and corrosion resistance, and is used as a base plating for decorative plating. However, it is also known that allergies occur when a decorative article subjected to such decorative plating is attached.
そのため、欧州ではニッケルに関して皮膚と直接かつ長時間接触する製品についての使用および流通に対する規制が定められている。 For this reason, there are regulations in Europe regarding the use and distribution of products that are in direct and long-term contact with the nickel.
このような状況においてニッケルめっきの代替となりうる種々の技術が研究されていて、例えば、銅錫合金めっきでは、可溶性銅塩と、可溶性第一錫塩と、メチオニン及び／又はメチオニン誘導体とを含有して銅／ 錫質量比が７０／３０〜２０／８０に調整された弱酸性〜強酸性の銅−錫合金めっき浴であって銀白色のめっきを施すことができることを特徴とする銅−錫合金めっき浴が報告されている（特許文献１）。 In this situation, various techniques that can replace nickel plating have been studied. For example, copper tin alloy plating contains a soluble copper salt, a soluble stannous salt, and methionine and / or a methionine derivative. A copper-tin alloy having a copper / tin mass ratio adjusted to 70/30 to 20/80, which is a weakly acidic to strongly acidic copper-tin alloy plating bath and capable of being silver-white plated A plating bath has been reported (Patent Document 1).
しかしながら、上記銅−錫合金めっき浴で使用する有機スルホン酸は高価であり、また、有機スルホン酸を高濃度で使用するため高コストであるという問題があり、低コストな別の組成の銅−錫合金めっき浴が要求されていた。 However, the organic sulfonic acid used in the copper-tin alloy plating bath is expensive and has a problem of high cost because the organic sulfonic acid is used at a high concentration. A tin alloy plating bath has been required.
従って、本発明は、上記銅−錫合金めっき浴よりもコストの点で優れ、ニッケルめっきの代替となりうる銅錫合金めっき液を提供することを課題とした。 Accordingly, an object of the present invention is to provide a copper-tin alloy plating solution that is superior in cost to the copper-tin alloy plating bath and can be used as a substitute for nickel plating.
本発明者らは、上記課題を解決するために鋭意研究した結果、無機酸系の銅錫合金めっき液に、カルボン酸類や特定の構造の界面活性剤を配合した銅錫合金めっき液が、低コストでニッケルめっきの代替となりうることを見出し、本発明を完成させた。 As a result of intensive studies to solve the above problems, the present inventors have found that a copper tin alloy plating solution in which a carboxylic acid or a surfactant having a specific structure is blended with an inorganic acid-based copper tin alloy plating solution has a low content. The present invention has been completed by finding that it can replace nickel plating at a low cost.
すなわち、本発明は、以下の成分（ａ）〜（ｆ）
（ａ）可溶性銅塩
（ｂ）可溶性第一錫塩
（ｃ）無機酸
（ｄ）メチオニン、メチオニンの異性体およびメチオニンの側鎖に置換基を有するメチオニン誘導体から選ばれる１種または２種以上
（ｅ）カルボン酸、カルボン酸のアルカリ金属塩およびカルボン酸のアンモニウム塩から選ばれる１種または２種以上
（ｆ）構造中にポリオキシアルキレン鎖を有する界面活性剤
を含有し、銅／錫質量比が８０／２０／〜６０／４０であることを特徴とする銅錫合金めっき液である。
That is, the present invention provides the following components (a) to (f):
(A) soluble copper salt (b) soluble stannous salt (c) inorganic acid (d) methionine, an isomer of methionine, and one or more selected from methionine derivatives having a substituent on the side chain of methionine ( e) One or more selected from carboxylic acid, alkali metal salt of carboxylic acid and ammonium salt of carboxylic acid (f) a surfactant having a polyoxyalkylene chain in the structure, and a copper / tin mass ratio Is a copper-tin alloy plating solution, characterized in that it is 80/20 / -60 / 40.
また、本発明は上記銅錫合金めっき液を用いて銅錫合金をめっきすることを特徴とする銅錫合金のめっき方法である。 Moreover, this invention is a copper tin alloy plating method characterized by plating a copper tin alloy using the said copper tin alloy plating solution.
本発明の銅錫合金めっき液は、高価な有機スルホン酸を用いないため低コストであるものの、ニッケルと同等の銀白色の外観を有するためニッケルめっきの代替となりうる優れたものである。 The copper-tin alloy plating solution of the present invention is low in cost because it does not use expensive organic sulfonic acid, but has a silver-white appearance equivalent to that of nickel, and thus is an excellent substitute for nickel plating.
また、本発明の銅錫合金めっき液は銅錫合金を析出させることができ、特にスペキュラム組成の銅錫合金を析出させることができる。 Moreover, the copper tin alloy plating solution of the present invention can precipitate a copper tin alloy, and in particular, can precipitate a copper tin alloy having a speculum composition.
本発明の銅錫合金めっき液は、以下の成分（ａ）〜（ｆ）
（ａ）可溶性銅塩
（ｂ）可溶性第一錫塩
（ｃ）無機酸
（ｄ）メチオニン、メチオニンの異性体およびメチオニンの側鎖に置換基を有するメチオニン誘導体から選ばれる１種または２種以上
（ｅ）カルボン酸、カルボン酸のアルカリ金属塩およびカルボン酸のアンモニウム塩から選ばれる１種または２種以上
（ｆ）構造中にポリオキシアルキレン鎖を有する界面活性剤
を含有するものである。
The copper tin alloy plating solution of the present invention comprises the following components (a) to (f):
(A) soluble copper salt (b) soluble stannous salt (c) inorganic acid (d) methionine, an isomer of methionine, and one or more selected from methionine derivatives having a substituent on the side chain of methionine ( e) One or more selected from carboxylic acids, alkali metal salts of carboxylic acids, and ammonium salts of carboxylic acids (f) containing a surfactant having a polyoxyalkylene chain in the structure.
上記成分（ａ）可溶性銅塩としては、可溶性の銅塩であれば特に限定されないが、例えば、硫酸銅、スルファミン酸銅、酢酸銅、塩化第二銅等が挙げられる。これらの可溶性銅塩の中でも特に硫酸銅が好ましい。これら可溶性銅塩は１種または２種以上を用いることができる。また、これら可溶性銅塩は、本発明のめっき液に、金属銅として０.０３〜０.３５ｍｏｌ／ｌ、好ましくは０.０７〜０.２５ｍｏｌ／ｌで含有させる。 The component (a) soluble copper salt is not particularly limited as long as it is a soluble copper salt, and examples thereof include copper sulfate, copper sulfamate, copper acetate, and cupric chloride. Of these soluble copper salts, copper sulfate is particularly preferred. These soluble copper salts can be used alone or in combination of two or more. Further, these soluble copper salts are contained in the plating solution of the present invention as metallic copper at 0.03 to 0.35 mol / l, preferably 0.07 to 0.25 mol / l.
上記成分（ｂ）可溶性第一錫塩としては、可溶性の第一錫塩であれば特に限定されないが、例えば、硫酸錫、スルファミン酸錫、塩化錫等が挙げられる。これらの可溶性第一錫塩の中でも特に硫酸錫が好ましい。これら可溶性第一錫塩は１種または２種以上を用いることができる。また、これら可溶性第一錫塩は、本発明のめっき液に、金属錫として０.０１５〜０.１３５ｍｏｌ／ｌ、好ましくは０.０３０〜０.１０５ｍｏｌ／ｌで含有させる。 The component (b) soluble stannous salt is not particularly limited as long as it is a soluble stannous salt, and examples thereof include tin sulfate, tin sulfamate, and tin chloride. Of these soluble stannous salts, tin sulfate is particularly preferred. These soluble stannous salts can be used alone or in combination of two or more. Further, these soluble stannous salts are contained in the plating solution of the present invention as metal tin at 0.015 to 0.135 mol / l, preferably 0.030 to 0.105 mol / l.
上記成分（ｃ）無機酸としては、特に限定されないが、例えば、硫酸、スルファミン酸、酢酸、塩酸等が挙げられる。これらの無機酸の中でも硫酸が好ましい。これら無機酸は１種または２種以上を用いることができる。また、これら無機酸は、本発明のめっき液に、０.５〜２.５ｍｏｌ／ｌ、好ましくは０.７５〜２.２５ｍｏｌ／ｌで含有させる。 Although it does not specifically limit as said component (c) inorganic acid, For example, a sulfuric acid, sulfamic acid, an acetic acid, hydrochloric acid etc. are mentioned. Of these inorganic acids, sulfuric acid is preferred. These inorganic acids can be used alone or in combination of two or more. These inorganic acids are contained in the plating solution of the present invention at 0.5 to 2.5 mol / l, preferably 0.75 to 2.25 mol / l.
上記成分（ｄ）メチオニン、メチオニンの異性体およびメチオニンの側鎖に置換基を有するメチオニン誘導体（以下、「メチオニン等」という）としては、例えば、メチオニンや、ＤＬ−メチオニン、Ｌ−メチオニン等のメチオニンの異性体、Ｎ−アセチル−ＤＬ−メチオニン等のメチオニンの側鎖に置換基を有するメチオニン誘導体が挙げられる。これらメチオニン等の中でもＤＬ−メチオニン、Ｌ−メチオニンが好ましく、特にＤＬ−メチオニンが好ましい。これらメチオニン等は１種または２種以上を用いることができる。また、これらメチオニン等は、本発明のめっき液に、０.１〜０.７ｍｏｌ／ｌ、好ましくは０.１５〜０.５５ｍｏｌ／ｌで含有させる。 Examples of the component (d) methionine, an isomer of methionine, and a methionine derivative having a substituent on the side chain of methionine (hereinafter referred to as “methionine”) include, for example, methionine such as methionine, DL-methionine, and L-methionine. And methionine derivatives having a substituent on the side chain of methionine such as N-acetyl-DL-methionine. Among these methionines, DL-methionine and L-methionine are preferable, and DL-methionine is particularly preferable. These methionines can be used alone or in combination of two or more. Further, these methionine and the like are contained in the plating solution of the present invention at 0.1 to 0.7 mol / l, preferably 0.15 to 0.55 mol / l.
上記成分（ｅ）カルボン酸、カルボン酸のアルカリ金属塩およびカルボン酸のアンモニウム塩（以下、「カルボン酸等」という）としては、例えば、クエン酸、酒石酸、リンゴ酸、乳酸等のカルボン酸およびそれらのアルカリ金属塩、アンモニウム塩等が挙げられる。これらのカルボン酸等の中でもクエン酸、クエン酸三アンモニウム、クエン酸三ナトリウムが好ましく、特にクエン酸三アンモニウムが好ましい。これらカルボン酸等は１種または２種以上を用いることができる。また、これらカルボン酸等は、本発明のめっき液に、０.０１５〜０.４５ｍｏｌ／ｌ、好ましくは０.１〜０.３ｍｏｌ／ｌで含有させる。 Examples of the component (e) carboxylic acid, alkali metal salt of carboxylic acid and ammonium salt of carboxylic acid (hereinafter referred to as “carboxylic acid etc.”) include carboxylic acids such as citric acid, tartaric acid, malic acid, lactic acid, and the like. And alkali metal salts and ammonium salts thereof. Among these carboxylic acids, citric acid, triammonium citrate, and trisodium citrate are preferable, and triammonium citrate is particularly preferable. These carboxylic acids can be used alone or in combination of two or more. These carboxylic acids and the like are contained in the plating solution of the present invention at 0.015 to 0.45 mol / l, preferably 0.1 to 0.3 mol / l.
上記成分（ｆ）構造中にポリオキシアルキレン鎖を有する界面活性剤としては、構造中にポリオキシアルキレン鎖を有する界面活性剤であれば特に限定されず、例えば、ポリオキシエチレンアルキルスルホコハク酸２ナトリウム、ポリオキシエチレンアルキル硫酸エステルナトリウム等のアニオン系のもの、エチレンジアミンのポリオキシアルキレン縮合付加物、ポリオキシエチレンラウリルアミン、ポリオキシエチレンステアリルアミン、ポリオキシアルキレンエーテル、ポリオキシアルキレンモノブチルエーテル等のノニオン系のものが挙げられる。これらの構造中にポリオキシアルキレン鎖を有する界面活性剤中でもポリオキシエチレンアルキルスルホコハク酸２ナトリウム、エチレンジアミンのポリオキシアルキレン縮合付加物が好ましく、ポリオキシエチレンアルキルスルホコハク酸２ナトリウムがより好ましく、ポリオキシエチレンアルキルスルホコハク酸２ナトリウム（エチレンオキサイド３ｍｏｌ／ｌ付加物）が特に好ましい。これら構造中にポリオキシアルキレン鎖を有する界面活性剤は１種または２種以上を用いることができる。また、これら構造中にポリオキシアルキレン鎖を有する界面活性剤は、本発明のめっき液に、０.０５〜２０ｇ／ｌ、好ましくは０.５〜１０ｇ／ｌで含有させる。 The surfactant having a polyoxyalkylene chain in the structure of component (f) is not particularly limited as long as it is a surfactant having a polyoxyalkylene chain in the structure. For example, disodium polyoxyethylene alkylsulfosuccinate , Anionic compounds such as sodium polyoxyethylene alkyl sulfate, polyoxyalkylene condensation adducts of ethylenediamine, nonionic compounds such as polyoxyethylene laurylamine, polyoxyethylene stearylamine, polyoxyalkylene ether, polyoxyalkylene monobutyl ether Can be mentioned. Among these surfactants having a polyoxyalkylene chain in their structure, disodium polyoxyethylene alkylsulfosuccinate and polyoxyalkylene condensation adducts of ethylenediamine are preferred, disodium polyoxyethylene alkylsulfosuccinate is more preferred, polyoxyethylene Alkylsulfosuccinic acid disodium (ethylene oxide 3 mol / l adduct) is particularly preferred. One or more surfactants having a polyoxyalkylene chain in these structures can be used. The surfactant having a polyoxyalkylene chain in the structure is contained in the plating solution of the present invention at 0.05 to 20 g / l, preferably 0.5 to 10 g / l.
なお、本発明の銅錫合金めっき液は、上記成分（ａ）〜（ｆ）を含有すると共に、銅／錫質量比が８０／２０／〜６０／４０、好ましくは７５／２５〜６５／３５である。この質量比はめっき液に添加する成分（ａ）と（ｂ）の量を変えることで容易に調整することができる。 The copper tin alloy plating solution of the present invention contains the above components (a) to (f), and the copper / tin mass ratio is 80/20 / -60 / 40, preferably 75 / 25-65 / 35. It is. This mass ratio can be easily adjusted by changing the amounts of the components (a) and (b) added to the plating solution.
また、本発明の銅錫合金めっき液は、本発明の効果を損なわない範囲で、例えば、ゼラチン、ポリエチレングリコール等の平滑化剤、水酸化ナトリウム、水酸化カリウム等のｐＨ調整剤等の従来の銅錫合金めっき液に添加することのできる成分を含有することができる。これら成分は、従来の使用量で本発明の銅錫合金めっき液にめっき液に含有させることができる。 In addition, the copper tin alloy plating solution of the present invention is a range that does not impair the effects of the present invention, for example, conventional smoothing agents such as gelatin and polyethylene glycol, and pH adjusting agents such as sodium hydroxide and potassium hydroxide. The component which can be added to a copper tin alloy plating solution can be contained. These components can be contained in the plating solution in the copper tin alloy plating solution of the present invention in the conventional use amount.
更に、本発明の銅錫合金めっき液は、水に各成分を溶解することで調製できる。 Furthermore, the copper tin alloy plating solution of the present invention can be prepared by dissolving each component in water.
以上説明した本発明の銅錫合金めっき液は、従来の銅錫合金めっき液と同様の条件で、銅錫合金をめっきすることができ、例えば、浴温１０〜５０℃の本発明の銅錫合金めっき液に被めっき物を浸漬し、錫、銅、カーボン、ステンレス等のアノードを用い、電流密度０.５〜３Ａ／ｄｍ２で所望の時間めっきすればよい。 The copper tin alloy plating solution of the present invention described above can be plated with a copper tin alloy under the same conditions as the conventional copper tin alloy plating solution. For example, the copper tin alloy of the present invention having a bath temperature of 10 to 50 ° C. What is necessary is just to immerse a to-be-plated object in an alloy plating solution, and to plate at a current density of 0.5 to 3 A / dm 2 for a desired time using an anode of tin, copper, carbon, stainless steel or the like.
本発明めっき液でめっきすることができる被めっき物は特に限定されず、例えば、表面が、銅、鉄、ステンレス等の金属、ＡＢＳ、ポリイミド等の樹脂等で形成されたもの等が挙げられる。 The to-be-plated object which can be plated with this invention plating solution is not specifically limited, For example, what the surface formed with metals, such as copper, iron, stainless steel, resin, such as ABS, a polyimide, etc. are mentioned.
本発明の銅錫合金めっき液を用いて銅錫合金をめっきした場合、ニッケルと同等の銀白色の外観を有するめっき皮膜となる。そのため、本発明の銅錫合金めっき液はニッケルの代替めっき等に利用することができる。 When a copper tin alloy is plated using the copper tin alloy plating solution of the present invention, a plating film having a silver-white appearance equivalent to nickel is obtained. Therefore, the copper tin alloy plating solution of the present invention can be used for alternative plating of nickel and the like.
なお、本発明の銅錫合金めっき液として、銅／錫質量比が、７５／２５〜６５／３５のものを用いた場合、いわゆる、スペキュラム合金をめっきすることができる。スペキュラム合金とは銅錫合金における錫が４０質量％程度のものである。スペキュラム合金が析出しているかどうかはＸ線回折（２θ／θ）において、Ｃｕ６Ｓｎ５に基づくピークがあることにより確認することができる。 When a copper / tin mass ratio of 75/25 to 65/35 is used as the copper tin alloy plating solution of the present invention, a so-called speculum alloy can be plated. The speculum alloy is a copper tin alloy having about 40% by mass of tin. Whether or not the speculum alloy is precipitated can be confirmed by the presence of a peak based on Cu 6 Sn 5 in X-ray diffraction (2θ / θ).
このスペキュラム合金めっきは特に装飾品等のめっきに利用することができる。 This speculum alloy plating can be used particularly for plating decorative items.
以下、本発明を実施例を挙げて詳細に説明するが、本発明はこれら実施例に何ら限定されるものではない。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited to these Examples at all.
実 施 例 １
銅錫合金めっき：
下記表１に記載の成分を含有する銅錫合金めっき液（銅／錫質量比＝７１／２９）を、水に各成分を溶解させることで調製した。この銅錫合金めっき液に銅めっきを施した真鍮基板を浸漬し、下記条件で銅錫合金めっきを行った。めっき後、この基板の外観を目視で評価した。また、この基板上のめっき皮膜の結晶構造をＸ線回折で評価した。なお、この基板のめっき皮膜についてＸ線回折（２θ／θ）を行った結果を図１に示した。
Example 1
Copper tin alloy plating:
A copper tin alloy plating solution (copper / tin mass ratio = 71/29) containing the components shown in Table 1 below was prepared by dissolving each component in water. A brass substrate plated with copper was immersed in this copper-tin alloy plating solution, and copper-tin alloy plating was performed under the following conditions. After plating, the appearance of the substrate was visually evaluated. Further, the crystal structure of the plating film on the substrate was evaluated by X-ray diffraction. In addition, the result of having performed X-ray diffraction (2 (theta) / (theta)) about the plating film of this board | substrate was shown in FIG.
（めっき条件）
浴温：４５℃
電流密度：２.５Ａ／ｄｍ２
アノード：錫
時間：１０分
(Plating conditions)
Bath temperature: 45 ° C
Current density: 2.5 A / dm 2
Anode: Tin Time: 10 minutes
銅錫合金めっき後の基板は外観がニッケルめっきと酷似していた。また、Ｘ線回折の結果、めっき皮膜にＣ６Ｓｎ５に基づくピークが認められたことから、この銅錫合金めっき液によりスペキュラム合金が析出することがわかった。 The substrate after copper-tin alloy plating was very similar in appearance to nickel plating. Further, as a result of X-ray diffraction, a peak based on C 6 Sn 5 was observed in the plating film, and thus it was found that a speculum alloy was precipitated by this copper-tin alloy plating solution.
実 施 例 ２
銅錫合金めっき：
下記表２に記載の成分を含有する銅錫合金めっき液（銅／錫質量比＝７１／２９）を、水に各成分を溶解させることで調製した。この銅錫合金めっき液に銅めっきを施した真鍮基板を浸漬し、下記条件で銅錫合金めっきを行った。めっき後、この基板の外観を目視で評価した。
Example 2
Copper tin alloy plating:
A copper tin alloy plating solution (copper / tin mass ratio = 71/29) containing the components shown in Table 2 below was prepared by dissolving each component in water. A brass substrate plated with copper was immersed in this copper-tin alloy plating solution, and copper-tin alloy plating was performed under the following conditions. After plating, the appearance of the substrate was visually evaluated.
（めっき条件）
浴温：２５℃
電流密度：１Ａ／ｄｍ２
アノード：カーボン
時間：７分
(Plating conditions)
Bath temperature: 25 ° C
Current density: 1 A / dm 2
Anode: Carbon Time: 7 minutes
銅錫合金めっき後の基板は外観がニッケルめっきと酷似していた。 The substrate after copper-tin alloy plating was very similar in appearance to nickel plating.
実 施 例 ３
銅錫合金めっき：
下記表３に記載の成分を含有する銅錫合金めっき液（銅／錫質量比＝７１／２９）を、水に各成分を溶解させることで調製した。この銅錫合金めっき液に銅めっきを施した真鍮基板を浸漬し、下記条件で銅錫合金めっきを行った。めっき後、この基板の外観を評価した。
Example 3
Copper tin alloy plating:
A copper tin alloy plating solution (copper / tin mass ratio = 71/29) containing the components shown in Table 3 below was prepared by dissolving each component in water. A brass substrate plated with copper was immersed in this copper-tin alloy plating solution, and copper-tin alloy plating was performed under the following conditions. After plating, the appearance of this substrate was evaluated.
（めっき条件）
浴温：２５℃
電流密度：１Ａ／ｄｍ２
アノード：カーボン
時間：７分
(Plating conditions)
Bath temperature: 25 ° C
Current density: 1 A / dm 2
Anode: Carbon Time: 7 minutes
銅錫合金めっき後の基板は外観がニッケルめっきと似ていた。 The substrate after copper-tin alloy plating was similar in appearance to nickel plating.
本発明の銅錫合金めっき液を用いて得られるめっきは、ニッケルと同等の銀白色の外観を有するためニッケルめっきの代替となりうる。
以 上
The plating obtained using the copper-tin alloy plating solution of the present invention has a silver-white appearance equivalent to that of nickel, and can be used as an alternative to nickel plating.
that's all
Claims (3)
（ａ）可溶性銅塩
（ｂ）可溶性第一錫塩
（ｃ）無機酸
（ｄ）メチオニン、メチオニンの異性体およびメチオニンの側鎖に置換基を有するメチオニン誘導体から選ばれる１種または２種以上
（ｅ）カルボン酸、カルボン酸のアルカリ金属塩およびカルボン酸のアンモニウム塩から選ばれる１種または２種以上
（ｆ）構造中にポリオキシアルキレン鎖を有する界面活性剤
を含有し、銅／錫質量比が８０／２０／〜６０／４０であることを特徴とする銅錫合金めっき液。 The following components (a) to (f)
(A) soluble copper salt (b) soluble stannous salt (c) inorganic acid (d) methionine, an isomer of methionine, and one or more selected from methionine derivatives having a substituent on the side chain of methionine ( e) One or more selected from carboxylic acid, alkali metal salt of carboxylic acid and ammonium salt of carboxylic acid (f) a surfactant having a polyoxyalkylene chain in the structure, and a copper / tin mass ratio Is a copper-tin alloy plating solution, characterized in that it is 80/20 / -60 / 40.
A copper tin alloy plating method using the copper tin alloy plating solution according to claim 1 or 2, wherein the copper tin alloy is plated.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017217387A1 (en) * | 2016-06-13 | 2017-12-21 | 石原ケミカル株式会社 | Electrolytic tin or tin alloy plating bath and electronic component having electrodeposition article that is formed with use of said plating bath |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000026994A (en) * | 1998-07-09 | 2000-01-25 | Daiwa Kasei Kenkyusho:Kk | Electric-electronic circuit parts |
| JP2004010907A (en) * | 2002-06-03 | 2004-01-15 | Kyoto Ichi | Copper-tin alloy plating bath and copper-tin alloy plating method using the plating bath |
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2014
- 2014-04-21 JP JP2014087050A patent/JP2015206074A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000026994A (en) * | 1998-07-09 | 2000-01-25 | Daiwa Kasei Kenkyusho:Kk | Electric-electronic circuit parts |
| JP2004010907A (en) * | 2002-06-03 | 2004-01-15 | Kyoto Ichi | Copper-tin alloy plating bath and copper-tin alloy plating method using the plating bath |
| JP3876383B2 (en) * | 2002-06-03 | 2007-01-31 | 京都市 | Copper-tin alloy plating bath and copper-tin alloy plating method using the plating bath |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017217387A1 (en) * | 2016-06-13 | 2017-12-21 | 石原ケミカル株式会社 | Electrolytic tin or tin alloy plating bath and electronic component having electrodeposition article that is formed with use of said plating bath |
| KR20190018478A (en) * | 2016-06-13 | 2019-02-22 | 이시하라 케미칼 가부시키가이샤 | An electro-tin and tin alloy plating bath, and an electronic part in which a complex is formed by using the plating bath |
| TWI730123B (en) * | 2016-06-13 | 2021-06-11 | 日商石原化學股份有限公司 | Tin and tin alloy electroplating bath and electrodeposited electronic component manufactured by the electroplating bath |
| KR102500063B1 (en) * | 2016-06-13 | 2023-02-14 | 이시하라 케미칼 가부시키가이샤 | Electric tin and tin alloy plating bath, and electronic parts in which an electrodeposited material is formed using the plating bath |
| US11939691B2 (en) | 2016-06-13 | 2024-03-26 | Ishihara Chemical Co., Ltd. | Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath |
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