JP2015171954A - Laminate-producing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate-producing method for producing a laminate of a desired shape.SOLUTION: A laminate-producing method comprises: a coating step of forming a film over a glass plate; a reinforcing step of reinforcing a front surface and a rear surface of the glass plate to make a reinforced glass plate; and a cutting step of extending a crack 30 penetrating in the thickness direction through the reinforced glass plate 10 with the film 18 by irradiating a laser beam locally on the reinforced glass plate 10 with the film 18 and by moving the irradiated position by a laser beam 20 in the reinforced glass plate 10 with the film 18, thereby to extend cracks 30 penetrating through the reinforced glass plate 10 having the film 18 in the thickness direction. At least one of the coating step and the reinforcing step is accompanied by a heat treatment. The cutting step heats an intermediate layer 17 of the reinforced glass plate 10 locally at a temperature at or lower than an annealing point by the laser beam 20, and generates a tensile stress or a compressive stress lower than an internal residual tensile stress CT, locally in the intermediate layer 17 thereby to control the extension rate of the crack 30 due to the internal residual tensile stress.

Description

  The present invention relates to a method for manufacturing a laminated board.

  As a strengthening method for strengthening glass, for example, there are a physical strengthening method such as an air cooling strengthening method and a chemical strengthening method such as an ion exchange method (for example, see Patent Documents 1 and 2). The tempered glass plate is one in which residual compressive stress is generated on the front and back surfaces of the glass plate and the front and back surfaces of the glass plate are strengthened.

  Conventionally, it has been difficult to cut a tempered glass plate, and the tempered glass plate has been manufactured by cutting the glass plate into product sizes and then strengthening the product.

JP 2000-290030 A Japanese Patent Publication No. 6-60039

  In recent years, a tempered glass plate with a film such as a low reflection film has been developed.

  However, warping may occur due to a difference in thermal expansion between the film and the glass plate during heat treatment for film formation or heat treatment for strengthening the glass plate. Warpage occurred at the edge of the glass plate with the film, and the desired shape could not be obtained.

  This invention is made | formed in view of the said subject, Comprising: It aims at provision of the manufacturing method of the laminated board from which the desired shape is obtained.

In order to solve the above problems, a method for manufacturing a laminate according to one aspect of the present invention includes:
A method for producing a laminated plate having a tempered glass plate and a film supported by the tempered glass plate,
A coating process for forming a film on a glass plate;
A tempered glass comprising a surface layer and a back layer as a reinforced layer having a residual compressive stress that reinforces the front and back surfaces of the glass plate, and an intermediate layer formed between the surface layer and the back layer and having an internal residual tensile stress A strengthening process to produce a plate;
Irradiate laser light locally on the tempered glass plate with film, move the irradiation position of the laser light on the tempered glass plate with film, and extend cracks that penetrate the tempered glass plate with film in the thickness direction And a cutting step of cutting the laminated plate from the tempered glass plate with the film,
In the cutting step, the intermediate layer is locally heated by the laser light at a temperature below the annealing point, and a tensile stress or a compressive stress smaller than the internal residual tensile stress is locally generated in the intermediate layer. The crack extension speed due to the internal residual tensile stress is controlled.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the laminated board from which the desired shape is obtained is provided.

It is sectional drawing which shows an example of the tempered glass board with a film | membrane used for the cutting process by 1st Embodiment of this invention. It is a schematic diagram which shows an example of the residual stress distribution of an air-cooled tempered glass board. It is a schematic diagram which shows an example of the residual stress distribution of a chemically strengthened glass plate. It is explanatory drawing of the cutting process by 1st Embodiment of this invention. It is a figure which shows an example of the relationship between the irradiation position of the laser beam in the tempered glass board with a film | membrane, and the front-end | tip position of a crack. It is a schematic diagram which shows an example of the stress distribution in the cross section along the AA line of FIG. It is a schematic diagram which shows an example of the stress distribution in the cross section along the BB line of FIG. It is a figure which shows an example of the cutting-out position of the laminated board cut out from the tempered glass board with a film | membrane. It is a figure which shows the protection process by 1st Embodiment of this invention. It is explanatory drawing of the cutting process by 2nd Embodiment of this invention.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted.

[First Embodiment]
The laminate has a tempered glass plate and a film supported by the tempered glass plate. The film is disposed on one side of the tempered glass plate, but may be disposed on both sides, and the two films disposed on both sides may have different functions.

  The manufacturing method of a laminated board has a coating process, a reinforcement | strengthening process, and a cutting process. The order of the coating step and the strengthening step is not particularly limited, and either step may be performed first, or both steps may be performed simultaneously. When both processes are performed at the same time, when the glass plate heated in the coating process is cooled to room temperature, the glass plate is tempered to be strengthened. The cutting process is performed after the coating process and the strengthening process. Hereinafter, each step will be described.

  A coating process forms a film | membrane on a glass plate. Although the kind of glass of a glass plate is not specifically limited, For example, soda-lime glass, an alkali free glass etc. are mentioned. The thickness of a glass plate is suitably set according to the use of a glass plate, for example, is 0.1-25 mm. In the case of a tempered glass plate by physical strengthening, it is preferable that the thickness is 1.5 mm or more because a temperature difference is easily made between the front and back surfaces of the glass plate and the inside in the strengthening step.

  The film formed on the glass plate may be, for example, a low reflection film (Anti Reflection Layer) having a fine uneven structure. The low reflection film includes, for example, silica fine particles, and the silica fine particles are arranged so as to cover the surface of the glass plate. A plurality of layers made of a plurality of silica fine particles may be laminated. The silica fine particles are bonded together with a binder, and the binder fixes the silica fine particles on the glass plate. The binder contains a metal oxide, for example, at least one metal oxide selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, zirconium oxide, and tantalum oxide.

  The film formation method may be any of a wet method and a dry method (including a vacuum deposition method, a sputtering method, a CVD method, etc.), and is appropriately selected according to the type of the film. As a method for forming the low reflection film, there is a method in which a coating liquid is applied on a glass plate and heat-treated. The maximum temperature of the heat treatment is, for example, 200 ° C to 1800 ° C. The maximum temperature of the heat treatment is preferably 400 ° C. or higher, more preferably 600 ° C. or higher.

  The coating liquid for the low reflection film is prepared, for example, by mixing silica fine particles, a hydrolyzable metal compound, a catalyst for hydrolysis, water and a solvent, and hydrolyzing the metal compound. The metal compound becomes a binder by heat treatment, and includes a metal alkoxide containing at least one metal element such as Si, Al, Ti, Zr, and Ta. When this coating solution is applied to a glass plate and heated, a dehydration condensation reaction of the hydrolyzate of the metal compound is performed, and a volatile component is vaporized to form a low reflection film.

  The coating liquid for the low reflection film may not contain silica fine particles. For example, the coating liquid may be selected from the group consisting of alkoxysilanes, hydrolysates of alkoxysilanes, and partial condensates of alkoxysilanes. It may be prepared by mixing at least one selected with water and a solvent.

  The method for applying the coating liquid is not particularly limited, and for example, a spin coating method, a roll coating method, a spray coating method, a dip coating method, a flow coating method, a screen printing method and the like are used.

The film of the present embodiment is a low reflection film, but there are many kinds of films. For example, a low emission film (laminated with a metal film (infrared reflection film) and a dielectric film) ( Low Emissivity Layer). As the metal film, for example, a film mainly containing Ag, Al, Cu, Au, Pt, Cr, Ti or the like is used. As the dielectric film, an oxide film such as ZnO, SnO ₂ , or TiO ₂ , a nitride film such as SiNx, or a metal oxynitride film such as silicon aluminum nitride (SiAlON) is used. The low radiation film is formed by, for example, a sputtering method.

  In the tempering step, residual tensile stress is generated on the front and back surfaces of the glass plate, and the front and back surfaces of the glass plate are strengthened to produce a tempered glass plate. The strengthening method may be either a physical strengthening method such as an air cooling strengthening method or a chemical strengthening method such as an ion exchange method.

  The air-cooling strengthening method rapidly cools the glass plate at the temperature near the softening point from both sides, and creates a temperature difference between the front and back surfaces of the glass plate and the inside of the glass plate. Residual compressive stress is generated, and the front and back surfaces of the glass plate are strengthened.

  The rapid cooling in the air cooling strengthening method may be performed simultaneously with the coating process, or may be performed when the glass plate coated with the coating liquid is heated and then cooled to room temperature. For example, film formation and glass strengthening can be performed continuously by heating and quenching while a glass plate coated with a coating solution is horizontally transported by a plurality of transport rollers. Compared with the case where the strengthening step is performed after the coating step, reheating for strengthening is not necessary, so that time and cost can be reduced. A coating liquid may be apply | coated to the upper surface of a glass plate, and a conveyance roll may support a glass plate from the downward direction.

  By the way, the glass at a temperature near the softening point is soft, and the glass can flow in a viscous manner so as to absorb the difference in thermal expansion between the glass and the film. Thereafter, when the glass plate is rapidly cooled, warpage occurs due to a difference in thermal expansion between the glass plate and a film formed on the glass plate. Warpage occurs at the end of a glass plate with a film. The central part of the glass plate with the film is pressed against the transport roll by gravity and becomes flat.

  In the ion exchange method, the front and back surfaces of a glass plate are ion-exchanged, and ions having a small ion radius (for example, Li ions and Na ions) contained in the glass are replaced with ions having a large ion radius (for example, K ions). Thereby, a residual compressive stress is produced in the surface and back surface of a glass plate, and the surface and back surface of a glass plate are strengthened. In the ion exchange method, ion exchange is performed by immersing a glass plate in a high-temperature treatment solution.

  In the case of the ion exchange method, after performing ion exchange on both surfaces (front surface and back surface) of the glass plate, a coating process for forming a film on the glass plate is performed. The coating process in this case is preferably a heat treatment at a temperature not exceeding the temperature at which the strengthening is weakened. In the case of the air cooling strengthening method, the order of the coating process and the strengthening process is not particularly limited. However, when the coating process is performed after the tempering process, heating beyond the annealing point where viscous flow occurs in the tempered glass sheet may relieve the residual stress and weaken the strengthening. It is preferable to carry out the process.

  Even when the coating step is performed after the strengthening step, warpage occurs due to a difference in thermal expansion between the glass plate and the film in the process of cooling the heated glass plate for film formation. Warpage occurs at the end of a glass plate with a film. The central part of the glass plate with a film is pressed against a support such as a table by gravity and becomes flat.

  FIG. 1 is a view showing an example of a cross section of a tempered glass plate with a film used in the cutting step according to the first embodiment of the present invention. In FIG. 1, the direction of the arrow indicates the direction of action of residual stress in the tempered glass sheet, and the size of the arrow indicates the magnitude of stress in the tempered glass sheet.

  The tempered glass plate 10 includes a surface layer 13 and a back surface layer 15 as reinforcing layers having residual compressive stress, and an intermediate layer 17 formed between the surface layer 13 and the back surface layer 15 and having residual tensile stress. The film 18 is supported on the back surface 14 of the tempered glass plate 10.

  The end surface of the tempered glass plate 10 may be covered with a reinforcing layer extending from the end portion of the surface layer 13 and the end portion of the back surface layer 15. Further, the end face of the tempered glass plate 10 may not be covered with the tempered layer, and the end face of the intermediate layer 17 may be exposed at the end face of the tempered glass plate 10.

  FIG. 2 is a schematic diagram showing an example of the residual stress distribution of the air-cooled tempered glass sheet. FIG. 3 is a schematic diagram showing an example of a residual stress distribution of a chemically strengthened glass plate.

  As shown in FIG. 2 and FIG. 3, the residual compressive stress decreases as it goes inward from both ends in the thickness direction of the tempered glass plate 10, and a residual tensile stress is generated inside the tempered glass plate 10.

  2 and 3, CS is the maximum residual compressive stress (surface compressive stress) (> 0) of the reinforcing layers 13 and 15, CT is an internal residual tensile stress (> 0) in the intermediate layer 17, DOL is the reinforcing layer 13, A thickness of 15 is shown respectively. CS, CT, and DOL are the tempering conditions (in the case of air-cooled tempering method, the heating temperature and cooling rate of the glass plate, in the case of ion exchange method, the concentration and temperature of the processing solution, and the glass plate to the processing solution. The immersion time can be adjusted.

  The surface compressive stress (CS) of the reinforcing layers 13 and 15 and the thickness (DOL) of the reinforcing layers 13 and 15 are measured by, for example, a surface stress meter FSM-6000 (manufactured by Orihara Seisakusho).

In the case of a chemically strengthened glass plate, the internal residual tensile stress (CT) of the intermediate layer 17 is calculated by the following mathematical formula (1).
CT = (CS × DOL) / (t−2 × DOL) (1)
CS, CT, and DOL are measured with the film 18 attached. Usually, the surface on which the film 18 is not formed is measured. However, when the surface on which the film 18 is formed is measured, the measurement is performed by a microbirefringence imaging system Abrio (manufactured by HINDS Instruments).

In addition, when the surface layer 13 and the back surface layer 15 have different thicknesses and different maximum compressive stresses, the internal residual tensile stress (CT) is calculated by the following mathematical formula (2).
CT = (C1 × D1 / 2 + C2 × D2 / 2) / (t−D1−D2) (2)
In the above formula (2), C1 represents the maximum residual compressive stress of the surface layer 13, D1 represents the thickness of the surface layer 13, C2 represents the maximum residual compressive stress of the back surface layer 15, and D2 represents the thickness of the back surface layer 15.

In the case of a physically strengthened glass plate, the internal residual tensile stress (CT) of the intermediate layer 17 is calculated by the following mathematical formula (3).
CT = CS / a (3)
In Equation (3), a is a constant determined by the temperature at the start of cooling the glass plate, the cooling rate of the glass, the thickness of the glass plate, etc., and is usually in the range of 2.0 to 2.5.

  FIG. 4 is an explanatory diagram of a cutting process according to the first embodiment of the present invention. FIG. 5 is a diagram showing an example of the relationship between the irradiation position of the laser beam and the tip position of the crack in the tempered glass plate with a film.

  In the cutting step, the laminated plate 101 (see FIG. 8) is cut out from the tempered glass plate 10 with the film 18. The laminated plate 101 to be cut out includes a part of the tempered glass plate 10 and a part of the film 18.

  In the cutting step, the tempered glass plate 10 with the film 18 is locally irradiated with the laser beam 20, the irradiation position of the laser 20 in the tempered glass plate 10 with the film 18 is moved, and the tempered glass plate 10 is moved in the plate thickness direction. The crack 30 that penetrates is extended. The crack 30 extends along the locus of the irradiation position of the laser 20 on the tempered glass plate 10. In order to move the irradiation position of the laser 20 on the tempered glass plate 10, the tempered glass plate 10 may move, the light source of the laser light 20 may move, or both may move. Instead of moving the tempered glass plate 10, the tempered glass plate 10 may be rotated. Further, in order to move the irradiation position of the laser 20 on the tempered glass plate 10, a galvanometer mirror that reflects the laser light from the light source toward the tempered glass plate 10 may be rotated.

  The crack 30 penetrates the tempered glass plate 10 and the film 18 in the plate thickness direction, and the cutting in this embodiment is a so-called full cut cutting.

  A scribe line (groove line) may not be formed at the cutting position of the tempered glass plate 10 before laser irradiation. A scribe line may be formed, but it takes time to form the scribe line. Moreover, the tempered glass board 10 may be missing when forming the scribe line.

  An initial crack may be formed at the cutting start position of the tempered glass plate 10. The initial crack is formed by, for example, a cutter, a file, or a laser. When the end surface of the tempered glass plate 10 is ground with a grindstone or the like, microcracks formed by grinding can be used as initial cracks.

  The cutting start position and the cutting end position of the tempered glass plate 10 may be either the outer periphery of the tempered glass plate 10 or the inside of the tempered glass plate 10. Moreover, the shape of the cutting line of the tempered glass plate 10 may be various.

  After being emitted from the light source, the laser light 20 is collected by an optical system such as a condenser lens, is incident on the front surface 12 of the tempered glass plate 10, and is emitted from the rear surface 14 of the tempered glass plate 10. The film 18 may be supported on the surface (back surface 14) from which the laser light 20 is emitted in the tempered glass plate 10. Absorption of the laser beam 20 by the film 18 can be suppressed.

Assuming that the intensity of the laser beam 20 on the surface 12 of the tempered glass plate 10 is I ₀ and the intensity of the laser beam 20 when moved through the tempered glass plate 10 by a distance L (cm) is I, I = I ₀ × exp The equation (−α × L) is established. This equation is called Lambert-Beer's law. α represents the absorption coefficient (cm ⁻¹ ) of the tempered glass plate 10 with respect to the laser light 20, and is determined by the wavelength of the laser light 20, the chemical composition of the tempered glass plate 10, and the like. α is measured by an ultraviolet visible near infrared spectrophotometer or the like.

  While the laser beam 20 passes through the tempered glass plate 10, the tempered glass plate 10 absorbs part of the irradiation energy of the laser beam 20 as heat, and thermal stress is generated in the tempered glass plate 10. Using this thermal stress, cutting of the tempered glass plate 10 is controlled. At this time, the film 18 is also cut simultaneously. The film 18 absorbs part of the irradiation energy of the laser light 20 as heat and may be cut by the thermal stress, or may be cut by the thermal stress generated in the tempered glass plate 10.

  By the way, the cutting mechanism of the tempered glass and the cutting of the non-tempered glass of the present embodiment are fundamentally different from each other, and the manner of crack extension is completely different.

  In cutting the non-strengthened glass plate, the glass plate is locally heated with laser light, and the irradiation position of the laser light on the glass plate is moved to form a temperature gradient along the moving direction. A tensile stress is generated in the vicinity of the rear of the irradiation position of the laser beam, and the crack extends due to this tensile stress. The tip position of the crack follows the irradiation position of the laser light as the irradiation position of the laser light moves. As described above, the extension of the crack is performed only by the irradiation energy of the laser beam. Therefore, if laser irradiation is interrupted in the middle of cutting, the extension of cracks stops.

  On the other hand, in the cutting of tempered glass of this embodiment, in order to utilize the residual tensile stress originally present inside the glass plate, the tensile stress is not generated by laser light as in the case of cutting of non-tempered glass. May be. Further, when a crack is generated by applying some force to the tempered glass plate, the crack extends by itself due to residual tensile stress. Moreover, since the residual tensile stress inside the glass plate exists in the entire glass plate, the crack can extend in any direction. Further, when the crack extension speed reaches a certain speed, the crack branches.

  According to the knowledge of the present inventor, when the internal residual tensile stress (CT) of the intermediate layer 17 becomes 30 MPa or more, the crack formed in the tempered glass plate 10 is naturally extended only by the residual tensile stress of the intermediate layer 17 ( Self-propelled).

  Therefore, in the present embodiment, the intermediate layer 17 is locally heated at a temperature equal to or lower than the annealing point by the laser light 20 while cutting the tempered glass plate 10 by extending the crack 30 due to the internal residual tensile stress CT. A tensile stress or a compressive stress smaller than the internal residual tensile stress CT is locally generated in the intermediate layer 17 to suppress the extension of the crack 30 due to the internal residual tensile stress CT. That is, the extension speed of the crack 30 can be controlled by controlling the moving speed of the irradiation position of the laser beam 20. By controlling the extension speed of the crack 30, the direction in which the crack 30 extends can be determined, and the crack 30 can be prevented from branching. That is, by controlling the extension speed of the crack 30, the extension trajectory of the crack 30 can be controlled with high accuracy. The reason why the intermediate layer 17 is heated at a temperature equal to or lower than the annealing point is that when the heating exceeds the annealing point, the thermal stress is relieved by the viscous flow of the glass plate.

  FIG. 6 is a schematic diagram showing an example of a stress distribution in a cross section along the line AA in FIG. FIG. 7 is a schematic diagram showing an example of a stress distribution in a cross section along the line BB in FIG. The cross section in FIG. 7 is a cross section behind the cross section in FIG. Here, “rear” means the rear in the moving direction of the irradiation position of the laser light on the tempered glass plate (that is, the rearward direction of the crack in the tempered glass plate). 6 and 7, the direction of the arrow indicates the direction of the stress applied to the tempered glass sheet, and the length of the arrow indicates the magnitude of the stress on the tempered glass sheet.

  As shown in FIG. 6, the laser-irradiated portion of the intermediate layer 17 is heated to a higher temperature than the other portions of the intermediate layer 17. Therefore, a tensile stress or a compressive stress smaller than the internal residual tensile stress CT is generated in the laser irradiated portion of the intermediate layer 17, and the extension of the crack 30 due to the internal residual tensile stress CT is suppressed. If compressive stress is generated as shown in FIG. 6, extension of the crack 30 can be reliably prevented. On the other hand, when a tensile stress smaller than the internal residual tensile stress CT is generated, the tip position of the crack 30 and the irradiation position of the laser beam 20 are close to each other, and the tip position of the crack 30 can be accurately controlled.

  On the other hand, as shown in FIG. 7, the temperature in the vicinity of the rear of the laser irradiation portion of the intermediate layer 17 is lower than that of the laser irradiation portion of the intermediate layer 17. Therefore, a tensile stress larger than the internal residual tensile stress CT is generated in the vicinity of the rear of the laser irradiation portion of the intermediate layer 17. The crack 30 is formed in a portion where the tensile stress exceeds a predetermined value, and is concentrated in a portion where the tensile stress is large. Therefore, the tip position of the crack 30 does not deviate from the locus of the irradiation position of the laser beam 20.

  The tip position of the crack 30 follows the irradiation position of the laser beam 20 as the irradiation position of the laser beam 20 moves, and does not overtake the irradiation position of the laser beam 20. The tip position of the crack 30 may partially overlap the irradiation position of the laser light 20 as long as it does not pass the irradiation position of the laser light 20.

  As described above, according to the present embodiment, the intermediate layer 17 is locally heated by the laser beam 20, and a tensile stress or a compressive stress smaller than the internal residual tensile stress CT is locally generated in the intermediate layer 17, The extension of the crack 30 due to the internal residual tensile stress CT is suppressed. Therefore, the tip position of the crack 30 can be controlled with high accuracy, and the cutting accuracy can be improved.

  In addition, as shown in FIG. 6, the laser irradiation part of the reinforcement layers 13 and 15 is heated, and becomes higher temperature than the other part of the reinforcement layers 13 and 15. FIG. Therefore, a compressive stress larger than the residual compressive stress shown in FIGS. 1 to 3 is generated in the laser irradiated portions of the reinforcing layers 13 and 15, and the extension of the crack 30 is suppressed.

  In the present embodiment, not only the reinforcing layers 13 and 15 but also the intermediate layer 17 is heated by the laser light 20, so that the laser light 20 having a high internal transmittance is used. Assuming that the moving distance of the laser light 20 from entering the tempered glass plate 10 to exiting is M, α × M is 3.0 or less (that is, the internal transmittance of the laser light is 5% or more). It is preferable.

  When α × M exceeds 3.0, most of the irradiation energy of the laser light 20 is absorbed as heat in the vicinity of the surface 12 of the tempered glass plate 10, and a steep temperature gradient is generated in the plate thickness direction. The laser irradiation portion of the surface layer 13 becomes significantly higher in temperature than the laser irradiation portion of the intermediate layer 17, and a tensile stress larger than the internal residual tensile stress CT is generated in the laser irradiation portion of the intermediate layer 17. Therefore, the tip position of the crack 30 overtakes the irradiation position of the laser beam 20.

  α × M is more preferably 0.3 or less (laser light internal transmittance of 74% or more), further preferably 0.105 or less (laser light internal transmittance of 90% or more), and particularly preferably 0.02 or less. (Internal transmittance of laser beam is 98% or more).

  When the laser beam 20 is perpendicularly incident on the surface 12 of the tempered glass plate 10, the moving distance M of the laser beam 20 has the same value (M = t) as the plate thickness t of the tempered glass plate 10. On the other hand, when the laser beam 20 is incident obliquely on the surface 12 of the tempered glass plate 10, it is refracted according to Snell's law. Assuming that the refraction angle is γ, the moving distance M of the laser light 20 is approximately obtained by the equation M = t / cos γ.

  The internal residual tensile stress CT is preferably 15 MPa or more so that the extension of the crack 30 is mainly performed by the residual tensile stress of the intermediate layer 17. Thereby, the position where the tensile stress reaches a predetermined value (that is, the tip position of the crack 30) and the irradiation position of the laser beam 20 are sufficiently close, and the cutting accuracy is improved. The internal residual tensile stress CT is more preferably 30 MPa or more, and further preferably 40 MPa. When the internal residual tensile stress CT is 30 MPa or more, the crack 30 extends only by the residual tensile stress of the intermediate layer 17, and the tip position of the crack 30 and the irradiation position of the laser beam 20 become closer, so that the cutting accuracy is improved. Further improve.

  As the light source of the laser light 20, for example, a near infrared (hereinafter simply referred to as “near infrared”) laser having a wavelength of 800 to 1100 nm is used. Examples of the near infrared laser include a Yb fiber laser (wavelength: 1000 to 1100 nm), a Yb disk laser (wavelength: 1000 to 1100 nm), an Nd: YAG laser (wavelength: 1064 nm), and a high-power semiconductor laser (wavelength: 808 to 980 nm). ). These near-infrared lasers are high-powered and inexpensive, and it is easy to adjust α × M within a desired range.

  In the present embodiment, a high-power and inexpensive near-infrared laser is used as the light source of the laser light 20, but any light source having a wavelength of 250 to 5000 nm may be used. For example, UV laser (wavelength: 355 nm), green laser (wavelength: 532 nm), Ho: YAG laser (wavelength: 2080 nm), Er: YAG laser (2940 nm), laser using a mid-infrared light parametric oscillator (wavelength: 2600) ˜3450 nm). The oscillation method of the laser beam 20 is not limited, and either a CW laser that continuously oscillates the laser beam or a pulse laser that oscillates the laser beam intermittently can be used. The intensity distribution of the laser beam 20 is not limited, and may be a Gaussian type or a top hat type.

  In the case of a near-infrared laser near 1000 nm (800 to 1100 nm), the absorption coefficient α increases as the iron (Fe) content, cobalt (Co) content, and copper (Cu) content in the tempered glass plate 10 increase. Becomes larger. In this case, the absorption coefficient α increases in the vicinity of the absorption wavelength of the rare earth atom as the content of the rare earth element (for example, Yb) in the tempered glass plate 10 increases. The adjustment of the absorption coefficient α uses iron from the viewpoint of glass transparency and cost, and cobalt, copper, and rare earth elements may not be substantially contained in the tempered glass plate 10.

The intensity of the laser beam 20 is attenuated according to Lambert-Beer's law. Therefore, the front surface 12 and the back surface 14 of the tempered glass plate 10 have the same or substantially the same laser power density (W / cm ² ), that is, the same or substantially the same temperature. The area of the laser beam 20 may be smaller than the area of the laser beam 20 on the surface 12. If the condensing position of the laser beam 20 is on the side opposite to the light source with respect to the tempered glass plate 10, the area of the laser beam 20 on the back surface 14 is smaller than the area of the laser beam 20 on the front surface 12. If the temperatures of the front surface 12 and the back surface 14 of the tempered glass plate 10 are approximately the same, the cracks 30 extend to the same extent on the front surface 12 and the back surface 14 of the tempered glass plate 10.

  The condensing position of the laser light 20 may be inside the tempered glass plate 10 or may be on the light source side with reference to the tempered glass plate 10 as shown in FIG.

  On the surface 12 of the tempered glass plate 10, the laser beam 20 may be formed in a circle having a diameter φ smaller than the plate thickness t of the tempered glass plate 10. When the diameter φ is equal to or greater than the plate thickness t, the heated portion of the glass plate 10 is too large, and a part of the cut surface (particularly, the cutting start portion and the cutting end portion) may be slightly curved. The diameter φ is, for example, 1 mm or less, preferably 0.5 mm or less.

  In addition, the shape of the laser beam 20 on the surface 12 of the tempered glass plate 10 may be various, and may be, for example, a rectangle or an ellipse.

  Examples of the use of the laminated plate cut out from the tempered glass plate 10 in the cutting step include FPD substrates and cover glasses for vehicle window glasses, architectural window glasses, liquid crystal displays, and cover glass for solar cell panels. It is done.

  FIG. 8 is a diagram illustrating an example of a cut-out position of a laminated plate cut out from a tempered glass plate with a film. In FIG. 8, the part of the laminated board cut out from the tempered glass board with a film | membrane is shown with an oblique line. In FIG. 8, the film is not shown because it is not visible due to the presence of the tempered glass plate.

  In the cutting step, the laminated plate 101 can be cut out from a portion of the tempered glass plate 10 with the film 18 without warping. As a warped portion, the end portion of the tempered glass plate 10 with the film 18 is cut out by a cutting process. Therefore, a laminated board having a desired shape can be obtained.

  Further, in the cutting step, a plurality of laminated plates 101 are cut out from the tempered glass plate 10 with the film 18, so that the laminated plates 101 can be efficiently produced in large quantities. In the case of the air cooling strengthening method, since it is difficult to transport a small glass plate with a transport roll, it is effective to transport a large glass plate with a transport roll and cut it after air cooling strengthening.

  FIG. 9 is a diagram illustrating a protection process according to the first embodiment of the present invention.

  The manufacturing method of a laminated board may further have the process of protecting the cut surface of the laminated board 101 with the resin 19. FIG. Instead of chamfering the cut surface of the laminate 101, the laminate 101 is less likely to break. As the resin 19, for example, a thermoplastic elastomer (for example, polyvinyl chloride) is used.

  The resin 19 may be formed only on the cut surface of the laminated plate 101 as shown in FIG. 9A, or may be formed so as to protrude from the cut surface of the laminated plate 101 as shown in FIG. 9B. Good.

[Second Embodiment]
FIG. 10 is an explanatory diagram of a cutting process according to the second embodiment of the present invention. 10, the same components as those in FIG. 4 are denoted by the same reference numerals, and description thereof is omitted.

  The cutting step of the present embodiment includes a step of locally blowing the gas 40 to the tempered glass plate 10 with the film 18, and the spray position of the gas 40 on the tempered glass plate 10 is interlocked with the irradiation position of the laser beam 20. By moving, the tempered glass plate 10 is cut. As shown in FIG. 10, the irradiation position of the laser beam 20 may exist inside the spray position of the gas 40. Note that the spray position of the gas 40 may be in front of or behind the irradiation position of the laser beam 20. The gas 40 blows off a deposit (for example, dust) on the tempered glass plate 10 to prevent the laser light 20 from being absorbed by the deposit and prevent the surface 12 of the tempered glass plate 10 from being overheated. The gas 40 may be blown to the surface (front surface 12) opposite to the surface (back surface 14) that supports the film 18 of the tempered glass plate 10.

  The gas 40 may be a cooling gas (for example, compressed air at room temperature) that locally cools the tempered glass plate 10. Since a rapid temperature gradient occurs along the moving direction of the irradiation position of the laser beam 20, the distance between the position where the tensile stress reaches a predetermined value (that is, the tip position of the crack 30) and the position of the laser beam 20 is Shorter. Therefore, since the position controllability of the crack 30 is improved, the cutting accuracy can be further improved.

  The nozzle 50 is formed in a cylindrical shape as shown in FIG. 10, for example, and the laser light 20 may pass through the nozzle 50. The central axis 51 of the nozzle 50 and the optical axis 21 of the laser light 20 may be arranged coaxially. The positional relationship between the spray position of the gas 40 and the irradiation position of the laser beam 20 is stabilized.

  The tempered glass plate 10 may move, the nozzle 50 may move, or both may move for the movement of the blowing position of the gas 40 in the tempered glass plate 10.

  As mentioned above, although the 1st-2nd embodiment of the cutting method of a tempered glass board with a film was explained, the present invention is not limited to the above-mentioned embodiment, and is variously changed and replaced in the range indicated in the claims. Is possible.

DESCRIPTION OF SYMBOLS 10 Tempered glass board 12 Front surface 13 Front surface layer 14 Back surface 15 Back surface layer 17 Intermediate layer 18 Film 20 Laser beam 30 Crack 40 Gas 101 Laminate plate

Claims (10)

A method for producing a laminated plate having a tempered glass plate and a film supported by the tempered glass plate,
A coating process for forming a film on a glass plate;
A tempered glass comprising a surface layer and a back layer as a reinforced layer having a residual compressive stress that reinforces the front and back surfaces of the glass plate, and an intermediate layer formed between the surface layer and the back layer and having an internal residual tensile stress A strengthening process to produce a plate;
Irradiate laser light locally on the tempered glass plate with film, move the irradiation position of the laser light on the tempered glass plate with film, and extend cracks that penetrate the tempered glass plate with film in the thickness direction And a cutting step of cutting the laminated plate from the tempered glass plate with the film,
In the cutting step, the intermediate layer is locally heated by the laser light at a temperature below the annealing point, and a tensile stress or a compressive stress smaller than the internal residual tensile stress is locally generated in the intermediate layer. A method for producing a laminated board, wherein a crack extension rate due to the internal residual tensile stress is controlled.   The said cutting process is a manufacturing method of the laminated board of Claim 1 which cuts out a several laminated board from the said tempered glass board with a film | membrane.   The manufacturing method of the laminated board of Claim 1 or 2 which further has the protection process which protects the cut surface of the said laminated board with resin.   The manufacturing method of the laminated board as described in any one of Claims 1-3 whose film formed on the said glass plate is a low reflection film which has a fine uneven structure.   The method for manufacturing a laminated board according to claim 4, wherein the low reflective film contains silica fine particles.   The manufacturing method of the laminated board as described in any one of Claims 1-5 whose wavelength of the said laser beam is 250-5000 nm.   The manufacturing method of the laminated board as described in any one of Claims 1-6 whose internal residual tensile stress of the said intermediate | middle layer is 15 Mpa or more.   The manufacturing method of the laminated board of Claim 7 whose internal residual tensile stress of the said intermediate | middle layer is 30 Mpa or more.   The said cutting process includes the process of spraying gas locally on the said tempered glass board, and moves the spraying position of the gas in the said tempered glass board in conjunction with the irradiation position of the said laser beam. The manufacturing method of the laminated board as described in any one.   The said gas is a manufacturing method of the laminated board of Claim 9 which is the cooling gas which cools the said tempered glass board heated with the said laser beam.

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