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JP2015170428A - Insulating film for tab sealing and electrochemical device - Google Patents

Insulating film for tab sealing and electrochemical device Download PDF

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JP2015170428A
JP2015170428A JP2014043461A JP2014043461A JP2015170428A JP 2015170428 A JP2015170428 A JP 2015170428A JP 2014043461 A JP2014043461 A JP 2014043461A JP 2014043461 A JP2014043461 A JP 2014043461A JP 2015170428 A JP2015170428 A JP 2015170428A
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resin layer
mass
insulating film
tab
melting point
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JP6381234B2 (en
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大介 中嶋
Daisuke Nakajima
大介 中嶋
畑 浩
Hiroshi Hata
浩 畑
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Resonac Packaging Corp
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Showa Denko Packaging Co Ltd
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Priority to JP2014043461A priority Critical patent/JP6381234B2/en
Priority to TW104102592A priority patent/TWI634006B/en
Priority to KR1020150023945A priority patent/KR102285624B1/en
Priority to CN201510090135.6A priority patent/CN104893599B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/183Sealing members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • H01M10/0525Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/116Primary casings; Jackets or wrappings characterised by the material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/116Primary casings; Jackets or wrappings characterised by the material
    • H01M50/124Primary casings; Jackets or wrappings characterised by the material having a layered structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50Current conducting connections for cells or batteries
    • H01M50/531Electrode connections inside a battery casing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Laminated Bodies (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an insulating film for tab sealing, by which a sealing state can be adequately maintained through the insulating film for sealing even when the internal pressure is raised.SOLUTION: An insulating film 1 for tab sealing comprises at least a base resin layer 2 including a resin composition which includes 70-99 mass% of an acid-modified polypropylene and 1-30 mass% of a thermoplastic elastomer. The resin composition has a melting point of 155°C or higher, of which MFR is 10 g per 10 minutes or less.

Description

本発明は、リチウムイオン2次電池、電気二重層キャパシタ等の電気化学デバイスに使用されるタブ封止用絶縁フィルム及び該絶縁フィルムを用いて構成された電気化学デバイスに関する。   The present invention relates to an insulating film for sealing a tab used in an electrochemical device such as a lithium ion secondary battery and an electric double layer capacitor, and an electrochemical device configured using the insulating film.

なお、本明細書において、「MFR」の語は、JIS K7210−1999に準拠して、温度230℃、荷重2.16kgの条件で測定されたMFR(メルトフローレート)を意味する。   In the present specification, the term “MFR” means MFR (melt flow rate) measured under conditions of a temperature of 230 ° C. and a load of 2.16 kg in accordance with JIS K7210-1999.

また、本明細書において、「融点」の語は、JIS K7121−1987「プラスチックの転移温度測定方法」に規定された方法で示差走査熱量計を用いて昇温速度10℃/分で測定された融解ピーク温度(融点)を意味する。   Further, in this specification, the term “melting point” was measured at a rate of temperature increase of 10 ° C./min using a differential scanning calorimeter according to the method defined in JIS K7121-1987 “Method for Measuring Plastic Transition Temperature”. It means melting peak temperature (melting point).

薄型電池として用いられるラミネート型電気化学デバイスは、電極や電解質を含む発電要素が包装用外装フィルム内に収容されるとともに、発電要素に接続されたリード端子の一部が外部に引き出された状態で外装フィルムの周縁部が熱融着(ヒートシール)されることにより、上記の発電要素を封入した構造を備えている。   A laminate type electrochemical device used as a thin battery has a power generation element including an electrode and an electrolyte housed in a packaging outer film, and a part of a lead terminal connected to the power generation element is pulled out to the outside. The outer peripheral film has a structure in which the power generation element is sealed by heat-sealing the peripheral edge of the outer film.

前記電気化学デバイスにおける一対のリード端子は、上記ヒートシール時に外装フィルムにおける内面層を突き破り、中間層の金属箔に接触して短絡してしまう場合がある。   The pair of lead terminals in the electrochemical device may break through the inner surface layer of the exterior film at the time of the heat sealing, and contact with the metal foil of the intermediate layer to cause a short circuit.

そこで、このような短絡防止のために、リード端子における外装フィルムのシール部に対応する位置を、封止用絶縁フィルムによって被覆することが行われている。具体的には、正極リード端子および負極リード端子における前記シール部に対応する部位を、予め絶縁性を有する熱接着性合成樹脂の封止フィルムで被覆しておくことが提案されている(特許文献1〜4参照)。   Therefore, in order to prevent such a short circuit, a position corresponding to the seal portion of the exterior film in the lead terminal is covered with a sealing insulating film. Specifically, it has been proposed that portions corresponding to the seal portions in the positive electrode lead terminal and the negative electrode lead terminal are previously covered with a sealing film made of a heat-adhesive synthetic resin having an insulating property (Patent Literature). 1-4).

特開2008−192451号公報JP 2008-192451 A 特開2003−007265号公報JP 2003-007265 A 特開2010−245000号公報JP 2010-245000 A 特開2009−224218号公報JP 2009-224218 A

ところで、リチウムイオン2次電池等では、過充電時や過昇温時に電池本体部においてガスが発生しやすく、このためにガスが徐々に外装材で覆われた内部空間に蓄積していき外装材内部の内圧が上昇する場合がある。しかるに、上記従来の封止用絶縁フィルムでは、このように内圧が上昇した場合に、リード端子のシール部において必ずしも十分な封止状態を維持できるものではなかった。   By the way, in the case of a lithium ion secondary battery or the like, gas is likely to be generated in the battery body during overcharge or overheating, and for this reason, the gas gradually accumulates in the internal space covered with the exterior material. Internal internal pressure may increase. However, in the conventional sealing insulating film, when the internal pressure is increased as described above, the sealing state of the lead terminal cannot always maintain a sufficient sealing state.

本発明は、かかる技術的背景に鑑みてなされたものであって、内圧が上昇した場合においても封止用絶縁フィルムを介しての封止状態を十分に維持できるタブ封止用絶縁フィルム及び電気化学デバイスを提供することを目的とする。   The present invention has been made in view of such a technical background, and an insulating film for tab sealing and an electric device that can sufficiently maintain a sealing state via the insulating film for sealing even when the internal pressure increases. The object is to provide a chemical device.

前記目的を達成するために、本発明は以下の手段を提供する。   In order to achieve the above object, the present invention provides the following means.

[1]酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる樹脂組成物からなるベース樹脂層を少なくとも含み、
前記樹脂組成物の融点が155℃以上であり、前記樹脂組成物のMFRが10g/10分以下であることを特徴とするタブ封止用絶縁フィルム。
[1] At least a base resin layer made of a resin composition comprising 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer,
An insulating film for tab sealing, wherein the resin composition has a melting point of 155 ° C. or higher, and the MFR of the resin composition is 10 g / 10 min or less.

[2]酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる樹脂組成物からなるベース樹脂層を少なくとも含み、
前記樹脂組成物の融点が155℃以上であり、前記樹脂組成物のMFRが10g/10分以下であることを特徴とするタブ封止用絶縁フィルム。
[2] From a resin composition comprising 70% by mass to 99% by mass of a first resin component made of acid-modified polypropylene and polypropylene not modified with acid, and 1% by mass to 30% by mass of a thermoplastic elastomer. Comprising at least a base resin layer,
An insulating film for tab sealing, wherein the resin composition has a melting point of 155 ° C. or higher, and the MFR of the resin composition is 10 g / 10 min or less.

[3]前記絶縁フィルムは、前記ベース樹脂層における外装材側の面に外側樹脂層が積層されると共に、前記ベース樹脂層におけるタブ側の面に内側樹脂層が積層された構成であり、前記外側樹脂層が、酸変性ポリプロピレン又は/及び酸で変性されていないポリプロピレンを含有し、前記内側樹脂層が酸変性ポリプロピレンを含有する前項1または2に記載のタブ封止用絶縁フィルム。   [3] The insulating film has a configuration in which an outer resin layer is laminated on a surface of the base resin layer on an exterior material side, and an inner resin layer is laminated on a tab side surface of the base resin layer, The insulating film for tab sealing according to the preceding item 1 or 2, wherein the outer resin layer contains acid-modified polypropylene or / and polypropylene not modified with acid, and the inner resin layer contains acid-modified polypropylene.

[4]前記外側樹脂層の融点が130℃〜140℃であり、前記内側樹脂層の融点が130℃〜140℃であり、
前記ベース樹脂層の融点は、前記外側樹脂層の融点より25℃以上高く、かつ前記内側樹脂層の融点より25℃以上高い前項3に記載のタブ封止用絶縁フィルム。
[4] The melting point of the outer resin layer is 130 ° C to 140 ° C, the melting point of the inner resin layer is 130 ° C to 140 ° C,
4. The tab sealing insulating film according to item 3, wherein the melting point of the base resin layer is 25 ° C. or more higher than the melting point of the outer resin layer and 25 ° C. or more higher than the melting point of the inner resin layer.

[5]前記ベース樹脂層の融点は、前記外側樹脂層の融点より25℃〜45℃高く、かつ前記内側樹脂層の融点より25℃〜45℃高い前項4に記載のタブ封止用絶縁フィルム。   [5] The insulating film for tab sealing according to item 4, wherein the melting point of the base resin layer is 25 ° C. to 45 ° C. higher than the melting point of the outer resin layer and 25 ° C. to 45 ° C. higher than the melting point of the inner resin layer. .

[6]前記絶縁フィルムは、前記ベース樹脂層における外装材側の面に外側樹脂層が積層されるとともに、前記ベース樹脂層におけるタブ側の面に内側樹脂層が積層された構成であり、
前記外側樹脂層が、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなり、
前記内側樹脂層が、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなる前項1または2に記載のタブ封止用絶縁フィルム。
[6] The insulating film has a configuration in which an outer resin layer is laminated on a surface of the base resin layer on an exterior material side and an inner resin layer is laminated on a tab side surface of the base resin layer,
The outer resin layer comprises a resin composition having a melting point of less than 155 ° C., comprising 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer,
The preceding item 1 or 2 wherein the inner resin layer comprises a resin composition having a melting point of less than 155 ° C., comprising 70% to 99% by mass of acid-modified polypropylene and 1% to 30% by mass of a thermoplastic elastomer. 2. Insulating film for sealing tabs.

[7]前記絶縁フィルムは、前記ベース樹脂層における外装材側の面に外側樹脂層が積層されるとともに、前記ベース樹脂層におけるタブ側の面に内側樹脂層が積層された構成であり、
前記外側樹脂層が、酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなり、
前記内側樹脂層が、酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなる前項1または2に記載のタブ封止用絶縁フィルム。
[7] The insulating film has a configuration in which an outer resin layer is laminated on a surface on the exterior material side of the base resin layer, and an inner resin layer is laminated on a tab side surface of the base resin layer,
Melting | fusing point formed by the said outer side resin layer containing 70 mass%-99 mass% of 1st resin components which consist of acid-modified polypropylene and the polypropylene which is not modified | denatured with acid, and 1 mass%-30 mass% of thermoplastic elastomers. Consists of a resin composition of less than 155 ° C,
Melting | fusing point formed by the said inner side resin layer containing 70 mass%-99 mass% of 1st resin components which consist of acid-modified polypropylene and the polypropylene which is not modified | denatured with an acid, and thermoplastic elastomer 1 mass%-30 mass%. The insulating film for tab sealing according to 1 or 2 above, comprising a resin composition having a temperature of less than 155 ° C.

[8]前記熱可塑性エラストマーの融点が80℃以下であり、前記熱可塑性エラストマーのMFRが5g/10分以下である前項1〜7のいずれか1項に記載のタブ封止用絶縁フィルム。   [8] The insulating film for tab sealing according to any one of items 1 to 7, wherein the thermoplastic elastomer has a melting point of 80 ° C. or lower and the thermoplastic elastomer has an MFR of 5 g / 10 min or less.

[9]前記熱可塑性エラストマーが、エチレン−プロピレンラバー及びエチレン−プロピレン−ブテンラバーからなる群より選ばれる1種または2種の樹脂である前項1〜8のいずれか1項に記載のタブ封止用絶縁フィルム。   [9] The tab sealing according to any one of items 1 to 8, wherein the thermoplastic elastomer is one or two resins selected from the group consisting of ethylene-propylene rubber and ethylene-propylene-butene rubber. Insulating film.

[10]前項1〜9のいずれか1項に記載のタブ封止用絶縁フィルムを含むことを特徴とする電気化学デバイス。   [10] An electrochemical device comprising the tab sealing insulating film described in any one of 1 to 9 above.

[11]外装材と、
前記外装材に収容される電気化学素子と、
内端部が前記電気化学素子に電気的に接続されると共に、外端部が前記外装材の外部に配置されるタブと、を備え、
前記外装材のシール部によって前記タブの両面を前項1〜9のいずれか1項に記載のタブ封止用絶縁フィルムを介して挟み込んだ状態で、前記外装材のシール部が前記タブの両面に接合されていることを特徴とする電気化学デバイス。
[11] an exterior material;
An electrochemical element housed in the exterior material;
An inner end portion is electrically connected to the electrochemical element, and an outer end portion is disposed outside the exterior material, and a tab,
The both sides of the tab are sandwiched between the tab sealing insulating films according to any one of the preceding items 1 to 9 by the seal portion of the exterior material, and the seal portion of the exterior material is placed on both sides of the tab. An electrochemical device characterized by being bonded.

[1]の発明では、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる樹脂組成物からなるベース樹脂層を少なくとも含む構成であり、ベース樹脂層が、上記特定範囲の含有率で酸変性ポリプロピレンを含有することで接着力(金属タブに対する接着力及び外装材に対する接着力)を確保できると共に、上記特定範囲の含有率で熱可塑性エラストマーを含有することで、内圧の上昇等によりタブ封止用絶縁フィルムに力が加わったときに熱可塑性エラストマー成分に応力が集中した場合でもベース樹脂層内部での凝集破壊の発生を防止できて、タブ封止用絶縁フィルムを介した良好な封止状態を十分に維持できる。   In the invention of [1], at least a base resin layer comprising a resin composition comprising 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer is included. The base resin layer contains acid-modified polypropylene at a content within the above specified range, thereby ensuring adhesive strength (adhesive strength with respect to the metal tab and exterior material) and thermoplasticity at the above specified range. By containing an elastomer, it is possible to prevent the occurrence of cohesive failure inside the base resin layer even when stress is concentrated on the thermoplastic elastomer component when force is applied to the tab sealing insulating film due to an increase in internal pressure, etc. The good sealing state through the tab sealing insulating film can be sufficiently maintained.

また、ベース樹脂層の融点が155℃以上であるので、該ベース樹脂層がシール接合時に潰れ難く、これにより、十分な絶縁性を確保できる。更に、樹脂組成物のMFRが10g/10分以下であるから、ベース樹脂層がシール接合時に潰れ難く、より十分な絶縁性を確保できる利点がある。   Further, since the melting point of the base resin layer is 155 ° C. or higher, the base resin layer is not easily crushed at the time of seal bonding, thereby ensuring sufficient insulation. Furthermore, since the MFR of the resin composition is 10 g / 10 min or less, the base resin layer is not easily crushed at the time of seal bonding, and there is an advantage that more sufficient insulation can be secured.

[2]の発明では、酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる樹脂組成物からなるベース樹脂層を少なくとも含む構成であり、ベース樹脂層が、上記特定範囲の含有率で第1樹脂成分を含有することで接着力(金属タブに対する接着力及び外装材に対する接着力)を確保できると共に、上記特定範囲の含有率で熱可塑性エラストマーを含有することで、内圧の上昇等によりタブ封止用絶縁フィルムに力が加わったときに熱可塑性エラストマー成分に応力が集中した場合でもベース樹脂層内部での凝集破壊の発生を防止できて、タブ封止用絶縁フィルムを介した良好な封止状態を十分に維持できる。   In invention of [2], it contains 70 mass%-99 mass% of 1st resin components which consist of acid-modified polypropylene and polypropylene which is not modified with acid, and thermoplastic elastomer 1 mass%-30 mass%. It is the structure containing at least the base resin layer which consists of a resin composition, and an adhesive force (adhesive strength with respect to a metal tab, and adhesive strength with respect to an exterior material) is included because a base resin layer contains a 1st resin component with the content rate of the said specific range. ) Can be secured, and when the thermoplastic elastomer is contained in the specified range, the stress is concentrated on the thermoplastic elastomer component when a force is applied to the tab sealing insulating film due to an increase in internal pressure or the like. However, the occurrence of cohesive failure within the base resin layer can be prevented, and a good sealing state via the tab sealing insulating film can be sufficiently maintained.

また、ベース樹脂層の融点が155℃以上であるので、該ベース樹脂層がシール接合時に潰れ難く、これにより十分な絶縁性を確保できる。更に、樹脂組成物のMFRが10g/10分以下であるから、ベース樹脂層がシール接合時に潰れ難く、より十分な絶縁性を確保できる利点がある。   Further, since the melting point of the base resin layer is 155 ° C. or higher, the base resin layer is not easily crushed at the time of seal bonding, thereby ensuring sufficient insulation. Furthermore, since the MFR of the resin composition is 10 g / 10 min or less, the base resin layer is not easily crushed at the time of seal bonding, and there is an advantage that more sufficient insulation can be secured.

[3]の発明では、ベース樹脂層の外装材側の面に積層された外側樹脂層が、酸変性ポリプロピレン又は/及び酸で変性されていないポリプロピレンを含有する構成であるから、該外側樹脂層が外装材に対して低温にて十分にシール接合することができるし、ベース樹脂層のタブ側の面に積層された内側樹脂層が、酸変性ポリプロピレンを含有する構成であるから、該内側樹脂層が金属タブに対して十分に熱接着できる。本構成では、中間層のベース樹脂層が、融点が155℃以上であるので、該ベース樹脂層がシール接合時に潰れ難く、これにより十分な絶縁性を確保できる。   In the invention of [3], since the outer resin layer laminated on the surface of the base resin layer on the exterior material side contains acid-modified polypropylene and / or polypropylene not modified with acid, the outer resin layer Can be sufficiently sealed and bonded to the exterior material at a low temperature, and the inner resin layer laminated on the tab side surface of the base resin layer has a structure containing acid-modified polypropylene. The layer can be sufficiently thermally bonded to the metal tab. In this configuration, since the base resin layer of the intermediate layer has a melting point of 155 ° C. or higher, the base resin layer is not easily crushed at the time of seal bonding, thereby ensuring sufficient insulation.

[4]の発明では、外側樹脂層の融点が130℃〜140℃であり、内側樹脂層の融点が130℃〜140℃であり、ベース樹脂層の融点は、外側樹脂層の融点より25℃以上高く、かつ内側樹脂層の融点より25℃以上高いので、十分なシール接合強度を確保できると共に、十分な絶縁性を確保できる(十分なシール性と十分な絶縁性の確保を両立できる)。   In the invention of [4], the melting point of the outer resin layer is 130 ° C to 140 ° C, the melting point of the inner resin layer is 130 ° C to 140 ° C, and the melting point of the base resin layer is 25 ° C higher than the melting point of the outer resin layer. Since it is higher than the above and 25 ° C. higher than the melting point of the inner resin layer, it is possible to ensure sufficient seal bonding strength and sufficient insulation (both sufficient sealability and sufficient insulation can be ensured).

[5]の発明では、ベース樹脂層の融点は、外側樹脂層の融点より25℃〜45℃高く、かつ内側樹脂層の融点より25℃〜45℃高い構成であり、両者の融点差が45℃以下であるので、より十分なシール性(封止性)及びより十分な絶縁性を確保できる利点がある。   In the invention of [5], the melting point of the base resin layer is 25 ° C. to 45 ° C. higher than the melting point of the outer resin layer and 25 ° C. to 45 ° C. higher than the melting point of the inner resin layer. Since it is below ℃, there is an advantage that more sufficient sealing performance (sealing performance) and more sufficient insulation can be secured.

[6]と[7]の発明では、ベース樹脂層の外装材側の面に積層された外側樹脂層が、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなる組成であるので、該外側樹脂層が外装材に対して十分にシール接合することができるし、ベース樹脂層のタブ側の面に積層された内側樹脂層が、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなる組成であるので、該内側樹脂層が金属タブに対して十分に熱接着できる。更に、ベース樹脂層、外側樹脂層及び内側樹脂層の全てが熱可塑性エラストマーを1質量%〜30質量%含有するので、タブ封止用絶縁フィルム全体に柔軟性が付与されて、折り曲げた時の白化を低減することができる。   In the inventions [6] and [7], the outer resin layer laminated on the surface of the base resin layer on the exterior material side is 70% to 99% by mass of acid-modified polypropylene and 1% to 30% by mass of a thermoplastic elastomer. %, And the melting point of the resin composition is less than 155 ° C., the outer resin layer can be sufficiently sealed and bonded to the exterior material, and the tab side of the base resin layer From the resin composition having a melting point of less than 155 ° C., wherein the inner resin layer laminated on the surface of the resin comprises 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer. Therefore, the inner resin layer can be sufficiently thermally bonded to the metal tab. Furthermore, since all of the base resin layer, the outer resin layer, and the inner resin layer contain 1% by mass to 30% by mass of the thermoplastic elastomer, the entire insulating film for tab sealing is given flexibility and is bent. Whitening can be reduced.

[8]の発明では、熱可塑性エラストマーの融点が80℃以下であるから、金属タブに対する接着力をさらに向上させることができる。また、熱可塑性エラストマーのMFRが5g/10分以下であるから、ベース樹脂層において酸変性ポリプロピレン(又は第1樹脂成分)中で熱可塑性エラストマーが約0.3μm〜約15μmの大きさの独立した球状分散相を形成するものとなって、非相溶の樹脂組成においても十分なシール強度を確保できる利点がある。   In the invention of [8], since the melting point of the thermoplastic elastomer is 80 ° C. or less, the adhesive force to the metal tab can be further improved. Further, since the MFR of the thermoplastic elastomer is 5 g / 10 min or less, the thermoplastic elastomer in the acid-modified polypropylene (or the first resin component) in the base resin layer has an independent size of about 0.3 μm to about 15 μm. The spherical dispersed phase is formed, and there is an advantage that sufficient sealing strength can be secured even in an incompatible resin composition.

[9]の発明では、熱可塑性エラストマーが、エチレン−プロピレンラバー及びエチレン−プロピレン−ブテンラバーからなる群より選ばれる1種または2種の樹脂であるから、内圧の上昇等によりタブ封止用絶縁フィルムに力が加わっても、熱可塑性エラストマー成分により応力を十分に吸収することができて、ベース樹脂層内部での凝集破壊の発生を防止することができ、これによりタブ封止用絶縁フィルムを介した良好な封止状態をより十分に維持できる。   In the invention of [9], since the thermoplastic elastomer is one or two resins selected from the group consisting of ethylene-propylene rubber and ethylene-propylene-butene rubber, an insulating film for tab sealing due to an increase in internal pressure or the like Even if a force is applied to the resin, the thermoplastic elastomer component can sufficiently absorb the stress and prevent the occurrence of cohesive failure inside the base resin layer. The satisfactory sealed state can be maintained more sufficiently.

[10]及び[11]の発明(電気化学デバイス)では、内圧の上昇等によりタブ封止用絶縁フィルムに力が加わったときに熱可塑性エラストマー成分に応力が集中した場合でもベース樹脂層内部での凝集破壊の発生を防止できて、タブ封止用絶縁フィルムを介した良好な封止状態を十分に維持できる。また、タブ封止用絶縁フィルムのベース樹脂層の融点が155℃以上であるので、該ベース樹脂層がシール接合時に潰れ難く、これにより、十分な絶縁性を確保できる。更に、タブ封止用絶縁フィルムのベース樹脂層のMFRが10g/10分以下であるから、ベース樹脂層がシール接合時に潰れ難く、より十分な絶縁性を確保できる利点がある。   In the inventions [10] and [11] (electrochemical devices), even when stress is concentrated on the thermoplastic elastomer component when a force is applied to the tab sealing insulating film due to an increase in internal pressure or the like, The occurrence of cohesive failure can be prevented, and a good sealing state via the tab sealing insulating film can be sufficiently maintained. In addition, since the melting point of the base resin layer of the tab sealing insulating film is 155 ° C. or higher, the base resin layer is not easily crushed during seal bonding, thereby ensuring sufficient insulation. Further, since the MFR of the base resin layer of the tab sealing insulating film is 10 g / 10 min or less, the base resin layer is not easily crushed at the time of seal bonding, and there is an advantage that more sufficient insulation can be secured.

本発明に係るタブ封止用絶縁フィルムの一実施形態を示す断面図である。It is sectional drawing which shows one Embodiment of the insulating film for tab sealing which concerns on this invention. 袋状に加工された外装材の中に電気化学素子を収容した状態を示す斜視図である。It is a perspective view which shows the state which accommodated the electrochemical element in the exterior material processed into the bag shape. 本発明に係るタブ封止用絶縁フィルムを用いて構成された電気化学デバイスの一実施形態を示す断面図(シール部での断面図)である。It is sectional drawing (sectional drawing in a seal part) which shows one Embodiment of the electrochemical device comprised using the insulating film for tab sealing which concerns on this invention. 実施例1で得られたタブ封止用絶縁フィルムのシール強度測定におけるS−Dカーブを示すグラフである。3 is a graph showing an SD curve in the measurement of the sealing strength of the tab sealing insulating film obtained in Example 1. FIG. 比較例1で得られたタブ封止用絶縁フィルムのシール強度測定におけるS−Dカーブを示すグラフである。It is a graph which shows the SD curve in the sealing strength measurement of the insulating film for tab sealing obtained in the comparative example 1.

本発明に係るタブ封止用絶縁フィルム1は、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる樹脂組成物からなるベース樹脂層2を少なくとも含み、前記樹脂組成物の融点が155℃以上であり、前記樹脂組成物のMFRが10g/10分以下であることを特徴とするものである。   The insulating film 1 for tab sealing according to the present invention is a base resin layer made of a resin composition containing 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer. 2, the melting point of the resin composition is 155 ° C. or more, and the MFR of the resin composition is 10 g / 10 min or less.

また、本発明に係るタブ封止用絶縁フィルム1は、酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる樹脂組成物からなるベース樹脂層を少なくとも含み、前記樹脂組成物の融点が155℃以上であり、前記樹脂組成物のMFRが10g/10分以下であることを特徴とするものである。   Moreover, the insulating film 1 for tab sealing which concerns on this invention is 70 mass%-99 mass% of 1st resin components which consist of acid-modified polypropylene and the polypropylene which is not modified | denatured with acid, and 1 mass%-30 mass of thermoplastic elastomers. %, And the resin composition has a melting point of 155 ° C. or higher, and the MFR of the resin composition is 10 g / 10 min or less. It is what.

本発明では、ベース樹脂層2が、酸変性ポリプロピレンを70質量%〜99質量%含有する構成、又は酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分を70質量%〜99質量%含有する構成であるので、接着力(金属タブに対する接着力及び外装材に対する接着力)を確保できると共に、熱可塑性エラストマーを1質量%〜30質量%含有する構成であるので、内圧の上昇等によりタブ封止用絶縁フィルムに力が加わったときに、酸変性ポリプロピレン中に、又は第1樹脂成分中に分散した熱可塑性エラストマー成分に応力が集中した場合でもベース樹脂層2内部での凝集破壊の発生を防止できて、タブ封止用絶縁フィルム1を介した良好な封止状態を十分に維持できる。   In the present invention, the base resin layer 2 contains 70% by mass to 99% by mass of the first resin component containing 70% by mass to 99% by mass of acid-modified polypropylene, or acid-modified polypropylene and polypropylene not modified with acid. Since the composition contains 1% by mass to 30% by mass, the adhesive strength (adhesive strength to the metal tab and the adhesive strength to the exterior material) can be ensured, and the thermoplastic elastomer is contained in an amount of 1 to 30% by mass. When force is applied to the tab sealing insulating film by the above, even if stress is concentrated in the acid-modified polypropylene or the thermoplastic elastomer component dispersed in the first resin component, the cohesive failure in the base resin layer 2 is caused. Generation | occurrence | production can be prevented and the favorable sealing state through the insulating film 1 for tab sealing can fully be maintained.

また、本発明では、通常は、熱可塑性エラストマーが酸変性ポリプロピレン中で相分離構造を形成しており、又は熱可塑性エラストマーが前記第1樹脂成分中で相分離構造を形成しており、前記分散した熱可塑性エラストマー成分に応力が集中した際に、該応力が前記相分離構造の熱可塑性エラストマー相を順に伝播することを極力抑えることができることにより、ベース樹脂層2内部での凝集破壊の発生をより十分に防止できて、安定した封止強度を備えた封止用絶縁フィルム1を提供できる。   In the present invention, usually, the thermoplastic elastomer forms a phase separation structure in the acid-modified polypropylene, or the thermoplastic elastomer forms a phase separation structure in the first resin component, and the dispersion When stress is concentrated on the thermoplastic elastomer component, it is possible to prevent the stress from sequentially propagating through the thermoplastic elastomer phase of the phase separation structure as much as possible, thereby preventing the occurrence of cohesive failure inside the base resin layer 2. The insulating film 1 for sealing which can prevent more fully and has the stable sealing strength can be provided.

なお、前記相分離構造において熱可塑性エラストマー相が略板状に相分離しているものが存在し、このような近接した略板状の熱可塑性エラストマー相間で応力が順に伝播することを抑えることができることにより、凝集破壊の発生を防止できるものと推定される。前記略板状の熱可塑性エラストマー相は、封止用絶縁フィルム1の表面に略平行状に拡がっているものと考えられる。   In the phase separation structure, there are those in which the thermoplastic elastomer phase is phase-separated in a substantially plate shape, and it is possible to suppress the propagation of stress in order between the adjacent substantially plate-like thermoplastic elastomer phases. It is estimated that the occurrence of cohesive failure can be prevented. The substantially plate-like thermoplastic elastomer phase is considered to be spread substantially parallel to the surface of the sealing insulating film 1.

また、前記樹脂組成物(ベース樹脂層2)の融点が155℃以上であるので、該ベース樹脂層2がシール接合時に潰れ難く、これにより十分な絶縁性を確保できる。なお、前記樹脂組成物(ベース樹脂層2)の融点は、155℃〜175℃の範囲であるのが好ましい。   In addition, since the melting point of the resin composition (base resin layer 2) is 155 ° C. or higher, the base resin layer 2 is not easily crushed at the time of seal bonding, thereby ensuring sufficient insulation. The melting point of the resin composition (base resin layer 2) is preferably in the range of 155 ° C to 175 ° C.

更に、前記樹脂組成物(ベース樹脂層2)のMFRが10g/10分以下であるから、ベース樹脂層2がシール接合時に潰れ難く、より十分な絶縁性を確保できる。なお、前記前記樹脂組成物(ベース樹脂層2)のMFRは、0.2g/10分〜10g/10分の範囲であるのが好ましい。0.2g/10分以上であることで、シール性を向上できる。中でも、前記樹脂組成物(ベース樹脂層2)のMFRは、0.5g/10分〜7g/10分の範囲であるのが特に好ましい。   Furthermore, since the MFR of the resin composition (base resin layer 2) is 10 g / 10 min or less, the base resin layer 2 is not easily crushed during seal bonding, and sufficient insulation can be secured. The MFR of the resin composition (base resin layer 2) is preferably in the range of 0.2 g / 10 min to 10 g / 10 min. The sealing property can be improved by being 0.2 g / 10 min or more. Especially, it is especially preferable that MFR of the said resin composition (base resin layer 2) is the range of 0.5g / 10min-7g / 10min.

前記ベース樹脂層における熱可塑性エラストマーの含有率が30質量%を超えると、内圧の上昇等によりタブ封止用絶縁フィルムに力が加わったときに、該タブ封止用絶縁フィルムを介した良好な封止状態を確保することができない。また、前記ベース樹脂層における熱可塑性エラストマーの含有率が1質量%未満では、熱可塑性エラストマー成分による効果が十分に得られないので、内圧の上昇等によりタブ封止用絶縁フィルムに力が加わったときに、タブ金属との密着性が低くなり、該タブ封止用絶縁フィルムを介した良好な封止状態を確保することができない。前記ベース樹脂層2における熱可塑性エラストマーの含有率は、5質量%〜25質量%の範囲であるのが好ましい。   When the content of the thermoplastic elastomer in the base resin layer exceeds 30% by mass, when a force is applied to the tab sealing insulating film due to an increase in internal pressure or the like, a good condition is obtained via the tab sealing insulating film. The sealed state cannot be ensured. In addition, when the content of the thermoplastic elastomer in the base resin layer is less than 1% by mass, the effect of the thermoplastic elastomer component cannot be sufficiently obtained, so that force is applied to the tab sealing insulating film due to an increase in internal pressure or the like. Sometimes, adhesiveness with a tab metal becomes low, and a favorable sealing state via the insulating film for tab sealing cannot be secured. The content of the thermoplastic elastomer in the base resin layer 2 is preferably in the range of 5% by mass to 25% by mass.

本発明に係るタブ封止用絶縁フィルム1は、上記特定構成のベース樹脂層2を少なくとも含む構成であり、前記特定構成のベース樹脂層2のみからなる構成(ベース樹脂層2の単層)であってもよいし、前記特定構成のベース樹脂層2の少なくともいずれか一方の面に樹脂層が積層された積層構成であってもよい。   The tab sealing insulating film 1 according to the present invention has a configuration including at least the base resin layer 2 having the specific configuration described above, and includes only the base resin layer 2 having the specific configuration (a single layer of the base resin layer 2). There may be a laminated structure in which a resin layer is laminated on at least one surface of the base resin layer 2 having the specific structure.

後者の積層構成としては、図1、3に示すように、前記ベース樹脂層2における外装材23側の面に外側樹脂層3が積層されると共に、前記ベース樹脂層2におけるタブ21(22)側の面に内側樹脂層4が積層された構成であって、前記外側樹脂層3が、「酸変性ポリプロピレン」又は/及び「酸で変性されていないポリプロピレン」を含有し、前記内側樹脂層4が酸変性ポリプロピレンを含有する構成を採用するのが好ましい。   As the latter laminated structure, as shown in FIGS. 1 and 3, the outer resin layer 3 is laminated on the surface of the base resin layer 2 on the exterior material 23 side, and the tab 21 (22) in the base resin layer 2 is laminated. The inner resin layer 4 is laminated on the side surface, and the outer resin layer 3 contains “acid-modified polypropylene” and / or “polypropylene not modified with acid”, and the inner resin layer 4 It is preferable to adopt a configuration containing acid-modified polypropylene.

上記構成において、外側樹脂層の融点が130℃〜140℃であり、内側樹脂層の融点が130℃〜140℃であり、ベース樹脂層2の融点が、外側樹脂層3の融点より25℃以上高く、かつ内側樹脂層4の融点より25℃以上高い構成である場合には、十分なシール接合強度を確保できると共に、十分な絶縁性を確保できる(即ち十分なシール性と十分な絶縁性の確保を両立できる)。   In the above configuration, the melting point of the outer resin layer is 130 ° C. to 140 ° C., the melting point of the inner resin layer is 130 ° C. to 140 ° C., and the melting point of the base resin layer 2 is 25 ° C. or more than the melting point of the outer resin layer 3. When the structure is high and 25 ° C. or more higher than the melting point of the inner resin layer 4, sufficient seal bonding strength can be secured and sufficient insulation can be secured (that is, sufficient sealability and sufficient insulation). Can ensure both).

更に、ベース樹脂層2の融点は、外側樹脂層3の融点より25℃〜45℃高く、かつ内側樹脂層4の融点より25℃〜45℃高い構成であるのが好ましく、両者の融点差が45℃以下であることにより、より十分なシール性(封止性)及びより十分な絶縁性を確保できる。   Further, the melting point of the base resin layer 2 is preferably 25 ° C. to 45 ° C. higher than the melting point of the outer resin layer 3 and 25 ° C. to 45 ° C. higher than the melting point of the inner resin layer 4. By being 45 degrees C or less, more sufficient sealing performance (sealing property) and more sufficient insulation can be ensured.

或いは、前記積層構成としては、次のような構成を採用してもよい。即ち、図1、3に示すように、前記ベース樹脂層2における外装材23側の面に外側樹脂層3が積層されるとともに、前記ベース樹脂層2におけるタブ21(22)側の面に内側樹脂層4が積層された構成であって、前記外側樹脂層3が、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなり、前記内側樹脂層4が、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなる構成であっても良い。   Alternatively, the following configuration may be adopted as the stacked configuration. That is, as shown in FIGS. 1 and 3, the outer resin layer 3 is laminated on the surface of the base resin layer 2 on the exterior material 23 side, and the inner surface of the base resin layer 2 on the tab 21 (22) side surface. The resin layer 4 is laminated, and the outer resin layer 3 has a melting point formed by containing 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer. It consists of a resin composition of less than 155 ° C., and the inner resin layer 4 contains 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer, and has a melting point of 155 ° C. The structure which consists of less resin compositions may be sufficient.

或いはまた、図1、3に示すように、前記ベース樹脂層2における外装材23側の面に外側樹脂層3が積層されるとともに、前記ベース樹脂層2におけるタブ21(22)側の面に内側樹脂層4が積層された構成であって、前記外側樹脂層3が、「酸変性ポリプロピレン」および「酸で変性されていないポリプロピレン」からなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなり、前記内側樹脂層4が、「酸変性ポリプロピレン」および「酸で変性されていないポリプロピレン」からなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなる構成であっても良い。   Alternatively, as shown in FIGS. 1 and 3, the outer resin layer 3 is laminated on the surface of the base resin layer 2 on the exterior material 23 side, and on the surface of the base resin layer 2 on the tab 21 (22) side. The inner resin layer 4 is laminated, and the outer resin layer 3 is composed of 70% by mass to 99% by mass of a first resin component composed of “acid-modified polypropylene” and “polypropylene not modified with acid”, A thermoplastic elastomer containing 1% by mass to 30% by mass, and a resin composition having a melting point of less than 155 ° C., wherein the inner resin layer 4 is “acid-modified polypropylene” and “polypropylene not modified with acid” And a resin composition having a melting point of less than 155 ° C., comprising 70% by mass to 99% by mass of the first resin component and 1% by mass to 30% by mass of the thermoplastic elastomer. It may be.

本発明において、前記酸変性ポリプロピレンとしては、特に限定されるものではないが、例えば、カルボン酸変性ポリプロピレン等が挙げられる。前記カルボン酸変性ポリプロピレンとしては、特に限定されるものではないが、例えば、マレイン酸変性ポリプロピレン、無水マレイン酸変性ポリプロピレン、無水イタコン酸変性ポリプロピレン、イタコン酸変性ポリプロピレン、アクリル酸変性ポリプロピレン、メタアクリル酸変性ポリプロピレン、フマル酸変性ポリプロピレン、シトラコン酸変性ポリプロピレン等が挙げられる。中でも、前記酸変性ポリプロピレンとしては、マレイン酸変性ポリプロピレン、無水マレイン酸変性ポリプロピレン及びアクリル酸変性ポリプロピレンからなる群より選ばれる少なくとも1種の酸変性ポリプロピレンを用いるのが好ましい。   In the present invention, the acid-modified polypropylene is not particularly limited, and examples thereof include carboxylic acid-modified polypropylene. The carboxylic acid-modified polypropylene is not particularly limited. For example, maleic acid-modified polypropylene, maleic anhydride-modified polypropylene, itaconic anhydride-modified polypropylene, itaconic acid-modified polypropylene, acrylic acid-modified polypropylene, methacrylic acid-modified Examples thereof include polypropylene, fumaric acid-modified polypropylene, and citraconic acid-modified polypropylene. Among these, as the acid-modified polypropylene, it is preferable to use at least one acid-modified polypropylene selected from the group consisting of maleic acid-modified polypropylene, maleic anhydride-modified polypropylene, and acrylic acid-modified polypropylene.

前記熱可塑性エラストマーとしては、特に限定されるものではないが、例えば、オレフィン系熱可塑性エラストマー、スチレン系エラストマー、水添スチレン系エラストマー等が挙げられる。   Although it does not specifically limit as said thermoplastic elastomer, For example, an olefin type thermoplastic elastomer, a styrene-type elastomer, a hydrogenated styrene-type elastomer etc. are mentioned.

前記オレフィン系熱可塑性エラストマーとしては、特に限定されるものではないが、例えば、エチレン−α−オレフィン共重合体等が挙げられる。前記α−オレフィンとしては、例えば、プロピレン、1−ブテン、1−ヘキサン等が挙げられる。   Although it does not specifically limit as said olefin type thermoplastic elastomer, For example, an ethylene-alpha-olefin copolymer etc. are mentioned. Examples of the α-olefin include propylene, 1-butene, 1-hexane and the like.

前記スチレン系エラストマー、水添スチレン系エラストマーとしては、特に限定されるものではないが、例えば、スチレン−エチレン・ブチレン−スチレン共重合体、スチレン−エチレン・プロピレン−スチレン共重合体、スチレン−エチレン・ブチレン−スチレン水添共重合体、スチレン−エチレン・プロピレン−スチレン水添共重合体などが挙げられる。   The styrene-based elastomer and hydrogenated styrene-based elastomer are not particularly limited. For example, styrene-ethylene / butylene-styrene copolymer, styrene-ethylene / propylene-styrene copolymer, styrene-ethylene / Examples include butylene-styrene hydrogenated copolymer and styrene-ethylene / propylene-styrene hydrogenated copolymer.

中でも、前記熱可塑性エラストマーとしては、エチレン−プロピレンラバー(EPR)及びエチレン−プロピレン−ブテンラバー(EPBR)からなる群より選ばれる1種または2種の熱可塑性エラストマーを用いるのが好ましい。前記EPBRとしては、例えば、エチレン−プロピレン−1−ブテンラバーを例示できる。   Among them, it is preferable to use one or two thermoplastic elastomers selected from the group consisting of ethylene-propylene rubber (EPR) and ethylene-propylene-butene rubber (EPBR) as the thermoplastic elastomer. Examples of the EPBR include ethylene-propylene-1-butene rubber.

前記熱可塑性エラストマーの融点は80℃以下であるのが好ましい。融点が80℃以下である熱可塑性エラストマーを用いることにより、熱シール接合時にタブ表面との密着性を十分に確保できるという利点がある。   The thermoplastic elastomer preferably has a melting point of 80 ° C. or lower. By using a thermoplastic elastomer having a melting point of 80 ° C. or less, there is an advantage that sufficient adhesion with the surface of the tab can be ensured during heat seal bonding.

また、前記熱可塑性エラストマーのMFRは5g/10分以下であるのが好ましい。MFRが5g/10分以下である熱可塑性エラストマーを用いることにより、ベース樹脂層2において酸変性ポリプロピレン(又は第1樹脂成分)中で熱可塑性エラストマーが約0.3μm〜約15μmの大きさの独立した球状分散相を形成するものとなって、非相溶の樹脂組成においても十分なシール強度を確保できる利点がある。   The thermoplastic elastomer preferably has an MFR of 5 g / 10 min or less. By using a thermoplastic elastomer having an MFR of 5 g / 10 min or less, the base elastomer layer 2 has an independent amount of about 0.3 μm to about 15 μm in the thermoplastic elastomer in the acid-modified polypropylene (or the first resin component). Thus, there is an advantage that sufficient sealing strength can be secured even in an incompatible resin composition.

前記「酸で変性されていないポリプロピレン」としては、特に限定されるものではないが、ホモポリプロピレン及びランダムポリプロピレン(エチレン−プロピレンランダム共重合体)からなる群より選ばれる1種または2種の樹脂を用いるのが好ましい。前記エチレン−プロピレンランダム共重合体におけるプロピレン含有率は85質量%〜99質量%の範囲であるのが好ましい。   The “polypropylene not modified with acid” is not particularly limited, but one or two resins selected from the group consisting of homopolypropylene and random polypropylene (ethylene-propylene random copolymer) are used. It is preferable to use it. The propylene content in the ethylene-propylene random copolymer is preferably in the range of 85% by mass to 99% by mass.

前記第1樹脂成分(酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分)において、酸変性ポリプロピレンの含有率は、1質量%〜99質量%の範囲に設定されるのが好ましい。中でも、前記第1樹脂成分において酸変性ポリプロピレンの含有率は、1質量%〜50質量%の範囲に設定されるのがより好ましく、この場合にはコストを低減できて経済的である。   In the first resin component (first resin component made of acid-modified polypropylene and polypropylene not modified with acid), the content of acid-modified polypropylene is preferably set in the range of 1% by mass to 99% by mass. . Among them, the content of the acid-modified polypropylene in the first resin component is more preferably set in the range of 1% by mass to 50% by mass, and in this case, the cost can be reduced and it is economical.

本発明において、前記ベース樹脂層2の厚さは、20μm〜70μmに設定されるのが好ましい。また、前記外側樹脂層3の厚さは、15μm〜40μmに設定されるのが好ましい。また、前記内側樹脂層4の厚さは、15μm〜40μmに設定されるのが好ましい。   In the present invention, the thickness of the base resin layer 2 is preferably set to 20 μm to 70 μm. Moreover, it is preferable that the thickness of the outer resin layer 3 is set to 15 μm to 40 μm. Moreover, it is preferable that the thickness of the inner resin layer 4 is set to 15 μm to 40 μm.

また、本発明のタブ封止用絶縁フィルム1の厚さは、50μm〜150μmに設定されるのが好ましい。   Moreover, it is preferable that the thickness of the insulating film 1 for tab sealing of this invention is set to 50 micrometers-150 micrometers.

本発明のタブ封止用絶縁フィルム1を用いて構成された電気化学デバイス20の一実施形態を図3に示す。この電気化学デバイス20は、電気化学素子と、電極タブ21、22と、タブ封止用絶縁フィルム1と、外装材23と、を備える。   FIG. 3 shows an embodiment of an electrochemical device 20 configured using the tab sealing insulating film 1 of the present invention. The electrochemical device 20 includes an electrochemical element, electrode tabs 21 and 22, a tab sealing insulating film 1, and an exterior material 23.

この電気化学デバイス20の製造手順の一例を説明する。まず、図2に示すように、方形状に2枚切り出した外装材(外装フィルム)23、23を、互いの内面層を対向させて、周囲3辺23a、23b、23cを熱溶着して袋状物を作成する。   An example of the manufacturing procedure of the electrochemical device 20 will be described. First, as shown in FIG. 2, the outer packaging materials (exterior films) 23 and 23 cut into two squares are opposed to each other with their inner surfaces facing each other, and the surrounding three sides 23a, 23b and 23c are thermally welded to form a bag. Create a shape.

また、図2に示すように、正極タブ21におけるシール部23dに対応する部分にタブ封止用絶縁フィルム1、1を両面から挟み込んだ状態で溶着すると共に、負極タブ22におけるシール部23dに対応する部分にタブ封止用絶縁フィルム1、1を両面から挟み込んだ状態で溶着する。これらタブ21、22を電気化学素子に溶接によって接合固定する。前記正極タブ21は、例えば、アルミニウム、チタン等の金属導体によって構成されている。前記負極タブ22は、例えば、銅、ニッケル、ニッケルメッキされた銅等の金属導体によって構成されている。なお、前記電気化学素子は、正極と負極とが、電解質部を介して積層されて構成されている。前記タブ材(タブ21、22の材料)としては、圧延した硬質の箔や板を使用するのが好ましい。また、タブ21、22を構成する金属表面の腐食防止や、タブ封止用絶縁フィルム1との密着性を十分に確保するために、タブ21、22に下地処理を施してもよい。例えば、クロメート処理の場合は、脱脂処理を行った金属材の表面に下記1)〜3)のいずれかの水溶液を塗工した後、乾燥させる。
1)リン酸、クロム酸およびフッ化物金属塩の混合物からなる水溶液
2)リン酸、クロム酸およびフッ化物非金属塩の混合物からなる水溶液
3)アクリル系樹脂、キトサン誘導体樹脂及びフェノール系樹脂からなる群より選ばれる少なくとも1種の樹脂と、リン酸と、クロム酸(又はクロム(III)塩)と、フッ化物金属塩との混合物からなる水溶液。
Further, as shown in FIG. 2, the tab sealing insulating films 1, 1 are welded to the portion corresponding to the seal portion 23 d in the positive electrode tab 21 while being sandwiched from both sides, and correspond to the seal portion 23 d in the negative electrode tab 22. The tab sealing insulating films 1 and 1 are welded in a state of being sandwiched from both sides. These tabs 21 and 22 are joined and fixed to the electrochemical element by welding. The positive electrode tab 21 is made of a metal conductor such as aluminum or titanium. The negative electrode tab 22 is made of, for example, a metal conductor such as copper, nickel, or nickel-plated copper. In addition, the said electrochemical element is comprised by laminating | stacking the positive electrode and the negative electrode through the electrolyte part. As the tab material (the material of the tabs 21 and 22), it is preferable to use a rolled hard foil or plate. Moreover, in order to prevent corrosion of the metal surfaces constituting the tabs 21 and 22 and to ensure sufficient adhesion to the tab sealing insulating film 1, the tabs 21 and 22 may be subjected to a ground treatment. For example, in the case of chromate treatment, the aqueous solution of any one of 1) to 3) below is applied to the surface of the metal material that has been degreased and then dried.
1) Aqueous solution comprising a mixture of phosphoric acid, chromic acid and fluoride metal salt 2) Aqueous solution comprising a mixture of phosphoric acid, chromic acid and fluoride non-metal salt 3) Consisting of acrylic resin, chitosan derivative resin and phenolic resin An aqueous solution comprising a mixture of at least one resin selected from the group, phosphoric acid, chromic acid (or chromium (III) salt), and a fluoride metal salt.

次に、前記袋状物内に、タブ21、22が接続された電気化学素子を収容する。次いで、袋状物のシール部23d、23dによって、タブ21、22をタブ封止用絶縁フィルム1、1を介して挟み込んだ状態で、シール部23d、23dの全域を互いに熱溶着する(図2、3参照)。これにより、電気化学素子が、外装材(外装フィルム)23、23内に密閉状態で収容された電気化学デバイス(電池等)20が作製される。この電気化学デバイス20において、正極タブ21の先端部21b及び負極タブ22の先端部22bは、外装材23の外部に導出されている(図2参照)。   Next, the electrochemical element to which the tabs 21 and 22 are connected is accommodated in the bag-like material. Next, the entire areas of the seal portions 23d and 23d are thermally welded to each other in a state where the tabs 21 and 22 are sandwiched between the tab sealing insulating films 1 and 1 by the bag-like seal portions 23d and 23d (FIG. 2). 3). Thereby, the electrochemical device (battery etc.) 20 by which the electrochemical element was accommodated in the exterior material (exterior film) 23 and 23 in the airtight state is produced. In this electrochemical device 20, the front end portion 21b of the positive electrode tab 21 and the front end portion 22b of the negative electrode tab 22 are led out of the exterior material 23 (see FIG. 2).

なお、本発明の電気化学デバイス20は、上記製造方法で得られるものに特に限定されるものではない。   In addition, the electrochemical device 20 of this invention is not specifically limited to what is obtained with the said manufacturing method.

次に、本発明の具体的実施例について説明するが、本発明はこれら実施例のものに特に限定されるものではない。   Next, specific examples of the present invention will be described, but the present invention is not particularly limited to these examples.

<原材料>
(樹脂組成物A)
無水マレイン酸変性ポリプロピレン樹脂(無水マレイン酸グラフト量0.2質量%)60質量部、エチレン−プロピレンラバー(EPR、三井化学社製の「タフマーP−0480」)40質量部を2軸押出機で230℃の樹脂温度で溶融混練して得られた樹脂組成物。この樹脂組成物AのMFRは、1.3g/10分であり、樹脂組成物Aの融点は168℃である。
(樹脂組成物B)
無水マレイン酸変性ポリプロピレン樹脂(無水マレイン酸グラフト量0.2質量%)85質量部、エチレン−プロピレンラバー(EPR)15質量部を2軸押出機で230℃の樹脂温度で溶融混練して得られた樹脂組成物。この樹脂組成物BのMFRは、6g/10分であり、樹脂組成物Bの融点は168℃である。
(樹脂組成物C)
無水マレイン酸変性ポリプロピレン樹脂(無水マレイン酸グラフト量0.2質量%)70質量部、エチレン−プロピレンラバー(EPR)30質量部を2軸押出機で230℃の樹脂温度で溶融混練して得られた樹脂組成物。この樹脂組成物CのMFRは、3.5g/10分であり、樹脂組成物Cの融点は168℃である。
(樹脂組成物D)
無水マレイン酸変性ポリプロピレン樹脂(無水マレイン酸グラフト量0.3質量%)10質量部、ホモポリプロピレン樹脂(MFR:0.4g/10分)89質量部、エチレン−プロピレンラバー(EPR)1質量部を2軸押出機で230℃の樹脂温度で溶融混練して得られた樹脂組成物。この樹脂組成物DのMFRは、0.5g/10分であり、樹脂組成物Dの融点は165℃である。
(樹脂組成物E)
無水マレイン酸変性ポリプロピレン樹脂(無水マレイン酸グラフト量0.3質量%)15質量部、ホモポリプロピレン樹脂(MFR:0.4g/10分)83質量部、エチレン−プロピレンラバー(EPR)2質量部を2軸押出機で230℃の樹脂温度で溶融混練して得られた樹脂組成物。この樹脂組成物EのMFRは、0.5g/10分であり、樹脂組成物Eの融点は163℃である。
(樹脂組成物F)
無水マレイン酸変性ポリプロピレン樹脂(無水マレイン酸グラフト量0.2質量%)75質量部、エチレン−プロピレンラバー(EPR)25質量部を2軸押出機で230℃の樹脂温度で溶融混練して得られた樹脂組成物。この樹脂組成物FのMFRは、3.2g/10分であり、樹脂組成物Fの融点は134℃である。
(樹脂G)
無水マレイン酸変性ポリプロピレン樹脂(無水マレイン酸グラフト量0.2質量%)。この樹脂GのMFRは、3.5g/10分であり、樹脂Gの融点は134℃である。
(樹脂H)
ランダムポリプロピレン樹脂(エチレン−プロピレンランダム共重合体;プロピレン含有率4質量%)。この樹脂HのMFRは、3g/10分であり、樹脂Hの融点は140℃である。
<Raw materials>
(Resin composition A)
60 parts by mass of maleic anhydride-modified polypropylene resin (maleic anhydride graft amount 0.2% by mass) and 40 parts by mass of ethylene-propylene rubber (EPR, “Tuffmer P-0480” manufactured by Mitsui Chemicals, Inc.) using a twin screw extruder A resin composition obtained by melt-kneading at a resin temperature of 230 ° C. The MFR of the resin composition A is 1.3 g / 10 minutes, and the melting point of the resin composition A is 168 ° C.
(Resin composition B)
Obtained by melt-kneading 85 parts by mass of maleic anhydride-modified polypropylene resin (maleic anhydride graft amount 0.2 mass%) and 15 parts by mass of ethylene-propylene rubber (EPR) at a resin temperature of 230 ° C. with a twin screw extruder. Resin composition. The MFR of the resin composition B is 6 g / 10 minutes, and the melting point of the resin composition B is 168 ° C.
(Resin composition C)
Obtained by melt-kneading 70 parts by mass of maleic anhydride-modified polypropylene resin (maleic anhydride graft amount 0.2% by mass) and 30 parts by mass of ethylene-propylene rubber (EPR) at a resin temperature of 230 ° C. with a twin screw extruder. Resin composition. The MFR of the resin composition C is 3.5 g / 10 minutes, and the melting point of the resin composition C is 168 ° C.
(Resin composition D)
10 parts by mass of maleic anhydride-modified polypropylene resin (maleic anhydride graft amount 0.3% by mass), 89 parts by mass of homopolypropylene resin (MFR: 0.4 g / 10 min), 1 part by mass of ethylene-propylene rubber (EPR) A resin composition obtained by melt-kneading at a resin temperature of 230 ° C. with a twin-screw extruder. The MFR of the resin composition D is 0.5 g / 10 minutes, and the melting point of the resin composition D is 165 ° C.
(Resin composition E)
15 parts by mass of maleic anhydride-modified polypropylene resin (maleic anhydride graft amount 0.3% by mass), 83 parts by mass of homopolypropylene resin (MFR: 0.4 g / 10 min), 2 parts by mass of ethylene-propylene rubber (EPR) A resin composition obtained by melt-kneading at a resin temperature of 230 ° C. with a twin-screw extruder. The MFR of the resin composition E is 0.5 g / 10 minutes, and the melting point of the resin composition E is 163 ° C.
(Resin composition F)
It is obtained by melt-kneading 75 parts by mass of maleic anhydride-modified polypropylene resin (maleic anhydride graft amount 0.2% by mass) and 25 parts by mass of ethylene-propylene rubber (EPR) at a resin temperature of 230 ° C. with a twin screw extruder. Resin composition. The MFR of the resin composition F is 3.2 g / 10 minutes, and the melting point of the resin composition F is 134 ° C.
(Resin G)
Maleic anhydride-modified polypropylene resin (maleic anhydride graft amount 0.2 mass%). The MFR of the resin G is 3.5 g / 10 minutes, and the melting point of the resin G is 134 ° C.
(Resin H)
Random polypropylene resin (ethylene-propylene random copolymer; propylene content 4% by mass). The MFR of this resin H is 3 g / 10 min, and the melting point of the resin H is 140 ° C.

なお、上記「MFR」は、JIS K7210−1999に準拠して、温度230℃、荷重2.16kgの条件で測定されたMFR(メルトフローレート)を意味する。   In addition, said "MFR" means MFR (melt flow rate) measured on condition of temperature 230 degreeC and load 2.16kg based on JISK7210-1999.

また、上記「融点」は、JIS K7121−1987の「プラスチックの転移温度測定方法」に準拠して、株式会社島津製作所製のDSC(示差走査熱量計)(型式DSC−60A)を用いて昇温速度10℃/分で測定して得られたDSC曲線より求められた融解ピーク温度(融点)である。   The “melting point” is raised using a DSC (Differential Scanning Calorimeter) (model DSC-60A) manufactured by Shimadzu Corporation in accordance with “Measurement Method of Plastic Transition Temperature” of JIS K7121-1987. It is a melting peak temperature (melting point) obtained from a DSC curve obtained by measurement at a rate of 10 ° C./min.

<実施例1>
樹脂組成物Bを押出機から押出すことによって厚さ80μmのタブ封止用絶縁フィルムを得た。
<Example 1>
The resin composition B was extruded from an extruder to obtain an insulating film for tab sealing having a thickness of 80 μm.

<実施例2>
樹脂組成物Cを押出機から押出すことによって厚さ80μmのタブ封止用絶縁フィルムを得た。
<Example 2>
Resin composition C was extruded from an extruder to obtain an insulating film for tab sealing having a thickness of 80 μm.

<実施例3>
樹脂組成物Dを押出機から押出すことによって厚さ80μmのタブ封止用絶縁フィルムを得た。
<Example 3>
Resin composition D was extruded from an extruder to obtain an insulating film for tab sealing having a thickness of 80 μm.

<実施例4>
樹脂組成物Eを押出機から押出すことによって厚さ80μmのタブ封止用絶縁フィルムを得た。
<Example 4>
The resin composition E was extruded from an extruder to obtain an insulating film for tab sealing having a thickness of 80 μm.

<比較例1>
樹脂組成物Aを押出機から押出すことによって厚さ80μmのタブ封止用絶縁フィルムを得た。
<Comparative Example 1>
Resin composition A was extruded from an extruder to obtain an insulating film for tab sealing having a thickness of 80 μm.

<実施例5>
樹脂組成物Bからなる厚さ40μmのベース樹脂層2の一方の面に樹脂組成物Fからなる厚さ30μmの外側樹脂層3が積層されると共に前記ベース樹脂層2の他方の面に樹脂組成物Fからなる厚さ30μmの内側樹脂層4が積層された構成を備えた図1に示すタブ封止用絶縁フィルム1を共押出インフレーション成形法により得た。
<Example 5>
An outer resin layer 3 made of resin composition F having a thickness of 30 μm is laminated on one surface of a base resin layer 2 made of resin composition B and having a thickness of 40 μm, and a resin composition is made on the other surface of the base resin layer 2. The tab sealing insulating film 1 shown in FIG. 1 having a structure in which an inner resin layer 4 made of the product F and having a thickness of 30 μm was laminated was obtained by a coextrusion inflation molding method.

<実施例6>
樹脂組成物Cからなる厚さ40μmのベース樹脂層2の一方の面に樹脂組成物Fからなる厚さ30μmの外側樹脂層3が積層されると共に前記ベース樹脂層2の他方の面に樹脂組成物Fからなる厚さ30μmの内側樹脂層4が積層された構成を備えた図1に示すタブ封止用絶縁フィルム1を共押出インフレーション成形法により得た。
<Example 6>
An outer resin layer 3 made of resin composition F and having a thickness of 30 μm is laminated on one surface of a base resin layer 2 made of resin composition C and having a thickness of 40 μm, and a resin composition is formed on the other surface of the base resin layer 2. The tab sealing insulating film 1 shown in FIG. 1 having a structure in which an inner resin layer 4 made of the product F and having a thickness of 30 μm was laminated was obtained by a coextrusion inflation molding method.

<実施例7>
樹脂組成物Dからなる厚さ40μmのベース樹脂層2の一方の面に樹脂組成物Fからなる厚さ30μmの外側樹脂層3が積層されると共に前記ベース樹脂層2の他方の面に樹脂組成物Fからなる厚さ30μmの内側樹脂層4が積層された構成を備えた図1に示すタブ封止用絶縁フィルム1を共押出インフレーション成形法により得た。
<Example 7>
An outer resin layer 3 having a thickness of 30 μm made of a resin composition F is laminated on one surface of a base resin layer 2 made of a resin composition D and having a thickness of 40 μm, and a resin composition is formed on the other surface of the base resin layer 2. The tab sealing insulating film 1 shown in FIG. 1 having a structure in which an inner resin layer 4 made of the product F and having a thickness of 30 μm was laminated was obtained by a coextrusion inflation molding method.

<実施例8>
樹脂組成物Eからなる厚さ40μmのベース樹脂層2の一方の面に樹脂組成物Fからなる厚さ30μmの外側樹脂層3が積層されると共に前記ベース樹脂層2の他方の面に樹脂組成物Fからなる厚さ30μmの内側樹脂層4が積層された構成を備えた図1に示すタブ封止用絶縁フィルム1を共押出インフレーション成形法により得た。
<Example 8>
An outer resin layer 3 having a thickness of 30 μm made of a resin composition F is laminated on one surface of a base resin layer 2 made of a resin composition E and having a thickness of 40 μm, and a resin composition is formed on the other surface of the base resin layer 2. The tab sealing insulating film 1 shown in FIG. 1 having a structure in which an inner resin layer 4 made of the product F and having a thickness of 30 μm was laminated was obtained by a coextrusion inflation molding method.

<比較例2>
樹脂組成物Aからなる厚さ40μmのベース樹脂層2の一方の面に樹脂組成物Fからなる厚さ30μmの外側樹脂層3が積層されると共に前記ベース樹脂層2の他方の面に樹脂組成物Fからなる厚さ30μmの内側樹脂層4が積層された構成を備えた図1に示すタブ封止用絶縁フィルム1を共押出インフレーション成形法により得た。
<Comparative Example 2>
An outer resin layer 3 having a thickness of 30 μm made of resin composition F is laminated on one surface of a base resin layer 2 made of resin composition A and having a thickness of 40 μm, and a resin composition is formed on the other surface of base resin layer 2. The tab sealing insulating film 1 shown in FIG. 1 having a structure in which an inner resin layer 4 made of the product F and having a thickness of 30 μm was laminated was obtained by a coextrusion inflation molding method.

<実施例9>
樹脂組成物Cからなる厚さ40μmのベース樹脂層2の一方の面に樹脂Gからなる厚さ30μmの外側樹脂層3が積層されると共に前記ベース樹脂層2の他方の面に樹脂Gからなる厚さ30μmの内側樹脂層4が積層された構成を備えた図1に示すタブ封止用絶縁フィルム1を共押出インフレーション成形法により得た。
<Example 9>
An outer resin layer 3 made of resin G having a thickness of 30 μm is laminated on one surface of a base resin layer 2 made of resin composition C and having a thickness of 40 μm, and made of resin G on the other surface of the base resin layer 2. A tab sealing insulating film 1 shown in FIG. 1 having a structure in which an inner resin layer 4 having a thickness of 30 μm was laminated was obtained by a coextrusion inflation molding method.

<実施例10>
樹脂組成物Bからなる厚さ40μmのベース樹脂層2の一方の面に樹脂Hからなる厚さ30μmの外側樹脂層3が積層されると共に前記ベース樹脂層2の他方の面に樹脂Gからなる厚さ30μmの内側樹脂層4が積層された構成を備えた図1に示すタブ封止用絶縁フィルム1を共押出インフレーション成形法により得た。
<Example 10>
An outer resin layer 3 made of resin H and having a thickness of 30 μm is laminated on one surface of a base resin layer 2 made of resin composition B and having a thickness of 40 μm, and a resin G is made on the other surface of the base resin layer 2. A tab sealing insulating film 1 shown in FIG. 1 having a structure in which an inner resin layer 4 having a thickness of 30 μm was laminated was obtained by a coextrusion inflation molding method.

上記のようにして得られた各タブ封止用絶縁フィルムについて下記評価法に基づいて評価を行った。これらの結果を表1〜3に示す。   Each tab sealing insulating film obtained as described above was evaluated based on the following evaluation method. These results are shown in Tables 1-3.

<シール強度測定による封止性能の評価法>
得られたタブ封止用絶縁フィルムの内側樹脂層の表面を、タブリード材(タブ)の表面に重ね合わせると共に、前記絶縁フィルムの外側樹脂層の表面に、外装材の内側層の表面を重ね合わせて200℃での加熱により、タブリード材(タブ)/タブ封止用絶縁フィルム/外装材をシール接合して、シール接合物を得た。なお、前記外装材は、厚さ40μmのアルミニウム箔の一方の面に厚さ25μmの2軸延伸ポリアミドフィルムをドライラミネートし、前記アルミニウム箔の他方の面に厚さ40μmの未延伸ポリプロピレンフィルム(内側層)をドライラミネートして得られた外装材である。また、前記タブリード材(タブ)は、厚さ0.3mm、幅60mm、長さ50mmの銅板に、厚さ2μmのニッケルメッキを施し、さらにキトサン樹脂、フッ化クロム及びリン酸を含む水溶液で表面処理して得られたものである。
<Evaluation method of sealing performance by measuring seal strength>
The surface of the inner resin layer of the obtained tab sealing insulating film is overlaid on the surface of the tab lead material (tab), and the surface of the inner layer of the exterior material is overlaid on the surface of the outer resin layer of the insulating film. By heating at 200 ° C., the tab lead material (tab) / tab sealing insulating film / exterior material was sealed and bonded to obtain a sealed bonded product. In addition, the exterior material is obtained by dry laminating a 25 μm thick biaxially stretched polyamide film on one surface of an aluminum foil having a thickness of 40 μm, and an unstretched polypropylene film having a thickness of 40 μm on the other surface of the aluminum foil (inside It is an exterior material obtained by dry laminating a layer. In addition, the tab lead material (tab) is a surface of a copper plate having a thickness of 0.3 mm, a width of 60 mm, and a length of 50 mm, which is plated with nickel of 2 μm, and further an aqueous solution containing chitosan resin, chromium fluoride and phosphoric acid. It is obtained by processing.

次に、前記シール接合物を長さ方向に切断して幅15mm×長さ150mmの試験体を切り出した。次に、JIS Z0238−1998に準拠して、この試験体の外装材とタブ封止用絶縁フィルムをともに東洋精機社製ストログラフの上側のチャック部でチャックし、タブリード材を下側のチャック部でチャックして引張速度10mm/分で180度剥離させた時の剥離強度を測定し、これをタブリード材とタブ封止用絶縁フィルムとのシール強度(N/15mm幅)とした。この時、縦軸をシール強度(N/15mm幅)とし、横軸を伸び(タブ封止用絶縁フィルムの破壊の変位;チャック間の移動距離)(mm)としたS(Seal-Strength)−D(Distance)カーブを記録し、このS−Dカーブから下記判定基準に基づいて、タブ封止用絶縁フィルムの封止性能(封止強度)を評価した。
(判定基準)
「○」…S−Dカーブにおいて、第1降伏点後にシール強度の低下が認められず、且つ第1降伏点後において50(N/15mm幅)以上のシール強度が得られている(この評価が得られたものを合格とした)
「△」…S−Dカーブにおいて、第1降伏点後にシール強度の大幅な低下が認められるが、第1降伏点後において50(N/15mm幅)以上のシール強度が得られている
「×」…S−Dカーブにおいて、第1降伏点後にシール強度の大幅な低下が認められ、第1降伏点後においてシール強度が50(N/15mm幅)未満である。
Next, the seal bonded product was cut in the length direction to cut out a test body having a width of 15 mm and a length of 150 mm. Next, in accordance with JIS Z0238-1998, both the exterior material of this specimen and the insulating film for sealing the tab are chucked by the upper chuck portion of the strograph manufactured by Toyo Seiki Co., Ltd., and the tab lead material is lowered by the lower chuck portion. The peel strength at the time of chucking and peeling at 180 ° at a tensile speed of 10 mm / min was measured, and this was defined as the seal strength (N / 15 mm width) between the tab lead material and the tab sealing insulating film. At this time, S (Seal-Strength)-where the vertical axis is the seal strength (N / 15 mm width), and the horizontal axis is the elongation (displacement of the tab sealing insulating film; distance moved between chucks) (mm) A D (Distance) curve was recorded, and the sealing performance (sealing strength) of the insulating film for tab sealing was evaluated from the SD curve based on the following criteria.
(Criteria)
“◯”: In the SD curve, no decrease in seal strength was observed after the first yield point, and a seal strength of 50 (N / 15 mm width) or greater was obtained after the first yield point (this evaluation). Was obtained)
“△”: In the SD curve, a significant decrease in seal strength is observed after the first yield point, but a seal strength of 50 (N / 15 mm width) or more is obtained after the first yield point. In the SD curve, a significant decrease in the seal strength is recognized after the first yield point, and the seal strength is less than 50 (N / 15 mm width) after the first yield point.

<剥離界面の観察による封止性能の評価法>
上記180度剥離試験を行った後の剥離界面の色を目視で調べると共に、剥離界面の断面をSEM(走査電子顕微鏡)で観察して剥離位置(どの位置で剥離しているか)を調べて、下記判定基準に基づいて、タブ封止用絶縁フィルムの封止性能(封止強度)を評価した。なお、剥離界面の色において、白色部は、層内部で凝集破壊が生じていることを示すものであり、灰色部は、樹脂層と樹脂層の界面で凝集破壊が生じていることを示すものである。
(判定基準)
「○」…剥離界面の色は白色部と灰色部が混在しており、剥離位置は、ベース樹脂層と外側樹脂層の界面、又はベース樹脂層と内側樹脂層の界面である(樹脂層間近傍で凝集破壊が生じている)(この「○」評価が得られたものを合格とした)
「×」…剥離界面の色は全面が白色であり、剥離位置は、樹脂層間(樹脂層同士の界面)ではなく、ベース樹脂層内である(ベース樹脂層の内部で凝集破壊が生じている)。
<Evaluation method of sealing performance by observation of peeling interface>
While visually examining the color of the peel interface after performing the 180 degree peel test, the cross section of the peel interface is observed with a SEM (scanning electron microscope) to examine the peel position (where the peel is). Based on the following criteria, the sealing performance (sealing strength) of the tab sealing insulating film was evaluated. In the color of the peeling interface, the white part indicates that cohesive failure occurs inside the layer, and the gray part indicates that cohesive failure occurs at the interface between the resin layer and the resin layer. It is.
(Criteria)
“◯”: The color of the peeling interface includes a white part and a gray part, and the peeling position is the interface between the base resin layer and the outer resin layer or the interface between the base resin layer and the inner resin layer (near the resin layer) Cohesive failure has occurred) (This "○" evaluation was accepted)
“X”: The color of the peeling interface is white on the entire surface, and the peeling position is not in the resin layer (interface between the resin layers) but in the base resin layer (cohesive failure occurs inside the base resin layer) ).

表1〜3から明らかなように、本発明の実施例1〜10のタブ封止用絶縁フィルムは、封止強度に優れており、電池等の電気化学デバイスにおいて内圧が上昇した場合においても本発明のタブ封止用絶縁フィルムを介しての良好な封止状態を十分に維持できる。   As is clear from Tables 1 to 3, the tab sealing insulating films of Examples 1 to 10 of the present invention are excellent in sealing strength, and even when the internal pressure is increased in an electrochemical device such as a battery. The good sealing state through the insulating film for tab sealing of the invention can be sufficiently maintained.

これに対し、比較例1では、樹脂組成物における熱可塑性エラストマーの含有率が30質量%を超えているので、封止強度に劣っており、電池等の電気化学デバイスにおいて内圧が上昇した場合に、タブ封止用絶縁フィルムを介しての良好な封止状態を十分に維持することはできない。また、比較例2では、ベース樹脂層における熱可塑性エラストマーの含有率が30質量%を超えているので、封止強度に劣っており、電池等の電気化学デバイスにおいて内圧が上昇した場合に、タブ封止用絶縁フィルムを介しての良好な封止状態を十分に維持することはできない。   On the other hand, in Comparative Example 1, since the thermoplastic elastomer content in the resin composition exceeds 30% by mass, the sealing strength is inferior, and the internal pressure increases in an electrochemical device such as a battery. The good sealing state through the tab sealing insulating film cannot be sufficiently maintained. Further, in Comparative Example 2, the content of the thermoplastic elastomer in the base resin layer exceeds 30% by mass, so that the sealing strength is inferior, and the tab is increased when the internal pressure is increased in an electrochemical device such as a battery. A good sealing state through the sealing insulating film cannot be maintained sufficiently.

本発明に係るタブ封止用絶縁フィルムは、電池、キャパシタ等の電気化学デバイスのタブ封止用絶縁フィルムとして好適に用いられる。   The insulating film for tab sealing which concerns on this invention is used suitably as an insulating film for tab sealing of electrochemical devices, such as a battery and a capacitor.

1…タブ封止用絶縁フィルム
2…ベース樹脂層
3…外側樹脂層
4…内側樹脂層
20…電気化学デバイス
21…正極タブ
22…負極タブ
23…外装材
DESCRIPTION OF SYMBOLS 1 ... Tab sealing insulating film 2 ... Base resin layer 3 ... Outer resin layer 4 ... Inner resin layer 20 ... Electrochemical device 21 ... Positive electrode tab 22 ... Negative electrode tab 23 ... Exterior material

Claims (11)

酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる樹脂組成物からなるベース樹脂層を少なくとも含み、
前記樹脂組成物の融点が155℃以上であり、前記樹脂組成物のMFRが10g/10分以下であることを特徴とするタブ封止用絶縁フィルム。
Including at least a base resin layer composed of a resin composition comprising 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer;
An insulating film for tab sealing, wherein the resin composition has a melting point of 155 ° C. or higher, and the MFR of the resin composition is 10 g / 10 min or less.
酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる樹脂組成物からなるベース樹脂層を少なくとも含み、
前記樹脂組成物の融点が155℃以上であり、前記樹脂組成物のMFRが10g/10分以下であることを特徴とするタブ封止用絶縁フィルム。
A base resin comprising a resin composition comprising 70% by mass to 99% by mass of a first resin component made of acid-modified polypropylene and polypropylene not modified with acid, and 1% by mass to 30% by mass of a thermoplastic elastomer. Including at least a layer,
An insulating film for tab sealing, wherein the resin composition has a melting point of 155 ° C. or higher, and the MFR of the resin composition is 10 g / 10 min or less.
前記絶縁フィルムは、前記ベース樹脂層における外装材側の面に外側樹脂層が積層されると共に、前記ベース樹脂層におけるタブ側の面に内側樹脂層が積層された構成であり、前記外側樹脂層が、酸変性ポリプロピレン又は/及び酸で変性されていないポリプロピレンを含有し、前記内側樹脂層が酸変性ポリプロピレンを含有する請求項1または2に記載のタブ封止用絶縁フィルム。   The insulating film has a configuration in which an outer resin layer is laminated on a surface of the base resin layer on the exterior material side, and an inner resin layer is laminated on a tab side surface of the base resin layer, and the outer resin layer 3. The tab sealing insulating film according to claim 1, comprising: acid-modified polypropylene or / and polypropylene not modified with acid, and the inner resin layer contains acid-modified polypropylene. 前記外側樹脂層の融点が130℃〜140℃であり、前記内側樹脂層の融点が130℃〜140℃であり、
前記ベース樹脂層の融点は、前記外側樹脂層の融点より25℃以上高く、かつ前記内側樹脂層の融点より25℃以上高い請求項3に記載のタブ封止用絶縁フィルム。
The melting point of the outer resin layer is 130 ° C to 140 ° C, the melting point of the inner resin layer is 130 ° C to 140 ° C,
The insulating film for tab sealing according to claim 3, wherein the melting point of the base resin layer is 25 ° C or more higher than the melting point of the outer resin layer and 25 ° C or more higher than the melting point of the inner resin layer.
前記ベース樹脂層の融点は、前記外側樹脂層の融点より25℃〜45℃高く、かつ前記内側樹脂層の融点より25℃〜45℃高い請求項4に記載のタブ封止用絶縁フィルム。   The insulating film for tab sealing according to claim 4, wherein the melting point of the base resin layer is 25 to 45 ° C higher than the melting point of the outer resin layer and 25 to 45 ° C higher than the melting point of the inner resin layer. 前記絶縁フィルムは、前記ベース樹脂層における外装材側の面に外側樹脂層が積層されるとともに、前記ベース樹脂層におけるタブ側の面に内側樹脂層が積層された構成であり、
前記外側樹脂層が、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなり、
前記内側樹脂層が、酸変性ポリプロピレン70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなる請求項1または2に記載のタブ封止用絶縁フィルム。
The insulating film has a configuration in which an outer resin layer is laminated on a surface of the base resin layer on the exterior material side, and an inner resin layer is laminated on a tab side surface of the base resin layer,
The outer resin layer comprises a resin composition having a melting point of less than 155 ° C., comprising 70% by mass to 99% by mass of acid-modified polypropylene and 1% by mass to 30% by mass of a thermoplastic elastomer,
The inner resin layer is made of a resin composition having a melting point of less than 155 ° C, comprising 70% to 99% by mass of acid-modified polypropylene and 1% to 30% by mass of a thermoplastic elastomer. 2. An insulating film for sealing a tab according to 2.
前記絶縁フィルムは、前記ベース樹脂層における外装材側の面に外側樹脂層が積層されるとともに、前記ベース樹脂層におけるタブ側の面に内側樹脂層が積層された構成であり、
前記外側樹脂層が、酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなり、
前記内側樹脂層が、酸変性ポリプロピレンおよび酸で変性されていないポリプロピレンからなる第1樹脂成分70質量%〜99質量%と、熱可塑性エラストマー1質量%〜30質量%と、を含有してなる融点が155℃未満の樹脂組成物からなる請求項1または2に記載のタブ封止用絶縁フィルム。
The insulating film has a configuration in which an outer resin layer is laminated on a surface of the base resin layer on the exterior material side, and an inner resin layer is laminated on a tab side surface of the base resin layer,
Melting | fusing point formed by the said outer side resin layer containing 70 mass%-99 mass% of 1st resin components which consist of acid-modified polypropylene and the polypropylene which is not modified | denatured with acid, and 1 mass%-30 mass% of thermoplastic elastomers. Consists of a resin composition of less than 155 ° C,
Melting | fusing point formed by the said inner side resin layer containing 70 mass%-99 mass% of 1st resin components which consist of acid-modified polypropylene and the polypropylene which is not modified | denatured with an acid, and thermoplastic elastomer 1 mass%-30 mass%. The insulating film for tab sealing according to claim 1 or 2, comprising a resin composition having a temperature of less than 155 ° C.
前記熱可塑性エラストマーの融点が80℃以下であり、前記熱可塑性エラストマーのMFRが5g/10分以下である請求項1〜7のいずれか1項に記載のタブ封止用絶縁フィルム。   The insulating film for tab sealing according to any one of claims 1 to 7, wherein the thermoplastic elastomer has a melting point of 80 ° C or lower, and the thermoplastic elastomer has an MFR of 5 g / 10 min or less. 前記熱可塑性エラストマーが、エチレン−プロピレンラバー及びエチレン−プロピレン−ブテンラバーからなる群より選ばれる1種または2種の樹脂である請求項1〜8のいずれか1項に記載のタブ封止用絶縁フィルム。   The insulating film for tab sealing according to any one of claims 1 to 8, wherein the thermoplastic elastomer is one or two resins selected from the group consisting of ethylene-propylene rubber and ethylene-propylene-butene rubber. . 請求項1〜9のいずれか1項に記載のタブ封止用絶縁フィルムを含むことを特徴とする電気化学デバイス。   An electrochemical device comprising the tab sealing insulating film according to claim 1. 外装材と、
前記外装材に収容される電気化学素子と、
内端部が前記電気化学素子に電気的に接続されると共に、外端部が前記外装材の外部に配置されるタブと、を備え、
前記外装材のシール部によって前記タブの両面を請求項1〜9のいずれか1項に記載のタブ封止用絶縁フィルムを介して挟み込んだ状態で、前記外装材のシール部が前記タブの両面に接合されていることを特徴とする電気化学デバイス。
An exterior material,
An electrochemical element housed in the exterior material;
An inner end portion is electrically connected to the electrochemical element, and an outer end portion is disposed outside the exterior material, and a tab,
The both sides of the tab are sandwiched via the tab sealing insulating film according to any one of claims 1 to 9 by the seal portion of the exterior material, and the seal portion of the exterior material is provided on both sides of the tab. An electrochemical device characterized by being bonded to the substrate.
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017073200A (en) * 2015-10-05 2017-04-13 住友電気工業株式会社 Lead material
CN110556502A (en) * 2019-09-03 2019-12-10 深圳市文壹科技有限公司 sheet type welding attack angle manufacturing process for tabs required by power soft package lithium ion battery
WO2019244971A1 (en) * 2018-06-20 2019-12-26 大日本印刷株式会社 Adhesive film for metal terminal, metal terminal with adhesive film, and battery
JP2020093428A (en) * 2018-12-11 2020-06-18 三井化学株式会社 Composite having composition layer and metal layer
WO2021006351A1 (en) * 2019-07-10 2021-01-14 大日本印刷株式会社 Adhesive film for metal terminals, metal terminal with adhesive film for metal terminals, electricity storage device using said adhesive film for metal terminals, and method for producing electricity storage device
JP2022078571A (en) * 2020-11-13 2022-05-25 凸版印刷株式会社 Resin film for terminal, and power storage device using the same
US20230207936A1 (en) * 2020-05-25 2023-06-29 Fujimori Kogyo Co., Ltd. Sealing Film, Electrode Lead Member, And Battery
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WO2025022540A1 (en) * 2023-07-25 2025-01-30 住友電気工業株式会社 Adhesive film, tab lead, and power-storage device

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706030B (en) * 2015-09-29 2020-10-01 日商昭和電工包裝股份有限公司 Sealing film for exterior material of power storage device, exterior material for power storage device, and power storage device
JP6738189B2 (en) * 2016-04-21 2020-08-12 昭和電工パッケージング株式会社 Exterior material for power storage device and power storage device
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JP7160048B2 (en) * 2017-11-17 2022-10-25 住友電気工業株式会社 Resin molding and tab lead
KR102322332B1 (en) * 2019-12-10 2021-11-10 율촌화학 주식회사 A film for lead tab and integrated cell pouch comprising the same
CN113285181A (en) * 2021-05-14 2021-08-20 格远电子科技(上海)有限公司 High-temperature-ineffectible tab and manufacturing method thereof
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007264A (en) * 2001-06-20 2003-01-10 Dainippon Printing Co Ltd Battery lead film and battery packaging material using the same
JP2007184189A (en) * 2006-01-10 2007-07-19 Sumitomo Electric Ind Ltd Electrical component, non-aqueous electrolyte battery, lead conductor with insulating coating layer and enclosure used for them
JP2008192451A (en) * 2007-02-05 2008-08-21 Sony Corp Sealant film for lead, and nonaqueous electrolyte battery
JP2009259739A (en) * 2008-04-21 2009-11-05 Sumitomo Electric Ind Ltd Electrical parts, nonaqueous electrolyte battery, and lead wire and sealing container used for them

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5076260B2 (en) 2001-06-20 2012-11-21 大日本印刷株式会社 Battery lead wire film, lead wire and battery using the same
JP5308696B2 (en) 2008-03-17 2013-10-09 藤森工業株式会社 Sealing film and electrode with sealing film
DE102008015965A1 (en) * 2008-03-20 2009-09-24 Varta Microbattery Gmbh Galvanic element with foil seal
JP5422842B2 (en) 2009-04-10 2014-02-19 昭和電工パッケージング株式会社 Electrochemical devices
JP5720132B2 (en) * 2010-07-13 2015-05-20 凸版印刷株式会社 Resin film covering metal terminals for secondary batteries
TWI511351B (en) * 2010-10-14 2015-12-01 Toppan Printing Co Ltd Lithium-ion battery exterior materials

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007264A (en) * 2001-06-20 2003-01-10 Dainippon Printing Co Ltd Battery lead film and battery packaging material using the same
JP2007184189A (en) * 2006-01-10 2007-07-19 Sumitomo Electric Ind Ltd Electrical component, non-aqueous electrolyte battery, lead conductor with insulating coating layer and enclosure used for them
JP2008192451A (en) * 2007-02-05 2008-08-21 Sony Corp Sealant film for lead, and nonaqueous electrolyte battery
JP2009259739A (en) * 2008-04-21 2009-11-05 Sumitomo Electric Ind Ltd Electrical parts, nonaqueous electrolyte battery, and lead wire and sealing container used for them

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017073200A (en) * 2015-10-05 2017-04-13 住友電気工業株式会社 Lead material
WO2019244971A1 (en) * 2018-06-20 2019-12-26 大日本印刷株式会社 Adhesive film for metal terminal, metal terminal with adhesive film, and battery
JPWO2019244971A1 (en) * 2018-06-20 2020-06-25 大日本印刷株式会社 Adhesive film for metal terminal, metal terminal with adhesive film, and battery
JP2020161484A (en) * 2018-06-20 2020-10-01 大日本印刷株式会社 Adhesive film for metal terminal, metal terminal with adhesive film, and battery
JP7134853B2 (en) 2018-12-11 2022-09-12 三井化学株式会社 Composite with composition layer and metal layer
JP2020093428A (en) * 2018-12-11 2020-06-18 三井化学株式会社 Composite having composition layer and metal layer
JP2022002215A (en) * 2019-07-10 2022-01-06 大日本印刷株式会社 Adhesive film for metal terminal, metal terminal with adhesive film for metal terminal, power storage device employing the adhesive film for metal terminal, and manufacturing method of power storage device
JPWO2021006351A1 (en) * 2019-07-10 2021-12-02 大日本印刷株式会社 An adhesive film for metal terminals, a metal terminal with an adhesive film for metal terminals, a power storage device using the adhesive film for metal terminals, and a method for manufacturing the power storage device.
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JP7600941B2 (en) 2019-07-10 2024-12-17 大日本印刷株式会社 ADHESIVE FILM FOR METAL TERMINAL, METAL TERMINAL WITH ADHESIVE FILM FOR METAL TERMINAL, ELECTRICITY STORAGE DEVICE USING ADHESIVE FILM FOR METAL TERMINAL, AND METHOD FOR MANUFACTURING ELECTRICITY STORAGE DEVICE
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EP4245531A4 (en) * 2020-11-13 2024-04-17 Toppan Inc. Terminal resin film and power storage device using same
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