JP2015156312A - Led lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting fixture capable of achieving improvement in heat radiation and reduction in thickness.

SOLUTION: An LED lighting fixture 100 includes: a fixture body 1; an LED module 2; a power supply module 6; and a wire accommodation part. The fixture body 1 includes a base part 11 and a side wall part 12. The LED module 2 is arranged on a surface 11a side of the base part 11. The power supply module 6 is arranged inside the side wall part 12. The power supply module 6 includes: a first connection part for connecting wiring for inputting AC power; and a second connection part for outputting DC power to the LED module 2. In the power supply module 6, a relatively short electronic component 62 out of a group of electronic components 62 is arranged in a first region which overlaps a vertical projection region of the wire accommodation part on a second surface 61b of a circuit board 61, and a relatively tall electronic component 62 out of the group of electronic components 62 is arranged in a second region other than the first region on the second surface 61b of the circuit board 61.

COPYRIGHT: (C)2015,JPO&INPIT

Description

  The present invention relates to an LED lighting apparatus.

  Conventionally, as a lighting fixture using light emitting elements such as LEDs (light emitting diodes), for example, a ceiling-embedded downlight 401 as shown in FIG. 15 has been proposed (Patent Document 1).

  The downlight 401 includes a light source unit 402 and a power supply unit 403 attached to the light source unit 402. The light source unit 402 is arranged in front of the heat dissipating means 404, the decorative frame 405 attached to the heat dissipating means 404, the substrate 407 mounted on the heat dissipating means 404, and the LED 406 mounted thereon, the reflector 408, and the reflector 408. A translucent cover 409 provided.

  The heat dissipating means 404 includes a substantially disc-shaped base 441 and a plurality of fins 442 erected on the back side of the base 441.

  The decorative frame 405 is formed with an annular flange 451 at the end of the widened opening.

  On the surface side of the substrate 407, a plurality of LEDs 406 are mounted in the central portion and its peripheral portion.

  The power supply unit 403 includes a power supply circuit 431 including a power supply circuit board, a power supply terminal block 432 that is connected to a commercial power supply and supplies power to the power supply circuit 431, and an arm-shaped attachment member 433. Electrical components such as a control IC, a transformer, and a capacitor are mounted on the power circuit board. This power supply circuit board is electrically connected to a board 407 on which the LED 406 is mounted. The power supply circuit 431 controls the lighting of the LED 406.

  Moreover, as a lighting fixture installed in a ceiling surface etc., the lighting fixture 510 as shown in FIG. 16 is proposed (patent document 2).

  The lighting fixture 510 includes a fixture main body 511, an LED unit 512, a power supply unit 513, a cover 514, an insulating cover 515, and a lens 516.

  The instrument main body 511 has a partition plate part 519 for isolating the upper part and the lower part of the instrument main body 511. The partition plate portion 519 has a bottom plate 520.

  The LED unit 512 has a plurality of LED elements 527 mounted on the lower surface of an LED substrate 526 formed in an annular shape.

  The power supply unit 513 has an AC-DC conversion circuit 532, a smoothing circuit 533, and the like mounted on the power supply unit substrate 530, and converts commercial AC power supplied from the outside into DC power for the LED element 527.

JP 2010-102897 A JP 2011-243510 A

  In the field of LED lighting fixtures, further thinning is desired. However, in the lighting fixture 510, it is necessary to form a large-capacity heat radiation space above the power supply unit 513, and thus reduction in thickness is limited. Moreover, in the lighting fixture 510, there exists a possibility that the heat | fever which generate | occur | produced in each of the LED unit 512 and the power supply unit 513 may mutually affect, and further thickness reduction is difficult.

  This invention is made | formed in view of the said reason, The objective is to provide the LED lighting fixture which can aim at the improvement of heat dissipation, and thickness reduction.

  The LED lighting apparatus of the present invention includes an apparatus main body, an LED module, a power supply module, and an electric wire storage unit. The instrument body includes a base part formed in a flat plate shape, and a frame-like side wall part protruding from the back surface of the base part inside the outer periphery of the back surface of the base part. The LED module includes an LED and a mounting substrate on which the LED is mounted. The LED module is disposed on the surface side of the base part. The power supply module is a group of electronic components for a power supply circuit that converts input AC power into DC power and outputs the DC power to the LED module; a first connection unit that connects an electric wire for inputting AC power; and A second connection for outputting DC power to the LED module; and a circuit board provided with the group of electronic components, the first connection, and the second connection. The power supply module is disposed inside the side wall portion on the back side of the base portion. In the power supply module, the first connection portion and the second connection portion are arranged on the second surface side opposite to the first surface near the base portion in the circuit board. The power supply module arranges a relatively short electronic component among the group of electronic components in a first region overlapping the vertical projection region of the electric wire housing portion on the second surface of the circuit board, and the circuit A relatively tall electronic component among the group of electronic components is arranged in a second region other than the first region on the second surface of the substrate.

  The LED lighting apparatus of the present invention includes an apparatus main body, an LED module, a power supply module, a back cover, and a terminal block. The instrument body is made of metal. The instrument body includes a base part formed in a flat plate shape, and a frame-like side wall part protruding from the back surface of the base part inside the outer periphery of the back surface of the base part. The LED module includes a plurality of LEDs and a mounting board on which the plurality of LEDs are mounted. The LED module is arranged on the surface side of the base part, and the plurality of LEDs are arranged outside the vertical projection region of the side wall part on the surface of the mounting substrate. The power supply module is a first connection part that connects a group of electronic components of a power supply circuit that converts input AC power into DC power and outputs the DC power to an electric wire for inputting AC power. 1 connector, a second connector which is a second connection part for outputting DC power to the LED module, the group of electronic components, a circuit board provided with the first connector and the second connector, Is provided. The power supply module is disposed inside the side wall portion on the back side of the base portion. In the power supply module, the first connector and the second connector are arranged on a second surface side opposite to the first surface near the base portion in the circuit board. The first connector includes a first contact and a first contact holding portion that holds the first contact. The back cover is formed in a back wall portion, a peripheral wall portion projecting from the outer peripheral edge of the back wall portion to the base portion side to surround the power supply module, and a central portion of the back wall portion, and the circuit board. A recessed portion recessed in a direction approaching the second surface. The terminal block is disposed in a space surrounded by the back wall portion, the wall portion of the concave portion, and the peripheral wall portion, and includes a connection terminal and a connection terminal holding portion that holds the connection terminal. The connection terminal includes a second contact that is electrically connected to the first contact, and a connection portion that connects an electric wire inserted through an electric wire insertion hole formed in the wall portion. The first connector and the connection terminal are connected by inserting one of the first contact and the second contact into the other in the thickness direction of the circuit board. The power supply module arranges a relatively short electronic component among the group of electronic components in a first region overlapping the vertical projection region of the terminal block and the recess on the second surface of the circuit board, A relatively tall electronic component of the group of electronic components is arranged in a second region other than the first region on the second surface of the circuit board.

  In this LED lighting apparatus, in the power supply module, the group of electronic components includes a plurality of lead type electronic components and a plurality of chip components. In the power supply module, the plurality of lead-type electronic components are disposed on the second surface side of the circuit board, and the plurality of chip components are disposed at least on the first surface and the second surface of the circuit substrate. It is preferable to arrange on one side.

  In this LED lighting apparatus, the power supply circuit includes a transformer as one of the group of electronic components. In the power supply module, it is preferable that the transformer is arranged apart from the first connection portion and the second connection portion in a peripheral portion of the second surface of the circuit board.

  In this LED lighting apparatus, it is preferable that the power supply module includes a plurality of electronic components having relatively high heat generation temperatures among the group of electronic components.

  In this LED lighting apparatus, it is preferable that in the power supply module, a specific functional element in the power supply circuit is configured by a combination of a plurality of electronic components in the group of electronic components.

  In this LED lighting apparatus, it is preferable that the power supply module is arranged such that a plurality of electronic components having a relatively high heat generation temperature among the group of electronic components do not face each other in the thickness direction of the circuit board. .

  In this LED lighting apparatus, the LED module includes a load circuit including the LED. The power supply circuit is connected in parallel to a lighting load including a power conversion circuit that converts AC power input from the first connection portion into DC power, and the power conversion circuit and the load circuit. And a bleeder circuit that allows a bypass current to flow when the absolute value of the input AC voltage is less than a threshold value.

  In this LED lighting apparatus, it is preferable to include a heat insulating member disposed between the power supply module and the base portion.

  In this LED lighting apparatus, it is preferable that a cured product of a resin for heat dissipation and electrical insulation is interposed between the power supply module and the base portion.

  In this LED lighting apparatus, it is preferable to include a first heat conductive sheet disposed between the power supply module and the base portion.

  In this LED lighting apparatus, it is preferable to include a first electrical insulating sheet disposed between the power supply module and the first heat conductive sheet.

  In this LED lighting apparatus, among the plurality of lead-type electronic components in the group of electronic components, the height dimension along the lead-out direction of the linear lead terminal is perpendicular to the height direction with respect to the outer shape of the package main body. It is preferable that the lead-type electronic component larger than the dimension in each direction is arranged by bending the lead terminal into an L shape.

  In this LED lighting apparatus, it is preferable that the power supply module is arranged by dropping a plurality of electronic components of the group of electronic components into through holes or notches formed in the circuit board.

  In this LED lighting apparatus, it is preferable to include a second heat conductive sheet disposed between the power supply module and the back cover.

  In this LED lighting apparatus, it is preferable to include a second electrical insulating sheet disposed between the power supply module and the second heat conductive sheet.

  In the LED lighting apparatus of the present invention, the apparatus body has a base part formed in a flat plate shape, and a frame-like side wall part protruding from the back surface of the base part inside the outer periphery of the back surface of the base part The LED module is disposed on the front surface side of the base portion, and the power module is disposed on the back surface side of the base portion and inside the side wall portion. Thereby, the LED lighting fixture of this invention can aim at the improvement of heat dissipation. Furthermore, the LED lighting apparatus of the present invention is configured such that the power supply module is relatively backed out of the group of electronic components in a first region that overlaps the vertical projection region of the electric wire housing portion on the second surface of the circuit board. Electronic components having a low height are arranged, and relatively tall electronic components of the group of electronic components are arranged in a second region other than the first region on the second surface of the circuit board. Thereby, the LED lighting apparatus can be thinned.

  In the LED lighting apparatus of the present invention, the LED module is disposed on the surface side of the base portion, and the plurality of LEDs are disposed outside a vertical projection region of the side wall portion on the surface of the mounting substrate. . Moreover, as for the LED lighting fixture of this invention, the said power supply module is arrange | positioned inside the said side wall part by the back surface side of the said base part. Thereby, the LED lighting fixture of this invention can aim at the improvement of heat dissipation. Furthermore, in the LED lighting apparatus of the present invention, the terminal block is disposed in a space surrounded by the back wall, the wall of the recess, and the peripheral wall, and holds the connection terminal and the connection terminal. A connection terminal holding portion, wherein the connection terminal connects a second contact electrically connected to the first contact and a wire inserted through an electric wire insertion hole formed in the wall portion. A section. Here, the first connector and the connection terminal are connected by inserting one of the first contact and the second contact into the other in the thickness direction of the circuit board. Thereby, the LED lighting apparatus of the present invention can be thinned. Further, in the LED lighting apparatus of the present invention, the power supply module is relatively positioned in the first area overlapping the vertical projection area of the terminal block and the recess on the second surface of the circuit board. A short electronic component is disposed on the second surface of the circuit board, and a relatively tall electronic component of the group of electronic components is disposed in a second region other than the first region on the second surface of the circuit board. . Thereby, the LED lighting apparatus of the present invention can be further reduced in thickness.

Fig.1 (a) is the schematic perspective view which fractured | ruptured some LED lighting fixtures of embodiment. FIG.1 (b) is the schematic perspective view which fractured | ruptured another part of the LED lighting fixture of embodiment. FIG. 2 is a partially exploded schematic perspective view for explaining the method of assembling the LED lighting apparatus of the embodiment. FIG. 3 is a partially broken schematic perspective view for explaining the connection form of the electric wire to the LED lighting apparatus of the embodiment. FIG. 4 is a schematic perspective view of the LED lighting apparatus according to the embodiment with a cover removed. FIG. 5 is a partially exploded perspective view seen from the lower side of the LED lighting apparatus of the embodiment. FIG. 6 is a partially exploded perspective view seen from the upper side of the LED lighting apparatus of the embodiment. FIG. 7 is an exploded perspective view seen from the lower side of the LED lighting apparatus of the embodiment. FIG. 8 is an exploded perspective view seen from the upper side of the LED lighting apparatus of the embodiment. FIG. 9 is a schematic perspective view showing a state in which the LED lighting apparatus of the embodiment is attached to a ceiling material. FIG. 10 is a schematic cross-sectional view of the LED lighting fixture of the embodiment attached to a ceiling material. Fig.11 (a) is a schematic plan view of the power supply module in the LED lighting fixture of embodiment. FIG.11 (b) is a schematic bottom view of the power supply module in the LED lighting fixture of embodiment. FIG.11 (c) is a schematic side view of the power supply module in the LED lighting fixture of embodiment. FIG. 12 is a schematic circuit diagram of a power supply module in the LED lighting apparatus of the embodiment. FIG. 13 is a schematic exploded perspective view seen from the lower side of the LED lighting fixture of the first modified example. FIG. 14 is a schematic exploded perspective view seen from the upper side of the LED lighting fixture of the first modified example. FIG. 15 is a partial cross-sectional view of a lighting fixture showing a conventional example. FIG. 16 is a longitudinal sectional view of a lighting fixture showing another conventional example.

  Below, the LED lighting fixture 100 of this embodiment is demonstrated based on FIGS.

  The LED lighting apparatus 100 includes an apparatus main body 1, an LED module 2, a power supply module 6, a back cover 7, and a terminal block 9. The instrument body 1 is made of metal. The instrument body 1 includes a base part 11 formed in a flat plate shape, and a frame-like side wall part 12 protruding from the back surface 11b of the base part 11 inside the outer periphery of the back surface 11b of the base part 11. . The LED module 2 includes a plurality of LEDs 22 and a mounting substrate 21 on which the plurality of LEDs 22 are mounted. The LED module 2 is disposed on the surface 11 a side of the base portion 11, and a plurality of LEDs 22 are disposed outside the vertical projection region of the side wall portion 12 on the surface 21 a of the mounting substrate 21. The power supply module 6 includes a group of electronic components 62 that convert input AC power into DC power and output it to the LED module 2 (see FIG. 12). In addition, the power supply module 6 is a first connector 64 that is a first connection portion that connects the electric wire 103 for inputting AC power, and a second connection portion that is a second connection portion for outputting DC power to the LED module 2. And a connector 67. The power supply module 6 includes a group of electronic components 62, a circuit board 61 provided with a first connector 64 and a second connector 67. The power supply module 6 is disposed inside the side wall portion 12 on the back surface 11 b side of the base portion 11. In the power supply module 6, the first connector 64 and the second connector 67 are disposed on the second surface 61 b side opposite to the first surface 61 a close to the base portion 11 in the circuit board 61. The first connector 64 includes a first contact 65 and a first contact holding portion 66 that holds the first contact 65. The back cover 7 is formed at the back wall portion 71, the peripheral wall portion 72 that protrudes from the outer peripheral edge of the back wall portion 71 toward the base portion 11 side and surrounds the power supply module 6, and the center portion of the back wall portion 71. A recess 73 recessed in a direction approaching the second surface 61b. The terminal block 9 is disposed in a space surrounded by the back wall portion 71, the wall portion 73a of the recess 73, and the peripheral wall portion 72, and includes a connection terminal 91, a connection terminal holding portion 92 that holds the connection terminal 91, Is provided. The connection terminal 91 connects the second contact 93 electrically connected to the first contact 65 and the wire 103 inserted into the connection terminal holding portion 92 through the wire insertion hole 73aa formed in the wall portion 73a. 95. The first connector 64 and the connection terminal 91 are connected by inserting one of the first contact 65 and the second contact 93 to the other in the thickness direction of the circuit board 61. The power supply module 6 is relatively positioned in a first area 68 (see FIG. 11A) that overlaps the vertical projection area of the terminal block 9 and the recess 73 on the second surface 61 b of the circuit board 61. A short electronic component 62 is disposed, and the second surface 69 b of the circuit board 61 is arranged in a second region 69 (see FIG. 11A) other than the first region 68, and the back of the group of electronic components 62 is relatively back. The high electronic component 62 is arranged. With the above configuration, the LED lighting apparatus 100 can improve heat dissipation and reduce the thickness.

  The LED lighting apparatus 100, for example, pulls out the electric wire 103 connected to an AC power source 701 (see FIG. 12) made of a commercial power source from a hole 201 (see FIG. 10) penetrating in the thickness direction of the construction material 200, and a connection portion 95 can be connected. In short, the LED lighting apparatus 100 is a power supply circuit built-in type LED lighting apparatus 100 that can be connected to a commercial power supply by the electric wire 103. The LED lighting device 100 preferably includes an attachment member 8 (see FIGS. 4 to 10) for attaching to a construction material 200 such as a ceiling material, for example.

  The LED lighting device 100 includes two screws 27 (see FIG. 7) for fixing the LED module 2 to the device main body 1 and three screws 74 (see FIGS. 5, 6 and 6) for attaching the back cover 7 to the device main body 1. 8).

  The LED lighting apparatus 100 may further include a reflecting plate 3, a light guide plate 4, and a cover 5. The LED lighting device 100 can be configured to include three screws 19 (see FIG. 8) for fixing the reflecting plate 3 to the device body 1. The light guide plate 4 and the cover 5 can be configured to be attached to the reflection plate 3.

  The LED lighting apparatus 100 is a ceiling light, but is not particularly limited to a ceiling light.

  Each component of the LED lighting apparatus 100 will be described in more detail below.

  The material of the instrument body 1 is preferably a metal. Aluminum is used as the metal that is the material of the instrument body 1. And the instrument main body 1 is formed by the aluminum die-casting method. The material of the instrument body 1 is preferably a metal having a high thermal conductivity, and is not limited to aluminum, and for example, copper or the like can be employed. In addition, as the metal that is the material of the instrument body 1, stainless steel or the like can be employed. The material of the instrument body 1 is not limited to a metal, but may be, for example, a resin, and a resin having higher thermal conductivity is preferable from the viewpoint of heat dissipation. As resin of the material of the instrument main body 1, for example, a resin whose thermal conductivity is improved by blending a thermally conductive filler can be employed. The material of the instrument body 1 may be ceramic. Moreover, as for the instrument main body 1, the part formed with the metal and the part formed with resin may be mixed.

  The instrument body 1 has a circular outer peripheral shape of the base 11. Moreover, as for the instrument main body 1, the outer peripheral shape of the side wall part 12 is made into circular shape, and the inner peripheral shape of the side wall part 12 is made into circular shape. In short, the side wall part 12 is formed in a cylindrical shape. In the LED lighting device 100, the power supply module 6 is accommodated in a space surrounded by the base portion 11 and the side wall portion 12 in the device main body 1.

  As shown in FIGS. 7 and 8, the base part 11 has an opening 13 that penetrates in the thickness direction of the base part 11 at the center of the base part 11. The opening 13 has a function of passing a lead wire 63 (see FIGS. 4 to 8) that electrically connects the LED module 2 and the power supply module 6.

  In addition, the base portion 11 is formed with two screw holes 14 and three through holes 15 with the opening portion 13 as the center. The two screw holes 14 are formed at positions that are spaced apart from the opening 13 in the opposite direction and sandwich the opening 13. The shaft portions of the two screws 27 are fitted into the two screw holes 14, respectively. The three through holes 15 are formed at positions corresponding to the vertices of a virtual equilateral triangle centered on the opening 13. The shafts of the three screws 19 are inserted into the three through holes 15, respectively. Further, three cylindrical protrusions 16 (see FIG. 8) are formed to protrude from the back surface 11b of the base portion 11. Each columnar protrusion 16 is formed at a position rotated about 30 degrees from each through-hole 15 around the opening 13. Each of the three columnar protrusions 16 is formed with a screw hole 16a into which the shaft portions of the three screws 74 are fitted.

  In the instrument main body 1, each screw hole 14, each through hole 15, and each columnar protrusion 16 are formed inside the vertical projection region of the side wall portion 12 in the base portion 11. Thereby, the LED lighting device 100 is configured such that the screw holes 14, the through holes 15, and the columnar protrusions 16 are not visible from the outside.

  Moreover, the instrument main body 1 is integrally provided with an annular rib 11ac (see FIGS. 4, 7, and 10) that protrudes from the peripheral portion of the surface 11 a of the base portion 11 in the thickness direction of the base portion 11. The inner diameter of the rib 11ac is slightly larger than the outer diameter of the mounting substrate 21 in the LED module 2. The rib 11ac has a function of positioning the LED module 2 in a plane parallel to the surface 11a of the base portion 11.

  The instrument body 1 is formed with an annular outer flange portion 12 d that protrudes outward from the outer peripheral surface 12 b of the side wall portion 12 over the entire circumference. The outer flange portion 12 d is formed to protrude outward from the center portion of the side wall portion 12 in the direction along the thickness direction of the base portion 11.

  The LED lighting apparatus 100 can be configured such that a plate-like heat insulating member 18 is disposed on the back surface 11 b of the base portion 11 inside the side wall portion 12. The heat insulating member 18 suppresses heat transfer between the power supply module 6 and the base part 11. As a material of the heat insulating member 18, for example, a fiber heat insulating material or a foam heat insulating material can be employed. Examples of the fiber-based heat insulating material include glass wool and ceramic fiber. Examples of the foam heat insulating material include phenolic foam and urethane foam.

  The heat insulating member 18 is arranged so as to cover the back surface 11b of the base part 11 inside the side wall part 12, but in a shape that can expose each through hole 15 and each columnar protrusion 16 of the base part 11. Preferably it is formed. For this reason, the heat insulating member 18 has a regular hexagonal outer peripheral shape, but may have a shape other than a regular hexagonal shape. The heat insulating member 18 is formed of a material having electrical insulation, and can also serve to ensure electrical insulation between the base portion 11 and the power supply module 6.

  The mounting substrate 21 of the LED module 2 is preferably larger than the outer peripheral shape of the vertical projection region on the surface 11 a of the base portion 11 of the side wall portion 12 and smaller than the outer peripheral shape of the base portion 11. For example, the mounting substrate 21 may have a disk shape. When the mounting substrate 21 has a disc shape, it is preferable that the mounting substrate 21 has a diameter larger than the outer diameter of the side wall portion 12 and smaller than the diameter of the base portion 11. Moreover, it is preferable that the mounting substrate 21 is on a straight line with the center line along the thickness direction of the mounting substrate 21 and the center line along the thickness direction of the base 11.

  The mounting substrate 21 is a substrate on which a plurality of LEDs 22 are mounted. “Mounting” is a concept that includes arranging and mechanically connecting the LEDs 22 and electrically connecting them.

  The mounting substrate 21 includes a support formed in a disk shape, and a wiring portion that is supported by the support and to which the plurality of LEDs 22 are electrically connected. The wiring part is formed in a predetermined pattern on the surface of the support. For example, copper, aluminum, gold or the like can be used as the material of the wiring portion. As the mounting substrate 21 has a larger wiring area, it is possible to efficiently dissipate the heat generated by the LED 22 and to efficiently reflect the light emitted from the LED 22 toward the mounting substrate 21. Become. Note that the mounting substrate 21 may have a configuration in which a reflective film that reflects light emitted from the LEDs 22 is provided on a support, separately from the wiring portion.

  The support body has a function of supporting the wiring portion. The support preferably has a function as a heat sink for efficiently transferring the heat generated by each LED 22 to the outside. The support is preferably made of a material having high thermal conductivity from the viewpoint of improving heat dissipation.

  The support can be constituted by, for example, a resin substrate. In this case, for example, the support is preferably formed of a resin substrate having a thermal conductivity of 1 W / m · K or more. Examples of the material of such a resin substrate include glass cloth / glass nonwoven fabric base epoxy resin formed so as to have a thermal conductivity of 1 W / m · K or more. As a material for such a resin substrate, for example, CEM-3 (Composite epoxy material-3) formed so as to have a thermal conductivity of 1 W / m · K or more can be employed. In this case, as the mounting substrate 21, for example, R-1787 (product number) of high thermal conductive glass composite substrate material “ECOOL (registered trademark)” manufactured by Panasonic Corporation can be used.

  The support may be composed of, for example, an alumina ceramic substrate, an aluminum nitride substrate, a silicon carbide substrate, or the like. The support may have a configuration in which an electrical insulating layer made of an appropriate material is formed on the surface of a metal plate, for example.

The mounting substrate 21 can be configured to include a white resist layer. The resist layer preferably covers a portion of the support where a wiring portion is not formed on the surface side where the wiring portion is formed. As a material for the resist layer, for example, a white resist can be employed. Examples of the white resist include a resin containing a white pigment. Examples of the white pigment include barium sulfate (BaSO ₄ ) and titanium dioxide (TiO ₂ ). Examples of the resin include a silicone resin. As the white resist, for example, “ASA COLOR (registered trademark) RESIST INK”, which is a white resist material made of silicone manufactured by Asahi Rubber Co., Ltd., can be used. The resist layer can be formed by, for example, a coating method.

  Since the LED module 2 includes the white resist layer, the light emitted from the LED 22 and incident on the mounting substrate 21 is easily reflected on the surface of the resist layer. Thereby, the LED module 2 can suppress the light emitted from the LED 22 from being absorbed by the mounting substrate 21. Therefore, the LED module 20 can improve the light output by improving the light extraction efficiency to the outside.

  In the mounting substrate 21, an opening 24 that communicates with the opening 13 of the base 11 is formed in the center of the mounting substrate 21. In addition, the mounting substrate 21 has through holes 25 formed at positions corresponding to the screw holes 14 of the base portion 11, and through holes at positions corresponding to the through holes 15 of the base portion 11. 26 is formed.

  The mounting substrate 21 has a front surface 21a and a back surface 21b. In the LED module 2, a plurality of LEDs 22 are arranged on the surface 21 a side of the mounting substrate 21. In addition, the LED module 2 is preferably mounted with the third connector 23 on the surface 21 a side of the mounting substrate 21. The third connector 23 of the LED module 2 is electrically connected to the second connector 67 of the power supply module 6 via the lead wire 63. One end of the lead wire 63 is connected to a fourth connector (not shown) connected to the second connector 67 and the other end is connected to a third connector 23 (not shown). Connected). The LED lighting apparatus 100 may have a configuration in which the other end portion of the lead wire 63 is soldered to the mounting substrate 21 without providing the third connector 23 in the LED module 2.

  The LED 22 is composed of a surface mount type white LED in which one LED chip (LED chip) is accommodated in one package. However, the present invention is not limited to this, and for example, a surface in which a plurality of LED chips are accommodated in one package. A mounting type white LED may be used.

  In the LED module 2, a plurality of LEDs 22 are arranged on the periphery of the surface 21 a of the mounting substrate 21 so as to be positioned outside the vertical projection region of the side wall portion 12 of the instrument body 1 on the surface 21 a of the mounting substrate 21. is there.

  In the LED module 2, it is preferable that the plurality of LEDs 22 be arranged on one imaginary line along the outer periphery of the mounting substrate 21, for example, on the surface 21 a of the mounting substrate 21. The virtual line is the outer periphery of the virtual circle. Moreover, it is preferable that the LED module 2 has a plurality of LEDs 22 arranged at equal intervals.

  The LED module 2 includes a load circuit 20 (see FIG. 12) including an LED 22. The load circuit 20 is a series circuit in which a plurality of LEDs 22 are connected in series. The load circuit 20 of the LED module 2 is not limited to a series circuit in which a plurality of LEDs 22 are connected in series, but may be a parallel circuit in which a plurality of LEDs 22 are connected in parallel or a series-parallel circuit in which a plurality of LEDs 22 are connected in series and parallel.

  As shown in FIGS. 7, 8 and 10, the reflector 3 is disposed on the surface 21 a side of the mounting substrate 21. The reflector 3 is configured to have a function of reflecting light emitted from the LEDs 22 to the side toward the light guide plate 4 and a function of reflecting light guided in the light guide plate 4.

  Specifically, the reflecting plate 3 is formed in a flat plate shape. The reflector 3 has a circular outer periphery. The diameter of the reflecting plate 3 is set smaller than the diameter of the base portion 11 and larger than the diameter of the mounting substrate 21. The reflector 3 is formed with a recess 33 that is recessed toward the mounting substrate 21 over the entire circumference of the periphery, and a plurality of window holes 32 that expose the LEDs 22 one by one are formed in the recess 33. Has been. As shown in FIG. 10, in the reflecting plate 3, the recessed portion 33 is in contact with the surface 21 a of the mounting substrate 21, and the inner peripheral surface of each window hole 32 surrounds each LED 22. Thereby, the LED lighting fixture 100 can suppress that the light radiated | emitted from each LED22 each enters between the LED module 2 and the reflecting plate 3, and becomes a loss.

  The reflector 3 has a circular hole 31 formed in the center of the reflector 3. A cylindrical protrusion 43 (see FIG. 8) of the light guide plate 4 is inserted into the hole 31 of the reflection plate 3. In addition, the reflective plate 3 has six through holes 34 formed in a portion outside the recess 33. The six through holes 34 are formed at positions corresponding to the vertices of a virtual regular hexagon centering on the hole 31. In short, the six through holes 34 are formed at equal intervals in the outer peripheral direction of the reflecting plate 3. Six columnar projections 51 (see FIG. 8) formed in the cover 5 are respectively inserted into the six through holes 34.

  In addition, three columnar protrusions 35, three columnar protrusions 36, and six raised portions 37 are formed to protrude on the surface of the reflection plate 3 facing the mounting substrate 21. The six projecting portions 35 surround the hole 31 and are formed at positions corresponding to the opening ends of the opening 24 of the mounting substrate 21. Each columnar protrusion 36 is formed at each position corresponding to each through hole 15 of the base portion 11. Each of the three columnar protrusions 36 is formed with a screw hole 36a into which the shaft portions of the three screws 19 are fitted. Each raised portion 37 is formed in an arc shape between the through holes 34 adjacent to each other in the outer peripheral direction of the reflecting plate 3. As shown in FIG. 10, the tip surface of each raised portion 37 abuts the reflecting plate 3 on the outer peripheral end of the surface 21 a of the mounting substrate 21 in the LED module 2.

  The material of the reflector 3 is preferably a material having a high reflectance with respect to the light emitted from the LED 22. As a material of the reflector 3, for example, a white polycarbonate resin, a white nylon resin, a white polybutylene terephthalate resin, a foamed polybutylene terephthalate resin, or the like can be used.

  Light emitted from each LED 22 of the LED module 2 enters the light guide plate 4 through each window hole 32 in which each LED 22 is accommodated.

  As a material of the light guide plate 4, for example, it is preferable to employ a translucent material such as an acrylic resin, a polycarbonate resin, a polystyrene resin, or glass.

  The light guide plate 4 is configured so that the light from the LED module 2 is guided inside the light guide plate 4 and uniformly emitted to the outside. Specifically, as shown in FIGS. 7, 8 and 10, the light guide plate 4 is formed in a flat plate shape, includes a first main surface 40 a and a second main surface 40 b, and includes a first main surface. 40a is arranged on the LED module 2 side, and the second main surface 40b is arranged on the cover 5 side. The light guide plate 4 guides the light from the LED module 2 so as to be uniformly emitted from the second main surface 40b. The light guide plate 4 reflects or scatters light from the LED module 2.

  The light guide plate 4 is formed in substantially the same size as the reflector 3. The outer peripheral shape of the light guide plate 4 is circular. The size of the light guide plate 4 is preferably the same size as the reflection plate 3.

  The light guide plate 4 includes a recess 41 that is recessed toward the LED module 2 at a position corresponding to the outer circumference of the virtual circle in which the plurality of LEDs 22 are arranged. In the light guide plate 4, one light incident surface 41 a on which light from the LEDs 22 is incident is formed at each position facing the LEDs 22 in the recessed portion 41. In the light guide plate 4, a portion where the light incident surface 41 a is not formed in the recessed portion 41 abuts on the recessed portion 33 of the reflecting plate 3.

  In addition, the light guide plate 4 is formed with one through hole 42 at each position corresponding to each through hole 34 of the reflecting plate 3. Further, the light guide plate 4 has a protrusion 43 formed at the center of the first main surface 40a.

  Since the LED lighting apparatus 100 includes the light guide plate 4, the illuminance unevenness is reduced even though the plurality of LEDs 22 are arranged only outside the vertical projection region of the side wall portion 12 on the surface 21 a of the mounting substrate 21. It becomes possible. Moreover, since the reflecting plate 3 is arrange | positioned at the 1st main surface 40a side of the light-guide plate 4 in the LED lighting fixture 100, the light radiated | emitted from each LED22 from the 2nd main surface 40b of the light-guide plate 4 efficiently. The light can be emitted. The light emitted from the second main surface 40b of the light guide plate 4 passes through the cover 5 and is emitted to the outside.

  The cover 5 is formed in a dome shape. The cover 5 is made of a light transmissive material. As the translucent material of the cover 5, for example, a silicone resin, an acrylic resin, a polycarbonate resin, glass, or the like can be employed. For example, the LED lighting apparatus 100 can further suppress uneven illuminance by performing a light diffusion process on the cover 5. In the cover 5, one protrusion 51 is formed at each position corresponding to each through hole 34 of the reflection plate 3 on the surface of the light guide plate 4. The cover 5 has a circular outer peripheral shape of the opening edge on the base part 11 side. The outer diameter of the cover 5 is substantially the same as the diameter of the base part 11.

  The LED lighting apparatus 100 includes a packing 52 (see FIG. 10) interposed between the peripheral portion of the cover 5 and the annular rib 11ac (see FIGS. 4, 7 and 10) of the surface 11a of the base portion 11. Is preferred. The packing 52 is formed in an annular shape. The packing 52 preferably has stretchability and water repellency. As a material of the packing 52, for example, silicone or the like can be used.

  The LED lighting apparatus 100 can improve the adhesion between the apparatus main body 1 and the cover 5 by including the packing 52. As a result, the LED lighting apparatus 100 can prevent foreign matter such as dust and insects from entering the inside of the cover 5 and intrusion of moisture such as water droplets.

  The circuit board 61 of the power supply module 6 is formed in a disk shape. The diameter of the circuit board 61 is smaller than the inner diameter of the side wall portion 12 of the instrument body 1. The circuit board 61 can be formed of a printed board.

  The circuit board 61 is formed with a first cutout portion 61c and a second cutout portion 61d in which a part of the peripheral portion thereof is cut out linearly. In other words, the circuit board 61 is formed in a shape in which a region outside the two chords parallel to each other without passing through the center of the virtual circle is eliminated from the virtual circle. The area outside the string means an area surrounded by a string and an arc connecting both ends of the string. In the circuit board 61, the lengths of the two strings are different. A relatively long string corresponds to the first notch 61c, and a relatively short string corresponds to the second notch 61d. In the LED lighting apparatus 100, since the first cutout portion 61c and the second cutout portion 61d are formed on the circuit board 61, the circuit board 61 is circular when the circuit board 61 is cut out from a multi-piece printed board. Compared to the case, the cost can be reduced by improving the material yield. Further, in the LED lighting device 100, since the first cutout portion 61c and the second cutout portion 61d are formed on the circuit board 61, handling, positioning, and the like of the circuit board 61 are facilitated during assembly.

  The first connector 64 includes two first contacts 65 and a first contact holding portion 66 that holds the two first contacts 65. In the first connector 64, each first contact 65 is made of a conductive material, and the first contact holding portion 66 is made of an electrically insulating material. As the conductive material of the first contact 65, for example, copper, nickel or the like can be employed. As the electrically insulating material of the first contact holding portion 66, for example, an electrically insulating resin, an electrically insulating ceramic, or the like can be used.

  The first contact holding part 66 is formed in a rectangular parallelepiped shape, and is arranged so that the longitudinal direction is parallel to the second surface 61 b of the circuit board 61. Each first contact 65 is formed in a pin shape. Each first contact 65 has a quadrangular cross section perpendicular to the longitudinal direction of the first contact 65, but is not limited thereto, and may be circular. Each first contact 65 passes through the first contact holding portion 66, and a first end close to the circuit board 61 is inserted into a through hole of the circuit board 61 and soldered to a land of the circuit board 61. Has been. Each first contact 65 protrudes from the first contact holding portion 66 at a second end far from the circuit board 61. The first connector 64 may be configured to be surface-mounted on the second surface 61 b of the circuit board 61.

  The second connector 67 is arranged such that one direction along the second surface 61b of the circuit board 61 from the outside of the circuit board 61 is the insertion / extraction direction of the fourth connector.

  The first connector 64 and the second connector 67 are mounted on the circuit board 61.

  The group of electronic components 62 is disposed on the first surface 61 a side and the second surface 61 b side of the circuit board 61. In FIGS. 1 to 3, 5 to 7, 10, and 11, only a part of the group of electronic components 62 is denoted by reference numerals. The power supply circuit 60 (see FIG. 12) of the power supply module 6 will be described later.

  As shown in FIGS. 5 and 6, the back cover 7 has a back wall portion 71 formed in a disk shape and a peripheral wall portion 72 formed in a cylindrical shape. In short, the back cover 7 is formed in a bottomed cylindrical shape.

  The back cover 7 is preferably formed of a resin having electrical insulation. Note that the back cover 7 may be formed of ceramic or the like having electrical insulation. The back cover 7 is preferably formed of a material having high thermal conductivity.

  The back cover 7 is integrally provided with an outer flange portion 75 that protrudes outward from the outer peripheral surface of the peripheral wall portion 72. In the back cover 7, one through hole 78 is formed at each position corresponding to each columnar protrusion 16 of the instrument body 1 in the outer collar portion 75. A plurality of claw portions 77 protruding inward are integrally formed on the peripheral wall portion 72 of the back cover 7. The claw portion 77 is in contact with the outer peripheral edge of the circuit board 61. In addition, the coupling | bonding method of the back cover 7 and the power supply module 6 is not specifically limited.

  Further, the back cover 7 has a notch 72 c formed in a part of the peripheral wall 72. The notch 72c is formed in a size that allows the lead wire 63 and the fourth connector to pass therethrough.

  Further, the back cover 7 has two electric wire insertion holes 73aa formed in the wall portion 73a, and these two electric wire insertion holes 73aa are arranged side by side. The opening shape of the wire insertion hole 73aa is preferably circular. The electric wire insertion hole 73aa is formed in a size that allows the electric wire 103 having a predetermined outer diameter to pass therethrough.

  The terminal block 9 is electrically connected to the second contact 93 by the first contact 65 of the first connector 64 contacting the second contact 93 of the connection terminal 91 inside the connection terminal holding portion 92. . Further, the terminal block 9 can be electrically connected to the connection portion 95 by bringing the electric wire 103 into contact with the connection portion 95 of the connection terminal 91 inside the connection terminal holding portion 92. Therefore, the terminal block 9 can electrically connect the first contact 65 and the electric wire 103 via the connection terminal 91. Note that the electric wire 103 is not a constituent requirement of the LED lighting apparatus 100.

  The electric wire 103 is an insulation coated electric wire. For this reason, the portion of the electric wire 103 to be inserted into the terminal block 9 is previously removed from the electrical insulation covering member so that the core wire 104 is exposed. In FIGS. 1 to 3 and 10, the power cable 102 in which two relatively hard wires 103, 103 are surrounded by a sheath 105 is recessed from the hole 201 (see FIG. 10) of the construction material 200 (see FIG. 10). A state of being introduced into the internal space 73 is illustrated. 3 shows a state where the electric wire 103 is electrically connected to the connection portion 95. The electric wire 103 is an electric wire for distributing power from the AC power source 701 to the LED lighting apparatus 100, for example, on the back of the ceiling or the back of the wall.

  The electric wire 103 is bent along the bottom wall 73b of the concave portion 73 with respect to the electric wire insertion hole 73aa of the wall portion 73a of the concave portion 73 by bending a portion housed in the internal space of the concave portion 73 at an angle of about 90 degrees. The electric wire 103 can be inserted from the direction. The recess 73 also has a function as a storage space for storing a part of each of the two electric wires 103. Further, the bottom wall 73 b of the recess 73 also has a function of preventing the electric wire 103 from hitting the power supply module 6.

  The terminal block 9 has a function of electrically connecting the power supply module 6 and the two electric wires 103. The connection terminal holding portion 92 of the terminal block 9 is made of an electrically insulating material. As the electrically insulating material of the connection terminal holding portion 92, an electrically insulating resin is employed. However, the present invention is not limited to this, and an electrically insulating ceramic or the like can also be employed. The terminal block 9 is provided with two connection terminals 91. The connection terminal 91 is made of a conductive material. The conductive material of the connection terminal 91 is preferably a metal with high conductivity, for example, copper. The connection terminal 91 can be formed by processing a metal plate such as a copper plate, for example.

  The connection terminal holding portion 92 includes a flat plate portion 92a disposed away from the back wall portion 71 and parallel to the back wall portion 71, and a concave portion 92b formed by recessing a portion of the flat plate portion 92a toward the power supply module 6. A planar U-shaped wall portion 92c protruding from the flat plate portion 92a toward the back wall portion 71. The wall portion 92c is located between the two connection terminals 91 and has a function of spatially separating and electrically insulating the two connection terminals 91 from each other. The wall portion 92c also has a function of fixing each connection terminal 91.

  The terminal block 9 has a protrusion 76 (see FIGS. 3 and 10) that protrudes from the back wall 71 of the back cover 7 toward the power supply module 6 inside the wall 92 c and is fixed to the back cover 7. Yes. Thereby, the terminal block 9 has the connection part 95 accommodated between the back wall part 71 of the back cover 7 and the flat plate part 92a.

  In the terminal block 9, two connection holes 96 (see FIG. 5) into which the two first contacts 65 of the first connector 64 are inserted one by one are formed in the bottom wall 92d of the recess 92b. The second contact 93 of each connection terminal 91 is accommodated in the recess 92b.

  The connection terminal 91 includes a second contact 93, a connection part 95, and a connection part 94 that connects the second contact 93 and the connection part 95.

  As shown in FIGS. 1A and 2, the second contact 93 includes a connection piece 93 b and a lock piece 93 a. The connection piece 93b is formed in an L shape, and includes a vertical piece 93ba standing on the bottom wall 92d of the recess 92b and a horizontal piece 93bb arranged along the bottom wall 92d of the recess 92b. In the horizontal piece 93bb, an opening portion 93bc penetrating in the thickness direction of the horizontal piece 93bb is formed. The lock piece 93a is connected to the peripheral portion of the opening 93bc at the end of the horizontal piece 93bb on the side far from the vertical piece 93ba, and faces the vertical piece 93ba of the connection piece 93b. The lock piece 93a is inclined so that the distance from the vertical piece 93ba in the thickness direction of the vertical piece 93ba becomes shorter as the distance from the horizontal piece 93bb in the thickness direction of the horizontal piece 93bb is increased. In the state where the first contact 65 is not inserted, the second contact 93 is such that the distance between the vertical piece 93ba in the thickness direction of the vertical piece 93ba and the tip of the lock piece 93a is the vertical piece 93ba of the first contact 65. It is shorter than the dimension in the direction along the thickness direction. The lock piece 93a constitutes a leaf spring.

  When connecting the first contact 65 and the second contact 93, when the first contact 65 is inserted into the connection hole 96 of the terminal block 9, the first contact 65 passes through the opening 93 bc of the horizontal piece 93 bb and the locking piece. 93 a is pushed up, and the tip of the lock piece 93 a is elastically contacted with the side surface of the first contact 65. Thus, in the LED lighting apparatus 100, the first contact 65 is sandwiched between the vertical piece 93ba and the lock piece 93a, and the first contact 65 and the second contact 93 are electrically connected and mechanically connected. Is done. In the first connector 64, the first contact holding portion 66 hits the bottom wall 92 d of the recess 92 b of the terminal block 9.

  Since the LED lighting fixture 100 does not need to connect the first connector 64 and the terminal block 9 using lead wires or the like, the LED lighting fixture 100 can be thinned.

  Moreover, the connection part 95 of the connection terminal 91 is provided with the connection piece 95b and the lock piece 95a, as shown in FIG.1 (b) and 3. FIG.

  In the connection portion 95, the distance between the connection piece 95b and the tip of the lock piece 95a is shorter than the outer diameter of the core wire 104 in a state where the core wire 104 of the electric wire 103 is not inserted, and the electric wire insertion of the wall portion 73a When the connection portion 95 is viewed from the front through the hole 73aa, the connection piece 95b and the lock piece 95a can be seen.

  When connecting the connection portion 95 and the electric wire 103, when the core wire 104 of the electric wire 103 is inserted into the electric wire insertion hole 73aa of the wall portion 73a, the core wire 104 increases the distance between the connection piece 95b and the lock piece 95a. Thus, the connecting piece 95b is inserted between the locking piece 95a, and the tip of the locking piece 95a makes elastic contact with the side surface of the core wire 104. Thereby, as for LED lighting fixture 100, the core wire 104 is clamped between the connection piece 95b and the lock piece 95a, and the connection part 95 and the electric wire 103 are electrically connected and mechanically connected.

  The mounting member 8 includes a flat mounting base 80a and a side portion 80b provided to protrude from the outer peripheral edge of the mounting base 80a toward the base portion 11 side. The attachment member 8 is preferably made of metal. As the metal that is the material of the mounting member 8, for example, aluminum, iron, stainless steel, or the like can be employed. Note that the attachment member 8 is not limited to metal, and may be formed of resin or ceramic. The mounting member 8 is preferably made of a material having high thermal conductivity.

  The mounting base 80a has a circular outer peripheral shape. Moreover, the side part 80b is formed in the cylindrical shape. Therefore, the attachment member 8 is formed into a bottomed cylindrical shape in which the attachment base 80a and the side portion 80b are combined.

  The attachment member 8 has an opening 81 that penetrates in the thickness direction of the attachment base 80a at the center of the attachment base 80a. The opening 81 has a function as an electric wire insertion hole through which the two electric wires 103 are passed. The opening shape of the opening 81 is preferably circular. Further, the attachment member 8 has two through holes 82 formed in the attachment base 80a. The two through holes 82 are formed at positions that are separated from the opening 81 and sandwich the opening 81 in one radial direction of the mounting base 80a. Further, the attachment member 8 is formed with an annular inner collar portion 83 that protrudes inward over the entire circumference of the inner circumferential surface of the side portion 80b. The inner collar portion 83 is formed on the inner peripheral surface of the side portion 80b near the middle in the axial direction of the side portion 80b. The inner diameter of the attachment member 8 is larger than the outer diameter of the side wall portion 12 of the instrument body 1. As shown in FIG. 10, the attachment member 8 has an inner flange portion 83 coupled to an outer flange portion 12 d formed on the outer peripheral surface of the side wall portion 12 of the instrument body 1. As a method of coupling the inner flange portion 83 and the outer flange portion 12d, for example, either or both of the side wall portion 12 and the attachment member 8 may be elastically deformed, or the inner flange portion 83 and the outer flange portion 12d One of these may be formed into a male screw shape, and the other may be formed into a female screw shape and fitted together.

  The attachment member 8 can be directly attached to the construction material 200 by passing the screw 84 through each of the two through holes 82 formed in the attachment base 80a and fixing the screw 84 to the construction material 200 such as a ceiling material. . As the screw 84, for example, a wood screw can be used.

  The LED lighting apparatus 100 can be assembled by the following assembly method, for example.

  In the method for assembling the LED lighting apparatus 100, the first step, the second step, the third step, the fourth step, the fifth step, the sixth step, and the seventh step are sequentially performed.

  First, in the first step, the LED module 2 is loaded on the surface 11 a of the base part 11, and the screw 27 inserted into the through hole 25 from the LED module 2 side is screwed into the screw hole 14 of the base part 11. To do. In the method for assembling the LED lighting apparatus 100, the LED module 2 is fixed to the base portion 11 by performing the first step.

  Next, in the second step, the heat insulating member 18 is placed on the back surface 11 b of the base portion 11, and the fifth of the lead wires 63 led out from the fourth connector connected to the second connector 67 of the power supply module 6. The connectors are inserted in the order of the opening 18 a of the heat insulating member 18, the opening 13 of the base 11, and the opening 24 of the mounting substrate 21, and are connected to the third connector 23 of the LED module 2. In the method for assembling the LED lighting apparatus 100, the LED module 2 and the power supply module 6 are electrically connected by performing the second step.

  Next, in a third step, the protrusion 51 of the cover 5 is inserted from the light guide plate 4 side with the recess 41 and the protrusion 43 of the light guide plate 4 inserted into the recess 33 and the hole 31 of the reflector 3 respectively. These are inserted into the through holes 42 of the light guide plate 4 and the through holes 34 of the reflection plate 3. In the fourth step, the tip of the protrusion 51 protruding from the through hole 34 of the reflector 3 is plastically deformed into a shape that does not come out of the through hole 34 by laser light or the like. In the method for assembling the LED lighting apparatus 100, the reflection plate 3 and the light guide plate 4 are fixed inside the cover 5 by performing the third step and the fourth step. In addition, the light guide plate 4 can be rotated with respect to the reflection plate 3 in a state where the reflection plate 3 is combined by the depression 41 and the protrusion 43 inserted into the reflection plate 3. Therefore, in the third step, it is easy to align the through hole 34 and the through hole 42 when the protrusion 51 of the cover 5 is inserted into the through hole 42 of the light guide plate 4 and the through hole 34 of the reflection plate 3. Moreover, the reflecting plate 3 has a protrusion 35 at a position along the end of the opening 24 of the mounting substrate 21, and can be rotated with respect to the LED module 2 in a state combined with the LED module 2. . For this reason, it is easy to align the through hole 15 of the base part 11 and the through hole 26 of the mounting substrate 21 with the columnar protrusion 36 of the reflecting plate 3.

  Next, in the fifth step, the LED module 2 is pressed against the base part 11 by the raised part 37 of the reflector 3, and the through hole 15 and the mounting of the base part 11 from the back surface 11 b side of the base part 11 are mounted. The screw 19 inserted into the through hole 26 of the substrate 21 is screwed into the columnar protrusion 36 of the reflecting plate 3. In the method of assembling the LED lighting device 100, the reflector 3, the light guide plate 4, and the cover 5 are fixed to the device body 1 by performing the fifth step. In the method for assembling the LED lighting apparatus 100, the opening edge of the cover 5 is brought into close contact with a portion of the surface 11 a of the base 11 that is not covered with the LED module 2 by performing the fifth step. The reflection plate 3 and the light guide plate 4 are covered with the cover 5 and the instrument body 1.

  Next, in the sixth step, the back on which the terminal block 9 is fixed in advance so that the first contacts 65 of the first connector 64 are inserted into the second contacts 93 of the terminal block 9 and electrically connected thereto. The cover 7 is disposed on the back surface 11 b side of the base portion 11 of the instrument body 1.

  Next, in the seventh step, the shaft portion of the screw 74 is fitted into the screw hole 16 a of the columnar protrusion 16 of the instrument body 1 through the through hole 78 of the back cover 7. In the method for assembling the LED lighting apparatus 100, the back cover 7 is fixed to the apparatus main body 1 by performing the seventh step, and the LED lighting apparatus 100 is completed. The LED lighting apparatus 100 can be installed by using the attachment member 8 so as to be exposed from the construction surface of the construction material 200 such as a ceiling material.

  Since the LED module 2 and the power supply module 6 are held in the apparatus main body 1, the LED lighting apparatus 100 is constructed in comparison with the LED lighting apparatus in which the LED module 2 and the power supply module 6 are housed in separate housings. Is easy. Moreover, the LED lighting apparatus 100 can reduce the occupied space accompanying installation, and can be easily constructed even in a building or the like in which a heat insulating material or a reinforcing material is laid on the back side of the construction material 200.

  By the way, in the LED lighting apparatus 100, the LED module 2 and the power supply module 6 are main heat sources.

  However, in the LED lighting device 100, the power supply module 6 is disposed inside the side wall portion 12 on the back surface 11 b side of the base portion 11 of the device body 1, while the plurality of LEDs 22 of the LED module 2 are provided on the base portion. 11 on the surface 11a side of the mounting substrate 21 and located outside the vertical projection region of the side wall portion 12 on the surface 21a of the mounting substrate 21.

  Therefore, the LED lighting device 100 includes not only a direction in which the internal space surrounded by the base portion 11 and the side wall portion 12 in the device main body 1 and the side wall portion 12 and each LED 22 is parallel to the base portion 11 but also the base portion 11. It is not close in the direction orthogonal to. Thereby, the LED lighting apparatus 100 can prevent the heat generated by each LED 22 from being directly transmitted to the internal space, and can prevent the heat generated by the power supply module 6 from being directly transmitted to each LED 22. It becomes possible. The direction orthogonal to the base part 11 is the same as the thickness direction of the base part 11.

  In the LED lighting apparatus 100, each LED 22 is adjacent to the external space via the base part 11 in the direction orthogonal to the base part 11. Further, the internal space of the instrument body 1 is adjacent to the external space via the side wall portion 12. Therefore, in the LED lighting apparatus 100, the heat generated in each LED 22 is easily transferred to the external space side through the base portion 11, and the heat generated in the power supply module 6 is on the external space side through the side wall portion 12. It is easy to be transferred to. Therefore, the LED lighting apparatus 100 is unlikely to transmit heat indirectly between each LED 22 of the LED module 2 and the power supply module 6.

  As described above, in the LED lighting apparatus 100, heat is not directly transmitted between each LED 22 and the power supply module 6, and is not easily transmitted indirectly. Therefore, in the LED lighting device 100, heat is not easily transmitted between each LED 22 and the power supply module 6, and a temperature increase of each LED 22 and the power supply module 6 can be suppressed.

  When the LED lighting apparatus 100 is installed on the construction material 200, an external space is formed between the peripheral portion of the back surface 11 b of the base portion 11 and the construction material 200, and is generated in each of the LED module 2 and the power supply module 6. It is possible to efficiently dissipate the generated heat to the external space.

  In the LED lighting apparatus 100, each LED 22 and the internal space in which the power supply module 6 is housed are thermally separated, so that the volume of the space surrounded by the back cover 7 and the base 11 is reduced. It is also possible to suppress the temperature of the power supply module 6 from rising excessively. Therefore, the LED lighting apparatus 100 can be further reduced in thickness.

  And in the LED lighting fixture 100, it becomes possible to aim at thickness reduction of the LED lighting fixture 100 whole by thickness reduction of the power supply module 6. FIG.

  Hereinafter, the power supply circuit 60 of the power supply module 6 and the group of electronic components 62 will be further described.

  The power supply circuit 60 can be configured to include a power conversion circuit 602 as shown in FIG. 12, for example. The power conversion circuit 602 is a circuit of a power conversion circuit 602 that converts AC power input from the first connector 64 into DC power, and supplies DC power to the load circuit 20.

  The power conversion circuit 602 includes a rectifier circuit 621, a smoothing capacitor C1, a resonance capacitor C2, a first switching element Q1 composed of a MOSFET, a second switching element Q2 composed of a MOSFET, a transformer T1, a first control circuit 627, and a rectifying circuit. A diode D3, a resonance inductor L2, and the like are provided. The power conversion circuit 602 includes resistors R16, R17, R19, R21, R22, capacitors C11, C12, C13, and the like.

  The rectifier circuit 621 is a circuit that performs full-wave rectification on the input AC voltage, and is configured by a diode bridge circuit. The rectifier circuit 621 is composed of one full-wave rectifier. In FIG. 12, the parasitic diode D01 and the parasitic capacitance C01 of the MOSFET constituting the first switching element Q1 are shown. In FIG. 12, a parasitic diode D02 of the MOSFET that constitutes the second switching element Q2 is shown.

  The transformer T1 includes a primary winding N11, a secondary winding N2, a first auxiliary winding N3, and a second auxiliary winding N12. The load circuit 20 is connected in series to a series circuit of the secondary winding N2, transformer D1, and inductor L2 of the transformer T1.

  The first control circuit 627 is a circuit that controls on / off of the first switching element Q1, and can be configured by, for example, a control IC (Integrated Circuit) or the like.

  The first control circuit 627 controls on / off of the first switching element Q1 based on the voltage of the resistor R16 that detects the current flowing through the first switching element Q1, the voltage of the resistor R21 that detects the current flowing through the load circuit 20, and the like. .

  The resistors R17 and R18 and the capacitor C11 constitute a self-excited control circuit that controls the second switching element Q2.

  In the power conversion circuit 602, the subsequent stage of the smoothing capacitor C1 constitutes an active clamp type DC-DC converter.

  The power supply circuit 60 preferably includes an input filter circuit 601 on the input side of the power conversion circuit 602. The input filter circuit 601 is configured by, for example, one noise filter provided with a choke coil.

  By the way, the LED lighting fixture 100 connects the series circuit of the alternating current power supply 701 which consists of commercial power supplies, and the light control device 702 between the two 1st contacts 65 of the 1st connector 64 via a pair of electric wire 103. FIG. Can do. The dimmer 702 includes a bidirectional thyristor connected in series to the AC power source 701. In this case, the power supply circuit 60 preferably has a configuration including a power conversion circuit 602 and a bleeder circuit 603, as shown in FIG. The power conversion circuit 602 is a circuit that converts AC power input from the first connector 64 into DC power, and supplies DC power to the load circuit 20. The bleeder circuit 603 is connected in parallel to the illumination load 600 including the power conversion circuit 602 and the load circuit 20. The bleeder circuit 603 is a circuit that causes a bypass current to flow when the absolute value of the AC voltage input from the first connector 64 is less than a threshold value. The bypass current flows through a closed circuit including the AC power supply 701, the bleeder circuit 603, and the bidirectional thyristor of the dimmer 702 using the AC power supply 701 as a current supply source. Therefore, the LED lighting apparatus 100 can suppress fluctuations in the conduction period of the bidirectional thyristor even if noise is superimposed on the power supply line in the vicinity of the zero cross of the AC voltage of the AC power supply 701. Thereby, the LED lighting fixture 100 can perform light control stably. The load circuit 20 is not limited to a series circuit in which a plurality of LEDs 22 are connected in series, and may be a parallel circuit in which the LEDs 22 are connected in parallel.

  The bleeder circuit 603 includes, for example, two diodes D31 and D32, one third switching element Q3 made of a MOSFET, two resistors R71 and R72, and one Zener diode ZD1. Can do.

  The power supply circuit 60 includes a second control circuit 628 in addition to the first control circuit 627.

  The second control circuit 628 compares the absolute value (hereinafter referred to as “power supply voltage”) of the phase-controlled AC voltage input to the power supply circuit 60 with a threshold value. When the power supply voltage is less than the threshold value, the second control circuit 628 A function of turning on the switching element Q3 is provided. The second control circuit 628 has a function of detecting the conduction angle of the AC voltage subjected to phase control and outputting a dimming signal having a duty ratio corresponding to the detected conduction angle to the first control circuit 627. The first control circuit 627 controls on / off of the first switching element Q1 so that the light output of the load circuit 20 is dimmed based on the dimming signal. The second control circuit 628 can be configured by, for example, a microcomputer.

  The bleeder circuit 603 is configured so that the sum of the gate-source voltage of the third switching element Q3 and the voltage across the series circuit of the two resistors R71 and R72 matches the Zener voltage of the Zener diode ZD1. The bypass current flowing through the switching element Q3 is controlled at a constant current. Note that the bleeder circuit 603 is not particularly limited in circuit configuration.

  The power supply module 6 includes a noise filter, a full-wave rectifier, a capacitor C2, a first switching element Q1, a second switching element Q2, a third switching element Q3, a transformer T1, a control IC, and three diodes other than the smoothing capacitor C1 described above. Each of D3, D31, D32, inductor L2, seven resistors R16, R17, R19, R21, R22, R71, R72, three capacitors C11, C12, C13, Zener diode ZD1, etc. constitute one electronic component 62. ing.

  A smoothing capacitor C1 shown in FIG. 12 is a specific functional element in the power supply circuit 60, and is configured by a combination of a plurality of electronic components 62 in a group of electronic components 62. Specifically, the smoothing capacitor C1 shown in FIG. 12 is configured by a parallel circuit of two capacitors C1a and C1b shown in FIG. In the power supply module 6, each of the two capacitors C1a and C1b constitutes one electronic component 62. As a result, the LED lighting apparatus 100 can further reduce the height of the power supply module 6, and can further distribute the amount of heat generated by a specific functional element to the two electronic components 62. Thus, the temperature rise of each electronic component 62 can be suppressed. The specific functional element is not limited to the smoothing capacitor C1, but may be, for example, a rectifier circuit 621. The rectifier circuit 621 may be configured by a combination of four rectifier diodes instead of a single full-wave rectifier. .

  As described above, the power supply module 6 converts the input AC power into DC power and outputs the group of electronic components 62, the first input connector 64, and the second output output. The connector 67 includes a group of electronic components 62, a circuit board 61 on which the first connector 64 and the second connector 67 are mounted. In the power supply module 6, a first connector 64 and a second connector 67 are disposed on one side (second surface 61 b) side of the circuit board 61. The first connector 64 includes a first contact 65 and a first contact holding portion 66 that holds the first contact 65. The first contact 65 protrudes from the first contact holding portion 66 in the thickness direction of the circuit board 61. And the power supply module 6 arrange | positions the electronic component 62 with a comparatively short height among the group of electronic components 62 in the 1st area | region 68 (refer Fig.11 (a)) including the mounting area | region of the 1st connector 64, A relatively tall electronic component 62 among the group of electronic components 62 is arranged in a second region 69 (see FIG. 11A) other than the first region 68 on the second surface 61b of the circuit board 61. . Thereby, the LED lighting apparatus 100 can be further reduced in thickness.

  In the power supply module 6, a group of electronic components 62 includes a plurality of lead type electronic components and a plurality of chip components. In the power supply module 6, a plurality of lead-type electronic components are arranged on the second surface 61 b side of the circuit board 61, and a plurality of chip components are arranged on both the first surface 61 a and the second surface 61 b of the circuit board 61. It is. In general, the chip component can have a lower protrusion height from the circuit board 61 than the lead type electronic component. Therefore, in the LED lighting apparatus 100, it is possible to reduce the thickness of the LED lighting apparatus 100 compared to the case where lead type electronic components are arranged on both the first surface 61a and the second surface 61b of the circuit board 61. Become. Of the group of electronic components 62, a plurality of chip components may be arranged on at least one of the first surface 61 a and the second surface 61 b of the circuit board 61. The electronic component 62 made of a lead type electronic component includes a package main body 62a and a linear lead terminal 62b. The lead terminal 62b of the electronic component 62 made of a lead type electronic component is inserted into a through hole (not shown) of the circuit board 61.

  The power supply circuit 60 includes a transformer T1 as one of a group of electronic components 62. In this case, in the power supply module 6, it is preferable that the transformer T <b> 1 is arranged away from the first connector 64 and the second connector 67 on the peripheral portion of the second surface 61 b of the circuit board 61. The LED lighting apparatus 100 can be reduced in thickness by disposing the transformer T1, which is a relatively large electronic component 62 of the group of electronic components 62, away from the first connector 64 and the second connector 67. It becomes.

  In the power supply module 6, it is preferable that a plurality of electronic components 62 having a relatively high heat generation temperature among the group of electronic components 62 are distributed and arranged. Thereby, the LED lighting apparatus 100 can suppress the temperature increase of the electronic component 62 due to heat conduction between the adjacent electronic components 62, and can further suppress the temperature increase of the power supply module 6. For example, in the case of the power supply circuit 60 of FIG. 12, the plurality of electronic components 62 having a relatively high heat generation temperature among the group of electronic components 62 include, for example, a first switching element Q1, a second switching element Q2, and a third switching element. Examples include the element Q3, three diodes D3, D31, and D32, an inductor L2, and a transformer T1.

  The power supply module 6 is preferably arranged so that a plurality of electronic components having a relatively high heat generation temperature among the group of electronic components 62 do not face each other in the thickness direction of the circuit board 61. Thereby, the LED lighting device 100 can further suppress the temperature rise of the power supply module 6.

  As described above, the LED lighting apparatus 100 includes the heat insulating member 18 disposed between the power supply module 6 and the base unit 11. Thereby, the LED lighting apparatus 100 can suppress the heat generated in the power supply module 6 from being transmitted to the portion immediately below the power supply module 6 in the base portion 11, and the heat generated in the power supply module 6 can be reduced to each LED 22. It is possible to suppress the transmission to. In addition, the LED lighting apparatus 100 can suppress the heat generated by each LED 22 from being transmitted to the power supply module 6 via the portion directly below the power supply module 6 in the base portion 11. Therefore, the LED lighting apparatus 100 is difficult to transmit heat between each LED 22 and the power supply module 6, and can suppress the temperature rise of each LED 22 and the power supply module 6, thereby improving heat dissipation while achieving a reduction in thickness. It becomes possible to make it.

  Instead of providing the heat insulating member 18, the LED lighting apparatus 100 may be configured such that a cured product of a heat radiating and electrical insulating resin is interposed between the power supply module 6 and the base portion 11. Thereby, the LED lighting fixture 100 can improve heat dissipation and electrical insulation. As the heat radiating and electrically insulating resin, for example, urethane resin or the like can be employed. For example, after the power supply module 6 is disposed on the back surface 11 b side of the base portion 11 of the instrument body 1, the cured resin is surrounded by the circuit board 61, the base portion 11, and the side wall portion 12 of the power supply module 6. It can be formed by filling the space with resin with a dispenser or the like and then curing. The cured product of the resin functions as a heat insulating heat conducting part.

  The LED lighting apparatus 100 may be configured to include a first heat conductive sheet disposed between the power supply module 6 and the base portion 11 instead of providing the heat insulating member 18. Thereby, the LED lighting fixture 100 can improve heat dissipation. As a 1st heat conductive sheet, the sheet | seat which mix | blended the heat conductive filler with resin, such as a silicone resin, an acrylic resin, a polyolefin, etc. can be employ | adopted, for example. As the filler, for example, a ceramic filler or a metal filler can be employed. By adopting a ceramic filler as the filler, the first heat conductive sheet can improve electrical insulation as compared with the case where a metal filler is employed. The 1st heat conductive sheet in this specification is the meaning equivalent to a heat-radiation sheet.

  LED lighting fixture 100 can also be set as the structure provided with the 1st electrical insulation sheet arrange | positioned between the power supply module 6 and the 1st heat conductive sheet. Thereby, the LED lighting apparatus 100 can improve the electrical insulation between the power supply module 6 and the apparatus main body 1.

  As shown in FIG. 11 (a), the power supply module 6 includes a plurality of lead-type electronic components in the group of electronic components 62, and the height along the lead-out direction of the linear lead terminal 62b with respect to the outer shape of the package body 62a. It is preferable that the lead-type electronic component whose dimension in the vertical direction is larger than the dimension in each direction orthogonal to the height direction is arranged by bending the lead terminal 62b into an L shape. In short, the lead-type electronic component in which the dimension in the height direction along the lead-out direction of the lead terminal 62b is larger than the dimension in each direction orthogonal to the height direction with respect to the outer shape of the package main body 62a is placed on its side. Is preferred. Thereby, the LED lighting apparatus 100 can be further reduced in thickness.

  The LED lighting apparatus 100 may be configured to include a second heat conductive sheet disposed between the power supply module 6 and the back cover 7. Thereby, the LED lighting apparatus 100 can efficiently transfer the heat generated in the power supply module 6 to the back cover 7 side, and can further suppress the temperature rise of the power supply module 6 and each LED 22. . As the second heat conductive sheet, a sheet formed of the same material as the first heat conductive sheet can be adopted, but a sheet formed of a material different from the first heat conductive sheet may be used. The 2nd heat conductive sheet in this specification is the meaning equivalent to a thermal radiation sheet.

  Moreover, the LED lighting apparatus 100 is good also as a structure provided with the 2nd electrical insulation sheet arrange | positioned between the power supply module 6 and the 2nd heat conductive sheet. Thereby, the LED lighting apparatus 100 can improve the electrical insulation between the power supply module 6 and the back cover 7 when a conductive material such as metal is adopted as the material of the back cover 7. Become.

  By the way, the LED lighting fixture 100 comprises the electric wire accommodating part by the recessed part 73 of the back cover 7, and the terminal block 9. FIG. The LED lighting apparatus 100 can store the electric wire 103 for inputting AC power and connected to the first connection portion in the electric wire storage portion.

  Therefore, the LED lighting apparatus 100 includes the apparatus main body 1, the LED module 2, the power supply module 6, and the electric wire storage unit. The instrument body 1 includes a base part 11 formed in a flat plate shape, and a frame-like side wall part 12 protruding from the back surface 11b of the base part 11 inside the outer periphery of the back surface 11b of the base part 11. . The LED module 2 includes an LED 22 and a mounting substrate 21 on which the LED 22 is mounted. The LED module 2 is disposed on the surface 11 a side of the base portion 11. The power supply module 6 includes a group of electronic components 62 that convert input AC power into DC power and output it to the LED module 2, and a first connection portion that connects a wire for inputting AC power. And a second connection part for outputting DC power to the LED module 2, and a circuit board 61 provided with a group of electronic components 62, a first connection part and a second connection part. The power supply module 6 is disposed inside the side wall portion 12 on the back surface 11 b side of the base portion 11. In the power supply module 6, the first connection portion and the second connection portion are arranged on the second surface 61 b side opposite to the first surface 61 a close to the base portion 11 in the circuit board 61. The power supply module 6 disposes a relatively short electronic component among the group of electronic components 62 in the first region 68 that overlaps the vertical projection region of the electric wire housing portion on the second surface 61b of the circuit substrate 61, Among the group of electronic components 62, the relatively tall electronic component 62 is disposed in the second region 69 other than the first region 68 on the second surface 61 b of 61. Therefore, the LED lighting apparatus 100 can improve heat dissipation and reduce the thickness. Here, the number of LEDs 22 in the LED module 2 is not limited to a plurality and may be one. Moreover, LED2 may be arrange | positioned so that the center part of the base part 11 may overlap. In addition, the LED lighting apparatus 100 is not limited to the case where the first connection portion is configured by the first connector 64, and for example, the first connection portion may be configured by a land or the like to which the electric wire 103 is soldered. A terminal block to which the electric wire 103 is directly connected may be used. In addition, the LED lighting apparatus 100 is not limited to the case where the second connection portion is configured by the second connector 67, and for example, the second connection portion may be configured by a land or the like to which the lead wire 63 is soldered. . Moreover, even if the LED lighting fixture 100 is not provided with the back cover 7 or the terminal block 9, it is the opposite side to the base part 11 side in the power supply module 6 among the space enclosed by the side wall part 12 of the instrument main body 1. FIG. It can be set as the structure which utilizes space as an electric wire accommodating part.

  FIG.13 and FIG.14 is a schematic exploded perspective view of the LED lighting fixture 101 of a 1st modification. The basic configuration of the LED lighting apparatus 101 is substantially the same as that of the LED lighting apparatus 100, and the configuration of the power supply module 6 is different. Regarding the LED lighting fixture 101, the same components as those of the LED lighting fixture 100 are denoted by the same reference numerals as those of the LED lighting fixture 100, and the description thereof is omitted.

  The power supply module 6 in the LED lighting apparatus 101 is arranged by dropping a transformer T1 which is one electronic component 62 of a group of electronic components 62 into a notch 61e formed in the circuit board 61. Thereby, the LED lighting apparatus 101 can be further reduced in thickness.

  Instead of providing the notch 61e, the LED lighting apparatus 101 may be formed by forming a through hole in the circuit board 61 and dropping the transformer T1 that is one electronic component 62 into the through hole.

  The number of notches 61e and through holes formed for dropping the electronic component 62 on the circuit board 61 is not particularly limited, and the number of the electronic components 62 to be dropped is not limited.

  Each figure explained in the above-mentioned embodiment etc. is typical, and the ratio of each size and thickness of each component does not necessarily reflect the actual size ratio. In addition, the materials, numerical values, and the like described in the embodiments and the like are merely preferable examples and are not limited thereto. Furthermore, the present invention can be appropriately modified in configuration without departing from the scope of its technical idea.

  For example, the LED lighting apparatus 100 is not limited to the male connector structure in which the first contact 65 of the first connector 64 protrudes from the first contact holding portion 66, but the first contact 65 is accommodated in the first contact holding portion 66. A female connector structure may be used. In this case, the terminal block 9 may have a pin-like structure in which the second contact 93 protrudes from the connection terminal holding portion 92, for example. In short, it is only necessary that the first connector 64 and the connection terminal 91 are connected so that one of the first contact 65 and the second contact 93 can be inserted into and removed from the other in the thickness direction of the circuit board 61.

  Moreover, the outer peripheral shape of the base part 11 is not limited to a circular shape, and may be, for example, an elliptical shape or a polygonal shape. Moreover, the outer periphery shape and inner periphery shape of the side wall part 12 are not restricted circularly, For example, elliptical shape, polygonal shape, etc. may be sufficient. Further, the side wall portion 12 is not limited to the case where the outer peripheral shape and the inner peripheral shape are similar to each other, and may be different from each other. For example, the side wall 12 may have a circular outer peripheral shape and a regular hexagonal inner peripheral shape. Since it is not necessary to embed the LED lighting device 100 in the construction material 200 such as a ceiling material, the degree of freedom in designing the shape of the device main body 1 is higher than that of the ceiling-mounted LED lighting device.

  Moreover, although LED22 is arrange | positioned on the outer periphery of one virtual circle, LED lighting fixture 100 is not restricted to this. For example, the LED lighting apparatus 100 may be configured on the outer periphery of a plurality of virtual circles having different diameters. Moreover, the LED lighting fixture 100 changes the shape of the fixture main body 1, the reflecting plate 3, the light guide plate 4, the cover 5 and the like as appropriate, and the plurality of LEDs 22 are arranged on the outer periphery of a virtual ellipse, a virtual polygon, or the like. It is good also as a structure.

  The plurality of LEDs 22 are not limited to white LEDs, and may be LEDs that emit light other than white light, for example, or the plurality of LEDs 22 may emit different colors.

  The LED module 2 may employ an LED chip as the LED 22. In this case, the LED chip can be constituted by, for example, a blue LED chip that emits blue light. As the blue LED chip, for example, a gallium nitride blue LED chip can be adopted. When the LED module 2 employs an LED chip as the LED 22, the LED module 2 preferably includes a plurality of sealing portions that cover the plurality of LEDs 22 on the surface 21 a side of the mounting substrate 21. For example, the sealing portion is preferably formed in a hemispherical shape or a semi-elliptical spherical shape. In the LED module 2, when the LED 22 is an LED chip, the sealing portion is preferably formed of a mixture of a translucent material that transmits visible light and a wavelength conversion material. Thereby, the light emitted from the LED module 2 is emitted from the LED 22 and emitted from the sealing portion without being wavelength-converted by the wavelength conversion material, and light emitted from the sealing portion after being wavelength-converted by the wavelength conversion material, Can be mixed color light.

  As the translucent material, for example, a silicone resin, an epoxy resin, an acrylic resin, glass, an organic / inorganic hybrid material, or the like can be used.

The wavelength conversion material preferably contains a yellow phosphor. As the yellow phosphor, for example, a Ce ³⁺ activated YAG (Yttrium Aluminum Garnet) phosphor, Eu ²⁺ activated oxynitride phosphor, or the like can be employed. Examples of the Ce ³⁺ activated YAG phosphor include Y ₃ Al ₅ O ₁₂ : Ce ³⁺ . Examples of Eu ²⁺ activated oxynitride phosphors include SrSi ₂ O ₂ N ₂ : Eu ²⁺ .

  The LED module 2 employs a blue LED chip as the LED 22 and employs a yellow phosphor as the wavelength conversion material, so that the mixed color light can be converted into white light.

The wavelength conversion material may contain, for example, a red phosphor in addition to the yellow phosphor. In short, the wavelength conversion material may include a yellow phosphor and a red phosphor. As the red phosphor, for example, Eu ²⁺ activated nitride phosphor can be employed. Examples of the Eu ²⁺ activated nitride phosphor include (Sr, Ca) AlSiN ₃ : Eu ²⁺ and CaAlSiN ₃ : Eu ²⁺ .

  Further, the heat insulating member 18 is not particularly limited in thickness, area, shape and the like. Further, the heat insulating member 18 is not limited to the material exemplified in the embodiment and the like, and other materials can also be adopted.

  Moreover, a 1st heat conductive sheet and a 2nd heat conductive sheet do not specifically limit thickness, an area, a shape, etc. In addition, the first heat conductive sheet and the second heat conductive sheet are not limited to the materials exemplified in the embodiments and the like, and other materials may be employed.

  Moreover, a heat dissipation sheet does not specifically limit thickness, an area, a shape, etc. In addition, the heat dissipation sheet is not limited to the material exemplified in the embodiment and the like, and other materials can be adopted.

  The heat insulating sheet 18, the first heat conductive sheet, and the heat radiating sheet are not limited to being disposed on the entire surface of the power supply module 6 on the first surface 61 a side of the circuit board 61, but a part ( For example, the electronic component 62 having a relatively high heat generation temperature may be disposed).

  The second heat conductive sheet and the heat radiating sheet are not limited to being disposed on the entire surface of the power supply module 6 on the second surface 61b side of the circuit board 61, but a part of the circuit board 61 on the second surface 61b side (for example, the heat generation temperature May be disposed at a place where the electronic component 62 is relatively high.

  When the heat insulating sheet 18, the first heat conductive sheet, the second heat conductive sheet, and the heat radiating sheet are thinned or disposed on a part of the circuit board 61, the material cost can be reduced. .

DESCRIPTION OF SYMBOLS 1 Appliance main body 2 LED module 6 Power supply module 9 Terminal block 11 Base part 11a Surface 11b Back surface 12 Side wall part 18 Thermal insulation member 21 Mounting board 21a Surface 22 LED
61 Circuit board 61a 1st surface 61b 2nd surface 62 Electronic component 64 1st connector (1st connection part)
65 1st contact 66 1st contact holding part 67 2nd connector (2nd connection part)
68 1st area | region 69 2nd area | region 72 Peripheral wall part 73 Recessed part 73a Wall part 73aa Wire insertion hole 91 Connection terminal 92 Connection terminal holding | maintenance part 93 2nd contact 100 LED lighting fixture 101 LED lighting fixture 103 Electric wire

Claims (16)

An instrument body, an LED module, a power supply module, and an electric wire storage unit;
The instrument body includes a base portion formed in a flat plate shape, and a frame-like side wall portion protruding from the back surface of the base portion inside the outer periphery of the back surface of the base portion,
The LED module includes an LED and a mounting substrate on which the LED is mounted, and is disposed on the surface side of the base portion.
The power supply module is a group of electronic components for a power supply circuit that converts input AC power into DC power and outputs the DC power to the LED module; a first connection unit that connects an electric wire for inputting AC power; and A second connection part for outputting DC power to the LED module; and a circuit board provided with the group of electronic components, the first connection part and the second connection part, It is arranged inside the side wall on the back side,
In the power supply module, the first connection portion and the second connection portion are arranged on the second surface side opposite to the first surface close to the base portion in the circuit board,
A relatively short electronic component of the group of electronic components is disposed in a first region overlapping the vertical projection region of the electric wire housing portion on the second surface of the circuit board, and the second of the circuit board is arranged. A relatively tall electronic component among the group of electronic components is arranged in a second region other than the first region on the surface,
The LED lighting fixture characterized by the above-mentioned. An instrument body, an LED module, a power supply module, a back cover, and a terminal block;
The instrument body is made of metal,
The instrument body includes a base portion formed in a flat plate shape, and a frame-like side wall portion protruding from the back surface of the base portion inside the outer periphery of the back surface of the base portion,
The LED module includes a plurality of LEDs and a mounting board on which the plurality of LEDs are mounted. The LED module is disposed on the surface side of the base part, and from a vertical projection region of the side wall part on the surface of the mounting board. And the plurality of LEDs are arranged outside,
The power supply module is a first connection part that connects a group of electronic components of a power supply circuit that converts input AC power into DC power and outputs the DC power to an electric wire for inputting AC power. 1 connector, a second connector which is a second connection part for outputting DC power to the LED module, the group of electronic components, a circuit board provided with the first connector and the second connector, And is disposed inside the side wall portion on the back side of the base portion,
In the power supply module, the first connector and the second connector are arranged on the second surface side opposite to the first surface close to the base portion in the circuit board,
The first connector includes a first contact and a first contact holding portion that holds the first contact.
The back cover is formed in a back wall portion, a peripheral wall portion projecting from the outer peripheral edge of the back wall portion to the base portion side to surround the power supply module, and a central portion of the back wall portion, and the circuit board. A recess recessed in a direction approaching the second surface,
The terminal block is disposed in a space surrounded by the back wall portion, the wall portion of the recess, and the peripheral wall portion, and includes a connection terminal and a connection terminal holding portion that holds the connection terminal,
The connection terminal includes a second contact electrically connected to the first contact, and a connection portion for connecting an electric wire inserted through an electric wire insertion hole formed in the wall portion,
In the first connector and the connection terminal, one of the first contact and the second contact is inserted and connected to the other in the thickness direction of the circuit board,
The power supply module arranges a relatively short electronic component among the group of electronic components in a first region overlapping the vertical projection region of the terminal block and the recess on the second surface of the circuit board, A relatively tall electronic component among the group of electronic components is disposed in a second region other than the first region on the second surface of the circuit board.
The LED lighting fixture characterized by the above-mentioned. In the power supply module, the group of electronic components includes a plurality of lead-type electronic components and a plurality of chip components,
The plurality of lead-type electronic components are disposed on the second surface side of the circuit board, and the plurality of chip components are disposed on at least one of the first surface and the second surface of the circuit board. is there,
The LED lighting fixture according to claim 1 or 2. The power supply circuit includes a transformer as one of the group of electronic components,
In the power supply module, the transformer is disposed apart from the first connection portion and the second connection portion in a peripheral portion of the second surface of the circuit board.
The LED lighting fixture as described in any one of Claims 1 thru | or 3. The power supply module is arranged by dispersing a plurality of electronic components having a relatively high heat generation temperature among the group of electronic components.
The LED lighting device according to claim 1, wherein the LED lighting device is a light emitting diode. In the power supply module, a specific functional element in the power supply circuit is configured by a combination of a plurality of electronic components in the group of electronic components.
The LED lighting apparatus according to any one of claims 1 to 5, wherein The power supply module is arranged such that a plurality of electronic components having a relatively high heat generation temperature among the group of electronic components are not opposed in the thickness direction of the circuit board.
The LED lighting apparatus according to claim 1, wherein the LED lighting apparatus is a lamp. The LED module includes a load circuit including the LED,
The power supply circuit is connected in parallel to a lighting load including a power conversion circuit that converts AC power input from the first connection portion into DC power, and the power conversion circuit and the load circuit. A bleeder circuit that causes a bypass current to flow when the absolute value of the input AC voltage is less than a threshold value,
The LED lighting apparatus according to claim 1, wherein the LED lighting apparatus is a lamp. A heat insulating member disposed between the power supply module and the base portion;
The LED lighting apparatus according to claim 1, wherein the LED lighting apparatus is a lamp. Between the power supply module and the base portion, a cured product of a resin for heat dissipation and electrical insulation is interposed,
The LED lighting apparatus according to claim 1, wherein the LED lighting apparatus is a lamp. A first heat conductive sheet disposed between the power supply module and the base portion;
The LED lighting apparatus according to claim 1, wherein the LED lighting apparatus is a lamp. A first electrical insulating sheet disposed between the power supply module and the first thermal conductive sheet;
The LED lighting apparatus according to claim 11. Among the plurality of lead-type electronic components in the group of electronic components, the dimension in the height direction along the lead-out direction of the linear lead terminal with respect to the outer shape of the package main body is larger than the dimension in each direction orthogonal to the height direction. Larger lead type electronic components are arranged by bending the lead terminal into an L-shape,
The LED lighting apparatus according to claim 1, wherein the LED lighting apparatus is a lamp. The power supply module is arranged by dropping a plurality of electronic components of the group of electronic components into through holes or notches formed in the circuit board.
The LED lighting apparatus according to claim 1, wherein the LED lighting apparatus is a lamp. A second heat conductive sheet disposed between the power supply module and the back cover;
The LED lighting apparatus according to claim 2. A second electrical insulating sheet disposed between the power supply module and the second heat conductive sheet;
The LED lighting apparatus according to claim 15.

Images