JP2015153920A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus configured so that the conducted members not arranged on the facing surfaces can be conducted, and a conducting member does not deform to protrude from the conducted member at the time of mounting.SOLUTION: A mounting structure of an EMI gasket 1, for conducting a substrate 6 and a mounting sheet metal 5 not arranged on the facing surfaces, is provided. The EMI gasket 1 is held on the substrate 6 and mounting sheet metal 5 while inclining. The EMI gasket 1 is held in a state not protruding from the mounting sheet metal 5, when it is assembled to the EMI gasket 1 of the substrate 6 and mounting sheet metal 5.

Description

  The present invention relates to an electronic device, and more particularly to a mounting structure for a conductive member in the electronic device.

  As countermeasures against static electricity and unnecessary radiation of electronic devices, conduction between sheet metals and substrates is performed by a conductive member called an EMI gasket. FIG. 9 is an internal cross-sectional view of the EMI gasket. The EMI gasket 21 is obtained by winding a conductive cloth 92 around a core 91 of urethane foam, and by contacting a plurality of sheet metals or the like with the conductive cloth 92 portion, the sheet metal is passed through the conductive cloth 92. Connection between each other can be obtained. The EMI gasket has an adhesive portion 2 for being attached and fixed to a member. The adhesive part 2 is, for example, a double-sided tape.

  FIG. 7 shows an example of attaching the EMI gasket. The sheet metal holder 25 attached to the side surface of the component 29 and the substrate 26 are arranged so as to be vertical. Further, the EMI gasket 21 is charged by being sandwiched between the outer cover 23 made of a mold and the side surfaces of the sheet metal holder 25. At this time, the EMI gasket 21 is deformed by being pressed by the holder 25. Therefore, the portion indicated by the Y dimension in the figure protrudes above the sheet metal holder 25.

  The portion of the EMI gasket 21 that protrudes upward from the state shown in FIG. 7 is pressed from the β direction by the ground pattern 28 of the substrate 26. As a result, as shown in FIG. 8, electrical connection between the sheet metal 25 and the ground pattern 28 of the substrate 26 can be achieved via the EMI gasket 21. In addition, when charging an EMI gasket, it is necessary to ensure contact reliability even in consideration of variations in the size of the EMI gasket and assembly errors. Therefore, it is desirable that the Y dimension in FIG. 8, that is, the portion protruding above the EMI gasket 21 to be charged by the substrate 26 is at least 30% with respect to the height in the charge direction of the EMI gasket.

  Patent Document 1 discloses an EMI gasket mounting structure in which only the upper and lower surfaces are conductive and the side surfaces are covered with a non-conductive member such as urethane foam.

JP-A-11-143396

  The EMI gasket functioning as a conducting member may protrude in an unintended direction like the protruding portion 21a of FIG. 8 due to deformation that occurs when charged. At this time, if the electronic component 27 is mounted on the substrate 26, there is a problem that the protruding portion 21a of the EMI gasket comes into contact and short-circuits. In order to solve this problem, a substrate or the like is brought into contact with the upper and lower conductive portions of the EMI gasket disclosed in Patent Document 1, and a urethane foam portion is brought into contact with a portion where it is not desired to short-circuit an electronic component mounted on the substrate. To do.

  However, in the gasket mounting structure disclosed in Patent Document 1, the conductive portion of the EMI gasket is only on the top and bottom surfaces. Therefore, it is possible to conduct only by a method of charging so that the EMI gasket is sandwiched between substrates or the like arranged in parallel on the opposite side. For example, conduction between members having a right-angled arrangement as shown in FIG. Can't do it.

  The present invention provides an electronic device configured such that conductive members that are not arranged to face each other can be conducted with each other, and the conductive member is deformed and does not protrude from the conductive member when attached. Objective.

  An electronic apparatus according to an embodiment of the present invention is an electronic apparatus having a conductive member that conducts a plurality of conductive members, and the first and second conductive members that are not disposed facing each other. A holding member that holds the first conductive member and the conductive member in a state where the conductive member is not protruded from the first conductive member when the first and second conductive members are assembled to the conductive member. Retained.

  According to the present invention, the conductive members that are not disposed facing each other can be made conductive, and the conductive member can be prevented from being deformed and protruding from the conductive member during attachment.

It is a figure which shows the attachment structure of the gasket in the electronic device as Example 1. FIG. It is a figure which shows a state when a sheet metal is assembled | attached to the edge of EMI gasket. It is a figure which shows a state when a board | substrate is assembled | attached to (beta) direction. It is a figure which shows the attachment structure of the gasket in the electronic device as Example 2. FIG. It is a figure which shows a state when a sheet metal is assembled | attached to the edge of EMI gasket. It is a figure which shows the state which assembled | attached the board | substrate to (beta) direction. It is a figure which shows the example of attachment of an EMI gasket. It is a figure which shows the example of attachment of an EMI gasket. It is an internal sectional view of an EMI gasket.

Example 1
FIG. 1 is a diagram illustrating a gasket mounting structure in an electronic apparatus as the first embodiment. The gasket mounting structure shown in FIG. 1 is realized as an internal structure of an electronic device.

  The EMI gasket 1 is a conducting member that conducts conductive members such as sheet metal. In the example shown in FIG. 1, the shape of the EMI gasket 1 is a rectangular parallelepiped. The EMI gasket 1 is obtained by winding a conductive cloth around the core material of urethane foam, and has an adhesive portion 2 having adhesiveness on the side surface for attaching and fixing a member. By bringing a plurality of conductive members such as sheet metal into contact with the surface of the EMI gasket 1 at the same time, conduction between the respective conductive members can be achieved through the EMI gasket 1. The attachment metal plate 5 is a first member to be conducted. The substrate 6 is a second conductive member. As shown in FIG. 1, the attachment sheet metal 5 and the substrate 6 are not disposed facing each other.

  The exterior cover 3 that functions as a holding member that holds the EMI gasket 1 is formed of a mold and is provided with a slope 4. The inclined surface 4 holds the EMI gasket 1 while being inclined with respect to the attachment metal plate 5 and the substrate 6. Hereinafter, the surface of the EMI gasket 1 held by the inclined surface 4 is described as a holding surface. In the present embodiment, the holding surface includes the adhesive portion 2.

  The EMI gasket 1 is fixed in the direction shown in FIG. 1 by sticking the adhesive portion 2 to the inclined surface 4. The attachment sheet metal 5 holds the component 9. An electronic component 7 is mounted on the substrate 6, and a ground portion 8 is provided for bringing the EMI gasket 1 into contact with the substrate 6 for electrical conduction. In the drawing, a side 10 a of the EMI gasket 1 is a first side facing the holding surface of the EMI gasket 1. The side 10b is a second side facing the holding surface of the EMI gasket 1.

  The component 9 is assembled so that the attachment sheet metal 5 contacts the EMI gasket 1 along the α direction. Further, the substrate 6 is assembled so that the ground portion 8 contacts the EMI gasket 1 along the β direction. At this time, the relationship between the direction of the inclined surface 4 and the attachment sheet metal 5 and the ground portion 8 satisfies the following conditions. That is, in this embodiment, the location of the EMI gasket 1 that the mounting sheet metal 5 first contacts becomes the side 10a, and the location of the EMI gasket 1 that the ground portion 8 of the substrate 6 contacts first becomes the side 10b. Is set. Therefore, the angle θ1 formed by the contact surface of the mounting sheet metal 5 with the EMI gasket 1 and the inclined surface 4 is 0 ° <θ1 <90 °. The angle θ2 formed by the contact surface of the substrate 6 with the EMI gasket 1 and the inclined surface 4 is 0 ° <θ2 <90 °.

  FIG. 2 is a diagram illustrating a state when the sheet metal is assembled to the side of the EMI gasket. When the attachment sheet metal 5 is charged to the side 10a (FIG. 1) of the EMI gasket 1, the EMI gasket 1 is compressed and deformed so as to protrude upward. As a result, the side 10b moves to the position 10b '. Comparing the state at this time with the state shown in FIG. 8, spaces 11 a and 11 b are formed on the left and right sides of the side 10 b ′ of the EMI gasket 1 in FIG. 2.

  FIG. 3 shows a state where the substrate 6 is further assembled in the β direction from the state shown in FIG. When the side 10b 'of the EMI gasket 1 is charged to the substrate 6, the EMI gasket 1 protrudes in the left-right direction with respect to the side 10b' as shown by the protruding portions 10c and 10d in the drawing. However, in this embodiment, as shown in FIG. 2, since the spaces 11a and 11b are provided, the EMI gasket 1 does not protrude from the sheet metal 5 to the electronic component 7 side when the substrate 6 is assembled. Retained. As a result, the protruding portion of the EMI gasket 1 can be prevented from short-circuiting with the electronic component 7.

(Example 2)
FIG. 4 is a diagram illustrating a gasket mounting structure in the electronic apparatus as the second embodiment. In Example 2, the slope that is the mounting surface of the EMI gasket 1 is the sheet metal 12. The sheet metal 12 is fixed to the exterior cover 3 with screws 13. Moreover, in order to ensure conduction | electrical_connection between the EMI gasket 1 and the sheet metal 12, the adhesion part 2 has electroconductivity.

  FIG. 5 is a view showing a state when the sheet metal is assembled to the side of the EMI gasket. When the attachment sheet metal 5 is charged to the side 30a of the EMI gasket 1, the EMI gasket 1 is compressed and deformed so as to protrude upward. As a result, the side 30b moves to the position 30b ', and spaces 31a and 31b are formed on the left and right sides of the side 30b' of the EMI gasket 1.

  FIG. 6 shows a state in which the substrate 6 is further assembled in the β direction from the state of FIG. The side 30b 'of the EMI gasket 1 is charged to the substrate 6, and the protruding portions 30c and 30d protrude in the left-right direction around the side 30b'. However, since the spaces 31a and 31b are provided, the EMI gasket 1 does not protrude beyond the sheet metal 5 in the direction opposite to the electronic component 7 side, that is, the assembly direction (α direction) of the attachment sheet metal 5. As a result, the protruding portion of the EMI gasket 1 can be prevented from short-circuiting with the electronic component 7.

  In the second embodiment, the conduction of the three conductive members, that is, the sheet metal 5, the substrate 6, and the sheet metal 12, can be obtained with one EMI gasket 1. Therefore, the assembly workability can be improved and the number of parts can be reduced.

1 EMI gasket 5 Mounting sheet metal 8 Gland

Claims (7)

An electronic device having a conductive member for conducting a plurality of conductive members,
A holding member that holds the conducting member tilted with respect to the first and second conducting members that are not disposed facing each other;
The electronic device is characterized in that the conductive member is held in a state in which it does not protrude from the first conductive member when the first and second conductive members are assembled to the conductive member. The conducting member has a holding surface held by an inclined surface of the holding member,
An angle θ1 formed between a contact surface of the first member to be electrically connected to the conducting member and the inclined surface of the holding member is 0 ° <θ1 <90 °,
2. The angle θ <b> 2 formed by the contact surface of the second member to be electrically connected with the conducting member and the inclined surface of the holding member satisfies 0 ° <θ2 <90 °. Electronic equipment. The conducting member is a rectangular parallelepiped,
The contact surface of the first conductive member is in contact with a first side facing the holding surface of the conductive member;
The electronic device according to claim 2, wherein the contact surface of the second conductive member is in contact with a second side facing the holding surface of the conductive member. The electronic device according to claim 3, wherein the holding surface of the conductive member has adhesiveness. The electronic apparatus according to any one of claims 1 to 4, wherein the inclined surface of the holding member is a conductive member. The electronic device according to claim 5, wherein the holding surface of the conductive member has conductivity. The electronic device according to any one of claims 1 to 6, wherein the first conductive member and / or the second conductive member is a substrate.

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