JP2015132524A - Test apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a test apparatus that discharges heat from a device under test efficiently.SOLUTION: A test apparatus comprises: a first substrate 20 having a test terminal 14 electrically connecting to a device under test 10; a second substrate 22 that has a first surface to which the first substrate is provided and is electrically connected to the first substrate; a first member 26 that is provided on a second surface of the second substrate, which is the opposite side of the first substrate, and has a heat conductivity higher than a heat conductivity of the second substrate; an insulating member 18 that is provided between the first substrate and the second substrate and has a heat conductivity higher than the heat conductivity of the second substrate; and a penetration member 28 that penetrates the second substrate, has a heat conductivity higher than the heat conductivity of the second substrate, and connects the insulating member with the first member.

Description

  The present invention relates to a test apparatus, for example, a test apparatus that electrically tests a device under test.

  As a test method for an electronic device such as an LSI (Large Scale Integrated Circuit), for example, there is a method in which a probe needle such as a probe card is brought into contact with a device under test (DUT: Device Under Test). Further, for example, there is a method of bringing a pin into contact with a packaged device under test.

  It is known to transmit the heat of the probe needle to a metal connecting ring via a heat conducting pin (for example, Patent Document 1). It is known to provide a temperature control mechanism at the extension of the probe (for example, Patent Document 2).

JP-A-11-74321 JP 2003-215162 A

  As electronic devices increase in speed and integration, the amount of heat generated by the devices themselves increases. As a result, the device under test becomes high temperature when testing the device under test.

  The purpose of this test apparatus is to efficiently release heat from the device under test.

  A first base holding a test terminal to be electrically connected to the device under test; an insulating member provided on the first base; a thermal conductivity lower than that of the insulating member provided on the insulating member; Two bases, a first member provided on the second base, having a higher thermal conductivity than the second base, and passing through the second base and having a higher thermal conductivity than the second base, the insulating member And a penetrating member for connecting the first member to the first member.

  According to this test apparatus, heat from the device under test can be efficiently released.

FIG. 1 is a diagram showing a test system. FIG. 2 is a perspective view of the test apparatus according to Example 1 as viewed from above. FIG. 3 is a perspective view of the test apparatus according to Example 1 as viewed from below. FIG. 4 is a cross-sectional view of the test apparatus according to the first embodiment. Fig.5 (a) to FIG.5 (c) is the top view, side view, and sectional drawing which show the example of an insulating sheet. 6 (a) and 6 (b) are cross-sectional views showing the connection between the relay board and the probe card board. Fig.7 (a) and FIG.7 (b) are the top views and sectional drawings which show another example of an insulating sheet. FIGS. 8A and 8B are cross-sectional views showing the connection between the relay board and the probe card board. FIG. 9 is a cross-sectional view showing a test apparatus according to Comparative Example 1. FIG. 10 is a schematic diagram of a test apparatus according to the second embodiment. FIG. 11A to FIG. 11C are cross-sectional views illustrating the test apparatus according to the third embodiment. FIG. 12A to FIG. 12C are diagrams (part 1) illustrating a test apparatus according to the fourth embodiment. FIG. 13A to FIG. 13C are diagrams (part 2) illustrating the test apparatus according to the fourth embodiment. FIG. 14A is a cross-sectional view of the test apparatus according to Example 5, and FIG. 14B is a plan view of the insulating member. FIG. 15 is a schematic diagram of a test apparatus according to the sixth embodiment. FIG. 16 is a cross-sectional view of a test apparatus according to the seventh embodiment.

  Embodiments will be described below with reference to the drawings.

  Example 1 is an example of testing a device under test using a probe needle. FIG. 1 is a diagram showing a test system. As shown in FIG. 1, the test system 116 mainly includes a wafer prober 52 and a test head 58. The wafer prober 52 includes a stage 50. The stage 50 holds the wafer 12. The stage 50 is movable in the XY directions (lateral directions), and aligns the device under test 10 and the probe needle 14 on the wafer 12. The stage 50 is movable in the Z direction (up and down direction). As the stage 50 moves up, the probe needle 14 comes into contact with the device under test 10. As the stage 50 is lowered, the probe needle 14 is separated from the device under test 10.

  The test connection cable 60 connects the tester main body and the test head 58. A performance board 56, a frog unit 54, a probe card board 22, a relay board 20, and a probe needle 14 are attached to the test head 58. The probe needle 14 and the test head 58 are electrically connected via the performance board 56, the frog unit 54, the probe card board 22, and the relay board 20. The size of the device under test 10 is, for example, 1 mm × 1 mm to 30 mm × 30 mm, for example, 20 mm × 20 mm. The probe needles 14 are provided in a matrix shape in a region corresponding to almost the entire surface of the device under test 10, for example, from 100 to tens of thousands. The distance between the tips of the probe needles 14 is, for example, about 100 μm to 500 μm. On the other hand, the distance between the pins of the test head 58 is 1 mm to 10 mm. The performance board 56, the frog unit 54, the probe card board 22, and the relay board 20 are electrically connected to the test head 58 by rearranging the probe needle 14. Also, by replacing the bottom of the probe board substrate 22, different types of devices under test can be tested.

  FIG. 2 is a perspective view of the test apparatus according to Example 1 as viewed from above (+ Z direction). FIG. 3 is a perspective view of the test apparatus according to Example 1 as viewed from below (−Z direction), and is a diagram in which the vicinity of the center of the test apparatus of FIG. 2 is extracted. 4 is a cross-sectional view of the test apparatus according to Example 1, and is a cross-sectional view of FIG. The surface direction of the probe card substrate 22 is defined as the X direction and the Y direction, and the vertical direction of the probe card substrate 22 is defined as the Z direction.

  As shown in FIGS. 2 to 4, the test apparatus 100 mainly includes a relay substrate 20, an insulating member 18, a probe card substrate 22, a reinforcing member 24, a reinforcing member 26, and a cooling device 34. The probe needle 14 is, for example, a probe needle or a pogo pin arranged in a matrix. The needle substrate 16 fixes the probe needle 14. The needle substrate 16 fixes, for example, the probe needle 14 perpendicularly to the wafer 12. The needle substrate 16 maintains the distance between the probe needles 14 and electrically connects the probe needles 14 to the relay substrate 20.

  The relay substrate 20 supports the probe needle 14 via the needle substrate 16. The relay substrate 20 may directly fix the probe needle 14. The metal wiring in the relay substrate 20 electrically connects the probe needle 14 and the connection terminal 40. The relay substrate 20 increases the interval between the probe needles 14 and is electrically connected to the probe card substrate 22 via the connection terminals 40. The relay substrate 20 may be a plurality of probe needles 14 combined into one and electrically connected to the probe card substrate 22. The size of the relay board 20 is, for example, 100 mm × 100 mm, and the thickness is, for example, several mm. The needle substrate 16 and the relay substrate 20 are, for example, ceramic multilayer substrates.

  The probe card substrate 22 is electrically connected to the relay substrate 20 via the connection terminals 40. Terminals 32 are provided on the upper surface of the probe card substrate 22. The terminal 32 is a terminal for electrically connecting to the tester head 58 via the performance board 56 or the like. The metal wiring in the probe card substrate 22 electrically connects the connection terminal 40 and the terminal 32. The probe card substrate 22 is rearranged with the connection terminals 40 and connected to the terminals 32. That is, the distance between the terminals 32 is wider than that of the connection terminals 40. The connection terminal 40 and the terminal 32 mainly contain a metal such as copper, for example. The probe card substrate 22 is an organic material multilayer substrate mainly including a resin such as glass epoxy resin. The size of the probe card substrate 22 is, for example, 200 mm to 500 mm, and the thickness is, for example, several mm.

  An insulating member 18 is provided between the relay board 20 and the probe card board 22. The insulating member 18 is an insulating sheet and is an insulator having a higher thermal conductivity than the probe card substrate 22. As the insulating member 18, for example, a heat dissipation sheet FSB-G manufactured by DENKO can be used. The thickness of the insulating member 18 is, for example, 1 mm to several mm.

  Reinforcing members 24 and 26 are provided so as to sandwich the probe card substrate 22 and the insulating member 18. The reinforcing members 24 and 26 are connected by a penetrating member 28. The reinforcing members 24 and 26 and the penetrating member 28 have higher thermal conductivity than the probe card substrate 22. The reinforcing members 24 and 26 are metal members, such as stainless steel, for example. Since the probe card substrate 22 is an organic material substrate and has low strength, the probe card substrate 22 bends when it is large. The reinforcing members 24 and 26 are stronger than the probe card substrate 22 and reinforce the probe card substrate 22. The penetrating member 28 is, for example, a screw, and fixes the reinforcing members 24 and 26. The penetrating member 28 is a metal screw such as stainless steel. The “connection” in the present specification and claims means not only a case where a plurality of members are in direct contact but also a case where the plurality of members are in contact via another member or the like.

  The reinforcing member 26 is approximately the same size as the probe card substrate 22. Thereby, the reinforcing member 26 can reinforce almost the entire probe card substrate 22. The reinforcing member 26 has a lattice shape. Thereby, it is light and can maintain intensity | strength. Further, the terminal 32 can be provided in the opening of the reinforcing member 26. Terminal 32. It may be provided outside the reinforcing member 26. The reinforcing member 24 is a member for fixing the reinforcing member 26 to the probe card substrate 22, and is provided only near the center of the probe card substrate 22. The reinforcing member 26 may also be provided only near the center of the probe card substrate 22.

  The cooling device 34 is provided on the reinforcing member 26. The cooling device 34 is connected to the reinforcing member 26 and releases heat of the reinforcing member 26.

  Fig.5 (a) to FIG.5 (c) is the top view, side view, and sectional drawing which show the example of an insulating sheet. FIG.5 (c) is AA sectional drawing of Fig.5 (a). As shown in FIGS. 5A to 5C, the insulating member 18 includes a through metal 40c penetrating in the Z direction near the center. The through metal 40c mainly includes, for example, copper or gold. The through metal 40c protrudes from the insulating member 18 up and down. A through hole 42c is formed around the insulating sheet.

  6 (a) and 6 (b) are cross-sectional views showing the connection between the relay board and the probe card board. As shown in FIG. 6A, terminals 40 a are formed on the upper surface of the relay substrate 20. Terminals 40 b are formed on the lower surface of the probe card substrate 22. Terminals 40a and 40b mainly contain a metal such as copper or solder. The terminals 40a and 40b are, for example, LGA (Land Grid Array) or BGA (Ball Grid Array). A through hole 42 b is formed in the probe card substrate 22. A through hole 42 a is formed in the auxiliary member 24. The relay substrate 20, the insulating member 18, and the probe card substrate 22 are aligned so that the terminals 40a, 40b and the through metal 40c overlap.

  As shown in FIG. 6B, the terminals 40a and 40b and the through metal 40c are bonded by pressure bonding or soldering. The connection terminals 40 are formed by the terminals 40a and 40b and the through metal 40c. Thereby, the relay substrate 20 and the probe card substrate 2 are electrically connected by the connection terminal 40 penetrating the insulating member 18. The through holes 42a to 42c communicate with each other.

  Fig.7 (a) and FIG.7 (b) are the top views and sectional drawings which show another example of an insulating sheet. FIG.7 (b) is AA sectional drawing of Fig.7 (a). As shown in FIGS. 7A and 7B, the insulating member 18 includes a through hole 41 that penetrates in the Z direction near the center. Other configurations are the same as those shown in FIGS. 5A to 5C, and a description thereof will be omitted.

  FIGS. 8A and 8B are cross-sectional views showing the connection between the relay board and the probe card board. As shown in FIG. 8A, the terminal 40a is, for example, BGA, and the terminal 40b is, for example, LGA. As shown in FIG. 8B, the terminal 40a is provided in the through hole 41, and the terminals 40a and 40b are joined to form the connection terminal 40. Thereby, the relay substrate 20 and the probe card substrate 2 are electrically connected by the connection terminal 40 penetrating the insulating member 18. Other configurations are the same as those in FIGS. 6A and 6B, and the description thereof is omitted.

  In the insulating member 18 shown in FIGS. 5A to 6B, the relay board 20 can be easily removed from the probe card board 22 by removing the through metal 40c and the terminal 40a or 40b.

  In the example shown in FIGS. 7A to 8B, since the terminals 40a and 40b are directly joined, the heat radiation through the connection terminal 40 is large, and the heat radiation performance can be further improved. Further, since the through hole 41 is formed in the insulating member 18 instead of the through metal 40c, the manufacturing cost can be reduced.

  In order to explain the effect of Example 1, Comparative Example 1 without an insulating sheet will be described. FIG. 9 is a cross-sectional view showing a test apparatus according to Comparative Example 1. As shown in FIG. 9, the test apparatus 120 according to Comparative Example 1 does not include an insulating sheet and a cooling device. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  The heat generated in the device under test 10 is released from the back surface of the device under test 10 through the stage 50 as indicated by an arrow 80. However, the device under test 10 in the wafer 12 generates heat locally. Further, during the test, the device under test 10 rapidly generates heat. For example, even when the temperature of the stage 50 is controlled, if the device under test 10 generates heat locally and / or rapidly, it becomes difficult to make the temperature of the stage 50 follow the temperature of the device under test 10. As described above, it is difficult to sufficiently release the heat of the device under test only by the path indicated by the arrow 80. On the other hand, as indicated by the arrow 82, the heat reaches the relay substrate 20 from the surface of the device under test 10 via the probe needle 14. However, the thermal conductivity of the probe card substrate 22 is low. For this reason, heat accumulates in the relay substrate 20, and the path of the arrow 82 hardly contributes to heat dissipation. As described above, when the heat generated in the device under test 10 cannot be sufficiently released, the device under test 10 becomes high temperature. When the temperature of the device under test 10 exceeds the specified junction temperature, the device under test 10 may cause thermal runaway. As a result, the device under test 10 or the test system may burn out.

  In order to release the heat accumulated in the relay substrate 20, it is conceivable that the probe card substrate 22 is made of a material having high thermal conductivity such as ceramic. However, large ceramic substrates are expensive. In addition, a large ceramic substrate has low dimensional accuracy. For this reason, electrical contact becomes difficult via the connection terminal 40 with the relay substrate 20. In particular, when a large number of probe needles 14 are used, it is difficult to connect the relay board 20 and the probe card board 22 because the distance between the connection terminals 40 is narrow. Thus, when an organic material substrate is used as the probe card substrate 22, the thermal conductivity is low, and heat dissipation through the probe needle 14 becomes difficult.

  As shown in FIG. 4, in Example 1, heat is conducted from the relay substrate 20 to the insulating member 18 as indicated by an arrow 84. As indicated by an arrow 86, heat is conducted in the insulating member 18. As indicated by the arrow 82, heat is conducted through the penetrating member 28. As indicated by the arrow 90, heat is conducted through the reinforcing member 26. As indicated by arrow 92, heat is radiated from the cooling device 34.

  For example, the thermal conductivity of the setamix material is 10 W / m · K or more. In particular, ceramics containing aluminum nitride, aluminum oxide, silicon nitride and / or silicon carbide have high thermal conductivity. The thermal conductivity of a metal such as stainless steel is 10 W / m · K or more. The thermal conductivity of the heat radiation sheet FSB-G is 16 W / m · K. On the other hand, the thermal conductivity of epoxy resin or glass epoxy resin is 0.5 W / m · K or less. As described above, the thermal conductivity of the insulating member 18, the relay substrate 20, the reinforcing members 24 and 26, and the penetrating member 28 is higher than that of the probe card substrate 22. Thereby, the heat from the device under test 10 can be released efficiently. The thermal conductivity of the relay substrate 20, the reinforcing members 24 and 26, and the penetrating member 28 is preferably 10 times or more that of the probe card substrate 22, and more preferably 20 times or more. The thermal conductivity of the relay substrate 20, the reinforcing members 24 and 26, and the penetrating member 28 is preferably 5 W / m · K or more, and more preferably 10 W / m · K or more.

  According to the first embodiment, the relay substrate 20 (first base) holds the probe needle 14 (test terminal) that is electrically connected to the device under test 10. The insulating member 18 is provided on the relay substrate 20. The probe card substrate 22 (second base) is provided on the insulating member 18. The reinforcing member 26 (first member) is provided on the probe card substrate 22. The penetrating member 28 penetrates the probe card substrate 22 and thermally connects the relay substrate 20 and the reinforcing member 26. In such a structure, the insulating member 18, the reinforcing member 26, and the penetrating member 28 have higher thermal conductivity than the probe card substrate 22. As a result, the heat of the device under test 10 can be released as shown in FIG.

  The connection terminal 40 penetrates the insulating member 18 and electrically connects the relay board 20 and the probe card board 22. Thereby, the electrical resistance of the relay board | substrate 20 and the probe card board | substrate 22 can be reduced, maintaining heat dissipation.

  Furthermore, when the relay substrate 20 has a higher thermal conductivity than the probe card substrate 22, heat tends to accumulate on the relay substrate 20 as shown in FIG. Therefore, in this case, it is effective to use the insulating member 18.

  The terminal 40b (first terminal) is provided on the surface of the probe card substrate 22 on the relay substrate 20 side, and the terminal 32 (second terminal) is provided on the surface opposite to the surface of the probe card substrate 22 on the relay substrate 20 side. Yes. The interval between the terminals 32 is wider than the interval between the terminals 40b. As described above, when the probe card substrate 22 is connected to the test head by increasing the interval between the connection terminals 40, the probe card substrate 22 is enlarged. For this reason, an organic material substrate is used as the probe card substrate 22. Therefore, as shown in FIG. 9, the heat dissipation through the probe card substrate 22 is reduced. Therefore, it is preferable to use the insulating member 18.

  A reinforcing member 24 having a higher thermal conductivity than the probe card substrate 22 is provided on the lower surface of the probe card substrate 22. The penetrating member 28 connects the reinforcing members 24 and 26. Thereby, it can thermally radiate efficiently.

  By providing the cooling device 34 for cooling the reinforcing member 26, heat can be efficiently radiated.

  The penetrating member 28 is formed outside the relay substrate 20 and is not formed on the relay substrate 20. Thereby, the area | region of the connection terminal 40 which connects the relay board | substrate 20 and the probe card board | substrate 22 is securable.

  Example 2 is an example provided with a heat sink and a cooling fan as a cooling device. FIG. 10 is a schematic diagram of a test apparatus according to the second embodiment. As shown in FIG. 10, the test apparatus 102 includes a cooling device 34, a temperature detector 35, and a control unit 36. The cooling device 34 includes a heat radiating plate 34 a and a cooling fan 38. The heat radiating plate 34 a is connected to the reinforcing member 26. The temperature detector 35 detects the temperature of the heat radiating plate 34 a or the reinforcing member 26. The temperature detector 35 is preferably arranged at a position where the heat generation state of the device under test 10 can be easily detected. The temperature detector 35 may be, for example, a temperature detection probe.

  The control unit 36 controls the cooling fan 38 based on the temperature detected by the temperature detector 35. The cooling fan 38 irradiates the heat radiating plate 34a with air. When the cooling fan 38 is driven, heat is efficiently released from the heat radiating plate 34a. The control unit 36 controls, for example, on / off of the cooling fan 38 and the rotation speed of the cooling fan 38. For example, when the temperature detected by the temperature detector 35 increases, the control unit 36 turns on the cooling fan 38 or increases the rotation speed of the cooling fan 38. As a result, the amount of heat released from the heat sink 34a can be controlled in accordance with the amount of heat generated by the device under test 10. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  As the cooling device 34, for example, a Peltier element can be used instead of the heat radiating plate 34a and the cooling fan 38. In this case, the control unit 36 controls the voltage applied to the Peltier element. Moreover, a liquid cooling device can be used. In this case, the control unit 36 controls the flow rate of the liquid in addition to the on / off control. The cooling device 34 and the control unit 36 may be separated or may be integrated.

  According to the second embodiment, the control unit 36 controls the cooling device 34 based on the temperature detected by the temperature detector 35. Thereby, for example, the heat dissipation amount of the cooling device 34 can be changed in accordance with the change in the heat generation amount of the device under test 10.

  Example 3 is an example in which a resin is used as the insulating member. FIG. 11A to FIG. 11C are cross-sectional views illustrating the test apparatus according to the third embodiment. As shown in FIG. 11A, the terminals 40a provided on the upper surface of the relay substrate 20 and the terminals 40b provided on the lower surface of the probe card substrate 22 are arranged to face each other. The terminal 40a is, for example, BGA, and the terminal 40b is, for example, LGA.

  As shown in FIG. 11B, the terminal 40a and the terminal 40b are joined. Thereby, the connection terminal 40 is formed. As shown in FIG. 11C, the heat conductive resin 18a is filled between the connection terminals 40 between the relay board 20 and the probe card board 22, and between the side face of the relay board 20 and the side face of the reinforcing member 24. To do. The thermally conductive resin 18a is cured. The thermal conductivity of the thermal conductive resin 18 a is higher than that of the probe card substrate 22. As the heat conductive resin 18a, for example, heat conductive epoxy resin Rico Zima Inus manufactured by Sumitomo Osaka Cement Co., Ltd. can be used. The thermal conductivity of Rico Zima Inus is, for example, 7 W / m · K. The needle substrate 16 including the probe needle 14 is fixed to the relay substrate 20. Thus, the test apparatus 104 is formed. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  Example 4 is an example which provides an insulating member in the side surface and lower surface of a reinforcement member. FIG. 12A to FIG. 13C are diagrams illustrating a test apparatus according to the fourth embodiment. FIG. 12C is a plan view of the integral member, and the other figures are sectional views.

  As shown in FIG. 12A, the relay board 20 and the probe card board 22 are joined using the connection terminals 40 as in the third embodiment. As shown in FIG. 12B, an insulating sheet 18 b is disposed on the lower surface of the probe card substrate 22. The thermal conductivity of the insulating sheet 18b is higher than that of the probe card substrate 22. As shown in FIG. 12C, the shape of the insulating sheet 18 b is annular and is almost the same as that of the reinforcing member 24. The insulating sheet 18b includes a through hole 42c.

  As shown in FIG. 13A, the penetrating member 28 fixes the reinforcing member 24 and the insulating sheet 18 b to the probe card substrate 22. As shown in FIG. 13B, the heat conductive resin 18a is provided between the connection terminals 40 between the relay board 20 and the probe card board 22, and between the side face of the relay board 20 and the side face of the reinforcing member 24. Fill. Thereby, the insulating member 18 is formed from the heat conductive resin 18a and the insulating sheet 18b. The needle substrate 16 including the probe needle 14 is fixed to the relay substrate 20. Thus, the test apparatus 104 is formed. Other configurations are the same as those of the third embodiment, and the description thereof is omitted.

  FIG. 14A is a cross-sectional view of the test apparatus according to Example 5, and FIG. 14B is a plan view of the insulating member. As shown in FIGS. 14A and 14B, in the test apparatus 108, the insulating member 18 includes an insulating sheet 18d and a protruding portion 18c. The protruding portion 18 c is provided on the side surface of the auxiliary member 24. Other configurations are the same as those of the first embodiment, and the description thereof is omitted.

  As in the first, second, fourth, and fifth embodiments, the insulating member 18 is provided between the reinforcing member 24 and the probe card substrate 22. Thereby, the contact area of the reinforcing member 24 and the insulating member 18 can be increased, and the heat conduction from the insulating member 18 to the reinforcing member 24 can be increased.

  As in the third to fifth embodiments, the insulating member 18 is in contact with the side surface of the reinforcing member 24. Thereby, the contact area of the reinforcing member 24 and the insulating member 18 can be increased, and the heat conduction from the insulating member 18 to the reinforcing member 24 can be increased.

  Further, as in the fourth and fifth embodiments, the insulating member 18 is in contact with the upper surface and the side surface of the reinforcing member 24. Thereby, the heat conduction from the insulating member 18 to the reinforcing member 24 can be further increased.

  In the third to fifth embodiments, a temperature detector and a control unit may be provided as in the second embodiment.

  FIG. 15 is a schematic diagram of a test apparatus according to the sixth embodiment. As shown in FIG. 15, in the test apparatus 110, the penetrating member 28 a is formed on the relay substrate 20 so as to penetrate the insulating member 18, the probe card substrate 22, and the reinforcing member 26. The penetrating member 28 a has a higher thermal conductivity than the probe card substrate 22. Thereby, the relay substrate 20 and the reinforcing member 26 can be connected. Other configurations are the same as those of the second embodiment, and the description thereof is omitted.

  According to the sixth embodiment, in addition to the penetrating member 28, the penetrating member 28 a is provided on the relay substrate 20. Thereby, heat dissipation from the relay substrate 20 can be performed more efficiently.

  In the third to fifth embodiments, the penetrating member 28a may be provided.

  Example 7 is an example of a test apparatus for testing a packaged device under test. FIG. 16 is a cross-sectional view of a test apparatus according to the seventh embodiment. As shown in FIG. 16, the test apparatus 112 mainly includes a socket 20a, a measurement board 22a, an insulating member 18, reinforcing members 24 and 26, a penetrating member 28, and a cooling device 34. The socket 20a supports the contact pin 14a. The contact pin 14a contacts the terminal 11 of the device under test 10a. The contact pin 14a is, for example, a pogo pin. The terminal 11 is, for example, LGA or BGA. The socket 20a electrically connects the contact pin 14a and the connection terminal 40. The connection terminal 40 electrically connects the socket 20a and the measurement board 22a. The connection terminal 40 may be formed integrally with the contact pin 14a. The measurement board 22 a electrically connects the connection terminal 40 and the terminal 32. The measurement board 22a is, for example, an organic material substrate. The terminal 32 is electrically connected to the tester head as in FIG.

  An insulating member 18 is provided between the socket 20a and the measurement board 22a. The thermal conductivity of the insulating member 18 is higher than that of the measurement board 22a. The connection terminal 40 penetrates the insulating member 18 and electrically connects the socket 20a and the measurement board 22a. The reinforcing members 24 and 26 are provided so as to sandwich the insulating member 18 and the measurement board 22a. A penetration member 28 which is a screw fixes the reinforcing members 24 and 26. The reinforcing member 24 may have a function of fixing the socket 20a to the measurement board 22a.

  On the upper surface of the device under test 10a, a pressing jig 46 for urging the device under test 10a toward the socket 20a is provided. Radiating fins 45 are attached to the holding jig 46. The heat generated in the device under test 10 a is conducted to the holding jig 46 as indicated by an arrow 94. Further, as indicated by an arrow 96, heat is radiated from the heat radiation fin 45 into the air.

  On the other hand, the heat conducted from the contact pin 14 a to the socket 20 a is conducted to the insulating member 18 as indicated by an arrow 82. As indicated by arrows 86 to 92, the heat is conducted to the cooling device 34 through the insulating member 18, the penetrating member 28, and the reinforcing member 26.

  Also in Example 7, the heat generated in the device under test 10a can be efficiently radiated.

  As in the seventh embodiment, the test terminal may be a connector connected to the packaged device under test 10a. The first substrate may be the measurement board 22a, and the second substrate may be the socket 20a.

  When testing the packaged device under test 10a as in the seventh embodiment, the radiation fins 45 can be used as shown in FIG. On the other hand, when the device under test 10 in the wafer state is tested as in Example 1-6, the heat radiation fin 45 cannot be used. Therefore, it is difficult to release the heat generated from the device under test 10 in the wafer state. Therefore, when testing the device under test 10 in a wafer state, it is effective to provide an insulating member having high thermal conductivity between the relay substrate 20 and the probe card substrate 22.

  In the first to seventh embodiments, the reinforcing members 24 and 26 are described as examples of the first member and the second member. However, the first member and the second member have a function of reinforcing the probe card board 22 or the measurement board 22a. Not necessary. In addition to the reinforcing members 24 and 26, a first member and a second member may be provided. By combining the first member and the second member with the reinforcing members 24 and 26, the number of parts can be reduced.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

In addition, the following additional notes are disclosed regarding the above description.
(Supplementary Note 1) A first base for holding a test terminal that is electrically connected to a device under test, an insulating member provided on the first base, and provided on the insulating member and conducting heat from the insulating member A second base having a low rate, a first member provided on the second base and having a higher thermal conductivity than the second base, and penetrating the second base and having a higher thermal conductivity than the second base. And a penetrating member connecting the insulating member and the first member.
(Supplementary note 2) The test apparatus according to supplementary note 1, further comprising a connection terminal that electrically connects the first base and the second base and penetrates the insulating member.
(Supplementary Note 3) The test apparatus according to Supplementary Note 1 or 2, wherein the first base has higher thermal conductivity than the second base.
(Additional remark 4) The said 2nd base | substrate is provided in the surface by the side of the said 1st base | substrate, The several 1st terminal electrically connected with the said 1st base | substrate, and the surface opposite to the surface by the side of the said 1st base | substrate The test apparatus according to any one of appendices 1 to 3, further comprising: a plurality of second terminals that are provided on the first terminal and have a larger interval than the first terminal.
(Additional remark 5) It provided in the said 1st base | substrate side of the said 2nd base | substrate, and comprised the 2nd member whose heat conductivity is higher than the said 2nd base | substrate, The said penetration member is a said 1st member, a said 2nd member, The test apparatus according to any one of appendices 1 to 4, wherein the test apparatus is connected.
(Appendix 6) The test apparatus according to any one of appendices 1 to 5, further comprising a cooling device that cools the first member.
(Additional remark 7) The test apparatus of Additional remark 6 characterized by including the detector which detects the temperature of a said 1st member, and the control part which controls the said cooling device based on the said temperature.
(Supplementary note 8) The test apparatus according to any one of supplementary notes 1 to 7, wherein the penetrating member is formed outside the first substrate.
(Additional remark 9) The said penetrating member is provided on the said 1st base | substrate, The test apparatus of Additional remark 8 characterized by the above-mentioned.
(Supplementary Note 10) The test apparatus according to supplementary note 5, wherein the insulating member is provided between the second member and the second base.
(Additional remark 11) The said insulation member is in contact with the side surface of the said 2nd member, The test apparatus of Additional remark 5 characterized by the above-mentioned.
(Additional remark 12) The said penetration member is a screw which fixes the said 1st member and the said 2nd member, The test apparatus of Additional remark 5 characterized by the above-mentioned.

DESCRIPTION OF SYMBOLS 10 Device under test 12 Wafer 14 Probe needle 14a Contact pin 18 Insulation member 20 Relay board 20a Socket 22 Probe card board 22a Measurement board 24, 26 Reinforcement member 28 Penetration member 34 Cooling device 40 Connection terminal

Claims (6)

A first substrate that holds a test terminal that is electrically connected to the device under test;
An insulating member provided on the first base;
A second base provided on the insulating member and having a lower thermal conductivity than the insulating member;
A first member provided on the second substrate and having a higher thermal conductivity than the second substrate;
A penetrating member that penetrates the second base, has a higher thermal conductivity than the second base, and connects the insulating member and the first member;
A test apparatus comprising:   The test apparatus according to claim 1, further comprising a connection terminal that electrically connects the first base and the second base and penetrates the insulating member.   The test apparatus according to claim 1, wherein the first base has a higher thermal conductivity than the second base.   The second substrate is provided on a surface on the first substrate side, provided on a surface opposite to the surface on the first substrate side, and a plurality of first terminals electrically connected to the first substrate. 4. The test apparatus according to claim 1, further comprising a plurality of second terminals having a larger interval than the first terminal. 5. A second member provided on the first substrate side of the second substrate and having a higher thermal conductivity than the second substrate;
The test apparatus according to claim 1, wherein the penetrating member connects the first member and the second member. The test apparatus according to claim 1, further comprising a cooling device that cools the first member.

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