JP2015112721A - Liquid discharge head, and method for manufacturing same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid discharge head which has both of discharge performance of a liquid and reliability.SOLUTION: A liquid discharge head includes: an element substrate including a substrate on which an energy generating element is arranged and which has a supply port for supplying a liquid into a flow channel, and a flow channel formation member which forms a flow channel between itself and the substrate and has a discharge port for discharging a liquid; a joint member having a first supply flow channel which is provided on a surface opposite to a surface of the element substrate on which the flow channel formation member is provided, and communicates with the supply port; and a support member having a second supply flow channel which is provided on a surface opposite to a surface of the joint member which contacts the element substrate, and communicates with the first supply flow channel. In the liquid discharge head, the joint member has a first opening corresponding to the supply port on the surface contacting the element substrate as an opening by the first supply flow passage, and a second opening corresponding to an opening by the second supply flow channel on the surface contacting the support member, which is larger than the first opening.

Description

  The present invention relates to a liquid discharge head and a method for manufacturing the same.

  Patent Document 1 discloses an element substrate having a discharge port for discharging droplets, an energy generating element, a flow path for supplying a liquid to each discharge port, and a supply port, and a liquid in each supply port. And a support member provided with a plurality of supply flow paths for supplying each of the liquid discharge heads, the width of the supply flow paths being larger than the opening width of the inlet portion of each of the supply ports A narrow forming method is disclosed. According to this method, the sticking out of the adhesive used for joining the element substrate and the support member to the supply flow path is suppressed, and the liquid discharge head can be manufactured without requiring high mounting accuracy. In recent years, there has been a demand for downsizing of the element substrate from the viewpoint of further improving productivity, and in order to realize downsizing of the element substrate, reduction of the opening width of the supply port of the element substrate is required.

JP 2002-154209 A

  However, when an element substrate with a reduced opening width of the supply port is used in the method described in Patent Document 1, the width of the supply flow path of the support member 30 becomes narrow as shown in FIG. Supply may be insufficient. Moreover, in order to ensure the width | variety of a supply flow path, it is difficult on manufacture to use the supporting member 30 which has a thin partition as shown in FIG. Further, when the partition walls are thin, it is necessary to further improve the mounting accuracy of the element substrate 10 with respect to the support member 30 so that the liquid in the adjacent supply flow channels is not mixed.

  It is an object of the present invention to provide a liquid discharge head that can sufficiently supply a liquid to the discharge port even when the opening width of the supply port of the element substrate is reduced, and achieves both liquid discharge performance and reliability. Objective.

  A liquid discharge head according to the present invention includes a substrate having an energy generating element disposed therein and having a supply port for supplying a liquid to the flow path, and a discharge port for discharging the liquid by forming the flow path between the substrate. An element substrate having a flow path forming member, and a first supply flow path provided on a surface of the element substrate opposite to the surface having the flow path forming member and communicating with the supply port. A liquid comprising: a joining member; and a support member having a second supply channel provided on a surface opposite to a surface of the joining member in contact with the element substrate, the second supply channel communicating with the first supply channel. In the discharge head, the opening of the joining member as the opening through the first supply channel, the surface in contact with the element substrate, the first opening corresponding to the supply port, and the surface in contact with the support member, Larger than the first opening, said second supply And a second opening corresponding to the opening by road.

  ADVANTAGE OF THE INVENTION According to this invention, even when the opening width of the supply port of an element substrate is reduced, it is possible to provide a liquid discharge head capable of sufficiently supplying liquid to the discharge port and having both liquid discharge performance and reliability. .

It is a perspective view which shows an example of the element substrate of the liquid discharge head which concerns on this invention. It is sectional drawing which shows an example of the liquid discharge head which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the element substrate which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the liquid discharge head which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the element substrate which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the liquid discharge head which concerns on this invention. It is sectional drawing which shows an example of the manufacturing method of the joining member which concerns on this invention. It is sectional drawing which shows an example of a liquid discharge head. It is sectional drawing which shows an example of a liquid discharge head.

[Liquid discharge head]
A liquid discharge head according to the present invention includes a substrate having an energy generating element disposed therein and having a supply port for supplying a liquid to the flow path, and a discharge port for discharging the liquid by forming the flow path between the substrate. An element substrate having a flow path forming member, and a first supply flow path provided on a surface of the element substrate opposite to the surface having the flow path forming member and communicating with the supply port. A liquid comprising: a joining member; and a support member having a second supply channel provided on a surface opposite to a surface of the joining member in contact with the element substrate, the second supply channel communicating with the first supply channel. In the discharge head, the opening of the joining member as the opening through the first supply channel, the surface in contact with the element substrate, the first opening corresponding to the supply port, and the surface in contact with the support member, Larger than the first opening, said second supply And a second opening corresponding to the opening by road.

  In the present invention, the bonding member is provided between the element substrate having the supply port and the support member having the second supply channel. The joining member has a first supply flow path, and the first supply flow path has a first opening corresponding to the supply port and a second supply flow path larger than the first opening. And a second opening corresponding to the opening. For this reason, even when the width between the supply ports is reduced, the presence of the joining member can sufficiently secure the width of the second supply flow path of the support member, and the discharge port can be sufficiently provided during liquid discharge. Liquid is supplied. Furthermore, since the width of the partition wall between the second supply flow paths of the support member can be sufficiently ensured due to the presence of the bonding member, the element substrate and the support member can be easily bonded and adjacent to each other. It is possible to prevent liquid mixing between the second supply flow paths.

  FIG. 1 shows an example of an element substrate of a liquid discharge head according to the present invention. The element substrate shown in FIG. 1 includes a substrate 1 made of silicon or the like in which energy generating elements 2 are arranged in two rows at a predetermined pitch. The energy generating element 2 may be partially hollow with respect to the substrate 1. On the substrate 1, a polyetheramide layer (not shown) is formed as an intermediate layer. Furthermore, a flow path forming member 14 having a discharge port 13 for forming a flow path 12 between the substrate 1 and the substrate 1 is provided on the substrate 1. Further, the substrate 1 has supply ports 11 formed between the rows of energy generating elements 2. The supply port 11 communicates with the discharge port 13 through the flow path 12. When pressure is applied by the energy generating element 2 to the liquid filled in the flow path 12 from the supply port 11, droplets are ejected from the ejection port 13. For example, recording can be performed by attaching the droplets to a recording medium.

  FIG. 2 is a cross-sectional view of the liquid discharge head obtained by joining the element substrate 10 shown in FIG. 1 to the support member 30 via the joining member 20 taken along the cutting line A-A ′ in FIG. 1. The bonding member 20 is bonded to the element substrate 10 and the support member 30. Further, the joining member 20 has a plurality of first supply flow paths 21, and the first supply flow path 21 has an opening corresponding to the supply port 11 and the first opening 5. And has a second opening 6 corresponding to the opening by the second supply channel 31. Here, the first opening 5 corresponding to the supply port 11 is a state in which one of the opening by the supply port 11 and the first opening 5 is joined so as to include the other, or both have the same shape. Shows a state in which the two are joined so as to match. For example, in FIG. 2, the first opening 5 is joined so as to include the opening by the supply port 11. The same applies to the second opening 6 corresponding to the opening by the second supply channel 31. Further, the second opening 6 being larger than the first opening 5 means that the maximum value of the passing length of the second opening 6 is larger than the maximum value of the passing length of the first opening 5. Indicates. Although the magnitude | size of the 1st opening 5 is not specifically limited, It is preferable that it is 100-1200 micrometers from a viewpoint from which the effect of this invention is acquired more. The size of the second opening 6 is not particularly limited as long as it is larger than that of the first opening 5, but can be set to, for example, 500 to 2000 μm. When the first opening 5 and the second opening 6 are arranged so as to overlap at least in the thickness direction of the joining member 20, the width between the supply ports 11 can be reduced, and the efficiency of liquid supply is improved. It is preferable from the viewpoint. The overlapping in the thickness direction indicates a state in which the bonding member 20 overlaps when viewed from a direction perpendicular to the bonding surface with the element substrate 10 or the support member 30. That is, when the shape of the first opening 5 is projected onto the second opening 6 in the thickness direction of the joining member 20, an overlapping region is generated between these openings. As a result, a flow path portion extending in the thickness direction of the joining member 20 and passing through both the inside of the first opening 5 and the inside of the second opening 6 is formed in the first supply flow path 21. .

  The material of the joining member 20 is not particularly limited as long as it can form a through hole and is stable at the time of joining and liquid supply, and may be a molded part or a ceramic part. However, it is preferable that the bonding member 20 contains silicon from the viewpoint that the bonding between the element substrate 10 and the bonding member 20 is easy and fine processing is possible. Further, the crystal orientation of the surface of the substrate 1 on which the energy generating element 2 is provided is preferably (100) from the viewpoints of electric mobility, silicon processing, film formation of the element substrate, and the like.

  The size of the surface of the bonding member 20 including the bonding portion with the element substrate 10 is the same as the bonding portion of the element substrate 10 with the bonding member 20 or the size of the bonding portion of the element substrate 10 with the bonding member 20. Is also preferable because the element substrate 10 is not restricted in size. That is, even when the element substrate 10 is made smaller by making the bonding member 20 larger than the element substrate 10 in the horizontal direction of FIG. Can lower the cost. Here, the size of the bonding portion of the bonding member 20 to the element substrate 10 is the same as the size of the bonding portion of the element substrate 10 to the bonding member 20. Therefore, the size of the surface of the bonding member 20 including the bonding portion with the element substrate 10 is the same as the size of the bonding portion of the element substrate 10 with the bonding member 20. It shows that the surface including the portion does not have a portion other than the joint portion. Further, the size of the surface of the bonding member 20 including the bonded portion with the element substrate 10 is larger than the size of the surface of the bonded portion of the element substrate 10 with the bonding member 20. The surface including the bonding portion between the element substrate 10 includes a bonding portion with the bonding member 20 of the element substrate 10.

  The support member 30 has a plurality of second supply channels 31. The second supply channel 31 communicates with the first supply channel 21 of the joining member 20. Although the material of the support member 30 is not particularly limited, for example, a mold part or a ceramic part can be used. The size of the second supply channel 31 is preferably 1400 to 2000 μm from the viewpoint of sufficiently supplying the liquid. In addition, the width of the partition wall 32 of the support member 30 is 200 μm or more from the viewpoint of easy joining with the joining member 20 and less likelihood of liquid mixing between the adjacent second supply channels 31. preferable.

  The liquid discharge head according to the present invention can be used, for example, as an ink jet recording head that performs recording by using ink as a liquid and discharging the ink onto a recording medium.

[Liquid discharge head manufacturing method]
Hereinafter, although the embodiment of the manufacturing method of the liquid discharge head concerning the present invention is shown, the present invention is not limited to these.

(First embodiment)
A method of manufacturing the liquid discharge head according to the present embodiment will be described with reference to FIGS. First, the substrate 1 on which the energy generating element 2 is arranged is prepared (FIG. 3A). As the substrate 1, a silicon substrate or the like can be used. The energy generating element 2 can be a heating resistor such as TaSiN. Further, an insulating protective film (not shown) that protects the electrical wiring from a liquid such as ink may be formed on the substrate 1. Examples of the material for the insulating protective film include SiO and SiN. The insulating protective film can be formed by, for example, plasma CVD. Next, as shown in FIG. 3B, the back surface of the substrate 1 is smoothed by polishing to thin the substrate 1. Next, as shown in FIG. 3C, after the back surface of the substrate 1 is cleaned, the surface is activated by plasma treatment and exposed to the atmosphere to form the surface-treated surface 3.

  Next, the bonding member 20 including the etching mask layer 4 patterned on both surfaces is prepared (FIG. 4A). Specifically, first, an etching mask layer 4 such as a thermal oxide film or SiO is formed on both surfaces of the bonding substrate 23 which is a silicon substrate. Thereafter, the first opening 5 corresponding to the supply port 11 of the element substrate 10 and the second opening 6 corresponding to the opening of the support member 30 by the second supply channel 31 and larger than the first opening 5 The etching mask layer 4 is patterned by photolithography and dry etching. If necessary, the surface on which the first opening 5 is formed may be activated by plasma treatment and exposed to the atmosphere.

  Next, the substrate 1 and the bonding member 20 are bonded (FIG. 4B). The bonding method is not particularly limited as long as it does not include a high-temperature heat treatment step that impairs the reliability of the element substrate 10 such as a bonding method using an adhesive or a plasma activation method.

  Next, the substrate 1 and the bonding member 20 are etched through the patterned etching mask layer 4, and the supply port 11 for supplying liquid to the flow path 12 is connected to the substrate 1, and the supply port 11 is connected to the bonding member 20. The first supply flow path 21 is formed. Specifically, first, as shown in FIG. 4C, the etching protective film 7 is formed so as to cover a portion of the bonded substrate 1 and the bonding member 20 other than the surface provided with the patterned etching mask layer 4. Form. The material of the etching protective film 7 is not particularly limited as long as it is a material that can protect the substrate 1 and the bonding member 20 in etching. Next, as shown in FIG. 4D, the first supply channel 21 and the supply port 11 are formed by etching. The method for forming the first supply channel 21 and the supply port 11 by etching is not particularly limited. For example, a deteriorated layer may be formed inside the bonding member 20 and wet etching may be performed so as to obtain a desired shape, or wet etching may be performed by introducing an etchant from the hole after processing with a laser or the like. . Among these, from the viewpoint of shortening the etching time, it is preferable to perform wet etching after forming a leading hole that penetrates the bonding member 20 with a laser and stops inside the element substrate 10. As the wet etching solution used for the wet etching, for example, a TMAH (Tetramethylammonium hydroxide) aqueous solution or the like can be used. The wet etchant may be heated before use. Next, as shown in FIG. 4E, the etching protective film 7 is removed.

  Next, on the surface of the substrate 1 on which the energy generating element 2 is disposed, a flow path 12 is formed between the substrate 1 and a flow path forming member having a discharge port 13 for discharging liquid, thereby forming an element substrate. 10 is obtained (FIG. 4F). The flow path forming member can be formed by, for example, photolithography. As a material for the flow path forming member, a negative photosensitive resin can be used. As the negative photosensitive resin, a resist containing a solid component as a resin component, a solvent, and a photoacid generator can be used. An epoxy resin or the like can be used as the resin component. As the solvent, propylene glycol monomethyl ether acetate (PGMEA) or the like can be used. As the photoacid generator, a triarylsulfonium salt or the like can be used.

  Next, the element substrate 10 and the joining member 20 are cut for each liquid ejection head, and electrical wiring for driving the energy generating element 2 is joined for each liquid ejection head (not shown).

  Next, the support member 30 having the second supply channel 31 is prepared. The viewpoint that the width of the partition wall 32 of the support member 30 is wider than the width of the bonding portion of the partition wall 22 of the bonding member 20 to the element substrate 10 can suppress the protrusion of the adhesive when bonding is performed using an adhesive. To preferred. Next, the joining member 20 and the support member 30 are joined so that the first supply channel 21 and the second supply channel 31 communicate with each other (FIG. 4G). As the bonding method, the same method as the bonding method between the element substrate 10 and the bonding member 20 described above can be used. Through the above steps, the liquid discharge head according to the present embodiment is obtained.

(Second embodiment)
This embodiment is the first implementation except that the supply port 11 of the element substrate 10 and the first supply flow path 21 of the bonding member 20 are individually formed before the element substrate 10 and the bonding member 20 are bonded. Since it is the same as the embodiment, the description of the overlapping steps and operations will be omitted as appropriate. A method for manufacturing the liquid discharge head according to the present embodiment will be described with reference to FIGS.

  First, the substrate 1 on which the energy generating element 2 is arranged is prepared (FIG. 5A). Next, a patterned etching mask layer 4 is formed on the surface of the substrate 1 opposite to the surface on which the energy generating element 2 is disposed. The substrate 1 is etched through the patterned etching mask layer 4 by the same method as in the first embodiment, and a supply port 11 for supplying a liquid to the flow path is formed in the substrate 1. Thereafter, on the surface of the substrate 1 on which the energy generating element 2 is disposed, the flow path 12 is formed between the substrate 1 and a flow path forming member having a discharge port 13 for discharging a liquid is formed. (FIG. 5B). Next, the patterned etching mask layer 4 is removed (FIG. 5C).

  Next, the bonding member 20 including the etching mask layer 4 patterned on both surfaces is prepared (FIG. 6A). The joining member 20 is etched through the patterned etching mask layer 4 in the same manner as in the first embodiment, and the first supply channel 21 is formed in the joining member 20 (FIG. 6B). Here, the etching is not limited to wet etching, and dry etching may be used. For example, as shown in FIG. 7A, the first opening 5 and the second opening 6 are formed so that the first opening 5 and the second opening 6 overlap at least in the thickness direction of the bonding member 20. . Further, it is preferable to form the first opening 5 and the second opening 6 so as not to overlap with the adjacent opening in the thickness direction of the bonding member 20. Next, as shown in FIG. 7B, dry etching is performed on the surface of the bonding member 20 having the first opening 5 to form a non-through hole 24 that stops inside the bonding substrate 23. Next, as shown in FIG. 7C, dry etching is performed on the surface of the bonding member 20 having the second opening 6 to form the first supply channel 21. For dry etching, a Bosch process, which is one of deep silicon processing techniques, can be used.

  Next, the element substrate 10 and the bonding member 20 are bonded so that the supply port 11 and the first supply channel 21 communicate with each other. The element substrate 10 and the joining member 20 are cut for each liquid ejection head, and electrical wiring for driving the energy generating element 2 is joined for each liquid ejection head (not shown). Thereafter, the support member 30 having the second supply flow path 31 is prepared, and the joining member 20 and the support member 30 are joined so that the first supply flow path 21 and the second supply flow path 31 communicate with each other. (FIG. 6C). The method similar to 1st embodiment can be used for the joining method of the element substrate 10 and the joining member 20, and the joining method of the joining member 20 and the support member 30. Further, the order of joining the element substrate 10 and the joining member 20 and joining the joining member 20 and the support member 30 are not particularly limited.

Example 1
A method for manufacturing the liquid discharge head according to the present embodiment will be described with reference to FIGS. First, as shown in FIG. 3A, a silicon substrate 1 having a plurality of energy generating elements 2 as heating resistors (TaSiN) arranged on the surface was prepared. On the substrate 1, an insulating protective film (not shown) in which SiO is formed by plasma CVD is formed. Next, as shown in FIG. 3B, the back surface of the substrate 1 was smoothed by polishing so that the substrate 1 was thinned and the surface roughness (Ra) was Ra ≦ 1 nm. Next, as shown in FIG. 3C, after the back surface of the substrate 1 was cleaned, the surface was activated by plasma treatment and exposed to the atmosphere to form the surface-treated surface 3.

  Next, an etching mask layer 4 as a thermal oxide film was formed on both surfaces of the silicon bonding substrate 23 having a crystal orientation of (100). The first opening 5 corresponding to the supply port of the element substrate and the second opening 6 larger than the first opening 5 corresponding to the opening by the second supply flow path of the support member can be formed. The etching mask layer 4 was patterned by photolithography and dry etching (FIG. 4A). Thereafter, the surface on which the first opening 5 was formed was activated by plasma treatment and exposed to the atmosphere. Next, as shown in FIG. 4B, the substrate 1 and the bonding member 20 were pressurized and temporarily bonded, and then annealed and bonded at 250 ° C. Next, as shown in FIG. 4C, the etching protective film 7 is covered so as to cover a portion of the bonded substrate 1 and the bonding member 20 other than the surface provided with the patterned etching mask layer 4. .

  Next, as shown in FIG. 4D, the first supply channel 21 and the supply port 11 were formed by wet etching. The first supply channel 21 and the supply port 11 communicate with each other. A 22 mass% TMAH aqueous solution was used as the wet etching solution. In order to shorten the etching time, a lead hole that penetrates the bonding member 20 with a laser and stops inside the substrate 1 was formed, and then wet etching was performed using a wet etching solution heated to 83 ° C. The opening width of the supply port 11, that is, the size of the first opening 5 was 500 μm. Next, as shown in FIG. 4E, the etching protective film 7 was removed.

  Next, as shown in FIG. 4F, a channel 12 is formed on the substrate 1 with the substrate 1 and a channel forming member having a discharge port 13 for discharging a liquid is formed by photolithography. did. A negative photosensitive resin was used as the material of the flow path forming member. The negative photosensitive resin is a resist containing an epoxy resin, PGMEA as a solvent, and a triarylsulfonium salt as a photoacid generator. Next, the element substrate 10 and the joining member 20 were cut for each liquid ejection head, and electrical wiring for driving the energy generating element 2 was joined for each liquid ejection head (not shown).

  Next, a support member 30 having a second supply channel 31 and a partition wall 32 having a width wider than the partition wall 22 of the joining member 20 is formed by molding, and as shown in FIG. 30 was joined to the joining member 20. The first supply channel 21 and the second supply channel 31 communicate with each other. An adhesive was used to join the support member 30 and the joining member 20 so that the adhesive did not protrude into the second supply channel 31.

  The liquid ejection head according to the present example was completed through the above steps. As a result of printing using the liquid discharge head, the liquid is sufficiently supplied even if the opening width of the supply port 11 of the element substrate 10 is reduced. Therefore, the printing quality is good even when high-speed printing is performed. It was confirmed that there was.

(Example 2)
A method for manufacturing the liquid discharge head according to the present embodiment will be described with reference to FIGS. First, as shown in FIG. 5A, a substrate 1 similar to that in Example 1 was prepared. In this embodiment, since the element substrate 10 and the bonding member 20 are bonded with an adhesive, the substrate 1 is not thinned by polishing.

  Next, the etching mask layer 4 was formed on the back surface of the substrate 1, and the etching mask layer 4 was patterned by photolithography so that a desired supply port could be formed. An etching protective film was formed so as to cover a portion of the substrate 1 other than the portion where the patterned etching mask layer 4 was formed, and the supply port 11 was formed by wet etching similar to that in Example 1. Thereafter, the etching protective film was removed, and the flow path 12 was formed between the substrate 1 and the flow path forming member having the discharge port 13 for discharging the liquid, as in Example 1 (FIG. 5B). )). Next, as shown in FIG. 5C, the etching mask layer 4 was removed.

  Next, as shown in FIG. 6A, the etching mask layer 4 patterned on both surfaces of the bonding substrate 23 was formed in the same manner as in Example 1. Next, as shown in FIG. 6B, the first supply channel 21 was formed by the same laser processing and wet etching as in Example 1.

  Next, the element substrate 10 and the bonding member 20 were bonded with an adhesive. The element substrate 10 and the joining member 20 were cut for each liquid ejection head, and electrical wiring for driving the energy generating element 2 was joined for each liquid ejection head (not shown). Thereafter, as shown in FIG. 6C, the joining member 20 and the supporting member 30 similar to those in Example 1 were joined with an adhesive. Here, since the surface accuracy of each of the element substrate 10 and the bonding member 20 is high, it was possible to bond the adhesive by controlling the protrusion of the adhesive by reducing the thickness of the adhesive. On the other hand, in joining the joining member 20 and the supporting member 30, since the supporting member 30 is formed by molding, a thick adhesive is used so that the joining can be surely performed even if the surface accuracy is low.

  The liquid ejection head according to the present example was completed through the above steps. As a result of printing using the liquid discharge head, the liquid is sufficiently supplied even if the opening width of the supply port 11 of the element substrate 10 is reduced. Therefore, the printing quality is good even when high-speed printing is performed. It was confirmed that there was.

(Example 3)
A manufacturing method of the liquid discharge head according to the present embodiment will be described with reference to FIG. First, as shown in FIG. 7A, the patterned etching mask layer 4 was formed on the surface of the bonding substrate 23 as in the first embodiment. Here, the first opening 5 and the second opening 6 corresponding to the first opening 5 overlap at least in the thickness direction of the joining member, and do not overlap with the adjacent opening in the thickness direction of the joining member. A first opening 5 and a second opening 6 were formed.

  Next, as shown in FIG. 7B, dry etching was performed on the surface of the bonding member 20 having the first opening 5 to form a non-through hole 24 that stops inside the bonding substrate 23. A Bosch process was used for the dry etching. Next, as shown in FIG. 7C, dry etching was performed on the surface of the bonding member 20 having the second opening 6 to form the first supply channel 21. A Bosch process was also used for the dry etching.

  The formation of the element substrate 10 and the bonding of the element substrate 10 and the support member 30 and the bonding member 20 were performed in the same manner as in Example 2, and the liquid ejection head according to the present example was completed. As a result of printing using the liquid discharge head, the liquid is sufficiently supplied even if the opening width of the supply port 11 of the element substrate 10 is reduced. Therefore, the printing quality is good even when high-speed printing is performed. It was confirmed that there was.

(Comparative Example 1)
A manufacturing method of the liquid discharge head according to this comparative example will be described with reference to FIG. In this comparative example, the element substrate 10 and the support member 30 were joined without using the joining member 20. Further, in the bonding, the width of the partition wall 32 of the support member 30 is made wider than the width of the partition wall between the supply ports 11 of the element substrate 10 in order to prevent the adhesive from protruding. Except for these, a liquid discharge head was fabricated in the same manner as in Example 2. As a result of printing using the liquid discharge head, liquid discharge failure was confirmed during continuous discharge of liquid. When this liquid discharge head was observed, it was confirmed that there were discharge ports where the adhesive did not protrude but the supply flow path was narrow and the liquid was not sufficiently supplied.

(Comparative Example 2)
A manufacturing method of the liquid discharge head according to this comparative example will be described with reference to FIG. In this comparative example, in order to sufficiently supply the liquid, the width of the partition wall 32 of the support member 30 is made narrower than the width of the partition wall between the supply ports 11 of the element substrate 10. Otherwise, a liquid ejection head was produced in the same manner as in Comparative Example 1. As a result of printing using the liquid discharge head, good printing was confirmed. However, high mounting accuracy is required when manufacturing the liquid discharge head, and productivity is greatly reduced.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Energy generating element 3 Surface treatment surface 4 Etching mask layer 5 First opening 6 Second opening 7 Etching protective film 10 Element substrate 11 Supply port 12 Channel 13 Discharge port 14 Channel formation member 20 Joining member 21 One supply flow path 22 Partition wall 23 of the bonding member Bonded substrate 24 Non-through hole 30 Support member 31 Second supply flow path 32 Partition wall of the support member

Claims (11)

A substrate having an energy generating element and having a supply port for supplying a liquid to the flow path; and a flow path forming member having a discharge port for forming the flow path between the substrate and discharging the liquid. An element substrate;
A bonding member having a first supply flow path that communicates with the supply port, provided on a surface opposite to the surface of the element substrate that includes the flow path forming member;
A support member having a second supply channel provided on a surface opposite to the surface in contact with the element substrate of the bonding member, the second supply channel communicating with the first supply channel;
A liquid ejection head comprising:
As the opening by the first supply flow path, the bonding member has a first opening corresponding to the supply port on a surface in contact with the element substrate, and a surface in contact with the support member than the first opening. A liquid discharge head having a large second opening corresponding to the opening formed by the second supply channel.   The liquid discharge head according to claim 1, wherein the joining member includes silicon.   The liquid discharge head according to claim 2, wherein the crystal orientation of the silicon is (100).   4. The liquid ejection head according to claim 1, wherein the first opening and the second opening of the joining member are arranged so as to overlap at least in the thickness direction of the joining member. 5.   The size of the surface including the bonding portion of the bonding member with the element substrate is the same as the bonding portion of the element substrate with the bonding member, or the size of the bonding portion of the element substrate with the bonding member. The liquid ejection head according to claim 1, wherein the liquid ejection head is also larger. Preparing a substrate on which an energy generating element is disposed;
Preparing a bonding member comprising an etching mask layer patterned on both sides;
Bonding the substrate and the bonding member;
The substrate and the bonding member are etched through the patterned etching mask layer, and a supply port for supplying a liquid to the channel is supplied to the substrate, and a first supply for communicating the supply port with the bonding member Forming a flow path;
Forming a flow path forming member having a discharge port for discharging a liquid on the surface of the substrate on which the energy generating element is disposed, and obtaining an element substrate;
Preparing a support member having a second supply channel;
Joining the joining member and the support member such that the first supply channel and the second supply channel communicate with each other;
A method of manufacturing a liquid ejection head comprising:
As the opening by the first supply flow path, the bonding member has a first opening corresponding to the supply port on a surface in contact with the element substrate, and a surface in contact with the support member than the first opening. A method for manufacturing a liquid discharge head, which is large and has a second opening corresponding to the opening by the second supply channel. Preparing a substrate on which an energy generating element is disposed;
Forming a patterned etching mask layer on a surface of the substrate opposite to the surface on which the energy generating element is disposed;
Etching the substrate through the patterned etching mask layer, and forming a supply port for supplying a liquid to the channel in the substrate;
Forming a flow path forming member having a discharge port for discharging a liquid on the surface of the substrate on which the energy generating element is disposed, and obtaining an element substrate;
Removing the patterned etching mask layer;
Preparing a bonding member comprising an etching mask layer patterned on both sides;
Etching the bonding member through the patterned etching mask layer to form a first supply channel in the bonding member;
Bonding the element substrate and the bonding member such that the supply port communicates with the first supply channel;
Preparing a support member having a second supply channel;
Joining the joining member and the support member such that the first supply channel and the second supply channel communicate with each other;
A method of manufacturing a liquid ejection head comprising:
As the opening by the first supply flow path, the bonding member has a first opening corresponding to the supply port on a surface in contact with the element substrate, and a surface in contact with the support member than the first opening. A method for manufacturing a liquid discharge head, which is large and has a second opening corresponding to the opening by the second supply channel.   The method of manufacturing a liquid discharge head according to claim 6, wherein the joining member includes silicon.   The method of manufacturing a liquid discharge head according to claim 8, wherein the crystal orientation of the silicon is (100).   10. The method of manufacturing a liquid ejection head according to claim 6, wherein the first opening and the second opening of the joining member are arranged so as to overlap at least in the thickness direction of the joining member. .   The size of the surface including the bonding portion of the bonding member with the element substrate is the same as the bonding portion of the element substrate with the bonding member, or the size of the bonding portion of the element substrate with the bonding member. The method for manufacturing a liquid ejection head according to claim 6, wherein the liquid ejection head is also larger.

Images