JP2015103701A - Non-contact holding mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact holding mechanism for holding a held member without causing any deflection.SOLUTION: A non-contact holding mechanism 1 has a suction surface 20 for sucking a held member 31, and holds the held member 31 by feeding a gas between the suction surface 20 and held member 31. The non-contact holding mechanism 1 includes a first table 2 having a first surface 6 facing the held member 31, and a second table 3 having a second surface 8 facing the held member 31. The first table 2 is combined with the second table 3 so that the first surface 6 forms the suction surface 20 in conjunction with the second surface 8, and an annular ejection port 19 for ejecting gas is formed in the suction surface 20.

Description

  The present invention relates to a non-contact type holding mechanism that holds a held member in a non-contact manner.

  As a holding mechanism for holding a thin plate-like held member such as a semiconductor wafer in a non-contact manner, for example, Patent Literature 1 discloses a Bernoulli chuck using the Bernoulli effect. The Bernoulli chuck disclosed in Patent Document 1 is provided with four (or eight) circular injection ports on the suction surface. Then, high pressure gas is ejected from the ejection port in a state where the suction surface and the held member are opposed to each other, and a negative pressure is generated by flowing gas between the suction surface and the held member. Hold in contact.

JP-A-11-223521

  However, the four (or eight) jet outlets such as the Bernoulli chuck of Patent Document 1 cannot sufficiently supply the gas flowing at high speed over the entire area between the suction surface and the held member, and the jet outlets. The gas flow rate tends to drop between the nozzle and the spout. Therefore, the Bernoulli effect is reduced between the jet port and the jet port, and the resulting negative pressure is reduced compared to the vicinity of the jet port. For this reason, when the semiconductor wafer is held by the Bernoulli chuck of Patent Document 1, the difference in the negative pressure may cause the held semiconductor wafer to bend.

  One method of preventing the occurrence of the above-described deflection includes a method of holding a semiconductor wafer once attached to a base material, but this method increases costs and man-hours. In addition, as another method for preventing the occurrence of deflection, there is a method of increasing the number of jets, but this method requires fine processing to form the jets and increases the cost.

  An object of the present invention is to provide a non-contact type holding mechanism that solves the problem that it is difficult to hold a member to be held without causing deflection.

  The non-contact type holding mechanism of the present invention has an adsorption surface that adsorbs a member to be held, and holds the member to be held in a non-contact manner by flowing a gas between the adsorption surface and the member to be held. The non-contact type holding mechanism includes a first table having a first surface facing the held member, and a second table having a second surface facing the held member. The first table is combined with the second table so that the first surface forms an adsorption surface together with the second surface, and an annular ejection port through which gas is ejected is formed on the adsorption surface. The

  According to the present invention, since a negative pressure can be uniformly generated between the suction surface and the held member, the held member can be held while suppressing the occurrence of deflection.

It is the schematic of the non-contact type | mold holding mechanism which concerns on this invention, (a) is sectional drawing, (b) is an enlarged view of the X section of (a). It is a cross-sectional exploded view of the non-contact type holding mechanism of FIG. It is a cross-sectional perspective view of the non-contact holding mechanism of FIG. It is the schematic of other embodiment of the non-contact type | mold holding mechanism which concerns on this invention.

  The non-contact type holding mechanism of the present invention will be described with reference to the drawings.

  1A and 1B are schematic views of a non-contact type holding mechanism according to the present invention, in which FIG. 1A is a cross-sectional view and FIG. FIG. 2 is an exploded cross-sectional view of the non-contact type holding mechanism of FIG. 3 is a cross-sectional perspective view of the non-contact type holding mechanism of FIG.

  The non-contact type holding mechanism 1 of the present invention includes a first table 2, a second table 3, a first holder 4, and a second holder 5.

  The first table 2 is conical, and in the present embodiment is conical. The portion corresponding to the bottom surface of the cone is the first surface 6 facing the thin plate-shaped held member 31. In the following description, a semiconductor wafer is used as an example of the member 31 to be held. A positioning convex portion 7 is formed at the apex portion of the first table 2.

  The second table 3 has a plate shape, which is a disk shape in the present embodiment, and one surface thereof is a second surface 8 facing the semiconductor wafer 31. The second surface 8 is provided with a housing portion 9 that is a recess for housing the first table 2. In this embodiment, the accommodating part 9 is formed in a substantially conical shape by the side wall. Gas flows into the bottom portion of the accommodating portion 9 (that is, the apex portion of the substantially cone) so as to surround the positioning concave portion 10 into which the positioning convex portion 7 of the first table 2 is fitted and the positioning concave portion 10. A plurality of inflow ports 11 are provided. The other surface of the second table 3 is provided with a fitting convex portion 12 that protrudes from the other surface and in which the inflow port 11 is located. Moreover, the line where the bottom part of the accommodating part 9 and the side wall 3a of the 2nd table 3 cross is the ridgeline 3b.

  In addition, when the 1st table 2 is accommodated in the accommodating part 9 of the 2nd table 3, the side surface 2a of the 1st table 2 and the side wall 3a of the 2nd table 3 are not contacted. The shapes of the first table 2 and the second table 3 are determined.

  The first holder 4 has a plate shape, in this embodiment, a disk shape, and a fitting recess 13 into which the fitting projection 12 of the second table 3 is fitted is provided on one surface thereof. . When the fitting recess 13 and the fitting convex portion of the second table 3 are fitted, the bottom of the fitting concave portion 13 and the tip of the fitting convex portion 12 of the second table 3 are in contact with each other. A gas supply space 22 is formed between the bottom of the fitting recess 13 and the tip of the fitting projection 12 of the second table 3. Moreover, the 2nd recessed part 14 for holders in which the 2nd holder 5 fits is formed in the other surface. The bottom of the fitting recess 13 and the second holder recess 14 communicate with each other via a gas supply port 15.

  The second holder 5 has a plate-like insertion portion 16 that is inserted into the second holder concave portion 14, and a shaft portion 17 that extends so as to protrude from the insertion portion 16. Further, an air passage 18 extending through the center of the shaft portion 17 and penetrating to the center of the insertion portion 16 is provided.

  The positioning projection 7 of the first table 2 is fitted into the positioning recess 10 of the second table 3, and the fitting projection 12 of the second table 3 is fitted into the fitting recess 13 of the first holder 4. The second holder insertion portion 16 is inserted into the second holder recess 14 of the first holder 4. The first and second holders 4 and 5 may be configured as one holder.

  In the state where the respective members are assembled, the first surface 6 and the second surface 8 form the suction surface 20 that faces the held member 31 when the held member 31 is sucked, and the first surface 6 and the second surface 8. An injection port 19 is formed so as to surround the first surface 6 by a gap between the surface 6 and the second surface 8. In addition, a gap between the side surface 2a of the first table 2 and the side wall 3a of the second table 3 connects the inflow port 11 and the jet port 19 to form a flow path 21 through which gas flows. As a result, gas flows from the air passage 18 to the jet outlet 19 through the gas supply port 15, the gas supply space 22, the inflow port 11, and the flow path 21.

  Moreover, it is preferable that the flow path 21 becomes small as it goes to the jet outlet 19 from the inflow port 11. By doing in this way, the flow velocity of the gas supplied from the inflow port 11 can be increased as it approaches the ejection port 19, and the gas can be ejected from the ejection port 11 at a higher flow rate. It is more preferable that b ≧ a × Ra / Rb is satisfied. Here, Ra is the distance from the axis passing through the centers of the first table 2 and the second table 3 to the periphery of the first table 2, and Rb is the center of the first table 2 and the second table 3. Is the distance from the axis passing through to the ridgeline 3b. a is a vertical distance from the side surface 2 a of the peripheral position of the first table 2 to the second table 3, and b is a vertical distance from the ridge line 3 b to the side surface 2 of the first table 2.

  In the non-contact type holding mechanism 1 configured as described above, the spout 19 is formed in an annular shape so as to surround the periphery of the first surface 6 of the first table 2. Therefore, gas can be ejected radially from the entire circumference of the ejection port 19, so that when the held member 31 is held by the non-contact type holding mechanism 1, it is uniform between the suction surface 20 and the held member 31. Negative pressure can be generated, and the held member 31 can be held with a uniform force. Therefore, when the held member 31 is attracted and held by the non-contact type holding mechanism 1 of the present invention, the held member 31 is less likely to bend. Moreover, since the gas outlet 19 is comprised by the 1st table 2 and the 2nd table 3, it is not necessary to process several circular opening like patent document 1. FIG. Therefore, manufacture becomes easy. Moreover, since the size and shape of the jet outlet 19 and the flow path 21 are determined by the two tables 2 and 3, a plurality of different first tables 2 and second tables 3 are prepared and combined, The size and shape of the channel 19 and the channel 21 can be freely changed.

  Next, another embodiment of the non-contact type holding mechanism according to the present invention will be described. FIG. 4 shows a schematic view of another embodiment of the non-contact type holding mechanism according to the present invention. Note that a description of the same configuration as that of the above-described embodiment is omitted.

  The non-contact type holding mechanism 1 can be rotated by connecting the rotating mechanism 41 having a driving device such as a motor and the second holder 5, and the non-contact type holding mechanism of the present invention can be used in a rotating device such as a spin coater. 1 can be used. In addition, when rotating the non-contact type holding mechanism 1, if the rotation is unbalanced, vibration and noise are generated, and the performance is deteriorated. In order to balance the rotation, it is necessary to determine the shapes of the first and second tables 2 and 3 and the first and second holders 4 and 5 so that the center of gravity is located on the rotation axis. For the same reason, it is desirable that the inlet 18a to the air passage 18 into which the gas flows is on the rotating shaft.

  Moreover, since the heated gas is radially injected from the injection port 19 by heating the gas from the blower device 43 with the heating device 42 and then supplying it to the air passage 18, the held member 31 is heated evenly. can do. Therefore, for example, when the semiconductor wafers are bonded together with an adhesive, the heat treatment can be performed while the semiconductor wafers are held by the non-contact type holding mechanism 1 of the present invention. Further, by configuring the first and second tables 2 and 3 with a material having a high thermal conductivity, when the heated gas passes through the flow path 21, the first and second tables 2 and 3 The heat transfer rate is increased uniformly and the held member 31 can be warmed more uniformly. In addition, by forming additional channels in the first and second tables 2 and 3, the held member 31 can be further heated uniformly.

  When the non-contact type holding mechanism 1 of the present invention is used for a spin coater, the first and second holders 4 and 5 are made of a material having low thermal conductivity, so that the rotating mechanism 41 is not affected by heat. Can not be. In addition, since it is possible to apply adhesives to semiconductor wafers, attach semiconductor wafers to each other, and heat treatment with the same device, the risk of dust adhering to the semiconductor wafers can be reduced, and the laminated structure of semiconductor wafers at low cost. Can be produced.

  Although the preferred embodiments of the present invention have been presented and described in detail above, the present invention is not limited to the above-described embodiments, and it is understood that various changes and modifications can be made without departing from the gist. I want to be.

DESCRIPTION OF SYMBOLS 1 Non-contact-type holding | maintenance mechanism 2 1st table 2a Side surface 3 2nd table 3a Side wall 3b Edge line 6 1st surface 7 Positioning convex part 8 2nd surface 9 Housing | casing part 10 Positioning recessed part 11 Inlet 19 Outlet 20 Adsorption surface 21 Flow path 31 Holding member 42 Heating device

Claims (6)

In a non-contact type holding mechanism that has an adsorption surface that adsorbs the held member and holds the held member in a non-contact manner by flowing a gas between the adsorption surface and the held member.
A first table having a first surface facing the held member;
A second table having a second surface facing the held member,
The first table is combined with the second table so that the first surface forms the suction surface together with the second surface, and the gas is ejected onto the suction surface. The non-contact type holding mechanism is characterized in that a jet nozzle is formed. The second table is a recess provided in the second surface, and is provided with a housing part in which the first table is housed and an inlet port into which the gas flows,
In a state where the first table is accommodated in the accommodating portion of the second table,
2. The non-contact according to claim 1, wherein a flow path connecting the inflow port and the jet port is formed by a gap formed between a side surface of the first table and a side wall of the second table. Mold retention mechanism.   The non-contact type holding mechanism according to claim 2, wherein a cross-sectional area of the flow path decreases from the inflow port toward the jet port. The first table has a weight shape, the bottom portion of the first table is the first surface, and the first positioning portion is provided at the apex portion,
The accommodating portion of the second table is recessed in a weight shape, and the positioning portion fits into the apex portion of the second table when the first table is accommodated in the accommodating portion. Positioning part is formed,
The non-contact type holding mechanism according to claim 1, wherein the inflow port is disposed around the second positioning portion.   The non-contact type holding mechanism according to any one of claims 1 to 4, wherein a heating device that heats a gas flowing into the inflow port is provided. A holder for supporting the second table;
The non-contact type holding mechanism according to claim 1, further comprising: a rotating mechanism that rotates the holder.

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