JP2015041752A - Mold type transformer, and image forming apparatus with the transformer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for thinning an apparatus in which a mold type transformer is integrated.SOLUTION: A mold type transformer 90 comprises a transformer including at least a pair of secondary side output terminals and is molded with an insulative resin 110. The mold type transformer comprises: a mounting face 90A which is abutted to a power supply substrate when mounting the mold type transformer to the power supply substrate; an output electrode 93 electrically connected to one of the pair of secondary side output terminals, the output electrode 93 having a plate shape including a first surface at a side of the mounting face and a second surface 93B at a side opposite to the first surface and extending from a side face 90C orthogonal with the mounting face 90A of the mold type transformer in a direction orthogonal to the side face; and an insulative resin part 120 for insulating the output electrode 93 with the insulative resin 110, the insulative resin part 120 being formed by exposing at least any one of the first surface and the second surface 93B of the output electrode 93.

Description

  The present invention relates to a mold-type transformer and an image forming apparatus including the transformer, and more particularly to a technique related to the arrangement of output electrodes of the mold-type transformer.

  Conventionally, for example, a technique described in Patent Document 1 is known as a technique related to the arrangement of output electrodes of a molded electrical component. In Patent Document 1, in a mold type power semiconductor element as a mold type electric component, an external terminal (output electrode) can be routed to a desired position to enable miniaturization. A technique in which an external terminal is provided is disclosed.

JP 2012-096881 A

However, when the output electrode of the mold type transformer as the mold type electric component is provided on the upper surface of the mold type transformer as in Patent Document 1, the output electrode of the mold type transformer and the mold type transformer are incorporated. A connection electrode for electrically connecting an electrode of a process cartridge (detachable unit) mounted on the image forming apparatus main body as an apparatus is also required in the height direction of the mold type transformer. For this reason, there is a possibility that the thinning of the apparatus may be hindered.
The present invention provides a technique for reducing the thickness of an apparatus in which a molded transformer is incorporated.

The molded transformer disclosed in the present specification includes a transformer having at least a pair of secondary output terminals, and is molded with an insulating resin, and the molded transformer An attachment surface that contacts the power supply substrate when attached to the power supply substrate, and an output electrode electrically connected to one of the pair of secondary output terminals, the first surface on the attachment surface side; And an output electrode having a plate-like shape having a second surface opposite to the first surface, extending from a side surface orthogonal to the mounting surface of the mold transformer in a direction orthogonal to the side surface, An insulating resin portion that insulates the output electrode with an insulating resin, wherein the insulating resin portion is formed by exposing at least one of the first surface and the second surface of the output electrode. Prepare.
According to this configuration, the output electrode is formed so as to extend in a direction perpendicular to the side surface of the transformer while ensuring the insulation of the output electrode. When incorporated in a forming apparatus, the image forming apparatus can be thinned.

In the molded transformer, the insulating resin portion may be formed so as to expose at least the first surface of the output electrode.
According to this configuration, the insulation of the output electrode can be ensured, and the work related to the connection of the output electrode from the mounting surface side using the first surface can be performed.

In the molded transformer, the insulating resin portion may be formed so as to expose only the first surface of the output electrode.
According to this structure, the operation | work which concerns on the output electrode from the attachment surface side becomes easy.

In the molded transformer, a screw hole for attaching a screw may be formed in the output electrode.
According to this configuration, the output electrode can be easily fixed to, for example, a conductive metal plate for connecting the output electrode to the outside.

In the molded transformer, the insulating resin portion may be formed to expose at least the second surface of the output electrode.
According to this configuration, the insulation of the output electrode can be ensured, and the output voltage can be taken out using the second surface of the output electrode.

In the molded transformer, the height from the mounting surface to the output electrode is higher than half of the height from the mounting surface to the upper surface facing the mounting surface of the mold transformer. It may be.
According to this configuration, an insulation distance between the output electrode and the power supply substrate can be earned.

In the molded transformer, the first surface of the output electrode may be provided so as to be substantially flush with the mounting surface.
According to this configuration, since the distance from the output electrode to the upper surface facing the mounting surface of the molded transformer can be earned, the distance is used, for example, for conduction for connecting the output electrode to the outside. A metal plate can be attached. That is, it is possible to save space when the molded transformer is attached to the apparatus. Thereby, the apparatus can be thinned.

In the molded transformer, the output electrode may have an exposed portion that extends further from the side surface of the molded transformer in a direction perpendicular to the side surface than the insulating resin portion.
According to this configuration, the output electrode can be connected to the outside via the exposed portion, and an insulation distance from the power supply substrate can be earned.

Further, in the mold type transformer, when the mold type transformer is attached to the power supply board, it is an attachment electrode attached to the power supply board, and is connected to the other of the pair of secondary side output terminals, You may make it provide the attachment electrode extended in the direction orthogonal to the said attachment surface from an attachment surface.
According to this structure, the insulation distance with an attachment electrode with a large electric potential difference with an output electrode can be earned. Thereby, unnecessary discharge or the like between the output electrode and the attachment electrode can be suppressed.

Further, an image forming apparatus disclosed in this specification includes any of the above-described mold type transformer, a frame on which a detachable detachable unit used for forming an image on a recording medium is mounted, The power supply board on which the mold type transformer is mounted, the power supply board attached to the frame body from the side opposite to the side on which the detachable unit is mounted, the output electrode of the mold type transformer, And a connection electrode for electrically connecting the electrode of the detachable unit.
According to this configuration, when the molded transformer is incorporated in the image forming apparatus, it is possible to reduce the thickness of the image forming apparatus while ensuring the insulation of the molded transformer.

In the image forming apparatus, the mold type transformer may be mounted on the power supply board such that the output electrode protrudes from an edge of the power supply board.
According to this structure, the insulation distance of a power supply board and an output electrode can be earned.

  According to the molded transformer of the present invention, the output electrode is formed so as to extend in a direction orthogonal to the side surface of the transformer. Therefore, when the mold type transformer is incorporated into the apparatus, for example, when incorporated into the image forming apparatus, the image forming apparatus can be thinned.

1 is a schematic cross-sectional view illustrating an internal configuration of a printer according to a first embodiment. Explanatory drawing showing the positional relationship between the detachable unit of the printer and the high voltage power supply board Schematic block diagram of high-voltage power supply for printer A circuit diagram showing composition of a mold type transformer concerning Embodiment 1 Perspective view showing the outline of the molded transformer Plan view showing the relationship between the mold-type transformer and the high-voltage power supply board The fragmentary sectional view which shows the connection form by the connection electrode in Embodiment 1 The perspective view which shows the schematic external shape of the mold type transformer which concerns on Embodiment 2. FIG. The fragmentary sectional view which shows the connection form by the connection electrode in Embodiment 2 The perspective view which shows the general external shape of another mold type transformer The perspective view which shows the general external shape of another mold type transformer The perspective view which shows the general external shape of another mold type transformer

<Embodiment 1>
The first embodiment will be described with reference to FIGS.

1. Overall Configuration of Printer FIG. 1 is a schematic sectional view showing an internal configuration of a color printer 1 (an example of an “image forming apparatus”) according to a first embodiment. In the following description, when distinguishing each component for each color, subscripts of Y (yellow), M (magenta), C (cyan), and K (black) are added to the reference numerals of the respective parts, and they are not distinguished. Omits subscripts. The image forming apparatus is not limited to a color printer, and may be, for example, a multifunction machine having a FAX and a copy function, or a monochrome printer.

  A color printer (hereinafter simply referred to as “printer”) 1 includes a paper feeding unit 3, a fixing unit 4, an image forming unit 5, a belt cleaning unit 20, a belt unit 30, a high-voltage power supply device 50, and a frame (6A, 6B: An example of “frame”). For example, the printer 1 converts a toner image composed of toner of one or a plurality of colors (four colors of yellow, magenta, cyan, and black in this embodiment) according to image data input from the outside into a sheet 15 (paper, OHP sheet). Etc.).

  The sheet feeding unit 3 is provided at the lowermost part of the printer 1 and includes a tray 17 that accommodates sheets (an example of “recording medium”) 15 and a pickup roller 19. The sheets 15 accommodated in the tray 17 are picked up one by one by the pickup roller 19 and are sent to the belt unit 30 through the conveyance roller 11 and the registration roller 12.

  The belt unit (an example of the “detachable unit”) 30 is mainly for conveying the sheet 15 and is detachably mounted on a predetermined mounting portion (not shown) formed in the printer 1, for example. The The belt unit 30 includes a driving roller 31, a driven roller 32, and a belt 34, and the belt 34 is bridged between the driving roller 31 and the driven roller 32. When the driving roller 31 rotates, the surface of the belt 34 facing the photosensitive drum 42 moves from the right direction to the left direction in FIG. As a result, the sheet 15 sent from the registration roller 12 is conveyed below the image forming unit 5. The belt unit 30 includes four transfer rollers 33.

  The image forming unit 5 includes four process units 40Y, 40M, 40C, and 40K and four exposure apparatuses 43. Each process unit 40 includes a charger 41, a photosensitive drum 42, a drum cleaner roller 44, a paper dust removing roller 45, a unit case 46, a developing roller 47, and a supply roller 48. Each process unit (an example of a “detachable unit”) 40Y, 40M, 40C, 40K is detachably attached to a frame (6A, 6B) formed in the printer 1 (see FIG. 2).

  For example, the photosensitive drum 42 is formed by forming a positively chargeable photosensitive layer on an aluminum substrate, and the aluminum substrate is grounded to the ground line of the printer 1 (see FIG. 3). . The charger 41 is, for example, a scorotron charger, and includes a discharge wire 41A and a grid 41B (see FIG. 3). The charging voltage CHG is applied to the discharge wire 41A, and the grid voltage GRID of the grid 41B is controlled so that the surface of the photosensitive drum 42 has substantially the same potential (for example, + 700V).

  The exposure device 43 includes, for example, a plurality of light emitting elements (for example, LEDs) arranged in a line along the rotational axis direction of the photosensitive drum 42, and the plurality of light emitting elements are selected according to image data input from the outside. By controlling the light emission, an electrostatic latent image is formed on the surface of the photosensitive drum 42. The exposure device 43 is fixedly installed in the printer 1. The exposure device 43 may use a laser.

  The unit case 46 stores toner of each color (in this embodiment, for example, a positively chargeable non-magnetic one-component toner), and includes a developing roller 47 and a supply roller 48. The toner is supplied to the developing roller 47 by the rotation of the supply roller 48 and is positively frictionally charged between the supply roller 48 and the developing roller 47. Further, the developing roller 47 supplies the toner as a uniform thin layer onto the photosensitive drum 42 to develop the electrostatic latent image, thereby forming a toner image on the photosensitive drum 42.

  Each transfer roller 33 is disposed at a position where the belt 34 is sandwiched between each transfer drum 33. Each transfer roller 33 receives a toner image formed on the photosensitive drum 42 by applying a transfer bias TRCC having a polarity opposite to the toner charging polarity (here, negative polarity) to the photosensitive drum 42. Transfer to the sheet 15. Thereafter, the sheet 15 is conveyed to the fixing unit 4 by the belt unit 30, and the toner image is thermally fixed by the fixing unit 4 and discharged onto the upper surface of the printer 1.

  A drum cleaning mechanism including the drum cleaner roller 44 and the paper dust removing roller 45 sucks and removes deposits (toner and paper dust) on the photosensitive drum 42 by electrostatic force. Here, the paper dust removing roller 45 is provided only in the process unit 40K, for example.

  A belt cleaning unit (an example of a “detachable unit”) 20 is provided below the belt unit 30 (see FIG. 2) and is detachably mounted on a predetermined mounting portion (not shown). The belt cleaning unit 20 includes a belt cleaning roller 21, a deposit collection roller 22, and a collection box 23, and collects deposits (mainly toner remaining on the belt 34) on the belt 34.

2. Configuration of High Voltage Power Supply Device Next, an electrical configuration related to the present invention of the printer 1 will be described with reference to FIG. FIG. 3 shows a schematic block diagram of the high-voltage power supply device 50 mounted on the high-voltage power supply substrate (an example of “power supply substrate”) 8 and a connection configuration related to the high-voltage power supply device 50. Note that the high-voltage power supply device 50 includes voltage generation circuits corresponding to the process units 40Y, 40M, 40C, and 40K, but the configuration corresponding to each process unit is substantially the same. Only the voltage generation circuit associated with 40K is shown.

  The high-voltage power supply device 50 includes a CPU 60, a plurality of voltage generation circuits connected to the CPU 60, a motor drive circuit 58, a ROM 61, and a RAM 62. The CPU 60 controls the entire printer in addition to controlling the voltage generation circuit. The ROM 61 stores an operation program for the entire printer, and the RAM 62 stores image data used for printing processing.

  For example, as shown in FIG. 3, the plurality of voltage generation circuits include a charging voltage generation circuit 51, a paper dust removal bias / drum cleaner bias generation circuit 52, a transfer bias generation circuit 53, a development bias generation circuit 54, and a supply roller bias. A generation circuit 55, a belt cleaner bias generation circuit 56, and a deposit recovery bias generation circuit 57 are included.

  The charging voltage generation circuit 51 includes a mold type transformer 90, and generates a charging voltage CHG applied to the discharge wire 41A of the charger 41 and a grid voltage GRID applied to the grid 41B of the charger 41. Here, the charging voltage CHG is, for example, 5.5 kV to 8 kV (positive polarity), and the grid voltage GRID is, for example, about 700 V (positive polarity). Here, the grid voltage GRID is generated by, for example, a discharge current during discharge between the discharge wire 41 </ b> A and the grid 41 </ b> B and a grid resistance provided in the charging voltage generation circuit 51. The mold type transformer 90 is molded with an insulating resin except for electrode portions such as the output electrode 93 (see FIG. 4).

  The charging voltage generation circuit 51 generates the charging voltage CHG in accordance with, for example, a PWM signal from the PWM1 port of the CPU 60, and the charging voltage CHG is feedback controlled via the A / D1 port.

  The paper dust removal bias / drum cleaner bias generation circuit 52 generates a paper dust removal bias DCLNB to be applied to the paper dust removal roller 45 and a drum cleaner bias DCLNA to be applied to the drum cleaner roller 44. Here, the paper dust removal bias DCLNB is, for example, about −300 V (negative polarity) during toner suction, and is, for example, about 700 V (positive polarity) during toner discharge / paper dust suction.

  The drum cleaner bias DCLNA is, for example, about −400 V (negative polarity) at the time of toner suction, and is about 600 V (positive polarity) at the time of toner discharge / paper powder suction. In this embodiment, the paper dust removal bias / drum cleaner bias generation circuit 52 generates a paper dust removal bias DCLNB in accordance with the PWM signal from the PWM2 port of the CPU 60, and the drum cleaner bias DCLNA is based on the paper dust removal bias DCLNB. Is generated. The paper dust removal bias DCLNB is feedback controlled via the A / D2 port. The drum cleaner bias DCLNA and the paper dust removal bias DCLNB may be individually generated by individual voltage generation circuits.

  The transfer bias generation circuit 53 generates a transfer bias (an example of “voltage”) TRCC applied to the transfer roller 33. Here, the transfer bias TRCC is, for example, about −7 kV (negative polarity). The transfer bias generation circuit 53 generates a transfer bias TRCC in accordance with, for example, a PWM signal from the PWM3 port of the CPU 60, and the transfer bias TRCC is feedback controlled via the A / D3 port.

  The development bias generation circuit 54 generates a development bias DEV to be applied to the development roller 47. Here, the developing bias DEV is, for example, about 400 to 550 V (positive polarity). For example, the development bias generation circuit 54 generates a development bias DEV in accordance with a PWM signal from the PWM4 port of the CPU 60, and the development bias DEV is feedback-controlled through the A / D4 port.

  The supply roller bias generation circuit 55 generates a supply roller bias (an example of “voltage”) SR to be applied to the supply roller 48. Here, the supply roller bias SR is, for example, about 500 to 650 V (positive polarity). The supply roller bias generation circuit 55 generates the supply roller bias SR according to, for example, a PWM signal from the PWM5 port of the CPU 60, and the supply roller bias SR is feedback controlled via the A / D5 port.

  The belt cleaner bias generation circuit 56 generates a belt cleaner bias BCLNA to be applied to the belt cleaner roller 21. Here, the belt cleaner bias BCLNA is, for example, about −1200 V (negative polarity). The belt cleaner bias generation circuit 56 generates a belt cleaner bias BCLNA according to, for example, a PWM signal from the PWM6 port of the CPU 60, and the belt cleaner bias BCLNA is feedback-controlled through the A / D6 port.

  The deposit collection bias generation circuit 57 generates a deposit collection bias BCLNB to be applied to the deposit collection roller 22. Here, the deposit recovery bias BCLNB is, for example, about −1600 V (negative polarity). For example, the deposit collection bias generation circuit 57 generates the deposit collection bias BCLNB according to a PWM signal from the PWM7 port of the CPU 60, and the deposit collection bias BCLNB is feedback-controlled through the A / D7 port.

  The motor drive circuit 58 drives the main motor 14 according to the control of the CPU 60. Each roller is controlled to rotate in accordance with the rotation control of the main motor 14.

2-1. Configuration of Mold Transformer Next, for example, a mold transformer 90 included in the charging voltage generation circuit 51 will be described with reference to FIGS. As shown in FIG. 4, the molded transformer 90 includes primary side terminals 91, 92b, 92c, 95, a transformer T1, a rectifier diode D1, a smoothing capacitor C1, resistors R1, R2, an output electrode 93, a secondary side ground. The terminal 94, the insulating resin part 120, etc. are included. These are molded with a flame retardant resin 110. The configuration of the molded transformer 90 is not limited to this. For example, an oscillation FET (field effect transistor) connected to the primary side of the transformer T1 may be included in the molded transformer 90.

  As shown in FIG. 5, the molded transformer 90 is formed in a rectangular parallelepiped shape, and includes an attachment surface 90 </ b> A that comes into contact with the high-voltage power supply substrate 8 when attached to the high-voltage power supply substrate 8.

  The primary side terminals 91, 92b, 92c, 95 and the secondary side ground terminal 94 are configured by pins extending in a direction orthogonal to the mounting surface 90A from the mounting surface 90A, and the molded transformer 90 is mounted on the high-voltage power supply board 8. When attached, it is attached to the high voltage power supply board 8 by soldering or the like. The primary side terminals 91, 92b, 92c, and 95 and the secondary side ground terminal 94 are not limited to pins. For example, when the molded transformer 90 is surface-mounted, it may be a planar electrode.

  The output electrode 93 is an output electrode that is electrically connected to one P1 of the pair of secondary output terminals (P1, P2) of the transformer T1, and includes a first surface 93A and a first surface on the mounting surface side. It has a plate-like shape having a second surface 93B on the opposite side, and extends in a direction orthogonal to the side surface 90C from a side surface 90C orthogonal to the mounting surface 90A of the molded transformer (see FIG. 5).

  The secondary-side ground terminal (an example of “attachment electrode”) 94 is attached to the high-voltage power supply board 8 when the molded transformer 90 is attached to the high-voltage power supply board 8, and a pair of secondary-side output terminals (P1,. P2) is connected to the other P2 and extends from the mounting surface 90A in a direction orthogonal to the mounting surface 90A.

  The insulating resin portion 120 insulates the output electrode 93 with the insulating resin 100. At this time, the insulating resin portion 120 is formed by exposing at least one of the first surface 93A and the second surface 93B of the output electrode 93 in order to enable connection to the outside of the output electrode 93. The In the present embodiment, the insulating resin portion 120 is formed so that only the second surface 93B of the output electrode 93 is exposed, as shown in FIG. Therefore, the insulation between the secondary side ground terminal 94 and the output electrode 93 can be secured, and the output voltage can be taken out using the second surface 93B of the output electrode.

At that time, as shown in FIGS. 5 and 7, the first surface 93A of the output electrode 93 is separated from the mounting surface 90A by a predetermined distance, for example, a distance half the thickness of the molded transformer 90. An output electrode 93 is provided. That is, the height from the mounting surface 90A to the output electrode 93 is higher than half the height from the mounting surface 90A to the upper surface 90B. Therefore, an insulation distance between the high-voltage power supply substrate 8 and the secondary side ground terminal 94 and the output electrode 93 can be increased while saving a space for attaching the high-voltage power supply substrate 8 on which the molded transformer 90 is mounted to the printer 1. .
The first surface 93A of the output electrode 93 may be provided so as to be substantially flush with the mounting surface 90A. In this case, the distance from the output electrode 93 to the upper surface 90B of the molded transformer 90 can be earned. As a result, while saving the space when the high voltage power supply board 8 on which the molded transformer 90 is mounted is attached to the printer 1, the molded transformer for connecting the output electrode 93 and the input electrode Pin1 of the process unit 40K. Connection space in the height direction of 90 (left and right direction in FIG. 7) can be earned.

  Further, when the molded transformer 90 is attached to the high-voltage power supply substrate 8, in other words, when mounted on the high-voltage power supply substrate 8, the output electrode 93 is connected to the edge of the high-voltage power supply substrate 8 as shown in FIG. 6. It is mounted so as to jump out from. Thereby, an insulation distance between the high voltage power supply substrate 8 and the output electrode 93 can be obtained. In addition, an insulation distance from other electrical components mounted on the high-voltage power supply board 8 can be secured, and the degree of freedom of component placement of the other electrical components is increased.

  As an aspect in which the molded transformer 90 is attached to the high-voltage power supply substrate 8 so that the output electrode 93 protrudes from the edge of the high-voltage power supply substrate 8, the one shown in FIG. Moreover, as an aspect which provides the output electrode 93 in the side surface of the mold type transformer 90, what is shown by FIG. 6 is contained.

3. Next, referring to FIG. 7, a connection configuration between the detachable unit and the high-voltage power supply board 8 will be described by taking the process unit 40K as an example. Specifically, a connection configuration between the input electrode Pin1 of the charger 41 of the process unit 40K and the mold type transformer 90 of the charging voltage generation circuit 51 mounted on the high-voltage power supply substrate 8 will be described. Since the same applies to the other process units 40Y, 40M, and 40C, the description thereof is omitted.

  As shown in FIG. 7, the connection electrode 70 is used when connecting the input electrode Pin <b> 1 of the charger 41 of the process unit 40 </ b> K and the output electrode 93 of the molded transformer 90 of the charging voltage generation circuit 51. .

  As shown in FIG. 7, the connection electrode 70 includes a coiled spring 71 that contacts the output electrode 93 of the molded transformer 90 and a contact member 72 that contacts the input electrode Pin <b> 1 of the process unit 40 </ b> K. The coiled spring 71 and the contact member 72 are integrated, for example.

  In order to connect the input electrode Pin1 of the charger 41 of the process unit 40K and the mold type transformer 90 of the charging voltage generation circuit 51, first, it is integrated with the fitting portion 7 formed in the frame 6A. The coiled spring 71 and the contact member 72 are fitted. Next, the high voltage power supply substrate 8 is attached to the frame 6 </ b> A by using, for example, screws or the like, so that the coiled spring 71 and the output electrode 93 of the molded transformer 90 are brought into contact with each other. When the process unit 40K is mounted on the frames 6A and 6B, the input electrode Pin1 of the process unit 40K pushes the abutting member 72 toward the output electrode 93 of the mold transformer 90. Contracts (see FIG. 7). Thereby, the connection between the input electrode Pin1 of the process unit 40K and the output electrode 93 of the mold type transformer 90 is reliably maintained.

4). Effect of Embodiment 1 The output electrode 93 of the molded transformer 90 is formed so as to extend from a side surface orthogonal to the mounting surface 90A of the molded transformer 90 in a direction orthogonal to the side surface. Therefore, when the high-voltage power supply board 8 is attached to the frame 6A, the distance K1 between the surface of the high-voltage power supply board 8 and the frame 6A can be reduced to almost the height of the molded transformer 90, as shown in FIG. . Accordingly, when the molded transformer 90 is incorporated in the printer 1, the printer 1 can be thinned.

  Further, the insulating resin portion 120 is formed so that only the second surface 93B of the output electrode 93 of the molded transformer 90 is exposed. Therefore, the output voltage (charging voltage CHG) can be taken out using the second surface 93B, and the insulation between the output electrode 93 of the molded transformer 90 and the high-voltage power supply substrate 8 can be secured.

<Embodiment 2>
Next, Embodiment 2 will be described with reference to FIGS. 8 and 9. In addition, only the structure which concerns on an insulating resin part differs from Embodiment 1. FIG. Therefore, only the differences will be described.

  As shown in FIGS. 8 and 9, the insulating resin portion 120 </ b> A of the second embodiment is formed so as to expose only the first surface 93 </ b> A of the output electrode 93 of the molded transformer 90. The output electrode 93 is formed with a screw hole 93H for screw attachment.

  In this structure, in order to connect the output electrode 93 and the coiled spring 71, a conductive metal plate 80 and a screw 81 are used as shown in FIG. In other words, the electrical connection between the output electrode 93 and the conductive metal plate 80 is made by fixing the conductive metal plate 80 to the output electrode 93 and the insulating resin portion 120 </ b> A using the screws 81. Then, by bringing the coiled spring 71 into contact with the conductive metal plate 80, the coiled spring 71 and the output electrode 93 are electrically connected via the conductive metal plate 80 and the screw 81. In this case, by attaching a conductive metal plate 80 for connecting the output electrode 93 to the outside, the space for attaching the high voltage power supply board 8 on which the molded transformer 90 is mounted to the printer 1 is further saved. The connection margin in the longitudinal direction (vertical direction in FIG. 9) of the molded transformer 90 when the output electrode 93 and the input electrode Pin1 of the process unit 40K are connected can be obtained.

  In the second embodiment, the first surface 93A may be substantially flush with the attachment surface 90A. In this case, while saving the space when the high voltage power supply substrate 8 on which the mold type transformer 90 is mounted is attached to the printer 1, the mold for connecting the output electrode 93 and the input electrode Pin1 of the process unit 40K is further reduced. A connection space in the height direction of the transformer 90 (left and right direction in FIG. 9) can be earned.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the first embodiment, the example in which the insulating resin portion 120 is formed so as to expose only the first surface 93 </ b> A of the output electrode 93 of the molded transformer 90 is shown, but is not limited thereto. Absent. As shown in FIGS. 10 and 11, the insulating resin portion 120 may be formed so as to expose at least the first surface 93 </ b> A of the output electrode 93.

  In FIG. 10, the insulating resin portion 120B is formed in a concave shape that opens on the upper surface 90B side of the molded transformer 90, and the output electrode is exposed on the bottom surface of the insulating resin portion 120B. 93 is arranged.

  In FIG. 11, the insulating resin portion 120 </ b> C is formed in a concave shape that opens on the mounting surface 90 </ b> A side of the molded transformer 90, and the first surface 93 </ b> A is exposed on the upper surface of the insulating resin portion 120 </ b> C. An electrode 93 is disposed.

  10 and 11, the electrical connection between the output electrode 93 and the input electrode Pin1 of the process unit 40K may be performed by the same method as in the first embodiment, for example.

  10 and 11, only the output electrode 93 may be formed with an exposed portion 93F (indicated by a broken line) that further extends in a direction orthogonal to the side surface 90C of the molded transformer 90. Thereby, the distance between the secondary side ground terminal 94 and the output electrode 93 can be further increased, and insulation between the secondary side ground terminal 94 and the output electrode 93 can be secured. That is, the insulation distance can be earned.

  (2) In the second embodiment, the example in which the insulating resin portion 120 is formed so as to expose only the second surface 93B of the output electrode 93 of the molded transformer 90 is shown, but the present invention is not limited thereto. Absent. As shown in FIG. 12, the insulating resin portion 120 may be formed to expose at least the second surface 93 </ b> B of the output electrode 93.

  In FIG. 12, the insulating resin portion 120D is formed in a concave shape that opens on the mounting surface 90A side of the mold transformer 90, and the second surface 93B is exposed on the inner upper surface of the insulating resin portion 120C. An output electrode 93 is disposed. At this time, the electrical connection between the output electrode 93 and the input electrode Pin1 of the process unit 40K may be performed by the same method as in the second embodiment, for example.

  In FIG. 12, only the output electrode 93 may be formed with an exposed portion 93F (indicated by a broken line) that further extends in a direction orthogonal to the side surface 90C of the molded transformer 90. Thereby, the distance between the secondary side ground terminal 94 and the output electrode 93 can be further increased, and insulation between the secondary side ground terminal 94 and the output electrode 93 can be secured. That is, the insulation distance can be earned.

  (3) The height from the mounting surface 90A of the molded transformer 90 to the output electrode 93 is higher than half of the height from the mounting surface 90A to the upper surface 90B facing the mounting surface of the molded transformer. In this case, an insulation distance from the secondary ground terminal (attachment electrode) 94 having a large potential difference from the output electrode 93 can be obtained. Thereby, unnecessary discharge or the like between the output electrode 93 and the secondary side ground terminal 94 can be suppressed.

  (4) In each of the above embodiments, the mold type transformer 90 of the charging voltage generation circuit 51 has been described as an example, but the present invention is not limited to this. The transformer included in each bias generation circuit (52-57) shown in FIG. 3 can also be a molded transformer having the same configuration as the molded transformer 90.

DESCRIPTION OF SYMBOLS 1 ... Printer, 6A, 6B ... Frame, 8 ... High voltage power supply board, 20 ... Belt cleaning unit, 30 ... Belt unit, 40 ... Process unit, 90 ... Mold type transformer, 93 ... Output electrode, 94 ... Secondary side ground Terminal 110 ... Insulating resin 120 ... Insulating resin part

Claims (11)

A transformer including at least a pair of secondary output terminals, which is molded with an insulating resin,
When the mold type transformer is attached to the power supply board, an attachment surface that contacts the power supply board,
An output electrode electrically connected to one of the pair of secondary output terminals, the plate-like shape having a first surface on the mounting surface side and a second surface opposite to the first surface An output electrode extending in a direction orthogonal to the side surface from a side surface orthogonal to the mounting surface of the molded transformer,
An insulating resin portion that insulates the output electrode with the insulating resin, the insulating resin portion being formed by exposing at least one of the first surface and the second surface of the output electrode; A mold type transformer. The molded transformer according to claim 1,
The insulative resin portion is a molded transformer formed so as to expose at least the first surface of the output electrode. The molded transformer according to claim 2,
The insulative resin part is a molded transformer formed so as to expose only the first surface of the output electrode. The molded transformer according to claim 3,
A molded transformer in which a screw hole for screw attachment is formed in the output electrode. The molded transformer according to claim 1,
The insulative resin portion is a molded transformer formed so as to expose at least the second surface of the output electrode. In the mold type transformer according to any one of claims 1 to 5,
The molded transformer is higher in height from the mounting surface to the output electrode than half of the height from the mounting surface to the upper surface of the molded transformer facing the mounting surface. In the mold type transformer according to any one of claims 1 to 5,
A molded transformer, wherein the first surface of the output electrode is provided so as to be substantially flush with the mounting surface. In the mold type transformer according to any one of claims 1 to 7,
The output electrode has an exposed portion that further extends from the side surface of the molded transformer in a direction orthogonal to the side surface than the insulating resin portion. The mold type transformer according to any one of claims 6 to 8,
When the mold type transformer is attached to the power supply board, it is an attachment electrode attached to the power supply board, connected to the other of the pair of secondary output terminals, and orthogonal to the attachment surface from the attachment surface A molded-type transformer comprising a mounting electrode extending in a direction to be moved. The mold type transformer according to any one of claims 1 to 9,
A frame on which a detachable detachable unit used for forming an image on a recording medium is mounted;
A power supply board on which the molded transformer is mounted, and a power supply board attached to the frame body from the side opposite to the side on which the detachable unit is mounted,
A connection electrode for electrically connecting the output electrode of the molded transformer and the electrode of the detachable unit;
An image forming apparatus comprising: The image forming apparatus according to claim 10.
The image forming apparatus, wherein the mold type transformer is mounted on the power supply substrate such that the output electrode protrudes from an edge of the power supply substrate.

Images